CN112025638B - Tool for measuring migration rate of silver ions of bonding wire - Google Patents
Tool for measuring migration rate of silver ions of bonding wire Download PDFInfo
- Publication number
- CN112025638B CN112025638B CN202010939814.7A CN202010939814A CN112025638B CN 112025638 B CN112025638 B CN 112025638B CN 202010939814 A CN202010939814 A CN 202010939814A CN 112025638 B CN112025638 B CN 112025638B
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- China
- Prior art keywords
- workstation
- migration rate
- bonding wires
- silver ions
- measuring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/02—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby of table type
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to the technical field of quality verification of bonding wires and discloses a tool for measuring the migration rate of silver ions of the bonding wires, which comprises two work tables, wherein the two work tables are symmetrically distributed front and back, the lower surfaces of the two work tables are symmetrically fixed with supporting sheets, the four supporting sheets are in rectangular distribution, both sides of the two work tables are provided with limiting grooves, the limiting grooves are in a vertically penetrating structure, the two work tables are hollow structures with opposite side openings, and the inside of the two work tables is provided with a connecting plate; through the both sides spacing groove on the work platform, ensure that the distance between two bonding wires is invariable to this reaches the requirement of detection condition, and simple structure, the operation of being convenient for has improved the inspection efficiency of bonding wire.
Description
Technical Field
The invention relates to the technical field of quality verification of bonding wires, in particular to a tool for measuring the migration rate of silver ions of bonding wires.
Background
The bonding wire is a very thin metal wire lead for realizing circuit connection between the chip and an external device and is mainly used in the fields of integrated circuits and semiconductors. The quality of the bond wire and its properties will directly affect the actual service life of the appliance.
Silver ion migration is a phenomenon that silver ions slowly migrate from a high potential end to a low potential in a moist environment containing a direct-current voltage gradient, and form flocculent or tendril-shaped expansion. Silver ion migration may cause the insulation performance of the bonding wires to decrease, even forming an electrical circuit between the two bonding wires, thereby causing a short circuit and device failure.
At present, silver-containing bonding wires are used more and more widely, the influence of silver ion migration is gradually revealed, however, the silver ion migration rate is measured without special support, so that the operation difficulty is high, the experimental accuracy is low, and therefore, how to design a tool for measuring the silver ion migration rate of the bonding wires to improve the measurement accuracy and the measurement efficiency becomes the current problem to be solved.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a tool for measuring the migration rate of silver ions of bonding wires, and solves the problems of high operation difficulty and low experimental accuracy caused by the fact that no special tool for measuring the migration rate of silver ions is supported.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a survey bonding silk silver ion migration rate's system utensil, includes the workstation, the quantity of workstation is two, two the front and back symmetric distribution of workstation, and two the equal symmetric fixation of lower surface of workstation has the backing sheet, four the backing sheet is the rectangle and distributes, two the spacing groove has all been seted up to the both sides of workstation, the spacing groove is run through from top to bottom the structure, two the workstation is opposite side open-ended hollow structure, and two the inside of workstation is equipped with a connecting plate.
Preferably, the two sides of the upper surface of the connecting plate are provided with graduation gauges.
Preferably, the front surface and the rear surface of the connecting plate are fixedly provided with limiting plates, and the length of each limiting plate is greater than that of the opening on the workbench.
Preferably, the lower surface of the supporting sheet is fixedly provided with an anti-slip gasket, and the anti-slip gasket is made of rubber with good elasticity.
(III) beneficial effects
The invention provides a tool for measuring the migration rate of silver ions of bonding wires, which has the following beneficial effects:
(1) According to the invention, the distance between the two bonding wires is ensured to be constant through the limit grooves on the two sides of the working platform, so that the requirement of detection conditions is met.
(2) The invention has simple structure, is convenient to operate and improves the inspection efficiency of the bonding wire.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the bottom view of the present invention;
fig. 3 is a schematic top view of the internal structure of the present invention.
In the figure: 1. a work table; 2. a limit groove; 3. a support sheet; 4. an anti-slip gasket; 5. a connecting plate; 6. a limiting plate; 7. a scale.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-3, the present invention provides a technical solution: the utility model provides a survey bonding silk silver ion migration rate's system utensil, including workstation 1, the quantity of workstation 1 is two, the front and back symmetric distribution of two workstations 1, and the equal symmetric fixation of lower surface of two workstations 1 has supporting plate 3, four supporting plates 3 are rectangular distribution, spacing groove 2 has all been seted up to the both sides of two workstations 1, spacing groove 2 is the vertical run-through structure, two workstations 1 are opposite side open-ended hollow structure, and the inside of two workstations 1 is equipped with a connecting plate 5, when using, place this system utensil on the desktop, support it through four supporting plates 3, then pass the spacing groove 2 on two workstations 1 respectively, know by the principle of two points confirm a straight line, bonding silk between two spacing grooves 2 forms a straight line section, because the distance department between two parallel straight lines equals, ensure that the distance between two bonding silk is invariable, thereby reach the detection condition requirement, and in the in-process that detects, when need change between two bonding silk, can change the distance between two worktops 1 when detecting, can change the distance between two, thereby the demand that can change between two platforms 1 respectively, and the demand can be changed.
Furthermore, the two sides of the upper surface of the connecting plate 5 are provided with the graduation gauges 7, so that operators can know the distance between the two work tables 1 after stretching.
Further, limiting plates 6 are fixedly arranged on the front surface and the rear surface of the connecting plate 5, the length of each limiting plate 6 is larger than that of the opening on the workbench 1, and the situation that two workbenches 1 are separated from the connecting plate 5 is avoided.
Further, the anti-slip gasket 4 is fixed on the lower surface of the supporting plate 3, the anti-slip gasket 4 is made of rubber with good elasticity, and the friction force between the supporting plate 3 and the tabletop can be increased by the anti-slip gasket 4, so that the situation that the workbench 1 moves in the using process can be avoided.
To sum up, the workflow of the invention: when the device is used, the device is placed on a tabletop, the device is supported by the four supporting sheets 3, bonding wires respectively penetrate through the limiting grooves 2 on the two work tables 1, the principle that a straight line is determined by two points is known, the bonding wires between the two limiting grooves 2 form a straight line section, the distance between the two parallel straight lines is equal everywhere, the constant distance between the two bonding wires is ensured, so that the requirement of detection conditions is met, in the process of detection, when the distance between the two bonding wires is required to be changed, the two work tables 1 can be pulled respectively to meet different detection requirements, the distance between the two work tables 1 can be changed, the distance between the two bonding wires can be changed, and finally the detection requirements are met.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a survey bonding silk silver ion migration rate's system utensil, includes workstation (1), its characterized in that: the utility model discloses a workbench, including workstation (1), spacer groove (2) are all offered to the quantity of workstation (1), two symmetrical distribution around workstation (1), and two the equal symmetrical support piece (3) of lower surface of workstation (1), four spacer piece (3) are the rectangle and distribute, two spacing groove (2) are run through from top to bottom structure, two workstation (1) are opposite side open-ended hollow structure, and two the inside of workstation (1) is equipped with connecting plate (5).
2. The fixture for measuring the migration rate of silver ions of bonding wires according to claim 1, wherein: graduation gauges (7) are arranged on two sides of the upper surface of the connecting plate (5).
3. The fixture for measuring the migration rate of silver ions of bonding wires according to claim 1, wherein: limiting plates (6) are fixed on the front surface and the rear surface of the connecting plate (5), and the length of each limiting plate (6) is greater than that of an upper opening of the workbench (1).
4. The fixture for measuring the migration rate of silver ions of bonding wires according to claim 1, wherein: the anti-slip gasket (4) is fixed on the lower surface of the supporting sheet (3), and the anti-slip gasket (4) is made of rubber with good elasticity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010939814.7A CN112025638B (en) | 2020-09-09 | 2020-09-09 | Tool for measuring migration rate of silver ions of bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010939814.7A CN112025638B (en) | 2020-09-09 | 2020-09-09 | Tool for measuring migration rate of silver ions of bonding wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112025638A CN112025638A (en) | 2020-12-04 |
| CN112025638B true CN112025638B (en) | 2023-07-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010939814.7A Active CN112025638B (en) | 2020-09-09 | 2020-09-09 | Tool for measuring migration rate of silver ions of bonding wire |
Country Status (1)
| Country | Link |
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| CN (1) | CN112025638B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180738A (en) * | 1984-02-06 | 1985-09-14 | ヴアルテル・シユテイヒト | Module type machine table for production unit |
| CN106112941A (en) * | 2016-08-23 | 2016-11-16 | 成都慧信实验设备有限公司 | Clipping cable rack |
| CN110164776A (en) * | 2019-06-12 | 2019-08-23 | 广东禾木科技有限公司 | A kind of production method of bonding wire protective coating |
| CN209559240U (en) * | 2018-01-12 | 2019-10-29 | 江门市中浩精密电子有限公司 | Jig is used in a kind of detection of PCB circuit board |
| CN209707263U (en) * | 2019-04-01 | 2019-11-29 | 浙江佳博科技股份有限公司 | A kind of bonding wire batch testing tooling |
| CN111141198A (en) * | 2019-12-30 | 2020-05-12 | 广东虹勤通讯技术有限公司 | NFC label test fixture |
| CN210589203U (en) * | 2019-08-08 | 2020-05-22 | 新疆利丰智能科技股份有限公司 | Improved computer system maintenance detection equipment |
-
2020
- 2020-09-09 CN CN202010939814.7A patent/CN112025638B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180738A (en) * | 1984-02-06 | 1985-09-14 | ヴアルテル・シユテイヒト | Module type machine table for production unit |
| CN106112941A (en) * | 2016-08-23 | 2016-11-16 | 成都慧信实验设备有限公司 | Clipping cable rack |
| CN209559240U (en) * | 2018-01-12 | 2019-10-29 | 江门市中浩精密电子有限公司 | Jig is used in a kind of detection of PCB circuit board |
| CN209707263U (en) * | 2019-04-01 | 2019-11-29 | 浙江佳博科技股份有限公司 | A kind of bonding wire batch testing tooling |
| CN110164776A (en) * | 2019-06-12 | 2019-08-23 | 广东禾木科技有限公司 | A kind of production method of bonding wire protective coating |
| CN210589203U (en) * | 2019-08-08 | 2020-05-22 | 新疆利丰智能科技股份有限公司 | Improved computer system maintenance detection equipment |
| CN111141198A (en) * | 2019-12-30 | 2020-05-12 | 广东虹勤通讯技术有限公司 | NFC label test fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112025638A (en) | 2020-12-04 |
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