CN112002655A

CN112002655A - Semiconductor silicon wafer surface titration type chemical polishing device

Info

Publication number: CN112002655A
Application number: CN202010706238.1A
Authority: CN
Inventors: 孔少临
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2020-11-27

Abstract

The invention relates to the technical field of chemical polishing, and discloses a titration type chemical polishing device for the surface of a semiconductor silicon wafer, which is in contact with a pulley. The pulley can be driven to rotate when the driving shaft drives the pulley to rotate, and the pulley moves towards the outside continuously through the outward diffused spiral shape while rotating, the rotating speed of the pulley is also a fixed value due to the fact that the power of the driving shaft is fixed, when the pulley moves towards the outside continuously, the rotating speed is reduced due to the fact that the distance between the pulley and the contact position and the central line is increased continuously, centrifugal force is reduced continuously, the centrifugal force applied to the surface of a material when the chemical agent moves towards the outside is reduced, the speed of the chemical agent moving towards the outside is reduced, the problem that the polishing speed of the inner side and the polishing speed of the outer side of the material are inconsistent due to the fact that the chemical agent moving towards the outside is increased continuously due to the fact that the rotating speed of the original equipment is fixed is solved, and the working stability of the device.

Description

Semiconductor silicon wafer surface titration type chemical polishing device

Technical Field

The invention relates to the technical field of chemical polishing, in particular to a semiconductor silicon wafer surface titration type chemical polishing device.

Background

The chemical polishing machine is a device used for surface polishing of some special materials or materials with special shapes, such as semiconductor silicon wafers, glass and other various materials, the principle is that a specific chemical agent is adopted, the chemical agent can corrode the materials to be polished and can be dripped to the surface of the materials in an electric control titration mode, the materials are driven to rotate through a rotating structure, the chemical agent can move outwards by utilizing centrifugal force to increase the contact area, because the chemical agent can be dissolved preferentially at the convex position, the dissolving rate is greater than that of the concave part, and finally the surface of the materials is smooth, so that the polishing effect is achieved, the device is simple in structure, convenient to operate, low in production difficulty and simple in price.

However, the rotating mechanisms adopted by the existing chemical polishing machine are all single power machines to drive the rotating discs to rotate, and the rotating speed during polishing is kept unchanged, so that the centrifugal forces applied to chemical agent droplets on the surface of a material at different positions are different, the centrifugal force applied to the chemical agent droplets farther away from the rotating center is higher, the outward moving speed of the chemical agent droplets is higher, and finally the contact time of the central position of the material and the chemical agent is longer than the contact time of the outer side of the material and the chemical agent, so that the polishing degree of the surface of the material is too large to cause defective products.

Disclosure of Invention

Aiming at the defects of the prior chemical polishing machine in the use process, the invention provides the semiconductor silicon wafer surface titration type chemical polishing device which has the advantages that the chemical agent can be used for ensuring that the polishing rates of the inner side and the outer side of the material are consistent, and the titration device does not need to be additionally arranged, thereby solving the problem that the original equipment is easy to cause the inconsistent polishing rates of the outer side and the inner side of the material and produce defective products.

The invention provides the following technical scheme: a semiconductor silicon chip surface titration type chemical polishing device comprises a chassis, and is characterized in that: the outer surface of the top of the chassis is fixedly provided with a shell, the central position of the top of the chassis is fixedly provided with a supporting column, two sides of the supporting column are provided with planes, and the positions of the planes close to the top are fixedly provided with fixed shafts, a reset device is movably sleeved on the outer surface of the fixed shaft, a moving device is fixedly arranged at one end of the reset device, the top of the supporting column is provided with a circular groove, the bottom of the circular groove is fixedly provided with a rotating bracket, a rotating seat is fixedly arranged on an output shaft of the rotating bracket, a bearing is fixedly sleeved on the outer surface of the rotating seat, the outer surface of the bearing is contacted with the inner wall of the circular groove at the top of the support column, the top of the rotating seat is fixedly provided with a turntable, the titration apparatus is fixedly mounted at the top of the chassis and at the position outside the supporting column, and extends from the inside of the shell to the position above the center of the turntable.

Preferably, resetting means includes the guide rail, the spout has all been seted up for two and top to the quantity of guide rail, the inside movable mounting of spout has the slider, the one end fixed mounting of slider has reset spring I, the one end of reset spring I links to each other with the bottom of spout, circular through-hole has been seted up and through this circular through-hole and fixed axle activity cup joints to one side of guide rail, the top fixed mounting of slider has reset spring II, the one end fixed mounting of reset spring II has the backup pad that resets, backup pad fixed mounting resets is on the plane of support column both sides, the one end fixed mounting of slider has the mobile device, fixed mounting has the trigger plate on the position that the guide rail bottom is located the inboard, trigger plate contacts with titration outfit.

Preferably, the mobile device includes the drive shaft, the pulley has been cup jointed in the surface activity of drive shaft, the pulley contacts with the carousel, the one end fixed mounting of drive shaft has the pivot, the backup pad has been cup jointed in the both sides activity of pivot, the top fixed mounting of pivot has spacing spring and spacing spring's one end to link to each other with the top of backup pad, the equal fixed mounting in both sides of backup pad has the connecting rod, the one end and the slider fixed connection of connecting rod.

Preferably, titration outfit includes the atmospheric pressure storehouse, one side fixed mounting in atmospheric pressure storehouse has deformation storehouse and deformation storehouse to be linked together with the atmospheric pressure storehouse, the central point of deformation storehouse one side puts the inside that is provided with contact tube and has seted up circular through-hole and communicate with deformation storehouse and atmospheric pressure storehouse, contact tube contacts with the trigger plate, fixed mounting has the air duct on the position that atmospheric pressure storehouse one side is located deformation storehouse bottom, the one end fixed mounting of air duct has stock solution device, the top fixed mounting of stock solution device has the catheter, the top fixed mounting of catheter has the dropping liquid device, the dropping liquid device is located the top that carousel central point put.

Preferably, the deformation bin is made of a flexible material capable of elastically deforming.

Preferably, the stock solution device includes the stock solution storehouse, the peripheral height that antiskid piece and antiskid piece have been cup jointed in the inside activity of stock solution storehouse is less than the central height, the stock solution mouth has been seted up at the top in stock solution storehouse, the stock solution mouth is the same with the catheter and the fixed cover in inside of stock solution mouth has been connect the single logical piece, the bottom and the air duct in stock solution storehouse are to the intercommunication.

Preferably, the dropping liquid device includes the drip storehouse, the inner chamber and the catheter in drip storehouse are linked together, the bottom fixed mounting in drip storehouse has the quantity of drip mouth and drip mouth to be six and arranges with circular array's mode, the drip mouth is linked together with the inner chamber in drip storehouse.

Preferably, the carousel includes the rotor, the thickness in the rotor outside is greater than the thickness of central point and puts, the helicla flute has been seted up to the rotor bottom, the helicla flute contacts with the pulley, the helicla flute is the heliciform of outdiffusion and extends and extend to the side of helicla flute always, the degree of depth of helicla flute initial position is the biggest, and its degree of depth constantly reduces along with the length constantly increasing of extension.

The invention has the following beneficial effects:

1. the pulley is movably sleeved on the outer surface of the driving shaft, and is contacted with the pulley through the spiral groove, so that the pulley can drive the rotor to rotate while the driving shaft drives the pulley to rotate, the rotor rotates while the pulley continuously moves outwards through the spiral shape of the spiral groove, the rotating speed of the pulley is a fixed value due to the fixed power of the driving shaft, when the pulley continuously moves outwards along the spiral groove, the rotating speed of the rotor is reduced due to the fact that the distance between the contact position of the pulley and the spiral groove and the central line of the rotor is continuously increased, the centrifugal force is also continuously reduced, the centrifugal force borne by the chemical agent on the surface of the material when the chemical agent moves outwards is also reduced, and the outwards moving speed of the chemical agent is also reduced, so that the phenomenon that the polishing speed of the inner side and the polishing speed of the outer side of the material are inconsistent due to the fact that the The problem of defective products is solved, and the working stability of the device is improved.

2. A reset spring I is fixedly installed at one end of the sliding block, one end of the reset spring I is connected with the bottom of the sliding groove, when the pulley moves along with the rotation of the rotating body, the reset spring I can generate elastic deformation to enable the sliding block to move synchronously, and when the pulley moves to the outermost side of the spiral groove and is separated from the spiral groove, the reset spring I can reset to drive the sliding block and the moving device to reset so as to prepare for next operation, a reset spring II is fixedly installed at the top of the sliding block, a reset support plate is fixedly installed at one end of the reset spring II, the reset support plate is fixedly installed on the plane at the two sides of the support column, so that the reset spring II can assist the reset spring I to reset the sliding block, and meanwhile, the phenomenon that the weight at the two sides of the fixed shaft is unbalanced when the pulley moves to the limit distance, the stability of the device during operation has been improved.

3. The degree of depth through helicla flute initial position is the biggest, its degree of depth constantly reduces along with the length constantly increasing of extension, thereby make the pulley move along the helicla flute between contact area also constantly reduce so that frictional force between the messenger also constantly reduces, because the slider also can pull and lift reset spring I and move and make its pulling force to the mobile device also constantly increase when the pulley moves along the helicla flute, thereby make the frictional force increase between pulley and the helicla flute, two kinds of effects are each other low-efficient make the frictional force between pulley and the helicla flute can change in acceptable within range, thereby prevent that the frictional force change volume between pulley and the helicla flute is too big thereby influence the rotational speed of pulley and the rotational speed of rotor, and then influence the polishing quality of rotor top material, the stability of the device work has further been improved.

4. The invention prevents the pulley from colliding with the spiral groove to cause the damage of the structure of the mobile device in the process of dragging the mobile device to reset when the sliding block resets through the thickness of the outer side of the rotating body being larger than the thickness of the central position, improves the working stability of the device, simultaneously, the pulley can reset until moving to the outermost side of the rotating body through the spiral groove extending in an outward-diffused spiral shape and extending to the side surface of the spiral groove, the outer contour of the polishing material is always positioned in the inner part of the outer contour of the rotating body, ensures that the chemical agent liquid drops on the material can move for enough time and can be separated from the material through centrifugal force, avoids the phenomenon that the chemical agent liquid drops start to reset and go through the next stroke without being separated from the material pulley, and leads the chemical agent liquid drops to be suddenly increased in centrifugal force to be separated so as to cause the acceleration, the reliability of the device is improved.

5. The invention contacts the trigger plate through the contact tube, and simultaneously, the trigger plate can generate a device with the contact tube through the material of the deformation bin, when the slide block resets each time, the trigger plate can generate a primary device with the contact tube along with the reset of the slide block, the device can lead the deformation bin to be compressed by impact force and generate high-pressure gas in the air pressure bin, the gas enters the liquid storage device through the air duct and pushes the anti-skid sheet and chemical agent above the anti-skid sheet, the chemical agent can be dripped out from the drip port through the drip bin through the conduction of the liquid guide tube, the process can be completed in a very short time, the chemical agent can be dripped to the surface of the material and polished next time when the pulley carries out the next stroke, the structure completes the whole titration effect through a mechanical mode, compared with the original equipment, the titration is cancelled by using an electric control mode, the structure has very high reliability, can ensure that liquid drops can be ensured to drop to the surface of a material when the pulley starts to run at each time, can automatically finish the process without setting in advance, and further improves the reliability of the device.

6. The circular through hole is arranged in the contact tube and is communicated with the deformation bin and the air pressure bin, so that on one hand, the through hole in the air pressure bin can be blocked when the trigger plate collides with the contact tube under the action of falling back of the slide block, high-pressure air in the air pressure bin can completely enter the air guide tube and is transmitted to the liquid storage device to act on the antiskid sheet, on the other hand, when the slide block moves again and drives the trigger plate to move, the trigger plate is separated from the contact tube, so that external air can enter the air pressure bin from the circular through hole in the contact tube for supplement, low air pressure formed when the deformation bin resets can not act on the antiskid sheet reversely but reset, the phenomenon that the next antiskid sheet moves to extrude chemical agent from a liquid dropping port to lose effect due to falling back of the chemical agent in the liquid storage device is avoided, and the stability of the device during working is improved, meanwhile, the peripheral height of the anti-slip sheet is lower than the central height, so that the friction force of the anti-slip sheet moving downwards is greater than the friction force of the anti-slip sheet moving upwards, the anti-slip sheet is more difficult to fall back, and the working stability of the device is further improved.

7. The invention can lead the rotating shaft to rotate around the supporting plate through the supporting plates movably sleeved at the two sides of the rotating shaft so as to lead the pulley to carry out the adjustment of the posture, meanwhile, a limit spring is fixedly arranged at the top of the rotating shaft, one end of the limit spring is connected with the top of the supporting plate, so that the limit spring limits the posture of the pulley to a certain extent and keeps the pulley in a resetting trend, thereby ensuring that the pulley can stably contact with the spiral groove while moving along the spiral groove, improving the stability of the pulley when moving, when the pulley rotates to the ending end of the spiral groove, the tension of the limiting spring to the pulley is smaller than the tension of the reset spring I and the reset spring II to the sliding block, so that the pulley rotates and can be separated from the outer surface of the rotating body, the situation that the pulley moves to the side face of the rotating body and cannot be separated from the reset is avoided, and the stability of the device in the working process is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the internal structure of the present invention;

FIG. 3 is an enlarged view of the point A in FIG. 2;

FIG. 4 is a schematic view of the internal structure of the present invention;

FIG. 5 is an enlarged view of the point B in FIG. 4;

FIG. 6 is a schematic view of a structural return device of the present invention;

FIG. 7 is a schematic view of a mobile device according to the present invention;

FIG. 8 is a schematic cross-sectional view of a mobile device according to an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view of a titration apparatus constructed in accordance with the present invention;

FIG. 10 is an enlarged view of the point C in FIG. 9;

FIG. 11 is an enlarged schematic view taken at D in FIG. 9 of the present invention;

FIG. 12 is a schematic cross-sectional view of a turntable according to the present invention;

FIG. 13 is a bottom view of the turntable of the present invention.

In the figure: 1. a chassis; 2. a housing; 3. a support pillar; 4. a fixed shaft; 5. a resetting device; 51. a guide rail; 52. a chute; 53. a slider; 54. a return spring I; 55. a return spring II; 56. resetting the support plate; 57. a trigger plate; 6. a mobile device; 61. a drive shaft; 62. a pulley; 63. a rotating shaft; 64. a support plate; 65. a limiting spring; 66. a connecting rod; 7. rotating the bracket; 8. a rotating seat; 9. a bearing; 10. a turntable; 101. a rotating body; 102. a helical groove; 11. a titration device; 111. an air pressure bin; 112. a deformation bin; 113. a contact tube; 114. an air duct; 115. a liquid storage device; 1151. a liquid storage bin; 1152. anti-slip sheets; 1153. a liquid storage port; 1154. a single-pass sheet; 116. a catheter; 117. a liquid dropping device; 1171. a drip chamber; 1172. a liquid dropping port.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-13, a semiconductor silicon wafer surface titration type chemical polishing device comprises a chassis 1, a housing 2 is fixedly mounted on the outer surface of the top of the chassis 1, a support pillar 3 is fixedly mounted at the central position of the top of the chassis 1, two sides of the support pillar 3 are provided with planes, a fixed shaft 4 is fixedly mounted at the position, close to the top, of the planes, a reset device 5 is movably sleeved on the outer surface of the fixed shaft 4, the reset device 5 comprises guide rails 51, two guide rails 51 are provided, sliding grooves 52 are respectively formed at the tops of the guide rails 51, a sliding block 53 is movably mounted inside the sliding grooves 52, a reset spring i 54 is fixedly mounted at one end of the sliding block 53, one end of the reset spring i 54 is connected with the bottom of the sliding groove 52, a circular through hole is formed at one side of the guide rail 51 and is movably sleeved, one end of the reset spring II 55 is fixedly provided with a reset support plate 56, the reset support plate 56 is fixedly arranged on the plane of the two sides of the support column 3, one end of the slide block 53 is fixedly provided with a mobile device 6, the mobile device 6 comprises a drive shaft 61, the outer surface of the drive shaft 61 is movably sleeved with a pulley 62, the pulley 62 is contacted with the turntable 10, one end of the drive shaft 61 is fixedly provided with a rotating shaft 63, the two sides of the rotating shaft 63 are movably sleeved with support plates 64, the top of the rotating shaft 63 is fixedly provided with a limit spring 65, one end of the limit spring 65 is connected with the top of the support plate 64, the two sides of the support plate 64 are both fixedly provided with connecting rods 66, one end of each connecting rod 66 is fixedly connected with the slide block 53, the bottom of the guide rail 51 is positioned at the inner side and is fixedly provided with a trigger plate 57, the top, the outer surface of the rotating seat 8 is fixedly sleeved with a bearing 9, the outer surface of the bearing 9 is in contact with the inner wall of a circular groove at the top of the supporting column 3, a turntable 10 is fixedly mounted at the top of the rotating seat 8, the turntable 10 comprises a rotating body 101, the thickness of the outer side of the rotating body 101 is larger than that of the central position, a spiral groove 102 is formed in the bottom of the rotating body 101, the spiral groove 102 is in contact with a pulley 62, the spiral groove 102 extends in an outward diffusion spiral shape and extends to the side face of the spiral groove 102, the depth of the initial position of the spiral groove 102 is the largest, the depth of the spiral groove is continuously reduced along with the continuous increase of the extending length, a titration device 11 is fixedly mounted at the top of the chassis 1 and at the position outside the supporting column 3, the trigger plate 57 is in contact with the titration device, one side of the air pressure bin 111 is fixedly provided with a deformation bin 112, the deformation bin 112 is communicated with the air pressure bin 111, the deformation bin 112 is made of a flexible material capable of being elastically deformed, a contact pipe 113 is arranged at the central position of one side of the deformation bin 112, a circular through hole is formed in the contact pipe 113 and communicated with the deformation bin 112 and the air pressure bin 111, the contact pipe 113 is contacted with a trigger plate 57, an air guide pipe 114 is fixedly arranged at the position, located at the bottom of the deformation bin 112, of one side of the air pressure bin 111, one end of the air guide pipe 114 is fixedly provided with a liquid storage device 115, the liquid storage device 115 comprises a liquid storage bin 1151, an anti-slip sheet 1152 is movably sleeved in the liquid storage bin 1151, the peripheral thickness of the anti-slip sheet 1152 is larger than the central thickness, a liquid storage port 1153 is formed in the top of the liquid storage bin 1151, the liquid storage port 1153 is identical to the liquid guide pipe 116, a, liquid storage device 115's top fixed mounting has catheter 116, the top fixed mounting of catheter 116 has dropping device 117, dropping device 117 includes dropping liquid storehouse 1171, dropping liquid storehouse 1171's inner chamber is linked together with catheter 116, dropping liquid mouth 1172 and dropping liquid mouth 1172's quantity is six and arranges with circular array's mode in dropping liquid storehouse 1171's bottom fixed mounting, dropping liquid mouth 1172 is linked together with dropping liquid storehouse 1171's inner chamber, dropping device 117 is located the top of carousel 10 central point.

Wherein, pulley 62 has been cup jointed through the activity of the outer surface of drive shaft 61, simultaneously contact with pulley 62 through helicla flute 102, make drive shaft 61 drive pulley 62 rotate while pulley 62 can drive rotor 101 rotate, and rotor 101 rotates while pulley 62 passes through the continuous outside shift of helicla form of helicla flute 102 outdiffusion, because the power of drive shaft 61 certainly makes the rotational speed of pulley 62 also be a definite value, when pulley 62 constantly moves to the outside along helicla flute 102, because the pulley 62 constantly increases the rotational speed that makes rotor 101 to the distance of helix groove 102 contact position to rotor 101 central line, make centrifugal force constantly descend, make the centrifugal force that receives when the chemical agent on material surface moves to the outside also reduce and make its speed that moves to the outside also reduce, thereby avoided original equipment to lead to the fact chemical agent to the speed that moves to the outside constantly increase to lead to the fact to its speed that moves to the outside because the rotational speed is certain The polishing rate of the inner side and the outer side of the material is inconsistent, so that defective products are generated, and the working stability of the device is improved.

Wherein, there is reset spring I54 through the one end fixed mounting of slider 53, reset spring I54's one end links to each other with the bottom of spout 52, make pulley 62 along with rotor 101 rotate when removing reset spring I54 can take place elastic deformation and make slider 53 can remove in step, pulley 62 moves to the outside of helicla flute 102 and when breaking away from with helicla flute 102 simultaneously, reset spring I54 can reset thereby drive slider 53 and mobile device 6 and reset, thereby prepare to carry out next operation, simultaneously there is reset spring II 55 through the top fixed mounting of slider 53, the one end fixed mounting of reset spring II 55 has reset support plate 56, reset support plate 56 fixed mounting is on the plane of support column 3 both sides, make reset spring II 55 can assist reset spring I54 to reset slider 53, prevent simultaneously that pulley 62 from making the weight unbalance of fixed axle 4 both sides and making slider 53 unable normal reset thereby make whole knot when removing to the ultimate range The structure is out of action, and the stability of the device during operation is improved.

Wherein, the depth of the initial position of the spiral groove 102 is the largest, and the depth is reduced with the increasing length, the contact area between the pulleys 62 moving along the spiral groove 102 is continuously reduced so that the friction force between the pulleys is continuously reduced, since the slide block 53 pulls and lifts the return spring i 54 to move while the pulley 62 moves along the spiral groove 102 so that the pulling force on the moving device 6 is continuously increased, thereby increasing the frictional force between the pulley 62 and the spiral groove 102, and the two effects are mutually inefficient so that the frictional force between the pulley 62 and the spiral groove 102 can be changed within an acceptable range, preventing the amount of change in the frictional force between the pulley 62 and the spiral groove 102 from being excessively large to affect the rotational speed of the pulley 62 and the rotational speed of the rotating body 101, thereby affecting the polishing quality of the material on the top of the rotor 101 and further improving the stability of the operation of the device.

Wherein, the thickness of the outer side of the rotator 101 is larger than that of the central position, so that the damage of the structure of the mobile device 6 caused by the collision between the pulley 62 and the spiral groove 102 is avoided in the process of dragging the mobile device 6 to reset when the sliding block 53 resets, the working stability of the device is improved, meanwhile, the spiral groove 102 extends in an outward-diffused spiral shape and extends to the side surface of the spiral groove 102, so that the pulley 62 can reset until moving to the outermost side of the rotator 101, the outline of the polishing material is always positioned in the inner part of the outline of the rotator 101, the chemical agent droplets on the material can be guaranteed to have enough time to move and be separated from the material through the centrifugal force, the phenomenon that the chemical agent droplets start to reset and go through the next stroke without being separated from the material pulley 62 is avoided, the centrifugal force applied to the chemical agent droplets suddenly increases to cause the accelerated separation, thereby the defect products, the reliability of the device is improved.

Wherein, contact with the trigger plate 57 through the contact tube 113, simultaneously through the flexible material that the material of deformation storehouse 112 is a can carry out elastic deformation, make trigger plate 57 along with slider 53 reset can take place once device with contact tube 113 each time slider 53 resets, the effect of the device can make deformation storehouse 112 receive the impact and thus compressed and produce high-pressure gas in atmospheric pressure storehouse 111, and this gas enters into stock solution device 115 through air duct 114 and passes through jack-up antiskid sheet 1152 and extrudes the chemical above the antiskid sheet 1152, make chemical through the conduction of catheter 116 through dropping liquid storehouse 1171 and from dropping liquid mouth 1172 drippage, this process can be accomplished in very short time, make chemical can drip to the surface of material and polish next time when pulley 62 carries out next stroke, this structure accomplishes whole titration effect through the mechanical mode, compared with the prior art, the titration device has the advantages that the electronic control mode is omitted for titration, the structure has high reliability, the liquid drops can be guaranteed to be dripped to the surface of the material when the pulley 62 starts to run each time, the titration can be automatically completed without being arranged in advance, and the reliability of the titration device is further improved.

Wherein, a circular through hole is opened inside the contact tube 113 and is communicated with the deformation bin 112 and the pneumatic bin 111, on one hand, the trigger plate 57 can block the through hole inside the contact tube 113 while colliding with the contact tube 113 under the action of falling back of the slider 53, so that high-pressure air inside the pneumatic bin 111 can completely enter the air duct 114 and be transferred to the liquid storage device 115 to act on the anti-slip sheet 1152, on the other hand, when the slider 53 moves again and drives the trigger plate 57 to move, the trigger plate 57 and the contact tube 113 are separated, so that external air can enter the pneumatic bin 111 from the circular through hole inside the contact tube 113 to be supplemented, low air pressure formed when the deformation bin 112 is reset is avoided not acting on the anti-slip sheet 1152 reversely, but resetting is avoided, and the phenomenon that the anti-slip sheet 1152 moves next time due to falling back of chemical inside the liquid storage device 115 and chemical cannot be extruded from the liquid dropping port 1172 to lose effect is avoided, the stability of the device during operation has been improved, and the peripheral height through antiskid sheets 1152 is less than the central height and makes its frictional force that moves downwards be greater than the frictional force of upward movement for the circumstances that antiskid sheets 1152 is more difficult to appear falling back has further improved the stability of the device during operation.

Wherein, the support plates 64 are movably sleeved on two sides of the rotating shaft 63, so that the rotating shaft 63 can rotate around the support plates 64 to adjust the posture of the pulley 62, meanwhile, the top of the rotating shaft 63 is fixedly provided with the limit spring 65, one end of the limit spring 65 is connected with the top of the support plates 64, so that the limit spring can limit the posture of the pulley 62 to a certain extent and enable the pulley 62 to be always in the reset trend, thereby enabling the pulley 62 to move along the spiral groove 102 and keep the pulley to be stably contacted with the spiral groove 102, improving the stability of the pulley 62 when moving, when the pulley 62 rotates to the end of the spiral groove 102, the pulling force of the limit spring 65 on the pulley 62 is smaller than the pulling force of the reset spring I54 and the reset spring II 55 on the sliding block 53, so that the pulley 62 rotates and can be separated from the outer surface of the rotating body 101, and the situation that the pulley 62 cannot be separated from the, the stability of the device during operation has been improved.

The number of the liquid dropping ports 1172 is six, and the liquid dropping ports are arranged in a circular array mode, so that six chemical agent liquid drops can be dropped out when the titration apparatus 11 works once, and polishing is synchronously performed, and the polishing rate of the apparatus is improved.

The using method of the invention is as follows:

before debugging, whether the chemical agent in the liquid storage device 115 is sufficient or not is checked, and whether the pulley 62 is in the initial position or not is checked, if the turntable 10 is not rotated in the initial position until the moving device 6 resets and the pulley 62 moves to the starting end of the spiral groove 102.

When the polishing device is used, a material to be polished is fixedly arranged at the top of the turntable 10, the central position of the material corresponds to the central line of the turntable 10, then the driving shaft 61 is started to enable the driving shaft 61 to drive the pulley 62 to rotate, so as to drive the rotating body 101 to rotate, the pulley 62 can move along the spiral groove 102 which is in the shape of an outward diffusion spiral while rotating, so that the position of the contact point of the pulley 62 and the rotating body 101 continuously moves outwards, the rotating shaft 63 can rotate while the pulley 62 moves along the spiral groove 102 so as to enable the pulley 62 to be attached to the spiral groove 102, when the pulley 62 reaches the end of the spiral groove 102, the pulley 62 can reset under the action of the reset spring I54 and the reset spring II 55, the trigger plate 57 can impact the contact tube 113 and plug the circular through hole in the contact tube 113 while impact force acts on the deformation bin 112 and enables the deformation bin to deform, high pressure gas is formed inside the contact tube 113 and enters the liquid storage device 115 from the gas guide tube 114 to act on the bottom of the anti-slip sheet 1152 to move upwards, so that chemical agents above the anti-slip sheet 1152 are pressed to flow into the dropping device 117 through the liquid guide tube 116 and drop from the dropping opening 1172 to the surface of the material, and then the next polishing operation is carried out.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor silicon wafer surface titration type chemical polishing device comprises a chassis (1), and is characterized in that: the outer surface of the top of the chassis (1) is fixedly provided with a shell (2), the central position of the top of the chassis (1) is fixedly provided with a support column (3), two sides of the support column (3) are provided with planes, the position of the plane close to the top is fixedly provided with a fixed shaft (4), the outer surface of the fixed shaft (4) is movably sleeved with a reset device (5), one end of the reset device (5) is fixedly provided with a moving device (6), the top of the support column (3) is provided with a circular groove, the bottom of the circular groove is fixedly provided with a rotating support (7), an output shaft of the rotating support (7) is fixedly provided with a rotating seat (8), the outer surface of the rotating seat (8) is fixedly sleeved with a bearing (9), and the outer surface of the bearing (9) is contacted with the inner wall of the circular groove at, the top fixed mounting who rotates seat (8) has carousel (10), fixed mounting has titration outfit (11) on chassis (1) top and the position that is located the support column (3) outside, titration outfit (11) extend to the top that carousel (10) central point put from the inside of shell (2) always.

2. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 1, wherein: the reset device (5) comprises guide rails (51), the number of the guide rails (51) is two, sliding grooves (52) are formed in the tops of the two guide rails (51), a sliding block (53) is movably arranged in the sliding grooves (52), a reset spring I (54) is fixedly arranged at one end of the sliding block (53), one end of the reset spring I (54) is connected with the bottom of the sliding groove (52), a circular through hole is formed in one side of the guide rails (51) and movably sleeved with the fixed shaft (4) through the circular through hole, a reset spring II (55) is fixedly arranged at the top of the sliding block (53), a reset supporting plate (56) is fixedly arranged at one end of the reset spring II (55), the reset supporting plate (56) is fixedly arranged on the planes of the two sides of the supporting column (3), a moving device (6) is fixedly arranged at one end of the sliding block (53), and a trigger plate (57) is fixedly arranged at the, the trigger plate (57) is in contact with the titration apparatus (11).

3. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 2, wherein: mobile device (6) include drive shaft (61), pulley (62) have been cup jointed in the surface activity of drive shaft (61), pulley (62) contact with carousel (10), the one end fixed mounting of drive shaft (61) has pivot (63), backup pad (64) have been cup jointed in the both sides activity of pivot (63), the top fixed mounting of pivot (63) has the one end of spacing spring (65) and spacing spring (65) to link to each other with the top of backup pad (64), the equal fixed mounting in both sides of backup pad (64) has connecting rod (66), the one end and slider (53) fixed connection of connecting rod (66).

4. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 2, wherein: the titration apparatus (11) comprises an air pressure bin (111), one side of the air pressure bin (111) is fixedly provided with a deformation bin (112), the deformation bin (112) is communicated with the air pressure bin (111), a contact pipe (113) is arranged at the central position of one side of the deformation bin (112), a circular through hole is arranged in the contact pipe (113) and is communicated with the deformation bin (112) and the air pressure bin (111), the contact tube (113) is in contact with the trigger plate (57), an air duct (114) is fixedly arranged at the position, located at the bottom of the deformation bin (112), of one side of the air pressure bin (111), one end of the air duct (114) is fixedly provided with a liquid storage device (115), the top of the liquid storage device (115) is fixedly provided with a liquid guide pipe (116), the top fixed mounting of catheter (116) has dropping device (117), dropping device (117) are located the top of carousel (10) central point and put.

5. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 4, wherein: the deformation bin (112) is made of a flexible material capable of being elastically deformed.

6. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 4, wherein: stock solution device (115) are including stock solution storehouse (1151), the peripheral height that antiskid piece (1152) and antiskid piece (1152) have been cup jointed in the inside activity of stock solution storehouse (1151) is less than the central height, stock solution mouth (1153) have been seted up at the top of stock solution storehouse (1151), stock solution mouth (1153) are the same with catheter (116) and the fixed cover in inside of stock solution mouth (1153) has been connect single logical piece (1154), the bottom and air duct (114) of stock solution storehouse (1151) are to the intercommunication.

7. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 4, wherein: dropping device (117) is including dropping liquid storehouse (1171), the inner chamber and catheter (116) of dropping liquid storehouse (1171) are linked together, the bottom fixed mounting of dropping liquid storehouse (1171) has dropping liquid mouth (1172) and the quantity of dropping liquid mouth (1172) to be six and arrange with the mode of circular array, dropping liquid mouth (1172) is linked together with the inner chamber of dropping liquid storehouse (1171).

8. The titration type chemical polishing device for the surface of a semiconductor silicon wafer according to claim 3, wherein: carousel (10) are including rotor (101), the thickness in rotor (101) outside is greater than the thickness that central point put, spiral groove (102) have been seted up to rotor (101) bottom, spiral groove (102) contact with pulley (62), spiral groove (102) are the heliciform of outdiffusion and extend to the side of spiral groove (102) always, the degree of depth of spiral groove (102) initial position is the biggest, and its degree of depth constantly reduces along with the length constantly increasing of extension.