CN111988976B - Light metal wave-proof sleeve and preparation method thereof - Google Patents
Light metal wave-proof sleeve and preparation method thereof Download PDFInfo
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- CN111988976B CN111988976B CN202010902115.5A CN202010902115A CN111988976B CN 111988976 B CN111988976 B CN 111988976B CN 202010902115 A CN202010902115 A CN 202010902115A CN 111988976 B CN111988976 B CN 111988976B
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 72
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 68
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 8
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052796 boron Inorganic materials 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- 239000011651 chromium Substances 0.000 claims abstract description 5
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 5
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 5
- 239000011777 magnesium Substances 0.000 claims abstract description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 239000010703 silicon Substances 0.000 claims abstract description 5
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 5
- 239000010936 titanium Substances 0.000 claims abstract description 5
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011701 zinc Substances 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 39
- 238000009954 braiding Methods 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 9
- 238000005056 compaction Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000001192 hot extrusion Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000009849 vacuum degassing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 238000005470 impregnation Methods 0.000 claims description 2
- 238000009941 weaving Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 239000013585 weight reducing agent Substances 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004847 absorption spectroscopy Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
- C22C21/14—Alloys based on aluminium with copper as the next major constituent with silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
- C22C21/16—Alloys based on aluminium with copper as the next major constituent with magnesium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
- C22C21/18—Alloys based on aluminium with copper as the next major constituent with zinc
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a light metal wave-proof sleeve and a preparation method thereof, wherein the light metal wave-proof sleeve is formed by weaving nickel-plated copper-aluminum alloy wires, the nickel-plated copper-aluminum alloy wires sequentially comprise aluminum alloy wires, copper-plated layers and nickel-plated layers from inside to outside, the thickness of the copper-plated layers is 0.2-0.3 mu m, and the thickness of the nickel-plated layers is 0.6-1.0 mu m; the nickel-plated copper-aluminum alloy wire comprises the following components in percentage by weight: 8-12:3-5:2-4:1-3:1-3:1-3:1.5-2.5:0.3-0.7:0.4-0.8:1.5-2.5:1.2-1.6:1.3 to 1.8 of aluminum, copper, magnesium, silicon, zinc, manganese, lithium, titanium, vanadium, boron, nickel, chromium and rare earth metals. The light metal wave-proof sleeve has the advantages of light weight, excellent electromagnetic shielding resistance, and convenience in operation and easiness in popularization.
Description
Technical Field
The invention relates to a wave-proof sleeve, in particular to a light metal wave-proof sleeve and a preparation method thereof.
Background
With the rapid development of the aviation industry, aircraft are updated more and more rapidly. The aircraft not only has more complex functions, but also adapts to complex electromagnetic environments. Thus, electromagnetic environmental effect design and verification of aircraft is an important aspect affecting the normal performance of aircraft.
The electromagnetic protection wave-proof sleeve starts from an electromagnetic interference coupling path, and the electromagnetic protection wave-proof sleeve is used as an important technical means and measures for ensuring electromagnetic compatibility among systems and resisting external complex electromagnetic environments. On the other hand, in order to improve the load and endurance of the aircraft, the weight index requirements are very strict, and the weight reduction requirements are very urgent. Therefore, how to meet the electromagnetic protection requirement and the weight reduction requirement simultaneously becomes the current difficult problem to be solved, the wave-proof sleeve is used as an important element for protecting an electrical system in the machine, a certain proportion is occupied on the weight addition of the whole machine, the weight reduction is realized on the premise of ensuring the performance requirement, and the wave-proof sleeve is very important for the weight reduction of the whole machine. However, the existing wave-proof sleeve is difficult to achieve the effects of weight reduction and electromagnetic shielding prevention.
Disclosure of Invention
The invention aims to provide a light metal wave-proof sleeve and a preparation method thereof, wherein the light metal wave-proof sleeve has light weight and excellent electromagnetic shielding resistance, and in addition, the preparation method has the advantages of simplicity and convenience in operation and easiness in popularization.
In order to achieve the above purpose, the invention provides a light metal wave-proof sleeve which is woven by nickel-plated copper-aluminum alloy wires, wherein the nickel-plated copper-aluminum alloy wires sequentially comprise aluminum alloy wires, copper-plated layers and nickel-plated layers from inside to outside, the thickness of the copper-plated layers is 0.2-0.3 mu m, and the thickness of the nickel-plated layers is 0.6-1.0 mu m; the nickel-plated copper-aluminum alloy wire comprises the following components in percentage by weight: 8-12:3-5:2-4:1-3:1-3:1-3:1.5-2.5:0.3-0.7:0.4-0.8:1.5-2.5:1.2-1.6:1.3 to 1.8 of aluminum, copper, magnesium, silicon, zinc, manganese, lithium, titanium, vanadium, boron, nickel, chromium and rare earth metals.
The invention also provides a preparation method of the light metal wave-proof sleeve, which comprises the following steps:
1) Carrying out heat treatment at 500-550 ℃ on an aluminum alloy raw material, carrying out vacuum degassing and vacuum hot pressing in sequence, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) Activating an aluminum alloy wire, and then sequentially carrying out copper plating treatment and nickel plating treatment to obtain a nickel-plated copper-aluminum alloy wire;
3) And doubling the nickel-plated copper-aluminum alloy wire, and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve.
In the technical scheme, the components and the content of the aluminum alloy wire are regulated, so that the aluminum alloy wire has the effects of high tensile strength, fine tissue structure and low fatigue crack, and then a copper plating layer and a nickel plating layer are formed outside the aluminum alloy wire in a copper plating and nickel plating mode, so that the mechanical strength, corrosion resistance and electromagnetic shielding resistance of the aluminum alloy wire are improved; finally, the nickel-plated copper-aluminum alloy wire meets the following conditions: density of not more than 3.0g/cm 3 The tensile strength is not less than 250Mpa, the elongation at break is not less than 10%, and the resistivity is not more than 0.033 Ω. mm 2 And/m. In addition, the double-turntable braiding machine carries out braiding through the upper and lower turntable braiding equipment, so that braiding tension can be effectively controlled, and braiding capacity is improved; compared with the old-fashioned type braiding machine, the productivity is improved by 30 percent.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
FIG. 1 is a schematic view of a preferred embodiment of a lightweight metal wave shield provided by the present invention;
fig. 2 is a physical diagram of the light metal wave-proof sleeve provided by the invention.
Detailed Description
The following describes specific embodiments of the present invention in detail. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
The endpoints and any values of the ranges disclosed herein are not limited to the precise range or value, and are understood to encompass values approaching those ranges or values. For numerical ranges, one or more new numerical ranges may be found between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point value, in combination with each other, and are to be considered as specifically disclosed herein.
The invention provides a light metal wave-proof sleeve, which is formed by weaving nickel-plated copper-aluminum alloy wires, wherein the nickel-plated copper-aluminum alloy wires sequentially comprise aluminum alloy wires, copper-plated layers and nickel-plated layers from inside to outside, the thickness of the copper-plated layers is 0.2-0.3 mu m, and the thickness of the nickel-plated layers is 0.6-1.0 mu m; the nickel-plated copper-aluminum alloy wire comprises the following components in percentage by weight: 8-12:3-5:2-4:1-3:1-3:1-3:1.5-2.5:0.3-0.7:0.4-0.8:1.5-2.5:1.2-1.6:1.3 to 1.8 of aluminum, copper, magnesium, silicon, zinc, manganese, lithium, titanium, vanadium, boron, nickel, chromium and rare earth metals.
In the invention, the content of copper in the copper plating layer in the nickel-plated copper-aluminum alloy wire can be selected in a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-proof sleeve, preferably, the copper in the copper plating layer accounts for 55-65% of the total copper content in the nickel-plated copper-aluminum alloy wire; .
In the invention, the content of nickel in the copper plating layer in the nickel-plated copper-aluminum alloy wire can be selected in a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-proof sleeve, preferably, the nickel in the nickel plating layer accounts for 1.5-2.5% of the total nickel content in the nickel-plated copper-aluminum alloy wire.
In the invention, the diameter of the nickel-plated copper-aluminum alloy wire can be selected in a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-proof sleeve, the diameter of the nickel-plated copper-aluminum alloy wire is preferably 0.08-0.16mm.
In the present invention, the specific kind of rare earth metal may be selected within a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-shielding cover, it is preferable that the rare earth metal is selected from at least one of lanthanum, cerium and zirconium.
In the present invention, the braid density of the light metal wave-shielding cover may be selected in a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-shielding cover, it is preferable that the braid density of the light metal wave-shielding cover is not less than 90%.
In the invention, the physical properties of the nickel-plated copper-aluminum alloy wire can be selected in a wide range, but in order to further improve the electromagnetic shielding resistance effect of the light metal wave-proof sleeve, the nickel-plated copper-aluminum alloy wire preferably meets at least the following conditions: the density of the material is not more than 3.0g/cm 3 The tensile strength is not less than 250Mpa, the elongation at break is not less than 10%, and the resistivity is not more than 0.033 Ω. mm 2 And/m. More preferably, the nickel-plated copper-aluminum alloy wire at least meets the following conditions: the density of the material is 2.8-3.2g/cm 3 The tensile strength is 255-260Mpa, the elongation at break is 11-13%, the resistivity is 0.032-0.033 Ω mm 2 /m。
The invention also provides a preparation method of the light metal wave-proof sleeve, which comprises the following steps:
1) Carrying out heat treatment at 500-550 ℃ on an aluminum alloy raw material, carrying out vacuum degassing and vacuum hot pressing in sequence, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) Activating an aluminum alloy wire, and then sequentially carrying out copper plating treatment and nickel plating treatment to obtain a nickel-plated copper-aluminum alloy wire;
3) And doubling the nickel-plated copper-aluminum alloy wire, and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve.
In the above preparation method, the manner of the activation treatment may be selected within a wide range, but in order to further enhance the activation effect, it is preferable that the activation treatment is impregnation with 4 to 6% by weight of dilute sulfuric acid, and the time of the activation treatment is 20 to 30 minutes.
In the above-mentioned production method, the manner of the copper plating treatment and the nickel plating treatment may be selected within a wide range, but in order to further improve the effect of the metal plating layer, it is preferable that the copper plating treatment is performed by a grooved rolling combined with a drawing process, and the nickel plating treatment is performed by an electroless nickel plating method.
The doubling is the process of combining two or more nickel-plated copper-clad aluminum alloy monofilaments into a strand on a doubling machine.
The present invention will be described in detail by examples. In the following examples, the aluminum alloy stock was commercially available under the trade designation HF0438B from hengzhou Hengfeng corporation. The copper plating treatment is carried out by a mode of combining grooved rolling with drawing processing technology, and the nickel plating treatment adopts a chemical nickel plating method.
Example 1
1) Carrying out heat treatment at 530 ℃ on an aluminum alloy raw material, carrying out vacuum degassing and vacuum hot pressing in sequence, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) The aluminum alloy wire is subjected to activation treatment for 25min (5 wt% dilute sulfuric acid dipping), and then copper plating treatment and nickel plating treatment are sequentially carried out to obtain a nickel-plated copper-aluminum alloy wire with the diameter of 0.12mm, wherein the thickness of a copper plating layer is 0.25 mu m, and the thickness of a nickel plating layer is 0.8 mu m;
3) And doubling the nickel-plated copper-aluminum alloy wires (stranding by a doubling machine), and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve with the braiding density of 95%.
Example 2
1) Carrying out heat treatment at 500 ℃, sequentially carrying out vacuum degassing and vacuum hot pressing on an aluminum alloy raw material, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) The aluminum alloy wire is subjected to activation treatment for 20min (5 wt% dilute sulfuric acid dipping), and then copper plating treatment and nickel plating treatment are sequentially carried out to obtain a nickel-plated copper-aluminum alloy wire with the diameter of 0.10mm, wherein the thickness of a copper plating layer is 0.2 mu m, and the thickness of a nickel plating layer is 0.6 mu m;
3) And doubling the nickel-plated copper-aluminum alloy wires (stranding by a doubling machine), and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve with the braiding density of 98%.
Example 3
1) Carrying out heat treatment at 550 ℃ on an aluminum alloy raw material, carrying out vacuum degassing and vacuum hot pressing in sequence, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) The aluminum alloy wire is subjected to activation treatment for 30min (5 wt% dilute sulfuric acid dipping), and then copper plating treatment and nickel plating treatment are sequentially carried out to obtain a nickel-plated copper-aluminum alloy wire with the diameter of 0.15mm, wherein the thickness of a copper plating layer is 0.3 mu m, and the thickness of a nickel plating layer is 1.0 mu m;
3) And doubling the nickel-plated copper-aluminum alloy wires (stranding by a doubling machine), and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve with the braiding density of 92%.
Detection example 1
The components of the nickel-plated copper-aluminum alloy wires in examples 1-3 were detected by inductively coupled plasma spectrometry, and the detection results were: the nickel-plated copper-aluminum alloy wire comprises the following components in percentage by weight: 8-12:3-5:2-4:1-3:1-3:1-3:1.5-2.5:0.3-0.7:0.4-0.8:1.5-2.5:1.2-1.6:1.3-1.8 of aluminum, copper, magnesium, silicon, zinc, manganese, lithium, titanium, vanadium, boron, nickel, chromium and rare earth metals (lanthanum, cerium and zirconium in a weight ratio of 1:0.5-1:0.5-1). The copper in the copper plating layer accounts for 52-60 wt% of the total copper in the nickel-plated copper-aluminum alloy wire; the nickel in the nickel plating layer accounts for 1.6-2.0 wt% of the total nickel in the nickel-plated copper-aluminum alloy wire.
Detection example 2
The performance of the nickel-plated copper-aluminum alloy wires in examples 1-3 was tested by a volumetric method (measuring material density), a tensile tester and a dc bridge, and the test results were: the density is 2.8-3.2g/cm 3 The tensile strength is 255-260Mpa, the elongation at break is 11-13%, the resistivity is 0.032-0.033 Ω mm 2 /m。
Detection example 3
The 6mm by 10mm light metal wave-proof sleeves of examples 1-3 were tested at-65℃to 260℃as follows:
1) The density was measured by volumetric method, resulting in: the density is not more than 28.5g/m.
2) The DC resistance (20 ℃ C.) was measured by a DC bridge, resulting in: not more than 4.3mΩ/m.
3) The shielding attenuation was detected by absorption spectroscopy, resulting in: not less than 35dB at 30MHz, not more than 40dB at 100MHz, not less than 40dB at 200MHz, not less than 45dB at 500MHz, not less than 45dB at 800MHz, not less than 50dB at 1000 MHz.
5) Salt spray test is carried out by a salt spray test box, and the result is as follows: after 192h test, the direct current resistance change rate is not more than 10%, and the shielding attenuation change rate is not more than 10%.
6) The mold test was performed by a mold test box, and the result was: not lower than level 0.
Through the detection, the metal wave-proof sleeve provided by the invention has the excellent effects of light weight, small resistance, strong shielding resistance, corrosion resistance and mold resistance.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the scope of the technical concept of the present invention, and all the simple modifications belong to the protection scope of the present invention.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the invention can be made without departing from the spirit of the invention, which should also be considered as disclosed herein.
Claims (8)
1. The light metal wave-proof sleeve is characterized by being woven by nickel-plated copper-aluminum alloy wires, wherein the nickel-plated copper-aluminum alloy wires sequentially comprise aluminum alloy wires, copper-plated layers and nickel-plated layers from inside to outside, the thickness of the copper-plated layers is 0.2-0.3 mu m, and the thickness of the nickel-plated layers is 0.6-1.0 mu m; the nickel-plated copper-aluminum alloy wire comprises the following components in percentage by weight: 8-12:3-5:2-4:1-3:1-3:1-3:1.5-2.5:0.3-0.7:0.4-0.8:1.5-2.5:1.2-1.6:1.3 to 1.8 of aluminum, copper, magnesium, silicon, zinc, manganese, lithium, titanium, vanadium, boron, nickel, chromium and rare earth metals;
wherein, copper in the copper plating layer accounts for 55-65% of the total copper in the nickel-plated copper-aluminum alloy wire; the nickel in the nickel plating layer accounts for 1.5-2.5% of the total nickel in the nickel-plated copper-aluminum alloy wire.
2. The lightweight metal wave sleeve of claim 1 wherein said nickel plated copper aluminum alloy wire has a diameter of 0.08-0.16mm.
3. The lightweight metal wave sleeve of claim 1 wherein said rare earth metal is selected from at least one of lanthanum, cerium, and zirconium.
4. The lightweight metal wave shield of claim 1 wherein said lightweight metal wave shield has a braid density of no less than 90%.
5. The lightweight metal wave sleeve of claim 1, wherein said nickel plated copper aluminum alloy wire meets at least the following conditions: the density of the material is not more than 3.0g/cm 3 The tensile strength is not less than 250Mpa, the elongation at break is not less than 10%, and the resistivity is not more than 0.033 Ω. mm 2 /m。
6. The lightweight metal wave sleeve of claim 1, wherein said nickel plated copper aluminum alloy wire meets at least the following conditions: the density of the material is 2.8-3.2g/cm 3 The tensile strength is 255-260Mpa, the elongation at break is 11-13%, the resistivity is 0.032-0.033 Ω mm 2 /m。
7. A method of manufacturing a lightweight metal wave-protecting jacket according to any of claims 1 to 6, comprising:
1) Carrying out heat treatment at 500-550 ℃ on an aluminum alloy raw material, carrying out vacuum degassing and vacuum hot pressing in sequence, carrying out hot extrusion by a die, cooling, and carrying out cold pressing compaction to form an aluminum alloy wire;
2) Activating the aluminum alloy wire, and then sequentially carrying out copper plating treatment and nickel plating treatment to obtain a nickel-plated copper-aluminum alloy wire;
3) And doubling the nickel-plated copper-aluminum alloy wire, and then braiding on a double-turntable braiding machine to obtain the light metal wave-preventing sleeve.
8. The production method according to claim 7, wherein the activation treatment is impregnation with 4 to 6% by weight of dilute sulfuric acid, and the activation treatment is performed for 20 to 30 minutes.
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| CN113944050B (en) * | 2021-12-21 | 2022-04-12 | 宁波诺丁汉新材料研究院有限公司 | Light conductive composite material and lightning protection fan blade made of same |
| CN115258815B (en) * | 2022-07-27 | 2024-04-19 | 安徽龙航电缆有限公司 | Ultra-light special round metal wave-proof sleeve |
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