CN111961999A - Method and device for chemical tinning on copper surface - Google Patents
Method and device for chemical tinning on copper surface Download PDFInfo
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- CN111961999A CN111961999A CN202010872059.5A CN202010872059A CN111961999A CN 111961999 A CN111961999 A CN 111961999A CN 202010872059 A CN202010872059 A CN 202010872059A CN 111961999 A CN111961999 A CN 111961999A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to the technical field of copper surface tin plating, and discloses a method and a device for copper surface chemical tin plating, wherein the method for copper surface chemical tin plating comprises the following steps: s1: polishing the surface of the prepared copper wire to remove an oxide layer on the surface of the copper wire; s2: washing the copper wire treated in the step S1 with ultrasonic waves to remove powder adhered to the surface of the copper wire; s3: sending the copper wire processed in the step S2 into a hot air pipeline, wherein hot air flowing in the hot air pipeline not only dries water on the upper surface of the copper wire, but also preheats the copper wire and heats the copper wire, and the temperature of the hot air in the hot air pipeline is 140 ℃; s4: introducing the copper wire treated in the step S3 into a tinning bath, and tinning the surface of the copper wire; s5: the tin-plated copper wire processed in step S4 is cleaned with hot water. The method and the device for chemically plating the tin on the surface of the copper can solve the problem that the surface plating layer of the copper wire produced at present is easy to fall off.
Description
Technical Field
The invention relates to the technical field of copper surface tin plating, in particular to a method and a device for chemical tin plating on the surface of copper.
Background
In order to prevent the copper wire from being oxidized and corroded by sulfide, organic acid and other substances, a protective layer is attached to the outer surface of the copper wire, and the protective layer is generally plated with a layer of tin. The conductivity of copper is 100%, while that of tin is only 14%, so that the conductivity of the copper wire with tin attached to the same section of wire is lower than that of the bare copper wire, generally 93-94%, which is a defect theoretically, although the use of the copper wire is not affected, therefore, the tin protective layer is required to have a proper and uniform thickness and to be tightly connected with the copper. The tin plating on the surface of the copper wire is generally divided into hot plating and cold plating, and the production process of the hot tin plating generally comprises the following steps: heating the material tin to be liquid in a tin pool, and then continuously enabling the annealed bare copper wire to pass through the tin pool and a tin plating eye die, so that a tin layer is attached to the bare copper wire and is finished into a smooth and bright tin plating copper wire through the eye die; when a hot tinned copper wire passes through an eye die, the copper wire and an inner hole of the eye die are required to be kept concentric as much as possible, so that the uniform thickness of a tin layer can be ensured, but the hot tinned copper wire is almost difficult to realize in actual operation, the tin layer on the copper wire is loose and is easy to drop tin powder, and the eye die is often blocked in the production process of the copper wire; in addition, because the copper line will be through liquid tin pond and pass eye mould arrangement rear ability line, on long and many turns of book get tinning equipment, make the walking resistance of copper line increase more, the line resistance increases and makes the copper line after the annealing stretched by the attenuation easily, when production diameter is 0.08mm and following tiny tinned wire, the copper line is burnt out in the tin pond very easily moreover.
The retrieval publication (bulletin) No. CN103388165A discloses a method for tinning the surface of a copper wire and a tinned copper wire prepared by the method, wherein when the method is used, the copper wire is subjected to the steps of pretreatment, tinning, neutralization and drying; the scheme still has the following technical defects:
the technical scheme has the advantages that the surface coating of the tinned copper wire is easy to fall off, and the scheme has obvious defects.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a method and a device for chemically plating tin on the surface of copper, which have the advantage that the surface coating of the copper wire after tin plating is not easy to fall off, and solve the problem that the surface coating of the currently produced copper wire is easy to fall off.
(II) technical scheme
In order to realize the purpose that the surface coating of the tinned copper wire is not easy to fall off, the invention provides the following technical scheme: the method for chemically plating tin on the surface of copper comprises the following steps:
s1: polishing the surface of the prepared copper wire to remove an oxide layer on the surface of the copper wire;
s2: washing the copper wire treated in the step S1 with ultrasonic waves to remove powder adhered to the surface of the copper wire;
s3: sending the copper wire processed in the step S2 into a hot air pipeline, wherein hot air flowing in the hot air pipeline not only dries water on the upper surface of the copper wire, but also preheats the copper wire and heats the copper wire, and the temperature of the hot air in the hot air pipeline is 140 ℃;
s4: introducing the copper wire treated in the step S3 into a tinning bath, and tinning the surface of the copper wire;
s5: cleaning the tinned copper wire treated in the step S4 by hot water, and wiping the surface of the tinned copper wire by a dry towel;
s6: flaw detection is carried out on the tinned copper wire processed in the step S5, and the unqualified tinned copper wire is subjected to tissue refinement treatment to remove defects;
s7: and coating the soft acrylic emulsion on the surface of the tinned copper wire treated in the step S6.
Preferably, in the step S1, the oxidized layer powder generated in the grinding process is collected.
Preferably, in the step S4, the tin plating bath contains a tin liquid, the tin liquid is added with a brightener and a displacement agent, and the ratio of the tin liquid: brightening agent: the ratio of the dislocation agent is (97-98): (0.8-1.5): (1-1.8).
Preferably, in the step S6, the tin-plated copper wire is subjected to flaw detection by an ultrasonic flaw detection method.
The device for the chemical tinning method on the surface of the copper comprises a tinning bath, wherein a stirring mechanism is arranged in the tinning bath, the notches of the tinning bath are symmetrically connected with guide wheels, and guide rollers are symmetrically and rotatably connected in the tinning bath above the stirring mechanism;
the stirring mechanism comprises a driving motor which is fixedly connected with the center of the bottom of the outer tank of the tinning tank, a sealing bearing is embedded in the center of the bottom of the tin plating tank, the output end of the driving motor is connected with a rotating shaft through a coupler, one end of the rotating shaft, far away from the driving motor, penetrates through the sealing bearing and extends into the tin plating tank, the rotating shaft is fixedly connected with the inner ring wall of the sealing bearing, the shaft wall of the rotating shaft is fixedly sleeved with a driving gear, a driven shaft is symmetrically arranged in the tin plating bath about a rotating shaft, the lower end of the driven shaft is rotatably connected to the bottom of an inner groove of the tin plating bath through a rotating part, a driven gear is fixedly sleeved on the shaft wall of the driven shaft, and the driving gear is meshed with the two driven gears, and a plurality of stirring blades are sleeved on the shaft walls of the rotating shaft and the driven shaft along the vertical direction at uniform intervals.
Preferably, the rotating part comprises an annular block with a T-shaped section and an annular groove with a T-shaped section, the annular block is fixedly connected to the lower end of the driven shaft, the position of the annular groove corresponding to the annular block is arranged at the bottom of an inner groove of the tinning bath, and the annular block is rotatably connected in the annular groove.
Preferably, a rolling groove is formed in one end, far away from the driven shaft, of the annular block, rolling balls are arranged in the rolling groove, the balls penetrate through a notch of the rolling groove, and the balls are connected to the bottom of the annular groove in a rolling mode.
Preferably, a sealing ring is arranged between the annular groove and the annular block, and the sealing ring is connected to the side wall of the vertical end of the annular block.
Preferably, the stirring blades on the rotating shaft and the driven shaft are arranged in a staggered mode.
(III) advantageous effects
Compared with the prior art, the invention provides a method and a device for chemical tinning on the surface of copper, which have the following beneficial effects:
1. this copper surface chemical tinning method, through polishing copper line surface, polish its surperficial oxide layer, to the surface of copper line tin-plating after, detect a flaw to it, thereby will have the copper line of defect to carry out the treatment of organizing the densification and get rid of the defect, improve copper line quality, again to the surface coating of tin-plated copper line wrap up soft acrylic acid emulsion, wrap up and protect the tin coating on tin-plated copper line surface through soft acrylic acid emulsion, prevent that the cladding material from droing from the copper line.
2. This device of copper surface chemical tinning method, through setting up rabbling mechanism, start driving motor, driving motor passes through the axis of rotation and drives axis of rotation and driving gear rotation, and driven gear through meshing with the driving gear drives two driven shafts and does the rotation opposite with axis of rotation direction, and axis of rotation and driven shaft drive respective stirring flabellum when rotating and rotate for tin liquor, brightener and the agent intensive mixing of walking a position in the tinning bath have improved the tinning effect to the copper line.
Drawings
FIG. 1 is a schematic structural diagram of a tin plating bath in the method and apparatus for chemical tin plating on a copper surface according to the present invention;
fig. 2 is an enlarged view of a portion a in fig. 1.
In the figure: 1 tin plating bath, 2 guide wheels, 3 guide rollers, 4 driving motors, 5 sealing bearings, 6 rotating shafts, 7 driving gears, 8 driven shafts, 9 driven gears, 10 stirring fan blades, 11 annular blocks, 12 annular grooves, 13 rolling grooves, 14 balls and 15 sealing rings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a method for electroless tin plating on a copper surface includes the following steps:
s1: polishing the surface of the prepared copper wire to remove an oxide layer on the surface of the copper wire;
s2: washing the copper wire treated in the step S1 with ultrasonic waves to remove powder adhered to the surface of the copper wire;
s3: sending the copper wire processed in the step S2 into a hot air pipeline, wherein hot air flowing in the hot air pipeline not only dries water on the upper surface of the copper wire, but also preheats the copper wire and heats the copper wire, and the temperature of the hot air in the hot air pipeline is 130 ℃;
s4: introducing the copper wire processed in the step S3 into a tinning bath 1, and tinning the surface thereof;
s5: cleaning the tinned copper wire treated in the step S4 by hot water, and wiping the surface of the tinned copper wire by a dry towel;
s6: flaw detection is carried out on the tinned copper wire processed in the step S5, and the unqualified tinned copper wire is subjected to tissue refinement treatment to remove defects;
s7: and coating the soft acrylic emulsion on the surface of the tinned copper wire treated in the step S6.
Through polishing copper wire surface, polish its surperficial oxide layer, carry out the tin-plating back to the surface of copper line, detect a flaw to it, thereby carry out the treatment of organizing the densification to the copper line that will have the defect and get rid of the defect, improve copper line quality, again to the surface coating of tin-plated copper line wrap up soft acrylic emulsion, wrap up and protect the tin coating on tin-plated copper line surface through soft acrylic emulsion, prevent that cladding material from droing from the copper line.
In step S1, oxide layer powder generated during the polishing process is collected.
In the step of S4, the tin plating bath contains tin liquid, brightener and displacement agent are added into the tin liquid, and the ratio of the tin liquid: brightening agent: the ratio of the dislocation agent is 97: 1.3: 1.7.
in step S6, the tin-plated copper wire is subjected to flaw detection by an ultrasonic flaw detection method.
The device for the chemical tinning method on the copper surface comprises a tinning bath 1, wherein a stirring mechanism is arranged in the tinning bath 1, the notches of the tinning bath 1 are symmetrically connected with guide wheels 2, and guide rollers 3 are symmetrically and rotatably connected in the tinning bath 1 above the stirring mechanism;
the stirring mechanism comprises a driving motor 4, the driving motor 4 is fixedly connected with the center of the outer bottom of the tin plating bath 1, a sealing bearing 5 is embedded at the center of the bottom of the tin plating bath 1, the output end of the driving motor 4 is connected with a rotating shaft 6 through a coupler, one end of the rotating shaft 6, far away from the driving motor 4, penetrates through the sealing bearing 5 and extends into the tin plating bath 1, the rotating shaft 6 is fixedly connected with the inner ring wall of the sealing bearing 5, a driving gear 7 is fixedly sleeved on the shaft wall of the rotating shaft 6, driven shafts 8 are symmetrically arranged in the tin plating bath 1 relative to the rotating shaft 6, the lower end of the driven shaft 8 is rotatably connected with the inner bottom of the tin plating bath 1 through a rotating part, a driven gear 9 is fixedly sleeved on the shaft wall of the driven shaft 8, the driving gear 7 is meshed with the two driven gears 9, a plurality of stirring fan blades 10 are uniformly sleeved on the, start driving motor 4, driving motor 4 drives axis of rotation 6 and driving gear 7 through axis of rotation 6 and rotates, drives two driven shafts 8 through driven gear 9 with driving gear 7 engaged with and does the rotation opposite with 6 directions of axis of rotation, and axis of rotation 6 and driven shaft 8 drive respective stirring fan blade 10 when rotating and rotate for tin liquor, brightener and the agent intensive mixing of walking a position in 1 tinning bath have improved the tinning effect to the copper line.
The rotating piece comprises an annular block 11 with a T-shaped section and an annular groove 12 with a T-shaped section, the annular block 11 is fixedly connected to the lower end of the driven shaft 8, the annular groove 12 corresponds to the annular block 11 and is arranged at the bottom of an inner groove of the tinning bath 1, the annular block 11 is rotatably connected to the annular groove 12, the rotating shaft 8 is supported by the annular block 11 clamped into the annular groove 12, and the rotating shaft 8 can rotate relative to the tinning bath 1 while keeping connection.
The rolling groove 13 has been seted up to the one end that the annular piece 11 kept away from driven shaft 8, is equipped with rolling ball 14 in the rolling groove 13, and ball 14 passes the notch setting of rolling groove 13, and ball 14 rolling connection is at the tank bottom of ring channel 12, supports the annular piece 11 in the ring channel 12 through ball 14, drives ball 14 and rolls when the annular piece 11 takes place to rotate, reduces the frictional resistance when the annular piece 11 rotates in ring channel 10.
A sealing ring 15 is arranged between the annular groove 12 and the annular block 11, and the sealing ring 15 is connected to the side wall of the vertical end of the annular block 11 to prevent liquid in the tin-plating bath 1 from entering the annular groove 12.
The stirring blades 10 on the rotating shaft 6 and the driven shaft 8 are arranged in a staggered mode.
In summary, according to the method and the device for chemically plating tin on the surface of the copper wire, the surface of the copper wire is polished, the oxide layer on the surface of the copper wire is polished, after the surface of the copper wire is plated with tin, flaw detection is performed on the copper wire, the defective copper wire is subjected to tissue densification treatment so as to remove the defect, the quality of the copper wire is improved, the surface of the tin-plated copper wire is coated with soft acrylic emulsion, and the tin-plated layer on the surface of the tin-plated copper wire is coated and protected by the soft acrylic emulsion so as to prevent the plating layer from falling off the copper wire; start driving motor 4, driving motor 4 drives axis of rotation 6 and driving gear 7 through axis of rotation 6 and rotates, drives two driven shafts 8 through driven gear 9 with driving gear 7 engaged with and does the rotation opposite with 6 directions of axis of rotation, and axis of rotation 6 and driven shaft 8 drive respective stirring fan blade 10 when rotating and rotate for tin liquor, brightener and the agent intensive mixing of walking a position in 1 tinning bath have improved the tinning effect to the copper line.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The method for chemically plating tin on the surface of copper is characterized by comprising the following steps: the method comprises the following steps:
s1: polishing the surface of the prepared copper wire to remove an oxide layer on the surface of the copper wire;
s2: washing the copper wire treated in the step S1 with ultrasonic waves to remove powder adhered to the surface of the copper wire;
s3: sending the copper wire processed in the step S2 into a hot air pipeline, wherein hot air flowing in the hot air pipeline not only dries water on the upper surface of the copper wire, but also preheats the copper wire and heats the copper wire, and the temperature of the hot air in the hot air pipeline is 140 ℃;
s4: introducing the copper wire processed in the step S3 into a tinning bath (1) and tinning the surface of the copper wire;
s5: cleaning the tinned copper wire treated in the step S4 by hot water, and wiping the surface of the tinned copper wire by a dry towel;
s6: flaw detection is carried out on the tinned copper wire processed in the step S5, and the unqualified tinned copper wire is subjected to tissue refinement treatment to remove defects;
s7: and coating the soft acrylic emulsion on the surface of the tinned copper wire treated in the step S6.
2. The method of chemical tin plating on a copper surface according to claim 1, characterized in that: in the step S1, oxide layer powder generated in the grinding process is collected.
3. The method of chemical tin plating on a copper surface according to claim 1, characterized in that: in the step S4, the tin plating bath contains a tin liquid, in which a brightener and a displacement agent are added, and the ratio of the tin liquid: brightening agent: the ratio of the dislocation agent is (97-98): (0.8-1.5): (1-1.8).
4. The method of chemical tin plating on a copper surface according to claim 1, characterized in that: and in the step S6, performing flaw detection on the tinned copper wire in an ultrasonic flaw detection mode.
5. The device of the chemical tinning method on the surface of copper comprises a tinning bath (1) and is characterized in that: a stirring mechanism is arranged in the tin plating bath (1), the notch of the tin plating bath (1) is symmetrically connected with guide wheels (2), and guide rollers (3) are symmetrically and rotatably connected in the tin plating bath (1) above the stirring mechanism;
the stirring mechanism comprises a driving motor (4), the driving motor (4) is fixedly connected to the center of the outer bottom of the tinning tank (1), a sealing bearing (5) is embedded at the center of the bottom of the tinning tank (1), the output end of the driving motor (4) is connected with a rotating shaft (6) through a coupler, one end of the rotating shaft (6), which is far away from the driving motor (4), penetrates through the sealing bearing (5) and extends into the tinning tank (1), the rotating shaft (6) is fixedly connected with the inner ring wall of the sealing bearing (5), a driving gear (7) is fixedly sleeved on the shaft wall of the rotating shaft (6), a driven shaft (8) is symmetrically arranged in the tinning tank (1) relative to the rotating shaft (6), the lower end of the driven shaft (8) is rotatably connected to the inner groove of the tinning tank (1) through a rotating part, a driven gear (9) is fixedly sleeved on the shaft wall of the driven shaft (8), and the driving gear (7) is meshed with the two driven gears (9), and a plurality of stirring fan blades (10) are sleeved on the shaft walls of the rotating shaft (6) and the driven shaft (8) along the vertical direction at uniform intervals.
6. The apparatus for chemical tinning of a copper surface according to claim 5, characterized in that: the rotating piece comprises a ring-shaped block (11) with a T-shaped section and a ring-shaped groove (12) with a T-shaped section, the ring-shaped block (11) is fixedly connected to the lower end of the driven shaft (8), the ring-shaped groove (12) is formed in the bottom of an inner groove of the tin-plating bath (1) corresponding to the ring-shaped block (11), and the ring-shaped block (11) is rotatably connected to the ring-shaped groove (12).
7. The apparatus for chemical tinning of a copper surface according to claim 6, characterized in that: the rolling groove (13) has been seted up to the one end that the driven shaft (8) was kept away from in annular piece (11), be equipped with rolling ball (14) in rolling groove (13), ball (14) pass the notch setting in rolling groove (13), and ball (14) roll connection is in the tank bottom of ring channel (12).
8. The apparatus for chemical tinning of a copper surface according to claim 6, characterized in that: a sealing ring (15) is arranged between the annular groove (12) and the annular block (11), and the sealing ring (15) is connected to the side wall of the vertical end of the annular block (11).
9. The apparatus for chemical tinning of a copper surface according to claim 5, characterized in that: the stirring fan blades (10) on the rotating shaft (6) and the driven shaft (8) are arranged in a staggered mode.
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| CN202010872059.5A CN111961999A (en) | 2020-08-26 | 2020-08-26 | Method and device for chemical tinning on copper surface |
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| CN202010872059.5A CN111961999A (en) | 2020-08-26 | 2020-08-26 | Method and device for chemical tinning on copper surface |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113737257A (en) * | 2021-09-07 | 2021-12-03 | 鹰潭安禄洪线缆科技有限公司 | Silver plating equipment for processing round copper wire with silver layer and processing method thereof |
| CN115071044A (en) * | 2022-06-17 | 2022-09-20 | 深圳市宇盛光电有限公司 | Manufacturing method of PN copper bar plastic-coated component |
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| CN104060309A (en) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | Surface tinning method of metallic copper wire |
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| CN110846619A (en) * | 2019-10-29 | 2020-02-28 | 宁波四维尔工业有限责任公司 | Surface coloring process for plastic automobile label |
| CN210902918U (en) * | 2019-09-25 | 2020-07-03 | 南通市第二人民医院 | Quick belt cleaning device of gastroenterology scope |
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| CN113737257A (en) * | 2021-09-07 | 2021-12-03 | 鹰潭安禄洪线缆科技有限公司 | Silver plating equipment for processing round copper wire with silver layer and processing method thereof |
| CN115071044A (en) * | 2022-06-17 | 2022-09-20 | 深圳市宇盛光电有限公司 | Manufacturing method of PN copper bar plastic-coated component |
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