CN111958084A - Processing equipment and processing method of solar cell module - Google Patents
Processing equipment and processing method of solar cell module Download PDFInfo
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- CN111958084A CN111958084A CN202010699352.6A CN202010699352A CN111958084A CN 111958084 A CN111958084 A CN 111958084A CN 202010699352 A CN202010699352 A CN 202010699352A CN 111958084 A CN111958084 A CN 111958084A
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- 238000003672 processing method Methods 0.000 title abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 214
- 230000007246 mechanism Effects 0.000 claims abstract description 160
- 238000005476 soldering Methods 0.000 claims abstract description 149
- 238000003466 welding Methods 0.000 claims abstract description 92
- 238000002844 melting Methods 0.000 claims abstract description 45
- 230000008018 melting Effects 0.000 claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 230000007547 defect Effects 0.000 abstract description 10
- 239000012634 fragment Substances 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 13
- 230000035882 stress Effects 0.000 description 9
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- 230000009471 action Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 239000002210 silicon-based material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Abstract
The embodiment of the invention provides a processing device and a processing method of a solar cell module, relating to the technical field of photovoltaic, wherein the processing device specifically comprises: the conveying mechanism, and a soldering paste placing mechanism, a soldering strip placing mechanism and a reflow soldering mechanism which are arranged in sequence; the solar cell module comprises a welding paste placing mechanism, a welding strip placing mechanism and a reflow soldering mechanism, wherein the conveying mechanism is used for conveying solar cells to the welding paste placing mechanism, the welding strip placing mechanism and the reflow soldering mechanism in sequence; the soldering paste placing mechanism is used for placing soldering paste on a bonding pad of the solar cell, and the melting point of the soldering paste is less than or equal to 150 ℃; the solder strip placing mechanism is used for placing the solder strip on the solder paste; and the reflow soldering mechanism is used for melting the soldering paste so as to weld the solar cell slice and the soldering strip, thereby obtaining the solar cell module. The processing equipment provided by the embodiment of the invention can reduce the welding deformation and the welding stress of the solar cell, improve the welding stability, reduce the fragment and hidden crack defects of the solar cell module and meet the mass production requirement of the solar module.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a solar cell module processing device and a solar cell module processing method.
Background
The back contact solar cell module is a module in which positive and negative electrodes are all arranged on the back of the cell, and has better photoelectric conversion efficiency and more attractive appearance because shading loss of a front grid line electrode is eliminated.
In the prior back contact solar module, the connection of the positive and negative electrodes on the back surface of the back contact solar cell sheet is generally realized by the following two methods: the first method is to use a conductive back plate and conductive adhesive to realize the interconnection of positive and negative electrodes, but the conductive back plate and the conductive adhesive have higher cost, and the laminated typesetting equipment has high price, so that the product competitiveness is insufficient, and the market popularization is not facilitated; the second is to use traditional solder strip welding positive and negative electrodes, because the welding only takes place in the back of the back contact solar cell piece, and the coefficient of thermal expansion of solder strip is about six times of silicon material, the solder strip is heated the thermal expansion when melting, the cooling shrink after the welding is finished, lead to the battery piece to take place serious bending deformation very easily, seriously influence welded stability, increased because the piece and the latent defect of splitting that welding stress appears in the battery pack processing procedure, the quality of battery pack has been reduced, hardly satisfy battery pack's volume production requirement.
Disclosure of Invention
In view of the above problems, embodiments of the present invention are proposed in order to provide a solar cell module processing apparatus and a solar cell module processing method that overcome or at least partially solve the above problems.
In order to solve the above problem, in a first aspect, an embodiment of the present invention discloses a processing apparatus for a solar cell module, including: the conveying mechanism, and a soldering paste placing mechanism, a soldering strip placing mechanism and a reflow soldering mechanism which are arranged in sequence; wherein the content of the first and second substances,
the transportation mechanism is used for sequentially conveying the solar cells to the soldering paste placing mechanism, the solder strip placing mechanism and the reflow soldering mechanism;
the soldering paste placing mechanism is used for placing soldering paste on the soldering pads of the solar cell, and the melting point of the soldering paste is less than or equal to 150 ℃;
the solder strip placing mechanism is used for placing solder strips on the solder paste;
and the reflow soldering mechanism is used for melting the soldering paste so as to weld the solar cell piece and the soldering strip to obtain the solar cell module.
Optionally, the reflow soldering mechanism includes: the device comprises a reflow furnace and a welding device arranged in the reflow furnace; wherein the content of the first and second substances,
the reflow furnace is provided with a feeding hole and a discharging hole, the solar cell enters the reflow furnace from the feeding hole, the welding device is used for melting the soldering paste on the solar cell so as to weld the solar cell with the soldering strip, and the welded solar cell is output out of the reflow furnace from the discharging hole.
Optionally, the welding device comprises a heating module, a heat preservation module and a cooling module;
the heating module is used for heating the internal temperature of the reflow oven to a target temperature, wherein the heating rate is greater than or equal to 10 degrees per second;
the heat preservation module is used for keeping the internal temperature at the target temperature and melting the soldering paste, wherein the heat preservation time is more than 10 seconds;
the cooling module is used for reducing the internal temperature so that the solar cell piece is welded with the welding strip, wherein the cooling rate is greater than or equal to 10 degrees per second.
Optionally, the temperature raising module comprises a first heater, a second heater and a third heater which are sequentially arranged, and the first heater is close to the solder strip placement mechanism;
the first heater is used for heating the internal temperature of the reflow oven to a first temperature, the second heater is used for heating the internal temperature of the reflow oven to a second temperature, and the third heater is used for heating the internal temperature of the reflow oven to a target temperature, wherein the first temperature is lower than the second temperature, and the second temperature is lower than the target temperature
Optionally, the welding device is selected from: at least one of an infrared welding device, an electromagnetic welding device and a hot air welding device.
Optionally, the processing apparatus further comprises: and the net pressing placing mechanism is arranged between the solder strip placing mechanism and the reflow soldering mechanism, and the net pressing placing mechanism is used for placing a net on the solder strip so as to fix the position of the solder strip on the solar cell.
Optionally, the solder paste placement mechanism is selected from: at least one of a dispenser, a screen printer and a steel plate printer.
In a second aspect, an embodiment of the present invention further discloses a method for processing a solar cell module, including:
placing soldering paste on a pad of a solar cell by using a soldering paste placing mechanism, wherein the melting point of the soldering paste is less than or equal to 150 ℃;
placing a solder strip on the solder paste by using a solder strip placement mechanism;
and adopting a reflow soldering mechanism to melt the soldering paste so as to weld the solar cell piece and the solder strip to obtain the solar cell module.
Optionally, the step of using a reflow soldering mechanism to melt the solder paste so as to solder the solar cell piece to the solder strip, so as to obtain the solar cell module includes:
raising the internal temperature of the reflow soldering mechanism to a target temperature, wherein the temperature rise rate is greater than or equal to 10 ℃ per second;
maintaining the internal temperature at the target temperature, melting the solder paste, wherein the holding time is greater than 10 seconds;
and reducing the internal temperature to weld the solar cell piece and the solder strip to obtain the solar cell module, wherein the cooling rate is greater than or equal to 10 degrees per second.
Optionally, before the step of melting the solder paste by using a reflow soldering mechanism to solder the solar cell to the solder strip, the method further includes:
and a net pressing placing mechanism is adopted for placing a net pressing on the welding strip so as to fix the position of the welding strip on the solar cell piece.
The embodiment of the invention has the following advantages:
in the embodiment of the invention, the soldering paste can be placed on the soldering pad of the solar cell piece through the soldering paste placing mechanism, the melting point of the soldering paste is less than or equal to 150 ℃, the solder strip can be laid on the soldering paste through the solder strip placing mechanism, and the soldering paste can be melted through the reflow soldering mechanism, so that the solar cell piece is soldered with the solder strip. In practical application, since the melting point of the solder paste is less than or equal to 150 degrees, the reflow soldering mechanism only needs to provide a low temperature to melt the solder paste, so as to solder and connect the solder strip to the solar cell. Therefore, welding between the welding and the solar cell piece can be avoided due to the fact that high-temperature fusion welding is used, welding deformation and welding stress of the solar cell piece are reduced, welding stability is improved, the defects of fragments and hidden cracks of the solar cell module can be reduced, and the requirement of mass production of the solar cell module is met.
Drawings
FIG. 1 is a schematic structural diagram of a solar cell of the present invention;
FIG. 2 is a schematic structural view of a solar cell module processing apparatus according to the present invention;
FIG. 3 is a schematic structural view of a solar cell module according to the present invention;
FIG. 4 is a flow chart illustrating the steps of a method of fabricating a solar module according to the present invention;
FIG. 5 is a flow chart illustrating steps in another method of fabricating a solar cell module according to the present invention;
description of reference numerals: 10-positive electrode connecting electrode, 101-positive electrode bonding pad, 102-positive electrode grid line, 100-solar cell slice, 11-negative electrode connecting electrode, 111-negative electrode bonding pad, 112-negative electrode grid line, 12-welding belt, 20-transport mechanism, 201-roller, 202-conveyor belt, 21-solder paste placing mechanism, 22-reflow soldering mechanism, 221-reflow oven, 222-soldering device, 223-circulating air device, 23-pressing net, 24-bottom heating device, A-cell unit and B-scribing way.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The embodiment of the invention provides processing equipment for a solar cell module, wherein the solar cell module can be a back contact solar cell module, and particularly the solar cell module can be formed by connecting a plurality of back contact solar cells. The processing equipment can be series welding equipment which can realize welding among back contact solar cells so as to connect a plurality of back contact solar cells into a solar module.
Referring to fig. 1, which shows a schematic structural diagram of a solar cell of the present invention, the solar cell shown in fig. 1 may be a back contact solar cell. The back of the solar cell is provided with an electrode, the electrode can comprise a connecting electrode and a thin grid line, and the connecting electrode comprises a bonding pad and a grid line connected with the bonding pad. Specifically, the electrodes may include a positive electrode and a negative electrode, the positive electrode may include a positive connection electrode 10 and a positive fine grid line (not shown in the figure), the negative electrode may include a negative connection electrode 11 and a negative fine grid line (not shown in the figure), the positive connection electrode 10 and the negative connection electrode 11 are distributed in parallel and in a staggered manner, and the positive fine grid line and the negative fine grid line are distributed in parallel and in a staggered manner.
Specifically, the positive connection electrode 10 may include a positive pad 101 and a positive gate line 102 connected to the positive pad 101, and the negative connection electrode 11 may include a negative pad 111 and a negative gate line 112 connected to the negative pad 111, wherein the width of the positive gate line 102 is smaller than the width of the positive pad 101, and the width of the negative gate line 112 is smaller than the width of the negative pad 111. The positive electrode pad 101 and the negative electrode pad 111 may have any suitable shape such as a circle, a rectangle, or an ellipse. For example, the number of the positive electrode grid lines 102 of the back contact solar cell is equal to the number of the negative electrode grid lines 112, the sum of the numbers of the positive electrode grid lines 102 and the negative electrode grid lines 112 may be 10 to 30, the number of the bonding pads of a single grid line is 6 to 20, and the bonding pad paste is silver paste or silver-containing paste.
As shown in fig. 1, the solar cell sheet may include a whole cell of two cells a, and each electrode grid line is divided into a first portion and a second portion within the two cells a, and the polarities of the first portion and the second portion are opposite. And a blank area is arranged between the two battery units A, a scribing channel B is arranged in the blank area, and the solar battery piece is cut by laser scribing equipment along the scribing channel B to form a left half battery piece and a right half battery piece (namely the battery units A) which are divided by the blank area. When the solar cell pieces need to be welded, the half cell pieces do not need to be welded after being rotated by 180 degrees, and only the same welding strip is needed to connect the positive electrode pad 101 of one of the adjacent half cell pieces with the negative electrode pad 111 of the adjacent half cell piece, so that series connection can be realized.
The solar cell sheet can be cut into more sub-cells with approximately equal areas. The reduction in the area of the sub-battery can reduce the warpage after welding. Optionally, the solar cell piece may be cut by a laser scribing process, and the laser scribing may specifically be nondestructive laser scribing.
Referring to fig. 2, which shows a schematic structural diagram of a solar cell module processing apparatus according to the present invention, and fig. 3, which shows a schematic structural diagram of a solar cell module according to the present invention, the processing apparatus shown in fig. 2 can serially weld a plurality of solar cells shown in fig. 1 together to obtain the solar cell module shown in fig. 2.
The solar cell module may specifically include: a transport mechanism 20, and a solder paste placement mechanism 21, a solder ribbon placement mechanism (not shown in the figure), and a reflow soldering mechanism 22 which are arranged in this order; wherein the content of the first and second substances,
the transportation mechanism 20 may be configured to sequentially transport the solar cell 100 to the solder paste placement mechanism 21, the solder ribbon placement mechanism, and the reflow soldering mechanism 22;
the solder paste placing mechanism 21 may be configured to place solder paste on the pads of the solar cell 100, the melting point of the solder paste is less than or equal to 150 degrees, and the pads may include a positive pad 101 and a negative pad 111;
the solder ribbon placement mechanism may be used to place solder ribbon 12 on the solder paste;
the reflow soldering mechanism 22 may be used to melt the solder paste to solder the solar cell sheet 100 to the solder ribbon 12, so as to obtain the solar cell module shown in fig. 3.
In the embodiment of the invention, the solder paste placing mechanism 11 can place the solder paste on the soldering pads of the solar cell 100, the melting point of the solder paste is less than or equal to 150 degrees, the solder strip 12 can be laid on the solder paste by the solder strip placing mechanism, and the solder paste can be melted by the reflow soldering mechanism 22, so that the solar cell 100 is soldered with the solder strip 12. In practical applications, since the melting point of the solder paste is less than or equal to 150 degrees, the reflow soldering mechanism 22 only needs to provide a low temperature to melt the solder paste to solder the solder ribbon 12 to the solar cell 100. Therefore, the welding between the welding and the solar cell piece 100 can be realized by avoiding using the welding strip 12 with higher temperature to melt, the welding deformation and the welding stress of the solar cell piece 100 are reduced, the welding stability is improved, the fragment and hidden crack defects of the solar cell module can be reduced, and the mass production requirement of the solar cell module is met.
Specifically, the transportation mechanism 20 may include a roller 201 and a conveyor belt 202 wound outside the roller 201, the conveyor belt 202 may be used to carry the solar cell 100, and the roller 201 may drive the conveyor belt 202 to rotate, so as to sequentially convey the solar cell 100 on the conveyor belt 202 to the solder paste placement mechanism 21, the solder strip placement mechanism, and the reflow soldering mechanism 22.
In practical application, the processing equipment can also comprise a feeding mechanism and a discharging mechanism. The feeding mechanism may be disposed at one end of the transportation mechanism 20, and the feeding mechanism may be used to lay the solar cell pieces 100 on the conveyor belt 202 of the transportation mechanism 20. The discharging mechanism may be disposed at the other end of the transportation mechanism 20, and the discharging mechanism may be configured to discharge the series-welded solar module from the conveyor belt 202 of the transportation mechanism 20. Moreover, the processing equipment can also comprise a photographing alignment mechanism and a grabbing and releasing mechanism, the solar cell pieces 100 can be aligned and strung on the conveyor belt 202 in a row by the matching use of the photographing alignment mechanism and the grabbing and releasing mechanism, and every other solar cell piece 100 can rotate 180 degrees.
Specifically, when the feeding mechanism lays the solar cell sheet 100 on the conveyor belt 202, the pads on the back surface of the solar cell sheet 100 may be placed upward. When the transportation mechanism 20 transports the solar cell 100 to a station where the solder paste placing mechanism 21 is provided, the solder paste placing mechanism 21 may place solder paste on the pads of the solar cell 100. In practical applications, the solder paste placing mechanism 21 may place the solder paste on each of the positive electrode pad 101 and the negative electrode pad 111 of the back electrode of the solar cell sheet 100.
Optionally, the solder paste may be a low-temperature solder paste with a melting point of less than or equal to 150 degrees, and the low-temperature solder paste may specifically be a solder paste containing a tin-bismuth alloy. Since the peak temperature of the reflow soldering of the low-temperature solder paste is between 170 ℃ and 200 ℃, the reflow soldering mechanism 22 can solder and connect the solder strip 12 to the solar cell 100 by melting the solder paste only at a relatively low temperature, thereby avoiding the use of a relatively high temperature for melting the solder strip 12 to realize the soldering between the solder strip 12 and the solar cell 100, and reducing the soldering deformation and the soldering stress of the solar cell 100.
Alternatively, the solder paste placement mechanism 21 may be selected from: at least one of a dispenser, a screen printer and a steel plate printer. That is, the solder paste placing mechanism 21 may place the solder paste on the pads of the solar cell 100 by means of dispensing, screen printing or steel printing.
It should be noted that when the solder paste placing mechanism 21 places the solder paste on the pad of the solar cell 100, the solder paste needs to be aligned with the center of the pad, and the size of the pad should be smaller than that of the pad so as to avoid the solder paste from overflowing from the pad after melting, and furthermore, during the transportation of the solar cell 100, the solder paste on the solar cell 100 should be avoided from touching. In addition, the solder paste may be placed before laser scribing of the solar cell 100, or may be placed after laser scribing, which is not limited by the embodiment of the present invention.
In some optional embodiments of the present invention, the processing equipment may further include a paste placing mechanism, and the paste placing mechanism may be configured to apply a dot-shaped insulating paste between adjacent pads of the same grid line of the solar cell sheet 100, and the size of the insulating paste may be smaller than that of the solder paste. In practical application, the insulating paste not only can facilitate alignment and transmission in the subsequent process of laying the solder strip 12 and the fixing effect in the welding process, but also can absorb thermal stress in the welding process, and further improves the quality of the solar cell module.
It should be noted that the paste placing mechanism may be an independent mechanism and disposed close to the solder paste placing mechanism 21, or may be integrated on the solder paste placing mechanism 21, which is not limited in the embodiment of the present invention.
The solder strip placement mechanism can realize straightening, cutting and carrying of the solder strip 12, and can place the solder strip 12 on grid lines of the solar cell 100 in a contraposition manner, wherein the grid lines specifically include a positive grid line 102 and a negative grid line 112. Specifically, the solder strip placing mechanism may place one part of the cut solder strip 12 on the positive electrode pad 101 of one solar cell piece 100 and another part on the negative electrode pad 111 adjacent to the solar cell piece 100. The solder strips 12 contact the solder paste on the positive electrode pads 101 and the negative electrode pads 111 to form a preliminary connection and fixation between the adjacent solar cells 100.
Optionally, the width of the solder strip 12 is 0.3-1.0 mm, the cross-sectional shape of the solder strip 12 may be rectangular, triangular or circular, the surface plating layer of the solder strip 12 may be Sn, SnPb or SnBi plating, and the alignment accuracy between the solder strip 12 and the grid line of the solar cell 100 is less than or equal to 0.2 mm.
In some embodiments of the present invention, the processing apparatus may further comprise: and the net pressing placement mechanism can be arranged between the solder strip placement mechanism and the reflow soldering mechanism 22, and the net pressing placement mechanism can be used for placing a net pressing 23 on the solder strip 12 so as to fix the position of the solder strip 12 on the solar cell 100. The pressing net 23 can be used for pressing the solder strip 12, so that the solder strip 12 is prevented from displacing or deviating on the solar cell piece 100 in the process of conveying or welding the solar cell piece 100, further, the defects of missing welding and insufficient welding can be avoided, and the welding quality of the solar cell module is improved.
In particular, the mesh pressing placement mechanism may be used to place a mesh pressing 23 on a weld bead 12. The presser 23 may be provided with a plurality of rows of elastic presser pins, which may be presser pins connected by a compressible spring. The number of rows of the elastic pressing pins may correspond to the number of rows of grid lines on the solar cell 100, and each row of the elastic pressing pins may be pressed on the same grid line. In practical application, the number of the single row of elastic pressing pins can be 2-10, which is not limited in the embodiment of the invention.
In an embodiment of the present invention, the reflow soldering mechanism 22 may specifically include: a reflow furnace 221 and a soldering device 222 provided in the reflow furnace 221; the reflow oven 221 is provided with a feed opening and a discharge opening, under the conveying action of the conveying mechanism 20, the solar cell 100 can enter the reflow oven 221 from the feed opening, the welding device 222 can be used for melting the solder paste on the solar cell 100, so that the solar cell 100 is welded with the solder strip 12, and the welded solar cell 100 is output to the outside of the reflow oven 221 from the discharge opening.
In a specific application, the soldering device 222 may be used to heat the solar cell 100 entering the reflow oven 221 so as to melt solder paste on the solar cell 100, and since the solder paste is disposed between the solder pads of the solar cell 100 and the solder strips 12, the solder pads of the solar cell 100 and the solder strips 12 may be connected together by melting the solder paste, so as to achieve series soldering of the solar cell 100, and obtain the solar cell module.
Specifically, since the melting point of the solder paste is less than or equal to 150 degrees, the soldering device 222 only needs to provide a lower temperature (for example, about 170 degrees) to melt the solder paste to solder the solder ribbon 12 to the solar cell 100, so as to avoid melting the solder ribbon 12 at a higher temperature to realize soldering with the solar cell 100, and reduce soldering deformation and soldering stress of the solar cell 100.
Alternatively, the welding device 222 may be selected from: at least one of an infrared welding device, an electromagnetic welding device and a hot air welding device, the specific type of the welding device 222 may not be limited in the embodiments of the present invention.
In the embodiment of the present invention, the welding device 222 may include a temperature raising module, a temperature keeping module, and a temperature lowering module; the temperature raising module may be configured to raise an internal temperature of the reflow oven 221 to a target temperature to melt the solder paste, wherein a temperature raising rate is greater than or equal to 10 degrees per second; the soak module may be to maintain the internal temperature at the target temperature to sufficiently melt the solder paste, wherein a soak time is greater than 10 seconds; the cooling module can be used for reducing the internal temperature, so that the soldering paste is cooled and solidified, and the solar cell piece 100 and the solder strip 12 are welded, wherein the cooling rate is greater than or equal to 10 degrees per second. That is, the process of welding the solder strip 12 to the solar cell 100 by the welding device 222 may specifically include three continuous processes of heating, heat preservation, and cooling.
Specifically, because the heating rate of the heating module and the cooling rate of the cooling module are relatively high, the production efficiency of the solar cell module and the equipment capacity of the processing equipment can be greatly improved. Meanwhile, due to the pre-pressing of the pressing net 23 on the welding strip 12, the soldering paste can be deformed and diffused to the welding pad area in advance, the welding effect and quality can be guaranteed by quickly heating and cooling, the defects that the molten soldering paste is diffused to an undesirable area to cause short circuit and the like can be reduced, and the welding quality of the solar cell module can be improved.
In the embodiment of the invention, the soldering process is reflow soldering, and the soldering interconnection of the solder strip 12 and the soldering pad of the solar cell 100 is completed through the melting and solidification of the solder paste, and the serial connection of the adjacent solar cells 100 is realized. Because the peak temperature of reflow soldering is usually lower than that of the conventional soldering process, the warpage caused by soldering thermal stress is small, the warpage of the solar cell piece 100 in the series connection process can be effectively reduced, and the reliability of the solar cell module is improved.
It should be noted that the target temperature may be slightly higher than the melting point of the solder paste, so that the solder paste is sufficiently melted. For example, in the case where the melting point of the solder paste is 150, the target temperature may be set to about 170 degrees.
In some optional embodiments of the present invention, the temperature raising module may include a first heater, a second heater, and a third heater, which are sequentially disposed, where the first heater is close to the solder strip placement mechanism; the first heater may be used to heat the internal temperature of the reflow oven 221 to a first temperature, the second heater may be used to heat the internal temperature of the reflow oven 221 to a second temperature, and the third heater may be used to heat the internal temperature of the reflow oven 221 to a target temperature, wherein the first temperature is lower than the second temperature, and the second temperature is lower than the target temperature.
Specifically, the first heater, the second heater and the third heater sequentially heat the solar cell 100, so that a temperature gradient can be formed in the heating process, the soldering effect of reflow soldering is favorably improved, and the soldering quality of the solar cell module can be improved.
For example, the first temperature may be 130 degrees, the second temperature may be 150 degrees, and the target temperature may be 170 degrees.
In practical applications, the first heater, the second heater, and the third heater may be multiple groups of heating lamp tubes with different powers, or may be other heating devices capable of providing different heating temperatures.
In the embodiment of the present invention, the reflow soldering mechanism 22 may further include a circulating air device 223, and the circulating air device 223 may be disposed at the top of the reflow oven 221. The air circulation device 223 may be used to control the air inside the reflow oven 221 to circulate so as to control the uniformity of the temperature of the internal temperature of the reflow oven 221, and thus, the improvement of the soldering effect of reflow soldering is facilitated.
Optionally, the processing equipment may further include a bottom heating device 24, and the bottom heating device 24 may be disposed near the conveyor belt 202 of the transportation mechanism 20 to heat the bottom of the solar cell 100 on the conveyor belt 202, so as to preheat the solar cell before welding, and thus, the welding effect of the solar cell 100 may be further improved.
In the embodiment of the invention, as the processing equipment integrates the soldering paste placing mechanism 21 and the reflow soldering mechanism 22, the processing equipment can realize continuous production of solar cell modules, the yield of production efficiency is high, and the occupied area of the processing equipment can be reduced.
To sum up, the processing equipment of the solar cell module according to the embodiment of the present invention may specifically include the following advantages:
in the embodiment of the invention, the soldering paste can be placed on the soldering pad of the solar cell piece through the soldering paste placing mechanism, the melting point of the soldering paste is less than or equal to 150 ℃, the solder strip can be laid on the soldering paste through the solder strip placing mechanism, and the soldering paste can be melted through the reflow soldering mechanism, so that the solar cell piece is soldered with the solder strip. In practical application, since the melting point of the solder paste is less than or equal to 150 degrees, the reflow soldering mechanism only needs to provide a low temperature to melt the solder paste, so as to solder and connect the solder strip to the solar cell. Therefore, welding between the welding and the solar cell piece can be avoided due to the fact that high-temperature fusion welding is used, welding deformation and welding stress of the solar cell piece are reduced, welding stability is improved, the defects of fragments and hidden cracks of the solar cell module can be reduced, and the requirement of mass production of the solar cell module is met.
The embodiment of the invention also provides a processing method of the solar cell module, and the processing method can be completed by adopting the processing equipment in the embodiments.
Referring to fig. 4, a flow chart of steps of a processing method of a solar cell module according to the present invention is shown, and the processing method may specifically include:
step 401: and placing soldering paste on the bonding pads of the solar cell by using a soldering paste placing mechanism, wherein the melting point of the soldering paste is less than or equal to 150 ℃.
In the embodiment of the invention, when the transportation mechanism 20 transports the solar cell 100 to the station provided with the solder paste placing mechanism 21, the solder paste placing mechanism 21 can place solder paste on the soldering pads of the solar cell 100. In practical applications, the solder paste placing mechanism 21 may place the solder paste on each of the positive electrode pad 101 and the negative electrode pad 101 of the back electrode of the solar cell sheet 100.
Optionally, the solder paste may be a low-temperature solder paste with a melting point of less than or equal to 150 degrees, and the low-temperature solder paste may specifically be a solder paste containing a tin-bismuth alloy. Because the peak temperature of the reflow soldering of the low-temperature solder paste is between 170 ℃ and 200 ℃, the reflow soldering mechanism 23 can solder and connect the solder strip 12 to the solar cell 100 only by melting the solder paste at a lower temperature, thereby avoiding the use of a higher temperature for melting the solder strip 12 to realize the soldering with the solar cell 100 and reducing the soldering deformation and the soldering stress of the solar cell 100.
Alternatively, the solder paste placement mechanism 21 may be selected from: at least one of a dispenser, a screen printer and a steel plate printer. That is, the solder paste placing mechanism 21 may place the solder paste on the pads of the solar cell 100 by means of dispensing, screen printing or steel printing.
Step 402: and placing the solder strip on the solder paste by adopting a solder strip placing mechanism.
In the embodiment of the present invention, the solder strip placement mechanism can realize straightening, cutting and transporting of the solder strip 12, and can place the solder strip 12 on the grid line of the solar cell 100 in a contraposition manner, where the grid line specifically may include the positive grid line 102 and the negative grid line 112. Specifically, the solder strip placing mechanism may place one part of the cut solder strip 12 on the positive electrode pad 101 of one solar cell piece 100 and another part on the negative electrode pad 111 adjacent to the solar cell piece 100. The solder strips 12 contact the solder paste on the positive electrode pads 101 and the negative electrode pads 111 to form a preliminary connection and fixation between the adjacent solar cells 100.
Step 403: and adopting a reflow soldering mechanism to melt the soldering paste so as to weld the solar cell piece and the solder strip to obtain the solar cell module.
In an embodiment of the present invention, the reflow soldering mechanism 22 may specifically include: a reflow furnace 221 and a soldering device 222 provided in the reflow furnace 221; the reflow oven 221 is provided with a feed inlet and a discharge outlet, under the conveying action of the conveying mechanism 20, the solar cell 100 can enter the reflow oven 221 from the feed inlet, the welding device 222 can be used for melting the solder paste on the solar cell 100, so that the solar cell 100 is welded with the solder strip, and the welded solar cell 100 is output to the outside of the reflow oven 221 from the discharge outlet.
In a specific application, the soldering device 222 may be used to heat the solar cell 100 entering the reflow oven 221 so as to melt solder paste on the solar cell 100, and since the solder paste is disposed between the solder pads of the solar cell 100 and the solder strips 12, the solder pads of the solar cell 100 and the solder strips 12 may be connected together by melting the solder paste, so as to achieve series soldering of the solar cell 100, and obtain the solar cell module.
Specifically, since the melting point of the solder paste is less than or equal to 150 degrees, the soldering device 222 only needs to provide a lower temperature (for example, about 170 degrees) to melt the solder paste to solder the solder ribbon 12 to the solar cell 100, so as to avoid melting the solder ribbon 12 at a higher temperature to realize soldering with the solar cell 100, and reduce soldering deformation and soldering stress of the solar cell 100.
Optionally, step 403 may include the following sub-steps:
substep 4031: raising the internal temperature of the reflow soldering mechanism to a target temperature, wherein the temperature raising rate is greater than or equal to 10 degrees per second.
Substep 4031 maintains the internal temperature at the target temperature, melting the solder paste, wherein the hold time is greater than 10 seconds.
Substep 4031 is to reduce the internal temperature to weld the solar cell piece and the solder strip, so as to obtain a solar cell module, wherein the cooling rate is greater than or equal to 10 degrees per second.
In the embodiment of the invention, because the heating rate and the cooling rate are higher, the production efficiency of the solar cell module and the equipment capacity of the processing equipment can be greatly improved.
Referring to fig. 5, which shows a flow chart of steps of another solar cell module processing method according to the present invention, before step 403 of the processing method shown in fig. 4, the processing method shown in fig. 5 may further include:
step 404: and a net pressing placing mechanism is adopted for placing a net pressing on the welding strip so as to fix the position of the welding strip on the solar cell piece.
In an embodiment of the present invention, the mesh pressing placement mechanism may be disposed between the solder ribbon placement mechanism and the reflow soldering mechanism 22, and the mesh pressing placement mechanism may be configured to place a mesh pressing 23 on the solder ribbon 12 to fix the position of the solder ribbon 12 on the solar cell 100. The pressing net 23 can be used for pressing the solder strip 12, so that the solder strip 12 is prevented from displacing or deviating on the solar cell piece 100 in the process of conveying or welding the solar cell piece 100, further, the defects of missing welding and insufficient welding can be avoided, and the welding quality of the solar cell module is improved.
Meanwhile, due to the pre-pressing of the pressing net 23 on the welding strip 12, the soldering paste can be deformed and diffused to the welding pad area in advance, the welding effect and quality can be guaranteed by quickly heating and cooling, the defects that the molten soldering paste is diffused to an undesirable area to cause short circuit and the like can be reduced, and the welding quality of the solar cell module can be improved.
In the embodiment of the invention, the soldering paste can be placed on the soldering pad of the solar cell piece through the soldering paste placing mechanism, the melting point of the soldering paste is less than or equal to 150 ℃, the solder strip can be laid on the soldering paste through the solder strip placing mechanism, and the soldering paste can be melted through the reflow soldering mechanism, so that the solar cell piece is soldered with the solder strip. In practical application, since the melting point of the solder paste is less than or equal to 150 degrees, the reflow soldering mechanism only needs to provide a low temperature to melt the solder paste, so as to solder and connect the solder strip to the solar cell. Therefore, welding between the welding and the solar cell piece can be avoided due to the fact that high-temperature fusion welding is used, welding deformation and welding stress of the solar cell piece are reduced, welding stability is improved, the defects of fragments and hidden cracks of the solar cell module can be reduced, and the requirement of mass production of the solar cell module is met.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is provided for the processing equipment of a solar cell module and the processing method of a solar cell module provided by the present invention, and the principle and the implementation mode of the present invention are explained by applying specific examples, and the description of the above examples is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A processing apparatus of a solar cell module, comprising: the conveying mechanism, and a soldering paste placing mechanism, a soldering strip placing mechanism and a reflow soldering mechanism which are arranged in sequence; wherein the content of the first and second substances,
the transportation mechanism is used for sequentially conveying the solar cells to the soldering paste placing mechanism, the solder strip placing mechanism and the reflow soldering mechanism;
the soldering paste placing mechanism is used for placing soldering paste on the soldering pads of the solar cell, and the melting point of the soldering paste is less than or equal to 150 ℃;
the solder strip placing mechanism is used for placing solder strips on the solder paste;
and the reflow soldering mechanism is used for melting the soldering paste so as to weld the solar cell piece and the soldering strip to obtain the solar cell module.
2. The processing apparatus of claim 1, wherein the reflow soldering mechanism comprises: the device comprises a reflow furnace and a welding device arranged in the reflow furnace; wherein the content of the first and second substances,
the reflow furnace is provided with a feeding hole and a discharging hole, the solar cell enters the reflow furnace from the feeding hole, the welding device is used for melting the soldering paste on the solar cell so as to weld the solar cell with the soldering strip, and the welded solar cell is output out of the reflow furnace from the discharging hole.
3. The processing apparatus according to claim 2, wherein the welding device comprises a temperature raising module, a temperature keeping module, and a temperature lowering module;
the heating module is used for heating the internal temperature of the reflow oven to a target temperature, wherein the heating rate is greater than or equal to 10 degrees per second;
the heat preservation module is used for keeping the internal temperature at the target temperature and melting the soldering paste, wherein the heat preservation time is more than 10 seconds;
the cooling module is used for reducing the internal temperature so that the solar cell piece is welded with the welding strip, wherein the cooling rate is greater than or equal to 10 degrees per second.
4. The processing equipment according to claim 2, wherein the temperature raising module comprises a first heater, a second heater and a third heater which are arranged in sequence, and the first heater is close to the solder strip placement mechanism;
the first heater is used for heating the internal temperature of the reflow oven to a first temperature, the second heater is used for heating the internal temperature of the reflow oven to a second temperature, and the third heater is used for heating the internal temperature of the reflow oven to a target temperature, wherein the first temperature is lower than the second temperature, and the second temperature is lower than the target temperature.
5. The processing plant according to claim 2, characterized in that said welding means are selected from: at least one of an infrared welding device, an electromagnetic welding device and a hot air welding device.
6. The processing apparatus as set forth in claim 1, further comprising: and the net pressing placing mechanism is arranged between the solder strip placing mechanism and the reflow soldering mechanism, and the net pressing placing mechanism is used for placing a net on the solder strip so as to fix the position of the solder strip on the solar cell.
7. The processing apparatus of claim 1, wherein the solder paste placement mechanism is selected from the group consisting of: at least one of a dispenser, a screen printer and a steel plate printer.
8. A method for processing a solar cell module is characterized by comprising the following steps:
placing soldering paste on a pad of a solar cell by using a soldering paste placing mechanism, wherein the melting point of the soldering paste is less than or equal to 150 ℃;
placing a solder strip on the solder paste by using a solder strip placement mechanism;
and adopting a reflow soldering mechanism to melt the soldering paste so as to weld the solar cell piece and the solder strip to obtain the solar cell module.
9. The manufacturing method of claim 8, wherein the step of using a reflow soldering mechanism to melt the solder paste to solder the solar cell to the solder ribbon to obtain the solar cell module comprises:
raising the internal temperature of the reflow soldering mechanism to a target temperature, wherein the temperature rise rate is greater than or equal to 10 ℃ per second;
maintaining the internal temperature at the target temperature, melting the solder paste, wherein the holding time is greater than 10 seconds;
and reducing the internal temperature to weld the solar cell piece and the solder strip to obtain the solar cell module, wherein the cooling rate is greater than or equal to 10 degrees per second.
10. The manufacturing method of claim 8, wherein before the step of using a reflow soldering mechanism to melt the solder paste to solder the solar cell to the solder ribbon to obtain the solar cell module, the method further comprises:
and a net pressing placing mechanism is adopted for placing a net pressing on the welding strip so as to fix the position of the welding strip on the solar cell piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010699352.6A CN111958084A (en) | 2020-07-17 | 2020-07-17 | Processing equipment and processing method of solar cell module |
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| CN202010699352.6A CN111958084A (en) | 2020-07-17 | 2020-07-17 | Processing equipment and processing method of solar cell module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420791A (en) * | 2022-01-19 | 2022-04-29 | 杭州康奋威科技股份有限公司 | Non-intermittent steady-state welding method and device for solar cell |
| CN116213871A (en) * | 2023-03-03 | 2023-06-06 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
-
2020
- 2020-07-17 CN CN202010699352.6A patent/CN111958084A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420791A (en) * | 2022-01-19 | 2022-04-29 | 杭州康奋威科技股份有限公司 | Non-intermittent steady-state welding method and device for solar cell |
| CN116213871A (en) * | 2023-03-03 | 2023-06-06 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
| CN116213871B (en) * | 2023-03-03 | 2023-08-25 | 北京铁科世纪科技有限公司 | Hot air type reflow soldering device and method for SMT (surface mounted technology) patch |
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