CN111968776A - Two-stage snakelike interconnection wire structure with high durability - Google Patents
Two-stage snakelike interconnection wire structure with high durability Download PDFInfo
- Publication number
- CN111968776A CN111968776A CN202010733333.0A CN202010733333A CN111968776A CN 111968776 A CN111968776 A CN 111968776A CN 202010733333 A CN202010733333 A CN 202010733333A CN 111968776 A CN111968776 A CN 111968776A
- Authority
- CN
- China
- Prior art keywords
- wire
- shaped
- arc
- stage
- serpentine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Abstract
The invention discloses a high-durability secondary snake-shaped interconnection wire structure which comprises a plurality of sequentially connected primary snake-shaped wire structures, wherein two adjacent primary snake-shaped wire structures are connected together through an arc-shaped wire to form a secondary snake-shaped interconnection wire structure. The invention adopts the arc-shaped conducting wire with the same width as the conducting wire of the first-stage serpentine conducting wire structure to connect two adjacent first-stage serpentine conducting wire structures. When the wire is stretched, the arc-shaped wire can provide the required transverse stretching amount for stretching, so that the stretching burden on the wire material is reduced, the strain concentration inside the wire material can be reduced, the durability of the wire is improved, and compared with the connection structure of the original linear wire, the structure can provide larger stretching amount. The arc-shaped wire adopted by the structure can be prepared only by adopting the original process, and the wire is prepared by adopting a new process, so that the structure is simple and convenient to manufacture.
Description
Technical Field
The invention relates to a two-stage snakelike interconnection wire structure, in particular to a two-stage snakelike interconnection wire structure with high durability.
Background
With the continuous innovative development in the fields of medical electronics, brain-computer interfaces, solar chips, industrial electronic products and the like and the continuous improvement of the requirements of practical application scenes, the traditional planar electronic device consisting of a rigid circuit board is difficult to meet the requirements of practical application, so that the flexible electronic technology is developed at the end. Flexible electronics, also known as flex circuits, is a technology in which electronic devices are mounted on flexible plastic substrates (such as polyimide, polyetheretherketone, or polyethylene terephthalate) and special wire structures are used to assemble electronic circuits. Flexible electronics have very wide applications in the fields of industry, biology, medicine, etc. due to their unique characteristics of stretchability, deformability, and bendability. The "flexibility" of the flexible implantable device is always accompanied by a cyclic process of deformation and recovery in use. In order to prevent mechanical failure behaviors such as bending, damage and even fracture of all parts when the device is deformed, stress concentration of the lead is required to be reduced in structural design, so that the durability is improved.
In order to improve the ductility and durability of the conductive wire, the conductive wire structure in the flexible electronic often adopts a snake-shaped interconnection conductive wire structure. Wherein the self-similar serpentine wires in the serpentine interconnection wires can be expanded in multiple stages when stretched. In order to reduce the complexity of the process, a two-stage serpentine wire structure is often adopted for devices applied in a unidirectional stretching scene. However, the primary connecting area of the conventional secondary serpentine conductor structure is a straight conductor, and when the conductor is subjected to secondary deployment, strain is concentrated on the primary connecting area due to the fact that the straight conductor cannot provide a deformed tensile amount, so that the durability of the conductor is reduced.
Disclosure of Invention
The present invention is directed to solving the above problems and providing a two-level serpentine interconnection structure with high durability. This structure has improved the flexible volume of the joining region between two one-level snakelike wire structures that are connected, prevents that the straining force from concentrating on the joining region department of one-level snakelike wire structure to the durability of wire has been improved.
The purpose of the invention can be achieved by adopting the following technical scheme:
the utility model provides a snakelike interconnected wire structure of second grade of high durability, includes a plurality of one-level snakelike wire structures that connect gradually, and two adjacent one-level snakelike wire structures link together through the arc wire, form the snakelike interconnected wire structure of second grade.
The outer diameter of the arc wire is 2 mm.
The width of the arc wire and the width of the wire of the first-level snake-shaped wire structure are both 0.05 mm.
The two-stage snakelike interconnection wire structure is a copper film structure formed by sputtering, deposition and printing.
The length of the two-stage snake-shaped interconnection wire structure is 8.9 mm.
The implementation of the invention has the following beneficial effects:
the invention adopts the arc-shaped conducting wire with the same width as the conducting wire of the first-stage serpentine conducting wire structure to connect two adjacent first-stage serpentine conducting wire structures. When the wire is stretched, the arc-shaped wire can provide the required transverse stretching amount for stretching, so that the stretching burden on the wire material is reduced, the strain concentration inside the wire material can be reduced, the durability of the wire is improved, and compared with the connection structure of the original linear wire, the structure can provide larger stretching amount. The arc-shaped wire adopted by the structure can be prepared only by adopting the original process, and the wire is prepared by adopting a new process, so that the structure is simple and convenient to manufacture.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a two-stage serpentine interconnect structure of high durability in accordance with the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1, the present embodiment relates to a two-stage serpentine interconnection wire structure with high durability, which includes a plurality of one-stage serpentine wire structures 1 connected in sequence, and two adjacent one-stage serpentine wire structures 1 are connected together through an arc wire 2 to form a two-stage serpentine interconnection wire structure 3.
The structure adopts the arc-shaped wire 2 with the same width as the wire of the first-level serpentine wire structure 1 to connect two adjacent first-level serpentine wire structures 1. When the wire is stretched, the arc-shaped wire 2 can provide the required transverse stretching amount for stretching, so that the stretching burden on the wire material is reduced, and then the strain concentration inside the wire material can be reduced, so that the durability of the wire is improved, namely, compared with the connection structure of the original linear wire, the structure can provide larger stretching amount. In addition, the arc-shaped conducting wire 2 adopted by the structure can be prepared only by adopting the original process, and the conducting wire is prepared by adopting a new process, so that the structure is simple and convenient to manufacture.
The outer diameter of the arc-shaped lead 2 is 2 mm. Of course, the outer diameter of the arc-shaped wire 2 can be adjusted adaptively according to the width of the wire of the primary serpentine wire structure 1.
The width of the arc-shaped lead 2 and the width of the lead of the first-level serpentine lead structure 1 are both 0.05 mm. Of course, the outer diameter of the arc-shaped wire 2 also needs to be adjusted accordingly according to the different wire widths of the primary serpentine wire structure 1.
The two-stage snakelike interconnection lead structure 3 is a copper film structure formed by sputtering, deposition and printing. The length of the two-stage snake-shaped interconnection wire structure 3 is 8.9 mm.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (5)
1. The utility model provides a snakelike interconnection wire structure of second grade of high durability, its characterized in that includes a plurality of one-level snakelike wire structures that connect gradually, and two adjacent one-level snakelike wire structures link together through the arc wire, form the snakelike interconnection wire structure of second grade.
2. The structure of claim 1, wherein the circular arc wire has an outer diameter of 2 mm.
3. The structure of claim 2, wherein the width of the circular arc wire and the width of the primary serpentine wire are both 0.05 mm.
4. The high durability two-level serpentine interconnection wire structure of claim 3, wherein said two-level serpentine interconnection wire structure is a copper thin film structure printed by sputter deposition.
5. The high durability two-stage serpentine interconnection wire structure of claim 4, wherein the length of the two-stage serpentine interconnection wire structure is 8.9 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010733333.0A CN111968776A (en) | 2020-07-27 | 2020-07-27 | Two-stage snakelike interconnection wire structure with high durability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010733333.0A CN111968776A (en) | 2020-07-27 | 2020-07-27 | Two-stage snakelike interconnection wire structure with high durability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111968776A true CN111968776A (en) | 2020-11-20 |
Family
ID=73363128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010733333.0A Pending CN111968776A (en) | 2020-07-27 | 2020-07-27 | Two-stage snakelike interconnection wire structure with high durability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111968776A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1545749A (en) * | 2001-09-13 | 2004-11-10 | �����ɷ� | Multilevel and space-filling ground-plane for miniature and multiband antenna |
| JP3171944U (en) * | 2011-09-13 | 2011-11-24 | 五光発條株式会社 | Snake Spring |
| CN105324841A (en) * | 2013-02-06 | 2016-02-10 | 伊利诺伊大学评议会 | Self-similar and fractal design for stretchable electronics |
| CN105580207A (en) * | 2013-05-14 | 2016-05-11 | Mc10股份有限公司 | Conformal electronics including nested serpentine interconnects |
| CN109545450A (en) * | 2018-10-22 | 2019-03-29 | 清华大学 | Flexible wire, the preparation method of flexible electronic device and flexible wireless energy supply device |
-
2020
- 2020-07-27 CN CN202010733333.0A patent/CN111968776A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1545749A (en) * | 2001-09-13 | 2004-11-10 | �����ɷ� | Multilevel and space-filling ground-plane for miniature and multiband antenna |
| JP3171944U (en) * | 2011-09-13 | 2011-11-24 | 五光発條株式会社 | Snake Spring |
| CN105324841A (en) * | 2013-02-06 | 2016-02-10 | 伊利诺伊大学评议会 | Self-similar and fractal design for stretchable electronics |
| CN105340369A (en) * | 2013-02-06 | 2016-02-17 | 伊利诺伊大学评议会 | Stretchable electronic systems with containment chambers |
| CN105580207A (en) * | 2013-05-14 | 2016-05-11 | Mc10股份有限公司 | Conformal electronics including nested serpentine interconnects |
| CN109545450A (en) * | 2018-10-22 | 2019-03-29 | 清华大学 | Flexible wire, the preparation method of flexible electronic device and flexible wireless energy supply device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5230632A (en) | Dual element electrical contact and connector assembly utilizing same | |
| EP3273754B1 (en) | Stretchable cable and stretchable circuit board | |
| US10575399B2 (en) | Multilayer substrate | |
| JP6191991B2 (en) | Stretchable flexible substrate and manufacturing method thereof | |
| CN105682356B (en) | Flexible circuit board component and electronic equipment | |
| JP7249648B2 (en) | Stretchable conductive wiring material and stretchable conductive wiring module having the same | |
| US20220381409A1 (en) | Led lamp strip capable of being bent in multiple directions and lamp string structure therefor | |
| EP4060221A1 (en) | Led light strip bendable in multiple directions | |
| CN107851490B (en) | Elastic electric conductor | |
| CN111968776A (en) | Two-stage snakelike interconnection wire structure with high durability | |
| KR102286323B1 (en) | Stretchable circuit board and stretchable circuit board fabricating method | |
| CN110381665A (en) | Circuit board assemblies and electronic equipment | |
| CN107403659B (en) | FFC line structure and method for manufacturing same | |
| CN108806509B (en) | Flexible substrate, packaging connecting piece and display screen | |
| KR20180057844A (en) | Electrical connection terminal | |
| CN207427565U (en) | A kind of flexible PCB grounding assembly and mobile terminal | |
| TWI815553B (en) | Circuit structure | |
| US20030194913A1 (en) | Method and apparatus to pre-form two or more integrated connectorless cables in the flexible sections of rigid-flex printed circuit boards | |
| CN209591359U (en) | The stretchable display structure of one kind, display panel and display equipment | |
| US7193300B2 (en) | Plastic leadframe and compliant fastener | |
| CN113921493A (en) | Electronic device and manufacturing method thereof | |
| CN208369928U (en) | FPC, liquid crystal module and display | |
| CN209626871U (en) | A kind of concealed conductive structure | |
| CN110931146B (en) | Stretchable conductor circuit | |
| TWI808719B (en) | An elastic flexible printed circuit and elastomer using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201120 |
|
| RJ01 | Rejection of invention patent application after publication |