CN112002662A - High-speed multifunctional automatic chip mounter for semiconductor production - Google Patents
High-speed multifunctional automatic chip mounter for semiconductor production Download PDFInfo
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- CN112002662A CN112002662A CN202010938183.7A CN202010938183A CN112002662A CN 112002662 A CN112002662 A CN 112002662A CN 202010938183 A CN202010938183 A CN 202010938183A CN 112002662 A CN112002662 A CN 112002662A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Thermal Sciences (AREA)
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Abstract
The invention discloses a high-speed multifunctional automatic chip mounter for semiconductor production, which comprises a box body, a transport box, a chip mounting box, a conductive block, an air cooling box, a water cooling box, a support column, the ground, an operation frame and an element box, wherein the transport box is fixedly connected to the upper end of the box body, a support plate is fixedly connected to the upper end of the transport box, the chip mounting box is fixedly connected to the upper end of the support plate, the conductive block is connected to the lower end of the outer side of the box body through a bolt, the air cooling box is hinged to the left end of the box body, the water cooling box is fixedly connected to the lower end of the box body, the support column is fixedly connected to the lower end of the box body, the ground is in contact connection with the lower end of the support column, the operation frame is fixedly connected to the upper. The invention relates to a high-speed multifunctional automatic chip mounter for semiconductor production, which has the characteristics of good heat dissipation and electric shock resistance.
Description
Technical Field
The invention belongs to the technical field of chip mounters, and particularly relates to a high-speed multifunctional automatic chip mounter for semiconductor production.
Background
Chip mounter: also known as a mounter or a Surface Mount System (Surface Mount System), which is disposed behind a dispenser or a screen printer in a production line, is an apparatus for accurately placing Surface Mount components on PCB pads by moving a mounting head. The method is divided into manual operation and full-automatic operation. But there are some problems in the use of present full-automatic chip mounter: 1. a large number of electronic elements are arranged in the chip mounter case, the heat dissipation effect is poor, a large amount of heat can be generated when the electronic elements work, and particularly, an electric welding machine for welding is arranged in the chip mounter case, so that the service life of the electronic elements in the chip mounter case is shortened and even the electronic elements can be burnt out due to heat accumulation when the chip mounter case works; 2. the chip mounter is provided with a plurality of electronic elements inside and outside, and the circuit may leak electricity after long-time operation, and the risk of electric shock of workers can be caused after the electricity leaks, so that a high-speed multifunctional automatic chip mounter for semiconductor production needs to be designed.
The invention content is as follows:
the present invention is directed to a high-speed multifunctional automatic chip mounter for semiconductor manufacturing to solve the above problems, and to provide a high-speed multifunctional automatic chip mounter for semiconductor manufacturing to solve the problems mentioned in the background art.
In order to solve the above problems, the present invention provides a technical solution:
the utility model provides a high-speed multi-functional automatic chip mounter of semiconductor production, includes box, transport case, paster case, conducting block, forced air cooling case, water-cooling case, pillar, ground, handling frame and component case, the upper end fixedly connected with transport case of box, the upper end fixedly connected with backup pad of transport case, the upper end fixedly connected with paster case of backup pad, there is the conducting block lower extreme in the box outside through bolted connection, the left end of box articulates there is the forced air cooling case, the lower extreme fixedly connected with water-cooling case of box, the lower extreme fixedly connected with pillar of box, the lower extreme contact connection of pillar has ground, the upper end fixedly connected with handling frame of box, the upper end of handling frame articulates there is the operation panel, the quantity of pillar is four, four pillar evenly distributed is in four corners of the lower extreme of box.
Preferably, the inside fixedly connected with axle sleeve one of right-hand member of transport case, the inside of axle sleeve one is rotated and is connected with the pivot, the upper end fixedly connected with servo motor of transport case, the terminal fixedly connected with belt pulley one of servo motor output shaft, the right-hand member fixedly connected with belt pulley two of pivot, be connected through the driving belt transmission between belt pulley two and the belt pulley one, the inside fixedly connected with baffle of transport case, the inside fixedly connected with axle sleeve two of baffle, the inside of axle sleeve two with the outside of pivot is rotated and is connected, the outside fixedly connected with cylinder of pivot, the conveyer belt has been cup jointed in the outside of cylinder.
Preferably, the right end of the box body is fixedly connected with a material table, the upper end of the material table is fixedly connected with a support, and the upper end of the support is fixedly connected with a material box.
Preferably, the lower end of the conductive block is fixedly connected with a conductive rod, a conductive cylinder is arranged inside the ground, a spring is arranged inside the conductive cylinder, a contact piece is slidably connected inside the conductive cylinder, the upper end of the contact piece is in contact connection with the upper end of the conductive rod, the lower end of the contact piece is in contact connection with the upper end of the spring, the outer side of the conductive cylinder is connected with a cylinder cover through threads, the lower end of the cylinder cover is arranged inside the ground, the cylinder cover is made of rubber materials, the upper end inside the conductive cylinder is fixedly connected with a limiting ring, and the lower end of the limiting ring is in contact connection with the upper end of the contact piece.
As preferred, the left end fixedly connected with bellows of air-cooling case, the inside fixedly connected with cooling fan of bellows, the air intake has been seted up to the left end of air-cooling case, the inside fixedly connected with drier of air-cooling case, the inside fixedly connected with component case of box, equal wind hole has been seted up to the upper end of component case, the upper end fixedly connected with spoiler of the inner wall of component case, the louvre has been seted up to the left end of component case, the left end fixedly connected with axle sleeve three of component case, the inside rotation of axle sleeve three is connected with the rubber pole, the outside fixedly connected with spoiler fan of rubber pole, the quantity of spoiler is a plurality of, and a plurality of spoilers are even to be distributed the upper end of the inner wall of component case.
As preferred, the lower extreme fixedly connected with heat-conducting plate of component case, the lower extreme fixedly connected with heat pipe of heat-conducting plate, the lower extreme fixedly connected with radiating block of heat pipe, the lower extreme fixedly connected with sealing washer of water-cooling tank, the inside fixedly connected with breather pipe of sealing washer, the left end fixedly connected with level sensor of water-cooling tank, the left end fixedly connected with electron moisturizing ware of water-cooling tank, the evaporation hole has been seted up to the right-hand member of water-cooling tank, the right-hand member fixedly connected with exhaust fan of water-cooling tank, level sensor's one end fixedly connected with power, level sensor's other end fixedly connected with electron moisturizing ware, power, level sensor and electron moisturizing ware establish ties in same circuit.
Preferably, the left end of the transport case is fixedly connected with an inclined plate, the placing box is placed at the upper end of the case body, the right end of the case body is provided with an air outlet, and the right end of the case body is fixedly connected with a flow guide fan.
Preferably, the upper end of the heat conducting plate is fixedly connected with a circuit box, and the upper end of the heat conducting plate is fixedly connected with a processor.
The invention has the beneficial effects that: the invention relates to a high-speed multifunctional automatic chip mounter for semiconductor production, which has the characteristics of good heat dissipation and electric shock resistance, and has the following two beneficial effects compared with the traditional high-speed multifunctional automatic chip mounter for semiconductor production in specific use:
firstly, the outer side of the box body is additionally provided with a structure such as an air cooling box and the like to uniformly radiate the internal electrical elements, the lower end of the element box is additionally provided with a structure such as a heat conducting plate and a water cooling box and the like to transfer the heat of the electrical elements into the water cooling box through the heat conducting plate for cooling, so that the electrical elements inside the surface-mounted box can be sufficiently radiated;
secondly, the lower end of the box body is additionally provided with a conductive block and a conductive rod, the box body and the current inside the box body are transmitted out, and then the box body and the current are transmitted underground through a contact piece and a conductive cylinder which are contacted with the lower end of the conductive rod, so that the safety of workers is protected.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a left side view of FIG. 1 of the present invention;
FIG. 3 is a top view of FIG. 1 of the present invention;
FIG. 4 is an enlarged view of the portion A of FIG. 1 according to the present invention;
FIG. 5 is an enlarged view of the portion B of FIG. 1 according to the present invention;
FIG. 6 is an enlarged view of the structure of the portion C of FIG. 2 according to the present invention;
fig. 7 is a working circuit diagram of the electronic water replenishing device of fig. 1 according to the present invention.
In the figure: 1. a box body; 2. a transport case; 3. a film sticking box; 4. a conductive block; 5. an air cooling box; 6. a water cooling tank; 7. a pillar; 8. a ground surface; 9. an operation frame; 10. a sloping plate; 11. placing boxes; 12. an air outlet; 13. a flow guiding fan; 14. a circuit box; 15. a processor; 16. a cooling fan; 17. a power source; 20. a conveyor belt; 21. a first shaft sleeve; 22. a rotating shaft; 23. a servo motor; 24. a first belt pulley; 25. a drive belt; 26. a second belt pulley; 27. a partition plate; 28. a second shaft sleeve; 29. a drum; 31. a support plate; 32. a material table; 33. a support; 34. a material box; 41. a conductive rod; 42. a conductive barrel; 43. a spring; 44. a contact piece; 45. a cylinder cover; 46. a limiting ring; 50. a rubber rod; 51. an air box; 52. an air inlet; 53. a desiccant; 54. a component box; 55. air equalizing holes; 56. a spoiler; 57. heat dissipation holes; 58. a third shaft sleeve; 59. a turbulent fan; 61. a heat conducting plate; 62. a heat conducting pipe; 63. a heat dissipating block; 64. a seal ring; 65. a breather pipe; 66. a water level sensor; 67. an electronic water replenishing device; 68. an evaporation hole; 69. an exhaust fan; 91. an operation panel.
The specific implementation mode is as follows:
as shown in fig. 1 to 7, the following technical solutions are adopted in the present embodiment:
example (b):
a high-speed multifunctional automatic chip mounter for semiconductor production comprises a box body 1, a transport box 2, a chip box 3, a conductive block 4, an air cooling box 5, a water cooling box 6, a support column 7, a ground 8, an operation frame 9 and an element box 54, wherein the upper end of the box body 1 is fixedly connected with the transport box 2, the upper end of the transport box 2 is fixedly connected with a support plate 31, the upper end of the support plate 31 is fixedly connected with the chip box 3, the lower end of the outer side of the box body 1 is connected with the conductive block 4 through a bolt, the left end of the box body 1 is hinged with the air cooling box 5, the lower end of the box body 1 is fixedly connected with the water cooling box 6, the lower end of the box body 1 is fixedly connected with the support column 7, the lower end of the support column 7 is in contact connection with the ground 8, the upper end of the box body 1 is fixedly connected with the operation frame 9, the four pillars 7 are uniformly distributed at four corners of the lower end of the box body 1.
Wherein, the inside fixedly connected with axle sleeve 21 of the right-hand member of transport case 2, the inside of axle sleeve 21 is rotated and is connected with pivot 22, the upper end fixedly connected with servo motor 23 of transport case 2, the terminal fixedly connected with belt pulley 24 of servo motor 23 output shaft, the right-hand member fixedly connected with belt pulley two 26 of pivot 22, be connected through driving belt 25 transmission between belt pulley two 26 and the belt pulley 24, the inside fixedly connected with baffle 27 of transport case 2, the inside fixedly connected with axle sleeve two 28 of baffle 27, the inside of axle sleeve two 28 with the outside of pivot 22 is rotated and is connected, the outside fixedly connected with cylinder 29 of pivot 22, conveyer belt 20 has been cup jointed in the outside of cylinder 29.
The material platform 32 is fixedly connected to the right end of the box body 1, the support 33 is fixedly connected to the upper end of the material platform 32, and the material box 34 is fixedly connected to the upper end of the support 33.
The lower end of the conductive block 4 is fixedly connected with a conductive rod 41, the inside of the ground 8 is provided with a conductive cylinder 42, the inside of the conductive cylinder 42 is provided with a spring 43, the inside of the conductive cylinder 42 is slidably connected with a contact piece 44, the upper end of the contact piece 44 is in contact connection with the upper end of the conductive rod 41, the lower end of the contact piece 44 is in contact connection with the upper end of the spring 43, the outer side of the conductive cylinder 42 is connected with a cylinder cover 45 through threads, the lower end of the cylinder cover 45 is arranged inside the ground 8, the cylinder cover 45 is made of rubber materials, the upper end of the inside of the conductive cylinder 42 is fixedly connected with a limit ring 46, and the lower end of the limit ring 46 is in contact connection with the upper end of the contact piece 44.
Wherein, the left end fixedly connected with bellows 51 of forced air cooling case 5, the inside fixedly connected with cooling fan 16 of bellows 51, air intake 52 has been seted up to the left end of forced air cooling case 5, the inside fixedly connected with drier 53 of forced air cooling case 5, the inside fixedly connected with component case 54 of box 1, equal wind hole 55 has been seted up to the upper end of component case 54, the upper end fixedly connected with spoiler 56 of the inner wall of component case 54, louvre 57 has been seted up to the left end of component case 54, the left end fixedly connected with axle sleeve three 58 of component case 54, the inside rotation of axle sleeve three 58 is connected with rubber pole 50, the outside fixedly connected with spoiler 59 of rubber pole 50, the quantity of spoiler 56 is a plurality ofly, and the even distribution of a plurality of spoilers 56 is in the upper end of the inner wall of component case 54.
Wherein, the lower extreme fixedly connected with heat-conducting plate 61 of component case 54, the lower extreme fixedly connected with heat pipe 62 of heat-conducting plate 61, the lower extreme fixedly connected with radiating block 63 of heat pipe 62, the lower extreme fixedly connected with sealing washer 64 of water-cooling tank 6, the inside fixedly connected with breather pipe 65 of sealing washer 64, the left end fixedly connected with level sensor 66 of water-cooling tank 6, the left end fixedly connected with electron moisturizing device 67 of water-cooling tank 6, evaporation hole 68 has been seted up to the right-hand member of water-cooling tank 6, the right-hand member fixedly connected with exhaust fan 69 of water-cooling tank 6, the one end fixedly connected with power 17 of level sensor 66, the other end fixedly connected with electron moisturizing device 67 of level sensor 66, power 17, level sensor 66 establish ties in same circuit with electron moisturizing device 67.
The left end of the transport case 2 is fixedly connected with an inclined plate 10, a placing box 11 is placed at the upper end of the case 1, an air outlet 12 is formed in the right end of the case 1, and a flow guide fan 13 is fixedly connected with the right end of the case 1.
Wherein, the upper end fixedly connected with circuit box 14 of heat-conducting plate 61, the upper end fixedly connected with treater 15 of heat-conducting plate 61.
The using state of the invention is as follows: when the chip mounter is used for processing, the material box 34 conveys chips which are not pasted into the chip mounter box 3 for pasting, the servo motor 23 drives the belt pulley second 26 at the lower end of the transmission belt 25 to rotate through the belt pulley first 24, the belt pulley second 26 rotates through the roller 29 at the outer side of the rotating shaft 22, the roller 29 drives the conveyor belt 20 at the outer side of the belt pulley second to rotate, the conveyor belt 20 conveys the processed chips to the inclined plate 10, the chips slide into the placing box 11 through the inclined plate 10, when the device works, the current leaked in the device is guided into the contact piece 44 contacted with the lower end of the conductive block 4 at the outer side of the box body 1 through the conductive rod 41 at the lower end of the conductive block 4, the contact piece 44 guides the current into the conductive cylinder 42, the conductive cylinder 42 guides the current into the deep part of the ground 8, when the device works, the cooling fan 16 at the left end of the box body 1 blows cold air into the air cooling box 5, the, one part of air flows into the element box 54 through the air equalizing hole 55 to dissipate heat of the elements therein, the other part of air enters the turbulent flow of the turbulent flow fan 59 under the guidance of the flow guiding fan 13 and then blows into the element box 54 to dissipate heat, the heat plate 61 at the lower end of the element box 54 transfers the heat dissipated by the circuit box 14 and the processor 15 at the upper end thereof to the heat dissipating block 63 through the heat conducting pipe 62, the heat dissipating block 63 dissipates the heat therein into the water of the water cooling box 6, the left end of the water cooling box 6 is further provided with the exhaust fan 69 to quickly evaporate the water therein, so that the heat dissipating effect is better, the left end of the water cooling box 6 is additionally provided with the water level sensor 66 and the electronic water replenishing device 67, and the water level sensor 66 controls the electronic water replenishing device 67 to replenish water to the interior of the water cooling box 6 through a circuit when the water is in the water cooling box 6.
While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (8)
1. The utility model provides a high-speed multi-functional automatic chip mounter of semiconductor production, includes box (1), transport case (2), paster case (3), conducting block (4), air-cooled box (5), water-cooled box (6), pillar (7), ground (8), handling frame (9) and component case (54), its characterized in that: the upper end of the box body (1) is fixedly connected with a transport box (2), the upper end of the transport box (2) is fixedly connected with a support plate (31), the upper end of the supporting plate (31) is fixedly connected with a patch box (3), the lower end of the outer side of the box body (1) is connected with a conductive block (4) through a bolt, the left end of the box body (1) is hinged with an air cooling box (5), the lower end of the box body (1) is fixedly connected with a water cooling box (6), the lower end of the box body (1) is fixedly connected with a strut (7), the lower end of the strut (7) is connected with the ground (8) in a contact way, the upper end of the box body (1) is fixedly connected with an operating frame (9), the upper end of the operating frame (9) is hinged with an operating plate (91), the number of the pillars (7) is four, and the four pillars (7) are uniformly distributed at four corners of the lower end of the box body (1).
2. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 1, wherein: a first shaft sleeve (21) is fixedly connected inside the right end of the transport box (2), a rotating shaft (22) is rotatably connected inside the first shaft sleeve (21), the upper end of the transport case (2) is fixedly connected with a servo motor (23), the tail end of an output shaft of the servo motor (23) is fixedly connected with a belt pulley I (24), the right end of the rotating shaft (22) is fixedly connected with a second belt pulley (26), the second belt pulley (26) is in transmission connection with the first belt pulley (24) through a transmission belt (25), a partition plate (27) is fixedly connected inside the transport box (2), a second shaft sleeve (28) is fixedly connected inside the partition plate (27), the inner part of the second shaft sleeve (28) is rotationally connected with the outer side of the rotating shaft (22), the outer side of the rotating shaft (22) is fixedly connected with a roller (29), and the outer side of the roller (29) is sleeved with a conveyor belt (20).
3. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 1, wherein: the material box is characterized in that a material table (32) is fixedly connected to the right end of the box body (1), a support (33) is fixedly connected to the upper end of the material table (32), and a material box (34) is fixedly connected to the upper end of the support (33).
4. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 1, wherein: the lower extreme fixedly connected with conducting rod (41) of conducting block (4), the inside on ground (8) is provided with a conductive cylinder (42), the inside of conductive cylinder (42) is provided with spring (43), the inside sliding connection of conductive cylinder (42) has contact piece (44), the upper end of contact piece (44) with the upper end contact of conducting rod (41) is connected, the lower extreme of contact piece (44) with the upper end contact of spring (43) is connected, there is cover (45) outside of conductive cylinder (42) through threaded connection, the lower extreme of cover (45) is in the inside on ground (8), cover (45) are made by rubber materials, the upper end fixedly connected with spacing ring (46) of the inside of conductive cylinder (42), the lower extreme of spacing ring (46) with the upper end contact of contact piece (44) is connected.
5. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 1, wherein: the left end fixedly connected with bellows (51) of forced air cooling case (5), the inside fixedly connected with cooling fan (16) of bellows (51), air intake (52) have been seted up to the left end of forced air cooling case (5), the inside fixedly connected with drier (53) of forced air cooling case (5), the inside fixedly connected with component case (54) of box (1), the upper end of component case (54) is seted up and is equallyd wind hole (55), the upper end fixedly connected with spoiler (56) of the inner wall of component case (54), the left end of component case (54) is seted up louvre (57), the left end fixedly connected with axle sleeve three (58) of component case (54), the inside rotation of axle sleeve three (58) is connected with rubber pole (50), the outside fixedly connected with spoiler fan (59) of rubber pole (50), the quantity of spoiler (56) is a plurality ofly, a plurality of spoilers (56) are evenly distributed at the upper end of the inner wall of the element case (54).
6. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 5, wherein: the lower end of the element box (54) is fixedly connected with a heat conducting plate (61), the lower end of the heat conducting plate (61) is fixedly connected with a heat conducting pipe (62), the lower end of the heat conducting pipe (62) is fixedly connected with a radiating block (63), the lower end of the water cooling box (6) is fixedly connected with a sealing ring (64), the inner part of the sealing ring (64) is fixedly connected with a ventilating pipe (65), the left end of the water cooling box (6) is fixedly connected with a water level sensor (66), the left end of the water cooling box (6) is fixedly connected with an electronic water replenishing device (67), the right end of the water cooling box (6) is provided with an evaporation hole (68), the right end of the water cooling box (6) is fixedly connected with an exhaust fan (69), one end of the water level sensor (66) is fixedly connected with a power supply (17), and the other, the power supply (17), the water level sensor (66) and the electronic water replenishing device (67) are connected in series in the same circuit.
7. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 1, wherein: the left end fixedly connected with swash plate (10) of transport case (2), box (11) have been put to the upper end of box (1), air outlet (12) have been seted up to the right-hand member of box (1), the right-hand member fixedly connected with water conservancy diversion fan (13) of box (1).
8. The high-speed multifunctional automatic chip mounter for semiconductor production according to claim 6, wherein: the upper end fixedly connected with circuit box (14) of heat-conducting plate (61), the upper end fixedly connected with treater (15) of heat-conducting plate (61).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010938183.7A CN112002662A (en) | 2020-09-09 | 2020-09-09 | High-speed multifunctional automatic chip mounter for semiconductor production |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010938183.7A CN112002662A (en) | 2020-09-09 | 2020-09-09 | High-speed multifunctional automatic chip mounter for semiconductor production |
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| CN112002662A true CN112002662A (en) | 2020-11-27 |
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| CN202010938183.7A Withdrawn CN112002662A (en) | 2020-09-09 | 2020-09-09 | High-speed multifunctional automatic chip mounter for semiconductor production |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112563177A (en) * | 2020-12-10 | 2021-03-26 | 温州大学 | Pipe supply device for material pipe in integrated circuit packaging equipment |
| CN112649885A (en) * | 2020-12-11 | 2021-04-13 | 广东财经大学 | Intelligent recognition device for electronic commerce |
| CN113031023A (en) * | 2021-01-26 | 2021-06-25 | 深圳市合讯电子有限公司 | Testing device of satellite navigation receiver |
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2020
- 2020-09-09 CN CN202010938183.7A patent/CN112002662A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563177A (en) * | 2020-12-10 | 2021-03-26 | 温州大学 | Pipe supply device for material pipe in integrated circuit packaging equipment |
| CN112649885A (en) * | 2020-12-11 | 2021-04-13 | 广东财经大学 | Intelligent recognition device for electronic commerce |
| CN112649885B (en) * | 2020-12-11 | 2022-03-04 | 广东财经大学 | Intelligent recognition device for electronic commerce |
| CN113031023A (en) * | 2021-01-26 | 2021-06-25 | 深圳市合讯电子有限公司 | Testing device of satellite navigation receiver |
| CN113031023B (en) * | 2021-01-26 | 2021-11-30 | 深圳市合讯电子有限公司 | Testing device of satellite navigation receiver |
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