CN111957611A - Packaging detection equipment with automatic sorting function for semiconductors - Google Patents
Packaging detection equipment with automatic sorting function for semiconductors Download PDFInfo
- Publication number
- CN111957611A CN111957611A CN202010822416.7A CN202010822416A CN111957611A CN 111957611 A CN111957611 A CN 111957611A CN 202010822416 A CN202010822416 A CN 202010822416A CN 111957611 A CN111957611 A CN 111957611A
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- Prior art keywords
- lock pin
- connecting rod
- automatic sorting
- special
- sorting function
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Sorting Of Articles (AREA)
Abstract
The invention discloses a packaging detection device with an automatic sorting function for a semiconductor, which comprises a vibrating disc, wherein a partition plate is arranged below the vibrating disc, a telescopic rod is arranged on the right side of a guide rail, a first servo motor is arranged above a feeding working box, a first linear rack is welded above the interior of the feeding working box, a second linear rack is arranged below a first special-shaped gear, a first lock pin is arranged above the telescopic rod, a second lock pin is arranged on the left side above a first connecting rod, a press plate is welded below a lifting column, and compared with the existing common packaging detection device, the packaging detection device with the automatic sorting function for the semiconductor is provided with a second special-shaped gear, the second servo motor drives the second special-shaped gear to rotate, the second special-shaped gear drives a rotary table to rotate through the second gear, and the second special-shaped gear rotates for a circle, the turntable rotates for 60 degrees, and automatic sorting operation can be carried out on the semiconductor.
Description
Technical Field
The invention relates to the technical field of packaging detection, in particular to packaging detection equipment with an automatic sorting function for a semiconductor.
Background
The packaging test is actually a post-packaging test, and a process of confirming the structure and the electrical function of the manufactured semiconductor element to ensure that the semiconductor element meets the requirements of a system is called a post-packaging test.
Disclosure of Invention
The invention aims to provide a packaging detection device with an automatic sorting function for semiconductors, which is used for solving the problems that the semiconductors cannot be automatically sorted generally and the use requirements of people cannot be well met in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: an encapsulation detection device with an automatic sorting function for semiconductors comprises a vibration disc, a partition plate is arranged below the vibration disc, a guide rail is arranged below the partition plate, a telescopic rod is arranged on the right side of the guide rail, a feeding working box is welded on the right side of the telescopic rod, a first servo motor is arranged above the feeding working box, a first linear rack is welded above the feeding working box, a first special-shaped gear is arranged below the first linear rack, a second linear rack is arranged below the first special-shaped gear, a first lock pin is arranged above the telescopic rod, a first connecting rod is screwed above the first lock pin, a second lock pin is arranged on the left side above the first connecting rod, a lifting column is screwed on the left side of the second lock pin, a pressing plate is welded below the lifting column, an encapsulation detector is arranged below the partition plate, a pin groove is arranged in the packaging detector, a support plate is welded below the packaging detector, a second connecting rod is welded below the support plate, a third lock pin is arranged below the second connecting rod, a third connecting rod is screwed below the left side of the third lock pin, a fifth lock pin is arranged below the third connecting rod, a connecting plate is screwed below the fifth lock pin, an air cylinder is welded above the connecting plate, an air rod is arranged on the left side of the air cylinder, a sixth lock pin is arranged on the left side of the air rod, a groove is arranged outside the sixth lock pin, a seventh lock pin is arranged on the left side of the lower part of the groove, a fourth connecting rod is arranged above the groove, an eighth lock pin is arranged on the right side of the fourth connecting rod, a rotary disc is welded below the connecting plate, a rotary shaft penetrates through the inside of the rotary disc, and a first gear is arranged below the rotary shaft, and the right side of the first gear is provided with a second special-shaped gear, a second servo motor is arranged below the second special-shaped gear, a frame is arranged below the second servo motor, and a containing box is installed on the left side of the frame.
Preferably, the horizontal center line of the guide rail coincides with the horizontal center line of the telescopic rod, and the horizontal center line of the guide rail coincides with the horizontal center line of the encapsulated detector.
Preferably, the number of the packaged detectors is six, and the position distribution of the six packaged detectors is circumferential distribution by taking the central axis of the rotating shaft as a circle center.
Preferably, the telescopic length of the telescopic rod is equal to the length from the right side of the guide rail to the right side in the partition plate.
Preferably, the lifting height of the lifting column is equal to the distance from the pressure plate to the lower part of the partition plate.
Preferably, the distance between the partition and the packaged detector is equal to the height of the semiconductor.
Preferably, the rotation angle of the second link is 180 °, and after the second link rotates 180 °, the upper surface of the package detector is attached to the upper surface of the storage box.
Preferably, the central axis of the guide rail is parallel to the central axis of the pin slot.
Preferably, the turntable rotates 60 ° for each revolution of the second profile gear.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the semiconductor feeding device, the feeding work box is arranged, the first servo motor drives the first special-shaped gear to rotate, the first special-shaped gear drives the feeding work box to move by driving the first linear rack and the second linear rack to move, and the feeding work box drives the telescopic rod to move so as to feed semiconductors.
2. According to the invention, the lifting column is arranged, the telescopic rod drives the first connecting rod to rotate through the first lock pin, the first connecting rod drives the lifting column to move up and down through the second lock pin, and the lifting column inserts the semiconductor into the silver angle groove on the packaging detection through the pressing plate so as to carry out ordered feeding operation on the semiconductor.
3. According to the invention, the cylinder is arranged, the cylinder drives the sixth lock pin in the groove to move through the air rod, the sixth lock pin drives the eighth lock pin to rotate through the fourth connecting rod, the sixth lock pin drives the packaging detector on the supporting plate to rotate through the second connecting rod, and the semiconductor subjected to packaging detection is placed in the containing box for blanking.
4. According to the automatic semiconductor sorting machine, the second special-shaped gear is arranged, the second servo motor drives the second special-shaped gear to rotate, the second special-shaped gear drives the turntable to rotate through the second gear, the second special-shaped gear rotates for a circle, the turntable rotates for 60 degrees, and automatic semiconductor sorting operation can be carried out.
5. The invention has the advantages that the storage boxes are arranged, six storage boxes are arranged, one storage box is used for storing the semiconductors which do not pass the packaging detection, and the other five storage boxes are used for automatically sorting the semiconductors which pass the packaging detection, so that the equipment operation is simplified.
Drawings
FIG. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of a first connecting rod connection structure according to the present invention;
FIG. 4 is a schematic structural view of a feeding work box according to the present invention;
FIG. 5 is a schematic view of a second shaped gear of the present invention;
FIG. 6 is a schematic view of a fourth connecting rod according to the present invention.
In the figure: 1. a vibrating pan; 2. a partition plate; 3. a guide rail; 4. a telescopic rod; 5. a feeding work box; 6. a first servo motor; 7. a first linear rack; 8. a first shaped gear; 9. a second linear rack; 10. a first lock pin; 11. a first link; 12. a second lock pin; 13. a lifting column; 14. pressing a plate; 15. packaging the detector; 16. a lead groove; 17. a support plate; 18. a second link; 19. a third lock pin; 20. a third link; 21. a fifth locking pin; 22. a connecting plate; 23. a cylinder; 24. a gas lever; 25. a sixth locking pin; 26. a groove; 27. a seventh locking pin; 28. a fourth link; 29. an eighth locking pin; 30. a turntable; 31. a rotating shaft; 32. a first gear; 33. a second shaped gear; 34. a second servo motor; 35. a frame; 36. a storage box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a packaging detection device with an automatic sorting function for semiconductors comprises a vibration disc 1, a partition plate 2 is arranged below the vibration disc 1, a guide rail 3 is arranged below the partition plate 2, a telescopic rod 4 is arranged on the right side of the guide rail 3, a feeding working box 5 is welded on the right side of the telescopic rod 4, a first servo motor 6 is arranged above the feeding working box 5, a first linear rack 7 is welded on the upper portion inside the feeding working box 5, a first special-shaped gear 8 is arranged below the first linear rack 7, a second linear rack 9 is arranged below the first special-shaped gear 8, a first lock pin 10 is arranged above the telescopic rod 4, a first connecting rod 11 is rotatably connected above the first lock pin 10, a second lock pin 12 is arranged on the left side above the first connecting rod 11, a lifting column 13 is rotatably connected on the left side of the second lock pin 12, a pressing plate 14 is welded below the lifting column 13, a packaging detector 15 is arranged below the partition board 2, a pin groove 16 is arranged inside the packaging detector 15, a support plate 17 is welded below the packaging detector 15, a second connecting rod 18 is welded below the support plate 17, a third lock pin 19 is arranged below the second connecting rod 18, a third connecting rod 20 is screwed below the third lock pin 19, a fifth lock pin 21 is arranged below the third connecting rod 20, a connecting plate 22 is screwed below the fifth lock pin 21, a cylinder 23 is welded above the connecting plate 22, a gas lever 24 is arranged on the left side of the cylinder 23, a sixth lock pin 25 is arranged on the left side of the gas lever 24, a groove 26 is arranged outside the sixth lock pin 25, a seventh lock pin 27 is arranged on the left side below the groove 26, a fourth connecting rod 28 is arranged above the groove 26, an eighth lock pin 29 is arranged on the right side of the fourth connecting rod 28, a rotary table 30 is welded below the connecting plate 22, a rotating shaft 31 penetrates through the rotating disc 30, a first gear 32 is arranged below the rotating shaft 31, a second special-shaped gear 33 is arranged on the right side of the first gear 32, a second servo motor 34 is arranged below the second special-shaped gear 33, a frame 35 is arranged below the second servo motor 34, and a storage box 36 is arranged on the left side of the frame 35.
The working principle is as follows: when the packaging detection equipment with the automatic sorting function for the semiconductors is used, firstly, the semiconductors are placed in a vibration disc 1, then the semiconductors are orderly placed into a guide rail 3 in a partition board 2 through vibration of the vibration disc 1, then, a first servo motor 6 drives a first special-shaped gear 8 in a feeding working box 5 to rotate, the first special-shaped gear 8 drives a first linear rack 7 and a second linear rack 9 to move, the first linear rack 7 and the second linear rack 9 move to drive a telescopic rod 4 to move, the telescopic rod 4 drives a first connecting rod 11 to rotate through a first lock pin 10, the first connecting rod 11 drives a lifting column 13 to move up and down through a second lock pin 12, the lifting column 13 presses the semiconductors into pin grooves 16 in a packaging detector 15 through a pressing plate 14 to perform packaging detection on the semiconductors, then, the second special-shaped servo motor 34 rotates, the second servo motor 34 drives a first gear 32 to rotate through a second gear 33, the first gear 32 drives the turntable 30 to rotate through the rotating shaft 31, then the air cylinder 23 on the connecting plate 22 drives the sixth lock pin 25 in the groove 26 to move through the air rod 24, the sixth lock pin 25 drives the fourth connecting rod 28 to rotate around the seventh lock pin 27 through the seventh lock pin 27, then the fifth lock pin 21 drives the third lock pin 19 to rotate around the fifth lock pin 21 through the third connecting rod 20, then the second connecting rod 18 drives the packaging detector 15 on the supporting plate 17 to rotate 180 degrees through the eighth lock pin 29 and the third lock pin 19, and the semiconductor is placed in the corresponding storage box 36 for automatic sorting of the semiconductor, which is the working principle of the packaging detection equipment with the automatic sorting function for the semiconductor.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A package inspection apparatus for semiconductors with automatic sorting function, comprising a vibrating tray (1), characterized in that: a partition plate (2) is arranged below the vibration disc (1), a guide rail (3) is arranged below the partition plate (2), a telescopic rod (4) is arranged on the right side of the guide rail (3), a feeding working box (5) is welded on the right side of the telescopic rod (4), a first servo motor (6) is arranged above the feeding working box (5), a first linear rack (7) is welded above the inner part of the feeding working box (5), a first special-shaped gear (8) is arranged below the first linear rack (7), a second linear rack (9) is arranged below the first special-shaped gear (8), a first lock pin (10) is arranged above the telescopic rod (4), a first connecting rod (11) is screwed above the first lock pin (10), a second lock pin (12) is arranged on the left side above the first connecting rod (11), and a lifting column (13) is screwed on the left side of the second lock pin (12), a pressing plate (14) is welded below the lifting column (13), a packaging detector (15) is arranged below the partition plate (2), a pin groove (16) is formed in the packaging detector (15), a supporting plate (17) is welded below the packaging detector (15), a second connecting rod (18) is welded below the supporting plate (17), a third lock pin (19) is installed below the second connecting rod (18), a third connecting rod (20) is screwed on the left side of the lower portion of the third lock pin (19), a fifth lock pin (21) is arranged below the third connecting rod (20), a connecting plate (22) is screwed on the lower portion of the fifth lock pin (21), an air cylinder (23) is welded on the right side of the upper portion of the connecting plate (22), an air rod (24) is arranged on the left side of the air cylinder (23), a sixth lock pin (25) is installed on the left side of the air rod (24), a groove (26) is formed in the outer portion of the sixth lock pin (25), a seventh lock pin (27) is arranged on the left side of the lower portion of the groove (26), a fourth connecting rod (28) is arranged above the groove (26), an eighth lock pin (29) is arranged on the right side of the fourth connecting rod (28), a rotary disc (30) is welded to the lower portion of the connecting plate (22), a rotary shaft (31) penetrates through the inner portion of the rotary disc (30), a first gear (32) is arranged below the rotary shaft (31), a second special-shaped gear (33) is arranged on the right side of the first gear (32), a second servo motor (34) is arranged below the second special-shaped gear (33), a frame (35) is arranged below the second servo motor (34), and a storage box (36) is installed on the left side of the frame (35).
2. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the horizontal center line of the guide rail (3) is overlapped with the horizontal center line of the telescopic rod (4), and the horizontal center line of the guide rail (3) is overlapped with the horizontal center line of the packaging detector (15).
3. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the packaging detectors (15) are arranged in six positions, and the positions of the six packaging detectors (15) are distributed in a circumferential manner by taking the central axis of the rotating shaft (31) as the center of a circle.
4. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the telescopic length of the telescopic rod (4) is equal to the length from the right side of the guide rail (3) to the right side in the partition plate (2).
5. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the lifting height of the lifting column (13) is equal to the distance from the pressure plate (14) to the lower part of the partition plate (2).
6. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the distance between the partition board (2) and the packaged detector (15) is equal to the height of the semiconductor.
7. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the rotating angle of the second connecting rod (18) is 180 degrees, and after the second connecting rod (18) rotates 180 degrees, the upper surface of the packaging detector (15) is attached to the upper surface of the containing box (36).
8. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the central axis of the guide rail (3) is parallel to the central axis of the pin groove (16).
9. The package inspecting apparatus for semiconductor devices with automatic sorting function according to claim 1, wherein: the rotating disc (30) rotates for 60 degrees every time the second special-shaped gear (33) rotates for one turn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010822416.7A CN111957611A (en) | 2020-08-17 | 2020-08-17 | Packaging detection equipment with automatic sorting function for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010822416.7A CN111957611A (en) | 2020-08-17 | 2020-08-17 | Packaging detection equipment with automatic sorting function for semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111957611A true CN111957611A (en) | 2020-11-20 |
Family
ID=73389023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010822416.7A Withdrawn CN111957611A (en) | 2020-08-17 | 2020-08-17 | Packaging detection equipment with automatic sorting function for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111957611A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504451A (en) * | 2021-09-10 | 2021-10-15 | 江苏煜晶光电科技有限公司 | Semiconductor packaging detection equipment |
-
2020
- 2020-08-17 CN CN202010822416.7A patent/CN111957611A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504451A (en) * | 2021-09-10 | 2021-10-15 | 江苏煜晶光电科技有限公司 | Semiconductor packaging detection equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201120 |