CN111926360B - Stainless steel surface gold plating method - Google Patents
Stainless steel surface gold plating method Download PDFInfo
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- CN111926360B CN111926360B CN202010683963.1A CN202010683963A CN111926360B CN 111926360 B CN111926360 B CN 111926360B CN 202010683963 A CN202010683963 A CN 202010683963A CN 111926360 B CN111926360 B CN 111926360B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
Abstract
The invention relates to the technical field of materials and electrochemistry, and discloses a method for plating gold on a stainless steel surface, which solves the problems that the bonding force of a plating layer is poor, the appearance of the plating layer after the gold plating of stainless steel is poor, and the use requirement of electronic packaging welding can not be met in the prior art. The invention discloses a stainless steel surface gold plating method, which comprises the following steps: chemical degreasing, electrochemical degreasing, acid washing, film removing, nickel preplating, low-stress nickel plating, gold flash plating and gold plating. The invention has scientific design and simple operation, can effectively control the binding force, the thickness and the planeness of the plating layer, and can meet the welding requirements of tin-lead, tin-antimony and parallel sealing welding of thin-wall products.
Description
Technical Field
The invention relates to the technical field of materials and electrochemistry, in particular to a method for plating gold on a stainless steel surface.
Background
304. The temperature expansion coefficient of 321 stainless steel is close to-17 ppm (10) with the temperature expansion coefficient of the composite substrate used by the inventor-6m/c), therefore, the stainless steel is expected to become an IP core packaging shell based on the composite substrate after gold plating. In the IP core packaging structure, the welding process comprises parallel sealing welding, tin-lead welding and tin-antimony welding, and because a large number of devices such as chips and the like are highly integrated in the IP core, in order to reduce the redundant substances as much as possible, the use of soldering flux is forbidden in the welding process. Because the surface of the stainless steel material is provided with a layer of passive film, solder is not wet, and direct welding between the stainless steel enclosure frame and the cover plate and between the enclosure frame and the composite substrate cannot be realized, the surface of the stainless steel packaging shell needs to be plated with gold, so that the stainless steel packaging shell can be endowed with excellent weldability.
321. The 304 stainless steel has high contents of chromium and nickel, about 17-20% of chromium and 9-12% of nickel, and particularly a thin and compact passive film is formed on the surface after heat treatment. The conventional pretreatment mode generally adopts hydrochloric acid pickling or mixed acid such as nitric acid/ammonium bifluoride, nitric acid/sulfuric acid/hydrochloric acid, ferric trichloride/hydrochloric acid and the like, the surface passivation film is oxidized into a soluble metal oxide film by utilizing an oxidant (nitric acid and ferric trichloride) in the mixed acid, and the surface metal and the metal oxide film are completely dissolved by the corrosive agent. However, these methods generally aim at the stainless steel materials which are not subjected to heat treatment or welding to be subjected to acid pickling passivation treatment, and for electroplating and chemical plating on the surface of the stainless steel, the binding force of a plating layer cannot be ensured, even pitting corrosion and foaming of the plating layer during welding are caused, the formula reliability is poor, and the methods cannot be used for batch electroplating/chemical plating of electronic packaging shells.
Therefore, the problem to be solved by the technical personnel in the field is to provide a method for plating gold on the surface of stainless steel, the plating layer has good bonding force, and can be used for batch electroplating/chemical plating of electronic packaging shells.
Disclosure of Invention
The invention discloses a method for plating gold on a stainless steel surface, which solves the problems that the bonding force of a plating layer is poor, the appearance of the stainless steel after gold plating is poor and the use requirement of electronic packaging and welding can not be met in the prior art.
The technical scheme adopted by the invention is as follows:
the invention discloses a stainless steel surface gold plating method which is characterized by comprising the following steps: chemical degreasing, electrochemical degreasing, acid washing, film removing, nickel preplating, low-stress nickel plating, gold flash plating and gold plating.
In some embodiments of the present invention, the chemical degreasing is ultrasonic chemical degreasing, and preferably, the stainless steel material is placed in an aqueous solution of degreasing powder, and is subjected to ultrasonic oscillation at 45-75 ℃ for 10-15 min to remove oil stains remaining on the surface of the stainless steel material.
The degreasing powder is a commercially available product, and the dosage and the concentration of the degreasing powder refer to a product specification.
In some embodiments of the present invention, the electrochemical degreasing is performed by placing the stainless steel material after chemical degreasing into an electrochemical degreasing tank as an anode, and performing electrolytic degreasing;
preferably, in the electrical degreasing step, a stainless steel plate is used as a cathode as a pole.
Preferably, the temperature during electrolysis is 50-85 ℃, and the current density is 2-10A/dm2The time is 20-30 min.
In some embodiments of the invention, the electrolyte comprises: 10-25 g/L of sodium hydroxide, 20-30 g/L of sodium carbonate, 25-60 g/L of sodium phosphate and 5-25 g/L of sodium silicate.
According to the technical scheme, when the stainless steel material is used as the anode for removing oil, water is subjected to electrolytic oxidation on the surface of a part and oxygen is separated out, and bubbles generate a mechanical scouring effect on an oil film remained on the surface of the part, so that the oil film is thoroughly stripped and dissolved in electrolyte. Alkalies and auxiliaries in the electrolyte have saponification, permeation, emulsification and dispersion effects on oil stains, so that the purpose of fine oil removal before plating is achieved. The electrochemical oil removal of the invention can not cause hydrogen permeation and corrosion of parts.
In some embodiments of the invention, the pickling is to pickle the stainless steel material after electrochemical degreasing with pickling solution,
preferably, pickling is carried out for 5-10 min at room temperature;
preferably, the acid wash comprises sulfuric acid, nitric acid, and hydrochloric acid;
more preferably, the pickling solution comprises 20-50mL/L sulfuric acid, 40-60mL/L nitric acid and 40-60mL/L hydrochloric acid.
Wherein, the sulfuric acid, the nitric acid and the hydrochloric acid used for preparing the pickling solution are analytically pure.
The pickling solution is prepared by using nitric acid, sulfuric acid and hydrochloric acid, wherein the nitric acid is used as an oxidant, and the sulfuric acid and the hydrochloric acid are used as corrosive agents. The pickling process has the advantages of mild corrosion to stainless steel parts, wide process window and strong operability, and has no influence on the size precision of the parts while removing oxide skin.
In some embodiments of the invention, the membrane removal is to put the stainless steel material after acid cleaning into water, and remove the membrane by ultrasonic oscillation; preferably, the time of ultrasonic oscillation is 10-30 s, and the temperature is room temperature.
The surface of the stainless steel part after acid washing is provided with a uniform gray film layer, and the film layer can be quickly cleaned under the oscillation cavitation action of ultrasonic waves in water.
In some embodiments of the invention, when the ultrasonic chemical degreasing and the ultrasonic oscillation film removing are performed, the ultrasonic frequency is greater than or equal to 28 KHZ.
In some embodiments of the present invention, the pre-nickel plating is to plate a layer of priming thin nickel on the surface of the stainless steel material in an impact nickel plating manner after the film is removed.
Preferably, the stainless steel material after the membrane is removed is washed by deionized water and is quickly charged and put into a tank,
preferably, the content of nickel chloride in the plating solution is 260-380 g/L, and the content of hydrochloric acid is 60-130 mL/L;
preferably, the nickel plating temperature is 5-35 ℃, and the current density is 3-10A/dm2The time is 1-3 min.
The invention prevents the surface of the stainless steel from being passivated again by plating a layer of priming thin nickel on the surface of the stainless steel rapidly; thereby effectively ensuring the binding force of the subsequent plating layer.
In some embodiments of the invention, the low-stress nickel plating is to directly electroplate nickel sulfamate on a stainless steel material after nickel preplating; preferably, the stainless steel material after nickel preplating is washed by deionized water and then is directly electroplated with nickel sulfamate.
Preferably, the stainless steel material after nickel preplating is washed by deionized water and then is directly electroplated with nickel sulfamate;
preferably, the pH value of the plating solution for electroplating the nickel sulfamate is 3.5-4.5, and the plating solution comprises 300-450 g/L of nickel sulfamate, 5-15 g/L of sodium chloride and 30-45 g/L of boric acid;
preferably, the temperature for electroplating the nickel sulfamate is 45-60 ℃, and the current density is 0.5-1A/dm2The electroplating time is 10-20 min.
In some embodiments of the invention, the flash gold plating is to place the stainless steel material plated with the low-stress nickel in a flash gold plating tank, and deposit a thin gold layer while activating a nickel layer by using a sulfite flash gold plating solution and using a large current impact;
preferably, the stainless steel material plated with the low-stress nickel is washed by deionized water and then is placed in a flash gold plating tank;
preferably, the current density at flash gold plating is 0.8 to 2A/dm2The time is 0.5-1 min, and the temperature is 45-50 ℃;
preferably, the sulfite flash gold plating solution comprises 120g/L of sodium sulfite, 50-70g/L of potassium citrate and 2-5g/L of gold, and the pH value is 8-9.5.
In some embodiments of the invention, the gold plating is pulse gold plating of the stainless steel material subjected to flash gold plating by using a sulfite gold plating solution;
preferably, the current density of pulse gold plating is 0.1-0.5A/dm2The time is 10-12 min, and the temperature is 45-50 ℃;
preferably, the sulfite gold-plating solution comprises 150g/L of sodium sulfite 120-.
The invention directly carries out pulse gold plating after flash gold plating, adopts sulfite gold plating solution, does not contain cyanide, and has good dispersion capability and covering capability and high current efficiency.
Compared with the prior art, the invention has the following beneficial effects:
the invention has scientific design and simple operation, can effectively control the binding force, the thickness and the planeness of the plating layer, and can meet the welding requirements of tin-lead, tin-antimony and parallel sealing welding of thin-wall products.
The plating process of the invention is simple and convenient to operate, does not use dangerous chemicals such as strong oxidant cyanide and the like, and is environment-friendly.
The method completely plates the nickel layer and the gold layer on the surface of the stainless steel, has good bonding force, can bear the high temperature of 400 ℃, does not bubble and peel, and meets the welding requirement (the use of the soldering flux is forbidden).
The method can effectively remove the thick oxide skin on the surface of the stainless steel after the heat treatment without a sand blasting mode, thereby ensuring the flatness of the thin-wall product, such as no deformation of a step part with the thickness of 0.1mm and the flatness of 0.05, and meeting the requirements of parallel sealing and air tightness.
The method is used for welding components and substrates on the gold-plated layer obtained on the surface of the stainless steel, and a series of environmental tests such as temperature impact, vibration, damp heat, temperature cycle and the like are carried out according to the test method of GJB 150A-environmental test method for military equipment, so that the use requirements of users are met.
Drawings
Fig. 1 is a schematic structural view of a stainless steel package cover of example 1.
FIG. 2 is an effect diagram of the stainless steel package cover plate after gold plating.
FIG. 3 is a micrograph of a stainless steel package cover plate with gold plated surface.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The ultrasonic frequency in the embodiment of the invention is 28 KHZ.
The oil removing powder used in the embodiment of the invention is U-151 oil removing powder produced by Anmet chemical company Limited.
In the embodiment of the invention, the reagents and reagents are analytically pure unless specified otherwise.
Example 1
The embodiment discloses a method for performing surface gold plating on a stainless steel packaging cover plate, the structure of the stainless steel packaging cover plate is shown as figure 1, and the edge of the stainless steel packaging cover plate is of a step structure with the thickness of 0.1 mm. The specific gold plating method comprises the following steps:
s1, chemical degreasing: and (3) placing the stainless steel packaging cover plate in 40g/L degreasing powder aqueous solution, and ultrasonically oscillating for 15min at the temperature of 45 ℃.
S2, electrochemical degreasing: putting the stainless steel packaging cover plate treated by S1 into the electricityTaking the chemical oil removal tank as an anode and the stainless steel plate as a cathode, and electrolytically removing oil; the electrolysis temperature is 85 ℃, and the current density is 10A/dm2The time is 20 min.
Wherein, the electrolyte comprises the following components: 10g/L of sodium hydroxide, 20g/L of sodium carbonate, 25g/L of sodium phosphate and 5g/L of sodium silicate.
S3, acid washing: pickling the stainless steel packaging cover plate treated by the S2 for 5min by using a pickling solution at room temperature; the composition of the pickling solution is 20mL/L sulfuric acid, 40mL/L nitric acid and 40mL/L hydrochloric acid.
S4, membrane removal: the stainless steel packaging cover plate treated by the S3 is placed in water and subjected to ultrasonic oscillation for 30S to remove the film.
S5, nickel preplating: carrying out impact nickel plating on the stainless steel packaging cover plate after the film is removed, and specifically, washing the stainless steel packaging cover plate treated by S4 with deionized water and then quickly charging the stainless steel packaging cover plate into a tank;
wherein, the content of nickel chloride in the plating solution is 260g/L, and the content of hydrochloric acid is 60 mL/L;
the nickel plating temperature is 25 ℃, and the current density is 7A/dm2The time is 2 min.
S6, plating low-stress nickel: washing the stainless steel packaging cover plate treated by the S5 with deionized water, and directly electroplating nickel sulfamate;
wherein the pH value of the plating solution for electroplating the nickel sulfamate is 3.5, and the plating solution comprises 400g/L of nickel sulfamate, 10g/L of sodium chloride and 35g/L of boric acid; the temperature for electroplating the nickel sulfamate is 50 ℃, and the current density is 0.8A/dm2The electroplating time is 15 min.
S7, flash gold plating: washing the stainless steel packaging cover plate treated by the S6 with deionized water, putting the stainless steel packaging cover plate into a flash gold plating tank, and flash gold plating by adopting a sulfite flash gold plating solution, wherein the current density during flash gold plating is 1.5A/dm2The time is 0.5min, the temperature is 45 ℃,
wherein the pH value of the sulfite flash gold plating solution is 8.5, the content of sodium sulfite is 100g/L, the content of potassium citrate is 70g/L, and the content of gold is 2 g/L.
S8, gold plating: performing pulse gold plating on the stainless steel packaging cover plate treated by the S7 by adopting a sulfite gold plating solution, wherein the current density of the pulse gold plating is 0.5A/dm2The time is 10min, the temperature is 45 ℃,
wherein the pH value of the sulfite gold-plating solution is 8.5, wherein the content of sodium sulfite is 120g/L, the content of potassium citrate is 100g/L, and the content of gold is 8 g/L.
The effect graph of the stainless steel package cover plate after gold plating is shown in the attached figure 2. Observing under a 40-time magnifying glass, and finding that the surface gold layer is uniform, smooth and continuous as shown in figure 3. The lines shown in the attached figures are machined knife lines.
Examples 2 to 3
Examples 2 to 3 provide a method for surface plating a stainless steel package cover plate substantially identical to example 1, except that the contents of the respective components of the electrolyte in the electrochemical degreasing step of S2 were different, and the remaining conditions were the same.
Example 2
The electrolyte composition of the present example was: 25g/L of sodium hydroxide, 30g/L of sodium carbonate, 60g/L of sodium phosphate and 25g/L of sodium silicate.
Example 3
The electrolyte composition of the present example was: 15g/L of sodium hydroxide, 26g/L of sodium carbonate, 45g/L of sodium phosphate and 17g/L of sodium silicate.
Examples 4 to 5
Examples 4 to 5 provide methods for surface plating of a stainless steel package cover plate substantially identical to example 1, except that the contents of the components in the plating solution in the step of S5 nickel preplating are different, and the remaining conditions are the same.
Example 4
The content of nickel chloride in the plating solution is 320g/L, and the content of hydrochloric acid is 100 mL/L.
Example 5
The content of nickel chloride in the plating solution is 380g/L, and the content of hydrochloric acid is 130 mL/L.
Examples 6 to 7
Examples 6 to 7 provide methods for surface plating of a stainless steel package cover plate substantially identical to example 1, except that the contents of the components in the plating solution for plating nickel sulfamate in the step of plating low stress nickel in S6 are different, and the rest conditions are the same.
Example 6
The pH value of the plating solution for electroplating the nickel sulfamate is 4.5, and the plating solution comprises 300g/L of nickel sulfamate, 5g/L of sodium chloride and 30g/L of boric acid.
Example 7
The pH value of the plating solution for electroplating the nickel sulfamate is 4.1, and the plating solution comprises 450g/L of nickel sulfamate, 15g/L of sodium chloride and 45g/L of boric acid.
Examples 8 to 9
Examples 8-9 provided methods for surface plating a stainless steel package cover plate substantially identical to example 1, except that the contents of the components in the sulfite flash gold plating solution and the sulfite gold plating solution were different in the S7 flash gold plating step and the S8 gold plating step, and the remaining conditions were the same.
Example 8
The pH value of the sulfite flash gold plating solution is 8.0, the content of sodium sulfite is 120g/L, the content of potassium citrate is 50g/L, and the content of gold is 5 g/L.
The pH value of the sulfite gold-plating solution is 8.0, the sodium sulfite content is 150g/L, the potassium citrate content is 70g/L, and the gold content is 13 g/L.
Example 9
The pH value of the sulfite flash gold plating solution is 9.5, the content of sodium sulfite is 110g/L, the content of potassium citrate is 60g/L, and the content of gold is 4 g/L.
The pH value of the sulfite gold-plating solution is 9.5, the sodium sulfite content is 130g/L, the potassium citrate content is 85g/L, and the gold content is 10 g/L.
Examples 10 to 11
Examples 10-11 provide a method for surface plating a stainless steel package cover plate substantially identical to example 1, except that the operating conditions of the respective steps are different, and the remaining conditions are the same.
Example 10
S, carrying out ultrasonic oscillation at 1.75 ℃ for 10 min;
s2, the temperature during electrolysis is 65 ℃, and the current density is 2A/dm2The time is 30 min;
s4, ultrasonic oscillation is carried out for 10 s;
s5, the nickel plating temperature is 35 ℃, and the current density is 3A/dm2Time of 3min；
S6, electroplating nickel sulfamate at the temperature of 60 ℃ and at the current density of 1A/dm2Electroplating time is 20 min;
s7, the current density is 0.8A/dm when gold flash plating is carried out2The time is 1min, and the temperature is 50 ℃;
s8, the current density in gold plating is 0.1A/dm2The time is 12min, and the temperature is 50 ℃.
Example 11
S, carrying out ultrasonic oscillation at 1.60 ℃ for 13 min;
s2, the temperature in electrolysis is 50 ℃, and the current density is 7A/dm2The time is 25 min;
s4, ultrasonic oscillation is carried out for 20 s;
s5, the nickel plating temperature is 5 ℃, and the current density is 10A/dm2For 1 min;
s6, electroplating nickel sulfamate at 45 ℃ and 0.5A/dm of current density2Electroplating time is 10 min;
s7, the current density is 2A/dm during flash gold plating2The time is 1min, and the temperature is 50 ℃;
s8, the current density in gold plating is 0.3A/dm2The time is 10min, and the temperature is 50 ℃.
The performance test of the stainless steel packaging cover plate after gold plating by the method of the invention has the following results:
wherein the appearance of the plating layer is observed under naked eyes and a magnifying glass of 40 times.
The thickness of the coating is detected by an X-ray thickness gauge.
The method for testing the binding force of the plating layer comprises the following steps:
baking at 400 deg.C for 5min, cooling in air, scratching parallel, staggered and deep to the substrate with scalpel blade to form 1mm × 1mm square grid, brushing with copper wire, and determining the coating as qualified.
The temperature shock, vibration, damp heat and temperature cycle are tested according to the test method of GJB 150A-environmental test method for military equipment of the national military Standard.
Example 12
In this example, different compositions of pickling solutions were examined. In this example, compared with example 1, the method for plating gold on the surface of each pair of stainless steel package cover plates is different only in the composition of the pickling solution, and the rest conditions are the same. Then, the performance test was performed on each sample, and the results were as follows:
as is clear from the above table, only two kinds of acid solutions were used for the acid solutions of nos. 4, 5 and 6. Although the total hydrogen ion concentration was the same as that of number 1, the obtained gold plating effect was different from that of number 1. The acid washing solution prepared by the three acids of the sulfuric acid, the nitric acid and the hydrochloric acid has better effect of removing oxide skin than the acid washing solution prepared by two acids with the same hydrogen ion concentration.
The embodiments described above are some, but not all embodiments of the invention. The detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (24)
1. A method for plating gold on the surface of stainless steel is characterized by sequentially comprising the following steps: chemical degreasing, electrochemical degreasing, acid washing, film removing, nickel preplating, low-stress nickel plating, gold flash plating and gold plating;
the pickling is to pickle the stainless steel material after electrochemical degreasing by using a pickling solution, wherein the pickling solution comprises 20-50mL/L sulfuric acid, 40-60mL/L nitric acid and 40-60mL/L hydrochloric acid;
and the membrane removal is to place the stainless steel material after acid cleaning in water and remove the membrane through ultrasonic oscillation.
2. The method of claim 1, wherein the chemical degreasing is ultrasonic chemical degreasing.
3. The method for gold plating on the surface of stainless steel according to claim 2, wherein the chemical degreasing is to place the stainless steel material in an aqueous solution of degreasing powder, and perform ultrasonic oscillation at 45-75 ℃ for 10-15 min to remove oil stains remained on the surface of the stainless steel material.
4. The method for plating gold on the surface of stainless steel according to claim 1, wherein the electrochemical degreasing is performed by placing the stainless steel material after chemical degreasing in an electrochemical degreasing tank as an anode and performing electrolytic degreasing.
5. The method of claim 4, wherein the step of electrically degreasing comprises using the stainless steel plate as a cathode.
6. The method of claim 4, wherein the temperature during electrolysis is 50-85 ℃ and the current density is 2-10A/dm2The time is 20-30 min.
7. The method for gold plating on the surface of stainless steel according to claim 1, wherein the pickling is performed at room temperature for 5-10 min.
8. The method for plating gold on the surface of stainless steel according to claim 1, wherein the time of ultrasonic oscillation is 10-30 s.
9. The method for plating gold on the surface of stainless steel according to claim 2, wherein the ultrasonic frequency is equal to or higher than 28kHz when the ultrasonic chemical degreasing and the ultrasonic vibration are used for removing the film.
10. The method for gold-plating on the surface of stainless steel according to claim 1, wherein the nickel pre-plating is to plate a layer of priming thin nickel on the surface of the stainless steel material by using an impact nickel plating method after the film is removed.
11. The method of claim 10, wherein the stainless steel material after stripping is washed with deionized water and then rapidly charged into a bath.
12. The method of claim 11, wherein the plating solution contains nickel chloride 260-380 g/L and hydrochloric acid 60-130 mL/L.
13. The method of claim 12, wherein the plating temperature is 5-35 ℃ and the current density is 3-10A/dm2The time is 1-3 min.
14. The method for plating gold on the surface of stainless steel according to claim 1, wherein the low-stress nickel plating is to directly plate nickel sulfamate on the stainless steel material after nickel preplating.
15. The method for plating gold on the surface of stainless steel according to claim 14, wherein the stainless steel material after nickel pre-plating is washed by deionized water and then is directly plated with nickel sulfamate.
16. The method of claim 15, wherein the plating solution for electroplating nickel sulfamate has a pH of 3.5 to 4.5, and comprises 300 to 450g/L of nickel sulfamate, 5 to 15g/L of sodium chloride, and 30 to 45g/L of boric acid.
17. The method of claim 15, wherein the nickel sulfamate is electroplated at a temperature of 45-60 ℃ and a current density of 0.5-1A/dm2The electroplating time is 10-20 min.
18. The method for gold plating on the surface of stainless steel as claimed in claim 1, wherein the flash gold plating is to place the stainless steel material plated with low-stress nickel in a flash gold plating tank, and deposit a thin gold layer while activating the nickel layer by using a high-current impact by using a sulfite flash gold plating solution.
19. The method of claim 18, wherein the stainless steel material plated with the low-stress nickel is placed in a flash gold plating bath after being washed with deionized water.
20. The method of claim 19, wherein the current density at flash gold plating is 0.8-2A/dm2 The time is 0.5-1 min, and the temperature is 45-50 ℃.
21. The method as claimed in claim 19, wherein the sulfite flash gold plating solution comprises sodium sulfite 100-120g/L, potassium citrate 50-70g/L, gold 2-5g/L, and pH 8-9.5.
22. The method for gold-plating on the surface of stainless steel according to claim 18, wherein the gold-plating is performed by pulse gold-plating the flash-plated stainless steel material with a sulfite gold-plating solution.
23. The method of claim 22, wherein the gold plating on the surface of the stainless steel is performed byIn that the current density of the pulse gold plating is 0.1 to 0.5A/dm2 The time is 10-12 min, and the temperature is 45-50 ℃.
24. The method as claimed in claim 22, wherein the sulfite gold-plating solution comprises sodium sulfite 120-150g/L, potassium citrate 70-100g/L, gold 8-13g/L, and pH 8-9.5.
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| CN114164468A (en) * | 2021-11-13 | 2022-03-11 | 深圳市宏钢机械设备有限公司 | Surface treatment process for improving metal surface bonding optical device strength |
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