CN111968936B - Full-metallization packaging structure of butterfly-shaped semiconductor device - Google Patents
Full-metallization packaging structure of butterfly-shaped semiconductor device Download PDFInfo
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- CN111968936B CN111968936B CN202011143042.2A CN202011143042A CN111968936B CN 111968936 B CN111968936 B CN 111968936B CN 202011143042 A CN202011143042 A CN 202011143042A CN 111968936 B CN111968936 B CN 111968936B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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Abstract
The invention discloses a full-metallization packaging structure of a butterfly semiconductor device, which comprises a table board and a packaging machine, wherein a sliding groove is formed in the table board, a through hole is formed in the bottom of the sliding groove, a conveying plate is connected onto the sliding groove in a sliding mode, rubber pads are symmetrically welded and fixed on the side wall of the conveying plate, a fixed block is welded and fixed on the side wall of the table board, a motor is welded and fixed on the side wall of the fixed block through a folding rod, a rotating shaft is welded and fixed at the output end of the motor, a first gear and a driving roller are sequentially welded and fixed on the rotating shaft, a rotating rod is rotatably connected to the upper portion of the fixed block, a second gear and a driven roller are sequentially welded and fixed on the side wall of the rotating rod, the second gear is meshed with the first gear, the packaging machine is fixedly. Has the advantages that: through setting up structures such as a plurality of gears, transport plate and drive roll, the intermittent type formula pay-off in order, and make packaging process heat dispersion good.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to an all-metallization packaging structure of a butterfly-shaped semiconductor device.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous wafer process is cut into small chips through a scribing process, then the cut chips are pasted on corresponding small islands of a substrate frame through glue, and bonding pads of the chips are connected to corresponding pins of the substrate through superfine metal (gold tin copper aluminum) wires or conductive resin to form a required circuit.
The encapsulation of semiconductor can use the packaging machine to encapsulate, often places the manual work at present and gets into the packaging machine in the semiconductor equipment, and encapsulation efficiency is low, can produce certain heat at the in-process of encapsulation, because the stress that produces and the stress that produces because the chip generates heat such as external environment changes such as heat, leads to the chip to damage easily for the defective rate of product encapsulation rises.
Therefore, the butterfly-shaped semiconductor device full-metallization packaging structure is provided.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, the packaging efficiency is low when a packaging machine is manually used, and the temperature in the packaging process is not easy to control, and provides an all-metallized packaging structure of a butterfly-shaped semiconductor device.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a full metallization packaging structure of butterfly semiconductor device, includes mesa and packaging machine, the spout has been seted up in the mesa, the through-hole has been seted up to the bottom of spout, sliding connection has the transport plate on the spout, transport plate lateral wall symmetry welded fastening has the rubber pad, the lateral wall welded fastening of mesa has the fixed block, the lateral wall of fixed block has the motor through folding rod welded fastening, the output welded fastening of motor has the pivot, welded fastening has first gear and drive roll in proper order in the pivot, fixed block upper portion rotates and is connected with the bull stick, the bull stick lateral wall welded fastening has second gear and driven voller in proper order, second gear and first gear engagement are connected, packaging machine fixed connection is in the mesa upper end, the packaging machine internal rotation is connected with carries out radiating negative pressure part to the semiconductor.
In the fully-metallized packaging structure of the butterfly-shaped semiconductor device, the side wall of the driving roller is fixedly welded with an upper rubber block, the side wall of the driven roller is fixedly welded with a lower rubber block, and the upper rubber block and the lower rubber block are both of arc structures.
In the full-metallization packaging structure of the butterfly-shaped semiconductor device, the side wall of the packaging machine is provided with a vent hole, a rectangular block is welded and fixed in the vent hole, and the side wall of the rectangular block is rotatably connected with a reciprocating lead screw.
In the fully-metallized packaging structure of the butterfly-shaped semiconductor device, the negative pressure component comprises a negative pressure fan welded and fixed on the side wall of the reciprocating lead screw, the negative pressure fan is arranged on the side wall of the reciprocating lead screw in the ventilation hole, the side wall of the reciprocating lead screw is in threaded connection with a nut, and the side wall of the nut is welded and fixed with a driving component for performing air injection and heat dissipation on the inside of the packaging machine.
In the fully-metallized packaging structure of the butterfly-shaped semiconductor device, the driving part comprises a circulating box welded and fixed on the table board, push rods are symmetrically welded and fixed on the side wall of the nut, a piston is welded and fixed after the push rods penetrate through the circulating box, and the piston is connected in the circulating box in a sealing and sliding manner.
In the full-metallization packaging structure of the butterfly-shaped semiconductor device, the side wall of the circulation box is symmetrically provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are internally provided with one-way valves.
In the full-metallization packaging structure of the butterfly semiconductor device, the side wall of the packaging machine, which is far away from the reciprocating lead screw, is fixedly provided with a plurality of air injection pipes in a penetrating and welding mode, and the air injection pipes are fixedly communicated with the air outlet through hoses.
In the full-metallization packaging structure of the butterfly-shaped semiconductor device, the side wall of the rotating rod is fixedly welded with the driving wheel, the side wall of the reciprocating lead screw is fixedly welded with the driven wheel, the driven wheel is positioned on the side wall of the reciprocating lead screw between the negative pressure fan and the nut, and the driving wheel and the driven wheel are connected through the synchronous belt.
In the full-metallization packaging structure of the butterfly-shaped semiconductor device, a plurality of first grooves are formed in the top of the conveying plate, a plurality of second grooves are formed in the side wall of the conveying plate, the first grooves and the second grooves are square hole grooves, each first groove is communicated with one corresponding second groove, the first grooves and the second grooves are in an L-shaped structure when viewed from the side, and electric push rods are fixedly welded on the side wall of the table board in a penetrating mode.
In foretell butterfly semiconductor device full metallization packaging structure, every equal sliding connection has first wedge in the first recess, every equal sliding connection has the second wedge in the second recess, first wedge and second wedge offset, every the top welded fastening of second wedge has reset spring, reset spring keeps away from the one end welded fastening of second wedge at second recess top.
Compared with the prior art, the invention has the advantages that:
1. through the arrangement of a plurality of gears, a plurality of rubber blocks, a driving roller, a conveying plate and other structures, the output end of the motor drives the rotating shaft to rotate, so that the rotating shaft drives the first gear and the driving roller to rotate, the first gear drives the second gear which is in meshed connection to rotate, and the second gear drives the rotating rod and the driven roller to synchronously rotate, in the process of rotating the driving roller, the upper rubber block is abutted against the rubber pad at the top of the conveying plate, the lower rubber block is abutted against the rubber pad at the bottom of the conveying plate, a certain friction force is formed between the rubber pad and the plurality of rubber blocks, thereby the upper rubber block and the lower rubber block drive the rubber pad and the conveying plate to slide in the chute together, the process is intermittent sliding conveying, the sliding distances of the conveying plates are consistent each time, so that the semiconductor equipment on the conveying plates is fed intermittently, and the semiconductor equipment can be conveniently packaged by a packaging machine at a fixed position;
2. through the arrangement of the reciprocating screw rod, the nut, the circulating box, the negative pressure fan, the air jet pipe and other structures, when the piston slides in the circulating box in a sealing manner, when the piston extrudes the air in the circulating box, the air in the circulating box flows into the hose from the air outlet hole and then flows into the air jet pipe from the hose, and the semiconductor equipment is subjected to jet cooling from the air jet pipe, so that the cooling speed of the semiconductor equipment is accelerated, the cooling effect is obvious, and meanwhile, a cooling wind path which is formed by jetting air from one side of the semiconductor equipment for cooling and being drawn away by the negative pressure fan from the other side after passing through the semiconductor equipment is formed;
3. through setting up the action wheel, from driving wheel and hold-in range isotructure, when the bull stick rotated, through the action wheel, drive reciprocal lead screw rotation from driving wheel and hold-in range to accomplish the transmission of power, avoid setting up a plurality of power input equipment, reduce production and use cost.
Drawings
Fig. 1 is a front view of a butterfly-shaped semiconductor device full-metallization package structure according to the present invention;
fig. 2 is a rear view of an all-metallized package structure of a butterfly-shaped semiconductor device according to the present invention;
fig. 3 is a cross-sectional view of a side a-a of a butterfly semiconductor device full-metallization package structure according to the present invention;
FIG. 4 is a perspective view of a mesa and runner portion of a fully metallized package structure for a butterfly semiconductor device in accordance with the present invention;
fig. 5 is a perspective view of a transportation plate and a rubber pad of an all-metallized packaging structure for a butterfly-shaped semiconductor device according to the present invention.
In the figure: 1 table top, 2 chutes, 3 transport plates, 4 rubber pads, 5 through holes, 6 fixed blocks, 7 folding rods, 8 motors, 9 rotating shafts, 10 first gears, 11 second gears, 12 rotating rods, 13 driving wheels, 14 driven wheels, 15 synchronous belts, 16 driven rollers, 17 upper rubber blocks, 18 lower rubber blocks, 19 vent holes, 20 rectangular blocks, 21 negative pressure fans, 22 nuts, 23 circulating boxes, 24 push rods, 25 pistons, 26 air inlet holes, 27 air outlet holes, 28 air injection pipes, 29 driving rollers, 30 reciprocating lead screws, 31 packaging machines, 32 electric push rods, 33 first grooves, 34 second grooves, 35 second wedge blocks and 36 first wedge blocks.
Detailed Description
The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
Examples
Referring to fig. 1-5, an all-metallized packaging structure for a butterfly-shaped semiconductor device comprises a table board 1 and a packaging machine 31, wherein a sliding groove 2 is formed in the table board 1, a through hole 5 is formed in the bottom of the sliding groove 2, a conveying plate 3 is connected to the sliding groove 2 in a sliding mode, rubber pads 4 are symmetrically welded and fixed to the side wall of the conveying plate 3, a fixing block 6 is welded and fixed to the side wall of the table board 1, a motor 8 is welded and fixed to the side wall of the fixing block 6 through a folding rod 7, a rotating shaft 9 is welded and fixed to the output end of the motor 8, a first gear 10 and a driving roller 29 are sequentially welded and fixed to the rotating shaft 9, a rotating rod 12 is rotatably connected to the upper portion of the fixing block 6, a second gear 11 and a driven roller 16 are sequentially welded and fixed to the side wall of the rotating rod 12, the second gear 11 is meshed with.
The lateral wall welded fastening of drive roll 29 has last block rubber 17, driven voller 16 lateral wall welded fastening has lower block rubber 18, it is the arc structure with lower block rubber 18 to go up block rubber 17, at drive roll 29 pivoted in-process, it offsets with the rubber pad 4 at transport plate 3 top to go up block rubber 17, simultaneously block rubber 18 offsets with the rubber pad 4 of transport plate 3 bottom down, certain frictional force has between rubber pad 4 and a plurality of block rubber, thereby go up block rubber 17, lower block rubber 18 drives rubber pad 4 and transport plate 3 and slides in spout 2 jointly, this process is intermittent type's slip, and gliding distance is unanimous at every turn, make the semiconductor equipment on the transport plate 3 carry out intermittent type pay-off, make things convenient for packaging machine 31 to encapsulate at fixed position semiconductor equipment.
The side wall of the packaging machine 31 is provided with a vent hole 19, a rectangular block 20 is fixedly welded in the vent hole 19, the side wall of the rectangular block 20 is rotatably connected with a reciprocating lead screw 30, the vent hole 19 is used for extracting hot air in the packaging machine 31, the reciprocating lead screw 30 rotates on the side wall of the rectangular block 20, so that a nut 22 on the side wall of the reciprocating lead screw 30 is driven to do reciprocating motion, the bottom of the nut 22 is abutted against the top of the table board 1, and rotation is not generated, so that the nut 22 can only do reciprocating motion.
The negative pressure part comprises a negative pressure fan 21 welded and fixed on the side wall of the reciprocating lead screw 30, the negative pressure fan 21 is arranged on the side wall of the reciprocating lead screw 30 in the vent hole 19, the side wall of the reciprocating lead screw 30 is in threaded connection with a nut 22, the side wall of the nut 22 is welded and fixed with a driving part for performing air injection and heat dissipation on the inside of the packaging machine 31, and when the reciprocating lead screw 30 rotates, the negative pressure fan 21 is driven to rotate, so that hot air in the packaging machine 31 is pumped out by the negative pressure fan 21, the gas circulation in the packaging machine 31 is accelerated, and the heat dissipation in the packaging machine.
The driving part comprises a circulating box 23 welded and fixed on the table board 1, push rods 24 are symmetrically welded and fixed on the side wall of the nut 22, a piston 25 is welded and fixed on the push rod 24 after penetrating through the circulating box 23, the piston 25 is connected in the circulating box 23 in a sealing and sliding mode, the nut 22 drives the push rod 24 and the piston 25 to synchronously move when the side wall of the reciprocating lead screw 30 reciprocates, therefore, the piston 25 reciprocates and slides in the circulating box 23 in a sealing mode, and the piston 25 extrudes and supplements gas in the circulating box 23.
An air inlet hole 26 and an air outlet hole 27 are symmetrically formed in the side wall of the circulation box 23, one-way valves are arranged in the air inlet hole 26 and the air outlet hole 27, the one-way valve in the air inlet hole 26 only allows outside air to enter the circulation box 23, and the one-way valve in the air outlet hole 27 only allows the air in the circulation box 23 to flow into the air injection pipe 28 through a hose.
The lateral wall of packaging machine 31, the lead screw 30 that keeps away from reciprocating, runs through welded fastening and has a plurality of jet-propelled pipes 28, jet-propelled pipe 28 passes through hose and exhaust vent 27 fixed intercommunication, when piston 25 is sealed gliding in circulation case 23, when piston 25 extrudees the gas in circulation case 23, the gas in circulation case 23 circulates to the hose from exhaust vent 27, and then in hose circulation to jet-propelled pipe 28, carry out the jet cooling to semiconductor equipment from jet-propelled pipe 28, accelerate the cooling rate of semiconductor equipment, the cooling effect is obvious, the wind path circulation that has formed simultaneously from the jet-propelled cooling of semiconductor equipment one side, after passing semiconductor equipment, the opposite side is taken out by negative pressure fan 21.
The lateral wall welded fastening of bull stick 12 has the action wheel 13, reciprocal lead screw 30 lateral wall welded fastening has from driving wheel 14, it is located reciprocal lead screw 30 on the lateral wall between negative pressure fan 21 and nut 22 to follow driving wheel 14, connect through hold-in range 15 between action wheel 13 and the follow driving wheel 14, when bull stick 12 rotates, through the action wheel 13, drive reciprocal lead screw 30 rotation from driving wheel 14 and hold-in range 15 drive, thereby accomplish the transmission of power, avoid setting up a plurality of power input equipment, reduce production and use cost.
A plurality of first recesses 33 have been seted up at the top of transport plate 3, a plurality of second recesses 34 have been seted up to the lateral wall of transport plate 3, first recess 33 and second recess 34 are square hole groove, every first recess 33 all communicates with a corresponding second recess 34, first recess 33 and second recess 34 are L font structure from the side of looking, the lateral wall of mesa 1 runs through welded fastening and has electric putter 32, electric putter 32 chooses for use the electric putter of DTY-100 model, when transport plate 3 conveying finishes being in quiescent condition, electric putter 32's expansion end and a second wedge 35 correspond and offset.
A first wedge block 36 is connected in each first groove 33 in a sliding manner, a second wedge block 35 is connected in each second groove 34 in a sliding manner, the first wedge block 36 abuts against the second wedge block 35, a reset spring is fixedly welded at the top of each second wedge block 35, one end, far away from the second wedge block 35, of the reset spring is fixedly welded at the top of the second groove 34, a semiconductor device is placed on the first wedge block 36 in the first groove 33, and after the movable end of the electric push rod 32 abuts against the second wedge block 35 correspondingly, the second wedge block 35 is pushed to slide in the second groove 34, therefore, the second wedge-shaped block 35 pushes the first wedge-shaped block 36, the first wedge-shaped block 36 drives the semiconductor device to move upwards together, the packaging operation of the semiconductor device by the packaging machine 31 is facilitated, and the reset spring enables the second wedge-shaped block 35 to restore to the original position after the thrust of the electric push rod 32 is lost.
In the invention, the packaging machine 31 is the prior art, which is not described herein, when the structure is used, firstly, the semiconductor device to be packaged is placed on the first wedge-shaped block 36 in the first groove 33 on the top of the transport plate 3, the first groove 33 is uniformly formed, the semiconductor device is fixed and limited, the motor 8 is turned on, the motor 8 in the device is a Y80M2-2 motor, the output end of the motor 8 drives the rotating shaft 9 to rotate, so that the rotating shaft 9 drives the first gear 10 and the driving roller 29 to rotate, the first gear 10 drives the second gear 11 in meshed connection to rotate, and then the second gear 11 drives the rotating rod 12 and the driven roller 16 to synchronously rotate, in the process of rotating the driving roller 29, the upper rubber block 17 abuts against the rubber pad 4 on the top of the transport plate 3, meanwhile, the lower rubber block 18 abuts against the rubber pad 4 on the bottom of the transport plate 3, and a certain friction force exists between the rubber pads 4 and a plurality of rubber blocks, thereby go up rubber block 17, lower rubber block 18 and drive rubber pad 4 and transport plate 3 jointly and slide in spout 2, this process is intermittent type nature slip transport, and gliding distance at every turn is unanimous for semiconductor equipment on the transport plate 3 carries out intermittent type pay-off, makes things convenient for packaging machine 31 to encapsulate the location at fixed position semiconductor equipment.
When the intermittent motion of transport plate 3 stops, the expansion end of electric putter 32 corresponds the counterbalance with second wedge 35 just, and electric putter 32 promotes second wedge 35 and slides in second recess 34 to make second wedge 35 promote first wedge 36, first wedge 36 drives semiconductor equipment and upwards moves jointly, makes things convenient for packaging machine 31 to the semiconductor equipment and encapsulates the operation.
When the rotating rod 12 rotates, the driving wheel 13, the driven wheel 14 and the synchronous belt 15 drive the reciprocating lead screw 30 to rotate, and when the reciprocating lead screw 30 rotates, the negative pressure fan 21 is driven to rotate, so that hot air in the packaging machine 31 is pumped out by the negative pressure fan 21, the air circulation in the packaging machine 31 is accelerated, the heat dissipation in the packaging machine 31 is facilitated, and the performance of a semiconductor device is prevented from being influenced by overhigh temperature.
When the reciprocating screw rod 30 rotates, the nut 22 in threaded connection on the side wall of the reciprocating screw rod 30 reciprocates, the bottom of the nut 22 abuts against the top of the table top 1, so that the nut 22 does not rotate, the nut 22 can only reciprocate, the nut 22 drives the push rod 24 and the piston 25 to synchronously move, so that the piston 25 slides in the circulating box 23 in a reciprocating and sealing manner, the piston 25 extrudes and supplements air in the circulating box 23, the side wall of the circulating box 23 is symmetrically provided with an air inlet hole 26 and an air outlet hole 27, a one-way valve in the air inlet hole 26 only allows external air to enter the circulating box 23 for supplementing air, and a one-way valve in the air outlet hole 27 only allows the air in the circulating box 23 to flow into the air injection pipe 28 through a hose.
When the piston 25 slides in the circulation box 23 in a sealing manner, when the piston 25 extrudes the gas in the circulation box 23, the gas in the circulation box 23 flows into the hose from the air outlet hole 27, and then flows into the air injection pipe 28 from the hose, and the semiconductor equipment is subjected to jet cooling from the air injection pipe 28, so that the cooling speed of the semiconductor equipment is increased, the cooling effect is obvious, meanwhile, the cooling air passage for injecting air from one side of the semiconductor equipment is formed, and the cooling air passage for extracting the gas from the other side of the semiconductor equipment by the negative pressure fan 21 after passing through the semiconductor equipment is formed, the stress generated by external environmental changes such as heat in the packaging process and the stress generated by chip heating are avoided, the chip damage is avoided, and the reject ratio of product packaging is reduced.
Although the terms of the table top 1, the chute 2, the transport plate 3, the rubber pad 4, the through hole 5, the fixing block 6, the folding rod 7, the motor 8, the rotating shaft 9, the first gear 10, the second gear 11, the rotating rod 12, the driving wheel 13, the driven wheel 14, the synchronous belt 15, the driven roller 16, the upper rubber block 17, the lower rubber block 18, the vent hole 19, the rectangular block 20, the negative pressure fan 21, the nut 22, the circulating box 23, the push rod 24, the piston 25, the air inlet hole 26, the air outlet hole 27, the air injection pipe 28, the driving roller 29, the reciprocating lead screw 30, the packaging machine 31, the electric push rod 32, the first groove 33, the second groove 34, the second wedge-shaped block 35, the first wedge-shaped block 36, etc. are used more often, the possibility of using other terms is. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (7)
1. The utility model provides a full metallization packaging structure of butterfly semiconductor device, includes mesa (1) and packaging machine (31), its characterized in that, seted up spout (2) in mesa (1), through-hole (5) have been seted up to the bottom of spout (2), sliding connection has transport plate (3) on spout (2), transport plate (3) lateral wall symmetry welded fastening has rubber pad (4), the lateral wall welded fastening of mesa (1) has fixed block (6), the lateral wall of fixed block (6) has motor (8) through folding rod (7) welded fastening, the output welded fastening of motor (8) has pivot (9), welded fastening has first gear (10) and drive roll (29) in proper order on pivot (9), fixed block (6) upper portion rotates and is connected with bull stick (12), bull stick (12) lateral wall welded fastening has second gear (11) and driven voller (16) in proper order, the second gear (11) is meshed with the first gear (10) in a connecting mode, the packaging machine (31) is fixedly connected to the upper end of the table board (1), a negative pressure component for dissipating heat of the semiconductor is connected in the packaging machine (31) in a rotating mode, a plurality of first grooves (33) are formed in the top of the conveying plate (3), a plurality of second grooves (34) are formed in the side wall of the conveying plate (3), the first grooves (33) and the second grooves (34) are both square hole grooves, each first groove (33) is communicated with one corresponding second groove (34), the first grooves (33) and the second grooves (34) are in an L-shaped structure when viewed from the side face, and an electric push rod (32) is fixedly welded to the side wall of the table board (1) in a penetrating mode;
a vent hole (19) is formed in the side wall of the packaging machine (31), a rectangular block (20) is fixedly welded in the vent hole (19), and a reciprocating screw rod (30) is rotatably connected to the side wall of the rectangular block (20);
the negative pressure part comprises a negative pressure fan (21) welded and fixed on the side wall of the reciprocating lead screw (30), the negative pressure fan (21) is arranged on the side wall of the reciprocating lead screw (30) in the vent hole (19), the side wall of the reciprocating lead screw (30) is in threaded connection with a nut (22), and the side wall of the nut (22) is welded and fixed with a driving part for performing air injection and heat dissipation on the inside of the packaging machine (31).
2. The full-metallization packaging structure of the butterfly-shaped semiconductor device, as recited in claim 1, wherein an upper rubber block (17) is welded and fixed to a side wall of the driving roller (29), a lower rubber block (18) is welded and fixed to a side wall of the driven roller (16), and both the upper rubber block (17) and the lower rubber block (18) are of an arc-shaped structure.
3. The full-metallization packaging structure of the butterfly-shaped semiconductor device, as recited in claim 1, wherein the driving component comprises a circulation box (23) welded and fixed on the table top (1), push rods (24) are symmetrically welded and fixed on side walls of the nut (22), a piston (25) is welded and fixed after the push rods (24) penetrate through the circulation box (23), and the piston (25) is hermetically and slidably connected in the circulation box (23).
4. The full-metallization packaging structure of the butterfly-shaped semiconductor device, as recited in claim 3, wherein the side wall of the circulation box (23) is symmetrically provided with an air inlet hole (26) and an air outlet hole (27), and the air inlet hole (26) and the air outlet hole (27) are both provided with a one-way valve therein.
5. The full-metallization packaging structure of the butterfly-shaped semiconductor device, as recited in claim 1, wherein a plurality of gas nozzles (28) are fixedly welded through a side wall of the packaging machine (31) away from the reciprocating lead screw (30), and the gas nozzles (28) are fixedly communicated with the air outlet (27) through a hose.
6. The full-metallization packaging structure of the butterfly-shaped semiconductor device, as set forth in claim 1, wherein a driving wheel (13) is welded and fixed to a side wall of the rotating rod (12), a driven wheel (14) is welded and fixed to a side wall of the reciprocating lead screw (30), the driven wheel (14) is located on a side wall of the reciprocating lead screw (30) between the negative pressure fan (21) and the nut (22), and the driving wheel (13) and the driven wheel (14) are connected through a synchronous belt (15).
7. The full-metallization packaging structure of the butterfly-shaped semiconductor device, according to claim 1, wherein a first wedge block (36) is slidably connected in each first groove (33), a second wedge block (35) is slidably connected in each second groove (34), the first wedge block (36) and the second wedge block (35) are abutted, a return spring is fixedly welded to the top of each second wedge block (35), and one end of the return spring, which is far away from the second wedge block (35), is fixedly welded to the top of the second groove (34).
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| US6739498B2 (en) * | 2001-05-17 | 2004-05-25 | Intel Corporation | Solder ball attachment system |
| CN101767235B (en) * | 2009-12-31 | 2012-05-23 | 天津必利优科技发展有限公司 | Infrared ray welding device for welding bar-shaped zone |
| CN204800094U (en) * | 2015-06-11 | 2015-11-25 | 深圳市鑫鸿华太阳能有限公司 | Novel solar wafer series welding machine |
| CN109256352B (en) * | 2018-10-15 | 2021-10-08 | 深圳成为控股有限公司 | Chip hot melting, welding packaging machine |
| CN210349814U (en) * | 2019-06-26 | 2020-04-17 | 江苏盐芯微电子有限公司 | Semiconductor packaging structure |
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2020
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