CN111940732B

CN111940732B - Uniform droplet/polymer space circuit combined printing device and method

Info

Publication number: CN111940732B
Application number: CN202010665392.9A
Authority: CN
Inventors: 齐乐华; 周怡; 罗俊; 李贺军; 豆毅博
Original assignee: Northwestern Polytechnical University
Current assignee: Northwestern Polytechnical University
Priority date: 2020-07-11
Filing date: 2020-07-11
Publication date: 2022-04-19
Anticipated expiration: 2040-07-11
Also published as: CN111940732A

Abstract

The invention relates to a uniform micro-droplet/polymer space circuit combined printing device and a method, belonging to the field of rapid printing of three-dimensional circuits; the device comprises an anti-oxidation inert gas cylinder, a pressure reducing valve, a glove box, an oxygen content detector, a water content detector, a high molecular polymer printing assembly, a uniform metal droplet jetting assembly, a signal generator, a laser, a temperature controller, a motion control card, a three-dimensional moving platform and a hot bed; the anti-oxidation inert gas cylinder is communicated with the glove box through a pressure reducing valve, the three-dimensional moving platform is fixed on the bottom surface of an inner cabin of the glove box, and the hot bed is fixed on the upper surface of the three-dimensional moving platform; the high molecular polymer printing component, the uniform metal droplet jetting component and the laser are fixed at the top of the inner chamber of the glove box through the cantilever beam, and the laser re-melts the metal circuit deposited and solidified on the hot bed after receiving the control signal; the invention solves the problems that air is easy to remain and pores are easy to form when silver paste is used for circuit printing, thereby improving the circuit forming quality and the electrical conductivity.

Description

Uniform droplet/polymer space circuit combined printing device and method

Technical Field

The invention belongs to the field of rapid printing of three-dimensional circuits, and particularly relates to a uniform droplet/polymer space circuit combined printing device and method.

Background

With the progress of electronic circuit design and manufacturing technology, circuit manufacturing is developing towards large scale, digitalization and individuation, and in order to further reduce product size and increase circuit integration density and wiring freedom, three-dimensional circuits are widely applied to circuit design and manufacturing. In recent years, the rise of 3D printing technology has made it possible to combine layer-by-layer deposition manufacturing technology with electronic circuit manufacturing technology and to achieve digitization in such a way that not only can electrical interconnections be made in any form (diagonal or smooth curved path) in all dimensions inside the part, but also the part can be printed in any shape to be mounted on other objects. The 3D printing technology can break through the limitation of the traditional manufacturing technology, and high-freedom-degree electronic circuits are molded inside the parts, so that the circuit integration density is further improved, and a new direction is provided for manufacturing the three-dimensional circuit in the real sense.

A process for making three-dimensional Circuits using polymeric and silver paste materials based on a combination of micro-dispensing and fused deposition fabrication techniques is presented in the literature "Carranza G T, Robles U, Valle C L, et al, design and Hybrid Additive fabrication of 3-D/volume electric Circuits [ J ]. IEEE Transactions on composites, Packaging and Manufacturing technologies, 2019,9(6): 1176-1183". The process can realize higher wiring freedom degree of the circuit in three dimensions, has advantages in the aspect of low-frequency space circuit printing, but is difficult to be applied to high-frequency space circuit printing with higher requirement on the quality of the circuit. Since the silver paste itself easily leaves air and forms pores, and the 3D printing process itself has a step effect, resulting in poor smoothness and conductivity of the formed circuit, it cannot be used for high frequency circuit printing.

The uniform metal droplet jetting technology has high flexibility, and electronic circuits can be printed into any shape and integrated into the interior or the surface of any object; the printing requirement of a high-frequency circuit can be met, the metal droplets realize good metallurgical bonding through mutual melting in the printing process, and a smooth electric interconnection circuit can be realized after the circuit is heated; the whole printing process does not need a mask plate, has the advantages of high manufacturing efficiency, low cost and the like, and is expected to be widely applied to the aspect of quickly preparing three-dimensional complex electronic circuits.

Disclosure of Invention

The technical problem to be solved is as follows:

in order to avoid the defects of the prior art, the invention provides a device and a method for printing a uniform droplet/polymer space circuit in a combined mode, which are used for realizing the rapid preparation of a high-freedom-degree space circuit interconnection circuit by combining the melting deposition of an insulating high-molecular material, the printing of uniform metal droplets and a continuous laser droplet remelting technology. The space circuit printing method utilizes high-melting-point insulating polymer materials to print media in the space circuit, and utilizes high-conductivity low-temperature alloy to print interconnection lines in the space circuit. The space circuit printing method extracts geometric information, material information, embedded chip types and machine information of each layer by using a slicing algorithm according to a digital model of a circuit, generates a corresponding substrate motion track at the same time, and realizes coordination control of substrate motion, insulating high polymer material fused deposition molding, interconnection wire deposition and electronic circuit laser remelting molding through lower computer control, thereby completing rapid preparation molding of a high-quality space circuit. The method integrates multiple processes in the same procedure, the material supply and deposition can be flexibly controlled in a fixed-point quantitative manner, the three-dimensional space of the model can be more effectively utilized, the electrical interconnection density is improved, the cost and the energy consumption are reduced, various chips and MEMS devices can be integrated, and the preparation of a molded multifunctional and polymorphic circuit is facilitated.

The technical scheme of the invention is as follows: a uniform droplet/polymer space circuit combination printing apparatus, comprising: the device comprises an anti-oxidation inert gas cylinder 1, a pressure reducing valve 4, a glove box 5, an oxygen content detector 6, a water content detector 9, a high polymer printing component, a uniform metal droplet jetting component, a signal generator 11, a laser 13, a temperature controller 14, a motion control card 15, a three-dimensional moving platform 17 and a hot bed 18; the anti-oxidation inert gas cylinder 1 is communicated with the glove box 5 through a pressure reducing valve 4 and is used for introducing inert gas into the glove box 5; the oxygen content detector 6 and the water content detector 9 are arranged on the glove box 5 and are respectively used for detecting the oxygen content and the water content in the glove box 5;

the three-dimensional moving platform 17 is fixed on the bottom surface of the inner cabin of the glove box 5, and the hot bed 18 is fixed on the upper surface of the three-dimensional moving platform 17; the high molecular polymer printing component, the uniform metal droplet jetting component and the laser 13 are all fixed at the top of an inner chamber of the glove box 5 through cantilever beams and are positioned above the three-dimensional moving platform 17, and the laser 13 can send out high-frequency laser to remelt metal lines deposited and solidified on the hot bed 18 after receiving control signals;

the signal generated by the signal generator 11 controls the operation of the high molecular polymer printing component and the uniform metal droplet ejection component and the laser action of the laser 13, the temperature controller 14 is used for controlling the heating temperature of the thermal bed 18, and the motion control card 15 is used for controlling the spatial three-dimensional movement of the three-dimensional moving platform 17 and the signal action time of the signal generator 11.

The further technical scheme of the invention is as follows: the high polymer printing assembly sequentially comprises a wire extruder 3, a high polymer printing head 20 and a high polymer heater 21 from top to bottom, a mounting hole for butting the high polymer wire 2 is formed in the upper portion of the wire extruder 3, the wire extruder 3 continuously conveys the high polymer wire 2 to the low polymer heater 21 after receiving a control signal, the high polymer wire 2 is heated to be in a molten state after passing through the high polymer heater 21, and then the high polymer printing head 20 at the lower portion of the high polymer heater 21 is extruded and deposited on the hot bed 18.

The further technical scheme of the invention is as follows: the uniform metal droplet ejection assembly is positioned on the right side of the high polymer material printing head 20 and comprises an excitation rod 7, piezoelectric ceramics 8, a heating furnace 10 and a metal droplet nozzle 16, and the metal droplet nozzle 16 is 202cm higher than the high polymer material printing head; the exciting rod 7 is connected with the piezoelectric ceramic 8 on the exciting rod through threads and extends into the heating furnace 10, the metal micro-droplet nozzle 16 is fixed at the bottom of the heating furnace 10, the heating furnace 10 heats metal to be in a molten state, the piezoelectric ceramic 8 generates vibration deformation after receiving a control signal and transmits the vibration deformation to the heating furnace 10 through the exciting rod 7, and the molten metal 12 in the heating furnace 10 is extruded out of the metal micro-droplet nozzle 16 after being vibrated to form metal droplets, and finally the metal droplets are deposited on the hot bed 18.

The further technical scheme of the invention is as follows: the laser 13 is 162cm higher than the metal droplet nozzle.

A uniform droplet/polymer space circuit combined printing method is characterized by comprising the following specific steps:

cleaning a glove box 5 by using an anti-oxidation inert gas cylinder 1, and keeping the pressure in the glove box 5 higher than the atmospheric pressure by 0-1 mbar to ensure that air cannot enter the closed glove box; detecting the oxygen concentration in the glove box 5 by using an oxygen content detector 6 to ensure that the oxygen content is below 10PPM, and detecting the water vapor concentration in the glove box 5 by using a water content detector 9 to ensure that the water vapor content is below 5 PPM;

secondly, adding a low-temperature alloy material with a melting point of 50-150 ℃ into the heating furnace 10, connecting a high-molecular wire 2 with a melting point of 200-350 ℃ into a mounting hole of the wire extruder 3, starting a heating system, adjusting the temperature controller 14, heating the heating furnace 10 to a temperature 20-50 ℃ above the liquidus of the low-temperature alloy material, and completely melting the internal metal material into molten metal 12; heating a high polymer material heater 21 to be 20-80 ℃ above the melting point temperature of the high polymer wire 2; heating the hot bed 18 to 100-150 ℃, preventing the space circuit insulating base material 19 from warping in the printing process, and ensuring good contact between the space circuit insulating base material and the hot bed 18;

after the temperature is kept for 20 minutes, aligning the laser 13 to the droplet deposition position, and adjusting the output power of the laser 13 to ensure that the surfaces of adjacent metal droplets can be fully remelted in the printing process, and simultaneously avoiding thermal deformation or ablation of the deposited high polymer material due to overhigh power of the laser 13;

step four, establishing a three-dimensional model of the spatial circuit to be formed by adopting spatial circuit modeling software, converting the three-dimensional model into an STL format, carrying out two-dimensional slicing processing on the model, and generating motion track information of the three-dimensional moving platform 17 and action time information of the wire extruder 3, the exciting rod 7 and the laser 13;

fifthly, adjusting the printing step pitch to be 0.7-0.8 times of the inner diameter of the metal micro-droplet nozzle 16, and avoiding the circuit from being broken; starting a printing program, importing and reading the deposition path file generated in the fourth step, accurately controlling the motion track of the three-dimensional moving platform 17 through the motion control card 15, firstly forming an insulating base material female die required by circuit deposition on the hot bed 18, then depositing and filling the molten metal 12 in the insulating base material female die to form an interconnection circuit, and simultaneously enabling continuous laser emitted by the laser 13 to act on the surface of the metal interconnection circuit to heat so as to form a high-quality circuit;

and step six, molding point by point and layer by layer according to the method in the step five, and repeating the steps to form the final space circuit.

The further technical scheme of the invention is as follows: and in the second step, the metal material is a high-conductivity low-temperature alloy material of tin-silver alloy, tin-copper alloy, bismuth-based alloy or gallium-indium alloy.

The further technical scheme of the invention is as follows: in the second step, the polymer wire 2 is made of polyether ether ketone resin, polyphenylene sulfone resin or polyether imide which is high melting point insulating polymer material modified by various additives.

Advantageous effects

The invention has the beneficial effects that: the invention provides a uniform droplet/polymer space circuit combined printing device and a method thereof, which are used for improving the forming quality and the applicability of a space circuit. The uniform metal droplets are used for line printing, the uniformity of the concentration of the metal droplets is stable, and the problems that air is easy to remain and pores are formed when silver paste is used for line printing are solved, so that the line forming quality and the conductivity can be improved; in the third step, the laser 13 is used for heating and remelting the circuit, the step effect in the 3D printing process is solved, and the formed metal circuit can smoothly meander the whole circuit along a spline path, so that the parasitic impedance of the circuit is reduced, and the printing of a high-frequency space circuit is realized.

Drawings

FIG. 1 is a schematic diagram of a printing apparatus for printing a space circuit substrate according to the present invention.

FIG. 2 is a schematic diagram of the printing state of the spatial circuit lines by the device used in the present invention.

Fig. 3 is a detailed process diagram of the rapid fabrication of a space circuit.

Fig. 4 is a schematic layout diagram of the multifunctional vehicle model space circuit formed by joint printing according to embodiment 2 of the method of the present invention.

Description of reference numerals: 1. an anti-oxidation inert gas cylinder, 2, a polymer wire, 3, a wire extruder, 4, a pressure reducing valve, 5, a glove box, 6, an oxygen content detector, 7, an excitation rod, 8, piezoelectric ceramics, 9, a water content detector, 10, a heating furnace, 11, a signal generator, 12, molten metal, 13, a laser, 14, a temperature controller, 15, a motion control card, 16, a metal droplet nozzle, 17, a three-dimensional moving platform, 18, a heating bed, 19, a space circuit insulating substrate, 20, a polymer material printing head, 21, a polymer material heater, 22, a molten state wire, 23, a polymer female die, 24, a metal droplet, 25, a continuous laser, 26, a circuit lead, 27, a power supply position, 28, a control chip position, 29, a resistance position, 30, a vehicle lamp position, 31, a motor position, 32 and a wheel position.

Detailed Description

The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Referring to fig. 1 and 2, the uniform droplet/polymer space circuit combined printing device comprises an anti-oxidation inert gas cylinder 1, a wire extruder 3, a pressure reducing valve 4, a glove box 5, an oxygen content detector 6, an excitation rod 7, piezoelectric ceramics 8, a water content detector 9, a heating furnace 10, a signal generator 11, a laser 13, a temperature controller 14, a motion control card 15, a metal droplet nozzle 16, a three-dimensional moving platform 17, a heat bed 18, a high polymer material printing head 20 and a high polymer material heater 21.

The port of the anti-oxidation inert gas bottle 1 is provided with external threads, the external threads are screwed with internal threads arranged at one end of a pressure reducing valve 4 and are placed outside a glove box 5, the other end of the pressure reducing valve 4 is provided with an air guide hose connector and is connected with the glove box 5 through an air guide hose, inert gas is pre-filled in the anti-oxidation inert gas bottle 1, the inert gas flows through the pressure reducing valve 4 and is continuously conveyed into the glove box 5 through an air guide pipe, so that the maintenance of an oxygen-free environment in the glove box 5 is ensured, the pressure reducing valve 4 judges the allowance of the inert gas by displaying the gas pressure in the anti-oxidation inert gas bottle 1 and can control the on-off of the inert gas through the closing of a valve, and the glove box 5 is provided with an oxygen content detector 6 and a water content detector 9 which are respectively used for detecting the oxygen content and the water content in the glove box 5; the three-dimensional moving platform 17 is fixed on the lower side of the inner cabin of the glove box 5, and the hot bed 18 is fixed on the uppermost part of the three-dimensional moving platform 17 through bolts;

the wire extruder 3, the high polymer material printing head 20 and the high polymer material heater 21 jointly form a high polymer printing assembly, the high polymer printing assembly is fixed at the top of an inner chamber of the glove box 5 through a cantilever beam, a mounting hole for butting the high polymer wire 2 is formed in the upper part of the wire extruder 3, the wire extruder 3 can continuously convey the high polymer wire 2 to the low polymer material heater 21 after receiving a control signal, the wire is heated to be in a molten state after passing through the high polymer material heater 21, and then the wire is extruded and deposited on the hot bed 18 through the high polymer material printing head 20 at the lower part of the high polymer material heater 21; the excitation rod 7, the piezoelectric ceramic 8, the heating furnace 10 and the metal droplet nozzle 16 jointly form a uniform metal droplet jetting assembly, the uniform metal droplet jetting assembly is fixed to the top of an inner chamber of the glove box 5 through a cantilever beam and located on the right side of the high polymer material printing head 20, the metal droplet nozzle 16 is about 2cm higher than the high polymer material printing head 20, the excitation rod 7 is connected with the piezoelectric ceramic 8 on the excitation rod through threads and extends into the heating furnace 10, the metal droplet nozzle 16 is fixed to the bottom of the heating furnace 10, the heating furnace 10 can heat metal to be in a molten state, the piezoelectric ceramic 8 can generate vibration deformation after receiving a control signal and transmit the vibration deformation to the heating furnace 10 through the excitation rod 7, and the molten metal 12 in the heating furnace 10 is extruded out of the metal droplet nozzle 16 after being vibrated to form metal droplets and finally deposited on the hot bed 18;

the laser 13 is fixed at the top of an inner cabin of the glove box 5 through a cantilever beam and is positioned at the right side of the metal micro-droplet nozzle 16, the height of the laser 13 is about 2cm higher than that of the metal micro-droplet nozzle 16, and the laser 13 can emit high-frequency laser to remelt the metal circuit deposited and solidified on the hot bed 18 after receiving a control signal; the signal generator 11, the temperature controller 14 and the motion control card 15 are all placed outside the glove box 5, the signal generator 11 generates specific control signals to control the motion of the wire extruder 3, the vibration of the piezoelectric ceramic 8 and the laser action of the laser 13, the temperature controller 14 is used for controlling the heating temperature of the hot bed 18 and the high polymer material heater 21, and the motion control card 15 is used for controlling the vertical and horizontal movement of the three-dimensional moving platform 17 and the signal action time of the signal generator 11.

Example 1: and printing the polyhedral space circuit functional part. Firstly, the pressure reducing valve 4 is opened, the glove box 5 is cleaned by using the anti-oxidation inert gas cylinder 1, and the low-oxygen working environment in the glove box 5 is ensured. The polyether ether ketone resin wire is installed in the installation hole of the wire extruder 3, the tin-silver alloy material is added into the heating furnace 10, the temperature controller 14 is adjusted, the temperature of the heating furnace 10 is set to be about 180 ℃, the temperature of the high polymer material heater 21 is set to be about 350 ℃, and the temperature of the hot bed 18 is set to be about 150 ℃. And performing two-dimensional slicing processing on the space circuit model and generating motion track information of the three-dimensional moving platform 17 and action time information of the wire extruder 3, the exciting rod 7 and the laser 13.

When electronic circuits are manufactured rapidly, the motion control card 15 is used for outputting a signal to control the effective acting time of a pulse signal of the signal generator 11, and the generated pulse signal acts on the wire extruder 13, the piezoelectric ceramic 8 and the laser 13. When a pulse signal acts on the wire extruder 13, the polymer wire 2 is conveyed to the polymer material heater 21 to heat the polymer wire into a molten state, and the molten state wire 22 is deposited on the heating bed 18 through the polymer material printing head 20, so that the space circuit insulating substrate 19 is printed; when a pulse signal is applied to the piezoelectric ceramic 8, the excitation rod 7 transmits a stress wave to the metal droplet nozzle 16, and the formed metal droplet 24 is used for forming a circuit lead 26.

And leading in and reading the generated deposition path file, and precisely controlling the three-dimensional moving platform 17 to move below the high molecular material printing head 20 through the motion control card 15 so as to deposit the insulating high molecular material on the hot bed 18, and repeating the steps to form a high molecular concave die 23 required by circuit deposition. The three-dimensional moving platform 17 is precisely controlled by the motion control card 15 to move under the metal droplet nozzle 16, and the metal droplets 24 are deposited and filled in the macromolecule concave die 23. When the pulse signal acts on the laser 13, the laser 13 emits continuous laser 25 to act on the metal liquid drops deposited in the high polymer female die 23, the surface of the line in the high polymer female die 23 is heated along with the metal liquid drops, cold isolation between the liquid drops is avoided, the line is more smooth, and therefore the printing quality of the line is improved. Repeating the steps to finish the point-by-point and layer-by-layer stacking and forming of the polyhedral space circuit functional part.

Example 2: and (4) jointly printing the multifunctional vehicle model space circuit. This example is substantially the same as example 1 except for the pattern profile and the internal wiring pattern. Since the car model lamp position 30, the motor position 31 and the wheel position 32 are relatively fixed and can not be changed at will, before printing the model, the layout of the model is reasonably designed in special space circuit modeling software, spaces of the power supply position 27, the control chip position 28 and the resistance position 29 are reserved under the condition that the lamp position 30, the motor position 31 and the wheel position 32 are not interfered, and then the circuit conducting wires 26 are reasonably arranged in the three-dimensional model to form a final three-dimensional data model. The generated deposition path file is imported and read, and the formation of the vehicle model space circuit is completed by repeated deposition according to the mode of the embodiment 1. Other components may then be mounted directly on the model at power supply location 27, control chip location 28, resistor location 29, lamp location 30, motor location 31, and wheel location 32 to complete the final multi-function vehicle model.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.

Claims

1. A uniform droplet/polymer space circuit combination printing apparatus, comprising: the device comprises an anti-oxidation inert gas cylinder (1), a pressure reducing valve (4), a glove box (5), an oxygen content detector (6), a water content detector (9), a high molecular polymer printing assembly, a uniform metal droplet jetting assembly, a signal generator (11), a laser (13), a temperature controller (14), a motion control card (15), a three-dimensional moving platform (17) and a hot bed (18); the anti-oxidation inert gas bottle (1) is communicated with the glove box (5) through a pressure reducing valve (4) and is used for introducing inert gas into the glove box (5); the oxygen content detector (6) and the water content detector (9) are arranged on the glove box (5) and are respectively used for detecting the oxygen content and the water content in the glove box (5);

the three-dimensional moving platform (17) is fixed on the bottom surface of an inner cabin of the glove box (5), and the hot bed (18) is fixed on the upper surface of the three-dimensional moving platform (17); the high molecular polymer printing component, the uniform metal droplet jetting component and the laser (13) are all fixed at the top of an inner chamber of the glove box (5) through cantilever beams and are positioned above the three-dimensional moving platform (17), and the laser (13) can send high-frequency laser to remelt metal lines deposited and solidified on the hot bed (18) after receiving a control signal;

the signal generator (11) generates a signal to control the operation of the high molecular polymer printing component and the uniform metal droplet jetting component and the laser action of the laser (13), the temperature controller (14) is used for controlling the heating temperature of the hot bed (18), and the motion control card (15) is used for controlling the space three-dimensional movement of the three-dimensional moving platform (17) and the signal action time of the signal generator (11);

the high polymer printing assembly sequentially comprises a wire extruder (3), a high polymer material heater (21) and a high polymer material printing head (20) from top to bottom, wherein a mounting hole for butting the high polymer wire (2) is formed in the upper part of the wire extruder (3), the wire extruder (3) continuously conveys the high polymer wire (2) to the high polymer material heater (21) on the lower part after receiving a control signal, the high polymer wire (2) is heated to be in a molten state after passing through the high polymer material heater (21), and then is extruded and deposited on a hot bed (18) through the high polymer material printing head (20) on the lower part of the high polymer material heater (21);

the uniform metal droplet jetting assembly is positioned on the right side of the high polymer material printing head (20) and comprises an excitation rod (7), piezoelectric ceramics (8), a heating furnace (10) and a metal droplet nozzle (16), and the metal droplet nozzle (16) is 2cm higher than the high polymer material printing head (20); the exciting rod (7) is connected with the piezoelectric ceramic (8) on the exciting rod through threads and extends into the heating furnace (10), the metal droplet nozzle (16) is fixed at the bottom of the heating furnace (10), the heating furnace (10) heats metal to be in a molten state, the piezoelectric ceramic (8) generates vibration deformation after receiving a control signal and transmits the vibration deformation to the heating furnace (10) through the exciting rod (7), and the molten metal (12) in the heating furnace (10) is extruded out of the metal droplet nozzle (16) to form metal droplets after being vibrated to finally deposit on the hot bed (18);

the method for printing the three-dimensional circuit by the uniform droplet/polymer space circuit combined printing device comprises the following specific steps:

cleaning a glove box (5) by using an anti-oxidation inert gas cylinder (1), and keeping the pressure in the glove box (5) higher than the atmospheric pressure by 0-1 mbar to ensure that air cannot enter the closed glove box; detecting the oxygen concentration in the glove box (5) by using an oxygen content detector (6) to ensure that the oxygen content is below 10PPM, and detecting the water vapor concentration in the glove box (5) by using a water content detector (9) to ensure that the water vapor content is below 5 PPM;

secondly, adding a low-temperature alloy material with a melting point of 50-150 ℃ into a heating furnace (10), connecting a high-molecular wire (2) with a melting point of 200-350 ℃ into a mounting hole of a wire extruder (3), starting a heating system, adjusting a temperature controller (14), heating the heating furnace (10) to a temperature 20-50 ℃ above the liquidus of the low-temperature alloy material, and completely melting the internal metal material into molten metal (12); heating a high polymer material heater (21) to a temperature 20-80 ℃ above the melting point of the high polymer wire (2); heating the hot bed (18) to 100-150 ℃, preventing the space circuit insulating base material (19) from warping in the printing process, and ensuring good contact between the space circuit insulating base material and the hot bed (18);

after the temperature is kept for 20 minutes, aligning a laser (13) to the deposition position of the metal droplets, and adjusting the output power of the laser (13) to ensure that the surfaces of the adjacent metal droplets can be fully remelted in the printing process, and simultaneously, the thermal deformation or ablation of the deposited high polymer material caused by overhigh power of the laser (13) is avoided;

step four, establishing a three-dimensional model of the spatial circuit to be formed by adopting spatial circuit modeling software, converting the three-dimensional model into an STL format, carrying out two-dimensional slicing processing on the model, and generating motion track information of a three-dimensional moving platform (17), and action time information of a wire extruder (3), an excitation rod (7) and a laser (13);

fifthly, adjusting the printing step pitch to be 0.7-0.8 times of the inner diameter of the metal micro-droplet nozzle (16) to avoid the circuit from being broken; starting a printing program, importing and reading the deposition path file generated in the fourth step, accurately controlling the motion track of the three-dimensional moving platform (17) through a motion control card (15), firstly forming an insulating base material female die required by circuit deposition on a hot bed (18), then depositing and filling molten metal (12) in the insulating base material female die to form an interconnection circuit, and simultaneously enabling continuous laser emitted by a laser (13) to act on the surface of the metal interconnection circuit to heat so as to form a high-quality circuit;

2. The uniform droplet/polymer space circuit associative printing apparatus of claim 1, wherein: the laser (13) is 2cm higher than the metal droplet nozzle (16).

3. The uniform droplet/polymer space circuit associative printing apparatus of claim 1, wherein: and in the second step, the metal material is a tin-silver alloy, a tin-copper alloy, a bismuth-based alloy or a gallium-indium alloy.

4. The uniform droplet/polymer space circuit associative printing apparatus of claim 1, wherein: and in the second step, the high polymer wire (2) is polyether-ether-ketone resin, polyphenylene sulfone resin or polyetherimide.