CN111978513A - Epoxy resin for pouring high-voltage switch and preparation method thereof - Google Patents
Epoxy resin for pouring high-voltage switch and preparation method thereof Download PDFInfo
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- CN111978513A CN111978513A CN201910516541.2A CN201910516541A CN111978513A CN 111978513 A CN111978513 A CN 111978513A CN 201910516541 A CN201910516541 A CN 201910516541A CN 111978513 A CN111978513 A CN 111978513A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Organic Insulating Materials (AREA)
Abstract
The invention discloses epoxy resin for pouring a high-voltage switch and a preparation method thereof, wherein the epoxy resin comprises the following raw materials: 100 parts by weight of liquid epoxy resin, 10-45 parts by weight of chain extender, 3-20 parts by weight of end capping agent and 0.005-0.1 part by weight of catalyst. The epoxy resin prepared by the invention and the curing agent have curing reaction, and the obtained cured product has high mechanical strength and impact strength of 20-30kJ/m2The bending strength is 130-160MPa, the tensile strength is 80-100MPa, and the anti-cracking index is 29-41; according to the invention, the prepared epoxy resin, the anhydride curing agent and the alumina filler are mixed according to a certain proportion, and the basin-type insulator for high-voltage switch insulation is poured, so that the obtained basin-type insulator has extremely low internal stress, higher mechanical strength and excellent electrical performance; basin-shaped body made of epoxy resin composition of the inventionThe insulator can bear high and low temperature tests at minus 40 ℃ to 130 ℃, and can resist water pressure of more than 25kg, which shows that the basin-type insulator has high mechanical strength.
Description
Technical Field
The invention relates to the technical field of epoxy resin for high-voltage switches, in particular to epoxy resin for pouring of a high-voltage switch and a preparation method thereof.
Background
At present, the national economy of China develops rapidly, not only brings wide market opportunity to high-voltage switch manufacturing enterprises, but also greatly promotes the product research and development and technical progress of the high-voltage switch industry. The GIS (gas Insulated switchgear) totally-enclosed combined electrical apparatus presents extremely strong vitality in the development of ultra-high voltage, extra-high voltage, large capacity, compact type, pollution-free, high reliability, intellectualization and combination in the era of increasingly developing the power industry to high voltage and high load density due to the excellent characteristics of compact structure, wide voltage range, safe and reliable operation and the like.
High voltage GIS electrical accidents are 80% insulation problems. The basin insulator is the core insulating part of GIS high voltage switch, and 1 or 3 great metallic conductors of diameter are buried in its structure, because the difference of coefficient of thermal expansion is great, and basin insulator when non-load such as storage, transportation, installation and maintenance, meets the low temperature condition and can produce very big internal stress or when meeting the heavy thermal stress that transships heavy current produced, basin insulator mechanical strength descends by a wide margin, serious even fracture. The quality of the basin-type insulator becomes the key for the stable quality and the reliability of high-voltage GIS electrical products, and becomes a difficult problem to be solved urgently for high-voltage GIS electrical insulation equipment in the global scope.
The basin-type insulator is manufactured by pouring and embedding a large metal conductor by epoxy resin, and the preparation process comprises three steps: mixing, pouring and curing; mixing, namely mixing the epoxy resin and the curing agent, intensively stirring, and simultaneously carrying out vacuum degassing to uniformly mix the materials and remove bubbles; pouring, namely pouring the uniformly mixed materials into a preheated mold under the vacuum condition; and (4) curing, namely curing the material in the mould at a proper temperature to obtain the basin-type insulator. Therefore, the high-performance epoxy resin material with high mechanical strength and low internal stress is the key for manufacturing the high-quality basin-type insulator.
Application number 98112617.0 discloses a "preparation method of an injection epoxy resin for a high-voltage switch", which comprises the steps of (1) using bisphenol A and epichlorohydrin as main raw materials, and firstly, adding epichlorohydrin: caustic alkali: modifier 1: the molar ratio of bisphenol A is 6-9:1.9-2.5:0.4-1.5:1, and the resin intermediate is synthesized through catalytic etherification, synthesis of bisphenol A chlorohydrin and heating reaction; (2) adding modifier 2, stirring and reacting for 0.5-2 hours at the temperature of 60-65 ℃ to obtain the epoxy resin product. The method uses the monoepoxy compounds such as propylene oxide and the like as the end-capping agent to well solve the problem of curing stress of the epoxy resin for pouring, but the end-capping agent is introduced in the basic polymerization reaction process of epichlorohydrin and bisphenol A, the synthesis route is long, the production difficulty is increased, and the glass transition temperature of the obtained epoxy resin is lower.
Disclosure of Invention
In order to solve the problems of low mechanical strength, low temperature resistance and easy cracking of the prior basin-type insulator, the invention aims to provide epoxy resin for pouring a high-voltage switch with high mechanical strength and low stress; therefore, the invention also provides a preparation method of the epoxy resin for pouring the high-voltage switch; in addition, the invention also provides the high-voltage power insulation epoxy resin composition comprising the epoxy resin, and the basin-type insulator prepared from the epoxy resin composition solves the problems of low mechanical strength and easy cracking caused by low mechanical strength and internal stress of the material.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides epoxy resin for pouring a high-voltage switch, which comprises the following raw materials: 100 parts by weight of liquid epoxy resin, 10-45 parts by weight of chain extender, 3-20 parts by weight of end capping agent and 0.005-0.1 part by weight of catalyst.
The epoxy resin is divided into solid (high polymer) and liquid (low polymer), the liquid epoxy resin is modified by adding a chain extender, an end-capping agent and a catalyst into the liquid epoxy resin, and the basin-type insulator cast and cured by the modified epoxy resin has improved mechanical properties, excellent low temperature resistance, excellent cracking resistance and high mechanical strength.
Wherein the liquid epoxy resin is an oligomeric BPA type epoxy resin, an oligomeric BPF type epoxy resin or an oligomeric bisphenol S type epoxy resin.
Wherein the chain extender is bisphenol A, bisphenol S or bisphenol F.
Chain extenders in addition to the above options, other difunctional compounds may be selected.
Wherein the end-capping reagent is a monophenol hydroxyl compound, a monocarboxyl compound or a monothiol compound.
The end-capping agent may be selected from other monofunctional aromatic compounds in addition to the above selections.
Preferably, the monophenol hydroxyl compound is phenol, o-cresol, m-cresol, p-cresol, tert-butylphenol or nonylphenol.
Preferably, the monocarboxylic compound is benzoic acid.
Preferably, the catalyst is a quaternary phosphonium salt, a quaternary ammonium salt, a tertiary amine or triphenyl phosphonium.
The second aspect of the invention provides a preparation method of the epoxy resin for pouring the high-voltage switch, wherein the liquid epoxy resin, the chain extender, the end-capping agent and the catalyst are reacted for 1-5 hours at the temperature of 120-230 ℃ to obtain the epoxy resin for pouring the high-voltage switch.
The epoxy resin is subjected to chain extension polymerization, and the end capping agent is added, so that the crosslinking density of the epoxy resin can be reduced, the curing stress of the epoxy resin can be reduced, and the mechanical strength of the epoxy resin can be improved.
Wherein the reaction temperature is 130-180 ℃.
In a third aspect of the invention, an epoxy resin composition for high-voltage electrical insulation is provided, which comprises the epoxy resin for casting a high-voltage switch.
Wherein, the epoxy resin composition also comprises a curing agent and an inorganic filler.
Wherein the curing agent is a conventional anhydride curing agent on the market, and the inorganic filler is alumina or silica micropowder.
Compared with the prior art, the invention has the following beneficial effects:
(1) the preparation method of the epoxy resin for pouring the high-voltage switch is simple and feasible, does not generate any by-product, and is economic and environment-friendly;
(2) the impact strength of a cured product obtained by curing reaction of the epoxy resin is more than or equal to 12.9kJ/m2Bending strength is more than or equal to 131MPa, tensile strength is more than or equal to 75MPa, KICThe value is more than or equal to 2.2MPa.m1/2The basin-type insulator prepared by the epoxy resin has a water pressure value of more than or equal to 25kg, and is obviously superior to a condensate of EP01551310 type pouring epoxy resin in GB/T13657-2011 standard and the performance of the basin-type insulator.
(3) The basin-type insulator prepared from the epoxy resin composition can bear a high-low temperature test at minus 40-130 ℃ according to a Q/GDW11127 method, and a water pressure failure test is more than or equal to 25kg of water pressure (and the Q/GDW11127 standard stipulates that the failure water pressure is more than 21kg), which shows that the obtained basin-type insulator has extremely low internal stress and high mechanical strength.
(4) The invention solves the problems of easy cracking and low mechanical strength caused by internal stress of the basin-type insulator for the high-voltage switch only by adding expensive toughening agent through a simple and environment-friendly method.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
The No. CN1061665C discloses a preparation method of a casting epoxy resin for a high-voltage switch, which comprises the steps of firstly synthesizing a low-molecular resin intermediate containing monoepoxy, and then synthesizing a resin product under the action of a catalyst. The inventor has continuously found that the epoxy resin for pouring the high-voltage switch with equivalent performance can be obtained by simplifying the process.
The epoxy resin is divided into high polymer solid state and low polymer liquid state, a chain extender, an end-capping agent and a catalyst are added into the liquid epoxy resin to react at the temperature of 120-.
Example 1
A preparation method of epoxy resin for pouring a high-voltage switch comprises the following steps:
s1, weighing 100g of liquid BPA epoxy resin (0164 from Nantong star company), 10g of bisphenol A (0164 from Nantong star company), 6g of phenol and 35mg of benzyltriethylammonium chloride, and uniformly mixing to obtain a homogeneous substance;
s2, heating the obtained homogeneous substance to 120 ℃, and reacting for 5 hours to obtain the epoxy resin A for high-voltage switch casting, wherein the epoxy value of the epoxy resin A is 0.152eq/100 g.
Example 2
A preparation method of epoxy resin for pouring a high-voltage switch comprises the following steps:
s1, weighing 100g of liquid BPA epoxy resin (0164 purchased from Nantong star company), 20g of bisphenol S (purchased from Rugay Jinling chemical company), 3g of phenol and 0.1g of benzyltriethylammonium chloride, and uniformly mixing to obtain a homogeneous substance;
s2, heating the obtained homogeneous substance to 230 ℃, and reacting for 1h to obtain the epoxy resin B for high-voltage switch casting, wherein the epoxy value of the epoxy resin B is 0.275eq/100 g.
Example 3
A preparation method of epoxy resin for pouring a high-voltage switch comprises the following steps:
s1, weighing 100g of liquid bisphenol S epoxy resin (purchased from Nantong star company 0164), 30g of bisphenol F (purchased from Dalian chemical Co., Ltd.), 15g of bisphenol A, 20g of tert-butylphenol and 0.005g of benzyltriethylammonium chloride, and heating and mixing uniformly to obtain a homogeneous substance;
S2, heating the obtained homogeneous substance to 180 ℃, and reacting for 3h to obtain the epoxy resin C for high-voltage switch casting, wherein the epoxy value of the epoxy resin C is 0.32eq/100 g.
Respectively using the epoxy resins synthesized in the embodiments 1, 2 and 3, selecting different curing agents, adding alumina filler for curing, and testing the mechanical strength of the cured product according to the GB/T2567-2008 standard; the epoxy resins synthesized in examples 1, 2 and 3 were used to manufacture 126kV three-wire common box basin insulators for high voltage GIS switches, and the water pressure values were measured (the mechanical strength was judged to be high or low), and the properties of the epoxy resin of the present invention were examined by the mechanical strength of the cured product and the water pressure value of the basin insulator. K is determined according to ASTM5045 methodICAnd GB/T1522 cold-hot cycle test to evaluate the internal stress and the cracking resistance of the epoxy resin. The basin-type insulator adopts a vacuum pouring process, and the technological process and the technological parameters are as follows: preheating epoxy resin for melting, adding into a blending kettle, adding alumina filler, stirring and mixing at 130 deg.C under normal pressure for 20min, and vacuumizing10Pa) for at least 2 hours, adding the curing agent in proportion, and stirring for 15min in vacuum; pouring the mixture into a mould preheated to 130 ℃ in a pouring box with a vacuum degree less than 100 Pa; then moving into a curing oven, curing for 30-40 hours at 130 ℃. Naturally cooling, and opening the die to obtain the basin-type insulator.
Example 4
100g of the epoxy resin A prepared in example 1 was taken, and the formulation: 100g of epoxy resin A, 25g of curing agent methyltetrahydrophthalic anhydride (Jiaxing Zhengda chemical industry), 260g of alumina powder (Shandong Shengyuan RF2, the same below); heating and mixing uniformly under vacuum condition, and degassing thoroughly; pouring into a mold, curing at 140 deg.C for 30 hr to obtain a cured product, preparing corresponding sample strip A according to the dimensions specified in GB/T2567-2008, and performing impact strength, bending strength, tensile strength and KICTesting; a pot insulator was prepared from the epoxy resin A obtained in example 1 by the above-mentioned method, and the water pressure value, impact strength, bending strength, tensile strength and K of the cured product were measuredICAnd the water pressure values of the basin-type insulator are shown in table 1.
TABLE 1
Example 5
Taking the epoxy resin B prepared in the example 2, and preparing according to the formula: 100g of epoxy resin B, 40g of curing agent tetrahydrophthalic anhydride (Puyang Heiweng) and 300g of alumina powder; sample specimen B was obtained in the same manner as above, and subjected to impact strength, bending strength, tensile strength and KICTesting; a pot insulator was prepared from the epoxy resin A obtained in example 2 by the above-mentioned method, and the water pressure value, impact strength, bending strength, tensile strength and K of the cured product were measured ICAnd the water pressure values of the basin-type insulator are shown in table 2.
TABLE 2
| Serial number | Item | Unit of | Test value | Method of producing a composite material |
| B1 | Impact strength | kJ/m2 | 12.9 | GB/T2567-2008 |
| B2 | Bending strength | MPa | 131 | GB/T2567-2008 |
| B3 | Tensile strength | MPa | 81 | GB/T2567-2008 |
| B4 | KIC | MPa.m1/2 | 2.2 | ASTM 5045 |
| B5 | Water pressure value | kg | 25 | Q/GDW11127-2013 |
Example 6
Epoxy resin C prepared in example 3 was taken according to the formula: 100g of epoxy resin C, 45g of curing agent phthalic anhydride (Changzhou Xinyang technology) and 350g of alumina powder; test specimen C was obtained in the same manner as above, and subjected to impact strength, bending strength, tensile strength and KICTesting; a pot insulator was prepared from the epoxy resin A obtained in example 3 by the above-mentioned method, and the water pressure value, impact strength, bending strength, tensile strength and K of the cured product were measuredICAnd the water pressure values of the basin-type insulator are shown in table 3.
TABLE 3
| Serial number | Item | Unit of | Test value | Method of producing a composite material |
| C1 | Impact strength | kJ/m2 | 15.3 | GB/T2567-2008 |
| C2 | Bending strength | MPa | 143 | GB/T2567-2008 |
| C3 | Tensile strength | MPa | 75 | GB/T2567-2008 |
| C4 | KIC | MPa.m1/2 | 2.5 | ASTM 5045 |
| C5 | Water pressure value | kg | 29 | Q/GDW11127-2013 |
Comparative example
The epoxy resin cast by EP01551310 in GB/T13657-2011 standard is used as a comparative example, and the formula is as follows: test specimens CK were prepared in the same manner as described above with 100g of EP01551310, 55g of curing agent phthalic anhydride and 350g of alumina powder, and subjected to impact strength, bending strength, tensile strength and KICTesting; the pot insulator was prepared by pouring the epoxy resin of EP01551310 as described above, and the water pressure value, impact strength, bending strength and tensile strength of the cured product were measured 、KICAnd the water pressure values of the basin-type insulator are shown in table 4.
TABLE 4
| Serial number | Item | Unit of | Test value | Method of producing a composite material |
| CK1 | Impact strength | kJ/m2 | 9.5 | GB/T2567-2008 |
| CK2 | Bending strength | MPa | 121 | GB/T2567-2008 |
| CK3 | Tensile strength | MPa | 73 | GB/T2567-2008 |
| CK4 | KIC | MPa.m1/2 | 1.7 | ASTM 5045 |
| CK5 | Water pressure value | kg | 15 | Q/GDW11127-2013 |
As is clear from comparison of tables 1, 2, 3 and 4, the cured products obtained by curing the epoxy resins obtained in the present invention have impact strengths of 12.9 to 16.9kJ/m2Bending strength of 131-143MPa, tensile strength of 75-81MPa, KICThe value is 2.2-2.6MPa.m1 /2The water pressure value of the basin-type insulator prepared by the epoxy resin is 25-29kg, which is obviously superior to the performance of a cured product obtained by curing the EP01551310 type pouring epoxy resin in the GB/T13657-2011 standard and the performance of the obtained basin-type insulator.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. The epoxy resin for pouring the high-voltage switch is characterized by comprising the following raw materials: 100 parts by weight of liquid epoxy resin, 10-45 parts by weight of chain extender, 3-20 parts by weight of end capping agent and 0.005-0.1 part by weight of catalyst.
2. The epoxy resin for casting a high-voltage switch according to claim 1, wherein the liquid epoxy resin is a liquid BPA type epoxy resin, a BPF type epoxy resin or a bisphenol S type epoxy resin.
3. The epoxy resin for casting a high voltage switch as claimed in claim 1, wherein the chain extender is bisphenol a, bisphenol S or bisphenol F.
4. The epoxy resin for casting a high voltage switch as claimed in claim 1, wherein the blocking agent is a monophenol hydroxyl compound, a monocarboxyl compound or a monothiol compound.
5. The epoxy resin for casting a high voltage switch according to claim 4, wherein the monophenol hydroxyl compound is phenol, o-cresol, m-cresol, p-cresol, t-butylphenol, or nonylphenol.
6. The casting epoxy resin for high voltage switches as claimed in claim 4, wherein the monocarboxylic acid compound is benzoic acid.
7. The epoxy resin for casting a high voltage switch as claimed in claim 1, wherein the catalyst is a quaternary phosphonium salt, a quaternary ammonium salt, a tertiary amine or triphenyl phosphonium.
8. The preparation method of the epoxy resin for pouring the high-voltage switch is characterized in that the liquid epoxy resin, the chain extender, the end-capping reagent and the catalyst are reacted at the temperature of 120-230 ℃ for 1-5h to obtain the epoxy resin for pouring the high-voltage switch.
9. The method as claimed in claim 8, wherein the reaction temperature is 130-180 ℃.
10. An epoxy resin composition for high-voltage electrical insulation, comprising the epoxy resin for casting a high-voltage electrical switch according to any one of claims 1 to 7.
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| CN201910516541.2A CN111978513A (en) | 2019-06-14 | 2019-06-14 | Epoxy resin for pouring high-voltage switch and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035467A (en) * | 2021-03-23 | 2021-06-25 | 上海腾炎新材料有限公司 | Resin fiber insulation basin for SF6 high-voltage switch equipment and manufacturing method thereof |
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| CN87106228A (en) * | 1986-07-18 | 1988-08-10 | 陶氏化学公司 | Controllable film-forming epoxy coating for cathodic electrocoating |
| US5324404A (en) * | 1989-12-23 | 1994-06-28 | Basf Lacke + Farben Aktiengesellschaft | Process for the coating of electrically conducting substrates, aqueous paint, epoxide-amine adduct and use of the epoxide-amine adduct as grinding resin in the production of pigment pastes |
| CN1164244A (en) * | 1994-10-21 | 1997-11-05 | 陶氏化学公司 | Low VOC laminating formulations |
| JP2006335796A (en) * | 2005-05-31 | 2006-12-14 | Dainippon Ink & Chem Inc | Epoxy resin composition, its cured product, novel hydroxy compound, novel epoxy resin and manufacturing method of these |
| CN101528795A (en) * | 2006-10-26 | 2009-09-09 | 巴斯夫公司 | Metal coordinating and film-forming materials |
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2019
- 2019-06-14 CN CN201910516541.2A patent/CN111978513A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87106228A (en) * | 1986-07-18 | 1988-08-10 | 陶氏化学公司 | Controllable film-forming epoxy coating for cathodic electrocoating |
| US5324404A (en) * | 1989-12-23 | 1994-06-28 | Basf Lacke + Farben Aktiengesellschaft | Process for the coating of electrically conducting substrates, aqueous paint, epoxide-amine adduct and use of the epoxide-amine adduct as grinding resin in the production of pigment pastes |
| CN1164244A (en) * | 1994-10-21 | 1997-11-05 | 陶氏化学公司 | Low VOC laminating formulations |
| JP2006335796A (en) * | 2005-05-31 | 2006-12-14 | Dainippon Ink & Chem Inc | Epoxy resin composition, its cured product, novel hydroxy compound, novel epoxy resin and manufacturing method of these |
| CN101528795A (en) * | 2006-10-26 | 2009-09-09 | 巴斯夫公司 | Metal coordinating and film-forming materials |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035467A (en) * | 2021-03-23 | 2021-06-25 | 上海腾炎新材料有限公司 | Resin fiber insulation basin for SF6 high-voltage switch equipment and manufacturing method thereof |
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