CN210349814U

CN210349814U - Semiconductor packaging structure

Info

Publication number: CN210349814U
Application number: CN201920981069.5U
Authority: CN
Inventors: 鲁明朕; 肖传兴; 杨亮亮
Original assignee: Jiangsu Yanxin Microelectronics Co ltd
Current assignee: Jiangsu Yanxin Microelectronics Co ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2020-04-17
Anticipated expiration: 2029-06-26

Abstract

The utility model relates to the technical field of accessory devices for producing high-precision parts, in particular to a semiconductor packaging structure; the working modes are various, the processed semiconductor finished product and the die can be conveniently separated, and the working efficiency of the device is effectively improved; the automatic feeding device comprises a machine tool, a placing rack, a high-pressure pump, a material injection gun, a first mounting rack, a second mounting rack, a stepping motor and a driving belt, wherein a placing cavity is formed in the placing rack; still include extrusion equipment, retrieve the frame, the guide plate, two sets of movable motor, two sets of bracing pieces, two sets of links, two sets of driving motor, two sets of connecting plates and two sets of springs, it is provided with the accumulator to retrieve the frame top, the accumulator internal fixation is provided with the baffle, two sets of driving motor's output all is provided with the activity roller, is provided with the fly leaf on the activity roller, the top and the bottom of spring are connected with connecting plate and spread groove respectively, are provided with the dead lever on the connecting plate.

Description

Semiconductor packaging structure

Technical Field

The utility model relates to a high accuracy part production auxiliary device's technical field especially relates to a semiconductor packaging structure.

Background

As is well known, a semiconductor package structure is a device for wrapping and sealing a product chip by using a hot melt adhesive when producing a semiconductor high-precision chip product so as to prevent the semiconductor product from being damaged in the transportation or working process to affect the work of the semiconductor product, and precision parts of the semiconductor package structure are widely used in the field; the prior semiconductor packaging structure comprises a machine tool, a placing frame, a high-pressure pump, a material injection gun, a first mounting frame, a second mounting frame, a stepping motor and a driving belt, wherein the top end of the machine tool is provided with the supporting frame, the top end of the supporting frame is connected with the bottom end of the placing frame, a placing cavity is arranged in the placing frame, the top end of the placing frame is provided with an opening, the opening is communicated with the placing cavity, a baffle is hinged at a taking and placing opening, a material conveying pipe is communicated and arranged on the placing frame and is communicated with the material injection gun, the high-pressure pump is arranged on the material conveying pipe, a valve is arranged on the material conveying pipe, the top end of the machine tool is provided with a fixing groove, the first mounting frame and the second mounting frame are respectively and fixedly arranged on the left side and the right side in the fixing groove, the, the transmission belt is sleeved on the first transmission roller and the second transmission roller; when the existing semiconductor packaging structure is used, a user opens a baffle and places hot-melt adhesive materials required by packaging work in a placement cavity, the user can place a module required by the work above a transmission belt, a stepping motor is opened to work to drive a first transmission roller to rotate and drive a second transmission roller to rotate under the transmission action of the transmission belt, the transmission belt can drive the module to move to the lower part of an injection gun in the transmission process, a valve is opened, the hot adhesive materials in the placement cavity can be sprayed into a formed packaging module through a material conveying pipe by a sprayer by utilizing high-pressure acting force generated by a high-pressure pump, and a formed finished product can be taken out after the hot adhesive materials are cooled and solidified; however, the conventional semiconductor package structure is found to have a single working mode during use, which is inconvenient for separating the processed semiconductor product from the mold, resulting in low working efficiency of the device and inconvenience for users, and thus, the reliability of the device is low.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a mode is comparatively various, and the semiconductor finished product and the mould after processing is accomplished are conveniently separated, effectively improve the work efficiency of device, offer convenience for the user to improve its semiconductor packaging structure who uses the reliability.

The utility model relates to a semiconductor packaging structure, which comprises a machine tool, a rack, a high-pressure pump, a material injection gun, a first mounting rack, a second mounting rack, a stepping motor and a driving belt, wherein the top end of the machine tool is provided with a support frame, the top end of the support frame is connected with the bottom end of the rack, a placing cavity is arranged in the rack, the top end of the rack is provided with an opening, the opening is communicated with the placing cavity, a baffle is hinged at the place where the material is placed, the rack is communicated with a material conveying pipe, the material conveying pipe is communicated with the material injection gun, the high-pressure pump is arranged on the material conveying pipe, a valve is arranged on the material conveying pipe, the top end of the machine tool is provided with a fixing groove, the first mounting rack and the second mounting rack are respectively and fixedly arranged at the left side and the right side in the fixing groove, the, the transmission belt is sleeved on the first transmission roller and the second transmission roller; the automatic feeding machine further comprises an extrusion device, a recovery frame, a guide plate, two groups of movable motors, two groups of support rods, two groups of connecting frames, two groups of driving motors, two groups of connecting plates and two groups of springs, wherein the extrusion device is fixedly arranged at the bottom end of the placing frame, a pressing plate is arranged at the bottom end of the extrusion device, the recovery frame is fixedly arranged at the right end of a machine tool, a recovery groove is formed in the top end of the recovery frame, a partition plate is fixedly arranged in the recovery groove, through holes are formed in the partition plate, the guide plate is hinged to the top end of the partition plate, the two groups of movable motors are respectively arranged on the front side and the rear side of the top end of the partition plate, the output ends of the two groups of movable motors are respectively provided with a transmission shaft, the two groups of support rods are respectively fixedly arranged, two sets of driving motor are fixed mounting respectively in the spread groove, two sets of driving motor's output all is provided with the movable roll to be provided with the fly leaf on the movable roll, the top and the bottom of spring are connected with connecting plate and spread groove respectively, be provided with the dead lever on the connecting plate, be provided with hydraulic means on the lateral wall behind the accumulator.

The utility model discloses a semiconductor packaging structure still includes electric heating board, agitator motor and two sets of baffling boards, and electric heating board fixed mounting is in the rack bottom, and agitator motor installs on the top of rack, agitator motor's output is provided with the stirring leaf, left end and the right-hand member in placing the chamber are installed respectively to two sets of baffling boards.

The utility model discloses a semiconductor packaging structure still includes arm-tie, apron and cardboard, is provided with on the recovery frame and gets and put the mouth to get and put the mouth and communicate with each other with the accumulator, the top of apron articulates on getting the lateral wall of putting the mouth, is provided with the accumulator on the preceding lateral wall of apron, and the left end and the right-hand member of arm-tie articulate respectively in on the left side wall and the right side wall of accumulator, be provided with the fixed axle on the preceding lateral wall of lathe, be provided with on the cardboard and revolve the hole, cardboard fixed mounting on the fixed axle and the lateral wall of fixed axle with revolve the inside wall contact in hole.

The utility model discloses a semiconductor packaging structure still includes two sets of slide rails and recovery board, and two sets of slide rails are fixed mounting respectively on the left side wall and the right side wall of accumulator, all be provided with spout, every group on two sets of slide rails front side and rear side in the spout all are provided with the pulley, the left end and the right-hand member of recovery board are provided with two sets of slides respectively, two sets of slides clamp respectively in two sets of spouts.

The utility model discloses a semiconductor packaging structure still includes that fan and two sets of activities are detained, and the left side and the right side of rack bottom are provided with two sets of installation poles respectively, be provided with two sets of movable grooves on the lateral wall of two sets of installation poles respectively, two sets of activities are detained and are fixed respectively on the left side wall and the right side wall of fan, and two sets of activities are detained and are inserted respectively to two sets of movable inslots.

The utility model discloses a semiconductor packaging structure still includes the transparent plate, is provided with the observation hole on the lateral wall of rack, and observe the hole and place the chamber and communicate with each other, transparent plate fixed mounting is on observing the hole.

The utility model discloses a semiconductor packaging structure still includes two sets of mounting brackets and two sets of carriages, and two sets of mounting brackets are fixed mounting respectively on the lateral wall of two sets of bracing pieces, and all be provided with the mounting groove on two sets of mounting brackets, and every group all be provided with the pulley in the mounting groove, front side and rear side on the guide plate lateral wall are installed respectively to two sets of carriages, be provided with two sets of draw-in grooves on two sets of carriages respectively, two sets of pulleys clamp respectively in two sets of draw-in grooves.

The utility model discloses a semiconductor packaging structure still includes four group's landing legs and push rods, and four group's landing legs are installed respectively in left front side, right front side, left rear side and the right rear side of lathe bottom, four group's landing leg bottoms are provided with four group's bases respectively, the bottom of four group's bases all is provided with multiunit anti-skidding line, and the front side and the rear side of lathe left end are provided with two sets of supports respectively, the front end and the rear end of push rod respectively with two sets of leg joint.

Compared with the prior art, the beneficial effects of the utility model are that: the finished product can be transported to the accumulator in the drive belt work, activity motor work can drive the transmission shaft rotation and drive two sets of bracing pieces simultaneously and remove, the bracing piece removes and can drive the guide plate and remove and make its perpendicular to horizontal direction in the accumulator, fixed plate and guide plate can carry out the rigidity to the mould, driving motor work can drive the movable roll and rotate in order to drive the removal of multiunit fly leaf, the fly leaf can drive the connecting plate and remove and drive the multiunit spring simultaneously and carry out the stay cord and warp, the spring takes place elastic deformation and can drive the dead lever and remove and strike the mould, its mode is comparatively various, the convenience is separated semiconductor finished product and mould after the processing is accomplished, effectively improve the work efficiency of device, bring the facility for the user, thereby improve its reliability in utilization.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic view of the structure within the connecting frame;

FIG. 3 is a schematic view of the construction of the mounting bracket and the pulley;

FIG. 4 is a schematic structural view of a recycling bin;

in the drawings, the reference numbers: 1. a machine tool; 2. placing a rack; 3. a high pressure pump; 4. a material injection gun; 5. a first mounting bracket; 6. a second mounting bracket; 7. a stepping motor; 8. a transmission belt; 9. a delivery pipe; 10. a second driving roller; 11. a baffle plate; 12. an extrusion device; 13. a recycling rack; 14. a baffle; 15. a support bar; 16. a connecting frame; 17. a drive motor; 18. a spring; 19. fixing the rod; 20. a partition plate; 21. a movable plate; 22. a movable motor; 23. an electrical heating plate; 24. a stirring motor; 25. a baffle plate; 26. stirring blades; 27. pulling a plate; 28. a cover plate; 29. clamping a plate; 30. a slide rail; 31. recovering the plate; 32. a slide plate; 33. a fan; 34. mounting a rod; 35. a transparent plate; 36. a mounting frame; 37. a pulley; 38. a support leg; 39. a push rod; 40. a base.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 to 4, the semiconductor packaging structure of the present invention comprises a machine tool 1, a rack 2, a high pressure pump 3, a material injection gun 4, a first mounting rack 5, a second mounting rack 6, a stepping motor 7 and a transmission belt 8, wherein the top end of the machine tool 1 is provided with a support frame, the top end of the support frame is connected with the bottom end of the rack 2, a placing cavity is arranged in the rack 2, the top end of the rack 2 is provided with an opening, the opening is communicated with the placing cavity, a baffle 11 is hinged at the place of the placing cavity, the rack 2 is provided with a material conveying pipe 9 in a communicating manner, the material conveying pipe 9 is communicated with the material injection gun 4, the high pressure pump 3 is arranged on the material conveying pipe 9, the material conveying pipe 9 is provided with a valve, the top end of the machine tool 1 is provided with a fixing groove, the first mounting rack 5 and the second mounting rack 6 are respectively, a first driving roller is arranged at the output end of the stepping motor 7, a second driving roller 10 is arranged on the second mounting frame 6, and a driving belt 8 is sleeved on the first driving roller and the second driving roller 10; the machine tool also comprises an extrusion device 12, a recovery frame 13, a guide plate 14, two groups of movable motors 22, two groups of support rods 15, two groups of connecting frames 16, two groups of driving motors 17, two groups of connecting plates and two groups of springs 18, wherein the extrusion device 12 is fixedly arranged at the bottom end of the placing frame 2, a pressing plate is arranged at the bottom end of the extrusion device 12, the recovery frame 13 is fixedly arranged at the right end of the machine tool 1, a recovery groove is arranged at the top end of the recovery frame 13, a partition plate 20 is fixedly arranged in the recovery groove, through holes are formed in the partition plate 20, the guide plate 14 is hinged to the top end of the partition plate 20, the two groups of movable motors 14 are respectively arranged at the front side and the rear side of the top end of the partition plate 20, transmission shafts are respectively arranged at the output ends of the two groups of movable motors 14, two groups of connecting grooves are respectively arranged on the side walls of the two groups of connecting frames 16, two groups of driving motors 17 are respectively and fixedly arranged in the connecting grooves, movable rollers are respectively arranged at the output ends of the two groups of driving motors 17, movable plates 21 are arranged on the movable rollers, the top ends and the bottom ends of the springs 18 are respectively connected with the connecting plates and the connecting grooves, fixed rods 19 are arranged on the connecting plates, and a hydraulic device is arranged on the rear side wall of the recovery tank; the finished product can be transported to the accumulator in the drive belt work, activity motor work can drive the transmission shaft rotation and drive two sets of bracing pieces simultaneously and remove, the bracing piece removes and can drive the guide plate and remove and make its perpendicular to horizontal direction in the accumulator, fixed plate and guide plate can carry out the rigidity to the mould, driving motor work can drive the movable roll and rotate in order to drive the removal of multiunit fly leaf, the fly leaf can drive the connecting plate and remove and drive the multiunit spring simultaneously and carry out the stay cord and warp, the spring takes place elastic deformation and can drive the dead lever and remove and strike the mould, its mode is comparatively various, the convenience is separated semiconductor finished product and mould after the processing is accomplished, effectively improve the work efficiency of device, bring the facility for the user, thereby improve its reliability in utilization.

The utility model discloses a semiconductor packaging structure, still include electric heating plate 23, agitator motor 24 and two sets of baffling boards 25, electric heating plate 23 is fixed to be installed in rack 2 bottom, agitator motor 24 is installed on the top of rack 2, the output of agitator motor 24 is provided with stirring leaf 26, two sets of baffling boards 25 are installed respectively at the left end and the right-hand member of placing the chamber; the electric heating plate can improve the temperature of the hot rubber material in the placing cavity to prevent the hot rubber material from solidifying, the stirring motor can drive the stirring blade to move, and the baffling effect of the matched baffle plate can mix and stir the hot rubber material in the placing cavity, so that the hot rubber material is prevented from precipitating.

The utility model discloses a semiconductor packaging structure, still include arm-tie 27, apron 28 and cardboard 29, be provided with on the recovery frame 13 and get and put the mouth, and get and put the mouth and communicate with each other with the accumulator, the top of apron 28 articulates on getting and putting the lateral wall of mouth, be provided with the accumulator on the preceding lateral wall of apron 28, the left end and the right-hand member of arm-tie 27 articulate respectively on the left lateral wall and the right lateral wall of accumulator, be provided with the fixed axle on the preceding lateral wall of lathe 1, be provided with the screw hole on the cardboard 29, cardboard 29 fixed mounting is on the fixed axle and the lateral wall of fixed axle contacts with the inside wall in screw hole; the apron can seal the protection placing the chamber, and the user pulling arm-tie can drive the apron and remove, and the person of facilitating the use opens or closes the apron, and the user can rotate the front side of cardboard to baffle on the fixed axle and can carry out the position to the baffle and prescribe a limit to in order to prevent that the apron from opening at the course of the work.

The utility model discloses a semiconductor packaging structure, still include two sets of slide rails 30 and recovery plate 31, two sets of slide rails 30 are fixed mounting respectively on the left side wall and the right side wall of accumulator, all are provided with the spout on two sets of slide rails 30, the front side and the rear side in each group spout all are provided with the pulley, the left end and the right-hand member of recovery plate 31 are provided with two sets of slides 32 respectively, two sets of slides 32 clamp respectively in two sets of spouts; the user can move the connecting plate to drive the recovery plate to move, and the recovery plate can drive the two groups of sliding plates to slide above the four groups of pulleys, so that the user can conveniently take and place the recovery plate, and the user can conveniently take out the semiconductor packaging finished products recovered in the recovery groove.

The utility model discloses a semiconductor packaging structure, still include fan 33 and two sets of activity are detained, the left side and the right side of rack 2 bottom are provided with two sets of installation poles 34 respectively, are provided with two sets of activity grooves on the lateral wall of two sets of installation poles 34 respectively, and two sets of activity are detained and are fixed respectively on the left lateral wall and the right lateral wall of fan 33, and two sets of activity are detained and are inserted respectively to two sets of activity grooves; the user can rotate two sets of activities on two sets of installation poles and detain the rotation angle in order to adjust the fan, and fan output wind-force can improve near operational environment's gas flow speed to improve the encapsulation off-the-shelf air-dry speed of drive belt top, thereby improve the work efficiency of device.

The utility model discloses a semiconductor packaging structure, also include the transparent plate 35, there are observation holes on the sidewall of the rack 2, and observe the hole and communicate with placing the chamber, the transparent plate 35 is fixedly mounted on observing the hole; the user can observe the storage condition of the hot glue stock in the placing cavity through the transparent plate.

The utility model discloses a semiconductor packaging structure, still include two sets of mounting brackets 36 and two sets of carriages, two sets of mounting brackets 36 are respectively fixed mounting on the lateral wall of two sets of bracing pieces 15, and all be provided with the mounting groove on two sets of mounting brackets 36, and all be provided with pulley 37 in every group mounting groove, two sets of carriages are respectively installed the front side and the rear side on guide plate 14 lateral wall, are provided with two sets of draw-in grooves on two sets of carriages respectively, two sets of pulley 37 clamp respectively in two sets of draw-in grooves; the pulley slides in the sliding frame, so that the stability of the guide plate in the movement of the recovery tank can be improved.

The utility model discloses a semiconductor packaging structure, still include four group's landing legs 38 and push rod 39, four group's landing legs 38 are installed respectively in the left front side, right front side, left rear side and the right rear side of lathe 1 bottom, four group's landing legs 38 bottoms are provided with four group's bases 40 respectively, four group's bases 40's bottom all is provided with multiunit anti-skidding line, the front side and the rear side of lathe left end are provided with two sets of supports respectively, push rod 39's front end and rear end are connected with two sets of supports respectively; the user promotes the push rod and can drive two sets of supports and drive the lathe simultaneously and remove, and the lathe removes and can drive four group's landing legs and remove to with device integral movement to suitable position, landing leg and base can improve the stability of lathe during operation.

The utility model discloses a semiconductor packaging structure, it is at the during operation, the user promotes the push rod and can drive two sets of supports and drive the lathe simultaneously and move, the lathe moves and can drive four groups of landing legs and move, so as to move the device to suitable position, landing leg and base can improve the stability of lathe during operation, the user can place the module that work needs above the drive belt, open step motor work and can drive first driving roller rotation and drive the second driving roller through the transmission of drive belt and rotate, the drive belt can drive the module and move to the below of notes material rifle in the process of carrying out the transmission, open the valve and utilize the high pressure effort that the high-pressure pump produced to spray the hot sizing material of placing the intracavity to the fashioned encapsulation module through the conveying pipeline by the sprinkler, it can to take out the fashioned finished product after the hot sizing material cools off and solidifies, drive belt work can be with the finished product transportation to the accumulator, the movable motor can drive the transmission shaft to rotate and drive the two groups of supporting rods to move simultaneously, the supporting rods can drive the guide plates to move so as to enable the guide plates to be perpendicular to the horizontal direction in the recovery tank, the fixed plate and the guide plates can fix the position of the die, the driving motor can drive the movable roller to rotate so as to drive the plurality of groups of movable plates to move, the movable plates can drive the connecting plates to move and drive the plurality of groups of springs to deform in a pulling rope mode, the springs can drive the fixed rods to move so as to knock the die, the working modes of the device are various, the processed semiconductor finished product and the die can be conveniently separated, the working efficiency of the device is effectively improved, convenience is brought to a user, the use reliability of the device is improved, the temperature of thermal sizing materials in the placing cavity can be improved by the operation of the, the hot sizing material in the placing cavity can be mixed and stirred by matching with the baffling effect of the baffle plate, thereby preventing the hot sizing material from precipitating, the placing cavity can be sealed and protected by the cover plate, a user can drive the cover plate to move by pulling the pull plate, the cover plate is convenient to open or close by the user, the user can limit the position of the baffle plate from the front side of the baffle plate by rotating the snap plate on the fixed shaft so as to prevent the cover plate from opening in the working process, the user can drive the recovery plate to move by moving the connecting plate, the recovery plate can drive the two groups of sliding plates to slide above the four groups of pulleys, thereby the user can conveniently take and place the recovery plate so as to conveniently take out the semiconductor packaging finished products recovered in the recovery tank, the user can rotate the two groups of movable buckles on the two groups of mounting rods so as to adjust the rotation angle of the fan, the air flow speed of the, thereby improve the work efficiency of device, the pulley slides in the carriage, stability when can improving the guide plate and remove in the accumulator.

In the semiconductor package structure of the present invention, unless otherwise stated, the terms "up, down, left, right, front, back, inner, and vertical, horizontal" and the like are included in the terms and are intended to represent only the orientation of the terms in the normal use state, or be a trivial term understood by those skilled in the art, and should not be considered as limiting the term, at the same time, the terms "first," "second," and "()" do not denote any particular quantity or order, but rather are used to distinguish one name from another, furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor packaging structure comprises a machine tool (1), a placing frame (2), a high-pressure pump (3), a material injection gun (4), a first mounting frame (5), a second mounting frame (6), a stepping motor (7) and a driving belt (8), wherein a supporting frame is arranged at the top end of the machine tool (1), the top end of the supporting frame is connected with the bottom end of the placing frame (2), a placing cavity is arranged in the placing frame (2), an opening is formed in the top end of the placing frame (2) and communicated with the placing cavity, a baffle (11) is hinged to a place where the placing hole is formed, a material conveying pipe (9) is arranged on the placing frame (2) in a communicated mode, the material conveying pipe (9) is communicated with the material injection gun (4), the high-pressure pump (3) is arranged on the material conveying pipe (9), a valve is arranged on the material conveying pipe (9), a fixing groove is formed in the top end of the machine tool (1), the first mounting frame (5, the stepping motor (7) is fixedly arranged on the first mounting frame (5), a first transmission roller is arranged at the output end of the stepping motor (7), a second transmission roller (10) is arranged on the second mounting frame (6), and the transmission belt (8) is sleeved on the first transmission roller and the second transmission roller (10); the machine tool is characterized by further comprising an extrusion device (12), a recovery frame (13), a guide plate (14), two groups of movable motors (22), two groups of support rods (15), two groups of connecting frames (16), two groups of driving motors (17), two groups of connecting plates and two groups of springs (18), wherein the extrusion device (12) is fixedly arranged at the bottom end of the placing frame (2), a pressing plate is arranged at the bottom end of the extrusion device (12), the recovery frame (13) is fixedly arranged at the right end of the machine tool (1), a recovery groove is formed in the top end of the recovery frame (13), a partition plate (20) is fixedly arranged in the recovery groove, a through hole is formed in the partition plate (20), the guide plate (14) is hinged and arranged at the top end of the partition plate (20), the two groups of movable motors (22) are respectively arranged at the front side and the rear side of the top end of the partition, two sets of bracing pieces (15) are fixed mounting respectively on two sets of transmission shafts, and the right-hand member of accumulator is provided with the fixed plate, and two sets of link (16) are fixed mounting respectively on the lateral wall of two sets of bracing pieces (15), be provided with two sets of spread grooves on the lateral wall of two sets of link (16) respectively, two sets of driving motor (17) are fixed mounting respectively in the spread groove, the output of two sets of driving motor (17) all is provided with the movable roller to be provided with fly leaf (21) on the movable roller, the top and the bottom of spring (18) are connected with connecting plate and spread groove respectively, be provided with dead lever (19) on the connecting plate, be provided with hydraulic means on the lateral.

2. The semiconductor packaging structure according to claim 1, further comprising an electric heating plate (23), a stirring motor (24) and two sets of baffle plates (25), wherein the electric heating plate (23) is fixedly installed at the bottom end of the placing frame (2), the stirring motor (24) is installed at the top end of the placing frame (2), the output end of the stirring motor (24) is provided with a stirring blade (26), and the two sets of baffle plates (25) are respectively installed at the left end and the right end of the placing cavity.

3. The semiconductor package structure according to claim 2, further comprising a pulling plate (27), a cover plate (28) and a clamping plate (29), wherein the recycling frame (13) is provided with a pick-and-place opening, the pick-and-place opening is communicated with the recycling slot, the top end of the cover plate (28) is hinged to the side wall of the pick-and-place opening, the front side wall of the cover plate (28) is provided with the pulling slot, the left end and the right end of the pulling plate (27) are hinged to the left side wall and the right side wall of the pulling slot respectively, the front side wall of the machine tool (1) is provided with a fixed shaft, the clamping plate (29) is provided with a screw hole, the clamping plate (29) is fixedly mounted on the fixed shaft, and the outer side wall of the fixed shaft is in contact with.

4. A semiconductor package structure according to claim 3, further comprising two sets of slide rails (30) and a recovery plate (31), wherein the two sets of slide rails (30) are respectively and fixedly mounted on the left and right side walls of the recovery tank, the two sets of slide rails (30) are respectively provided with a slide groove, the front and rear sides in each set of slide groove are respectively provided with a pulley, the left and right ends of the recovery plate (31) are respectively provided with two sets of slide plates (32), and the two sets of slide plates (32) are respectively clamped in the two sets of slide grooves.

5. The semiconductor package structure according to claim 4, further comprising a fan (33) and two sets of movable fasteners, wherein two sets of mounting rods (34) are respectively disposed on the left side and the right side of the bottom end of the placement frame (2), two sets of movable slots are respectively disposed on the sidewalls of the two sets of mounting rods (34), the two sets of movable fasteners are respectively fixed on the left sidewall and the right sidewall of the fan (33), and the two sets of movable fasteners are respectively inserted into the two sets of movable slots.

6. A semiconductor package structure as claimed in claim 5, further comprising a transparent plate (35), wherein a viewing hole is formed on a side wall of the placing frame (2), and the viewing hole is communicated with the placing cavity, and the transparent plate (35) is fixedly mounted on the viewing hole.

7. The semiconductor package structure of claim 6, further comprising two sets of mounting brackets (36) and two sets of sliding frames, wherein the two sets of mounting brackets (36) are respectively and fixedly mounted on the side walls of the two sets of support bars (15), the two sets of mounting brackets (36) are respectively provided with mounting grooves, the pulleys (37) are respectively arranged in the mounting grooves of the two sets of mounting brackets, the two sets of sliding frames are respectively mounted on the front side and the rear side of the side wall of the guide plate (14), the two sets of sliding frames are respectively provided with two sets of clamping grooves, and the two sets of pulleys (37) are respectively clamped in the two sets of clamping grooves.

8. The semiconductor package structure of claim 7, further comprising four sets of legs (38) and push rods (39), wherein the four sets of legs (38) are respectively mounted on the front left side, the front right side, the rear left side and the rear right side of the bottom end of the machine tool (1), the four sets of bases (40) are respectively disposed at the bottom ends of the four sets of legs (38), the four sets of bases (40) are respectively provided with multiple sets of anti-skid patterns at the bottom ends, two sets of brackets are respectively disposed at the front side and the rear side of the left end of the machine tool (1), and the front end and the rear end of the push rod (39) are respectively connected with the two sets of brackets.