CN111988945A

CN111988945A - Signal transmission device

Info

Publication number: CN111988945A
Application number: CN201910429384.1A
Authority: CN
Inventors: 陈思源; 吕曼宁; 邢琼雯; 林亦杰
Original assignee: Wistron Neweb Corp
Current assignee: Wistron Neweb Corp
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2020-11-24
Anticipated expiration: 2039-05-22
Also published as: CN111988945B

Abstract

A signal transmission device. The signal transmission device comprises a heat dissipation part, a first antenna module and a positioning cover; the first antenna module is arranged on the heat dissipation component and is thermally connected with the heat dissipation component; the positioning cover is fixed on the heat dissipation component, wherein the first antenna module is clamped between the positioning cover and the heat dissipation component, the positioning cover is suitable for limiting the first antenna module, the positioning cover comprises a plurality of positioning cover openings and a plurality of separation ribs, at least part of the positioning cover openings correspond to the first antenna module, and the separation ribs are used for defining the positioning cover openings in a separation mode. The signal transmission device of the invention can reduce the signal interference of the main circuit board to the first antenna module because the first antenna module is arranged on the heat dissipation part and the heat dissipation part is partially arranged between the first antenna module and the main circuit board, and the heat generated by the first antenna module can be directly conducted out by the heat dissipation part for heat dissipation, thereby providing better heat dissipation effect.

Description

Signal transmission device

Technical Field

The present invention relates to signal transmission devices, and more particularly, to a signal transmission device with a uniform radiation pattern.

Background

In the known signal transmission device, the antenna module is disposed on the printed circuit board and is located at an edge portion of the printed circuit board. However, due to the interference of the surrounding elements of the antenna module, the radiation pattern of the signal transmission device is not uniform, and thus, the signal transmission device cannot provide a good signal transmission effect. Particularly, with the development of 5G technology, when the frequency of the wireless signal is at high frequency (for example, 28GHz and 39GHz), any element located in the radiation pattern may seriously affect the signal transmission effect of the antenna module.

Therefore, it is desirable to provide a signal transmission device to solve the above problems.

Disclosure of Invention

An embodiment of the present invention provides a signal transmission device to solve the problems of the prior art, the signal transmission device includes a heat dissipation component, a first antenna module, and a positioning cover; the first antenna module is arranged on the heat dissipation component and is thermally connected with the heat dissipation component; the positioning cover is fixed on the heat dissipation component, wherein the first antenna module is clamped between the positioning cover and the heat dissipation component, the positioning cover is suitable for limiting the first antenna module, the positioning cover comprises a plurality of positioning cover openings and a plurality of separation ribs, at least part of the positioning cover openings correspond to the first antenna module, and the separation ribs are used for defining the positioning cover openings in a separation mode.

In one embodiment, the first antenna module includes a plurality of first antenna elements, and each partition rib is disposed between adjacent first antenna elements.

In one embodiment, each of the first antenna units includes a first coupling antenna region, and each of the separation ribs includes a separation rib notch corresponding to the first coupling antenna region.

In one embodiment, each of the first antenna units further includes a first patch antenna section, the first coupling antenna section includes a coupling antenna and a clearance zone, and the clearance zone is located between the coupling antenna and the first patch antenna section.

In one embodiment, the first antenna module includes a plurality of ground areas, each ground area is located between adjacent first patch antenna areas, and the partition rib correspondingly contacts the ground area.

In an embodiment, the position cover opening is rectangular, and the position cover opening includes a first edge, a second edge, a third edge and a fourth edge, the first edge is parallel to the second edge, the third edge is parallel to the fourth edge, the first edge is perpendicular to the third edge, the third edge is located on the partition rib, wherein the first edge is closer to the first coupling pole antenna region relative to the second edge, a first distance exists between the first edge and the first antenna module, and the first distance is greater than 2 mm.

In one embodiment, a second distance exists between the second edge and the first antenna module, and the second distance is greater than 2 mm.

In an embodiment, the first antenna module further includes a module circuit board and a module chip, the module circuit board includes a first surface and a second surface, the first surface is opposite to the second surface, the first antenna units are disposed on the first surface, the module chip is disposed on the second surface, and the module chip is thermally connected to the heat dissipation member.

In an embodiment, the heat dissipation component includes a receiving groove, the first antenna module is disposed in the receiving groove, and the module chip is thermally connected to the receiving groove.

In one embodiment, the signal transmission device further comprises a bolt, and the bolt locks the positioning cover on the heat dissipation component.

In an embodiment, the signal transmission device further includes a second antenna module and a third antenna module, the positioning cover includes a first section, a second section and a third section, the first section is suitable for limiting the first antenna module, the second section is suitable for limiting the second antenna module, the third section is suitable for limiting the third antenna module, and the first antenna module is located between the second antenna module and the third antenna module.

In one embodiment, the heat dissipation component includes a plane, a first inclined plane and a second inclined plane, the plane is located between the first inclined plane and the second inclined plane, the first antenna module is disposed on the plane, the second antenna module is disposed on the first inclined plane, and the third antenna module is disposed on the second inclined plane.

In an embodiment, the heat dissipating member includes a heat dissipating member protrusion, the first antenna module corresponds to the heat dissipating member protrusion, the first dipole antenna region and the first patch antenna region are arranged along a first direction, the first patch antenna region is located between the first dipole antenna region and the heat dissipating member protrusion, the second antenna module includes a second dipole antenna region and a second patch antenna region, the second dipole antenna region and the second patch antenna region are arranged along a second direction, and the first direction is opposite to the second direction.

In one embodiment, the signal transmission device further includes a main circuit board and a device housing, the heat dissipation member is partially located between the first antenna module and the main circuit board, and the device housing covers the first antenna module and the heat dissipation member.

In one embodiment, a third distance exists between the first antenna module and the device housing, a fourth distance exists between the first antenna module and the main circuit board, and a ratio of the third distance to the fourth distance is less than 33%.

In one embodiment, the signal transmission device further includes a heat conductive pad attached to the heat dissipation member, the heat conductive pad contacting the device housing.

In an embodiment, the signal transmission device further includes a central processing unit, a 5G baseband module, a 4G baseband module and an LTE baseband module, wherein the central processing unit, the 5G baseband module, the 4G baseband module and the LTE baseband module are disposed on the main circuit board, the 4G baseband module is located between the central processing unit and the 5G baseband module, and the 5G baseband module is located between the 4G baseband module and the LTE baseband module.

By applying the signal transmission device of the embodiment of the invention, the first antenna module is arranged on the heat dissipation part, and the heat dissipation part is partially arranged between the first antenna module and the main circuit board, so that the signal interference of the main circuit board to the first antenna module can be reduced, and the heat generated by the first antenna module can be directly led out by the heat dissipation part to dissipate heat, thereby providing better heat dissipation effect.

Drawings

Fig. 1 is an exploded view of a signal transmission device according to an embodiment of the present invention.

Fig. 2 is an exploded view of the main components of the signal transmission device according to the embodiment of the present invention.

Fig. 3A and 3B illustrate the assembly of the main components of the signal transmission device according to the embodiment of the present invention.

Fig. 4A shows a detailed structure of the first antenna element according to the embodiment of the present invention.

Fig. 4B shows a combination of the first antenna unit and the positioning cover according to the embodiment of the present invention.

Fig. 5 shows a detailed structure of the opening of the positioning cover according to the embodiment of the present invention.

Fig. 6 is a cross-sectional view of the main components of a signal transmission device according to an embodiment of the present invention.

Description of the main component symbols:

second section of D signal transmission device 52

1 first antenna module 53 third section

11 first antenna module 54 position cap opening

119 first edge of first antenna element 541

111 second edge of first dipole antenna region 542

Third edge of 111 dipole antenna A543

The fourth edge of the 111B clearance region 544

112 first patch antenna area 55 partition ribs

113 ground region 551 Rib notch

114 module circuit board 61 bolt

114A first surface 62 thermal pad

114B second surface 7 main circuit board

115 module chip 71 central processing unit

19 flexible transmission line 725G base frequency module

2 second antenna module 734G baseband module

3 third antenna module 74 LTE base frequency module

4 Heat-dissipating Member 8 device case

41 plane d1 first distance

421 first inclined plane d2 second distance

422 second slope d3 third distance

441 and the fourth distance of the container d4

45 heat sink protrusion Y1 first direction

5 second direction of positioning cover Y2

51 first section

Detailed Description

Fig. 1 is an exploded view of a signal transmission device D according to an embodiment of the invention. Fig. 2 shows an exploded view of the main components of the signal transmission device D according to the embodiment of the present invention. Fig. 3A and 3B show the assembly of the main components of the signal transmission device D according to the embodiment of the invention. With reference to fig. 1, fig. 2, fig. 3A and fig. 3B, in an embodiment, the signal transmission device D includes a heat dissipation member 4, a first antenna module 1 and a positioning cover 5. The first antenna module 1 is provided over the heat sink 4. The positioning cover 5 is fixed on the heat dissipating member 4, wherein the first antenna module 1 is located between the positioning cover 5 and the heat dissipating member 4, the positioning cover 5 is suitable for limiting the position of the first antenna module 11, wherein the positioning cover 5 includes a plurality of positioning cover openings 54 and a plurality of separating ribs 55, at least a portion of the positioning cover openings 54 correspond to the first antenna module 1, and the separating ribs 55 separate and define the positioning cover openings 54.

With reference to fig. 4A and 4B, in an embodiment, the first antenna module 1 includes a plurality of first antenna units 119, and each partition rib 55 is disposed between adjacent first antenna units 119. In one embodiment, each of the first antenna units 119 includes a first dipole antenna region 111, each of the partition ribs 55 includes a partition rib notch 551, and a notch width of the partition rib notch 551 along an extending direction of the partition rib 55 is greater than or equal to a width of the first dipole antenna region 111 along the extending direction of the partition rib 55. In this embodiment, the separation rib notch 551 corresponds to the first dipole antenna region 111, so that the signal interference of the separation rib notch 551 on the first dipole antenna region 111 can be reduced, and a better signal transmission effect can be provided.

With reference to fig. 4A and 4B, in an embodiment, each of the first antenna units 119 further includes a first patch antenna region 112, in this embodiment, the first coupling antenna region 111 includes two coupling antennas 111A and a clearance region 111B, and the clearance region 111B is located between the coupling antenna 111A and the first patch antenna region 112. The clearance area 111B is located between the dipole antenna 111A and the first patch antenna area 112, so as to avoid mutual interference between the dipole antenna 111A and the first patch antenna area 112, and provide a better signal transmission effect.

With reference to fig. 4A and 4B, in an embodiment, the first antenna module 1 includes a plurality of ground areas 113, each ground area 113 is located between adjacent first patch antenna areas 112, and in an embodiment, the separation rib 55 correspondingly contacts the ground area 113. The partition rib 55 is correspondingly contacted with the grounding region 113, so that the partition rib 55 can be prevented from shielding the first coupling antenna region 111 or the first patch antenna region 112, thereby reducing the influence of the partition rib 55 on signal transmission.

Fig. 5 shows a detailed structure of the opening of the positioning cover according to the embodiment of the present invention. Referring to fig. 5, in an embodiment, the position-determining cover opening 54 is rectangular, the position-determining cover opening 54 includes a first edge 541, a second edge 542, a third edge 543, and a fourth edge 544, the first edge 541 is parallel to the second edge 542, the third edge 543 is parallel to the fourth edge 544, the first edge 541 is perpendicular to the third edge 543, and the third edge 543 is located on the partition rib 55, wherein the first edge 541 is closer to the first dipole antenna region 111 than the second edge 542, a first distance d1 exists between the first edge 541 and the first antenna module 1, and the first distance d1 is greater than 2 mm.

Referring to fig. 5, in an embodiment, a second distance d2 exists between the second edge 542 and the first antenna module 1, and the second distance d2 is greater than 2 mm.

In the above embodiment, the first distance d1 is greater than 2mm, and the second distance d2 is greater than 2mm, so as to reduce the signal interference of the positioning cover 5 to the first antenna module 11, and provide a better signal transmission effect.

Fig. 6 is a cross-sectional view of the main components of a signal transmission device D according to an embodiment of the present invention. In an embodiment, the first antenna module 1 further includes a module circuit board 114 and a module chip 115, the module circuit board 114 includes a first surface 114A and a second surface 114B, the first surface 114A is opposite to the second surface 114B, the first antenna units 119 are disposed on the first surface 114A, the module chip 115 is disposed on the second surface 114B, and the module chip 115 is thermally connected to the heat dissipation member 4. In this embodiment, the heat generated by the module chip 115 can be directly conducted out from the heat dissipation member 4 to dissipate the heat, thereby providing a better heat dissipation effect.

Referring to fig. 2 and 6, in an embodiment, the heat dissipation member 4 includes a receiving groove 441, the first antenna module 1 is disposed in the receiving groove 441, and the module chip 115 is thermally connected to the receiving groove 441. The receiving groove 441 is adapted to abut against and limit the degree of freedom of the first antenna module 1.

Referring to fig. 3B, in an embodiment, the signal transmission device D further includes a bolt 61, and the bolt 61 locks the positioning cover 5 to the heat sink 4.

With reference to fig. 2, fig. 3A and fig. 3B, in an embodiment, the signal transmission device D further includes a second antenna module 2 and a third antenna module 3, the positioning cover 5 includes a first segment 51, a second segment 52 and a third segment 53, the first segment 51 is suitable for limiting the first antenna module 1, the second segment 52 is suitable for limiting the second antenna module 2, the third segment 53 is suitable for limiting the third antenna module 3, and the first antenna module 1 is located between the second antenna module 2 and the third antenna module 3.

With reference to fig. 2, 3A, 3B and 6, in an embodiment, the heat dissipation component 4 includes a plane 41, a first inclined plane 421 and a second inclined plane 422, the plane 41 is located between the first inclined plane 421 and the second inclined plane 422, the first antenna module 1 is disposed on the plane 41, the second antenna module 2 is disposed on the first inclined plane 421, and the third antenna module 3 is disposed on the second inclined plane 422.

Referring to fig. 6, in this embodiment, the plane 41, the first inclined surface 421 and the second inclined surface 422 are disposed in a wing shape in the cross section shown in fig. 6, in an embodiment, an angle between the first inclined surface 421 and the plane 41 may be 135 degrees, and an angle between the second inclined surface 422 and the plane 41 may be 135 degrees. With the above configuration, the first antenna module 1 located between the second antenna module 2 and the third antenna module 3 can provide a more uniform and complete radiation pattern.

With reference to fig. 2, fig. 3A, fig. 3B and fig. 6, in an embodiment, the heat dissipating member 4 includes a heat dissipating member protrusion 45, the first antenna module 1 corresponds to the heat dissipating member protrusion 45, the first coupler antenna region 111 and the first patch antenna region 112 are arranged along a first direction Y1, the first patch antenna region 112 is located between the first coupler antenna region 111 and the heat dissipating member protrusion 45, the second antenna module 2 includes a second coupler antenna region 211 and a second patch antenna region 212, the second coupler antenna region 211 and the second patch antenna region 212 are arranged along a second direction Y2, and the first direction Y1 is opposite to the second direction Y2. With this design, the second coupling antenna region 211 is prevented from being shielded and interfered by the heat dissipation member protrusion 45.

With reference to fig. 1 and fig. 6, in an embodiment, the signal transmission device D further includes a main circuit board 7 and a device housing 8, the heat dissipation component 4 is partially located between the first antenna module 1 and the main circuit board 7, and the device housing 8 covers the first antenna module 1 and the heat dissipation component 4. Since the heat dissipation member 4 is partially located between the first antenna module 1 and the main circuit board 7, signal interference of the main circuit board 7 to the first antenna module 1 can be reduced.

With reference to fig. 1 and 6, in an embodiment, a third distance d3 exists between the first antenna module 1 and the device housing 8, a fourth distance d4 exists between the first antenna module 1 and the main circuit board 7, and the third distance d3 is less than 30% of the sum of the third distance d3 and the fourth distance d 4. By means of this ratio, the interference of the device housing 8 with the signal transmission can be reduced.

Referring to fig. 1, in an embodiment, the signal transmission device D further includes a thermal pad 62, the thermal pad 62 is attached to the heat dissipation member 4, and the thermal pad 62 contacts the device housing 8, so as to obtain a better thermal conductive effect.

Referring to fig. 1, in an embodiment, the signal transmission apparatus further includes a central processing unit 71, a 5G baseband module 72, a 4G baseband module 73, and an LTE baseband module 74, wherein the central processing unit 71, the 5G baseband module 72, the 4G baseband module 73, and the LTE baseband module 74 are disposed on the main circuit board 7, the 4G baseband module 73 is located between the central processing unit 71 and the 5G baseband module 72, and the 5G baseband module 72 is located between the 4G baseband module 73 and the LTE baseband module 74.

Referring to fig. 1 and 2, in an embodiment, the first antenna module 1 is coupled to the circuit board 7 through a flexible transmission line 19.

Although the present invention has been described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A signal transmission device, the signal transmission device comprising:

a heat dissipating member;

the first antenna module is arranged on the heat dissipation part and is thermally connected with the heat dissipation part; and

the positioning cover is fixed on the heat dissipation component, the first antenna module is clamped between the positioning cover and the heat dissipation component, and the positioning cover is suitable for limiting the first antenna module, wherein the positioning cover comprises a plurality of positioning cover openings and a plurality of separation ribs, at least part of the positioning cover openings correspond to the first antenna module, and the separation ribs are used for defining the positioning cover openings in a separation mode.

2. The signal transmission device according to claim 1, wherein the first antenna module includes a plurality of first antenna elements, and each partition rib is disposed between adjacent first antenna elements.

3. The signal transmission device as claimed in claim 2, wherein each of the first antenna units includes a first dipole antenna region, each of the partition ribs includes a partition rib notch, and a notch width of the partition rib notch along an extending direction of the partition rib is greater than or equal to a width of the first dipole antenna region along the extending direction of the partition rib.

4. The signal transmission apparatus of claim 3 wherein each of the first antenna elements further comprises a first patch antenna section, the first coupling antenna section comprising a coupling antenna and a clearance zone, the clearance zone being located between the coupling antenna and the first patch antenna section.

5. The signal transmission device of claim 4, wherein the first antenna module comprises a plurality of ground areas, each ground area being located between adjacent ones of the first patch antenna areas, the partition rib correspondingly contacting the ground area.

6. The signal transmitting device according to claim 3, wherein the positioning cover opening has a rectangular shape, the positioning cover opening includes a first edge, a second edge, a third edge and a fourth edge, the first edge is parallel to the second edge, the third edge is parallel to the fourth edge, the first edge is perpendicular to the third edge, the third edge is located on the partition rib, wherein the first edge is closer to the first coupling pole antenna region than the second edge, a first distance exists between the first edge and the first antenna module, and the first distance is greater than 2 mm.

7. The signal transmission device of claim 6, wherein a second distance exists between the second edge and the first antenna module, the second distance being greater than 2 mm.

8. The signal transmission device as claimed in claim 2, wherein the first antenna module further comprises a module circuit board and a module chip, the module circuit board comprises a first surface and a second surface, the first surface is opposite to the second surface, the first antenna elements are disposed on the first surface, the module chip is disposed on the second surface, and the module chip is thermally connected to the heat dissipation member.

9. The signal transmission device according to claim 8, wherein the heat dissipation member includes a receiving groove, the first antenna module is disposed in the receiving groove, and the module chip is thermally connected to the receiving groove.

10. The signal transmission device of claim 8, further comprising a bolt that locks the retaining cap over the heat sink member.

11. The signal transmission device according to claim 2, further comprising a second antenna module and a third antenna module, wherein the positioning cover comprises a first section, a second section and a third section, the first section is adapted to limit the first antenna module, the second section is adapted to limit the second antenna module, the third section is adapted to limit the third antenna module, and the first antenna module is located between the second antenna module and the third antenna module.

12. The signal transmission device according to claim 11, wherein the heat dissipation member includes a flat surface, a first inclined surface and a second inclined surface, the flat surface is located between the first inclined surface and the second inclined surface, the first antenna module is disposed on the flat surface, the second antenna module is disposed on the first inclined surface, and the third antenna module is disposed on the second inclined surface.

13. The signal transmission device of claim 12, wherein the heat dissipating member includes a heat dissipating member protrusion, the first dipole antenna region and the first patch antenna region of each of the first antenna elements being arranged along a first direction, the first patch antenna region being located between the first dipole antenna region and the heat dissipating member protrusion, the second antenna module including a second dipole antenna region and a second patch antenna region, the second dipole antenna region and the second patch antenna region being arranged along a second direction, the first direction being opposite to the second direction.

14. The signal transmission device of claim 2, further comprising a main circuit board and a device housing, the heat sink member being partially positioned between the first antenna module and the main circuit board, the device housing covering the first antenna module and the heat sink member.

15. The signal transmission device of claim 14, wherein a third distance exists between the first antenna module and the device housing, and a fourth distance exists between the first antenna module and the main circuit board, the third distance being less than 30% of the sum of the third distance and the fourth distance.

16. The signal transmission device as claimed in claim 14, further comprising a thermal pad attached to the heat sink, the thermal pad contacting the device housing.

17. The signal transmitting device as claimed in claim 14, further comprising a central processing unit, a 5G baseband module, a 4G baseband module and an LTE baseband module, wherein the central processing unit, the 5G baseband module, the 4G baseband module and the LTE baseband module are disposed on the main circuit board, the 4G baseband module is disposed between the central processing unit and the 5G baseband module, and the 5G baseband module is disposed between the 4G baseband module and the LTE baseband module.