CN108831625A - A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof - Google Patents
A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof Download PDFInfo
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- CN108831625A CN108831625A CN201810639995.4A CN201810639995A CN108831625A CN 108831625 A CN108831625 A CN 108831625A CN 201810639995 A CN201810639995 A CN 201810639995A CN 108831625 A CN108831625 A CN 108831625A
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- Prior art keywords
- wire
- water resistance
- sea water
- shielding band
- fiber
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- 239000013535 sea water Substances 0.000 title claims abstract description 58
- 229910001369 Brass Inorganic materials 0.000 title claims abstract description 39
- 239000010951 brass Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000000835 fiber Substances 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 15
- 238000007598 dipping method Methods 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 13
- 239000002250 absorbent Substances 0.000 claims description 8
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000004014 plasticizer Substances 0.000 claims description 8
- 230000002745 absorbent Effects 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 6
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 3
- 229920002943 EPDM rubber Polymers 0.000 claims description 3
- 241000196324 Embryophyta Species 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 108010010803 Gelatin Proteins 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 3
- 229920004933 Terylene® Polymers 0.000 claims description 3
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 3
- 229920000159 gelatin Polymers 0.000 claims description 3
- 239000008273 gelatin Substances 0.000 claims description 3
- 235000019322 gelatine Nutrition 0.000 claims description 3
- 235000011852 gelatine desserts Nutrition 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000003456 ion exchange resin Substances 0.000 claims description 3
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 3
- -1 phthalic acid ester Chemical class 0.000 claims description 3
- 229920002401 polyacrylamide Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 235000012424 soybean oil Nutrition 0.000 claims description 3
- 239000003549 soybean oil Substances 0.000 claims description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 3
- 238000003786 synthesis reaction Methods 0.000 claims description 3
- 235000005979 Citrus limon Nutrition 0.000 claims description 2
- 244000131522 Citrus pyriformis Species 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229920006231 aramid fiber Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 2
- 230000005684 electric field Effects 0.000 abstract description 16
- 239000004615 ingredient Substances 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/021—Features relating to screening tape per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J111/00—Adhesives based on homopolymers or copolymers of chloroprene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/26—Sheathing; Armouring; Screening; Applying other protective layers by winding, braiding or longitudinal lapping
- H01B13/2606—Sheathing; Armouring; Screening; Applying other protective layers by winding, braiding or longitudinal lapping by braiding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/2806—Protection against damage caused by corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
- H01B7/2825—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable using a water impermeable sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/024—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of braided metal wire
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention provides a kind of sea water resistance semiconductive brass wire shielding bands and preparation method thereof, are related to power cable technical field.The sea water resistance semiconductive brass wire shielding band includes fiber, wire and the glue that blocks water.Wherein, fiber includes multiple spaced ribbons.Wire includes the metal strip that multiple intersections are in grid setting, and it is arranged in a crossed manner in formation shielding band substrate in fiber to intersect the multiple metal strips being arranged in grid；The glue that blocks water is compound in shielding band substrate, and block water glue for binding metal silk and fiber, wire arranged in a crossed manner crosspoint and filling wire and wire between, the gap between wire and fiber.The sea water resistance semiconductive brass wire shielding band by wire and fibrage at substrate on coating sea water resistance semiconductive block water glue-line, and the block water ingredient of glue of sea water resistance semiconductive is improved, make shielding band that there is good shielding electric field and block-water performance, while there is excellent sea water resistance energy.
Description
Technical field
The present invention relates to power cable technical field, in particular to a kind of sea water resistance semiconductive brass wire shielding band and
Preparation method.
Background technique
In operation, cable core electric current can generate powerful electric field to power cable, if there is moisture penetrates into insulating layer, form water
Branch will generate electric discharge, or even breakdown cable inside insulating layer.This just needs a kind of semiconductive material with water stop function
Material, thus the effect realized buffering electric field and prevent water from penetrating into.Again due in insulating surface and sheath contact position, it is also possible to exist
Gap causes shelf depreciation.Therefore, in surface of insulating layer plus the shielded layer of one layer of semiconductive material, to guarantee electric field radial direction
Be uniformly distributed, play the role of shield electric field, to prevent cable axial direction creeping discharge.To solve the above problems, previous way
It is the infiltration for buffering electric field using semiconductor waterstop and preventing water, electricity is shielded using semi-conductive tape or semiconductive shielding layer
, but these previous materials can only single solutions electric field buffering, block water and shielding problem, and shielding electric field and block-water effect compared with
Difference is not able to satisfy the occasion of high-efficiency shielding electric field and the requirement that blocks water.In addition, existing shielding band does not have sea water resistance energy, because
This limits power cable in marine application.
Summary of the invention
The purpose of the present invention is to provide a kind of sea water resistance semiconductive brass wire shielding band, the sea water resistance semiconductive brass wire shieldings
Band has good shielding electric field and block-water performance, is provided simultaneously with excellent sea water resistance energy.
Another object of the present invention is to provide a kind of preparation method of sea water resistance semiconductive brass wire shielding band, this preparation sides
Method simple possible, the sea water resistance semiconductive brass wire shielding band being prepared have good shielding electric field and block-water performance, together
When have excellent sea water resistance energy.
The invention is realized in this way：
A kind of sea water resistance semiconductive brass wire shielding band, including：
Fiber, fiber include multiple spaced ribbons；
Wire, wire includes multiple metal strips intersected in grid setting, and intersects multiple gold in grid setting
It is arranged in a crossed manner in formation shielding band substrate in fiber to belong to item；
Block water glue, and the glue that blocks water is compound in shielding band substrate, and the glue that blocks water is for binding metal silk and fiber, arranged in a crossed manner
Gap between the crosspoint and filling wire and wire of wire, between wire and fiber.
Further, in the preferred embodiment, multiple spaced ribbons are arranged in parallel and more
It is a intersect in grid setting metal strip in, a portion metal strip is arranged in parallel with ribbon, another part metal strip and
Ribbon is vertically arranged.
Further, in the preferred embodiment, fiber be selected from nylon, terylene, polyester-cotton blend, viscose, pure cotton and
Any one of aramid fiber.
Further, in the preferred embodiment, wire choosing group copper-plated metal silk, galvanized metal silk, chromium plating
Any one of wire and nickel-plated metal silk.
Further, in the preferred embodiment, the glue that blocks water passes through in roll compacting, dipping, coating and spraying
Any mode is compound on surface of the shielding with substrate.
A kind of preparation method of sea water resistance semiconductive brass wire shielding band, including：
Multiple ribbon intervals of fiber are arranged；
The metal strip of wire is intersected in open weave in formation shielding in spaced multiple ribbons of fiber
Band substrate；
The glue that will block water is imposed on by any mode in roll compacting, dipping, coating and spraying shields the surface with substrate
On obtain product；
By product 100~230 DEG C at a temperature of dry, sea water resistance semiconductive brass wire shielding band is obtained after arrangement.
Further, in the preferred embodiment, glue is blocked water mainly by following raw material in parts by weight
It is made：
20~50 parts of rubber, 0.5~15 part of plasticizer, 5~20 parts of superconduction carbon black, 0.5~3 part of dispersing agent, 5
~50 parts of polymer absorbent material and 1~10 part of auxiliary agent.
Further, in the preferred embodiment, rubber is selected from SBS, SEBS, butyl rubber, nitrile rubber, chlorine
One of buna, ethylene propylene diene rubber and silicon rubber, two or more；
Plasticizer is selected from epoxidized soybean oil, phthalic acid ester, tributyl citrate, trioctyl lemon acid, synthesis plant
One of ester, epoxy acetyl linolenic acid methyl esters and dioctyl adipate, two or more.
Further, in the preferred embodiment, polymer absorbent material is selected from polyacrylamide, polyacrylic acid
One of ester, polyacrylate, polyvinyl alcohol and modified fibre, two or more；
Auxiliary agent is selected from one of nano montmorillonite, ion exchange resin, organobentonite and gelatin, two kinds or more
Kind.
Further, in the preferred embodiment, the glue that will block water passes through in roll compacting, dipping, coating and spraying
Any mode impose on shielding the surface with substrate on obtain product during, processing linear velocity be 10-50 meters/
min。
The beneficial effect of above scheme：
The present invention provides a kind of sea water resistance semiconductive brass wire shielding band, which includes fibre
Dimension, wire and the glue that blocks water.Wherein, fiber includes multiple spaced ribbons.Wire includes multiple intersects in net
The metal strip of lattice setting, and intersect arranged in a crossed manner in formation shielding band substrate in fiber in multiple metal strips of grid setting；Resistance
Glue is compound in shielding band substrate, and block water glue for binding metal silk and fiber, wire arranged in a crossed manner crosspoint with
And the gap between filling wire and wire, between wire and fiber.The sea water resistance semiconductive brass wire shielding band passes through
Wire and fibrage at substrate on coating sea water resistance semiconductive block water glue-line, and block water glue to sea water resistance semiconductive
Ingredient is improved, and so that shielding band is had good shielding electric field and block-water performance, while having excellent sea water resistance energy.
The present invention also provides a kind of sea water resistance semiconductive brass wire shielding bands, by setting multiple ribbon intervals of fiber
It sets；The metal strip of wire is intersected in open weave in formation shielding tape base in spaced multiple ribbons of fiber
Material；The glue that will block water is imposed on surface of the shielding with substrate by any mode in roll compacting, dipping, coating and spraying to be obtained
Product；By product 100~230 DEG C at a temperature of dry, the method system of sea water resistance semiconductive brass wire shielding band is obtained after arrangement
It is standby to have obtained sea water resistance semiconductive brass wire shielding band.Preparation method simple possible, the sea water resistance semiconductive copper wire being prepared
Shielding band has good shielding electric field and block-water performance, is provided simultaneously with excellent sea water resistance energy.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram for the sea water resistance semiconductive brass wire shielding band that the embodiment of the present invention provides.
Icon：100- sea water resistance semiconductive brass wire shielding band；101- fiber；103- ribbon；105- wire；107- gold
Belong to item；109- blocks water glue.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.Therefore, below to the reality of the invention provided in the accompanying drawings
The detailed description for applying example is not intended to limit the range of claimed invention, but is merely representative of selected implementation of the invention
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the embodiment of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings,
Either the invention product using when the orientation or positional relationship usually put, be merely for convenience of the description present invention and simplification retouched
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and
It cannot be understood as indicating or implying relative importance.
In the description of the embodiment of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term
" setting ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be on or below second feature
Directly contacted including the first and second features, also may include the first and second features be not direct contact but by them it
Between other characterisation contact.Moreover, fisrt feature is on second feature, top and above include fisrt feature second spy
Right above sign and oblique upper, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature second feature it
Under, lower section and fisrt feature included below be directly below and diagonally below the second feature, or be merely representative of first feature horizontal height
Less than second feature.
Embodiment 1
Fig. 1 is the structural schematic diagram for the sea water resistance semiconductive brass wire shielding band 100 that the embodiment of the present invention provides, this implementation
Example provides a kind of structural schematic diagram of sea water resistance semiconductive brass wire shielding band 100, including：Fiber 101, wire 105 and
Block water glue 109.
Referring to Fig. 1, in the present embodiment, fiber 101 includes multiple spaced ribbons 103.Ribbon
103 quantity can be selected according to demand with length, and the embodiment of the present invention is without limitation.
Referring to Fig. 1, in the present embodiment, wire 105 includes multiple metal strips intersected in grid setting
107, and intersect arranged in a crossed manner in formation shielding band substrate in fiber 101 in multiple metal strips 107 of grid setting.Wherein, golden
The number for belonging to item 107 can also be selected and be adjusted according to demand, and the embodiment of the present invention is without limitation.
Referring to Fig. 1, in the present embodiment, the glue 109 that blocks water is compound in shielding band substrate, and the glue 109 that blocks water is used for
Binding metal silk 105 and fiber 101, the crosspoint of wire 105 arranged in a crossed manner and filling wire 105 and wire
Gap between 105, between wire 105 and fiber 101.The sea water resistance semiconductive brass wire shielding band 100 is by wire
105 and the substrate that is woven into of fiber 101 on coating sea water resistance semiconductive block water 109 layers of glue, and block water glue to sea water resistance semiconductive
109 ingredient is improved, and so that shielding band is had good shielding electric field and block-water performance, while having excellent sea water resistance
Performance.
In detail, referring to Fig. 1, in the present embodiment, multiple spaced ribbons 103, which are parallel to each other, to be set
It sets, and in multiple metal strips 107 intersected in grid setting, a portion metal strip 107 is arranged in parallel with ribbon 103,
Another part metal strip 107 is vertically arranged with ribbon 103.Certainly, in other embodiments of the invention, vertical and horizontal to set
The quantity for the metal strip 107 set can be adjusted and improve with width according to the length of total substrate, the embodiment of the present invention
Without limitation.
Optionally scheme, in the present embodiment, fiber 101 are selected from nylon, terylene, polyester-cotton blend, viscose, pure cotton and virtue
Any one of synthetic fibre.105 choosing group copper-plated metal silk 105 of wire, galvanized metal silk 105, chrome-plated metal silk 105 and plating nickel gold
Belong to any one of silk 105.Certainly, in other embodiments of the invention, the material of fiber 101 and wire 105 can be with
It is adjusted according to demand, the embodiment of the present invention is without limitation.
It is further preferred that in the present embodiment, the glue 109 that blocks water passes through any in roll compacting, dipping, coating and spraying
Kind mode is compound on surface of the shielding with substrate.It will be blocked water by any mode in roll compacting, dipping, coating and spraying
The compound gap that can reduce recombination site with substrate top with shielding of glue 109, improves combined strength bination, avoids the leakage of seawater.
The embodiments of the present invention also provide a kind of preparation methods of sea water resistance semiconductive brass wire shielding band 100, including：
S1：Multiple ribbons 103 of fiber 101 are spaced setting；
S2：The metal strip 107 of wire 105 is intersected in open weave in spaced multiple fibers of fiber 101
Shielding band substrate is formed in item 103；
S3：The glue 109 that will block water is imposed on by any mode in roll compacting, dipping, coating and spraying shields band substrate
Surface on obtain product；
S4：By product 100~230 DEG C at a temperature of dry, sea water resistance semiconductive brass wire shielding band is obtained after arrangement
100。
This preparation method simple possible, the sea water resistance semiconductive brass wire shielding band 100 being prepared have good screen
Electric field and block-water performance are covered, excellent sea water resistance energy is provided simultaneously with.
In detail, in the present embodiment, the glue 109 that blocks water mainly is made of following raw material in parts by weight：20 parts
Rubber, 0.5 part of plasticizer, 5 parts of superconduction carbon black, 0.5 part of dispersing agent, 5 parts of polymer absorbent material and 1 part
Auxiliary agent.The present invention is blocked water 109 layers of glue by coating sea water resistance semiconductive on the substrate that wire 105 and fiber 101 are woven into,
And the block water ingredient of glue 109 of sea water resistance semiconductive is improved, make shielding band that there is good shielding electric field and water preventing ability
Can, while there is excellent sea water resistance energy.
Wherein, rubber is selected from SBS, SEBS, butyl rubber, nitrile rubber, neoprene, ethylene propylene diene rubber and silicon rubber
One of glue, two or more；Plasticizer is selected from epoxidized soybean oil, phthalic acid ester, tributyl citrate, citric acid three
One of monooctyl ester, synthesis vegetable esters, epoxy acetyl linolenic acid methyl esters and dioctyl adipate, two or more；High score
Sub- water-absorbent material in polyacrylamide, polyacrylate, polyacrylate, polyvinyl alcohol and modified fibre 101 one
It plants, two or more；Auxiliary agent is selected from one of nano montmorillonite, ion exchange resin, organobentonite and gelatin, two kinds
Or it is a variety of.
Wherein, in the present embodiment, the glue 109 that will block water passes through any mode in roll compacting, dipping, coating and spraying
It imposes on surface of the shielding with substrate during obtaining product, the linear velocity of processing is 10 meters/min.Certainly, in the present invention
Other embodiments in, the linear velocity of processing can also be selected according to demand, and the embodiment of the present invention is without limitation.
Embodiment 2
The preparation method for present embodiments providing a kind of sea water resistance semiconductive brass wire shielding band 100 is provided with embodiment 1
The difference of method be that in this embodiment, the glue 109 that blocks water mainly is made of following raw material in parts by weight：30 parts
Rubber, 12 parts of plasticizer, 15 parts of superconduction carbon black, 1.5 parts of dispersing agent, 15 parts of polymer absorbent material and 5 parts
Auxiliary agent.
Also, the glue 109 that will block water imposes on shielding tape base by any mode in roll compacting, dipping, coating and spraying
During obtaining product on the surface of material, the linear velocity of processing is 20 meters/min.Certainly, in the other embodiment of the present invention
In, the linear velocity of processing can also be selected according to demand, and the embodiment of the present invention is without limitation.
Embodiment 3
The preparation method for present embodiments providing a kind of sea water resistance semiconductive brass wire shielding band 100 is provided with embodiment 1
The difference of method be that in this embodiment, the glue 109 that blocks water mainly is made of following raw material in parts by weight：50 parts
Rubber, 15 parts of plasticizer, 20 parts of superconduction carbon black, 3 parts of dispersing agent, 50 parts of polymer absorbent material and 10 parts
Auxiliary agent.
Also, the glue 109 that will block water imposes on shielding tape base by any mode in roll compacting, dipping, coating and spraying
During obtaining product on the surface of material, the linear velocity of processing is 50 meters/min.Certainly, in the other embodiment of the present invention
In, the linear velocity of processing can also be selected according to demand, and the embodiment of the present invention is without limitation.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of sea water resistance semiconductive brass wire shielding band, which is characterized in that including：
Fiber, the fiber include multiple spaced ribbons；
Wire, the wire includes multiple metal strips intersected in grid setting, and intersects multiple institutes in grid setting
It is arranged in a crossed manner in formation shielding band substrate in the fiber to state metal strip；
Block water glue, and the glue that blocks water is compound in the shielding band substrate, and the glue that blocks water is for bonding the wire and institute
It states between the crosspoint and the filling wire and the wire of fiber, the wire arranged in a crossed manner, the gold
Belong to the gap between silk and the fiber.
2. sea water resistance semiconductive brass wire shielding band according to claim 1, it is characterised in that：
Multiple spaced ribbons are arranged in parallel, and in multiple metal strips intersected in grid setting, wherein one
The metal strip is divided to be arranged in parallel with the ribbon, metal strip described in another part is vertically arranged with the ribbon.
3. sea water resistance semiconductive brass wire shielding band according to claim 1, it is characterised in that：
The fiber is selected from any one of nylon, terylene, polyester-cotton blend, viscose, pure cotton and aramid fiber.
4. sea water resistance semiconductive brass wire shielding band according to claim 1, it is characterised in that：
Any one of the wire choosing group copper-plated metal silk, galvanized metal silk, chrome-plated metal silk and nickel-plated metal silk.
5. the preparation method of sea water resistance semiconductive brass wire shielding band according to claim 1, it is characterised in that：
The glue that blocks water is compound in the shielding with substrate by any mode in roll compacting, dipping, coating and spraying
On surface.
6. a kind of preparation method of the sea water resistance semiconductive brass wire shielding band as described in any one of claims 1 to 5, feature
It is, including：
Multiple ribbon intervals of the fiber are arranged；
The metal strip of the wire is intersected in open weave in spaced multiple ribbons of the fiber
Form the shielding band substrate；
The glue that blocks water is imposed on into the shielding with substrate by any mode in roll compacting, dipping, coating and spraying
Product is obtained on surface；
By the product 100~230 DEG C at a temperature of dry, the sea water resistance semiconductive brass wire shielding band is obtained after arrangement.
7. the preparation method of sea water resistance semiconductive brass wire shielding band according to claim 6, which is characterized in that described to block water
Glue is mainly made of following raw material in parts by weight：
20~50 parts of rubber, 0.5~15 part of plasticizer, 5~20 parts of superconduction carbon black, 0.5~3 part of dispersing agent, 5~50
The polymer absorbent material and 1~10 part of auxiliary agent of part.
8. the preparation method of sea water resistance semiconductive brass wire shielding band according to claim 7, it is characterised in that：
The rubber is in SBS, SEBS, butyl rubber, nitrile rubber, neoprene, ethylene propylene diene rubber and silicon rubber
One kind, two or more；
The plasticizer is selected from epoxidized soybean oil, phthalic acid ester, tributyl citrate, trioctyl lemon acid, synthesis plant
One of ester, epoxy acetyl linolenic acid methyl esters and dioctyl adipate, two or more.
9. the preparation method of sea water resistance semiconductive brass wire shielding band according to claim 7, it is characterised in that：
The polymer absorbent material is selected from polyacrylamide, polyacrylate, polyacrylate, polyvinyl alcohol and modified fibre
Dimension one of, two or more；
The auxiliary agent is selected from one of nano montmorillonite, ion exchange resin, organobentonite and gelatin, two kinds or more
Kind.
10. the preparation method of sea water resistance semiconductive brass wire shielding band according to claim 6, it is characterised in that：
The glue that blocks water is imposed on into the shielding with substrate by any mode in roll compacting, dipping, coating and spraying
During obtaining product on surface, the linear velocity of processing is 10-50 meters/min.
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| CN201810639995.4A CN108831625A (en) | 2018-06-20 | 2018-06-20 | A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof |
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| CN201810639995.4A CN108831625A (en) | 2018-06-20 | 2018-06-20 | A kind of sea water resistance semiconductive brass wire shielding band and preparation method thereof |
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| CN111916259A (en) * | 2020-08-04 | 2020-11-10 | 东莞市雷兹盾电子材料有限公司 | Preparation method of super-soft conductive rubber and super-soft conductive rubber |
| CN111926569A (en) * | 2020-07-15 | 2020-11-13 | 沈阳天荣电缆材料有限公司 | Semi-conductive adhesive and preparation method thereof, semi-conductive fiber, semi-conductive copper wire shielding tape and preparation method thereof, and cable |
| CN113338048A (en) * | 2021-05-25 | 2021-09-03 | 扬州腾飞电缆电器材料有限公司 | Water-blocking expansion type semi-conductive nylon belt for ultrahigh-voltage cable and preparation method thereof |
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