CN111933821B - Packaging structure, manufacturing method thereof, display panel and display device - Google Patents
Packaging structure, manufacturing method thereof, display panel and display device Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000010410 layer Substances 0.000 claims abstract description 171
- 230000004888 barrier function Effects 0.000 claims abstract description 78
- 239000012044 organic layer Substances 0.000 claims abstract description 59
- 239000007788 liquid Substances 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims description 20
- 239000001301 oxygen Substances 0.000 claims description 17
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000003463 adsorbent Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000003350 kerosene Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 238000012536 packaging technology Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 18
- 238000005452 bending Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- -1 perfluoro Chemical group 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002594 sorbent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the application provides a packaging structure, a manufacturing method thereof, a display panel and a display device. The packaging structure is used for packaging the organic light-emitting device, and the organic light-emitting device comprises a planarization layer. The package structure includes: the first inorganic layer is positioned on one side of the planarization layer away from the cathode layer; the elastic barrier fence is positioned on one side of the first inorganic layer far away from the planarization layer; the transparent organic liquid layer is positioned on one side of the first inorganic layer far away from the planarization layer and is positioned on the inner side of the elastic barrier fence; an organic layer covering the elastic barrier rib and covering the transparent organic liquid layer; and the second inorganic layer is positioned on one side of the organic layer away from the transparent organic liquid layer. The elastic barrier fence and the transparent organic liquid layer in the packaging structure can effectively buffer the influence of stress on the packaging structure when the flexible OLED is deformed, ensure the stability of the packaging structure and solve the problem that the stress mismatch of the organic layer and the inorganic layer is serious in the prior packaging technology.
Description
Technical Field
The application relates to the technical field of display, in particular to a packaging structure, a manufacturing method thereof, a display panel and a display device.
Background
Organic Light-Emitting diodes (OLEDs) are available for display, and OLED display devices have advantages of ultra-Light, ultra-thin, high brightness, large viewing angle, low voltage, low power consumption, fast response, high definition, shock resistance, flexibility, low cost, and wide temperature range, etc., so OLED display technology is considered as the most promising new generation of display technology.
However, materials such as a light emitting device, a cathode metal material and the like in the OLED display are easy to react with water vapor and oxygen to influence the stability and the service life of the device, and the better the encapsulation effect of the OLED device is, the longer the service life is.
The technology of inorganic/organic overlapped films is adopted for packaging, which is a commonly used packaging method at present, but the stress mismatch of the organic layer and the inorganic layer is serious, so that the packaging structure of the display device is easy to crack and fall off in the bending process, and the service life of the display device is not easy to improve.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a packaging structure, a manufacturing method thereof, a display panel and a display device, which can solve the technical problems that in the prior art, stress mismatch of an organic layer and an inorganic layer is serious in an inorganic/organic overlapped film packaging technology, so that the packaging structure of the display device is easy to crack and fall off in the bending process.
In a first aspect, an embodiment of the present application provides a package structure for packaging an organic light emitting device, where the organic light emitting device includes an organic light emitting layer, a cathode layer located at a side of the organic light emitting layer, and a planarization layer located at a side of the cathode layer away from the organic light emitting layer; the package structure includes:
a first inorganic layer located on a side of the planarization layer remote from the cathode layer;
the elastic barrier bars are positioned on one side of the first inorganic layer, which is far away from the planarization layer, and are of frame-shaped structures;
a transparent organic liquid layer located on one side of the first inorganic layer away from the planarization layer and on the inner side of the elastic barrier rib;
an organic layer covering the elastic barrier rib and covering the transparent organic liquid layer;
and the second inorganic layer is positioned on one side of the organic layer away from the transparent organic liquid layer.
Optionally, the elastic barrier fence is provided with a groove penetrating through the thickness direction of the elastic barrier fence, and a water-oxygen adsorbent is contained in the groove.
Optionally, the material of the transparent organic liquid layer comprises kerosene and/or perfluoro; the material of the organic layer comprises one or a combination of polyamide, polyimide, polyester and epoxy resin.
Optionally, the materials of the first and second inorganic layers include one or a combination of alumina, silica, and silicon nitride.
In a second aspect, an embodiment of the present application provides a display panel, where the display panel includes the above-mentioned packaging structure.
In a third aspect, an embodiment of the present application provides a display device, where the display device includes the display panel described above.
In a fourth aspect, an embodiment of the present application provides a method for manufacturing a package structure, where the method includes:
providing an organic light emitting device to be packaged, wherein the organic light emitting device comprises an organic light emitting layer, a cathode layer positioned at one side of the organic light emitting layer and a planarization layer positioned at one side of the cathode layer away from the organic light emitting layer;
forming a first inorganic layer on a side of the planarization layer away from the cathode layer;
forming an elastic layer on one side of the first inorganic layer far away from the planarization layer, and performing graphical treatment on the elastic layer to form an elastic barrier bar, wherein the elastic barrier bar is of a frame-shaped structure;
dripping transparent organic liquid into the elastic barrier fence;
cooling the transparent organic liquid by utilizing liquid nitrogen to obtain solid transparent organic liquid;
forming an organic layer over the elastic barrier rib and the solid transparent organic liquid;
a second inorganic layer is formed on a side of the organic layer remote from the first inorganic layer.
Optionally, patterning the elastic layer to form elastic barrier ribs includes:
patterning the elastic layer to form an elastic barrier and a groove penetrating through the elastic barrier in the thickness direction; the manufacturing method further comprises the following steps: before forming the organic layer, a water oxygen adsorbent is placed in the grooves.
Optionally, the manufacturing method further includes: and before the second inorganic layer is formed, carrying out plasma treatment on the organic layer to modify the surface of the organic layer so as to obtain the organic layer with oil-water amphiphobic surface.
Optionally, forming an organic layer over the elastic barrier rib and the solid transparent organic liquid, comprising: and coating a monomer to be polymerized and vinyl silsesquioxane on the elastic barrier and the solid transparent organic liquid, and adopting ultraviolet light treatment to form an organic layer formed by hybridized polymerization of the monomer to be polymerized and the vinyl silsesquioxane.
The technical scheme provided by the embodiment of the application has the beneficial technical effects that:
according to the packaging structure, the manufacturing method thereof, the display panel and the display device, the elastic barrier bars and the transparent organic liquid layer positioned between the elastic barrier bars are added between the first inorganic layer and the organic layer, so that the influence of stress on the packaging structure when the flexible OLED display device is deformed can be effectively buffered, the stability of the packaging structure is ensured, and the problem that stress mismatch of the organic layer and the inorganic layer is serious in the prior packaging technology can be solved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic cross-sectional structure of an organic light emitting device and a package structure according to an embodiment of the present application;
FIG. 2 is a schematic top view of a barrier rib of the package structure shown in FIG. 1;
fig. 3 is a schematic cross-sectional structure diagram of another organic light emitting device and a package structure according to an embodiment of the present application;
FIG. 4 is a schematic top view of a barrier rib of the package structure shown in FIG. 3;
fig. 5 is a schematic diagram of a frame structure of a display panel according to an embodiment of the present application;
fig. 6 is a schematic diagram of a frame structure of a display device according to an embodiment of the present application;
fig. 7 is a flowchart illustrating a method for manufacturing a package structure according to an embodiment of the present application.
Reference numerals:
1-an organic light emitting device; 101-an organic light emitting layer; 102-a cathode layer; 103-planarizing the layer;
2-packaging structure; 201-a first inorganic layer; 202-elastic barrier bars; 2021-groove; 203-a transparent organic liquid layer; 204-an organic layer; 205-a second inorganic layer; 206-water oxygen adsorbent.
Detailed Description
The present application is described in detail below, examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The inventor of the present application considers that materials such as a light emitting device and a cathode metal material in an OLED display are liable to react with moisture and oxygen to affect the stability and service life of the device, so that the packaging effect of the OLED device directly affects the service life of the OLED display device. One of the common packaging methods at present is to adopt the technology of inorganic/organic overlapped films, but the stress mismatch of the organic layer and the inorganic layer is serious, so that the packaging structure of the display device is easy to crack and fall off in the bending process, and the service life of the display device is not easy to improve.
The application provides a packaging structure, a manufacturing method thereof, a display panel and a display device, and aims to solve the technical problems in the prior art.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments.
The embodiment of the present application provides a package structure, as shown in fig. 1 and 2, where the package structure 2 is used for packaging an organic light emitting device 1, and the organic light emitting device 1 includes an organic light emitting layer 101, a cathode layer 102 located on a side of the organic light emitting layer 101, and a planarization layer 103 located on a side of the cathode layer 102 away from the organic light emitting layer 101.
The package structure 2 includes:
a first inorganic layer 201 located on a side of the planarization layer 103 away from the cathode layer 102;
the elastic barrier rib 202 is located at one side of the first inorganic layer 201 away from the planarization layer 103, and the elastic barrier rib 202 has a frame-shaped structure;
a transparent organic liquid layer 203 located on a side of the first inorganic layer 201 away from the planarization layer 103 and on an inner side of the elastic barrier rib 202;
an organic layer 204 covering the elastic barrier rib 202 and covering the transparent organic liquid layer 203;
the second inorganic layer 205 is located on a side of the organic layer 204 remote from the transparent organic liquid layer 203.
According to the packaging structure 2 provided by the embodiment, the elastic barrier ribs 202 and the transparent organic liquid layer 203 positioned between the elastic barrier ribs 202 are added between the first inorganic layer 201 and the organic layer 204, so that the influence of stress on the packaging structure 2 during deformation of the flexible OLED display device can be effectively buffered, the stability of the packaging structure 2 is ensured, and the problem that the stress mismatch of the organic layer 204 and the inorganic layer is serious in the prior packaging technology can be solved.
Specifically, the elastic barrier rib 202 is a frame structure, and in a specific implementation, the specific shape of the elastic barrier rib 202 is determined according to the shape of the display panel, for example, if the display panel is rectangular, the elastic barrier rib 202 is a rectangular frame, and if the display panel is irregular, the elastic barrier rib 202 is an irregular frame.
Further, as shown in fig. 1, the material of the transparent organic liquid layer 203 includes kerosene and/or perfluoro; the material of the organic layer 204 includes one or a combination of polyamides, polyimides, polyesters, and epoxy resins.
Specifically, in selecting the materials of the transparent organic liquid layer 203 and the organic layer 204, substances that do not react with each other and do not dissolve should be selected to obtain a stable transparent organic liquid layer 203 and organic layer 204.
Further, as shown in fig. 1, in the package structure 2 provided in this embodiment, the materials of the first inorganic layer 201 and the second inorganic layer 205 include one or a combination of aluminum oxide, silicon dioxide and silicon nitride.
Specifically, titanium oxide may be doped in the first inorganic layer 201 and the second inorganic layer 205 to enhance the light transmittance of the first inorganic layer 201 and the second inorganic layer 205.
Optionally, as shown in fig. 3 and 4, in the package structure 2 provided in this embodiment, the elastic barrier rib 202 is provided with a groove 2021 along the thickness direction of the elastic barrier rib 202, and the water-oxygen adsorbent 206 is contained in the groove 2021.
Specifically, the material of the elastic barrier rib 202 is preferably photoresist, elastic resin, or the like.
Specifically, the depth of the grooves 2021 is preferably the thickness of the resilient barrier 202, i.e., the grooves 2021 extend through the resilient barrier 202 so as to accommodate more of the water oxygen sorbent 206.
Specifically, the material of the water oxygen adsorbent 206 includes one or a combination of CaO, metallic Ca, or metallic carbonate.
In the package structure 2 of the present embodiment, the grooves 2021 are formed on the elastic barrier ribs 202, and the water-oxygen adsorbent 206 is filled in the grooves 2021, so that water-oxygen can be effectively blocked, and the stability of the package structure 2 can be improved.
Based on the same inventive concept, an embodiment of the present application provides a display panel, as shown in fig. 5, where the display panel in this embodiment includes the package structure in the foregoing embodiment, and has the beneficial effects of the package structure in the foregoing embodiment, which is not described herein again.
Specifically, referring to fig. 1 or 3, the display panel provided in this embodiment further includes an organic light emitting device 1, where the organic light emitting device 1 includes an organic light emitting layer 101, a cathode layer 102 located on a side of the organic light emitting layer 101, and a planarization layer 103 located on a side of the cathode layer 102 away from the organic light emitting layer 101. In addition, the organic light emitting device 1 further includes an anode layer located on a side of the organic light emitting layer 101 away from the cathode layer 102, a substrate located on a side of the anode layer away from the organic light emitting layer 101, and a driving circuit located between the substrate and the anode layer.
Preferably, the display panel provided in this embodiment is a flexible display panel, and because the elastic barrier ribs 202 and the transparent organic liquid layer 203 located between the elastic barrier ribs 202 can overcome the problem that the stress mismatch between the organic layer 204 and the inorganic layer is serious in the prior art, the influence of stress on the packaging structure 2 when the flexible display panel is deformed is effectively buffered, so that the bending reliability of the flexible display panel is improved.
Based on the same inventive concept, an embodiment of the present application provides a display device, as shown in fig. 6, where the display device provided in this embodiment includes the display panel in the above embodiment.
Specifically, the display device in this embodiment further includes a driving chip and a power supply, where the driving chip is used to drive the organic light emitting device to emit light, and the power supply provides a driving signal for the display device.
Preferably, referring to fig. 1 or fig. 3, the display device provided in this embodiment is a flexible display device, and because the elastic barrier ribs 202 and the transparent organic liquid layer 203 located between the elastic barrier ribs 202 can overcome the problem of serious stress mismatch between the organic layer 204 and the inorganic layer in the existing packaging technology, the influence of stress on the packaging structure 2 when the flexible display device is deformed is effectively buffered, so as to improve the bending reliability of the flexible display device.
Based on the same inventive concept, the embodiment of the present application provides a method for manufacturing a package structure 2, as shown in fig. 7, and in combination with fig. 1 and fig. 2, the method for manufacturing a package structure provided in the embodiment includes:
s1: an organic light emitting device 1 to be packaged is provided, the organic light emitting device 1 including an organic light emitting layer 101, a cathode layer 102 located on a side of the organic light emitting layer 101, and a planarization layer 103 located on a side of the cathode layer 102 remote from the organic light emitting layer 101.
S2: forming a first inorganic layer 201 on a side of the planarization layer 103 remote from the cathode layer 102;
s3: forming an elastic layer on one side of the first inorganic layer 201 away from the planarization layer 103, and performing patterning treatment on the elastic layer to form an elastic barrier rib 202, wherein the elastic barrier rib 202 has a frame-shaped structure;
s4: dripping transparent organic liquid into the elastic barrier fence 202, and cooling the transparent organic liquid by utilizing liquid nitrogen to obtain solid transparent organic liquid;
s5: forming an organic layer 204 over the elastic barrier ribs 202 and the solid transparent organic liquid;
s6: a second inorganic layer 205 is formed on a side of the organic layer 204 remote from the first inorganic layer 201.
According to the manufacturing method of the packaging structure 2, the elastic barrier ribs 202 and the transparent organic liquid layer 203 positioned between the elastic barrier ribs 202 are added between the first inorganic layer 201 and the organic layer 204, so that the influence of stress on the packaging structure 2 during deformation of the flexible OLED display device can be effectively buffered, the stability of the packaging structure 2 is ensured, and the problem that stress mismatch between the organic layer 204 and the inorganic layer is serious in the prior packaging technology can be solved.
Optionally, referring to fig. 3 and 4, patterning the elastic layer to form elastic barrier ribs 202 includes: patterning the elastic layer to form an elastic barrier rib 202 and a groove 2021 along the thickness direction of the elastic barrier rib 202; based on this, the manufacturing method provided by the embodiment of the application further includes: before the organic layer 204 is formed, the water oxygen adsorbent 206 is placed in the recess 2021.
Specifically, the material of the elastic barrier rib 202 is preferably photoresist, elastic resin, or the like. The depth of the grooves 2021 is preferably the thickness of the resilient barrier 202, i.e., the grooves 2021 extend through the resilient barrier 202 so as to accommodate more of the water oxygen sorbent 206. The material of the water oxygen adsorbent 206 includes one or a combination of CaO, metallic Ca, or metallic carbonate.
Taking the material of the elastic barrier rib 202 as photoresist as an example, if the depth of the formed groove 2021 is the same as the thickness of the elastic barrier rib 202, the same mask plate is adopted to form the elastic barrier rib 202 with the groove 2021; if the depth of the grooves 2021 is less than the thickness of the elastic barrier ribs 202, a halftone mask may be used to form the elastic barrier ribs 202 with the grooves 2021.
In the method for manufacturing the package structure of the present embodiment, the grooves 2021 are formed on the elastic barrier ribs 202, and the water-oxygen adsorbent 206 is filled in the grooves 2021, so that water-oxygen can be effectively blocked, and the stability of the package structure 2 can be improved.
Optionally, referring to fig. 1 or fig. 3, the method for manufacturing the package structure according to the present embodiment further includes: before the second inorganic layer 205 is formed, the organic layer 204 is subjected to plasma treatment to modify the surface of the organic layer 204, so as to obtain the organic layer 204 having surface oil-water amphiphobicity.
Specifically, the material of the organic layer 204 is one or a combination of polyamides, polyimides, polyesters, and epoxy resins. By CF 4 The RF plasma is used to treat the surface of the organic layer 204, so that the surface of the organic layer 204 can be additionally provided with fluorine-containing nonpolar functional groups, such as-CF 2 、-C(CF) n 、-CF(CF) n Etc., these functional groups have the property of being oil-water amphiphobic; and the surface roughness of the organic layer 204 can be improved by the plasma treatment, so that the oil-water amphiphobic property of the organic layer 204 is further improved.
Optionally, referring to fig. 3 and fig. 4, in the method for manufacturing a package structure according to the present embodiment, step S5 includes: the elastomeric barrier 202 and the solid transparent organic liquid are coated with the monomer to be polymerized and the vinyl silsesquioxane and treated with ultraviolet light to form an organic layer 204 that is hybrid polymerized from the monomer to be polymerized and the vinyl silsesquioxane. Specifically, the monomer to be polymerized is diamine, dianhydride, bisphenol, polyalcohol, epichlorohydrin and other small organic molecules, and the organic layer 204 is one or a combination of polyamide, polyimide, polyester and epoxy resin formed by polymerization.
Specifically, in selecting the materials of the transparent organic liquid layer 203 and the organic layer 204, substances that do not react with each other and do not dissolve should be selected to obtain a stable transparent organic liquid layer 203 and organic layer 204.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the packaging structure, the manufacturing method thereof, the display panel and the display device, the elastic barrier bars and the transparent organic liquid layer positioned between the elastic barrier bars are added between the first inorganic layer and the organic layer, so that the influence of stress on the packaging structure when the flexible OLED display device is deformed can be effectively buffered, the stability of the packaging structure is ensured, and the problem that stress mismatch of the organic layer and the inorganic layer is serious in the prior packaging technology can be solved.
Those of skill in the art will appreciate that the various operations, methods, steps in the flow, acts, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed herein may be alternated, altered, rearranged, disassembled, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.
Claims (9)
1. A packaging structure for packaging an organic light-emitting device, wherein the organic light-emitting device comprises an organic light-emitting layer, a cathode layer positioned at one side of the organic light-emitting layer, and a planarization layer positioned at one side of the cathode layer away from the organic light-emitting layer;
the packaging structure is characterized by comprising:
a first inorganic layer located on a side of the planarization layer remote from the cathode layer;
the elastic barrier bars are positioned on one side, far away from the planarization layer, of the first inorganic layer and are of frame-shaped structures, grooves penetrating through the thickness direction of the elastic barrier bars are formed in the elastic barrier bars, and water-oxygen adsorbents are contained in the grooves;
a transparent organic liquid layer located on one side of the first inorganic layer away from the planarization layer and on the inner side of the elastic barrier rib;
an organic layer covering the elastic barrier rib and covering the transparent organic liquid layer;
and the second inorganic layer is positioned on one side of the organic layer away from the transparent organic liquid layer.
2. The package structure of claim 1, wherein,
the material of the transparent organic liquid layer comprises kerosene and/or perfluorinated;
the material of the organic layer comprises one or a combination of polyamide, polyimide, polyester and epoxy resin.
3. The package structure of claim 1, wherein the material of the first and second inorganic layers comprises one or a combination of aluminum oxide, silicon dioxide, and silicon nitride.
4. A display panel comprising the package structure of any one of claims 1-3.
5. A display device comprising the display panel of claim 4.
6. The manufacturing method of the packaging structure is characterized by comprising the following steps:
providing an organic light emitting device to be packaged, wherein the organic light emitting device comprises an organic light emitting layer, a cathode layer positioned at one side of the organic light emitting layer and a planarization layer positioned at one side of the cathode layer away from the organic light emitting layer;
forming a first inorganic layer on a side of the planarization layer away from the cathode layer;
forming an elastic layer on one side of the first inorganic layer far away from the planarization layer, and performing graphical treatment on the elastic layer to form an elastic barrier bar, wherein the elastic barrier bar is of a frame-shaped structure;
dripping transparent organic liquid into the elastic barrier fence;
cooling the transparent organic liquid by utilizing liquid nitrogen to obtain solid transparent organic liquid;
forming an organic layer over the elastic barrier rib and the solid transparent organic liquid;
a second inorganic layer is formed on a side of the organic layer remote from the first inorganic layer.
7. The method of manufacturing a package structure according to claim 6, wherein patterning the elastic layer to form elastic barrier ribs comprises:
patterning the elastic layer to form an elastic barrier and a groove penetrating through the elastic barrier in the thickness direction;
the manufacturing method further comprises the following steps: before forming the organic layer, a water oxygen adsorbent is placed in the grooves.
8. The method of manufacturing a package structure of claim 6, further comprising:
and before the second inorganic layer is formed, carrying out plasma treatment on the organic layer to modify the surface of the organic layer so as to obtain the organic layer with oil-water amphiphobic surface.
9. The method of manufacturing a package structure according to claim 6, wherein forming an organic layer on the elastic barrier rib and the solid transparent organic liquid comprises:
and coating a monomer to be polymerized and vinyl silsesquioxane on the elastic barrier and the solid transparent organic liquid, and adopting ultraviolet light treatment to form an organic layer formed by hybridized polymerization of the monomer to be polymerized and the vinyl silsesquioxane.
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| CN107170902A (en) * | 2017-05-26 | 2017-09-15 | 深圳市华星光电技术有限公司 | The method for packing of packaging film and preparation method thereof and oled panel |
| CN107565052A (en) * | 2017-08-25 | 2018-01-09 | 京东方科技集团股份有限公司 | Encapsulating structure and its manufacture method, display device |
| CN110165068A (en) * | 2018-05-11 | 2019-08-23 | 京东方科技集团股份有限公司 | Organic membrane structure and preparation method, encapsulating structure and preparation method and light-emitting substrate |
| CN110767818A (en) * | 2018-07-26 | 2020-02-07 | Oppo广东移动通信有限公司 | OLED screen, manufacturing method thereof and electronic device |
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| CN107170902A (en) * | 2017-05-26 | 2017-09-15 | 深圳市华星光电技术有限公司 | The method for packing of packaging film and preparation method thereof and oled panel |
| CN107565052A (en) * | 2017-08-25 | 2018-01-09 | 京东方科技集团股份有限公司 | Encapsulating structure and its manufacture method, display device |
| CN110165068A (en) * | 2018-05-11 | 2019-08-23 | 京东方科技集团股份有限公司 | Organic membrane structure and preparation method, encapsulating structure and preparation method and light-emitting substrate |
| CN110767818A (en) * | 2018-07-26 | 2020-02-07 | Oppo广东移动通信有限公司 | OLED screen, manufacturing method thereof and electronic device |
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