CN112015304B - Manufacturing method of LIG-based flexible electronic device - Google Patents
Manufacturing method of LIG-based flexible electronic device Download PDFInfo
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- CN112015304B CN112015304B CN202010910336.7A CN202010910336A CN112015304B CN 112015304 B CN112015304 B CN 112015304B CN 202010910336 A CN202010910336 A CN 202010910336A CN 112015304 B CN112015304 B CN 112015304B
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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Abstract
The invention discloses a manufacturing method of a flexible electronic device based on LIG, which is characterized in that step S200 is carried out, a graphene image is prepared on one surface of a substrate based on the LIG technology and is used as an induction layer; preparing a graphene image on the other side of the substrate based on an LIG technology as a driving layer, wherein the LIG technology is a laser induction technology of a short-wavelength laser light source; the induction layer and the driving layer are synchronously prepared, the preparation process comprises a first laser light source and a second laser light source which are arranged on a base material, light rays of the first laser light source and the second laser light source are parallel, the first laser light source and the second laser light source move in the front-back direction, the base material moves in the left-right direction, and preparation of a graphene preparation image is completed through cooperation of the first laser light source and the second laser light source; according to the invention, the processing steps of the single-layer base material film are sequentially completed on the transmission line, and meanwhile, the double-side synchronous processing method is adopted, so that the processing efficiency can be ensured, the manufacturing cost of the graphene flexible device is reduced, the structure of the graphene graph which is easy to damage is changed, and the graphene graph is protected.
Description
Technical Field
The invention relates to the technical field of touch devices, in particular to a manufacturing method of a flexible electronic device based on LIG.
Background
In recent years, with the development of smart phone terminals based on 4G and 5G technologies, the mobile phone screen adopts an edge curved surface design, and an integral folding design becomes an industry development direction. In the process of developing curved surface or folding mobile phone technology, it is a necessary condition that the display and touch module of the mobile phone screen realize flexible or foldable function. In the process of developing a flexible and foldable technology of the touch module, the graphene material is an important material with a significant role.
Laser Induced Graphene (LIG) is a sheet-like foam of atomic thick carbon that has many interesting properties in itself, but obtains new properties as part of a composite. The laser-induced graphene was first manufactured by Tour laboratories in 2014, when it was burned on the surface of a layer of common plastic polyimide sheet using a commercial laser. The heat of the laser turns a strip of material into interconnected graphene sheets. Compared with the traditional chemical vapor deposition, the laser-induced graphene method has more materials and lower cost.
However, the current laser-induced graphene (LIG) obtained graphene graphic layer is weak in mechanical property, when a transparent adhesive tape test is carried out, a graphene thin layer can be stripped from the surface of a polyimide film, meanwhile, the conductivity of a graphene area generated by laser induction is poor, the mode of adopting screen printing silver paste is often required to be enhanced, but the operation difficulty of the screen printing silver paste is large, and the accuracy of a printing area is poor. In addition, the existing laser-induced graphene research is mainly applied to a laboratory environment, an inert gas environment must be provided in the induction process of partial materials, and industrialization of laser-induced graphene (LIG) in the manufacture of flexible electronic devices is not facilitated.
Disclosure of Invention
To address one or more of the problems of the prior art, the present invention provides a method for manufacturing a LIG-based flexible electronic device, comprising the steps of:
step S100, preparing a transparent polyimide film as a base material;
s200, preparing a graphene image on one surface of the substrate based on an LIG technology to serve as an induction layer; preparing a graphene image on the other surface of the substrate based on an LIG technology as a driving layer, wherein the LIG technology is a laser induction technology of a short-wavelength laser light source; the induction layer and the driving layer are synchronously prepared, the preparation process comprises a first laser light source and a second laser light source which are arranged on the base material, light rays of the first laser light source and the second laser light source are parallel, the first laser light source and the second laser light source move in the front-rear direction, and the base material moves in the left-right direction to jointly complete preparation of a graphene preparation image;
step S300, preparing a silver nanowire film layer on the graphene image for enhancing the conductivity of the graphene image;
step S400, preparing a curing layer on the induction layer and the driving layer;
step S500, attaching an optical double-sided adhesive layer to the cured layer;
step S600, adhering a protective film made of a transparent polyimide film material to the optical double-sided adhesive layer;
and S700, attaching a display device on the other side of the optical double-sided adhesive layer to form a flexible electronic device.
In another aspect of the present invention, the laser-induced technology operating parameters are: the wavelength is 200-500 nm, the laser pulse time is 500 picoseconds-500 milliseconds, and the laser power density is 100-5000kW/cm 2; preferably: the wavelength is 405nm, the laser pulse time is 20 microseconds, and the laser power density is 1000kW/cm 2.
In another aspect of the present invention, the short wavelength laser source in step S200 is a defocused laser source, and the surface of the substrate is coated with a transparent flame retardant layer for accelerating the formation of amorphous carbon.
In another aspect of the present invention, the silver nanowire film layer in step S300 is prepared based on a needle tube brush device, where the needle tube brush device includes a feeding needle tube for providing the silver nanowire ink and a conical brush disposed at a tip of the needle tube; the graphene image surface processing device further comprises a plane moving device used for driving the conical hairbrush to move on the graphene image surface.
In another aspect of the present invention, the cured layer is prepared by slit coating in step S400.
In another aspect of the present invention, the cured layer in step 400 is prepared by a coating/baking technique, which comprises: step S410, coating a polymer protective layer; step S420, baking the protective layer to obtain a cured layer.
In another aspect of the invention, the optical double-sided adhesive layer is rolled to synchronously complete the preparation of the optical double-sided adhesive layer on the sensing layer and the optical double-sided adhesive layer on the driving layer.
In another aspect of the invention, the thickness of the optical double-sided adhesive tape layer is 10-30 mm.
In another aspect of the invention, the protective layer has a thickness in the range of 40 to 60 millimeters.
In another aspect of the present invention, the substrate is disposed on a conveyor belt, and is sequentially processed through the step S200, the step S300, the step 400, and the step S500 to prepare an electronic device structure of optical double-sided adhesive layer/silver nanowire film layer/sensing layer/substrate/driving layer/silver nanowire film layer/optical double-sided adhesive layer; the method further comprises a step S510, and after the step S500, the method is used for cutting off the optical double-sided adhesive layer.
Compared with the prior art, the invention has the following beneficial effects:
1. the manufacturing process of the single-film graphene electronic device is designed, so that the single-layer substrate thin film sequentially completes all processing steps on a transmission line, and meanwhile, a double-side synchronous processing method is adopted, so that the processing efficiency can be ensured, and the manufacturing cost of the graphene flexible device is reduced;
2. a silver nanowire film layer is prepared on the graphene image, so that the resistance in the graphene image is reduced, and the conductivity in the graphene image is improved;
3. the polymer film is coated on the graphene image/silver nanowire film layer, so that the structure of the graphene pattern which is easy to damage is changed, and the graphene pattern is protected.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of laser light source synchronous operation of a flexible electronic device based on LIG technology according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a flexible electronic device based on LIG technology according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the operation of a needle brush arrangement for flexible electronics based on LIG technology according to an embodiment of the present invention;
fig. 4 is a schematic optical double-sided tape roll diagram of a flexible electronic device based on LIG technology according to one embodiment of the present invention;
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection, either mechanically, electrically, or in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The preferred embodiments of the present invention will be described with reference to the accompanying drawings 1-4, and it should be understood that the preferred embodiments described herein are merely for purposes of illustration and explanation and are not intended to limit the present invention.
The invention provides a manufacturing method of a flexible electronic device based on LIG, which comprises the following steps:
step S100 of preparing a transparent polyimide film as a base material 10; considering that the flexible electronic device is mostly applied to bendable screen display, the polyimide film is selected for use, so that the overall manufacturing cost of the flexible electronic device can be reduced, and meanwhile, the applicability is ensured.
Step S200, as shown in fig. 1, preparing a graphene image on one surface of a substrate 10 based on an LIG technique as an induction layer 11; preparing a graphene image on the other side of the substrate 10 based on an LIG technology, wherein the graphene image is used as a driving layer 12, and the LIG technology is a laser induction technology of a short-wavelength laser light source; the induction layer 11 and the driving layer 12 are synchronously prepared, the preparation process comprises a first laser light source 01 and a second laser light source 02 which are arranged on a base material 10, light rays of the first laser light source 01 and the second laser light source 02 are parallel, the first laser light source 01 and the second laser light source 02 move in the front-back direction, the base material 10 moves in the left-right direction, and preparation of a graphene preparation image is completed through cooperation of the first laser light source 01 and the second laser light source 02;
step S300, preparing a silver nanowire film layer on the graphene image for enhancing the conductivity of the graphene image; a silver nanowire film layer is prepared on the graphene image, so that the resistance in the graphene image is reduced, and the conductivity in the graphene image is improved;
step S400, preparing a solidified layer on the sensing layer 11 and the driving layer 12; the polymer film is coated on the graphene image/silver nanowire film layer, so that the structure of the graphene pattern which is easy to damage is changed, and the graphene pattern is protected.
Step S500, adhering an optical double-sided adhesive layer on the solidified layer;
step S600, adhering a protective film 0 made of a transparent polyimide film material to the optical double-sided adhesive layer;
and S700, attaching the display device 2 to the optical double-sided adhesive layer on the other surface to form the flexible electronic device.
In a specific embodiment of the present invention, a polyimide film as a substrate 10 may be fixedly disposed on a conveyor belt, and the conveyor belt drives the substrate 10 to sequentially pass through steps S200, S300, step 400, and step S500, where the steps may be regarded as steps disposed on the conveyor belt, and finally a device structure of optical double-sided adhesive layer/silver nanowire film layer/sensing layer 11/substrate 10/driving layer 12/silver nanowire film layer/optical double-sided adhesive layer is prepared; after step S500, step S510 is further included, which is to cut off the optical double-sided adhesive layer, and a cutting knife 70 is disposed above the conveyor belt to cut off the optical double-sided adhesive layer, so as to ensure that the optical double-sided adhesive layer is adhered to the entire surface of the substrate 10. The manufacturing process of the single-film graphene electronic device enables the single-layer base material 10 film to sequentially complete all processing steps on a transmission line, and meanwhile, a double-side synchronous processing method is adopted, so that the processing efficiency can be guaranteed, and the manufacturing cost of the graphene flexible device can be reduced.
As shown in fig. 2, the specific structure of the LIG-based flexible electronic device provided by the present invention includes a protective film 0, a first optical double-sided adhesive layer 41, a first cured layer 31, a first silver nanowire layer 21, a substrate 10, a second silver nanowire layer 22, a second cured layer 32, a second optical double-sided adhesive layer 42, and a display device 2, wherein the first optical double-sided adhesive layer 41 and the second optical double-sided adhesive layer 42 are distributed on the upper and lower sides with the substrate 10 as a symmetry center, and are synchronously prepared in step S300; the first cured layer 31 and the second cured layer 32 are distributed on the upper and lower sides with the substrate 10 as the center of symmetry, and are prepared synchronously in step 4300; the first silver nanowire layer 21 and the second silver nanowire layer 22 are distributed on the upper and lower sides with the substrate 10 as a center of symmetry, and are simultaneously prepared in step S500.
In a specific embodiment of the present invention, the laser-induced technology operating parameters are: the wavelength is 200 nanometers, the laser pulse time is 500 milliseconds, the laser power density is 100kW/cm2, under high laser power in the laser induction process, long-time short-wavelength laser is required to act on the surface of a polyimide film, a graphene two-dimensional pattern with atomic thickness can be formed on the surface of the film, and in consideration of synchronous transportation of a base material 10 on a conveyor belt during laser induction, the action time needs to be prolonged to ensure the efficiency of the produced graphene pattern.
In a specific embodiment of the present invention, the laser-induced technology operating parameters are: the wavelength is 500 nanometers, the laser pulse time is 500 picoseconds and milliseconds, and the laser power density is 5000kW/cm 2; in the laser induction process, laser with high power wavelength rapidly acts on the surface of the base material 10 film, so that the efficiency of inducing the graphene pattern by the laser is improved.
In one embodiment of the present invention, the laser-induced technological operating parameters are preferably: the wavelength is 405nm, the laser pulse time is 20 microseconds, and the laser power density is 1000kW/cm 2. And in step S200, the short wavelength laser light source is a defocused laser light source, and a transparent flame retardant layer is coated on the surface of the substrate 10 in the processing process to accelerate the formation of amorphous carbon and prevent the thin film from igniting under the induction of laser.
As shown in fig. 3, in an embodiment of the present invention, the silver nanowire film layer in step S300 is prepared based on a needle tube brush device, which includes a supply needle tube for supplying silver nanowire ink and a tapered brush disposed at a needle tube head; a planar moving means (not shown) is also included for driving the tapered brush to move over the graphene image surface. Similarly, the needle brush arrangement comprises a first needle brush arrangement 51 located above the substrate 10 and a second needle brush arrangement 52 located below the substrate 10.
In one embodiment of the present invention, the cured layer in step S400 is prepared by slit coating.
In one embodiment of the present invention, the cured layer in step 400 is prepared using a coating/baking technique, which comprises: step S410, coating a polymer protective layer; step S420, baking the protective layer to obtain a cured layer.
As shown in fig. 4, in an embodiment of the present invention, the optical double-sided adhesive layer on the sensing layer 11 and the optical double-sided adhesive layer on the driving layer 12 are simultaneously prepared by a rolling method, and specifically, the method includes a feeding device (not shown) for feeding the optical double-sided adhesive and a pressing roller 60 for rolling the optical double-sided adhesive so that the optical double-sided adhesive is attached to the cured layer, and the optical double-sided adhesive layer is cut to be substantially the same size as the substrate 10 by a cutting blade 70 disposed above in step S510.
In a specific embodiment of the present invention, the optical double-sided adhesive tape has a thickness of 10 to 30 mm.
In another aspect of the invention, the protective layer has a thickness in the range of 40 to 60 millimeters.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of fabricating a LIG-based flexible electronic device, comprising the steps of:
step S100, preparing a transparent polyimide film as a base material;
s200, preparing a graphene image on one surface of the substrate based on an LIG technology to serve as an induction layer; preparing a graphene image on the other surface of the substrate based on an LIG technology as a driving layer, wherein the LIG technology is a laser induction technology of a short-wavelength laser light source; the induction layer and the driving layer are synchronously prepared, the preparation process comprises a first laser light source and a second laser light source which are arranged on the base material, light rays of the first laser light source and the second laser light source are parallel, the first laser light source and the second laser light source move in the front-rear direction, and the base material moves in the left-right direction to jointly complete preparation of a graphene preparation image;
step S300, preparing a silver nanowire film layer on the graphene image for enhancing the conductivity of the graphene image;
step S400, preparing a curing layer on the induction layer and the driving layer;
step S500, attaching an optical double-sided adhesive layer to the cured layer;
step S600, adhering a protective film made of a transparent polyimide film material to the optical double-sided adhesive layer;
step S700, attaching a display device on the other side of the optical double-sided adhesive layer to form a flexible electronic device;
the working parameters of the laser induction technology are as follows: the wavelength is 200-500 nm, the laser pulse time is 500 picoseconds-500 milliseconds, and the laser power density is 100-5000kW/cm2。
2. The method of claim 1, wherein the LIG-based flexible electronic device is manufactured by a method comprising the steps of,
in the step S200, the short wavelength laser light source is a defocused laser light source, and the surface of the substrate is coated with a transparent flame retardant layer for accelerating the formation of amorphous carbon.
3. The method of claim 2, wherein the LIG-based flexible electronic device is manufactured by a method comprising the steps of,
the silver nanowire film layer in the step S300 is prepared on the basis of a needle tube brush device, and the needle tube brush device comprises a feeding needle tube for providing the silver nanowire ink and a conical brush arranged at a needle tube head; the graphene image surface processing device further comprises a plane moving device used for driving the conical hairbrush to move on the graphene image surface.
4. The method of claim 3, wherein the LIG-based flexible electronic device is manufactured by the method of claim,
the cured layer in step S400 is prepared by slit coating.
5. The method of claim 4, wherein the LIG-based flexible electronic device is manufactured by the method of claim,
the cured layer in step S400 is prepared by a coating/baking technique, and the preparation process includes:
step S410, coating a polymer protective layer;
step S420, baking the protective layer to obtain a cured layer.
6. The method of claim 5, wherein the LIG-based flexible electronic device is manufactured by the method of claim,
and the optical double-sided adhesive layer synchronously completes the preparation of the optical double-sided adhesive layer on the induction layer and the optical double-sided adhesive layer on the driving layer in a rolling mode.
7. The method of claim 6, wherein the LIG-based flexible electronic device is manufactured by the method of claim,
the thickness of the optical double-sided adhesive tape layer is 10-30 mm.
8. The method of claim 7, wherein the LIG-based flexible electronic device is manufactured by the method of claim,
the thickness of the protective layer ranges from 40 mm to 60 mm.
9. The method for manufacturing a LIG-based flexible electronic device according to any one of claims 1 to 8,
the base material is arranged on the conveyor belt, and the electronic device structure of optical double-sided adhesive layer/silver nanowire film layer/induction layer/base material/driving layer/silver nanowire film layer/optical double-sided adhesive layer is prepared through the steps S200, S300, S400 and S500 in sequence.
10. The method for manufacturing a LIG-based flexible electronic device according to claim 9, further comprising a step S510 of cutting the optical double-sided adhesive layer after the step S500.
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Address after: 230000 Parmon Building, No. 16, National E-Commerce Industrial Park, 1201 Huguang East Road, Shushan District, Hefei City, Anhui Province Applicant after: Anhui Aerospace Paimeng Health Technology Co.,Ltd. Address before: 230000 paimeng building, No.16, national e-commerce Industrial Park, 1201 Yuanguang East Road, Shushan District, Hefei City, Anhui Province Applicant before: Anhui Aerospace Paimeng Health Technology Co.,Ltd. |
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Effective date of registration: 20210819 Address after: 253000 No. 6596, Dongfanghong East Road, Yuanqiao Town, Dezhou Economic and Technological Development Zone, Shandong Province Patentee after: Dezhou Aerospace paramount graphene Technology Co.,Ltd. Address before: 230000 Parmon Building, No. 16, National E-Commerce Industrial Park, 1201 Huguang East Road, Shushan District, Hefei City, Anhui Province Patentee before: Anhui Aerospace Paimeng Health Technology Co.,Ltd. |