CN111926569A - Semi-conductive adhesive and preparation method thereof, semi-conductive fiber, semi-conductive copper wire shielding tape and preparation method thereof, and cable - Google Patents
Semi-conductive adhesive and preparation method thereof, semi-conductive fiber, semi-conductive copper wire shielding tape and preparation method thereof, and cable Download PDFInfo
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- CN111926569A CN111926569A CN202010682303.1A CN202010682303A CN111926569A CN 111926569 A CN111926569 A CN 111926569A CN 202010682303 A CN202010682303 A CN 202010682303A CN 111926569 A CN111926569 A CN 111926569A
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- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
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Abstract
The invention provides a semiconductive adhesive and a preparation method thereof, semiconductive fiber, a semiconductive copper wire shielding tape, a preparation method thereof and a cable. A semiconductive adhesive comprising: 10-100 parts of aqueous textile emulsion, 5-70 parts of carbon material, 0.1-5 parts of dispersant, 0.1-5 parts of thickener, 0.1-5 parts of wetting agent and 0.1-10 parts of auxiliary agent. The preparation method of the semi-conductive adhesive comprises the following steps: mixing the raw materials of the semi-conductive adhesive. The semiconductive fiber comprises base material fiber and a coating arranged on the surface of the base material fiber, wherein the coating comprises semiconductive glue. The semiconductive copper wire shielding tape comprises semiconductive fibers. The semiconductive copper wire shielding tape comprises a tape and a semiconductive adhesive layer arranged on the surface and in the gap of the tape. The preparation method of the semiconductive copper wire shielding tape comprises the following steps: the semiconductive glue is applied to the surface and in the interstices of the tape. A cable includes a semiconductive copper wire shielding tape. The application provides a semi-conductive glue can effectively solve the cable corrosion problem.
Description
Technical Field
The invention relates to the field of cables, in particular to a semiconductive adhesive and a preparation method thereof, semiconductive fiber, a semiconductive copper wire shielding tape and a preparation method thereof, and a cable.
Background
The buffer layer between the high-voltage and ultrahigh-voltage crosslinked cable metal sheath and the cable core is an important component of the cable and has important influence on the mechanical and thermal properties of the cable. The cable can absorb the thermal expansion of the cable insulating layer, effectively buffer the mechanical stress when the cable is bent and thermally expanded, prevent the metal sheath from damaging the insulation, strengthen the heat dissipation performance of the cable, effectively prevent the cable from entering water when the protective layer and the metal sleeve are damaged, and maintain the stable operation of the cable within a certain time. The problems are solved by adopting a semi-conductive water-blocking tape and a semi-conductive buffering water-blocking tape. In the prior art, a semi-conductive copper wire shielding belt is used as a buffer layer, and the effect is very good.
When the semi-conductive copper wire shielding belt is produced, due to the moisture in the production environment, the braided semi-conductive copper wire shielding belt is actually in contact with water in the air before the semi-conductive adhesive is coated on the semi-conductive copper wire shielding belt, so that metal wires, particularly copper wires, in the braided belt are gradually corroded in the using process, and the original effect of the braided belt is gradually lost.
In view of this, the present application is specifically made.
Disclosure of Invention
The invention aims to provide a semiconductive adhesive and a preparation method thereof, a semiconductive fiber, a semiconductive copper wire shielding tape and a preparation method thereof, and a cable, so as to solve the problems.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the semiconductive adhesive comprises the following raw materials in parts by weight: 10-100 parts of aqueous textile emulsion, 5-70 parts of carbon material, 0.1-5 parts of dispersant, 0.1-5 parts of thickener, 0.1-5 parts of wetting agent and 0.1-10 parts of auxiliary agent;
the thickening agent comprises one or more of inorganic thickening agent, cellulose thickening agent, fatty alcohol thickening agent, fatty acid thickening agent, ether thickening agent, polyacrylate thickening agent and associated polyurethane thickening agent;
the auxiliary agent comprises one or more of dodecyl diphenyl ether sodium disulfonate, polyacrylamide, nano montmorillonite, benzotriazole, methyl benzotriazole, mercapto benzothiazole sodium salt, alkanolamide, polyoxyethylene fatty amide, amino polysiloxane and quaternary ammonium salt.
The assistant is matched with the thickening agent, and the assistant plays a role in delaying corrosion and prolonging the service life by passivating the metal surface or forming a deposition film on the metal surface.
Optionally, the raw material of the semi-conductive adhesive is calculated according to parts by weight, and the water-based textile emulsion can be any value between 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts and 10-100 parts; the carbon material may be any of 5 parts, 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, and 5 to 70 parts; the dispersant may be any value between 0.1 parts, 0.5 parts, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, and 0.1-5 parts; the thickener can be any value between 0.1 parts, 0.5 parts, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, and 0.1-5 parts; the wetting agent can be any value between 0.1 parts, 0.5 parts, 1 part, 2 parts, 3 parts, 4 parts, 5 parts and 0.1-5 parts; the auxiliary may be any of 0.1 part, 0.5 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, and 0.1 to 10 parts.
Preferably, the thickener comprises one or more of fumed silica, sodium bentonite, methyl cellulose, sodium carboxymethyl cellulose, starch, gelatin, polyacrylamide, polyvinyl alcohol, polyvinylpyrrolidone, polyethylene oxide and sodium polyacrylate;
optionally, the thickener may also include one or more of organic bentonite, diatomaceous earth, attapulgite, molecular sieve, silica gel, hydroxypropyl methylcellulose, hydroxyethyl cellulose, agar, xanthan gum;
preferably, the auxiliary agent comprises one or more of benzotriazole, methyl benzotriazole and sodium mercaptobenzothiazole.
Benzotriazole, tolyltriazole and sodium mercaptobenzothiazole have the best effect.
Preferably, the aqueous textile emulsion comprises one or more of pure acrylic and modified emulsion thereof, vinyl acetate acrylic and modified emulsion thereof, styrene acrylic and modified emulsion thereof, polyurethane emulsion, PVB emulsion, PVC emulsion and polyvinyl alcohol;
preferably, the carbon material comprises one or more of pigment carbon black, acetylene carbon black, superconducting carbon black and carbon nanotubes;
preferably, the dispersing agent comprises one or more of glyceryl stearate, peregal O-15, peregal O-25, liquid paraffin, microcrystalline paraffin and polyethylene wax;
preferably, the wetting agent comprises one or more of polyoxyethylene octylphenol ether, sodium diisooctyl sulfosuccinate, span, tween, alkyl sulfate, sulfonate, fatty acid ester sulfate, carboxylic acid soap, phosphate, polyoxyethylene fatty alcohol ether and polyoxyethylene polyoxypropylene block copolymer.
The preparation method of the semi-conductive adhesive comprises the following steps:
and mixing the raw materials of the semi-conductive adhesive to obtain the semi-conductive adhesive.
A semiconductive fiber comprising a base fiber and a coating disposed on a surface of the base fiber, the coating comprising the semiconductive glue;
preferably, the substrate fiber comprises one or more of nylon, terylene, polyester cotton, viscose, cotton fiber, vinylon, carbon fiber and aramid fiber.
A semiconductive copper wire shielding tape comprises the semiconductive fiber;
preferably, the semiconductive copper wire shielding tape is woven by the semiconductive fibers and the metal fibers.
The semiconductive copper wire shielding tape comprises a tape and a semiconductive adhesive layer arranged on the surface and in the gaps of the tape;
the semi-conductive glue layer comprises the semi-conductive glue.
Preferably, the strip material is woven from a warp material and a weft material;
the warp material and the weft material respectively and independently comprise metal fibers and nonmetal fibers;
preferably, the metal fibers comprise one or more of bare copper metal wires, copper tinned metal wires, copper galvanized metal wires, copper chromed metal wires, and copper nickel plated metal wires;
preferably, the non-metal fiber comprises one or more of nylon, terylene, polyester cotton, viscose, cotton fiber, vinylon, carbon fiber and aramid fiber;
preferably, the interstices formed by the warp material and the weft material are rectangular or parallelogram-shaped;
preferably, the areas of the plurality of voids are equal or unequal.
The warp material and the weft material may be metal fibers, the weft material may be nonmetal fibers, the warp material may be nonmetal fibers, the weft material may be metal fibers, and both the warp material and the weft material may include metal fibers and nonmetal fibers. Further, the "voids are rectangular or parallelogram shaped" as referred to herein, like plain or twill in the textile, i.e., the included angle between the warp and weft materials is either right or non-right.
The preparation method of the semiconductive copper wire shielding tape comprises the following steps:
applying the semi-conductive adhesive on the surface and in the gaps of the strip material, and drying;
preferably, the applying mode comprises any one of rolling, dipping, coating and spraying;
preferably, the strip is processed at a speed of 8-55 m/min;
preferably, the temperature of the drying is 90-200 ℃.
Alternatively, the processing speed of the strip may be any value between 8, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 8-55 meters/minute; the drying temperature may be any one of 90 deg.C, 100 deg.C, 110 deg.C, 120 deg.C, 130 deg.C, 140 deg.C, 150 deg.C, 160 deg.C, 170 deg.C, 180 deg.C, 190 deg.C, 200 deg.C and 90-200 deg.C.
A cable comprises the semiconductive copper wire shielding tape.
Compared with the prior art, the invention has the beneficial effects that:
according to the semiconductive adhesive provided by the application, the auxiliary agent is added into the semiconductive adhesive, and the auxiliary agent passivates the metal surface or forms a deposited film on the metal surface, so that the corrosion phenomenon of a metal wire is delayed, and the service life of a semiconductive copper wire shielding belt is prolonged; the thickening agent is used, so that the surface tension of the semi-conductive glue solution can be improved, and the thickening agent, the aqueous textile emulsion, the carbon material, the dispersing agent, the wetting agent and the auxiliary agent are used together to obtain good film-forming performance, ensure the uniformity of the distribution of the semi-conductive glue on the strip and avoid the local corrosion phenomenon;
the semi-conductive copper wire shielding belt provided by the application has long service life; the cable can absorb the thermal expansion of the cable insulation layer, effectively buffer the mechanical stress when the cable is bent and thermally expanded, prevent the metal sheath from damaging the insulation, strengthen the heat dissipation performance of the cable, effectively prevent the cable from entering water when the sheath and the metal sleeve are damaged, and maintain the stable operation of the cable within a certain time;
the preparation method of the semiconductive copper wire shielding tape is simple in process, and the prepared semiconductive copper wire shielding tape is stable in performance;
the cable that this application provided, the performance is excellent, long service life, the operation is stable.
Detailed Description
The terms as used herein:
"prepared from … …" is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of … …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of … …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when the range "1 ~ 5" is disclosed, the ranges described should be construed to include the ranges "1 ~ 4", "1 ~ 3", "1 ~ 2 and 4 ~ 5", "1 ~ 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
In these examples, the parts and percentages are by mass unless otherwise indicated.
"part by mass" means a basic unit of measure indicating a mass ratio of a plurality of components, and 1 part may represent any unit mass, for example, 1g or 2.689 g. If we say that the part by mass of the component A is a part by mass and the part by mass of the component B is B part by mass, the ratio of the part by mass of the component A to the part by mass of the component B is a: b. alternatively, the mass of the A component is aK and the mass of the B component is bK (K is an arbitrary number, and represents a multiple factor). It is unmistakable that, unlike the parts by mass, the sum of the parts by mass of all the components is not limited to 100 parts.
"and/or" is used to indicate that one or both of the illustrated conditions may occur, e.g., a and/or B includes (a and B) and (a or B).
Embodiments of the present invention will be described in detail below with reference to specific examples, but those skilled in the art will appreciate that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
The embodiment provides a semiconductive adhesive, which comprises the following components in parts by weight: 10 parts of pure acrylic emulsion, 70 parts of acetylene black, 0.1 part of glyceryl stearate, 5 parts of sodium bentonite, 5 parts of octylphenol polyoxyethylene ether and 10 parts of benzotriazole.
And uniformly mixing the components to obtain the semiconductive glue solution.
The embodiment also provides a semiconductive fiber, which comprises a material fiber and a coating layer arranged on the surface of the base material fiber; wherein the base material fiber is nylon.
The semiconductive fiber is obtained by impregnating the semiconductive glue solution with nylon fiber and then drying.
And weaving the semiconductive fibers as warps and the bare copper metal wires as wefts to obtain the semiconductive copper wire shielding belt.
And manufacturing the semi-conductive copper wire shielding tape to obtain the cable.
Example 2
The embodiment provides a semiconductive adhesive, which comprises the following components in parts by weight: 100 parts of polyurethane emulsion, 5 parts of carbon nano tube, 5 parts of peregal O-15, 0.1 part of sodium carboxymethyl cellulose, 0.1 part of tween 80 and 0.1 part of tolyltriazole.
And uniformly mixing the components to obtain the semi-conductive adhesive.
The embodiment also provides a semiconductive copper wire shielding tape, which comprises a tape and a semiconductive adhesive layer arranged on the surface and in the gap of the tape, wherein the semiconductive adhesive layer comprises the semiconductive adhesive. The preparation method comprises the following steps:
the copper tinned metal wires and the cotton fiber strips are simultaneously used as warps and wefts and are woven in an equidistant spacing mode to obtain strips, and the included angles between the warps and the wefts are 90 degrees, so that the areas of gaps between the warps and the wefts are equal; and applying the semi-conductive adhesive to the strip in a coating mode, so that the semi-conductive adhesive is coated on the surfaces of the warps and the wefts and in gaps formed by the warps and the wefts, and then drying at 90 ℃ to obtain the semi-conductive copper wire shielding belt.
And manufacturing the semi-conductive copper wire shielding tape to obtain the cable.
Example 3
The embodiment provides a semiconductive adhesive, which comprises the following components in parts by weight: 50 parts of PVC emulsion, 50 parts of superconducting carbon black, 2 parts of liquid paraffin, 2.5 parts of polyacrylamide, 3 parts of phosphate and 5 parts of mercapto benzothiazole sodium salt.
And uniformly mixing the components to obtain the semi-conductive adhesive.
The embodiment also provides a semiconductive copper wire shielding tape, which comprises a tape and a semiconductive adhesive layer arranged on the surface and in the gap of the tape, wherein the semiconductive adhesive layer comprises the semiconductive adhesive. The preparation method comprises the following steps:
the copper nickel-plated metal wires and the carbon fiber strips are simultaneously used as warps and wefts and are woven in an unequal-distance interval mode to obtain strips, and the included angle between the warps and the wefts is 120 degrees (twill), so that the areas of a plurality of gaps between the warps and the wefts are different; and applying the semi-conductive adhesive to the strip in a spraying manner, so that the semi-conductive adhesive is coated on the surfaces of the warps and the wefts and in gaps formed by the warps and the wefts, and then drying at 200 ℃ to obtain the semi-conductive copper wire shielding belt.
And manufacturing the semi-conductive copper wire shielding tape to obtain the cable.
Example 4
The embodiment provides a semiconductive adhesive, which comprises the following components in parts by weight: 40 parts of polyvinyl alcohol, 30 parts of pigment carbon black, 1.5 parts of polyethylene wax, 3 parts of polyvinylpyrrolidone, 3.5 parts of diisooctyl succinate sodium sulfonate and 8 parts of dodecyl diphenyl ether disulfonic acid sodium.
And uniformly mixing the components to obtain the semi-conductive adhesive.
The embodiment also provides a semiconductive copper wire shielding tape, which comprises a tape and a semiconductive adhesive layer arranged on the surface and in the gap of the tape, wherein the semiconductive adhesive layer comprises the semiconductive adhesive. The preparation method comprises the following steps:
the copper galvanized metal wires and the carbon fiber strips are simultaneously used as warps and wefts and are woven in an equidistant spacing mode to obtain strips, and the included angle between the warps and the wefts is 120 degrees (twill); and applying the semi-conductive adhesive to the strip in a spraying manner, so that the semi-conductive adhesive is coated on the surfaces of the warps and the wefts and in gaps formed by the warps and the wefts, and then drying at 150 ℃ to obtain the semi-conductive copper wire shielding belt.
And manufacturing the semi-conductive copper wire shielding tape to obtain the cable.
It should be noted that the semiconductive adhesive provided by the present application, in which the aqueous textile emulsion, the carbon material, the dispersant, the thickener, the wetting agent, and the auxiliary agent are freely selected and combined from the ingredients enumerated herein, is not limited to the embodiments provided by the examples. For example: the thickener may be a combination of inorganic thickeners, cellulosic thickeners, and the like; the auxiliary agent can be sodium dodecyl diphenyl ether disulfonate, polyacrylamide combination and the like; the aqueous textile emulsion can be pure acrylic and modified emulsion thereof, a combination of vinyl acetate acrylic and modified emulsion thereof, and the like; the carbon material may be a combination of pigment carbon black, acetylene carbon black, superconducting carbon black, or the like; the dispersant can be a combination of peregal O-15, peregal O-25, polyethylene wax, etc.; wetting agents include octylphenol polyoxyethylene ether, sodium diisooctyl succinate sulfonate, span, tween, combinations of alkyl sulfates and the like.
Comparative example 1
Unlike example 1, the semiconductive paste does not contain benzotriazole.
Comparative example 2
Unlike example 2, the semiconductive paste does not contain tolytriazole and sodium carboxymethylcellulose.
The semiconductive copper wire shielding tapes obtained in examples 1 to 4 and comparative examples 1 to 2 were subjected to performance tests, and the results are shown in table 1 below:
TABLE 1 test results
The corrosion resistance test adopts the following method: placing the metal wire in a constant temperature and humidity box under the conditions of 30 ℃ and 90% humidity, taking out the metal wire after 7 days, and observing whether the metal wire is corroded.
As can be seen from table 1 above, the semiconductive copper wire shielding tape provided by the present application has excellent mechanical properties; the thickening agent and the auxiliary agent have very important promotion effect on the anti-corrosion performance.
The application provides a semi-conductive copper wire shielding area can absorb cable insulation thermal expansion, mechanical stress when effectively buffering cable bending, thermal expansion to prevent that metal sheath's damage is insulating, strengthen the heat dispersion of cable, when sheath and metal covering damage, can prevent effectively that the cable from intaking, maintain the steady operation of cable in a certain time.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. The semiconductive adhesive is characterized by comprising the following raw materials in parts by weight: 10-100 parts of aqueous textile emulsion, 5-70 parts of carbon material, 0.1-5 parts of dispersant, 0.1-5 parts of thickener, 0.1-5 parts of wetting agent and 0.1-10 parts of auxiliary agent;
the thickening agent comprises one or more of inorganic thickening agent, cellulose thickening agent, fatty alcohol thickening agent, fatty acid thickening agent, ether thickening agent, polyacrylate thickening agent and associated polyurethane thickening agent;
the auxiliary agent comprises one or more of dodecyl diphenyl ether sodium disulfonate, polyacrylamide, nano montmorillonite, benzotriazole, methyl benzotriazole, mercapto benzothiazole sodium salt, alkanolamide, polyoxyethylene fatty amide, amino polysiloxane and quaternary ammonium salt.
2. The semi-conductive adhesive of claim 1, wherein the thickener comprises one or more of fumed silica, sodium bentonite, methyl cellulose, sodium carboxymethyl cellulose, starch, gelatin, polyacrylamide, polyvinyl alcohol, polyvinylpyrrolidone, polyethylene oxide, and sodium polyacrylate;
preferably, the auxiliary agent comprises one or more of benzotriazole, methyl benzotriazole and sodium mercaptobenzothiazole.
3. The semi-conductive adhesive as claimed in claim 1 or 2, wherein the aqueous textile emulsion comprises one or more of pure acrylic and modified emulsion thereof, vinyl acetate acrylic and modified emulsion thereof, styrene acrylic and modified emulsion thereof, polyurethane emulsion, PVB emulsion, PVC emulsion, and polyvinyl alcohol;
preferably, the carbon material comprises one or more of pigment carbon black, acetylene carbon black, superconducting carbon black and carbon nanotubes;
preferably, the dispersing agent comprises one or more of glyceryl stearate, peregal O-15, peregal O-25, liquid paraffin, microcrystalline paraffin and polyethylene wax;
preferably, the wetting agent comprises one or more of polyoxyethylene octylphenol ether, sodium diisooctyl sulfosuccinate, span, tween, alkyl sulfate, sulfonate, fatty acid ester sulfate, carboxylic acid soap, phosphate, polyoxyethylene fatty alcohol ether and polyoxyethylene polyoxypropylene block copolymer.
4. A method for preparing a semiconducting glue according to any of claims 1-3, comprising:
and mixing the raw materials of the semi-conductive adhesive to obtain the semi-conductive adhesive.
5. A semiconductive fiber comprising a base fiber and a coating layer disposed on a surface of the base fiber, the coating layer comprising the semiconductive paste according to any one of claims 1 to 3;
preferably, the substrate fiber comprises one or more of nylon, terylene, polyester cotton, viscose, cotton fiber, vinylon, carbon fiber and aramid fiber.
6. A semiconductive copper wire shielding tape, comprising the semiconductive fiber according to claim 5;
preferably, the semiconductive copper wire shielding tape is woven by the semiconductive fibers and the metal fibers.
7. The semiconductive copper wire shielding tape is characterized by comprising a tape and a semiconductive adhesive layer arranged on the surface and in the gap of the tape;
the semiconductive glue layer comprising the semiconductive glue of any of claims 1-3.
8. The semiconducting copper wire shielding tape according to claim 7, wherein the tape is woven from a warp material and a weft material;
the warp material and the weft material respectively and independently comprise metal fibers and nonmetal fibers;
preferably, the metal fibers comprise one or more of bare copper metal wires, copper tinned metal wires, copper galvanized metal wires, copper chromed metal wires, and copper nickel plated metal wires;
preferably, the non-metal fiber comprises one or more of nylon, terylene, polyester cotton, viscose, cotton fiber, vinylon, carbon fiber and aramid fiber;
preferably, the interstices formed by the warp material and the weft material are rectangular or parallelogram-shaped;
preferably, the areas of the plurality of voids are equal or unequal.
9. A method for preparing the semi-conductive copper wire shielding tape of claim 7 or 8, which is characterized by comprising the following steps:
applying the semi-conductive adhesive on the surface and in the gaps of the strip material, and drying;
preferably, the applying mode comprises any one of rolling, dipping, coating and spraying;
preferably, the strip is processed at a speed of 8-55 m/min;
preferably, the temperature of the drying is 90-200 ℃.
10. An electrical cable comprising a semiconducting copper wire shielding tape according to any one of claims 6 to 8.
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| CN202010682303.1A CN111926569A (en) | 2020-07-15 | 2020-07-15 | Semi-conductive adhesive and preparation method thereof, semi-conductive fiber, semi-conductive copper wire shielding tape and preparation method thereof, and cable |
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| CN202010682303.1A CN111926569A (en) | 2020-07-15 | 2020-07-15 | Semi-conductive adhesive and preparation method thereof, semi-conductive fiber, semi-conductive copper wire shielding tape and preparation method thereof, and cable |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115478436A (en) * | 2022-09-30 | 2022-12-16 | 建滔(清远)电子材料有限公司 | Electronic grade glass fiber cloth produced by ultralow-twist glass fiber yarn |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060023A (en) * | 2007-05-11 | 2007-10-24 | 中铝洛阳铜业有限公司 | A copper-clad aluminum complex cable copper strip composition and machining process |
| CN103265835A (en) * | 2013-04-30 | 2013-08-28 | 东莞市松山湖微电子材料研发中心 | Conductive coating with high corrosion resistance and preparation method thereof |
| CN108666014A (en) * | 2018-06-20 | 2018-10-16 | 沈阳天荣电缆材料有限公司 | A kind of sea water resistance semiconductive sealing binding strap and preparation method thereof |
| CN108831625A (en) * | 2018-06-20 | 2018-11-16 | 沈阳天荣电缆材料有限公司 | A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof |
| CN110437690A (en) * | 2018-05-03 | 2019-11-12 | 陈名海 | A kind of aqueous PTC electric-heating coatings and the preparation method and application thereof |
-
2020
- 2020-07-15 CN CN202010682303.1A patent/CN111926569A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060023A (en) * | 2007-05-11 | 2007-10-24 | 中铝洛阳铜业有限公司 | A copper-clad aluminum complex cable copper strip composition and machining process |
| CN103265835A (en) * | 2013-04-30 | 2013-08-28 | 东莞市松山湖微电子材料研发中心 | Conductive coating with high corrosion resistance and preparation method thereof |
| CN110437690A (en) * | 2018-05-03 | 2019-11-12 | 陈名海 | A kind of aqueous PTC electric-heating coatings and the preparation method and application thereof |
| CN108666014A (en) * | 2018-06-20 | 2018-10-16 | 沈阳天荣电缆材料有限公司 | A kind of sea water resistance semiconductive sealing binding strap and preparation method thereof |
| CN108831625A (en) * | 2018-06-20 | 2018-11-16 | 沈阳天荣电缆材料有限公司 | A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115478436A (en) * | 2022-09-30 | 2022-12-16 | 建滔(清远)电子材料有限公司 | Electronic grade glass fiber cloth produced by ultralow-twist glass fiber yarn |
| CN115478436B (en) * | 2022-09-30 | 2023-05-30 | 建滔(清远)电子材料有限公司 | Electronic grade glass fiber cloth produced by ultra-low twist glass fiber yarn |
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