CN111954385A - Solder mask structure of thick copper circuit board - Google Patents
Solder mask structure of thick copper circuit board Download PDFInfo
- Publication number
- CN111954385A CN111954385A CN202010823698.2A CN202010823698A CN111954385A CN 111954385 A CN111954385 A CN 111954385A CN 202010823698 A CN202010823698 A CN 202010823698A CN 111954385 A CN111954385 A CN 111954385A
- Authority
- CN
- China
- Prior art keywords
- solder mask
- thick copper
- layer
- ink
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 101
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 70
- 239000010949 copper Substances 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 abstract description 15
- 230000007547 defect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a thick copper circuit board solder mask structure which comprises a base material, a thick copper layer, an ink-jet solder mask layer and a silk-screen solder mask layer, wherein the base material is used as a support; the thick copper layer is positioned on the base material; the ink-jet solder mask layer is positioned at the junction of the thick copper layer and the substrate; the silk-screen solder mask is positioned above the base material, the thick copper layer and the ink-jet solder mask; the ink-jet solder mask is filled at the junction of the thick copper layer and the base material, and after prebaking, the silk-screen printing ink is printed on the base material, the thick copper layer and the ink-jet solder mask to form the silk-screen solder mask, so that the defect of difficulty in filling gaps caused by one-time silk-screen printing can be overcome, only one-time silk-screen printing ink is needed, multiple silk-screen printing solder masks are not needed, the viscosity of the ink is not needed to be changed, and various quality problems are avoided.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a solder mask structure of a thick copper circuit board.
Background
The outer finished copper thickness ≧ 2Oz is generally defined as a thick copper plate. The thick copper plate is mainly used for power circuit boards and high-power circuits which have the requirement of passing large current. The thick copper plate is difficult to fill a solder mask gap due to overlarge difference between the base material and the line surface, and is difficult to fill by one-time silk-screen printing operation, so that the solder mask is generally subjected to multiple silk-screen printing. If the viscosity of the ink is too high for the purpose of meeting the standard of the line surface solder resist thickness, the ink is difficult to drop to fill the line foot, the corner and the line seam part of the boundary of the copper and the base material, and the problems of easy oil accumulation, more bubbles and the like exist; if the viscosity of the ink is too low to fill the gap, the printing thickness of the line and the substrate is difficult to meet the requirements, the dilution is highly volatilized, the operating environment is polluted, and the pinhole defect is easily generated. The error of alignment of multiple exposure and development can cause the step phenomenon of the solder mask windowing, and the actual available windowing area is smaller than the design value.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a solder mask structure of a thick copper circuit board, which can overcome the defect of difficulty in filling gaps generated by one-time screen printing.
According to the embodiment of the first aspect of the invention, the solder mask structure of the thick copper circuit board comprises:
a substrate for support;
a thick copper layer on the substrate;
the ink-jet solder mask layer is positioned at the junction of the thick copper layer and the base material;
and the silk-screen solder mask is positioned above the substrate, the thick copper layer and the ink-jet solder mask.
The thick copper circuit board solder mask structure provided by the embodiment of the invention at least has the following beneficial effects: the ink-jet solder mask is filled at the junction of the thick copper layer and the base material, and after prebaking, the silk-screen printing ink is printed on the base material, the thick copper layer and the ink-jet solder mask to form the silk-screen solder mask, so that the defect of difficulty in filling gaps caused by one-time silk-screen printing can be overcome, only one-time silk-screen printing ink is needed, multiple silk-screen printing solder masks are not needed, the viscosity of the ink is not needed to be changed, and various quality problems are avoided.
According to some embodiments of the invention, if the inkjet solder mask layer is located on one side of the thick copper layer:
the upper surface of inkjet solder mask with the side on thick copper layer is crossing in first nodical, the upper surface of inkjet solder mask with the upper surface of substrate is crossing in the second nodical, first nodical extremely the distance of substrate is the maximum height of inkjet solder mask, the second nodical extremely the distance on thick copper layer does the lateral expansion length of inkjet solder mask, lateral expansion length more than or equal to twice maximum height.
According to some embodiments of the invention, if the inkjet solder mask layer is located between two spaced apart thick copper layers, the lateral extension length of the inkjet solder mask layer is equal to or greater than four times the maximum height of the inkjet solder mask layer, wherein the lateral extension length of the inkjet solder mask layer is the distance between the two spaced apart thick copper layers.
According to some embodiments of the invention, the substrate is provided with a hole site, and the thick copper layer around the hole site and the hole site is not covered with the silk-screen solder mask.
According to some embodiments of the invention, the distance from the highest point of the inkjet solder resist layer to the copper surface of the thick copper layer is not more than 50 microns.
According to some embodiments of the invention, the inkjet solder mask is an inkjet printing ink.
According to some embodiments of the invention, the screen printed solder mask is screen printed ink.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a schematic diagram of an inkjet solder mask layer of a thick copper circuit board solder mask structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a silk-screen solder mask of a solder mask structure of a thick copper circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an inkjet solder mask layer of a thick copper circuit board solder mask structure according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a silk-screen solder mask of a solder mask structure of a thick copper circuit board according to another embodiment of the present invention;
FIG. 5 is a top view of a thick copper circuit board solder mask structure without including a screen printed solder mask layer according to an embodiment of the present invention;
fig. 6 is a top view of a solder mask structure of a thick copper circuit board including a silk-screen solder mask layer according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 2, 5 and 6, an embodiment of the present invention provides a thick copper circuit board solder mask structure, including:
a substrate 100 for support;
a thick copper layer 200 on the substrate 100;
the ink-jet solder mask layer 300 is positioned at the interface of the thick copper layer 200 and the substrate 100;
and the silk-screen solder mask layer 400 is positioned above the substrate 100, the thick copper layer 200 and the ink-jet solder mask layer 300.
According to the thick copper circuit board solder mask structure provided by the embodiment of the invention, the ink-jet solder mask layer is filled at the junction of the thick copper layer 200 and the substrate 100, and the silk-screen solder mask layer 400 is formed by silk-screen printing ink on the substrate 100, the thick copper layer 200 and the ink-jet solder mask layer 300 after pre-baking, so that the defect of difficulty in filling gaps caused by one-time silk-screen printing can be overcome, only one-time silk-screen printing ink is needed, multiple silk-screen solder mask processes are not needed, the viscosity of the ink is not needed to be changed, and various quality problems are avoided.
Referring to fig. 1 and 2, in some embodiments of the present invention, if an inkjet solder mask layer 300 is located on one side of a thick copper layer 200, then:
the upper surface of the ink jet solder mask layer 300 and the side surface of the thick copper layer 200 intersect at a first intersection point A, the upper surface of the ink jet solder mask layer 300 and the upper surface of the substrate 100 intersect at a second intersection point B, the distance from the first intersection point A to the substrate 100 is the maximum height of the ink jet solder mask layer 300, the distance from the second intersection point B to the thick copper layer 200 is the lateral extension length L of the ink jet solder mask layer 300, and the lateral extension length L is more than or equal to twice of the maximum height. The transverse expansion length L is more than or equal to two times of the maximum height, so that the solder resist flow in the subsequent silk-screen process can be ensured to be uniform.
Referring to fig. 3 and 4, in some embodiments of the present invention, if the inkjet solder mask layer 300 is located between two spaced apart thick copper layers 200, the lateral extension length L of the inkjet solder mask layer 300 is equal to or greater than four times the maximum height of the inkjet solder mask layer 300, wherein the lateral extension length L of the inkjet solder mask layer 300 is the distance between the two spaced apart thick copper layers 200. Similarly, the transverse extension length L of the ink-jet solder mask layer 300 is greater than or equal to four times of the maximum height of the ink-jet solder mask layer 300, so that the solder mask flow in the subsequent silk-screen process can be ensured to be uniform.
Referring to fig. 5 and 6, in some embodiments of the present invention, the hole site 110 is formed on the substrate 100, and the hole site 110 and the thick copper layer 200 around the hole site 110 are not covered with the silk-screen solder resist layer 400.
According to some embodiments of the present invention, the distance from the highest point of the inkjet solder resist layer 300 to the copper surface of the thick copper layer 200 is not more than 50 microns. Thereby guaranteeing that the solder mask is printed by silk screen printing at one time without the occurrence of holes at the step parts.
According to some embodiments of the present invention, the inkjet solder mask layer 300 is an inkjet printing ink.
According to some embodiments of the invention, silk-screen solder mask 400 is silk-screen ink.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (7)
1. The utility model provides a structure is prevented welding by thick copper circuit board which characterized in that includes:
a substrate for support;
a thick copper layer on the substrate;
the ink-jet solder mask layer is positioned at the junction of the thick copper layer and the base material;
and the silk-screen solder mask is positioned above the substrate, the thick copper layer and the ink-jet solder mask.
2. The thick copper circuit board solder mask structure of claim 1, wherein if the ink jet solder mask layer is located on one side of the thick copper layer:
the upper surface of inkjet solder mask with the side on thick copper layer is crossing in first nodical, the upper surface of inkjet solder mask with the upper surface of substrate is crossing in the second nodical, first nodical extremely the distance of substrate is the maximum height of inkjet solder mask, the second nodical extremely the distance on thick copper layer does the lateral expansion length of inkjet solder mask, lateral expansion length more than or equal to twice maximum height.
3. The thick copper circuit board solder mask structure of claim 1, wherein if said inkjet solder mask layer is located between two spaced apart thick copper layers, a lateral extension length of said inkjet solder mask layer is equal to or greater than four times a maximum height of said inkjet solder mask layer, wherein said lateral extension length of said inkjet solder mask layer is a distance between two spaced apart thick copper layers.
4. The thick copper circuit board solder mask structure of claim 1, wherein the substrate is provided with a hole site, and the hole site and the thick copper layer around the hole site are not covered with the silk-screen solder mask layer.
5. The thick copper circuit board solder mask structure of claim 1, wherein the distance from the highest point of the ink jet solder mask layer to the copper surface of the thick copper layer is not more than 50 μm.
6. The thick copper circuit board solder mask structure of claim 1, wherein the ink jet solder mask layer is an ink jet printing ink.
7. The thick copper circuit board solder mask structure of claim 1, wherein the silk-screen solder mask layer is silk-screen ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010823698.2A CN111954385A (en) | 2020-08-17 | 2020-08-17 | Solder mask structure of thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010823698.2A CN111954385A (en) | 2020-08-17 | 2020-08-17 | Solder mask structure of thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111954385A true CN111954385A (en) | 2020-11-17 |
Family
ID=73342977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010823698.2A Pending CN111954385A (en) | 2020-08-17 | 2020-08-17 | Solder mask structure of thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111954385A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10244206A (en) * | 1997-03-04 | 1998-09-14 | Kansai Paint Co Ltd | Method for formation of solder resist film |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN103547081A (en) * | 2012-07-10 | 2014-01-29 | 深南电路有限公司 | Ultra-thick copper coil circuit board resistance welding method, system and circuit board |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
| CN212628629U (en) * | 2020-08-17 | 2021-02-26 | 鹤山市中富兴业电路有限公司 | Solder mask structure of thick copper circuit board |
-
2020
- 2020-08-17 CN CN202010823698.2A patent/CN111954385A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10244206A (en) * | 1997-03-04 | 1998-09-14 | Kansai Paint Co Ltd | Method for formation of solder resist film |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN103547081A (en) * | 2012-07-10 | 2014-01-29 | 深南电路有限公司 | Ultra-thick copper coil circuit board resistance welding method, system and circuit board |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
| CN212628629U (en) * | 2020-08-17 | 2021-02-26 | 鹤山市中富兴业电路有限公司 | Solder mask structure of thick copper circuit board |
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