CN111967564A

CN111967564A - Logistics list, preparation method thereof, logistics package and logistics goods

Info

Publication number: CN111967564A
Application number: CN202011114968.9A
Authority: CN
Inventors: 任磊; 颜力
Original assignee: Wuzhou Online E Commerce Beijing Co ltd
Current assignee: Wuzhou Online E Commerce Beijing Co ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2020-11-20
Anticipated expiration: 2040-10-19
Also published as: CN111967564B

Abstract

One or more embodiments of the present specification provide a logistics surface sheet, a method of manufacturing the same, a logistics package, and a logistics good, the logistics surface sheet including: composite layers and electronic labels; the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the metal layer is provided with a transparent structure, and the transparent structure comprises a radio frequency window penetrating through the metal layer; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the transparent structure containing the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for large size of the electronic tag is reduced.

Description

Logistics list, preparation method thereof, logistics package and logistics goods

Technical Field

The document relates to the technical field of the Internet of things, in particular to a logistics surface sheet, a preparation method of the logistics surface sheet, logistics packages and logistics goods.

Background

At present, with the rapid development of the internet of things technology, electronic tags are rapidly developed in the field of logistics. The electronic tag generally refers to a tag having Radio Frequency Identification (RFID) capability, and based on the electronic tag, target object information identified by the electronic tag can be identified by Radio Frequency signals and relevant data can be read and written. The application of the electronic tag in the field of express logistics can shorten the operation flow, increase the throughput of a distribution/distribution center, improve the speed and accuracy of checking operation, improve the transparency of management and enable information transmission to be faster and more accurate.

At present, the mode that provides of correlation technique with electronic tags uses in express delivery commodity circulation field is directly pasted electronic tags and paper face list together. As the logistics contained in the package in the field of express logistics are various, and contain a large amount of articles such as beverages, metal and the like which seriously affect the receiving and sending effects of the radio frequency signals of the electronic tags, the goods with metal packages and the like, the radio frequency signal receiving and sending performance of the electronic tags is extremely high. In order to improve the radio frequency performance of the electronic tag, a large-sized antenna has to be used, and the increase of the antenna size leads to the increase of the production cost.

Therefore, it is desirable to provide a technical solution capable of improving the radio frequency signal transceiving performance of the electronic tag with the small-sized antenna, so as to reduce the requirement for the large size of the electronic tag.

Disclosure of Invention

One or more embodiments of the present disclosure are to provide a logistics surface sheet, a method for manufacturing the same, a logistics package, and logistics goods, which can solve the technical problem that a large-size antenna electronic tag is required in the logistics field. In order to solve the above technical problems, one or more embodiments of the present specification are implemented as follows:

in a first aspect, it is an object of one or more embodiments of the present specification to provide a logistic bill. This commodity circulation face list includes: composite layers and electronic labels;

the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the metal layer is provided with a through structure, and the through structure comprises a radio frequency window penetrating through the metal layer;

the electronic tag is adhered to the first surface paper layer or the first adhesive layer, wherein the adhering position of the electronic tag corresponds to the position of the radio frequency window, and the size of an antenna of the electronic tag is smaller than that of the metal layer;

the first surface paper layer is used for printing visual logistics information of a target object;

the first adhesive layer is used for adhering the logistics surface sheet to the logistics information display position on the target object;

the electronic tag is used for storing and transceiving electronic logistics information of the target object, and the antenna in the electronic tag can be coupled with the metal layer and used for transceiving the electronic logistics information through a radio frequency signal.

In a second aspect, it is an object of one or more embodiments of the present specification to provide a method of preparing a logistic bills. The preparation method of the logistics surface sheet comprises the following steps:

providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting and receiving electronic logistics information of a target object; and the number of the first and second groups,

providing a composite layer, wherein the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the size of the metal layer is larger than that of an antenna in the electronic tag, the metal layer is provided with a through structure, the through structure comprises a radio frequency window penetrating through the metal layer, and the first surface paper layer is used for printing visual logistics information of a target object; and the number of the first and second groups,

and adhering the electronic tag to the composite layer to obtain an logistics surface sheet, wherein the adhering position of the electronic tag corresponds to the position of the radio frequency window, and the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit the electronic logistics information through radio frequency signals.

In a third aspect, an object of one or more embodiments of the present disclosure is to provide a logistics package. The logistics package is adhered with the logistics surface sheet as described in the first aspect.

In a fourth aspect, it is an object of one or more embodiments of the present specification to provide a logistics cargo. The surface of the logistics goods or the surface of the outer package thereof is adhered with the logistics surface sheet as described in the first aspect.

One or more embodiments of the present specification provide a logistics surface sheet, a method for preparing the same, a logistics package and a logistics goods, wherein the logistics surface sheet comprises: composite layers and electronic labels; the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the metal layer is provided with a through structure, and the through structure comprises a radio frequency window penetrating through the metal layer; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

Drawings

In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in one or more of the specification, and that other drawings can be obtained by those skilled in the art without inventive exercise;

FIG. 1 is a schematic diagram of a first structural component of a flow sheet provided in one or more embodiments herein;

FIG. 2a is a schematic diagram illustrating a second structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 2b is a schematic diagram illustrating a third structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 2c is a schematic diagram illustrating a fourth structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 3 is a schematic diagram illustrating a fifth structural configuration of a drop sheet provided in one or more embodiments of the present disclosure;

FIG. 4 is a schematic diagram illustrating a sixth structural configuration of a flow sheet provided in one or more embodiments herein;

FIG. 5 is a schematic diagram of a structure in which the flow surfaces are arranged in a single array according to one or more embodiments of the present disclosure;

FIG. 6 is a schematic flow diagram of a method for producing a flow sheet provided in one or more embodiments of the present disclosure;

FIG. 7 is a schematic structural composition diagram of a composite layer provided with RF windows arranged in an array according to one or more embodiments of the present disclosure;

fig. 8 is a schematic structural composition diagram of a composite layer after an electronic label is attached according to one or more embodiments of the present disclosure;

FIG. 9 is a schematic diagram of the structure of a logistics package provided in one or more embodiments of the present disclosure;

fig. 10 is a schematic structural composition diagram of a logistics cargo provided in one or more embodiments of the present disclosure.

Detailed Description

In order to make the technical solutions in one or more embodiments of the present disclosure better understood, the technical solutions in one or more embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in one or more embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of one or more embodiments of the present disclosure, but not all embodiments. All other embodiments that can be derived by a person skilled in the art from the embodiments given in one or more of the present specification without inventive step shall fall within the scope of protection of this document.

It should be noted that one or more embodiments and features of the embodiments in the present description may be combined with each other without conflict. Reference will now be made in detail to one or more embodiments of the disclosure, examples of which are illustrated in the accompanying drawings.

One or more embodiments of the present disclosure provide a logistics surface sheet, a method for manufacturing the same, a logistics package, and logistics goods, in which a metal layer is added to the logistics surface sheet, a transparent structure including a radio frequency window is formed on the metal layer, an electronic tag is disposed corresponding to the radio frequency window, and an antenna in the electronic tag is coupled to the metal layer, so that the metal layer is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, thereby enhancing the radio frequency signal transceiving performance of the electronic tag, and thus enhancing the radio frequency signal transceiving performance without increasing the size of the electronic tag, thereby reducing the requirement of the logistics surface sheet on the large size of the electronic tag.

Fig. 1 is a schematic diagram illustrating a first structural composition of a material flow sheet according to one or more embodiments of the present disclosure, where the material flow sheet includes: a composite layer 101 and an electronic label 102;

the composite layer 101 comprises a first face paper layer 1011, a metal layer 1012 and a first glue layer 1013 arranged in sequence, wherein the metal layer 1012 is provided with a through structure, and the through structure comprises a radio frequency window 1014 penetrating through the metal layer 1012; the rf window 1014 is used to reduce the influence of the metal layer 1012 on the impedance matching of the electronic tag 102 in the logistics list from a certain value to another value, that is, the rf window 1014 is used to reduce the influence of the metal layer 1012 on the impedance matching of the electronic tag 102 in the logistics list;

wherein, the electronic tag 102 includes: in an implementation, the number of the chips 1022 included in the electronic tag 102 may be one or more than one. The electronic tag 102 is attached to the first face paper layer 1011 or the first glue layer 1013, wherein the attachment position of the electronic tag 102 corresponds to the position of the rf window 1014, and the size of the antenna 1021 of the electronic tag 102 is smaller than the size of the metal layer 1012; specifically, considering that the impedance matching network in the electronic tag 102 is shielded by the metal layer 1012, which causes impedance mismatch of the electronic tag 102, and further affects the radio frequency performance of the electronic tag 102, based on this, by opening the radio frequency window 1014 on the metal layer 1012 and setting the electronic tag 102 corresponding to the radio frequency window 1014, the effect of the metal layer 1012 on the impedance matching of the electronic tag 102 can be reduced;

the first surface paper layer 1011 is used for printing visual logistics information of a target object;

the first glue layer 1013 is configured to adhere the logistics list to a logistics information display position on the target object;

the electronic tag 102 is configured to store and transmit electronic logistics information of a target object, and an antenna 1021 in the electronic tag 102 is capable of being coupled to the metal layer 1012 and transmitting and receiving the electronic logistics information via a radio frequency signal; specifically, the electronic tag 102 is coupled with the metal layer 1012 through the radio frequency window 1014, so that a part of current on the electronic tag 102 is coupled to the metal layer 1012 to form current on the surface of the metal layer 1012, and the metal layer 1012 can participate in radiation of electromagnetic waves as a radiator of an antenna in the electronic tag 102, thereby greatly increasing the reading distance of the electronic tag 102.

In a specific implementation, in consideration of the case that the electronic tag 102 is attached to the first face paper layer 1011, the first surface of the electronic tag 102 may further be provided with a second face paper layer 1023, the second surface of the electronic tag 102 is attached to the first surface of the first face paper layer 1011 through a second glue layer 1024, and the first surface is a surface of the first face paper layer 1011 for printing visual logistics information;

the second face paper layer 1023 is used for being matched with the first face paper layer 1011 to print visual logistics information of a target object together.

The first surface paper layer 1011 can be realized by thermal paper, so that the first surface paper layer 1011 can print visual logistics information of a target object in a thermal printing mode, and the thermal printing has the advantages of high printing speed, low cost and the like, so that the use cost and the printing efficiency of the logistics list can be effectively reduced.

In addition, the first adhesive layer 1013 may be implemented by using a hot melt adhesive or an adhesive film, for example, obtained by coating the hot melt adhesive or the adhesive film on the whole surface in the preparation process of the logistics list, and the logistics list may be adhered to the logistics information display position of the target object by using the first adhesive layer 1013.

The target object may include a logistics good or a logistics package, and the logistics information display position may be an outer surface of the logistics good, an outer surface of an outer package of the logistics good, or an outer surface of the logistics package, and the like, which is not limited in the embodiment of the present application.

In specific implementation, the metal layer 1012 may be obtained by forming a metal film on one surface of the first face paper layer 1011 by using a plating process, and then forming a transparent structure on the metal film by using a die cutting process; or the metal film can be obtained by directly adopting a composite process to stick a separately prepared metal film substrate to the first surface paper layer 1011 through a glue layer and then adopting a die cutting process to form a transparent structure on the metal film; or the metal layer 1012 with the through structure is directly and separately prepared in advance, and then the metal layer 1012 is adhered to the first face paper layer 1011 by a glue layer by adopting a composite process.

In addition, since the flow sheet may be bent during use, the metal layer 1012 may be made of a metal with good ductility, such as aluminum or copper, or other metals or alloys, so as to ensure that the flow sheet still maintains intact performance after being bent for multiple times.

In addition, one of the functions of the metal layer 1012 is to couple with the antenna 1021 of the electronic tag 102 through the rf window 1014, so as to couple part of the current on the electronic tag 102 to the metal layer 1012 to form a current on the surface of the metal layer 1012, so that the metal layer 1012 can be used as a radiator of the antenna in the electronic tag 102 to participate in the radiation of the electromagnetic wave, which is equivalent to increasing the rf signal radiation area of the antenna 1021 of the electronic tag 102, and thus can be coupled with the electronic tag 102 to improve the rf performance of the electronic tag 102, so that the small-sized electronic tag 102 can also have stronger rf performance without increasing the size of the electronic tag 102, and the requirement of the logistics field on the large-sized antenna 1021 of the electronic tag 102 is reduced.

In some exemplary applications, the size of the antenna 1021 of the electronic tag 102 can still achieve the same or higher rf signal transceiving performance as that of the electronic tag 102 without adding the metal layer 1012 after reducing the size by 90% by adding the metal layer 1012, for example, in order to meet the requirement of the logistics field in the prior art, the size of the antenna 1021 of the electronic tag 102 for identifying logistics information is generally 70mm by 70mm, and after reducing the size of the antenna 1021 of the electronic tag 102 to 15mm by 20mm, the same or higher rf signal transceiving performance as that of the electronic tag 102 with 70mm by adding the metal layer 1012 can still be achieved.

In the above description, the radio frequency signal transceiving performance may include, but is not limited to, a radio frequency signal transceiving sensitivity, a reading distance, and the like, and the embodiment of the present application is not limited thereto.

It should be noted that, the electronic tag 102 provided in the embodiment of the present application may be an RFID tag using a radio frequency identification RFID technology, and may also be a tag using other wireless communication technologies, which are all applicable to the present application to achieve the purpose of the embodiment of the present application, and all of which are within the protection scope of the present application.

In one or more embodiments of the present disclosure, a metal layer 1012 is added to a logistics surface sheet, a transparent structure including a radio frequency window 1014 is formed on the metal layer 1012, the electronic tag 102 is disposed corresponding to the radio frequency window 1014, and an antenna 1021 in the electronic tag 102 is coupled to the metal layer 1012, so that the metal layer 1012 is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, and the radio frequency signal transceiving performance of the electronic tag 102 is enhanced, so that the radio frequency signal transceiving performance is enhanced without increasing the size of the electronic tag 102, and the requirement for the large size of the electronic tag 102 is reduced.

In addition, the logistics surface list provided by the embodiment of the application can be used for identifying visual logistics information so that logistics workers and recipients can check the logistics information conveniently, and can also be used for identifying electronic logistics information so that the electronic tag 102 identification equipment can read and write related electronic logistics information in a wireless communication mode, thereby playing a dual-purpose role, being beneficial to shortening logistics operation flow, increasing throughput of a distribution/distribution center, improving checking operation speed and accuracy, improving management transparency and enabling information transmission to be faster and more accurate.

Moreover, compare in the mode of pasting paper bill and electronic tags 102 respectively to commodity circulation packing or commodity circulation goods, this application embodiment is through pasting paper bill and electronic tags 102 complex together, on the one hand, can reduction in production cost, and on the other hand, only need once paste the operation during the use, can effectively improve commodity circulation staff's work efficiency.

In addition, since the antenna 1021 generally needs to be designed into a specific shape, the processing requirements in the aspects of line width, space and the like are high, and the antenna 1021 is generally processed and manufactured one by one, while the metal layer 1012 only needs to be manufactured with a through structure, and the antenna 1021 can be manufactured in batch by die cutting and the like due to a simple structure, so that the processing cost of the antenna 1021 is far higher than that of the metal layer 1012. Moreover, the larger the size of the antenna 1021 is, the longer the manufacturing cycle of the processes of die cutting, laser engraving, etching and the like for manufacturing the antenna 1021 is, so that the larger the size of the antenna 1021 is, the longer the whole processing cycle thereof is, the lower the processing efficiency is, and when the antenna 1021 is combined with the chip 1022 of the electronic tag 102, the higher the bonding difficulty is, the lower the yield is, and these factors make the manufacturing cost of the large-size electronic tag 102 far higher than that of the small-size electronic tag 102. Through practical comparison, the cost of manufacturing the logistics surface sheet by combining the small-size electronic tag 102 and the metal layer 1012 in the embodiment of the application is far lower than the cost of manufacturing the logistics surface sheet by using the large-size electronic tag 102, so that the logistics surface sheet provided by the embodiment of the application has lower cost.

Moreover, referring to the above description, since the manufacturing cycle of the small-sized electronic tag 102 is much shorter than that of the large-sized electronic tag 102, and the electronic tag 102 with a smaller size is adopted, the overall processing efficiency of the logistics sheet can be effectively improved, and therefore, the logistics sheet manufactured by adopting the small-sized electronic tag 102 in the present application also has the advantages of short processing cycle and small inventory pressure.

In addition, when the electronic tag 102 is manufactured by a chemical etching process, a large amount of chemical reagents are used, so that a large amount of chemical industrial wastewater is generated, and air is polluted, so that the larger the size of the electronic tag 102 is, the more serious the environmental pollution is caused, and the logistics surface sheet is manufactured by the electronic tag 102 with a small size, so that the problem of environmental pollution generated in the manufacturing process of the electronic tag 102 can be effectively solved, namely, the logistics surface sheet provided by the embodiment of the specification also has the technical effect of reducing the environmental pollution.

It should be noted that, in the electronic tag 102, the size of the antenna 1021 is larger than that of the chip 1022, so in some descriptions of the embodiments of the present application, the size of the electronic tag 102 can be understood as the size of the antenna 1021 of the electronic tag 102, and correspondingly, the size of the antenna 1021 of the electronic tag 102 can also be understood as the size of the electronic tag 102.

In addition, the above-mentioned large size and small size are relative concepts, and those skilled in the art can flexibly set a size threshold according to actual requirements, and a size greater than the size threshold is referred to as a large size, and a size smaller than the size threshold is referred to as a small size. For example, in some exemplary applications, the size of the antenna 1021 of the electronic tag 102 can be reduced by 90% by adding the metal layer 1012, and still achieve the same or even higher rf signal transceiving performance as the electronic tag 102 without adding the metal layer 1012, for example, in order to meet the requirement of the logistics field in the prior art, the size of the antenna 1021 of the electronic tag 102 for identifying logistics information is generally 70mm × 70mm (which can be regarded as a large size), and by adding the metal layer 1012, the size of the antenna 1021 of the electronic tag 102 can be reduced to 15mm × 20mm (which can be regarded as a small size), and still achieve the same or even higher rf signal transceiving performance as the electronic tag 102 with 70mm × 70 mm.

When the logistics surface sheet provided by the embodiment is manufactured, a manufacturing process may be that a metal film substrate (for example, an aluminum foil coiled material) and a surface paper layer substrate (for example, a thermal sensitive paper coiled material) are directly compounded, then a transparent structure penetrating through the metal film substrate is formed by a die cutting process, and then the whole sheet is coated with glue and adhered with release paper to obtain a composite layer 101; or directly compounding a metal film substrate (such as an aluminum foil coiled material) and a surface paper layer substrate (such as a thermal sensitive paper coiled material), then coating glue and sticking release paper on the whole frame, and forming a through structure penetrating through the metal film substrate, the surface paper layer substrate and the glue layer by adopting a die cutting process to obtain a composite layer 101;

then the electronic labels 102 are correspondingly adhered to the first surface paper layer 1011 of the composite layer 101 one by one according to the positions of the radio frequency windows 1014 in the transparent structure, a large number of logistics surface sheets to be used can be manufactured in batch through a slitting process, the width of the metal film substrate and the surface paper layer substrate can be 1 meter, 2 meters, 3 meters and the like, the length of the sheet may be 10 meters, 20 meters, 50 meters, etc., and the size of the sheet may be 50mm by 50mm, 70mm by 70mm, etc., which is not limited by the examples of the present application, and thus, by the method, thousands of logistics surface sheets can be manufactured at one time, the production efficiency is very high, and the production cost is reduced along with high production efficiency, so the logistics surface sheet adopting the structure has the advantages of simple preparation process, high preparation efficiency and low cost.

Based on the above exemplary description, the embodiments of the present application may be modified in various ways, and the following description is given by way of example with reference to the accompanying drawings.

In any of the above embodiments of the present application, as shown in fig. 2a, the logistics surface sheet further includes: release paper 103;

the release paper 103 is bonded to a surface of the first adhesive layer 1013 away from the first face paper layer 1011.

The release paper 103 can be made of release paper, silicone oil paper, etc., and serves to protect the first adhesive layer 1013 and facilitate transportation. The release paper 103 can be removed before use, or a plurality of rolled release paper 103 can be used after removing the desired release paper 103.

In addition to the above embodiments, in some more detailed embodiments, on the basis of fig. 2a, as shown in fig. 2b, the rf window 1014 further penetrates through the first plane paper layer 1011; the electronic tag 102 has a size larger than that of the rf window 1014, and covers the rf window 1014 after being attached, and the second surface of the electronic tag 102 is attached to the first surface of the first face paper layer 1011 by the second adhesive layer 1024.

In view of the above, the metal film substrate and the face paper substrate are combined to form the transparent structure, if the transparent structure only penetrates through the metal film substrate, the processing precision is high, the processing difficulty can be improved, and the processing efficiency can be reduced, therefore, in the embodiment of the present application, the transparent structure can penetrate through the face paper substrate together, so that the first face paper layer 1011 is also penetrated through by the radio frequency window 1014, based on this, if the electronic tag 102 is attached to the first face paper layer 1011, it is required to ensure that the size of the electronic tag 102 is larger than the size of the radio frequency window 1014 and the radio frequency window 1014 is covered after the attachment, otherwise, the electronic tag 102 leaks into the radio frequency window 1014, which causes a defect area to be formed on the single surface of the logistics surface, and affects the subsequent printing. Therefore, by attaching the electronic label 102 in the above manner, it is ensured that one surface of the logistics list is completely covered by the face paper layer (including the first face paper layer 1011 and the second face paper layer 1023), thereby ensuring the printing effect. In addition, the commodity circulation face list that this application embodiment provided is processed through above-mentioned processing mode, can effectively reduce the processing degree of difficulty, improves machining efficiency, and corresponding meeting reduces the processing cost, and consequently, the commodity circulation face list that this application embodiment provided still has the processing degree of difficulty low, prepare efficient, advantage with low costs.

In addition to the above embodiments, in some more detailed embodiments, as shown in fig. 2c, the rf window 1014 penetrates through the first face paper layer 1011 and the first glue layer 1013, that is, the rf window 1014 penetrates through the first face paper layer 1011, the metal layer 1012 and the first glue layer 1013 simultaneously, so that the process of providing the rf window 1014 on the metal layer 1012 can be simplified, and the rf window 1014 penetrating through the three layers of the first face paper layer 1011, the metal film substrate and the first glue layer 1013 is formed by performing die cutting on a semi-finished composite layer comprising the three layers of the first face paper layer 1011, the metal film substrate and the first glue layer 1013 through the die cutting process, which not only can reduce the die cutting process, but also can improve the positioning difficulty when the electronic tag 102 and the composite layer 101 are subjected to the composite process.

In another embodiment, referring to fig. 3, fig. 3 is a schematic view illustrating a third structure of the logistics surface sheet according to one or more embodiments of the present disclosure, in which, as shown in fig. 3, for a case that the electronic tag 102 is attached on the first adhesive layer 1013, the radio frequency window 1014 does not penetrate through the first face paper layer 1011 and the first adhesive layer 1013, and the electronic tag 102 is attached on a surface of the first adhesive layer 1013 opposite to the metal layer 1012.

In this embodiment, the rf window 1014 does not penetrate through the first sheet 1011, so that the first sheet 1011 can print smoothly, and the rf window 1014 does not penetrate through the first glue layer 1013, so that the electronic tag 102 can be adhered to the composite layer 101 through the first glue layer 1013, thereby ensuring smooth implementation of the above structure. Through this embodiment, locate electronic tags 102 under first face paper layer 1011, can be so that first face paper layer 1011 surface smoothing, compare in the mode of pasting electronic tags 102 at first face paper layer 1011 outside, on the one hand more pleasing to the eye, on the other hand can effectively avoid electronic tags 102 to be hung and rub and drop in the commodity circulation transportation, has higher reliability.

In addition to any of the embodiments of the present application, in some modified embodiments, a projection of the electronic tag 102 on any one surface of the composite layer 101 is located at a first designated position, a projection of the rf window 1014 on any one surface of the composite layer 101 is located at a second designated position, and an absolute value of a deviation between a center point of the first designated position and a center point of the second designated position is smaller than or equal to a first preset threshold value.

A person skilled in the art may flexibly set the value of the first preset threshold according to actual requirements, which is not limited in the embodiment of the present application, and it should be noted that the smaller the deviation is, the more the electronic tag 102 and the rf window 1014 are overlapped with each other, the smaller the shielding of the metal layer 1012 on the electronic tag 102 is, and the more the rf signal transceiving performance of the electronic tag 102 is improved. Therefore, by setting the first preset threshold and making the electronic tag 102 and the rf window 1014 meet the constraint condition, it is ensured that the rf signal transceiving performance of the electronic tag 102 has a high level.

In the composite layer 101, the metal layer 1012 may be plated on the first surface paper layer 1011 or may be bonded to the first surface paper layer 1011 by a third adhesive layer, and the object of the present embodiment can be achieved.

If the metal layer 1012 is plated on the first surface paper layer 1011 by a plating process, the thickness of the metal layer 1012 can be controlled within a small range, so that the cost of the metal layer 1012 can be saved, and the cost of the whole logistics surface is reduced.

In addition, the third adhesive layer can be realized by adopting a hot melt adhesive, an adhesive film and the like, and the structure of compounding the metal layer 1012 and the surface paper layer by adopting the adhesive layer has the advantages of simple preparation process and low cost.

On the basis of any implementation manner of the embodiment of the present application, it is considered that if the metal layer 1012 in a certain logistics surface sheet shields the impedance matching network of the electronic tag in another logistics surface sheet, the impedance matching of the electronic tag in another logistics surface sheet may be affected, and impedance mismatch of the electronic tag in another logistics surface sheet may also be caused, so as to affect the radio frequency performance of the electronic tag in another logistics surface sheet, for example, reduce the reading distance of the electronic tag in another logistics surface sheet, based on this, in some modified implementation manners, refer to fig. 4, where fig. 4 is a schematic diagram of a fourth structure composition of the logistics surface sheet provided in one or more embodiments of the present specification, and as shown in fig. 4, the through structure corresponding to each electronic tag 102 further includes a plurality of through holes 1015;

the through holes 1015 are used for reducing the influence degree of the metal layer 1012 on the impedance matching of the electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is adhered to the target object;

wherein the other logistics surface sheet is used for pasting to other objects except the target object.

For example, in practical applications, in links of receiving, sending, distributing, checking and the like of logistics goods, a plurality of logistics goods are stacked together, which may cause shielding between logistics surface lists, if a logistics surface list does not include the through hole 1015, a metal layer in one logistics surface list may shield an electronic tag in another logistics surface list, and a worker has to adjust the position of each logistics goods, so that the information in each electronic tag 102 may be read by using the electronic tag 102 identification device. In the embodiment, the plurality of through holes 1015 are formed in the metal layer 1012, so that the shielding of the metal layer 1012 in a certain logistics surface list on the impedance matching networks of the electronic tags in other logistics surface lists is reduced, the influence on the impedance matching of the electronic tags in other logistics surface lists is reduced, the radio frequency performance of the electronic tags in other logistics surface lists is further improved, for example, the reading distance of the electronic tags in other logistics surface lists is increased, the position of each logistics cargo does not need to be adjusted, the electronic tag 102 identification equipment can be used for performing the reading and writing operation of electronic logistics information on the batched logistics cargos, and the automation degree and the working efficiency of links such as logistics cargo receiving, dispatching and inventory checking can be effectively improved.

It should be noted that, since the first face paper layer 1011 is used for printing visual logistics information of a target object, the through holes 1015 do not penetrate through the first face paper layer 1011 in order to ensure the integrity of the uppermost face paper layer.

In addition to the above embodiments, in some more detailed embodiments, if the absolute value of the difference between the size of the metal layer 1012 and the size of the first surface paper layer 1011 is less than or equal to a second preset threshold;

when the other physical distribution list and the physical distribution list pasted on the target object have an overlapping region, the plurality of through holes 1015 can reduce the influence degree of the metal layer 1012 on the impedance matching of the electronic tag in the other physical distribution list from a first value to a second value.

It is easy to understand that the larger the size of the metal layer 1012 is, the more easily the electronic tags in other logistics lists are shielded without providing the through hole 1015, so as to cause negative influence on the impedance matching of the electronic tags in other logistics lists, therefore, through the third preset threshold, in the case that the size of the metal layer 1012 is large, the degree of influence of the metal layer 1012 on the impedance matching of the electronic tags in other logistics lists can be reduced from the first value to the second value by using the through hole 1015, that is, the influence on the impedance matching of the electronic tags in other logistics lists is reduced.

In addition to the corresponding embodiment shown in fig. 4, in some variations, the plurality of through holes 1015 are uniformly distributed around the rf window 1014 in an array.

Through the embodiment, the through holes 1015 can be uniformly distributed in the metal layer 1012, so that the shielding of the electronic tags in other logistics lists is reduced, and the negative influence on the impedance matching of the electronic tags in other logistics lists is reduced.

In any of the above embodiments, the metal layer 1012 may cover the whole surface of the plane paper layer, or may cover a part of the surface of the plane paper layer, as long as it can be coupled with the antenna 1021 of the electronic tag 102 to improve the rf signal transceiving performance of the electronic tag 102, and the embodiment of the present application is not limited to a specific size thereof. In some embodiments, the size of the metal layer 1012 is the same as the size of the first sheet layer 1011.

Considering that the larger the area of the metal layer 1012, the greater the effect on improving the radio frequency signal transceiving performance of the electronic tag 102, therefore, in the case that the size of the metal layer 1012 is the same as that of the face paper layer, the effect of the metal layer 1012 on improving the radio frequency signal transceiving performance of the electronic tag 102 is relatively high, and therefore, in this embodiment, the logistics surface sheet has relatively high radio frequency signal transceiving performance.

In addition, referring to the schematic illustration of the foregoing embodiment, the logistic sheet based on the above structure can be prepared by directly laminating a metal film substrate (e.g., an aluminum foil roll) and a surface paper layer substrate (e.g., a thermal paper roll), then forming a through structure penetrating through the metal film substrate by a die cutting process, and then applying adhesive and a release paper to the whole sheet to obtain the composite layer 101; or directly compounding a metal film substrate (such as an aluminum foil coiled material) and a surface paper layer substrate (such as a thermal sensitive paper coiled material), then coating glue and sticking release paper on the whole frame, and forming a through structure penetrating through the metal film substrate, the surface paper layer substrate and the glue layer by adopting a die cutting process to obtain a composite layer 101;

according to the position of the radio frequency window 1014 in the transparent structure, the electronic tags 102 are correspondingly adhered to the first surface paper layer 1011 of the composite layer 101 one by one, and a large number of logistics surface sheets to be used can be manufactured in batch through a slitting process, wherein on one hand, the metal film substrate can be compounded with the surface paper layer substrate without cutting, so that the processing efficiency of the logistics surface sheets can be effectively improved; on the other hand, the metal film substrate generates less metal waste in the use process, and can effectively reduce the pollution to the environment.

In specific implementation, the composite layer array provided with the metal layer 1012 may be cut into a plurality of composite layer units, and then the electronic tag 102 may be attached to the position of the rf window 1014 on each composite layer unit, so as to obtain the logistics surface sheet. Specifically, the logistics surface sheet attached to the target object is obtained by cutting the prepared composite layer array provided with the metal layer to obtain a plurality of composite layers 101, and attaching the electronic tag 102 to the radio frequency window 1014 on each composite layer 101. The metal layer 1012 arranged on the composite layer array may be obtained by forming a metal film on the second surface of the first face paper layer substrate by using a plating process; or the first metal film substrate is adhered to the second surface of the first face paper layer substrate through a third adhesive layer by adopting a composite process.

In addition, on the basis of any of the above embodiments of the present application, the electronic tag 102 may be attached to each rf window 1014 on the composite layer array provided with the metal layer 1012 to obtain a logistics surface single array, and then the logistics surface single array is cut into a plurality of logistics surface sheets, please refer to fig. 5, fig. 5 is a schematic structural composition diagram of the logistics surface sheets arranged in an array according to one or more embodiments of the present specification, and as shown in fig. 5, the logistics surface sheet attached to the target object is a single-use logistics surface sheet obtained by cutting the prepared logistics surface single array;

a plurality of electronic tags 102 are arranged on the composite layer 101 in the logistics surface single array in an array manner; the rf windows 1014 formed in the composite layer 101 correspond to the electronic tags 102 one to one.

In fig. 5, the logistics surface single array may include a plurality of logistics surface single 10 in a roll form, or a plurality of logistics surface single 10 in a sheet form, which may be processed in a whole web based on the metal film substrate and the surface paper layer substrate, and when in use, the required logistics surface single 10 may be directly detached from the logistics surface single array for use.

In addition, the shape of the rf window 1014 may be square, rectangular, circular, T-shaped, or other shapes; the relative position of the rf window 1014 on the metal layer 1012 may be at the center of the metal layer 1012, or may be at an edge or other location. Similarly, the through hole 1015 may be square, rectangular, circular, T-shaped, or other shapes. The through hole 1015 may be the same shape as the rf window 1014 or may be different. The above are exemplary modifications of the embodiments of the present application, which can achieve the purpose of the embodiments of the present application, and all of which are within the scope of the present application.

The logistics surface sheet in one or more embodiments of the present specification, comprising: a composite layer 101 and an electronic label 102; the composite layer 101 includes a first face paper layer 1011, a metal layer 1012 and a first glue layer 1013 sequentially disposed, the metal layer 1012 is provided with a through structure, and the through structure includes a radio frequency window 1014 penetrating through the metal layer 1012; the antenna 1021 in the electronic tag 102 can be coupled to the metal layer 1012 and transmit and receive electronic logistics information via radio frequency signals. By adding the metal layer 1012 in the logistics surface sheet and opening the through structure including the radio frequency window 1014 on the metal layer 1012, the electronic tag 102 is arranged corresponding to the radio frequency window 1014, and the antenna 1021 in the electronic tag 102 is coupled with the metal layer 1012, so that the metal layer 1012 is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, and the radio frequency signal transceiving performance of the electronic tag 102 is enhanced, thus the radio frequency signal transceiving performance is enhanced without increasing the size of the electronic tag 102, and the requirement for the large size of the electronic tag 102 is reduced.

On the basis of the same technical concept, corresponding to the logistics list described in fig. 1 to 5, one or more embodiments of the present specification further provide a method for preparing the logistics list, fig. 6 is a schematic flow chart of the method for preparing the logistics list provided in one or more embodiments of the present specification, and the method in fig. 6 is used for preparing the logistics list described in fig. 1 to 5, and as shown in fig. 6, the method at least includes the following steps:

s602, providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting electronic logistics information of a target object; and the number of the first and second groups,

s604, providing a composite layer, wherein the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the size of the metal layer is larger than that of an antenna in the electronic tag, the metal layer is provided with a transparent structure, the transparent structure comprises a radio frequency window penetrating through the metal layer, and the first surface paper layer is used for printing visual logistics information of a target object; and the number of the first and second groups,

and S606, adhering the electronic tag to the composite layer to obtain a logistics surface sheet, wherein the adhering position of the electronic tag corresponds to the position of the radio frequency window, and the antenna in the electronic tag can be coupled with the metal layer and can transmit and receive electronic logistics information through radio frequency signals.

In one or more embodiments of the present disclosure, a metal layer is added to a logistics surface sheet, a transparent structure including a radio frequency window is formed on the metal layer, an electronic tag is disposed corresponding to the radio frequency window, and an antenna in the electronic tag is coupled to the metal layer, so that the metal layer is used as a radiator of the antenna in the electronic tag to participate in radiation of electromagnetic waves, and the radio frequency signal transceiving performance of the electronic tag is enhanced.

If the area of the composite layer is larger than or equal to the sum of the areas of the plurality of logistics surface sheets;

in a specific implementation, the composite layer provided with the metal layer may be cut into a plurality of composite layer units, and then an electronic tag is attached to a radio frequency window on each composite layer unit to obtain an logistics list, and correspondingly, in step S606, the electronic tag is attached to the composite layer to obtain the logistics list, which specifically includes:

cutting the composite layer to obtain a plurality of composite layer units;

and (4) sticking an electronic label at the radio frequency window on each composite layer unit to obtain an independently used logistics surface sheet.

In a specific implementation, an electronic tag may be attached to each rf window position on a composite layer provided with a metal layer to obtain an logistics surface single array, and then the logistics surface single array is cut into a plurality of separately used logistics surface single sheets, and correspondingly, in step S606, the electronic tag is attached to the composite layer to obtain the logistics surface single sheet, which specifically includes:

and adhering a plurality of electronic tags to the composite layer in an array manner to obtain an logistics surface single array which is used for cutting a plurality of logistics surface single for independent use, wherein the electronic tags correspond to the radio frequency windows in the composite layer one by one.

Based on the present embodiment, the manufacturing process of the logistics surface sheet may be that, firstly, a metal film substrate (e.g., an aluminum foil roll) and a surface paper layer substrate (e.g., a thermal paper roll) are directly combined, then a through structure penetrating through the metal film substrate is formed by a die cutting process, then a composite layer is obtained by applying glue and pasting release paper on the whole, then electronic labels are pasted on the first surface paper layer of the composite layer in a one-to-one correspondence manner according to the position of a radio frequency window in the through structure, a large number of logistics surface sheets to be used are manufactured in a batch manner by a slitting process, the widths of the metal film substrate and the surface paper layer substrate may be 1 meter, 2 meters, 3 meters, etc., the lengths thereof may be 10 meters, 20 meters, 50 meters, 70mm, etc., the size data of the finally formed logistics surface sheet may be 50mm x 50mm, 70mm, etc., which are not limited by the embodiment of the present, therefore, thousands of logistics surface sheets can be manufactured at one time through the method, the production efficiency is very high, the production cost is reduced along with the high production efficiency, and therefore the logistics surface sheets prepared through the method have the advantages of being simple in process, high in preparation efficiency and low in cost.

The electronic tag may be attached to the first face paper layer side of the composite layer, or may be attached to the first adhesive layer side of the composite layer, which will be described below:

in one embodiment, the step S606 of attaching the electronic tag to the composite layer to obtain a logistics surface sheet includes:

arranging a second surface paper layer on the first surface of the electronic tag;

and with the radio frequency window as an alignment reference, adhering the second surface of the electronic tag to the first surface of the first face paper layer in the composite layer through a second adhesive layer to obtain a logistics surface list, wherein the first surface is a surface of the first face paper layer used for printing visual logistics information.

This embodiment, can support the mode that the radio frequency window in the composite bed runs through first face paper layer, of course, the mode that the radio frequency window does not run through first face paper layer is also applicable, for example, if form penetrating structure again after compounding metal film substrate and face paper layer substrate, if penetrating structure only runs through the metal film substrate, then the machining precision is higher, can improve the processing degree of difficulty, reduce machining efficiency, therefore, based on this application embodiment, can make penetrating structure run through the face paper layer substrate in the lump, thereby make first face paper layer also run through by the radio frequency window, then, attach electronic tags in order to cover this radio frequency window on first face paper layer, can ensure that the whole surface of printing of commodity circulation face list is covered by face paper layer (including first face paper layer and second face paper layer), and then ensure to print the effect. In addition, because this embodiment can be implemented with the embodiment cooperation that makes penetrating structure run through the face paper layer substrate in the lump, can effectively reduce the processing degree of difficulty, improve machining efficiency, corresponding can reduce the processing cost, consequently, this application embodiment still has the processing degree of difficulty and hangs down, prepares efficient, advantage with low costs.

In another embodiment, the step S606 of attaching the electronic tag to the composite layer to obtain a logistics surface sheet specifically includes:

and with the radio frequency window as an alignment reference, adhering the electronic tag to one surface, deviating from the metal layer, of the first adhesive layer in the composite layer to obtain a logistics surface sheet.

This embodiment, be applicable to the situation that first surface paper layer is not run through by the radio frequency window, under the condition that the radio frequency window does not run through first surface paper layer, first surface paper layer can print smoothly, through this embodiment, paste electronic tags in first glue film, locate under first surface paper layer promptly, can make first surface paper layer surfacing, compare in pasting the outside mode at first surface paper layer with electronic tags, on the one hand more pleasing to the eye, on the other hand can effectively avoid electronic tags to be hung in the commodity circulation transportation and rub and drop, higher reliability has.

It should be noted that, the radio frequency window may only penetrate through the metal layer, may also penetrate through the metal layer and the first paper layer simultaneously, and may also penetrate through the metal layer, the first paper layer and the first glue layer simultaneously, and the specific penetration manner thereof is mainly determined by the adopted process for manufacturing the composite layer, and different penetration manners have different process difficulties for manufacturing the composite layer, which correspondingly also affects the processing efficiency and the cost, and the following description is made on the process for manufacturing the composite layer respectively.

In one embodiment of fabricating the composite layer, the step S604 provides a composite layer, which specifically includes:

providing a first face paper layer;

forming a metal layer covering the second surface of the first face paper layer;

forming a first glue layer covering one surface of the metal layer opposite to the first face paper layer to obtain a first composite layer semi-finished product comprising the first face paper layer, the metal layer and the first glue layer;

and die-cutting the first composite layer semi-finished product to form a radio frequency window penetrating through the first surface paper layer, the metal layer and the first adhesive layer to obtain the composite layer.

In the embodiment, the die cutting is performed after the first composite layer semi-finished product is formed, wherein in the process of forming the first composite layer semi-finished product, the surface paper layer substrate and the metal film substrate can be directly compounded without processing the metal film substrate, so that the compounding efficiency is high, and correspondingly, the preparation efficiency of the logistics surface sheet is improved.

In another embodiment of fabricating the composite layer, in step S604, a composite layer is provided, which specifically includes:

providing a first face paper layer;

forming a metal layer covering the second surface of the first surface paper layer to obtain a second composite layer semi-finished product comprising the first surface paper layer and the metal layer;

die-cutting the second composite layer semi-finished product to form a radio frequency window penetrating through the first surface paper layer and the metal layer to obtain a third composite layer semi-finished product;

and forming a first adhesive layer covering one surface of the metal layer, which faces away from the first surface paper layer, based on the third composite layer semi-finished product to obtain the composite layer.

In the embodiment, the second composite layer semi-finished product is formed, then die cutting is carried out, and then gluing is carried out, wherein in the process of forming the second composite layer semi-finished product, the surface paper layer substrate and the metal film substrate can be directly compounded without processing the metal film substrate, so that the compounding efficiency is higher, and correspondingly, the preparation efficiency of the logistics surface sheet is improved.

In addition to the above two embodiments for producing a composite layer, the forming of the metal layer covering the second surface of the first face paper layer may specifically include:

forming a metal film on the second surface of the first face paper layer by adopting a coating process to obtain a metal layer covering the second surface of the first face paper layer; alternatively, the first and second electrodes may be,

and adhering the first metal film substrate to the second surface of the first face paper layer through a third adhesive layer by adopting a composite process to obtain a metal layer covering the second surface of the first face paper layer.

If the metal layer is plated and attached to the first surface paper layer by adopting a film plating process, the thickness of the metal layer can be controlled within a small range, so that the cost of the metal layer can be saved, and the cost of the whole logistics surface is further reduced.

In addition, if the mode of adhesive layer adhesion is adopted, the third adhesive layer can be realized by hot melt adhesive, adhesive film and the like, and the structure of adopting the adhesive layer to compound the metal layer and the surface paper layer has the advantages of simple preparation process and low cost.

In another embodiment of fabricating the composite layer, the step S604 of providing the composite layer may specifically include:

providing a second metal film substrate;

forming a transparent structure on the second metal film substrate by adopting a die cutting process to obtain a metal layer with the transparent structure;

the metal layer provided with the transparent structure is adhered to the second surface of the first surface paper layer through a third adhesive layer;

and forming a first glue layer covering the surface, back to the first surface paper layer, of the metal layer with the transparent structure to obtain a composite layer comprising the first surface paper layer, the metal layer with the transparent structure and the first glue layer.

Through this embodiment, can be so that penetrating structure only runs through the metal level, on this basis, electronic tags both can paste in first rubber layer one side, also can paste in first rubber layer one side, has higher technology degree of freedom, can satisfy diversified commodity circulation face list preparation demand.

It should be noted that, the present embodiment is implemented in cooperation with a manner of attaching the electronic tag to one side of the first adhesive layer, and the effect is better. Particularly, because the radio frequency window does not run through first surface paper layer, therefore, first surface paper layer can be printed smoothly, again because the radio frequency window also does not run through first glue film, just make electronic tags paste the composite bed through first glue film on, thereby can locate electronic tags under the first surface paper layer, make first surface paper layer surfacing, compare in the mode of pasting electronic tags in first surface paper layer outside, on the one hand more pleasing to the eye, on the other hand can effectively avoid electronic tags to be hung in the commodity circulation transportation and rub and drop, higher reliability has.

In addition, the transparent structure may not be limited to the rf window, for example, the transparent structure corresponding to each electronic tag further includes: a plurality of through holes;

the through holes are used for reducing the influence degree of the metal layer 1012 on the impedance matching of the electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is pasted on a target object;

For example, in practical applications, in links of receiving, dispatching, checking and the like of logistics goods, a plurality of logistics goods are stacked together, so that shielding occurs between logistics surface lists, if a logistics surface list does not include the through hole, a metal layer in one logistics surface list shields an electronic tag in another logistics surface list, and a worker has to adjust the position of each logistics goods to read information in each electronic tag by using the electronic tag identification device. In the embodiment, the plurality of through holes are formed in the metal layer, so that the shielding of the metal layer in one logistics surface list to the impedance matching networks of the electronic tags in other logistics surface lists is reduced, the influence on the impedance matching of the electronic tags in other logistics surface lists is reduced, the radio frequency performance of the electronic tags in other logistics surface lists is further improved, for example, the reading distance of the electronic tags in other logistics surface lists is increased, the position of each logistics cargo does not need to be adjusted, the electronic tag identification equipment can be used for performing the reading and writing operation of electronic logistics information on the batched logistics cargos, and the automation degree and the working efficiency of links such as receiving, sending, distributing and counting of the logistics cargos can be effectively improved.

On the basis of any of the foregoing embodiments of the present application, before providing the electronic tag prepared in advance at S602, the method further includes:

providing a third metal film substrate;

etching, die cutting or laser engraving the third metal film substrate to obtain an antenna of the electronic tag;

and combining the antenna of the electronic tag with a chip of the electronic tag to obtain the electronic tag.

The chip of the electronic tag can be directly purchased or used as a finished product, and the size of the antenna can be reduced by the implementation of the electronic tag, so that the small-size antenna needs to be separately prepared. In the above-described method of obtaining an electronic tag by combining an antenna of an electronic tag and a chip of an electronic tag, the antenna of the electronic tag and the chip of the electronic tag may be bonded to each other to obtain the electronic tag.

Through the embodiment, the small-size electronic tag can be prepared in advance and then directly attached to the first surface paper layer or the first adhesive layer to prepare the logistics surface sheet, and the preparation difficulty of the logistics surface sheet can be effectively reduced and the preparation efficiency of the logistics surface sheet can be improved through the modes of preparation in advance, direct attachment and the like.

On the basis of any of the above embodiments of the present application, the method may further include:

and sticking anti-sticking paper based on the surface of the first glue layer deviating from the first surface paper layer.

Wherein, above-mentioned release paper can adopt to realize from type paper, silicone oil paper etc. and its effect is the first glue film of protection on the one hand, and on the other hand is the transportation of being convenient for. The logistics surface sheet pasted with the release paper can be torn off before use, or a plurality of logistics surface sheets in a roll can be used by taking off the needed logistics surface sheet from the release paper.

By adjusting the thicknesses of at least the surface paper layer, the metal layer, the electronic tag and the first adhesive layer, the thickness of the logistics surface sheet can be controlled within a thickness range suitable for printing by a thermal printer, for example, in some exemplary applications, the prepared logistics surface sheet has a thickness of 0.1mm, and can be well suitable for printing by the thermal printer without modifying the existing thermal printer, so that the logistics surface sheet is convenient to popularize and apply.

In order to facilitate understanding of the above examples of the preparation method of the material flow sheet, the examples of the present application further provide some specific embodiments, and the following specific example description may be understood with reference to any one of the foregoing embodiments, and any one of the foregoing embodiments may also be understood with reference to the following example description, and some contents are not described again.

In the following description, although some terms are changed, they do not affect the expression of their meanings, and some terms are described in correspondence with terms in the foregoing description of the embodiments, and the correspondence expressed by the correspondence may include an equivalent relationship or a top-bottom relationship, and those skilled in the art can understand the correspondence in consideration of the actual situation.

In some specific embodiments, the above method for preparing a material flow sheet may comprise the following steps:

p11: coating a thermosensitive coating on the raw paper web to form a thermosensitive paper web (i.e., one of the face paper web substrates);

p12: forming a metal film on the surface of the thermal sensitive paper coiled material in a vacuum evaporation mode to obtain a metallized thermal sensitive paper coiled material, namely a metallized thermal sensitive paper coiled material; or compounding a metal film coiled material (one of the metal film base materials, corresponding to the first metal film base material) and the thermosensitive paper coiled material through a hot melt adhesive or an adhesive film to obtain a metalized thermosensitive paper coiled material, namely a metalized thermosensitive paper coiled material;

p13: brushing glue (hot melt adhesive) or a composite glue film on the metal surface of the metallized heat-sensitive paper coiled material, and rolling the processed material and release paper together to obtain a first composite layer semi-finished product;

p14: performing die cutting, slitting and waste discharging (waste discharging is to remove a waste metal film) on a first composite layer semi-finished product obtained by processing P13 through a flat knife die cutting machine or a circular knife die cutting machine to form a radio frequency window penetrating through the first surface paper layer, the metal layer and the first adhesive layer, and cutting the appearance of a flow surface sheet to obtain a composite layer, wherein the understanding is given by referring to FIG. 7, FIG. 7 is a schematic structural composition diagram of the composite layer provided with radio frequency windows arranged in an array manner in one or more embodiments of the present specification, and as shown in FIG. 7, the die cutting and waste discharging are performed on the first composite layer semi-finished product through the flat knife die cutting machine or the circular knife die cutting machine to obtain the composite layer provided with radio frequency windows 1014 arranged in an array manner;

p21: additionally providing a metal film substrate, and processing the antenna by an etching process or a laser engraving process;

p22: bonding a chip of the electronic tag on the antenna by using chip flip-chip packaging equipment to form a dry tag;

p23: compounding the dry label with a second surface paper layer, specifically, brushing glue (hot melt adhesive) on the antenna surface of the dry label or compounding an adhesive film on the antenna surface, and then adhering the second surface paper layer to obtain the dry label with the second surface paper layer;

p24: carrying out die cutting, slitting and waste discharging on the dry label provided with the second surface paper layer through a flat knife die cutting machine or a circular knife die cutting machine to obtain the subminiature electronic label;

p3: referring to fig. 8, fig. 8 is a schematic structural diagram of a composite layer after an electronic tag is attached according to one or more embodiments of the present disclosure, wherein, as shown in fig. 8, subminiature electronic tags 102 are respectively attached to positions of radio frequency windows 1014 arranged in an array on the composite layer;

p4: and rolling the processed metallized surface sheet.

The material flow surface single preparation method in one or more embodiments of the specification comprises the following steps: providing a pre-prepared electronic tag, wherein the electronic tag is used for storing and transmitting and receiving electronic logistics information of a target object; providing a composite layer, wherein the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the size of the metal layer is larger than that of an antenna in the electronic tag, the metal layer is provided with a through structure, the through structure comprises a radio frequency window penetrating through the metal layer, and the first surface paper layer is used for printing visual logistics information of a target object; and adhering the electronic tag to the composite layer to obtain the logistics surface sheet, wherein the adhering position of the electronic tag corresponds to the position of the radio frequency window, and an antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

It should be noted that the embodiment in this specification and the previous embodiment in this specification are based on the same inventive concept, and therefore, specific implementation of this embodiment may refer to implementation of the aforementioned logistics list, and repeated details are not described herein.

On the basis of the same technical concept, corresponding to the logistics surface sheet described in fig. 1 to 5, one or more embodiments of the present disclosure further provide a logistics package, fig. 9 is a schematic structural composition diagram of the logistics package provided in one or more embodiments of the present disclosure, and as shown in fig. 9, the logistics surface sheet 10 described in fig. 1 to 5 is attached to the logistics package 20.

Wherein, above-mentioned commodity circulation face list 10 includes: composite layers and electronic labels;

the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, wherein the metal layer is provided with a through structure, and the through structure comprises a radio frequency window penetrating through the metal layer;

the electronic tag is adhered to the first surface paper layer or the first adhesive layer, wherein the adhering position of the electronic tag corresponds to the position of the radio frequency window, and the size of the antenna of the electronic tag is smaller than that of the metal layer;

the first adhesive layer is used for adhering the logistics surface sheet 10 to the logistics information display position on the target object;

the electronic tag is used for storing and transmitting and receiving electronic logistics information of a target object, and an antenna in the electronic tag can be coupled with the metal layer and transmits and receives the electronic logistics information through a radio frequency signal.

In the logistics package 20 of one or more embodiments of the present disclosure, the logistics surface sheet 10 disposed on the logistics package 20 includes: composite layers and electronic labels; the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the metal layer is provided with a through structure, and the through structure comprises a radio frequency window penetrating through the metal layer; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. By adding the metal layer in the logistics surface sheet 10 and arranging the transparent structure comprising the radio frequency window on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement on the large size of the electronic tag is reduced.

On the basis of the same technical concept, corresponding to the logistics surface sheet described in fig. 1 to 5, one or more embodiments of the present disclosure further provide a logistics good, and fig. 10 is a schematic structural composition diagram of the logistics good provided in one or more embodiments of the present disclosure, as shown in fig. 10, the logistics surface sheet 10 described in fig. 1 to 5 is attached to a surface of the logistics good 30 or a surface of an outer package 301 thereof.

In the logistics cargo 30 in one or more embodiments of the present specification, the logistics surface sheet 10 disposed on the logistics cargo 30 includes: composite layers and electronic labels; the composite layer comprises a first surface paper layer, a metal layer and a first adhesive layer which are sequentially arranged, the metal layer is provided with a through structure, and the through structure comprises a radio frequency window penetrating through the metal layer; the antenna in the electronic tag can be coupled with the metal layer and can receive and transmit electronic logistics information through radio frequency signals. The metal layer is added in the logistics surface sheet, the through structure comprising the radio frequency window is arranged on the metal layer, the electronic tag is arranged corresponding to the radio frequency window, and the antenna in the electronic tag is coupled with the metal layer, so that the metal layer is used as a radiating body of the antenna in the electronic tag to participate in the radiation of electromagnetic waves, the radio frequency signal receiving and sending performance of the electronic tag is enhanced, the radio frequency signal receiving and sending performance is not required to be enhanced by increasing the size of the electronic tag, and the requirement for the large size of the electronic tag is reduced.

The foregoing description has been directed to specific embodiments of this disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

For convenience of description, the above devices are described as being divided into various units by function, and are described separately. Of course, the functionality of the various elements may be implemented in the same one or more software and/or hardware implementations of one or more of the present descriptions.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of one or more embodiments of the present specification, it is to be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are used for indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed when in use, and are used for convenience in describing one or more embodiments of the present specification and for simplicity in description, but do not indicate or imply that the device or element that is referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting one or more embodiments of the present specification. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of one or more embodiments of the present specification, it is further noted that the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, fixed, removable, and integral connections unless expressly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in one or more embodiments of the present specification may be specifically understood by those of ordinary skill in the art.

Finally, it should be noted that: although the embodiments of one or more embodiments of the present specification have been described in detail with reference to the accompanying drawings for the purpose of illustrating the subject matter of one or more embodiments of the present specification, the embodiments of one or more embodiments of the present specification are not limited to the above-mentioned embodiments, the scope of the embodiments of one or more embodiments of the present specification is not limited thereto, and the above-mentioned embodiments are only illustrative and not restrictive, and although the embodiments of one or more embodiments of the present specification have been described in detail with reference to the above-mentioned embodiments, those skilled in the art will understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope disclosed in one or more embodiments of the present specification; such modifications, changes, or substitutions do not depart from the spirit and scope of the corresponding embodiments of the one or more embodiments of the present disclosure. Are intended to be covered by the scope of one or more embodiments of the present disclosure. Therefore, the scope of protection of one or more embodiments of the present specification shall be subject to the scope of protection of the claims.

Claims

1. A logistics sheet comprising: composite layers and electronic labels;

2. The logistics surface sheet of claim 1, wherein the first surface of the electronic tag is provided with a second surface paper layer, the second surface of the electronic tag is adhered to the first surface of the first surface paper layer through a second adhesive layer, and the first surface is a surface of the first surface paper layer used for printing the visual logistics information;

the second surface paper layer is used for being matched with the first surface paper layer to print the visual logistics information of the target object together.

3. The logistics surface sheet of claim 2, wherein the radio frequency window further extends through the first face paper layer, or the radio frequency window further extends through the first face paper layer and the first glue layer;

the size of the electronic tag is larger than that of the radio frequency window, the electronic tag covers the radio frequency window after being pasted, and the second surface of the electronic tag is pasted on the part, which is not penetrated, of the first surface of the first face paper layer through the second glue layer.

4. The logistics surface sheet of claim 1, wherein the radio frequency window does not penetrate through the first face paper layer and the first adhesive layer, and the electronic tag is adhered to a surface of the first adhesive layer opposite to the metal layer.

5. The logistics surface sheet of claim 1, wherein a projection of the electronic label on any one surface of the composite layer is located at a first designated position, a projection of the radio frequency window on any one surface of the composite layer is located at a second designated position, and an absolute value of a deviation between a center point of the first designated position and a center point of the second designated position is less than or equal to a first preset threshold value.

6. The logistics surface sheet of claim 1, wherein the metal layer is plated to the first facestock layer; or the metal layer and the first surface paper layer are bonded through a third adhesive layer.

7. The logistics surface sheet of claim 1, wherein the through-passage structure further comprises a plurality of through-holes;

the through holes are used for reducing the influence degree of the metal layer on the impedance matching of the electronic tags in other logistics surface sheets from a first value to a second value when the logistics surface sheet is pasted on the target object;

wherein the other logistics surface sheet is an logistics surface sheet used for being pasted to other objects except the target object.

8. The logistics surface sheet of claim 7, wherein if the absolute value of the difference between the dimensions of the metal layer and the first face paper layer is less than or equal to a second predetermined threshold;

when the other logistics surface sheet and the logistics surface sheet pasted on the target object have an overlapping area, the through holes can reduce the influence degree of the metal layer on the impedance matching of the electronic tags in the other logistics surface sheet from a first value to a second value.

9. The logistics surface sheet of claim 7, wherein the plurality of through-holes are evenly distributed in an array around the radio frequency window.

10. The logistics surface sheet of claim 1, wherein the metal layer is the same size as the first facestock layer.

11. The logistics surface sheet of claim 1, wherein the logistics surface sheet further comprises: release paper;

and the anti-sticking paper and the surface of the first adhesive layer, which is deviated from the first face paper layer, are adhered.

12. The logistics surface sheet of claim 1, wherein the logistics surface sheet adhered to the target object is a single-use logistics surface sheet obtained by cutting the prepared logistics surface sheet array;

a plurality of electronic tags are arranged on the composite layer in the logistics surface single array in an array manner; and radio frequency windows arranged in the composite layer correspond to the electronic tags one by one.

13. The logistics surface sheet of claim 1, wherein the logistics surface sheet adhered to the target object is obtained by cutting a prepared composite layer array provided with a metal layer to obtain a plurality of composite layers, and adhering the electronic label at a radio frequency window on the composite layers.

14. A method for preparing a logistics surface sheet comprises the following steps:

15. The method of claim 14, wherein the area of the composite layer is greater than or equal to the sum of the areas of the plurality of slip sheets;

the step of adhering the electronic tag to the composite layer to obtain the logistics surface sheet comprises the following steps:

and adhering a plurality of electronic tags to the composite layer in an array manner to obtain an logistics surface list array which is used for cutting a plurality of logistics surface lists into independent use, wherein the electronic tags correspond to the radio frequency windows in the composite layer one by one.

16. The method of claim 14, wherein the area of the composite layer is greater than or equal to the sum of the areas of the plurality of slip sheets;

cutting the composite layer to obtain a plurality of composite layer units;

and adhering the electronic label to the radio frequency window on the composite layer unit to obtain the independently used logistics surface sheet.

17. The method of claim 14, wherein said affixing the electronic label to the composite layer results in a logistics sheet comprising:

arranging a second face paper layer on the first surface of the electronic tag;

and with the radio frequency window as an alignment reference, adhering the second surface of the electronic tag to the first surface of the first surface paper layer in the composite layer through a second adhesive layer to obtain a logistics surface list, wherein the first surface is the surface of the first surface paper layer used for printing the visual logistics information.

18. The method of claim 14, wherein said affixing the electronic label to the composite layer results in a logistics sheet comprising:

and with the radio frequency window as an alignment reference, adhering the electronic tag to one surface, deviating from the metal layer, of the first adhesive layer in the composite layer to obtain a logistics surface list.

19. The method of claim 14, wherein the providing a composite layer comprises:

providing a first face paper layer;

20. The method of claim 14, wherein the providing a composite layer comprises:

providing a first face paper layer;

and forming a first adhesive layer covering one surface of the metal layer, which is opposite to the first surface paper layer, based on the third composite layer semi-finished product to obtain a composite layer.

21. The method of claim 19 or 20, wherein said forming a metal layer overlying a second surface of said first tissue layer comprises:

22. The method of claim 14, wherein the providing a composite layer comprises:

providing a second metal film substrate;

and forming a first adhesive layer covering one surface, back to the first surface paper layer, of the metal layer with the through structure to obtain a composite layer comprising the first surface paper layer, the metal layer with the through structure and the first adhesive layer.

23. The method of claim 14, wherein the pass-through structure further comprises: a plurality of through holes;

24. The method of claim 14, wherein prior to said providing a pre-prepared electronic label, further comprising:

providing a third metal film substrate;

25. The method of claim 14, wherein the method further comprises:

based on first glue film deviates from a surface of first face paper layer, paste release paper.

26. A logistics package, wherein the logistics surface sheet of any one of claims 1 to 13 is adhered to the logistics package.

27. A physical distribution cargo, wherein a physical distribution sheet as claimed in any one of claims 1 to 13 is attached to the surface of the physical distribution cargo or the surface of the outer package thereof.