CN111970597B - Earphone, method for detecting wearing state of earphone and electronic equipment - Google Patents

Earphone, method for detecting wearing state of earphone and electronic equipment Download PDF

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Publication number
CN111970597B
CN111970597B CN202010826929.5A CN202010826929A CN111970597B CN 111970597 B CN111970597 B CN 111970597B CN 202010826929 A CN202010826929 A CN 202010826929A CN 111970597 B CN111970597 B CN 111970597B
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China
Prior art keywords
pressure
pressure sensors
headset
earphone
pressure sensor
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CN111970597A (en
Inventor
李富林
冉锐
邓耿淳
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091Details not provided for in groups H04R1/1008 - H04R1/1083
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • H04R3/002Damping circuit arrangements for transducers, e.g. motional feedback circuits
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • H04R3/005Circuits for transducers, loudspeakers or microphones for combining the signals of two or more microphones

Abstract

The application discloses an earphone, a method for detecting wearing state of the earphone and electronic equipment. The earphone includes: at least one pressure sensor for acquiring a pressure signal, the at least one pressure sensor comprising a first set of pressure sensors including one or more pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the earphone; and the processing unit is used for determining the wearing state of the earphone according to the pressure signal. According to the technical scheme, user experience can be improved.

Description

Earphone, method for detecting wearing state of earphone and electronic equipment
The application is a divisional application of invention applications with the application date of 2017, 11 and 27, and the Chinese application number of 201780008902.1, and the invention name of earphone, method for detecting wearing state of earphone and electronic equipment.
Technical Field
The present invention relates to the field of information technology, and more particularly, to an earphone, a method for detecting a wearing state of the earphone, and an electronic device.
Background
When a person uses an earphone, such as listening to music, broadcasting or books, the playing is suspended if the person needs to communicate with the earphone, and the playing is continued after the communication is finished. In the existing headset configurations, this function is typically implemented with mechanical buttons.
However, the above-described mechanical button solution is less convenient in experience. In addition, after the earphone is pulled out, if the earphone is not detected, the mobile phone is continuously connected with the earphone; when an important telephone is accessed, the ring tone only sounds in the earphone, so that the user misses the important telephone, unnecessary troubles are caused to the user, and the user experience is influenced.
Disclosure of Invention
The embodiment of the application provides an earphone, a method for detecting wearing state of the earphone and electronic equipment, and user experience can be improved.
In a first aspect, a headset is provided, comprising:
at least one pressure sensor for acquiring a pressure signal, the at least one pressure sensor comprising a first set of pressure sensors including one or more pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the headset;
and the processing unit is used for determining the wearing state of the earphone according to the pressure signal.
In the embodiment of the application, the wearing state of the earphone is determined according to the pressure signal of the pressure sensor in the ear entering area of the earphone, so that corresponding operation can be executed corresponding to the wearing state of the earphone, manual control of a user is not needed, and user experience can be improved.
In some possible implementations, the pressure sensors of the first set of pressure sensors are disposed at an ear plug, a headphone post, or a headphone barrel of the headphone in-ear region.
In some possible implementation manners, pressure sensors in the first pressure sensor set can be arranged on a deformation reinforcing structure of an ear entering region of the earphone, convex strips are arranged on grooves of the earphone column, and after the grooves and other structures are attached by the large-deformation adhesive such as foam cotton glue, the deformation can be amplified structurally to enable the pressure sensors to obtain larger signal quantity, so that the performance is optimized.
In some possible implementations, the at least one pressure sensor further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
In some possible implementations, the pressure sensors of the second set of pressure sensors are disposed at a headset sleeve of a handheld region of the headset.
In some possible implementations, the processing unit is specifically configured to:
and if the pressure in the handheld area of the earphone is determined according to the pressure signals acquired by one or more pressure sensors in the second pressure sensor set and the pressure in the in-ear area of the earphone is determined according to the pressure signals acquired by one or more pressure sensors in the first pressure sensor set, determining that the earphone is worn in the ear.
In some possible implementations, the processing unit is specifically configured to:
and if the pressure in the handheld area of the earphone is determined to exist according to the pressure signals acquired by one or more pressure sensors in the second pressure sensor set and the pressure in the in-ear area of the earphone is determined to disappear according to the pressure signals acquired by one or more pressure sensors in the first pressure sensor set, determining that the earphone is picked up.
In the embodiment of the application, the wearing state of the earphone is determined through the signals of the pressure sensors in the ear entering area and the hand-held area, and the wearing state of the earphone can be accurately judged, so that corresponding operation can be executed corresponding to the wearing state of the earphone, manual control of a user is not needed, and the user experience can be improved. In addition, the earphone structure and the sensing system of the embodiment of the application are simpler, so that the cost is lower.
In some possible implementations, the at least one pressure sensor is disposed in at least one of: the earphone is characterized in that the earphone is arranged on the inner side surface of the shell structure of the earphone, on the outer side surface of the shell structure of the earphone or in the material of the shell structure of the earphone.
In some possible implementations, pressure sensors are provided on the same area of the housing structure of the headset on the inner side, on the outer side and in the material. The three pressure sensors in the same area can be respectively arranged on the inner side surface of the shell structure of the earphone, the outer side surface of the shell structure of the earphone and the material of the shell structure of the earphone. The three sensors form a multi-lamination sensing structure to form a triple pressure sensor, and a pressure signal with higher dimensionality can be acquired. In addition to the improvement of the accuracy of determining the wearing state of the headphone, operations such as tapping, pressing, shaking (shaking) and the like can be realized.
In some possible implementations, a plurality of pressure sensors are uniformly arranged along a circumference of the housing structure of the headset. A plurality of triplex pressure sensors in different locations may form a pressure sensing network system. The signals of the pressure sensing network system can be expanded and more abundant application can be realized after the signals are processed by the software algorithm of the processing unit.
In some possible implementations, the first set of pressure sensors includes a resistive pressure sensor of a bridge structure, where resistances of two adjacent ones of the bridge arms of the resistive pressure sensor of the bridge structure are disposed on different sides of a housing structure of the headset.
In some possible implementations, the processing unit is further configured to:
upon determining that the headset is being worn into the ear, performing an operation associated with the headset being worn into the ear; alternatively, the first and second electrodes may be,
performing an operation associated with the earphone-removed ear upon determining that the earphone is a removed ear.
In a second aspect, there is provided a method of detecting a wearing state of a headset, the headset including at least one pressure sensor, the at least one pressure sensor including:
a first set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the first set of pressure sensors being disposed in an in-ear region of the earpiece;
the method comprises the following steps:
acquiring a pressure signal of the at least one pressure sensor;
and determining the wearing state of the earphone according to the pressure signal.
In some possible implementations, the at least one pressure sensor further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
In some possible implementations, the determining the wearing state of the headset according to the pressure signal includes:
and determining the wearing state of the earphone according to the pressure signals obtained by one or more pressure sensors in the first pressure sensor set and the pressure signals obtained by one or more pressure sensors in the second pressure sensor set.
In some possible implementations, if it is determined that pressure exists in the holding area of the earphone according to the pressure signals obtained by one or more pressure sensors in the second pressure sensor set and it is determined that pressure exists in the ear-entering area of the earphone according to the pressure signals obtained by one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is worn into the ear
In some possible implementations, it is determined that the earphone is picked up from the ear if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by one or more pressure sensors in the second pressure sensor set and it is determined that pressure disappears in the ear entrance area of the earphone according to the pressure signals acquired by one or more pressure sensors in the first pressure sensor set.
In a third aspect, an electronic device is provided, including: the headset of the first aspect or any possible implementation thereof.
In a fourth aspect, a computer storage medium is provided, in which program code is stored, and the program code can be used to instruct to execute the method in the second aspect or any possible implementation manner thereof.
In a fifth aspect, there is provided a computer program product comprising instructions which, when run on a computer, cause the computer to perform the method of the second aspect described above or any possible implementation thereof.
Drawings
Fig. 1 is a schematic diagram of a capacitive pressure sensor according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a resistive pressure sensor according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a bridge resistive pressure sensor according to an embodiment of the present application.
Fig. 4 is a schematic block diagram of a headset of an embodiment of the present application.
Fig. 5 a-8 b are schematic views of the arrangement region of the pressure sensor according to the embodiment of the present application.
Fig. 9 and 10 are schematic views of the arrangement position of the pressure sensor according to the embodiment of the present application.
Fig. 11 and 12 are schematic views of an arrangement of a plurality of pressure sensors according to an embodiment of the present application.
Fig. 13 and 14 are schematic diagrams of a triple pressure sensor according to an embodiment of the present application.
Fig. 15 is a schematic view of a pressure sensing network system according to an embodiment of the present application.
Fig. 16 and 17 are schematic views showing the arrangement of the bridge type resistive pressure sensor according to the embodiment of the present application.
Fig. 18 to 20 are schematic diagrams of the headphone processing flow according to the embodiment of the present application.
Fig. 21 is a flowchart of a process of inserting an earphone into an ear according to an embodiment of the present application.
Fig. 22 is a flowchart of a process of earphone-out of the ear according to an embodiment of the present application.
Fig. 23 is a schematic diagram of an external side design of an earphone sleeve according to an embodiment of the present application.
Fig. 24 and 25 are schematic views of the arrangement of the pressure sensor and the infrared sensor or the capacitance sensor according to the embodiment of the present application.
FIG. 26 is a schematic diagram of a capacitive sensor according to an embodiment of the present application.
Fig. 27 is a schematic flowchart of a method of detecting a wearing state of a headset according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
The technical solution of the embodiment of the present application may be applied to earphones of various forms, for example, in-ear earphones or ear plugs, but the embodiment of the present application is not limited thereto.
The pressure sensor in the embodiment of the present application may be a capacitive pressure sensor or a resistive pressure sensor, but the embodiment of the present application is not limited thereto.
The capacitive pressure sensor, which may also be referred to as a pressure-capacitance sensor, has the principle as shown in fig. 1, that when pressure is applied to the plate 12, the pressure causes the distance between the capacitors 21 between the two plates 11 and 12 to change, thereby changing the value of the capacitance. The pressure of different sizes produces different capacitance value changes, converts the change volume of this capacitance value into the electrical signal, measures the change of this signal through detecting the chip and can detect the size of corresponding pressure.
The resistance-type pressure sensor can also be called a piezoresistive sensor, and the principle of the resistance-type pressure sensor is as shown in fig. 2, the resistance-type pressure sensor 22 is arranged on a certain to-be-detected stressed surface, and the stressed carrier 13 is stressed to deform, so as to press or stretch the resistance-type pressure sensor 22, and accordingly the resistance value of the resistance-type pressure sensor changes accordingly. Different pressure size produces different resistance changes, detects this resistance change through detecting the chip and can detect corresponding dynamics size.
As shown in fig. 3, four independent resistive pressure sensors are combined into a bridge topology, i.e., a bridge resistive pressure sensor is formed, which can realize temperature drift suppression at a hardware level.
Fig. 4 shows a schematic block diagram of a headset 400 of an embodiment of the application.
As shown in fig. 4, the headset 400 includes at least one pressure sensor 410 and a processing unit 420.
At least one pressure sensor 410 is used to acquire a pressure signal.
The at least one pressure sensor 410 may include:
a first set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the first set of pressure sensors being disposed in an in-ear region of the earpiece.
The pressure sensor 410 may be a capacitive pressure sensor or a resistive pressure sensor, which is not limited in this application.
The processing unit 420 is configured to determine a wearing state of the earphone according to the pressure signal.
Optionally, the wearing state of the headset may include that the headset is not worn, the headset is worn into the ear, the headset is taken out of the ear, whether the headset is worn well (for example, wearing level) when the headset is worn, and the like, but the embodiment of the present application is not limited thereto.
Alternatively, the processing unit 420 may be specifically a processor, a processing chip or a detection chip.
The pressure sensor arranged in the ear-entering area can be used for detecting the pressure signal in the process of the earphone entering or exiting the ear. Deformation generated when the earphone is worn into the ear is conducted to the pressure sensor in the ear entering area step by step through the earphone structure, the deformation generated by pressure can be maintained all the time after the earphone is worn into the ear, and the pressure sensor also keeps corresponding signal quantity to finish in-ear wearing detection; when the earphone is out of the ear, the deformation can be restored, the pressure sensor in the ear area can correspondingly release the signal quantity, and the detection of the out-of-the-ear is finished.
In the embodiment of the application, the wearing state of the earphone is determined according to the pressure signal of the pressure sensor in the ear entering area of the earphone, so that corresponding operation can be executed corresponding to the wearing state of the earphone, manual control of a user is not needed, and user experience can be improved.
Optionally, in one embodiment of the present application, the at least one pressure sensor 410 may be disposed in at least two different areas of the headset.
By arranging at least one pressure sensor in different areas, multi-dimensional pressure signals can be obtained, so that the accuracy of determining the wearing state of the headset can be improved. Furthermore, various operations can be realized according to signals of at least one pressure sensor, and user experience is further improved.
Alternatively, in one embodiment of the present application, the pressure sensor 410 may be disposed at multiple locations in the in-ear region of the earphone. For example, the pressure sensor 410 may be provided at an ear plug, a headphone post, or a headphone barrel of the in-ear region of the headphone.
As shown in fig. 5a, 6a and 7a, for an in-ear headphone, the pressure sensor 410 may be provided at an ear plug 510, a headphone post 520 or a headphone barrel 530 at the in-ear region of the headphone.
Alternatively, the pressure sensor 410 may be arranged on a deformation enhancing structure of the in-ear region of the earphone. For example, as shown in fig. 6b and 6c, a convex strip 521 or a concave groove 522 may be disposed on the concave portion of the earphone post 520, and then the pressure sensor 410 is attached with an adhesive 610 having a large deformation, such as foam cotton, so that the deformation may be structurally amplified to enable the pressure sensor to obtain a larger signal amount, thereby optimizing performance.
As shown in fig. 8a, for an earbud headphone (which may also be referred to as an earbud), the pressure sensor 410 may be located at an earbud 810 of the in-ear region of the headphone.
Optionally, in an embodiment of the present application, the at least one pressure sensor 410 further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
Another area where the pressure sensor 410 is located may be a hand-held area of the headset. For example, the pressure sensor 410 may be disposed at a headset sleeve of a handheld region of a headset.
As shown in fig. 5b, 6d and 7b, for an in-ear headphone, the pressure sensor 410 may be provided at the headphone sleeve 540 of the handheld area of the headphone.
As shown in fig. 8b, for an ear bud headphone, the pressure sensor 410 may be located at the headphone sleeve 840 in the hand-held area of the headphone.
Alternatively, in one embodiment of the present application, the pressure sensor 410 may be disposed on an inner side of the housing structure of the headset, on an outer side of the housing structure of the headset, or in the material of the housing structure of the headset.
For example, for the hand-held area, as shown in fig. 9, the pressure sensor 410 may be attached to the inner side of the housing structure of the earphone sleeve by an adhesive 910 (e.g., foam), or the pressure sensor 410 may be disposed in the material of the housing structure of the earphone sleeve by injection molding or the like, or the pressure sensor 410 may be directly printed or attached to the outer side of the housing structure of the earphone sleeve by an adhesive.
Similarly, for the ear entry area, as shown in fig. 10, the pressure sensor 410 may be attached to the inner side of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of an adhesive 910, or the pressure sensor 410 may be disposed in the material of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of injection molding or the like, or the pressure sensor 410 may be printed directly or attached to the outer side of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of an adhesive.
For the pressure sensor in the handheld area, when external handheld force is applied, pressure is transmitted to the pressure sensor, and a corresponding pressure signal can be obtained.
For the pressure sensor in the ear-entering area, when the earplug is inserted into the ear, pressure is generated and transmitted to the pressure sensor, and a corresponding pressure signal can be obtained.
It should be understood that the pressure sensor 410 may be disposed in other areas of the earphone besides the ear insertion area and the hand holding area, which is not limited in the embodiments of the present application.
Alternatively, in one embodiment of the present application, a plurality of pressure sensors 410 may be provided for one area. For example, as shown in fig. 11 and 12, a plurality of pressure sensors 410 may be provided in the hand-held region (fig. 11) and the ear-entry region (fig. 12).
Alternatively, in one embodiment of the present application, three pressure sensors 410 of the same area may be provided on the inner side of the housing structure of the headset, on the outer side of the housing structure of the headset and in the material of the housing structure of the headset, respectively, as shown in fig. 13 (hand-held area) and fig. 14 (in-ear area). The three sensors form a multi-lamination sensing structure to form a triple pressure sensor, and a pressure signal with higher dimensionality can be acquired. In addition to the improvement of the accuracy of determining the wearing state of the headphone, operations such as tapping, pressing, shaking (shaking) and the like can be realized.
Alternatively, in one embodiment of the present application, a plurality of triplex pressure sensors in different locations may form a pressure sensing network system. For example, fig. 15 shows an eight-unit sensor network system composed of a plurality of triple pressure sensors, which is configured to arrange eight triple pressure sensors at eight positions in an ear area, obtain multi-dimensional pressure information at different positions to form the pressure sensor network system, and expand richer applications after signals of the pressure sensor network system are processed by a software algorithm of a processing unit.
Optionally, in an embodiment of the present application, the first set of pressure sensors includes a resistive pressure sensor of a bridge structure, where resistances of two adjacent bridge arms in a bridge in the resistive pressure sensor of the bridge structure are disposed on different sides of a housing structure of the earphone.
For example, as shown in FIG. 16, pressure sensor 410 is a resistive pressure sensor in a bridge configuration, and is composed of resistors 41,42,43, and 44 of four bridge arms, wherein resistor 41 is connected in series with resistor 44, and resistor 42 is connected in series with resistor 43. When placed on the earpiece post of the headset, resistors 41 and 43 are on the outside and resistors 42 and 44 are on the inside. Fig. 16 is a schematic diagram of the pressure sensor after being unfolded around the earphone post. When the earphone silica gel is sleeved in the ear to squeeze the piezoresistive sensor wrapping the whole earphone post, the resistance 41 and the resistance 43 positioned on the outer side and the resistance 42 and the resistance 43 positioned on the inner side are deformed in opposite directions under stress, so that the change directions of the resistances are opposite. It can be seen from the circuit diagram IN fig. 16 that when the resistances of two different planes are changed oppositely, the voltages IN + and IN-can obtain the largest input differential signal, and the optimal performance is achieved.
In another example, as shown in fig. 17, the pressure sensor 410 disposed on the earphone barrel of the earphone has a circular arc-shaped profile. Resistors 41 and 43 are located on the outside and resistors 42 and 44 are located on the inside. Similarly, when the earphone silicone is inserted into the ear, the resistance 41 and the resistance 43 located outside are deformed in the opposite direction to the resistance 42 and the resistance 43 located inside, and thus the resistance changes in the opposite direction. It can be seen from the circuit diagram IN fig. 17 that when the resistances of two different planes are changed oppositely, the voltages IN + and IN-can obtain the largest input differential signal, and the optimal performance is achieved.
Optionally, in an embodiment of the present application, if one or more pressure sensors in the first set of pressure sensors do not acquire a pressure signal, it is determined that the headset is not worn.
Optionally, in an embodiment of the present application, the processing unit 420 may determine the wearing state of the headset according to the pressure signals obtained by one or more pressure sensors in the first set of pressure sensors and the pressure signals obtained by one or more pressure sensors in the second set of pressure sensors.
As shown in fig. 18, the pressure signals of the pressure sensor 410 in the handheld area and the pressure sensor 410 in the ear area are transmitted to the processing unit 420 together, and the processing unit 420 can determine whether the earphone is worn or not through software algorithm.
Alternatively, as shown in fig. 19, if the pressure sensors 410 are disposed in other regions, the pressure signals of the pressure sensors 410 in each region are jointly transmitted to the processing unit 420, so as to further improve the accuracy of the processing unit 420 in determining whether the earphone is worn or not.
Alternatively, as shown in fig. 20, if a plurality of pressure sensors 410 are provided for each area, and the pressure signals of the pressure sensors 410 of the respective areas are jointly transmitted to the processing unit 420, the processing unit 420 can determine whether the headset is worn or not through a software algorithm. In addition, the processing unit 420 may also implement other functions, such as heart rate monitoring, step counting, etc., according to signals of multiple pressure sensors 410 in the same area, thereby further improving user experience. Optionally, the processing unit 420 may also implement other functions, such as heart rate monitoring, etc., in combination with signals of other sensors in the system, such as an acceleration sensor, so as to further enhance the user experience.
The pressure sensors 410 in the ear-entering area and the hand-held area respectively acquire a hand-held pressure signal and an ear-entering pressure signal when the earphone is worn, that is, acquire two-dimensional pressure signals, so that the wearing state of the earphone can be accurately determined.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the headset according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure exists in the ear entrance area of the headset according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the headset is worn into the ear.
Specifically, the pressure sensor of the handheld area detects a pressure signal indicating that the handheld area is touched (touch), and the pressure sensor of the in-ear area detects a pressure signal indicating that the in-ear area is touch, which in combination can determine that the headset is worn in the ear.
Optionally, in an embodiment of the present application, the processing unit 420 may further perform an operation associated with the headset being worn into the ear when it is determined that the headset is worn into the ear.
For example, when it is determined that the headset is worn in the ear, playing may be performed, or a device to which the headset is connected, such as a cell phone, may be notified so that the cell phone selects the headset to play, and so on.
Fig. 21 shows a flowchart of the process of inserting the earphone into the ear. It should be understood that fig. 21 is only an example and should not be taken as limiting the embodiments of the present application.
2110, pressure sensors of a plurality of areas detect pressure.
The plurality of pressure zones includes a hand-held zone and an in-ear zone.
2120, it is determined whether the handheld area is touched.
And determining whether the handheld area is touched or not through signals of the pressure sensors of the handheld area. If so, then 2130 is performed; if not, returning to the initial step.
2130, determining whether the in-ear area is touched.
After determining that the handheld area is touched, further determining whether the in-ear area is touched through a signal of the pressure sensor of the in-ear area. If yes, go to 2140; if not, returning to the initial step.
2140, the in-ear detection is completed, and the relevant operation is executed.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure in the ear entrance area of the earphone disappears according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is taken out of the ear.
Specifically, the pressure sensor in the handheld area detects that the pressure signal indicates that the handheld area is touch, and then the pressure in the ear area disappears to determine that the earphone is taken out of the ear.
Optionally, in an embodiment of the present application, the processing unit 420 may further perform an operation associated with the earphone being taken out of the ear when it is determined that the earphone is taken out of the ear.
For example, when it is determined that the earphone is taken off the ear, the playing may be paused, or a device to which the earphone is connected, such as a mobile phone, may be notified to pause the playing of the mobile phone or select a speaker of the mobile phone to play, etc.
Fig. 22 shows a process flow diagram for earphone-out-of-ear. It should be understood that fig. 22 is only an example and should not be taken as limiting the embodiments of the present application.
2210, pressure sensors of a plurality of areas detect pressure.
The plurality of pressure zones includes a hand-held zone and an in-ear zone.
2220, determining whether the hand-held area is touched.
And determining whether the handheld area is touched or not through signals of the pressure sensors of the handheld area. If yes, 2130 is executed; if not, returning to the initial step.
2230, determining if the pressure in the ear area has disappeared.
After the handheld area is determined to be touched, whether the pressure in the ear area disappears is further determined through signals of the pressure sensor in the ear area. If yes, go to 2140; if not, returning to the initial step.
2240, finishing the ear detection and executing the related operation.
The earphone of this application embodiment, the wearing state of earphone is confirmed through the pressure sensor's that goes into ear region and handheld region signal, can accurately judge the wearing state of earphone to can correspond the wearing state execution corresponding operation of earphone, need not user manual control, thereby can promote user experience. In addition, the earphone structure and the sensing system of the embodiment of the application are simpler, so that the cost is lower.
Optionally, in an embodiment of the present application, a touch convex structure, a touch concave structure, or a touch particle point is disposed on an outer side surface of an area of the earphone sleeve where the pressure sensor is disposed.
For example, as shown in fig. 23, the pressure sensor 410 is attached to the inner side of the casing of the mobile phone casing in a fitting manner, and accordingly, for the outer side, a design of the outer side of the touch salient point, a design of the outer side of the touch concave point, or a design of the outer side of the touch particle point may be adopted. It is understood that the form of the outer side surface may be varied and is not limited to the examples.
Optionally, in an embodiment of the present application, the processing unit 420 may further implement a key function according to the pressure signal.
The detection signal of the pressure sensor can be used for realizing other functions besides determining whether the earphone is in the ear, for example, realizing a key function. For example, a finger may click or touch a handheld area, and a pressure sensor in the area may obtain data of pressure changes, or a finger may click or touch an arbitrary position of the headset, and a pressure sensor in an ear area may also obtain data of pressure changes, and the data may be used to implement other functions such as key pressing.
Optionally, in an embodiment of the present application, the headset further includes an infrared sensor and/or a capacitive sensor. Accordingly, the processing unit 420 may determine the wearing state of the headset according to the detection signal of the infrared sensor and/or the capacitance sensor and the pressure signal.
In particular, the pressure sensor may also be used in combination with other types of sensors, such as infrared sensors or capacitive sensors, to further improve the accuracy of determining the wearing state of the headset. For example, as shown in fig. 24, in addition to the at least one pressure sensor 410, one or more infrared sensors or capacitive sensors 2410 may be provided on the headset.
The infrared sensor can judge whether the earphone is inserted into the ear or not through infrared detection. For a capacitive sensor, as shown in fig. 25, when the headset is at some close distance near ear skin 2520, parasitic capacitance 2530 is caused to increase significantly; at this time, the capacitive sensor 2510 will obtain a sensing signal to the processing unit, and the processing unit performs recognition through a software algorithm to complete the functions of wearing detection and the like.
Multiple sensing technologies may be used in combination, for example, one may be the primary sensing technology and the other may be the secondary sensing technology. That is to say, the piezoresistive sensing technology in the embodiment of the present invention can be applied not only to an earphone for pressure detection as a main sensing technology, but also to an earphone for infrared sensing or an earphone for capacitance sensing as an auxiliary sensing technology.
Alternatively, in one embodiment of the present application, as shown in FIG. 25, multiple pressure sensors 2550 may be disposed on the back side of the headset (finger 2540 touch position in FIG. 25). In one aspect, when finger 2540 touches this area, capacitive sensor 2510 is brought closer to skin 2520, creating a new key operation. On the other hand, with the multi-dimensional pressure effect of the multi-pressure sensor 2550, operations such as tapping, double-tapping, re-pressing, sliding and the like can be received, multi-dimensional sensing signals are acquired through the multi-pressure sensor 2550, so that a post-stage processing unit identifies the multi-dimensional sensing signals through a software algorithm, and finally different key functions can be realized.
Optionally, in an embodiment of the present application, as shown in fig. 26, a silicone sleeve 2610 in the earphone is a conductive silicone, and the silicone can be arranged into a capacitive sensor, so that a capacitance value contacting with skin can be increased to correspondingly increase the sensitivity of the capacitive sensor.
It should be understood that the technical solutions of the embodiments of the present application are not limited to the earphone shape or form described in the above embodiments, but all earphone shapes or forms suitable for various sensor applications.
The embodiment of the present application further provides a chip, where the chip may be used to implement the processing unit in the earphone of the embodiment of the present application, and may have a function of the processing unit.
The embodiment of the application also provides an electronic device, and the electronic device can comprise the earphone of the various embodiments of the application.
The headset, the chip, and the electronic device according to the embodiments of the present application are described above, and the method for detecting the wearing state of the headset according to the embodiments of the present application is described below. It should be understood that the method for detecting a wearing state of an earphone according to the embodiment of the present application may be implemented by the earphone according to the embodiment of the present application or the processing unit therein, where reference may be made to the foregoing embodiments for specific description, and for brevity, no further description is provided below.
Fig. 27 shows a schematic flow chart of a method 2700 of detecting a wearing state of a headset according to an embodiment of the present application. The method 2700 may be performed by the headset of the embodiments of the present application or a processing unit therein as previously described. As shown in fig. 27, the method 2700 may include:
2710, acquiring pressure signals of at least one pressure sensor, wherein the at least one pressure sensor comprises a first pressure sensor set, the first pressure sensor set comprises one or more pressure sensors, and the pressure sensors in the first pressure sensor set are arranged in an ear entering area of the earphone;
2720, determining the wearing state of the earphone according to the pressure signal.
Optionally, in an embodiment of the present application, if one or more pressure sensors in the first set of pressure sensors do not acquire a pressure signal, it is determined that the headset is not worn.
Optionally, in an embodiment of the present application, the at least one pressure sensor is disposed in at least two different areas of the headset.
Optionally, in an embodiment of the present application, the at least one pressure sensor further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
Optionally, in an embodiment of the present application, a wearing state of the headset may be determined according to pressure signals obtained by one or more pressure sensors in the first set of pressure sensors and pressure signals obtained by one or more pressure sensors in the second set of pressure sensors.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set and it is determined that pressure exists in the ear entrance area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is worn into the ear
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure in the ear entrance area of the earphone disappears according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is taken out of the ear.
Optionally, in an embodiment of the present application, a key function may be implemented according to the pressure signal.
Optionally, in an embodiment of the present application, the headset further includes an infrared sensor and/or a capacitive sensor;
the wearing state of the headset can be determined according to the detection signal of the infrared sensor and/or the capacitance sensor and the pressure signal.
Optionally, in an embodiment of the present application, an operation associated with the headset being worn into the ear may be performed upon determining that the headset is worn into the ear; alternatively, the first and second electrodes may be,
performing an operation associated with the earphone being extracted when it is determined that the earphone is extracted.
It should be understood that the specific examples are provided herein only to assist those skilled in the art in better understanding the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as touch hardware, computer software, or combinations of both, and that the components and steps of the various examples have been described in a functional generic sense in the foregoing description for the purpose of clearly illustrating interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electrical, mechanical or other form of connection.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the elements may be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk, and various media capable of storing program codes.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (11)

1. An earphone, comprising:
a plurality of pressure sensors for acquiring pressure signals, the plurality of pressure sensors being disposed at least two of: the upper side and the lower side of the inner side and the material of the same area of the shell structure of the earphone are respectively provided with a plurality of holes;
the processing unit is used for realizing the key function according to the pressure signal;
wherein the plurality of pressure sensors comprises a first set of pressure sensors comprising a plurality of pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the earphone;
the plurality of pressure sensors comprises a second set of pressure sensors comprising a plurality of pressure sensors, the pressure sensors of the second set of pressure sensors being disposed in a hand-held area of the headset;
the plurality of pressure sensors includes a third set of pressure sensors including a plurality of pressure sensors, the pressure sensors of the third set of pressure sensors being disposed on a rear side of an in-ear region of the earphone.
2. The headset of claim 1, wherein the plurality of pressure sensors includes a first pressure sensor, a second pressure sensor, and a third pressure sensor, the first pressure sensor, the second pressure sensor, and the third pressure sensor being disposed on an inner side, an outer side, and in a material, respectively, of a same area of a housing structure of the headset, the first pressure sensor, the second pressure sensor, and the third pressure sensor forming a triple pressure sensor;
and the processing unit is used for realizing the key function according to the pressure signals of the triple pressure sensors.
3. A headset according to claim 1 or 2, characterized in that the key functions comprise at least one of the following operating corresponding functions: flick, double click, tap, and slide.
4. The headset of claim 1, wherein the pressure sensors of the first set of pressure sensors are disposed at an ear plug, a post, or a barrel of the headset in the in-ear region of the headset.
5. The headset of claim 1, wherein the pressure sensors of the second set of pressure sensors are disposed at a headset sleeve of a hand-held area of the headset.
6. The earphone according to claim 5, wherein the outer side of the area of the earphone sleeve where the pressure sensor is arranged is provided with a touch convex structure, a touch concave structure or a touch particle point.
7. The headset of claim 1 or 2, wherein the plurality of pressure sensors are resistive pressure sensors.
8. The headset according to claim 1 or 2, wherein the plurality of pressure sensors are arranged on the inner or outer side of the housing structure of the headset by means of a glue or in the material of the housing structure of the headset by means of an injection moulding.
9. The earphone according to claim 8, wherein the adhesive is foam.
10. A headset according to claim 1 or 2, characterized in that the headset is an in-ear headset or an ear bud headset.
11. An electronic device, characterized in that it comprises a headset according to any of claims 1 to 10.
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