CN111970825A - Integrated novel voice coil and manufacturing method thereof - Google Patents

Integrated novel voice coil and manufacturing method thereof Download PDF

Info

Publication number
CN111970825A
CN111970825A CN202010458768.9A CN202010458768A CN111970825A CN 111970825 A CN111970825 A CN 111970825A CN 202010458768 A CN202010458768 A CN 202010458768A CN 111970825 A CN111970825 A CN 111970825A
Authority
CN
China
Prior art keywords
coil
voice coil
integrated
fpc
sound tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010458768.9A
Other languages
Chinese (zh)
Inventor
杨意会
徐坤锦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Qianhaizhenbaiyi Technology Co ltd
Original Assignee
Shenzhen Qianhaizhenbaiyi Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Qianhaizhenbaiyi Technology Co ltd filed Critical Shenzhen Qianhaizhenbaiyi Technology Co ltd
Priority to CN202010458768.9A priority Critical patent/CN111970825A/en
Publication of CN111970825A publication Critical patent/CN111970825A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/003Printed circuit coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • H04R9/046Construction
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3415Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The invention discloses an integrated novel voice coil and a manufacturing method thereof, and the integrated novel voice coil comprises a voice cylinder (1) made of a base material of a Flexible Printed Circuit (FPC), an integrated inductance coil (2) formed by etching or laser engraving an FPC base material and an integrated copper-clad layer thereof or printing a conducting Circuit on the FPC base material, and two Circuit board coil bonding pads (3) formed on the voice coil (1) and used for connecting a Circuit board. The coil circuit and the sound tube are integrated, the probability of wire scattering and wire off of the coil is zero, the materials are only copper foil and FPC base materials which can resist temperature over 300 ℃, and the loudspeaker is lighter and thinner, so that the magnetic materials of the loudspeaker can be correspondingly reduced, the size is reduced, and the effects of reducing cost and saving energy are achieved.

Description

Integrated novel voice coil and manufacturing method thereof
Technical Field
The invention relates to the field of audio equipment, in particular to an integrated novel voice coil and a manufacturing method thereof.
Background
In the prior art, an insulating sheet material, a metal sheet material or a mixture sheet material is often adopted in a sound tube and rolled into a tubular shape with a set diameter to be used as a framework of a voice coil. One end of the voice tube is uniformly wound with an enameled copper wire to form a coil, and after the coil is wound to a specified number of turns, the two ends of the coil are led out and are wound and fixed by an insulating material to complete the manufacture of the voice coil.
The defects of the existing voice coil;
1. the material is formed by stacking a plurality of materials, and the temperature resistance of the materials is insufficient and is not more than 250 ℃ due to different temperature resistances. The firmness of the pasting is unstable, the hardness of the voice coil is unstable, and poor line scattering/line falling is easy to occur;
2. the framework and the copper wire are separated and are attached by glue, so that the weight of the glue is increased;
3. the thickness of the insulating layer of the enameled wire, the gap between the enameled wires, the thickness of glue and the superposition of various thicknesses make the enameled wire difficult to be made thin;
the voice coil is a device with relatively tight requirements, and the existing manufacturing process of the voice coil is difficult to realize automatic production. At present, the production is carried out in a semi-automatic winding and segmenting operation mode, the yield is low, and the reliability and consistency are poor during mass production.
The method has the advantages of no possibility of repair, high reject ratio, more factors influencing the product quality, material characteristics, winding method/strength/density/uniformity, temperature resistance/adhesive force/curing degree/hardness/toughness of fixing glue, wire drawing uniformity of copper wires of enameled wires/purity of copper materials/thickness of insulating paint/uniformity of insulating paint, strength/temperature resistance/heat conductivity of a framework, and bonding strength/uniformity/temperature resistance of sticker or glue for fixing leads, and the factors can cause high defects of wire scattering/wire breakage/short circuit/deformation and the like and large index error of product performance, and cause high cost of finished products.
Disclosure of Invention
The invention aims to solve the technical problem of a novel integrated voice coil and a manufacturing method thereof, the voice coil manufactured by adopting a flexible printed circuit board/a flexible circuit board can realize automatic production, has stable material characteristics and production process, and can solve all the defects of the existing voice coil.
The invention is realized by the following technical scheme: the utility model provides a novel voice coil loudspeaker voice coil of integration, includes the sound section of thick bamboo that forms by the preparation of FPC substrate to and the inductance coils of integration based on the sound section of thick bamboo preparation forms, and form two circuit board coil pad on the sound section of thick bamboo, be used for the connecting circuit board.
As a preferable technical scheme, the sound tube is made of an FPC base material, and the inductance coil is integrally formed on the sound tube.
As a preferred technical scheme, the inductance coil is formed by copper-clad etching or laser engraving of an FPC substrate or printing of a conductive circuit on the substrate.
A manufacturing method of an integrated novel voice coil comprises the following steps:
s1, preparing a single-layer or multi-layer FPC substrate, and coating copper on the surface of the FPC substrate to etch or laser engrave or print a conductive circuit on the substrate according to a given design;
s2, laminating and winding the single-layer or multi-layer FPC formed by the circuit to form a sound tube;
s3, forming metallized holes through drilling and electroplating, forming conductive paths among different layers and rolling into coils;
and S4, finally, after high-temperature shaping, the voice coil with the integrated voice tube and the induction coil is manufactured.
The invention has the beneficial effects that: the novel integrated voice coil adopts a Flexible Printed Circuit (FPC for short), and the Flexible Printed Circuit is connected with a voice coil through a Flexible Printed Circuit;
the FPC has the characteristics of high wiring density, light weight, thin thickness and low cost, and the voice coil framework and the coil are integrated by adopting the voice coil of the FPC, so that the production links and raw materials of the voice coil are reduced, the production efficiency of the voice coil is improved, and the cost of the voice coil is reduced;
meanwhile, the characteristics of the FPC are utilized to ensure that the vibration body such as the loudspeaker adopting the voice coil has the advantages of small magnetic gap, high efficiency, good sound quality and low cost, and the application range is very wide.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it is to be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Further, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms such as "upper," "above," "lower," "below," and the like in describing relative spatial positions herein is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly
In the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "sleeved," "connected," "penetrating," "plugged," and the like are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, the integrated voice coil of the present invention includes a sound tube 1 made of an FPC substrate with copper foil, and an integrated inductance coil 2 made based on the sound tube 1, and two circuit board coil pads 3 are formed on the sound tube 1 for connecting a circuit board.
In this embodiment, sound tube 1 is the sound tube that is prepared by the FPC substrate, and inductance coils 2 formula as an organic whole sets up the inductance coils on sound tube 1, and the appearance is the same with traditional voice coil loudspeaker voice coil, but sets up the structure of formula as an organic whole between inductance coils and the sound tube, can effectually solve a great deal of not enough among the prior art.
In this embodiment, the inductance coil 2 is a coil formed by etching or laser engraving the FPC substrate and the integrated copper-clad layer thereof, or printing a conductive circuit on the FPC substrate. Because the material only has two temperature resistance of copper foil and FPC substrate and can reach more than 300 ℃, and is lighter and thinner, the magnetic material can be correspondingly reduced, the volume of the loudspeaker is reduced, and the effects of reducing cost and saving energy are achieved.
The specific voice coil manufacturing steps are as follows:
firstly, preparing a single-layer or multi-layer FPC base material, and cutting the single-layer or multi-layer FPC base material into a proper size; then, laminating and winding the single-layer or multi-layer flexible circuit layer of the formed pipe body together to form a sound tube (1); forming metallized holes through drilling and electroplating, forming conductive paths among different layers and forming a coil (2); and finally, after high-temperature setting, the voice coil with the integrated voice tube and the induction coil is manufactured.
The invention has the beneficial effects that: the novel integrated voice coil adopts a Flexible Printed Circuit (FPC for short), and a Flexible Printed Circuit board (FPC for short) is adopted. The FPC has the characteristics of high wiring density, light weight, thin thickness and low cost, and the voice coil of the FPC is adopted to realize the integration of the voice tube and the coil, so that the production links and raw materials of the voice coil are reduced, the production efficiency of the voice coil is improved, and the cost of the voice coil is reduced. Meanwhile, the characteristics of the FPC are utilized to ensure that the vibration bodies such as the loudspeaker adopting the voice coil have the advantages of small magnetic gap, high efficiency, good sound quality and low cost. The application range is very wide.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims (4)

1. The utility model provides a novel voice coil loudspeaker voice coil of integration which characterized in that: the novel loudspeaker comprises a sound tube (1) prepared from an FPC (flexible printed circuit) base material with copper foil, an integrated inductance coil (2) manufactured on the basis of the sound tube (1), and two circuit board coil bonding pads (3) formed on the sound tube (1) and used for connecting a circuit board.
2. The integrated voice coil of claim 1, wherein: the sound tube (1) is prepared from an FPC base material, and the inductance coil (2) is integrally arranged on the sound tube (1).
3. The integrated voice coil of claim 2, wherein: the inductance coil (2) is formed by etching or laser engraving of an FPC (flexible printed circuit) base material and an integrated copper-clad layer thereof.
4. A manufacturing method of an integrated novel voice coil is characterized by comprising the following steps:
s1, preparing a single-layer or multi-layer FPC base material, and cutting the single-layer or multi-layer FPC base material into a proper size;
s2, laminating the single-layer or multi-layer flexible circuit layers of the formed sound tube;
s3, after laminating, forming metallized holes through drilling and electroplating, forming conductive paths among different layers and forming a coil (2);
and S4, finally, after high-temperature shaping, the sound tube (1) and the induction coil (2) with integration are manufactured.
CN202010458768.9A 2020-05-27 2020-05-27 Integrated novel voice coil and manufacturing method thereof Pending CN111970825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010458768.9A CN111970825A (en) 2020-05-27 2020-05-27 Integrated novel voice coil and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010458768.9A CN111970825A (en) 2020-05-27 2020-05-27 Integrated novel voice coil and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN111970825A true CN111970825A (en) 2020-11-20

Family

ID=73358191

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010458768.9A Pending CN111970825A (en) 2020-05-27 2020-05-27 Integrated novel voice coil and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN111970825A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2620787A (en) * 2022-07-22 2024-01-24 Gp Acoustics Uk Ltd Loudspeakers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202121767U (en) * 2011-07-01 2012-01-18 宁波凯普电子有限公司 Large power voice coil
JP2012015874A (en) * 2010-07-02 2012-01-19 Clarion Co Ltd Voice coil speaker
CN106454655A (en) * 2016-09-30 2017-02-22 常州阿木奇声学科技有限公司 Loudspeaker and voice coil thereof
CN108966095A (en) * 2018-08-07 2018-12-07 张永春 Loudspeaker unit and speaker unit
CN208489984U (en) * 2018-08-07 2019-02-12 张永春 Voice coil assemblies and loudspeaker

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015874A (en) * 2010-07-02 2012-01-19 Clarion Co Ltd Voice coil speaker
CN202121767U (en) * 2011-07-01 2012-01-18 宁波凯普电子有限公司 Large power voice coil
CN106454655A (en) * 2016-09-30 2017-02-22 常州阿木奇声学科技有限公司 Loudspeaker and voice coil thereof
CN108966095A (en) * 2018-08-07 2018-12-07 张永春 Loudspeaker unit and speaker unit
CN208489984U (en) * 2018-08-07 2019-02-12 张永春 Voice coil assemblies and loudspeaker

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2620787A (en) * 2022-07-22 2024-01-24 Gp Acoustics Uk Ltd Loudspeakers

Similar Documents

Publication Publication Date Title
JP2012009798A (en) Thin type common mode filter and method of manufacturing the same
US6630881B1 (en) Method for producing multi-layered chip inductor
JP6753825B2 (en) Coreless build-up support board
JP2012038806A (en) Laminated coil
JPH10172831A (en) Laminated inductor
CN111970825A (en) Integrated novel voice coil and manufacturing method thereof
CN112568506A (en) Ceramic heating body and manufacturing method thereof
CN215898007U (en) Integrated light voice coil
CN214675659U (en) Loudspeaker, moving-coil earphone and moving-coil microphone
CN201717256U (en) Passive device and circuit board embedded with same
TWI747453B (en) Coil apparatus
CN210579553U (en) Printed circuit board
JP5245645B2 (en) Manufacturing method of laminated coil component
JPH11317311A (en) Composite component and manufacture of the same
JPH10189342A (en) Common mode choke coil and its manufacture
CN111970622A (en) Loudspeaker capable of generating power and implementation method thereof
CN216017269U (en) Circuit die body unit integrated structure of low-temperature co-fired ceramic electronic device
JPH09199331A (en) Coil component and its manufacture
CN215988297U (en) Novel inductor
JP2005101175A (en) Helical inductor, method for manufacturing the same, and substrate provided with built-in helilcal inductor
TWM619715U (en) Circuit module unit integration structure of low temperature co-firing ceramic electronic device
JPH09275014A (en) Coil part and its manufacturing method
CN115604911A (en) Circuit board with surface anti-abrasion structure
JP2001023823A (en) Laminated chip inductor
JPH09190925A (en) Coil component and its manufacture

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20201120

RJ01 Rejection of invention patent application after publication