CN112004382A - Radiator for semiconductor refrigerating device - Google Patents

Radiator for semiconductor refrigerating device Download PDF

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Publication number
CN112004382A
CN112004382A CN202010868465.4A CN202010868465A CN112004382A CN 112004382 A CN112004382 A CN 112004382A CN 202010868465 A CN202010868465 A CN 202010868465A CN 112004382 A CN112004382 A CN 112004382A
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CN
China
Prior art keywords
rod
frame
moisture
block
sliding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202010868465.4A
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Chinese (zh)
Inventor
戴宝木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhou Suideluo Trade Co ltd
Original Assignee
Fuzhou Suideluo Trade Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhou Suideluo Trade Co ltd filed Critical Fuzhou Suideluo Trade Co ltd
Priority to CN202010868465.4A priority Critical patent/CN112004382A/en
Publication of CN112004382A publication Critical patent/CN112004382A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Gases (AREA)

Abstract

The invention discloses a radiator for a semiconductor refrigerating device, which structurally comprises a machine body, radiating fins and an air outlet mechanism, wherein the radiating fins and the machine body are of an integrated structure, the air outlet mechanism is arranged at the front end position of the radiating fins, a link rod can drive a clearing rod to swing forwards through the throwing force generated by the rotation of a rotating rod, the bottom plate can be attached to the outer surface of a rotating shaft through the thrust generated by an elastic strip to the bottom plate, so that a collecting tank can push away the moisture on the rotating shaft, the moisture condensed on the rotating shaft is effectively avoided, the lubricating oil between the rotating shaft and an outer pipe is diluted by the moisture when the rotating rod rotates again, a sliding plate can slide forwards through the inertia force generated by the forward propulsion of a frame body, a water absorbing block on the sliding plate can absorb the moisture, and the moisture in the collecting tank can be effectively prevented from being dried quickly, so that the moisture overflow is easily occurred.

Description

Radiator for semiconductor refrigerating device
Technical Field
The invention relates to the field of semiconductors, in particular to a radiator for a semiconductor refrigerating device.
Background
The present inventors found based on the above description that the heat radiator for a semiconductor refrigeration device mainly uses an apparatus for dissipating heat generated by the operation of the semiconductor refrigeration device, and can bring out the heat inside the semiconductor refrigeration device through the rotating outlet fan, so as to rapidly lower the temperature inside the semiconductor refrigeration device, and the temperature of the outlet fan itself can also rise while bringing out the heat, thereby achieving the refrigeration effect, and the present inventors found that the heat radiator for the semiconductor refrigeration device mainly has the following disadvantages, for example:
when the inside temperature of semiconductor refrigerating plant drops to extremely low, air-out fan can automatic shutdown operation this moment, nevertheless because of the difference in temperature of the heat production on a part air conditioning that takes over at last and the air-out fan, can condense moisture on the air-out fan, if the moisture that condenses in the pivot, moisture dilutes the lubricating oil between pivot and the outer tube when then can make air-out fan rotate once more, so can make the friction increase between pivot and the outer tube for a long time, then can cause the pivot to rotate the difficult condition at last.
Disclosure of Invention
In view of the above problems, the present invention provides a heat sink for a semiconductor refrigeration device.
In order to achieve the purpose, the invention is realized by the following technical scheme: a radiator for a semiconductor refrigerating device structurally comprises a machine body, radiating fins and an air outlet mechanism, wherein the radiating fins and the machine body are of an integrated structure, and the air outlet mechanism is arranged at the front end of each radiating fin; the air outlet mechanism comprises an outer frame, a rotating rod, a blade and an exhaust net, the rotating rod and the outer frame are of an integrated structure, the blade is fixedly connected with the side face of the rotating rod in an embedded mode, and the exhaust net is installed at the front end of the outer frame.
As a further optimization of the invention, the rotating rod comprises an outer tube, a rotating shaft, a linkage rod, two clearing rods and a connecting head, wherein the rotating shaft is movably clamped with the outer tube, the linkage rod is hinged with the left side of the outer tube, one end of each clearing rod is movably clamped with the linkage rod, the other end of each clearing rod is attached to the outer surface of the rotating shaft, the connecting heads and the rotating shaft are of an integrated structure, and the two clearing rods are uniformly distributed on the left side of the outer tube in a symmetrical manner through the matching of the linkage rods.
As a further optimization of the invention, the clearing rod comprises a fixing rod, a combining rod, a bottom plate and a collecting groove, the combining rod is in clearance fit with the fixing rod, the bottom plate is fixedly embedded and connected with the bottom of the combining rod, the collecting groove and the bottom plate are of an integrated structure, the elastic strip is arranged between the combining rod and the fixing rod, and the bottom plate can be pushed to be tightly attached to the surface of an object through the elastic strip.
As a further optimization of the invention, the collecting tank comprises a frame body, a connecting rod and a stress block, wherein the connecting rod is hinged with the frame body, the stress block is movably clamped with the connecting rod, and the stress block can be driven to swing downwards by the extrusion of moisture on the stress block.
As a further optimization of the invention, the frame body comprises a pull-back strip, a frame and a sliding plate, the pull-back strip is arranged between the frame and the sliding plate, the sliding plate is movably clamped with the frame, and the sliding plate can slide forwards by the throwing force generated by pushing forwards by the mechanism.
As a further optimization of the invention, the sliding plate comprises a beating bottom plate, a ventilating opening, a water absorbing block and a rebound ring, wherein the ventilating opening and the beating bottom plate are of an integrated structure, the water absorbing block is arranged at the left side position of the ventilating opening, the rebound ring is arranged between the beating bottom plate and the ventilating opening, and the water absorbing block is made of polyester sponge with strong water absorption.
As a further optimization of the invention, the ventilation port comprises a plate, a position fixing frame and a blocking block, wherein the position fixing frame and the plate are of an integrated structure, the blocking block is movably clamped with the plate, and the blocking block is of a trapezoidal structure.
The invention has the following beneficial effects:
1. through the dwang rotates the power of getting rid of that produces, can make the gangbar drive and clear away the pole and swing forward, and through the thrust that the elasticity strip produced the bottom plate, can make the surface of bottom plate and pivot laminate mutually to make the collecting vat can push away the epaxial moisture of commentaries on classics, the effectual pivot moisture of condensing of having avoided has then made the dwang rotate once more the condition that the lubricating oil between with pivot and the outer tube was diluted to moisture.
2. The sliding plate can slide forwards by the aid of the inertia force generated by forward propulsion of the frame body, so that the water absorption blocks on the sliding plate can absorb water, the water inside the collecting tank is effectively prevented from being dried quickly, and the water is easy to overflow.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink for a semiconductor refrigeration device according to the present invention.
Fig. 2 is a schematic structural view of a side-view half-section of the air outlet mechanism of the present invention.
Fig. 3 is a side view of a half-section structure of the rotating rod of the present invention.
FIG. 4 is a side view of a cleaning rod according to the present invention.
FIG. 5 is a schematic side view of a half-section of a collection trough according to the present invention.
FIG. 6 is a side view of a half-section of the frame of the present invention.
Fig. 7 is a side sectional view of the sliding plate of the present invention.
Fig. 8 is a side view of the half-section structure of the ventilation port of the present invention.
In the figure: the air conditioner comprises a machine body-1, a cooling fin-2, an air outlet mechanism-3, an outer frame-31, a rotating rod-32, a blade-33, an exhaust net-34, an outer tube-a 1, a rotating shaft-a 2, a linkage rod-a 3, a clearing rod-a 4, a joint-a 5, a fixed rod-a 41, a combination rod-a 42, a bottom plate-a 43, a collecting tank-a 44, an elastic strip-a 45, a frame-b 1, a connecting rod-b 2, a stress block-b 3, a pull strip-b 11, a frame-b 12, a sliding plate-b 13, a bottom plate-c 1, an air vent-c 2, a water absorption block-c 3, a rebound ring-c 4, a block-d 1, a position fixing frame-d 2 and a blocking block-d 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-5:
the invention provides a radiator for a semiconductor refrigerating device, which structurally comprises a machine body 1, radiating fins 2 and an air outlet mechanism 3, wherein the radiating fins 2 and the machine body 1 are of an integrated structure, and the air outlet mechanism 3 is arranged at the front end positions of the radiating fins 2; air-out mechanism 3 includes frame 31, dwang 32, blade 33, exhaust net 34, dwang 32 and frame 31 structure as an organic whole, blade 33 is connected with the side of dwang 32 is embedded firmly, exhaust net 34 is installed in the front end position of frame 31.
Wherein, the dwang 32 includes outer tube a1, pivot a2, gangbar a3, clears away pole a4, adapter a5, pivot a2 and outer tube a1 activity block, gangbar a3 and outer tube a 1's left side hinged joint, clear away the one end and the movable block of gangbar a3 of pole a4, the other end of clearing away pole a4 is laminated with the surface of pivot a2, adapter a5 and pivot a2 are the integrated structure, clear away pole a4 and be equipped with two, and be the symmetric distribution through the even outer tube a 1's of cooperation of gangbar a3 left side, can carry out the moisture on the countershaft a2 through clearing away pole a4 and scrape.
The clearing rod a4 comprises a fixing rod a41, a combining rod a42, a bottom plate a43 and a collecting groove a44, the combining rod a42 is in clearance fit with the fixing rod a41, the bottom plate a43 is fixedly embedded with the bottom of the combining rod a42, the collecting groove a44 and the bottom plate a43 are of an integrated structure, the elastic strip a45 is installed between the combining rod a42 and the fixing rod a41, the elastic strip a45 can push the bottom plate a43 to be tightly attached to the surface of an object, and therefore the collecting groove a44 can scrape moisture on the surface of the object,
the collecting groove a44 comprises a frame b1, a connecting rod b2 and a stressed block b3, the connecting rod b2 is hinged to the frame b1, the stressed block b3 is movably clamped with the connecting rod b2, the stressed block b3 can swing downwards by means of extrusion of moisture on the stressed block b3 on the stressed block b3, the stressed block b3 can be pushed to swing upwards by means of the connecting rod b2, and therefore the stressed block b3 can block moisture entering the frame b 1.
The detailed use method and action of the embodiment are as follows:
in the invention, when the temperature in the semiconductor refrigeration device is reduced to be extremely low, the rotating rod 32 automatically stops running at the moment, but the temperature difference between a part of cold air carried out at last and heat on the rotating rod 32 causes water to be condensed on the rotating rod 32, if the water is condensed on the rotating shaft a2, the lubricating oil between the rotating shaft a2 and the outer tube a1 is diluted by the water when the rotating rod 32 rotates again, the friction between the rotating shaft a2 and the outer tube a1 is increased for a long time, and finally the rotating shaft a2 is difficult to rotate, the problems can be effectively solved by the clearing rod a4 on the rotating rod 32, the link rod a3 can drive the clearing rod a4 to swing forwards by the throwing force generated by the rotating rod 32, and the pushing force generated by the elastic strip a45 on the bottom plate a43 can make the bottom plate a43 be attached to the outer surface of the rotating shaft a2, so that the collecting groove a44 can push the water on the rotating shaft a2, and through the extrusion of moisture to atress piece b3, can make atress piece b3 swing downwards, rethread connecting rod b2 can promote to make the extruded atress piece b3 of moisture reset to can block the moisture that flows out in the opposite direction, effectually avoid the moisture that condenses on the pivot a2, the condition that moisture dilutes the lubricating oil between pivot a2 and the outer tube a1 when making dwang 32 rotate once more.
Example 2
As shown in fig. 6-8:
the frame b1 comprises a pull-back strip b11, a frame b12 and a sliding plate b13, wherein the pull-back strip b11 is installed between the frame b12 and the sliding plate b13, the sliding plate b13 is movably clamped with the frame b12, the sliding plate b13 can slide forwards by the swing force generated by forward pushing of the mechanism, and the sliding plate b13 can be quickly pulled and reset by the pull-back strip b 11.
The sliding plate b13 comprises a soleplate c1, a ventilation port c2, a water absorbing block c3 and a rebound ring c4, the ventilation port c2 and the soleplate c1 are of an integrated structure, the water absorbing block c3 is installed at the left side position of the ventilation port c2, the rebound ring c4 is installed between the soleplate c1 and the ventilation port c2, the water absorbing block c3 is made of polyester sponge with strong water absorption, and water can be absorbed through the water absorbing block c 3.
The ventilation port c2 comprises a plate d1, a position fixing frame d2 and a blocking block d3, the position fixing frame d2 and the plate d1 are of an integrated structure, the blocking block d3 is movably clamped with the plate d1, the blocking block d3 is of a trapezoidal structure, and moisture can be prevented from entering the inside of the mechanism through the blocking block d 3.
The detailed use method and action of the embodiment are as follows:
in the invention, the clearing rod a4 collects the moisture on the outer surface of the rotating shaft a2 in the collecting groove a44, if more moisture is collected, the moisture in the collecting groove a44 cannot be dried quickly, so that the moisture is easy to overflow, the sliding plate b13 on the frame b1 can effectively solve the problem, the sliding plate b13 can slide forwards by the inertia force generated by the forward propulsion of the frame b1, so that the water absorption block c3 on the sliding plate b13 can absorb the moisture, and when the sliding plate b13 is pulled by the pulling strip b11 to slide backwards and reset, the front end of the bottom plate c1 can swing inwards, so that the airflow in the bottom plate c1 can push the blocking block d3, so that the blocking block d3 can extend forwards, so that the airflow can enter into the gap between the blocking block d3 and the plate d1 to be discharged, thereby accelerating the drying speed of the moisture in the water absorption block c3, the situation that the moisture in the collecting groove a44 cannot be dried quickly so that the moisture is easy to overflow is effectively avoided.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.

Claims (7)

1. The utility model provides a radiator that semiconductor refrigerating plant used, its structure includes organism (1), fin (2), air-out mechanism (3), fin (2) and organism (1) structure as an organic whole, its characterized in that: the air outlet mechanism (3) is arranged at the front end of the radiating fin (2);
air-out mechanism (3) are including frame (31), dwang (32), blade (33), exhaust net (34), dwang (32) and frame (31) structure as an organic whole, blade (33) are connected with the side of dwang (32) is inlayed admittedly, exhaust net (34) are installed in the front position of frame (31).
2. A heat sink for a semiconductor cooling device according to claim 1, wherein: the dwang (32) include outer tube (a1), pivot (a2), gangbar (a3), clear away pole (a4), adapter (a5), pivot (a2) and outer tube (a1) activity block, the left side hinged joint of gangbar (a3) and outer tube (a1), the one end and the gangbar (a3) activity block of clear away pole (a4), the other end of clear away pole (a4) is laminated with the surface of pivot (a2), adapter (a5) and pivot (a2) are the integrated structure.
3. A heat sink for a semiconductor cooling device according to claim 2, wherein: the clearing rod (a4) comprises a fixing rod (a41), a combining rod (a42), a bottom plate (a43) and a collecting groove (a44), the combining rod (a42) is in clearance fit with the fixing rod (a41), the bottom plate (a43) is fixedly embedded in the bottom of the combining rod (a42), the collecting groove (a44) and the bottom plate (a43) are of an integrated structure, and an elastic strip (a45) is installed between the combining rod (a42) and the fixing rod (a 41).
4. A heat sink for a semiconductor cooling device according to claim 3, wherein: the collecting tank (a44) comprises a frame body (b1), a connecting rod (b2) and a stress block (b3), wherein the connecting rod (b2) is hinged with the frame body (b1), and the stress block (b3) is movably clamped with the connecting rod (b 2).
5. A heat sink for a semiconductor cooling device according to claim 4, wherein: the frame body (b1) comprises a pull-back strip (b11), a frame (b12) and a sliding plate (b13), wherein the pull-back strip (b11) is installed between the frame (b12) and the sliding plate (b13), and the sliding plate (b13) is movably clamped with the frame (b 12).
6. A heat sink for a semiconductor cooling device according to claim 5, wherein: the sliding plate (b13) comprises a soleplate (c1), an air vent (c2), a water absorption block (c3) and a rebound ring (c4), wherein the air vent (c2) and the soleplate (c1) are of an integrated structure, the water absorption block (c3) is installed at the left position of the air vent (c2), and the rebound ring (c4) is installed between the soleplate (c1) and the air vent (c 2).
7. A heat sink for a semiconductor cooling device according to claim 6, wherein: the ventilation opening (c2) comprises a plate (d1), a position fixing frame (d2) and a blocking block (d3), the position fixing frame (d2) and the plate (d1) are of an integrated structure, and the blocking block (d3) is movably clamped with the plate (d 1).
CN202010868465.4A 2020-08-26 2020-08-26 Radiator for semiconductor refrigerating device Withdrawn CN112004382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010868465.4A CN112004382A (en) 2020-08-26 2020-08-26 Radiator for semiconductor refrigerating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010868465.4A CN112004382A (en) 2020-08-26 2020-08-26 Radiator for semiconductor refrigerating device

Publications (1)

Publication Number Publication Date
CN112004382A true CN112004382A (en) 2020-11-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010868465.4A Withdrawn CN112004382A (en) 2020-08-26 2020-08-26 Radiator for semiconductor refrigerating device

Country Status (1)

Country Link
CN (1) CN112004382A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112963652A (en) * 2021-02-24 2021-06-15 严立敏 Water conservancy air regenerating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112963652A (en) * 2021-02-24 2021-06-15 严立敏 Water conservancy air regenerating device

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Application publication date: 20201127

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