CN111952701A - Ceramic dielectric filter structure mounted on PCB - Google Patents

Ceramic dielectric filter structure mounted on PCB Download PDF

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Publication number
CN111952701A
CN111952701A CN202010948678.8A CN202010948678A CN111952701A CN 111952701 A CN111952701 A CN 111952701A CN 202010948678 A CN202010948678 A CN 202010948678A CN 111952701 A CN111952701 A CN 111952701A
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China
Prior art keywords
fixedly connected
heat dissipation
circuit board
pcb
ceramic
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CN202010948678.8A
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Chinese (zh)
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CN111952701B (en
Inventor
刘河洲
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Hengyang Hengshan Science And Technology Innovation Service Co Ltd
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Hengyang Hengshan Science And Technology Innovation Service Co Ltd
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Priority to CN202010948678.8A priority Critical patent/CN111952701B/en
Publication of CN111952701A publication Critical patent/CN111952701A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

Abstract

The invention discloses a structure of a ceramic dielectric filter installed on a PCB (printed circuit board), which comprises a circuit board, wherein three contacts are fixedly connected to the upper end of the circuit board at equal intervals, an installation device is fixedly connected to the upper end of the circuit board, a heat dissipation device is clamped to the upper end of the installation device, three cylinders are fixedly connected to the inner lower wall of the heat dissipation device at equal intervals, the upper ends of the three cylinders are fixedly connected with the ceramic filter together, metal coatings are coated on the front end face, the rear end face, the left end face and the right end face of the ceramic filter, three pins are fixedly connected to the lower end of the ceramic filter at equal intervals, the lower ends of the pins penetrate through the cylinders and are fixedly connected to the upper ends of the three contacts through the installation device. According to the structure of the ceramic dielectric filter mounted on the PCB, the heat dissipation device is arranged, so that the heat dissipation of the filter can be realized.

Description

Ceramic dielectric filter structure mounted on PCB
Technical Field
The invention relates to the technical field of filters, in particular to a structure of a ceramic dielectric filter arranged on a PCB (printed circuit board).
Background
The ceramic dielectric filter is made of lead zirconate titanate ceramic material, the ceramic material is made into a sheet shape, two surfaces of the ceramic material are coated with silver as electrodes, the piezoelectric effect is achieved after direct-current high-voltage polarization, the filter has the functions of stability and good anti-interference performance, the ceramic dielectric filter is widely applied to various electronic products such as televisions, video recorders and radios as frequency selection elements, has the advantages of stable performance, no need of adjustment, low price and the like, replaces the traditional LC filter network, and has the following defects: 1. the filter which can be arranged on the circuit board has a small structure due to the small area and the complex structure of the circuit board, the contact area of the filter and the circuit board is small, the installation of the filter is difficult, and the pin of the filter is long and is easy to break and damage after installation; 2. when the wave filter was being filtered the null wave, long-time work can produce a large amount of heats, and the unable quick discharge of these heats can lead to wave filter self temperature to rise and influence the work efficiency of wave filter, burns out the wave filter even.
Disclosure of Invention
The invention mainly aims to provide a structure of a ceramic dielectric filter mounted on a PCB (printed circuit board), which can effectively solve the problems in the background art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a structure of ceramic dielectric filter installed on PCB board, includes the circuit board, the three contact of circuit board upper end equidistance fixedly connected with, circuit board upper end fixedly connected with installation device, installation device upper end joint has heat abstractor, the three drum of lower wall equidistance fixedly connected with in the heat abstractor, it is three the common fixedly connected with ceramic filter in drum upper end, the terminal surface all scribbles metal coating about and around the ceramic filter, the three pin of ceramic filter lower extreme equidistance fixedly connected with, and the pin lower extreme runs through the drum and pass through installation device fixed connection in three contact upper end, ceramic filter front end fixed interlude is connected with input mechanism and output mechanism, ceramic filter upper end joint has the device board.
Preferably, the mounting device includes the mount pad, open the mount pad upper end has the mounting groove, mount pad lower extreme equidistance fixed interlude is connected with the metal pin pipe, the equal fixedly connected with insulating pad foot in mount pad lower extreme front portion and lower extreme rear portion, four the equal fixed connection of pad foot lower extreme is in circuit board upper end.
Preferably, the four pad feet are symmetrically distributed in a front-back manner in pairs, and the lower ends of the three metal pin tubes are not in contact with the upper end of the circuit board.
Preferably, heat abstractor includes the case lid, the equal threaded connection in case lid upper end front portion and upper end rear portion has two bolts, four the common threaded connection of bolt lower extreme has the heat dissipation case, two radiating grooves have all been opened on heat dissipation case left end upper portion and right-hand member upper portion, three perforation has been opened to heat dissipation case lower extreme middle part equidistance, case lid lower extreme fixedly connected with semiconductor refrigeration piece, the joint of heat dissipation case is in the mounting groove.
Preferably, the three through holes are positioned right above the three metal pin tubes, and the heat dissipation groove is positioned above the upper end of the mounting seat.
Preferably, the device plate comprises a porcelain plate, three isolating through grooves are formed in the middle of the upper end of the porcelain plate at equal intervals, two resonance holes are formed in the front portion of the upper end of the porcelain plate and the rear portion of the upper end of the porcelain plate, a first coupling hole is formed in the left portion of the upper end of the porcelain plate, and a second coupling hole (94) is formed in the left portion of the upper end of the porcelain plate.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the installation device is arranged, so that the installation device can be installed on the circuit board firstly, and then the filter is installed on the installation device, the installation of the filter is convenient, and the installation device can protect the pins of the filter, so that the damage of the filter caused by the breakage of the pins is prevented.
2. According to the invention, the heat dissipation device is arranged, the filter is placed in the heat dissipation device, the semiconductor refrigeration sheet in the heat dissipation device can cool the filter, the working temperature of the filter is controlled, the metal coating coated on the outer surface of the filter can conduct heat quickly, and the heat generated by the filter can be discharged quickly by arranging the heat dissipation groove.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a ceramic dielectric filter mounted on a PCB according to the present invention;
fig. 2 is a schematic view showing the overall structure of a mounting device of the structure of a ceramic dielectric filter mounted on a PCB according to the present invention;
FIG. 3 is a schematic diagram of the overall structure of a heat dissipation device of the present invention, which is mounted on a PCB board and has the structure of a ceramic dielectric filter;
fig. 4 is a schematic view of the entire structure of a device board of the ceramic dielectric filter structure mounted on a PCB according to the present invention.
In the figure: 1. a circuit board; 2. a contact; 3. a pin; 4. a cylinder; 5. a mounting device; 6. an output mechanism; 7. a heat sink; 8. an input mechanism; 9. a mounting plate; 10. a ceramic filter; 11. a metal coating; 51. a mounting seat; 52. mounting grooves; 53. a metal pin tube; 54. a foot pad; 71. a box cover; 72. a bolt; 73. a heat sink; 74. perforating; 75. a heat dissipation box; 76. a semiconductor refrigeration sheet; 91. a porcelain plate; 92. a resonant aperture; 93. isolating the through grooves; 94. a second coupling hole; 95. a coupling aperture.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a structure of a ceramic dielectric filter mounted on a PCB comprises a circuit board 1, three contacts 2 are fixedly connected to the upper end of the circuit board 1 at equal intervals, a mounting device 5 is fixedly connected to the upper end of the circuit board 1, a heat dissipation device 7 is clamped to the upper end of the mounting device 5, three cylinders 4 are fixedly connected to the inner lower wall of the heat dissipation device 7 at equal intervals, a ceramic filter 10 is fixedly connected to the upper ends of the three cylinders 4 together, the front and rear end faces and the left and right end faces of the ceramic filter 10 are coated with metal coatings 11, three pins 3 are fixedly connected to the lower end of the ceramic filter 10 at equal intervals, the lower ends of the pins 3 penetrate through the cylinders 4 and are fixedly connected to the upper ends of the three contacts 2 through the mounting device 5, an input mechanism 8 and an.
The mounting device 5 comprises a mounting seat 51, a mounting groove 52 is formed in the upper end of the mounting seat 51, metal pin pipes 53 are fixedly inserted and connected to the lower end of the mounting seat 51 at equal intervals, insulating pad feet 54 are fixedly connected to the front portion and the rear portion of the lower end of the mounting seat 51, the lower ends of the four pad feet 54 are fixedly connected to the upper end of the circuit board 1, the four pad feet 54 are symmetrically distributed in the front-back direction, the lower ends of the three metal pin pipes 53 are not in contact with the upper end of the circuit board 1, the lower portion of the mounting seat 51 is gradually reduced to prevent the heat dissipation device 7 from sliding downwards to break the pins 3, the heat dissipation device 7 comprises a box cover 71, two bolts 72 are in threaded connection with the front portion and the rear portion of the upper end of the box cover 71, heat dissipation boxes 75 are in threaded connection with the lower ends of the four bolts 72, two heat dissipation grooves 73 are, accelerate the heat dissipation, open at radiator box 75 lower extreme middle part equidistance has three perforation 74, case lid 71 lower extreme fixedly connected with semiconductor refrigeration piece 76, radiator box 75 joint is in mounting groove 52, three perforation 74 is located directly over three metal pin pipe 53, make things convenient for the welding of pin 3, radiator tank 73 is located the top of mount pad 51 upper end, avoid mount pad 51 to block thermal discharge, device board 9 includes porcelain plate 91, porcelain plate 91 upper end middle part equidistance has opened three isolation logical groove 93, porcelain plate 91 upper end front portion and upper end rear portion have all opened two resonance holes 92, porcelain plate 91 upper end left part is opened there is coupling hole 95 No. one, porcelain plate 91 upper end left part is opened there is coupling hole 94 No. two, coupling hole 95 and coupling hole 94 No. two are located respectively about between two resonance holes 92.
It should be noted that the present invention is a structure of a ceramic dielectric filter mounted on a PCB, in which a heat dissipation device 7 is provided to cool a ceramic filter 10, the ceramic filter 10 is mounted in a heat dissipation box 75, a pin 3 at the lower end of the ceramic filter 10 is inserted through three through holes 74, a box cover 71 and the heat dissipation box 75 are sealed by a bolt 72, a semiconductor refrigeration sheet 76 is provided to cool the ceramic filter 10 and reduce the temperature of the ceramic filter 10, a heat dissipation groove 73 is provided on the opposite surface of the heat dissipation box 75 to rapidly discharge the heat in the heat dissipation box 75, a mounting device 5 is provided to facilitate the mounting of the ceramic filter 10 on the circuit board 1, four pads 54 are fixedly mounted on the circuit board 1, and three metal pin tubes 53 are located right above a contact 2, and a pin 3 is inserted through the three metal pin tubes 53, and the welding is on contact 2, in the mounting groove 52 with the joint in mount pad 51 of radiator box 75 simultaneously, accomplishes the installation to ceramic filter 10, through setting up coupling hole 95 No. and coupling hole 94 No. two, can improve the out-of-band rejection characteristic, through setting up keep apart logical groove 93, to two resonance holes 92 complete isolation for input mechanism 8 and output mechanism 6 form the return circuit.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A structure of a ceramic dielectric filter mounted on a PCB board, comprising a circuit board (1), characterized in that: the circuit board comprises a circuit board (1), three contacts (2) are fixedly connected to the upper end of the circuit board (1) at equal intervals, a mounting device (5) is fixedly connected to the upper end of the circuit board (1), a heat dissipation device (7) is clamped to the upper end of the mounting device (5), three cylinders (4) are fixedly connected to the inner lower wall of the heat dissipation device (7) at equal intervals, a ceramic filter (10) is fixedly connected to the upper ends of the three cylinders (4) jointly, metal coatings (11) are coated on the front end face and the rear end face and the left end face and the right end face of the ceramic filter (10), three pins (3) are fixedly connected to the lower end of each ceramic filter (10) at equal intervals, the lower ends of the pins (3) penetrate through the cylinders (4) and are fixedly connected to the upper ends of the three contacts (, the upper end of the ceramic filter (10) is clamped with a device plate (9).
2. A ceramic dielectric filter structure mounted on a PCB as claimed in claim 1, wherein: installation device (5) are including mount pad (51), open mount pad (51) upper end has mounting groove (52), mount pad (51) lower extreme equidistance fixed interlude is connected with metal pin pipe (53), mount pad (51) lower extreme front portion and the equal fixedly connected with of lower extreme rear portion fill up foot (54), four fill up the equal fixed connection of foot (54) lower extreme in circuit board (1) upper end.
3. A ceramic dielectric filter structure mounted on a PCB as claimed in claim 2, wherein: the four pad feet (54) are symmetrically distributed in a front-back manner in pairs, and the lower ends of the three metal pin tubes (53) are not in contact with the upper end of the circuit board (1).
4. A ceramic dielectric filter structure mounted on a PCB as claimed in claim 1, wherein: heat abstractor (7) includes case lid (71), case lid (71) upper end front portion and the equal threaded connection of upper end rear portion have two bolts (72), four bolt (72) lower extreme common threaded connection has heat dissipation case (75), two radiating grooves (73) have all been opened on heat dissipation case (75) left end upper portion and right-hand member upper portion, heat dissipation case (75) lower extreme middle part equidistance is opened three perforation (74), case lid (71) lower extreme fixedly connected with semiconductor refrigeration piece (76), heat dissipation case (75) joint is in mounting groove (52).
5. The structure of a ceramic dielectric filter mounted on a PCB as claimed in claim 4, wherein: the three through holes (74) are positioned right above the three metal pin tubes (53), and the heat dissipation groove (73) is positioned above the upper end of the mounting seat (51).
6. A ceramic dielectric filter structure mounted on a PCB as claimed in claim 1, wherein: the device board (9) comprises a porcelain board (91), three isolating through grooves (93) are formed in the middle of the upper end of the porcelain board (91) at equal intervals, two resonant holes (92) are formed in the front portion and the rear portion of the upper end of the porcelain board (91), a first coupling hole (95) is formed in the left portion of the upper end of the porcelain board (91), and a second coupling hole (94) is formed in the left portion of the upper end of the porcelain board (91).
CN202010948678.8A 2020-09-10 2020-09-10 Structure for mounting ceramic dielectric filter on PCB Active CN111952701B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010948678.8A CN111952701B (en) 2020-09-10 2020-09-10 Structure for mounting ceramic dielectric filter on PCB

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Application Number Priority Date Filing Date Title
CN202010948678.8A CN111952701B (en) 2020-09-10 2020-09-10 Structure for mounting ceramic dielectric filter on PCB

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CN111952701A true CN111952701A (en) 2020-11-17
CN111952701B CN111952701B (en) 2021-08-06

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060033596A1 (en) * 2004-08-13 2006-02-16 Michael Eddy Method and apparatus for stabilizing the temperature of dielectric-based filters
CN207010238U (en) * 2017-08-08 2018-02-13 姜淙文 A kind of LCL filter of three-phase grid-connected inverter
CN208581216U (en) * 2018-09-18 2019-03-05 惠州攸特电子股份有限公司 Heat radiating type network filter
CN109755698A (en) * 2019-01-30 2019-05-14 苏州市协诚五金制品有限公司 A kind of structure for the Ceramic Dielectric Filter being installed on pcb board
CN211238448U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 High-stability ceramic dielectric filter
CN211238447U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 Low-loss ceramic dielectric filter
CN211238449U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 High-stability and low-loss ceramic dielectric filter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060033596A1 (en) * 2004-08-13 2006-02-16 Michael Eddy Method and apparatus for stabilizing the temperature of dielectric-based filters
CN207010238U (en) * 2017-08-08 2018-02-13 姜淙文 A kind of LCL filter of three-phase grid-connected inverter
CN208581216U (en) * 2018-09-18 2019-03-05 惠州攸特电子股份有限公司 Heat radiating type network filter
CN109755698A (en) * 2019-01-30 2019-05-14 苏州市协诚五金制品有限公司 A kind of structure for the Ceramic Dielectric Filter being installed on pcb board
CN211238448U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 High-stability ceramic dielectric filter
CN211238447U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 Low-loss ceramic dielectric filter
CN211238449U (en) * 2019-11-05 2020-08-11 常州市瑞得通讯科技有限公司 High-stability and low-loss ceramic dielectric filter

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