CN111933443B - Large transformer core cooling channel ceramic chip setting method and chip mounting equipment - Google Patents
Large transformer core cooling channel ceramic chip setting method and chip mounting equipment Download PDFInfo
- Publication number
- CN111933443B CN111933443B CN202010947133.5A CN202010947133A CN111933443B CN 111933443 B CN111933443 B CN 111933443B CN 202010947133 A CN202010947133 A CN 202010947133A CN 111933443 B CN111933443 B CN 111933443B
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- ceramic chip
- ceramic
- cooling channel
- transformer core
- transmission plate
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- 239000000919 ceramic Substances 0.000 title claims abstract description 116
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 230000005540 biological transmission Effects 0.000 claims abstract description 44
- 229910000976 Electrical steel Inorganic materials 0.000 claims abstract description 34
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000001179 sorption measurement Methods 0.000 claims description 31
- 239000003292 glue Substances 0.000 claims description 22
- 238000004026 adhesive bonding Methods 0.000 claims description 13
- 238000003860 storage Methods 0.000 claims description 9
- 230000004323 axial length Effects 0.000 claims description 5
- 238000003892 spreading Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 229910052573 porcelain Inorganic materials 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000003921 oil Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention provides a method for arranging a large-sized transformer core cooling channel ceramic chip and patch equipment, which are used for solving the problems that the method for arranging the large-sized transformer core cooling channel ceramic chip in the prior art is time-consuming and labor-consuming, seriously affects the production efficiency of the large-sized transformer core and the like. According to the ceramic tile setting method, the ceramic tile is stuck to the middle medium by adopting the chip mounting equipment, when the transformer iron core is stacked to the layer of silicon steel sheets needing to be provided with the cooling channel, the middle medium stuck with the ceramic tile is tiled on the surface of the layer of silicon steel sheets, and the surface stuck with the ceramic tile faces upwards; then, the stacking of the silicon steel sheets is continued again. The patch device of the present invention includes: frame, transmission board actuating mechanism, put paper cylinder, collection roller, paster support, paster subassembly, locating sleeve and control mechanism. The invention has the beneficial technical effects of effectively improving the pasting efficiency and quality of the porcelain sheet, effectively improving the lamination speed and quality of the iron core and effectively improving the production efficiency of the iron core.
Description
Technical Field
The invention relates to a large transformer core production technology, in particular to a large transformer core cooling channel ceramic tile setting method and patch equipment.
Background
In order to reduce the operating temperature of large transformers, the transformer core and coil are typically immersed in insulating oil, and heat generated by the core and coil is carried away by the circulation of the insulating oil, so that the transformer is maintained at a lower temperature. In order to ensure the magnetic conduction effect of the iron core of the large-sized transformer, the shape of the iron core is designed into a closed loop. The middle of the closed loop forms a closed space, and insulating oil in the closed space cannot participate in the circulation of the insulating oil, so that the working temperature of the transformer is seriously affected. To solve this problem, a plurality of slits are generally provided in the lamination direction of the transformer core, so that the insulating oil in the closed space can flow into or out of the closed space through the slits, thereby participating in the circulation of the insulating oil, ensuring the operating temperature of the transformer, and the slits are also called cooling channels. Obviously, the simplest method for setting the cooling channel is to set some small ceramic sheets (such as alumina ceramic sheets with the diameter of 20mm and the thickness of 3 mm) at intervals between the silicon steel sheets laminated into the transformer core, so that gaps are formed between the silicon steel sheets on the upper side and the lower side of the ceramic sheets, namely, the cooling channel is formed.
In general, large transformer cores are formed by stacking cut silicon steel sheets on a transformer production site. In the production process, when the silicon steel sheets are stacked to the layer of silicon steel sheets needing to be provided with the cooling channels, porcelain sheets are stuck on the surfaces of the layer of silicon steel sheets according to design requirements in a manual mode. Because the ceramic chip is stuck in a large amount, and the adhesive is solidified for a long time, the ceramic chip setting process is the most time-consuming and labor-consuming process in the iron core production process, and the production efficiency of the large-scale transformer iron core is seriously affected.
Obviously, the method for setting the ceramic chip of the cooling channel of the large transformer core in the prior art has the problems of time and labor waste, serious influence on the production efficiency of the large transformer core and the like.
Disclosure of Invention
The invention provides a method for arranging a large-sized transformer core cooling channel ceramic chip and patch equipment, which are used for solving the problems that the method for arranging the large-sized transformer core cooling channel ceramic chip in the prior art is time-consuming and labor-consuming, seriously affects the production efficiency of the large-sized transformer core and the like.
According to the method for arranging the ceramic chips of the cooling channel of the large-sized transformer core, the ceramic chips are stuck to the middle medium by adopting the chip sticking equipment, when the transformer core is stacked to the layer of silicon steel sheets needing to be provided with the cooling channel, the middle medium stuck with the ceramic chips is tiled on the surface of the layer of silicon steel sheets, and one surface stuck with the ceramic chips faces upwards; then, stacking the silicon steel sheets again; the intermediate medium comprises insulating paper, an insulating plate and a silicon steel sheet.
Further, the patch device includes: the device comprises a frame, a transmission plate driving mechanism, a paper placing roller, a paper collecting roller, a patch bracket, a patch assembly, a positioning sleeve and a control mechanism; the transmission plate is a rectangular thin plate and is arranged right above the frame through a transmission plate driving mechanism; the paper placing roller is arranged at the rear side of the frame; the paper collecting roller is arranged at the front side of the frame; the patch bracket is erected right above the transmission plate and comprises an upright post and a rotating shaft; the upright posts are arranged on two sides of the transmission plate and can move up and down; the rotating shaft is rotatably arranged between the ends of the two upright posts and is connected with a vacuum pipeline; the patch assembly and the positioning sleeve are alternately sleeved on the rotating shaft at intervals; the patch assembly comprises a rotating body, an adsorption supporting rod, a ceramic chip bucket and a gluing bucket, wherein the rotating body is sleeved on the rotating shaft and is connected with a vacuum pipeline on the rotating shaft; the adsorption support rod is of a tubular structure, one end of the adsorption support rod is provided with a horn-mouth-shaped ceramic chip suction nozzle, and the other end of the adsorption support rod is fixedly arranged on the rotating body and is connected with a vacuum pipeline on the rotating body; the ceramic chip hopper is arranged right above the rotating shaft, a ceramic chip outlet is arranged right below the ceramic chip hopper, and the ceramic chip outlet is opposite to the ceramic chip suction nozzle of the suction support rod; the gluing hopper is arranged right in front of the rotating shaft and comprises a glue storage cavity and a gluing head; the glue spreading head is a sponge body and is used for absorbing the glue transmitted in the glue storage cavity; the control mechanism controls the coordinated operation of the mechanisms or components through circuits and mechanical structures.
Furthermore, the locating sleeves are in a plurality of groups, and the axial lengths of the groups are different.
The invention relates to a large-scale transformer core cooling channel ceramic chip patch device, which comprises: the device comprises a frame, a transmission plate driving mechanism, a paper placing roller, a paper collecting roller, a patch bracket, a patch assembly, a positioning sleeve and a control mechanism; the transmission plate is a rectangular thin plate and is arranged right above the frame through a transmission plate driving mechanism; the paper placing roller is arranged at the rear side of the frame; the paper collecting roller is arranged at the front side of the frame; the patch bracket is erected right above the transmission plate and comprises an upright post and a rotating shaft; the upright posts are arranged on two sides of the transmission plate and can move up and down; the rotating shaft is rotatably arranged between the ends of the two upright posts and is connected with a vacuum pipeline; the patch assembly and the positioning sleeve are alternately sleeved on the rotating shaft at intervals; the patch assembly comprises a rotating body, an adsorption supporting rod, a ceramic chip bucket and a gluing bucket, wherein the rotating body is sleeved on the rotating shaft and is connected with a vacuum pipeline on the rotating shaft; the adsorption support rod is of a tubular structure, one end of the adsorption support rod is provided with a horn-mouth-shaped ceramic chip suction nozzle, and the other end of the adsorption support rod is fixedly arranged on the rotating body and is connected with a vacuum pipeline on the rotating body; the ceramic chip hopper is arranged right above the rotating shaft, a ceramic chip outlet is arranged right below the ceramic chip hopper, and the ceramic chip outlet is opposite to the ceramic chip suction nozzle of the suction support rod; the gluing hopper is arranged right in front of the rotating shaft and comprises a glue storage cavity and a gluing head; the glue spreading head is a sponge body and is used for absorbing the glue transmitted in the glue storage cavity; the control mechanism controls the coordinated operation of the mechanisms or components through circuits and mechanical structures.
Furthermore, the locating sleeves are in a plurality of groups, and the axial lengths of the groups are different.
Further, the number of the adsorption supporting rods is two, and the adsorption supporting rods are fixedly arranged on the rotating body at 180 degrees.
Further, two ends of the transmission plate are provided with pressing plate mechanisms for fixing the intermediate medium.
Further, the patch support is further provided with a lateral movement mechanism relative to the transmission plate.
Further, a pressure sensor is arranged in the vacuum pipeline of the adsorption support rod, and when the adsorption support rod suction nozzle is not adsorbed to the ceramic chip, a signal is sent to the control mechanism when the adsorption pressure of the vacuum pipeline changes.
The method for arranging the ceramic chips of the cooling channel of the large-sized transformer core and the patch equipment have the beneficial technical effects that the pasting efficiency and quality of the ceramic chips are effectively improved, the lamination speed and quality of the transformer core are effectively improved, and the production efficiency of the large-sized transformer core is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a large-scale transformer core cooling channel tile mounting apparatus of the present invention;
FIG. 2 is a schematic diagram of the structure of a chip assembly of the large-scale transformer core cooling channel chip mounting apparatus of the present invention;
FIG. 3 is a schematic illustration of the arrangement of staggered tiles.
The method for arranging the ceramic chip of the cooling channel of the large-sized transformer core and the patch equipment are further described below with reference to the accompanying drawings and the specific embodiments.
Detailed Description
Fig. 1 is a schematic structural diagram of a ceramic chip mounting device for a cooling channel of a large-sized transformer core, fig. 2 is a schematic structural diagram of a ceramic chip mounting assembly of the ceramic chip mounting device for the large-sized transformer core, in the drawings, 1 is a frame, 2 is a transmission plate, 3 is a transmission plate driving mechanism, 4 is a paper placing roller, 5 is a paper collecting roller, 6 is a ceramic chip bracket, 7 is a ceramic chip mounting assembly, 7-1 is a rotator, 7-2 is an adsorption supporting rod, 7-3 is a ceramic chip bucket, 7-4 is a glue coating bucket, and 8 is a positioning sleeve. According to the method for arranging the ceramic chips of the cooling channels of the large-sized transformer core, the ceramic chips are stuck to the middle medium by adopting the chip mounting equipment, when the transformer core is stacked to the layer of silicon steel sheets needing to be provided with the cooling channels, the middle medium stuck with the ceramic chips is paved on the surface of the layer of silicon steel sheets, and the surface stuck with the ceramic chips faces upwards; then, stacking the silicon steel sheets again; the intermediate medium comprises insulating paper, an insulating plate and a silicon steel sheet; the patch device includes: the device comprises a frame 1, a transmission plate 2, a transmission plate driving mechanism 3, a paper placing roller 4, a paper collecting roller 5, a patch bracket 6, a patch assembly 7, a positioning sleeve 8 and a control mechanism; the transmission plate 2 is a rectangular thin plate and is arranged right above the frame 1 through a transmission plate driving mechanism 3; the paper placing roller 5 is arranged at the rear side of the frame 1; the paper collecting roller 5 is arranged at the front side of the frame 1; the patch bracket 6 is erected right above the transmission plate 2 and comprises an upright post and a rotating shaft; the upright posts are arranged on two sides of the transmission plate and can move up and down; the rotating shaft is rotatably arranged between the ends of the two upright posts and is connected with a vacuum pipeline; the patch assembly 7 and the positioning sleeve 8 are alternately sleeved on the rotating shaft at intervals; the patch assembly 7 comprises a rotating body 7-1, an adsorption supporting rod 7-2, a ceramic chip bucket 7-3 and a gluing bucket 7-4, wherein the rotating body 7-1 is sleeved on the rotating shaft and is connected with a vacuum pipeline on the rotating shaft; the adsorption supporting rod 7-2 is of a tubular structure, one end of the adsorption supporting rod is provided with a horn-shaped ceramic chip suction nozzle, and the other end of the adsorption supporting rod is fixedly arranged on the rotating body 7-1 and is connected with a vacuum pipeline on the rotating body 7-1; the ceramic chip hopper 7-3 is arranged right above the rotating shaft, a ceramic chip outlet is arranged right below the ceramic chip hopper, and the ceramic chip outlet is opposite to the ceramic chip suction nozzle of the suction support rod 7-2; the gluing hopper 7-4 is arranged right in front of the rotating shaft and comprises a glue storage cavity and a gluing head; the glue spreading head is a sponge body and is used for absorbing the glue transmitted in the glue storage cavity; the control mechanism controls the coordinated operation of the mechanisms or components through circuits and mechanical structures.
Because the middle medium is used as a base material for sticking the ceramic chip, the ceramic chip can be stuck on the middle medium before the transformer iron core is stacked, when the transformer iron core is stacked on the layer of silicon steel sheet needing to be provided with the cooling channel, the middle medium stuck with the ceramic chip is tiled on the surface of the layer of silicon steel sheet, and one surface stuck with the ceramic chip faces upwards; then, the stacking of the silicon steel sheets is continued again. The method can greatly improve the stacking efficiency of the transformer iron core and effectively ensure the quality of the iron core. Obviously, the intermediate medium comprises insulating paper, insulating plates, silicon steel sheets and other thin sheets or sheet materials with certain strength and rigidity, so that the ceramic sheets are firmly adhered, and the ceramic sheets can be conveniently paved on the silicon steel sheets.
Because the porcelain sheet is not pasted on the stacking site of the transformer iron core, the porcelain sheet can be pasted on the middle medium in a mechanized mode, namely, the porcelain sheet pasting device for the cooling channel porcelain sheet of the large-sized transformer iron core is adopted to paste the porcelain sheet on the middle medium. The specific working process comprises the following steps: the axial length of the locating sleeve is selected according to the design requirement of the transformer iron core, so that the spacing between the adsorption supporting rods accords with the spacing requirement of the ceramic chip adhered to the silicon steel sheet after the patch assembly and the locating sleeve are alternately sleeved on the rotating shaft at intervals. Obviously, in order to meet the design requirement of the transformer core, the locating sleeves are in a plurality of groups, and the axial lengths of each group are different. The number of the locating sleeves and the patch components is selected according to the width of the intermediate medium and the interval between the ceramic chips adhered to the silicon steel sheet, so that the ceramic chips are ensured to be uniformly distributed in the transverse direction of the intermediate medium; and adjusting the stepping distance of the transmission plate driving mechanism on the frame according to the design requirement of the transformer core, and ensuring that the longitudinal distance of the attached ceramic chip meets the design requirement of the transformer core. And filling the glue storage cavity with glue, and ensuring that the glue coating head adsorbs enough glue. And loading ceramic chips into the ceramic chip hopper, and spreading the insulating paper on the transmission plate through the paper placing roller and the paper collecting roller. The power supply is started, the control mechanism controls the vacuum pipeline to run, the electromagnetic valve of the suction nozzle is started to enable the suction nozzle of the ceramic chip to generate negative pressure, and the ceramic chip at the outlet of the ceramic chip bucket is adsorbed on the suction nozzle of the ceramic chip. The control mechanism controls the rotating shaft to rotate 90 degrees clockwise, at the moment, the ceramic chip on the ceramic chip suction nozzle is just positioned at the gluing head, and the outer end face of the ceramic chip is coated with glue. The control mechanism controls the rotating shaft to rotate 90 degrees clockwise again, at the moment, the ceramic chip on the ceramic chip suction nozzle is right above the insulating paper, and the outer end surface of the ceramic chip coated with the adhesive is right opposite to the insulating paper. The control mechanism controls the patch bracket to move downwards, so that the outer end surface of the porcelain piece coated with the adhesive contacts with the insulating paper and has set pressure. And keeping the pressure for a set time, closing the suction nozzle electromagnetic valve by the control mechanism, controlling the patch bracket to move upwards to return to the original position, and simultaneously controlling the rotating shaft to rotate 180 degrees to finish the pasting of the first row of ceramic chips. The control mechanism controls the transmission plate driving mechanism to drive the transmission plate to move on the frame for a set distance, and the second row of ceramic chips are pasted. Obviously, two adsorption supporting rods can be fixedly arranged on the rotating body and distributed at 180 degrees. Like this, after the pasting of first row ceramic chip is accomplished to first group absorption branch, the second group absorption branch just in time is located vertical ascending position, can begin the pasting of second row ceramic chip immediately, can improve to a certain extent and paste efficiency. After the second row of ceramic tiles are pasted, the third row of ceramic tiles are pasted until the transmission plate moves forward to the set position, and the first round of ceramic tiles are pasted. The control mechanism controls the transmission plate driving mechanism to drive the transmission plate to return to the original position, and the second round of ceramic tile pasting is started. And (5) reciprocating the process until the sticking of all the ceramic chips is completed. Obviously, when an insulating plate or a silicon steel sheet is used as an intermediate medium, the insulating plate or the silicon steel sheet can be laid flat on the transmission plate, and after the first round of tile pasting is completed, the insulating plate or the silicon steel sheet is replaced, and then, the second round of tile pasting is started.
In order to ensure that the intermediate medium can move synchronously with the transmission plate, two ends of the transmission plate are provided with pressing plate mechanisms for fixing the intermediate medium. After the insulating paper, the insulating plate or the silicon steel sheet is tiled on the transmission plate, the pressing plate mechanisms arranged at the two ends of the transmission plate compress the insulating paper, the insulating plate or the silicon steel sheet at the two ends of the transmission plate, so that the insulating paper, the insulating plate or the silicon steel sheet can move synchronously with the transmission plate.
Fig. 3 is a schematic arrangement view of staggered tiles, and in order to meet the requirement of pasting the staggered tiles, the patch bracket is further provided with a transverse moving mechanism relative to the transmission plate. After the first row of ceramic chips are pasted, the control mechanism controls the patch bracket to transversely move by a distance of half of the ceramic chip spacing relative to the transmission plate through the transverse moving mechanism, simultaneously, the ceramic chip outlet of the first ceramic chip hopper in the transverse moving direction is closed, and then, the pasting of the second row of ceramic chips is started. After the second row of ceramic chips are pasted, the control mechanism controls the patch bracket to transversely move back to the original position through the transverse moving mechanism, simultaneously, the ceramic chip outlet of the closed ceramic chip hopper is opened, and then, the pasting of the third row of ceramic chips is started. And the process is repeated until the conveying plate moves forward to the set position. The staggered tiles refer to tiles in even columns that are offset from tiles in odd columns by a distance of one half pitch (see fig. 3).
In order to prevent the ceramic chip from being blocked at the outlet of the ceramic chip hopper or not being transmitted to the outlet in time, the suction nozzle of the suction support rod is not sucked to the ceramic chip to generate misoperation. The ceramic chip patch equipment of the large-sized transformer core cooling channel is also provided with the pressure sensor in the vacuum pipeline of the adsorption support rod, and when the adsorption support rod suction nozzle is not adsorbed to the ceramic chip, the adsorption pressure of the vacuum pipeline is changed, a signal is sent to the control mechanism. The control mechanism stops the chip mounting equipment, and restarts after the fault is removed.
Obviously, the method for arranging the ceramic chips of the cooling channel of the large-sized transformer core and the patch equipment have the beneficial technical effects that the pasting efficiency and quality of the ceramic chips are effectively improved, the lamination speed and quality of the transformer core are effectively improved, and the production efficiency of the large-sized transformer core is effectively improved.
Claims (5)
1. The utility model provides a large-scale transformer core cooling channel ceramic chip paster equipment which characterized in that, this paster equipment includes: the device comprises a frame, a transmission plate driving mechanism, a paper placing roller, a paper collecting roller, a patch bracket, a patch assembly, a positioning sleeve and a control mechanism; the transmission plate is a rectangular thin plate and is arranged right above the frame through a transmission plate driving mechanism; the paper placing roller is arranged at the rear side of the frame; the paper collecting roller is arranged at the front side of the frame; the patch bracket is erected right above the transmission plate and comprises an upright post and a rotating shaft; the upright posts are arranged on two sides of the transmission plate and can move up and down; the rotating shaft is rotatably arranged between the ends of the two upright posts and is connected with a vacuum pipeline; the patch assembly and the positioning sleeve are alternately sleeved on the rotating shaft at intervals; the patch assembly comprises a rotating body, an adsorption supporting rod, a ceramic chip bucket and a gluing bucket, wherein the rotating body is sleeved on the rotating shaft and is connected with a vacuum pipeline on the rotating shaft; the adsorption support rod is of a tubular structure, one end of the adsorption support rod is provided with a horn-mouth-shaped ceramic chip suction nozzle, and the other end of the adsorption support rod is fixedly arranged on the rotating body and is connected with a vacuum pipeline on the rotating body; the ceramic chip hopper is arranged right above the rotating shaft, a ceramic chip outlet is arranged right below the ceramic chip hopper, and the ceramic chip outlet is opposite to the ceramic chip suction nozzle of the suction support rod; the gluing hopper is arranged right in front of the rotating shaft and comprises a glue storage cavity and a gluing head; the glue spreading head is a sponge body and is used for absorbing the glue transmitted in the glue storage cavity; the control mechanism controls the coordinated operation of the transmission plate driving mechanism and each component through a circuit and a mechanical structure; the patch bracket is also provided with a transverse moving mechanism relative to the transmission plate; a pressure sensor is arranged in the vacuum pipeline of the adsorption support rod, and when the adsorption support rod suction nozzle is not adsorbed to the ceramic chip, and the adsorption pressure of the vacuum pipeline is changed, a signal is sent to the control mechanism.
2. The large transformer core cooling channel tile mounting apparatus of claim 1, wherein said positioning sleeves are in a plurality of groups, each group having a different axial length.
3. The large-scale transformer core cooling channel tile patch device of claim 1, wherein the number of the adsorption struts is two and is fixedly installed on the rotor at 180 degrees.
4. The large-scale transformer core cooling channel tile mounting apparatus of claim 1, wherein two ends of the transfer plate are provided with a platen mechanism for securing an intermediate medium.
5. The method for arranging the ceramic chips of the cooling channels of the large-sized transformer iron cores is characterized in that the ceramic chips are stuck on the middle medium by adopting the chip mounting equipment in any one of claims 1 to 4, when the transformer iron cores are stacked on the layer of silicon steel sheets needing to be provided with the cooling channels, the middle medium stuck with the ceramic chips is paved on the surface of the layer of silicon steel sheets, and one surface stuck with the ceramic chips faces upwards; then, stacking the silicon steel sheets again; the intermediate medium comprises insulating paper, an insulating plate and a silicon steel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947133.5A CN111933443B (en) | 2020-09-10 | 2020-09-10 | Large transformer core cooling channel ceramic chip setting method and chip mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947133.5A CN111933443B (en) | 2020-09-10 | 2020-09-10 | Large transformer core cooling channel ceramic chip setting method and chip mounting equipment |
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| Publication Number | Publication Date |
|---|---|
| CN111933443A CN111933443A (en) | 2020-11-13 |
| CN111933443B true CN111933443B (en) | 2024-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010947133.5A Active CN111933443B (en) | 2020-09-10 | 2020-09-10 | Large transformer core cooling channel ceramic chip setting method and chip mounting equipment |
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| CN (1) | CN111933443B (en) |
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| CN105576919A (en) * | 2016-01-13 | 2016-05-11 | 徐俊 | Disc type motor of integral cooling heat radiation structure |
| CN105655098A (en) * | 2014-11-14 | 2016-06-08 | 中国长城计算机深圳股份有限公司 | Transformer and method for manufacturing same |
| CN106856147A (en) * | 2016-12-28 | 2017-06-16 | 河北工业大学 | A kind of extra-high voltage transformer iron core pasting method of view-based access control model detection |
| CN208045268U (en) * | 2018-05-03 | 2018-11-02 | 珠海经济特区宝诚电子有限公司 | The novel patch product iron core of high power low loss |
| CN210722730U (en) * | 2019-08-22 | 2020-06-09 | 东莞市威元电子科技有限公司 | Transformer core assembly device |
| CN212365733U (en) * | 2020-09-10 | 2021-01-15 | 重庆铧鸿电力设备有限公司 | Ceramic chip mounting equipment for large transformer core cooling channel |
-
2020
- 2020-09-10 CN CN202010947133.5A patent/CN111933443B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655098A (en) * | 2014-11-14 | 2016-06-08 | 中国长城计算机深圳股份有限公司 | Transformer and method for manufacturing same |
| CN105576919A (en) * | 2016-01-13 | 2016-05-11 | 徐俊 | Disc type motor of integral cooling heat radiation structure |
| CN106856147A (en) * | 2016-12-28 | 2017-06-16 | 河北工业大学 | A kind of extra-high voltage transformer iron core pasting method of view-based access control model detection |
| CN208045268U (en) * | 2018-05-03 | 2018-11-02 | 珠海经济特区宝诚电子有限公司 | The novel patch product iron core of high power low loss |
| CN210722730U (en) * | 2019-08-22 | 2020-06-09 | 东莞市威元电子科技有限公司 | Transformer core assembly device |
| CN212365733U (en) * | 2020-09-10 | 2021-01-15 | 重庆铧鸿电力设备有限公司 | Ceramic chip mounting equipment for large transformer core cooling channel |
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| CN111933443A (en) | 2020-11-13 |
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