CN111918752A - Cover plate for drilling and drilling method using same - Google Patents
Cover plate for drilling and drilling method using same Download PDFInfo
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- CN111918752A CN111918752A CN201980022283.0A CN201980022283A CN111918752A CN 111918752 A CN111918752 A CN 111918752A CN 201980022283 A CN201980022283 A CN 201980022283A CN 111918752 A CN111918752 A CN 111918752A
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- drilling
- resin composition
- cover plate
- composition layer
- drill
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
Abstract
A drilling cover plate, comprising: the metal foil and the resin composition layer formed on at least one surface of the metal foil, wherein the shear storage modulus of the resin composition layer satisfies the relationship shown in the following formulas (i) and (ii). Delta G' of 3.0 to 1.0 … (i) 4.5X 105≤G’(56)≤100×105… (ii) (in the above formula, Δ G ═ log)10(G’(62))‑log10(G ' (56)), and G ' (56) and G ' (62) respectively represent the shear storage modulus (unit: Pa)) at 56 ℃ and 62 ℃ of the resin composition.
Description
Technical Field
The present invention relates to a drilling cover plate and a drilling method using the same.
Background
As a method for drilling a laminated board or a multilayer board used as a material for a printed circuit board, the following method is generally used: the laminate sheet is formed by stacking 1 or more laminated sheets or multilayer sheets, and placing a sheet of aluminum foil alone or a sheet of a resin composition layer formed on the surface of the aluminum foil (hereinafter, this "sheet" is referred to as a "cover sheet for drilling" in the present specification) as a backing sheet on the uppermost portion of the laminated sheet or multilayer sheet, and drilling the sheet.
In recent years, with the demand for improved reliability and increased density of printed wiring boards, high-quality drilling such as reduction in inner wall roughness and improvement in hole position accuracy during drilling are required for drilling of laminated boards or multilayer boards.
In order to meet the requirements such as reduction in the inner wall roughness and improvement in the hole position accuracy in the drilling process, for example, patent document 1 discloses a drilling cover sheet in which a water-soluble resin layer is formed on an aluminum foil on which a thermosetting resin film is formed. Patent document 2 discloses a lubricant sheet for hole opening, in which a non-halogen colorant is blended in a resin composition.
Further, a drilling cover plate using the solid lubricant is disclosed. For example, patent document 3 discloses an auxiliary plate for drilling, which is composed of a lubricating layer; a composite material comprising a nano-structured powder of tungsten disulfide or the like and an abrasion-resistant lubricating layer as a solid of a highly heat-conductive compound; and a support body. Patent document 4 discloses a drilling cover plate including a layer of a resin composition in which a water-soluble resin, a water-soluble lubricant, and carbon powder are mixed. Further, patent document 5 discloses a heat-releasing lubricating aluminum cap for piercing, which contains graphite as an inorganic filler in a composite material.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2003-136485
Patent document 2: japanese patent laid-open publication No. 2004-230470
Patent document 3: japanese patent laid-open publication No. 2007-281404
Patent document 4: japanese patent laid-open No. 2008-222762
Patent document 5: japanese patent laid-open No. 2006 and 346912
Disclosure of Invention
Problems to be solved by the invention
Thus, with the progress of semiconductor technology, the demand for higher density and improved reliability of printed circuit boards has been increasing. In mass production, the range of the drill diameter is usually 0.5mm to 0.105 mm. Specifically, there are 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, 0.25mm, 0.2mm, 0.15mm, 0.105mm and the like. Moreover, the minimum bit diameter is also gradually moving from 0.105mm to 0.075mm, and against laser drilling techniques, there is a very small fraction of 0.05mm drilling being attempted. Further, even in the case of processing a printed wiring board with drill diameters of 0.2mm and 0.15mm, the demand for improvement of the hole position accuracy is strong. Further, due to competition caused by globalization and the demand of emerging countries, productivity improvement and cost reduction are also required.
In the processing using the conventional cover plate for drilling, the frictional heat between the drill and the laminate plate or the multilayer plate melts the resin composition containing the water-soluble resin or the like around the drill, thereby exhibiting lubricity. However, in the conventional drilling cover plate, the effect of lubricity of the layer of the resin composition is not necessarily sufficient, and it is not possible to sufficiently meet the demand for improvement in hole position accuracy. That is, it is desired to develop a drilling cover plate that satisfies the requirement of higher hole position accuracy.
On the other hand, from the viewpoint of productivity improvement and cost reduction, as described above, there is a demand for a drill having excellent drill breakage resistance even when a drill having a small drill diameter is used, and for chips derived from a drilling cover plate to be less likely to adhere to the drill.
The present invention has been made in view of the above problems, and an object thereof is to provide: a cover plate for drilling which is excellent in drill breakage resistance and hole positioning accuracy even when a drill having a small drill diameter is used, and in which the entanglement of chips originating from the cover plate for drilling is small, and a drilling method using the same.
Means for solving the problems
The present inventors have made various studies to solve the above problems, and as a result, have found that: the present invention has been accomplished by adjusting the shear storage modulus of the resin composition layer to solve the above problems.
Namely, the present invention is as follows.
[1]
A drilling cover plate, comprising: a metal foil, and a resin composition layer formed on at least one surface of the metal foil,
the shear storage modulus of the resin composition layer satisfies the relationships represented by the following formulae (i) and (ii).
-3.0≤△G’≤-1.0…(i)
4.5×105≤G’(56)≤100×105…(ii)
(in the above formula,. DELTA.G' ═ log10(G’(62))-log10(G ' (56)), and G ' (56) and G ' (62) respectively represent the shear storage modulus (unit: Pa) at 56 ℃ and 62 ℃ of the resin composition. )
[2]
The drilling cover plate according to [1], wherein the resin composition layer further satisfies the relationship represented by the following formula (iii).
0.005×105≤G’(70)≤80×105…(iii)
(in the formula, G' (70) represents a shear storage modulus (unit: Pa) at 70 ℃ of the resin composition.)
[3]
The drill cover sheet according to [1] or [2], wherein the resin composition contains a water-soluble resin (A).
[4]
The drilling cover plate according to any one of [1] to [3], wherein the resin composition contains a filler (B).
[5]
The entry sheet for drilling according to [4], wherein the filler (B) is talc and/or molybdenum disulfide.
[6]
The drill cover plate according to any one of [3] to [5], wherein the water-soluble resin (A) is 1 or 2 or more selected from the group consisting of polyethylene oxide, polypropylene oxide, polybutylene glycol, polyethylene glycol, polypropylene glycol, a monoether compound of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, a polyglycerol monostearate compound, and a polyoxyethylene propylene copolymer.
[7]
The drill cover plate according to any one of [1] to [6], wherein the resin composition layer has a thickness in a range of 0.02 to 0.3 mm.
[8]
The drilling cover plate according to any one of [1] to [7], wherein the metal foil has a thickness in a range of 0.05 to 0.5 mm.
[9]
A drilling method includes the following hole forming steps: a hole is formed in a laminated plate or a multilayer plate using the lid plate for drilling according to any one of [1] to [8 ].
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, there can be provided: a cover plate for drilling which is excellent in drill breakage resistance and hole positioning accuracy even when a drill having a small drill diameter is used, and in which the entanglement of chips originating from the cover plate for drilling is small, and a drilling method using the same.
Drawings
Fig. 1 shows the results of measurement of the shear storage modulus of examples 2, 3 and 5, and comparative examples 1, 2 and 3.
Detailed Description
The mode for carrying out the present invention (hereinafter referred to as "the present embodiment") will be described in detail below, but the present invention is not limited thereto, and various modifications can be made without departing from the scope of the invention.
[ cover plate for drilling ]
The drilling cover plate (hereinafter, also simply referred to as "cover plate") of the present embodiment includes: the metal foil and the resin composition layer formed on at least one surface of the metal foil, wherein the shear storage modulus of the resin composition layer satisfies the relationship shown in the following formulas (i) and (ii).
-3.0≤△G’≤-1.0…(i)
4.5×105≤G’(56)≤100×105…(ii)
(in the above formula,. DELTA.G' ═ log10(G’(62))-log10(G ' (56)), and G ' (56) and G ' (62) respectively represent the shear storage modulus (unit: Pa) at 56 ℃ and 62 ℃ of the resin composition. )
The resin composition layer may be formed on one surface of the metal foil or on both surfaces of the metal foil. In the case of forming the resin composition layers on both sides, the compositions of the resin compositions of the layers may be the same or different.
[ resin composition layer ]
The resin composition layer in the present embodiment is a layer having a shear storage modulus satisfying the relationship shown in the above formulas (i) and (ii). The cover plate of the present embodiment is expected to exhibit functions of imparting lubricity to a portion of a workpiece which is in contact with a cutting tool during cutting, reducing improvement in resistance to breakage of a drill due to excessive load on the cutting tool, and improving hole position accuracy due to improvement in machinability, and is expected to prevent chips of the resin composition layer from being entangled with the cutting tool. The cutting process in which the cover plate functions is a dynamic process in which the resin composition layer is in contact with a blade of a drill rotating at high speed during use. In the present embodiment, the storage modulus is defined as a shear storage modulus from the viewpoint of specifying the structure that exhibits each function in such a state. In particular, when the storage modulus is rapidly decreased at an elevated temperature, the resin composition layer is in a gel state from a solid state, and the resin composition layer in the gel state is considered to be advantageous for the respective functions of the cover plate. At this time, if the temperature in the gel state is too high, a load is applied to the cutting tool before the lubricity of the cover plate is exhibited, which is considered to have an influence on the hole position accuracy and the drill breakage in the continuous machining. Even if the gel state is achieved, if the storage modulus in the gel state is high, lubricity is poor, and if the storage modulus in the gel state is too low, it is difficult to form a lubricating film, and both cases are not preferable from the viewpoint of lubricity, the burden on the cutting tool, such as breakage of the drill, and hole position accuracy. In addition, it is considered that the lower the storage modulus in the solid state, the more easily the chips of the resin composition layer are entangled with the cutting tool. However, the mechanism of action is not limited to the above-mentioned point.
Δ G 'in the formula (i) represents the common logarithm (log) of the shear storage modulus (G' (62)) at 62 ℃10(G '(62))) and the common logarithm (log) of the shear storage modulus at 56 ℃ (G' (56)))10(G '(56))) and formula (i) defines the range of Δ G'. In general, the shear storage modulus shows a tendency to decrease with increasing temperature, but formula (i) is based on log10(G' (62)) and (log)10The difference between (G' (56)) defines the tendency of the shear storage modulus to exhibit a predetermined value.
Δ G' is-3.0 to-1.0, preferably-2.8 to-1.0, more preferably-2.6 to-1.0, still more preferably-2.4 to-1.0, and particularly preferably-2.2 to-1.0. With Δ G' of-3.0 or more, the chip of the resin composition layer is further inhibited from tangling the cutting tool. Further, by setting Δ G' to-1.0 or less, the drill breakage resistance and the hole position accuracy are further improved.
The formula (ii) represents the range of G' (56). G' (56) is 4.5X 105～100×105Preferably 20X 105～100×105More preferably 30X 105～100×105More preferably 35X 105～100×105Particularly preferably 40X 105～100×105. G' (56) is 4.5X 105In the above, the chip of the resin composition layer is further inhibited from being entangled with the cutting tool. In addition, the passage G' (56) is 100X 105The drill breakage resistance and hole position accuracy are further improved as follows.
In addition, G' (62) is preferably 0.010X 105～4.4×105More preferably 0.10X 105～4.4×105More preferably 0.20X 105～4.4×105Particularly preferably 0.40X 105～4.4×105. G' (62) is 0.010X 105As described above, the chips of the resin composition layer tend to be further inhibited from being entangled in the cutting tool. In addition, the passage G' (62) is 4.4X 105The drill breakage resistance and hole position accuracy tend to be further improved.
The resin composition layer preferably further satisfies the relationship represented by the following formula (iii).
0.005×105≤G’(70)≤80×105…(iii)
(in the formula, G' (70) represents a shear storage modulus (unit: Pa) at 70 ℃ of the resin composition.)
The formula (iii) represents the range of G' (70). G' (70) is preferably 0.005X 105～80×105More preferably 0.020X 105～40×105More preferably 0.150X 105～10×105. G' (70) is 0.005X 105As described above, the chips of the resin composition layer tend to be further inhibited from being entangled in the cutting tool. In addition, the passage G' (70) is 80X 105The drill breakage resistance and hole position accuracy tend to be further improved.
The value of Δ G ' can be adjusted by controlling the values of G ' (56) and G ' (62). In addition, G ' (56), G ' (62), and G ' (70) may be adjusted according to the kind and content of the resin used, and the kind and content of the filler. For example, when the case including the filler material is compared with the case without the filler material, the shear storage modulus as a whole is improved by including the filler material. As the content of the filler increases, the shear storage modulus improves as a whole, but the rate of increase in the shear storage modulus particularly on the high temperature side tends to increase. Further, if the particle diameter is reduced without changing the content of the filler, the shear storage modulus as a whole becomes lower than that in the case of a large particle diameter, but the reduction rate tends to become higher on the high temperature side.
The shear storage modulus in the present embodiment can be measured by the method described in examples.
[ composition of resin composition layer ]
The component constituting the resin composition layer is preferably a water-soluble resin (a), and may contain a filler (B) as needed. The components are described in detail below.
(Water-soluble resin (A))
The water-soluble resin (A) may be further classified into a weight-average molecular weight of 1.0X 10 according to the difference in molecular weight5～2.0×106The weight average molecular weight of the polymer water-soluble resin (2) is 3.0X 103～7.0×104And a weight average molecular weight of 1.0X 102～2.5×103The low-molecular water-soluble resin of (4). The water-soluble polymer resin is advantageous in improving the moldability and shear storage modulus of the resin composition layer as a whole, and can contribute to improving the adhesion to the workpiece and improving the hole position accuracy. Further, the medium-molecular water-soluble resin and the low-molecular water-soluble resin can contribute to improvement of lubricity, chip-discharging property, and hole position accuracy. In the present embodiment, the term "water-soluble" refers to a property of dissolving 100g or more of water at 25 ℃ under 1 atmosphere.
The water-soluble resin (a) is not particularly limited, and examples thereof include 1 or 2 or more selected from the group consisting of polyethylene oxide, polypropylene oxide, polybutylene glycol, polyethylene glycol, polypropylene glycol, monoether compounds of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyglycerin monostearate compounds, and polyoxyethylene propylene copolymers. By using such a water-soluble resin (a), the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed.
(Polymer Water-soluble resin (a-1))
The water-soluble polymer resin (a-1) is not particularly limited, and examples thereof include polyethylene oxide and polypropylene oxide. The water-soluble polymer resin (a-1) may be used alone in 1 kind or in combination with 2 or more kinds.
The weight-average molecular weight of the water-soluble polymer resin (a-1) was 1.0X 105～2.0×106Preferably 1.0X 105～1.0×106More preferably 1.0X 105～6.0×105. The weight average molecular weight of the water-soluble polymer resin (a-1) is in the above range, and thus the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed.
The content of the water-soluble polymer resin (a-1) is preferably 3 to 15 parts by mass, more preferably 5 to 12 parts by mass, and still more preferably 7 to 10 parts by mass, based on 100 parts by mass of the total amount of the resin components in the resin composition. When the content of the water-soluble polymer resin (a-1) is within the above range, the film-forming property and the hole position accuracy of the resin composition layer tend to be further improved.
(Medium molecular Water-soluble resin (a-2))
The medium-molecular water-soluble resin (a-2) is not particularly limited, and examples thereof include glycol compounds such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyethylene monoether compounds such as polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, and polyoxyethylene octylphenyl ether; polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyglycerin monostearate compounds, polyoxyethylene propylene copolymers and the like. Among them, polybutylene glycol, polyethylene glycol, and polypropylene glycol are preferable. The medium molecular water-soluble resin (a-2) may be used alone in 1 kind or in combination of 2 or more kinds.
The weight-average molecular weight of the medium-molecular water-soluble resin (a-2) was 3.0X 103～7.0×104Preferably 3.0X 103～3.0×104More, morePreferably 3.0X 103～1.0×104. When the weight average molecular weight of the medium molecular water-soluble resin (a-2) is within the above range, the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed.
The content of the medium molecular water-soluble resin (a-2) is preferably 40 to 85 parts by mass, more preferably 55 to 85 parts by mass, and still more preferably 65 to 80 parts by mass, based on 100 parts by mass of the total amount of the resin components in the resin composition. When the content of the medium molecular water-soluble resin (a-2) is within the above range, the accuracy of the pore site tends to be further improved.
(Low-molecular Water-soluble resin (a-3))
The low-molecular water-soluble resin (a-3) is not particularly limited, and examples thereof include glycol compounds such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyethylene monoether compounds such as polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, and polyoxyethylene octylphenyl ether; polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyglycerin monostearate compounds, polyoxyethylene propylene copolymers and the like. Among them, polyoxyethylene monoether compounds, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, polyglycerin monostearate compounds, and polyoxyethylene propylene copolymers are preferable. The low-molecular water-soluble resin (a-3) may be used alone in 1 kind or in combination with 2 or more kinds.
The content of the low-molecular water-soluble resin (a-3) is preferably 3 to 25 parts by mass, more preferably 5 to 20 parts by mass, and still more preferably 10 to 20 parts by mass, based on 100 parts by mass of the total amount of the resin components in the resin composition. When the content of the low-molecular water-soluble resin (a-3) is within the above range, the lubricity and the hole position accuracy of the resin composition layer tend to be further improved.
(Filler (B))
The filler (B) is not particularly limited, and examples thereof include silica, talc, kaolin, mica, boehmite, and molybdenum compounds (molybdenum disulfide, molybdenum oxide, and zinc molybdate). Among them, talc and/or molybdenum disulfide are preferable. By using such a filler, the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed.
The median particle diameter (average particle diameter) of the filler (B) is preferably 0.3 μm or more and 10 μm or less, more preferably 0.3 μm or more and 8 μm or less, and still more preferably 0.5 μm or more and 6 μm or less. When the median particle diameter of the filler (B) is within the above range, the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed. Here, the median diameter is a particle diameter (D50) having a height of 50% in a cumulative distribution curve (number basis) of particle diameters measured by a particle diameter measuring method such as a laser diffraction method.
The content of the filler (B) is preferably 10 to 150 parts by mass, more preferably 30 to 125 parts by mass, and still more preferably 50 to 100 parts by mass, based on 100 parts by mass of the total amount of the resin components in the resin composition. When the content of the filler (B) is within the above range, the drill breakage resistance and the hole position accuracy tend to be further improved, and the entanglement tends to be suppressed.
The shape of the filler (B) is not particularly limited, and is preferably a plate shape, for example. The resistance of the plate-like filler (B) at the time of shearing becomes larger than that of the filler having a substantially spherical shape such as a silicone resin powder. Therefore, Δ G' and the like can be adjusted to the ranges of the present embodiment by setting the content of the filler (B) to the above-mentioned ranges. On the other hand, the closer the shape of the filler (B) is to a spherical shape, the smaller the resistance at the time of shearing, and the more difficult adjustment of Δ G' tends to be.
From such a viewpoint, it is preferable that the filler (B) contains tabular talc and/or molybdenum disulfide, and by setting the content of these in the above range, the drill breakage resistance tends to be further improved.
(other Components)
The resin composition layer may contain additives as needed. The type of the additive is not particularly limited, and examples thereof include surface conditioners, leveling agents, antistatic agents, emulsifiers, antifoaming agents, wax additives, coupling agents, rheology control agents, preservatives, mildewcides, antioxidants, light stabilizers, nucleating agents such as Na formate, heat stabilizers, and coloring agents.
The thickness of the resin composition layer can be appropriately selected depending on the diameter of a drill used for drilling, the configuration of a hole-forming object to be processed (for example, a printed circuit board material such as a laminated board or a multilayer board), and the like. The thickness of the resin composition layer is preferably 0.02 to 0.3mm, more preferably 0.02 to 0.2mm, and still more preferably 0.02 to 0.1 mm. When the thickness of the resin composition layer is 0.02mm or more, a more sufficient lubricating effect can be obtained, and the load on the drill can be reduced, so that breakage of the drill tends to be further suppressed. Further, since the thickness of the resin composition layer is 0.3mm or less, the resin composition tends to be prevented from being entangled with the drill.
[ Metal foil ]
The metal foil used in the drilling cover plate of the present embodiment is not particularly limited, and is preferably a metal material having high adhesion to the resin composition layer and capable of withstanding impact from a drill. The metal type of the metal foil includes, for example, aluminum from the viewpoint of availability, cost, and workability. As a material of the aluminum foil, aluminum having a purity of 95% or more is preferable. Examples of such aluminum foils include 5052, 3004, 3003, 1N30, 1N99, 1050, 1070, 1085, and 8021 defined in JIS-H4160. By using an aluminum foil having an aluminum purity of 95% or more as the metal foil, the impact by the drill and the engagement with the drill tip are alleviated, and the hole position accuracy of the machined hole can be further improved in addition to the lubricating effect of the drill by the resin composition.
The thickness of the metal foil is preferably 0.05 to 0.5mm, more preferably 0.05 to 0.3mm, and still more preferably 0.05 to 0.2 mm. When the thickness of the metal foil is 0.05mm or more, burrs of the object to be drilled (for example, a laminated plate) tend to be further suppressed during drilling. Further, when the thickness of the metal foil is 0.5mm or less, the discharge of chips generated during the drilling process tends to be easier.
The thicknesses of the respective layers constituting the drilling cover plate of the present embodiment are measured as follows. First, the cover sheet was cut in the direction of lamination of the respective layers using a CROSS-SECTION POLISHER (product name "CROSS-SECTION laser SM-09010" manufactured by japan electronics DATUM corporation) or an ultramicrotome (product number "EMUC 7" manufactured by Leica corporation). Then, the thickness of each layer of the composition, for example, the metal foil and the resin composition layer, was measured by observing the cross section of the cut and exposed cross section in a direction perpendicular to the cross section using an SEM (Scanning Electron Microscope) product number "VE-7800" manufactured by KEYENCE corporation. The thickness of 5 sites was measured for 1 visual field, and the average value thereof was defined as the thickness of each layer.
[ method for producing cover plate for drilling ]
The method for producing the drilling cover plate of the present embodiment is not particularly limited, and for example, the drilling cover plate is produced by forming a resin composition layer on at least one surface of a metal foil. The method for forming the resin composition layer on the metal foil is not particularly limited, and a known method can be used. Examples of such a method include the following methods: a solution of a resin composition in which a resin or the like is dissolved or dispersed in a solvent is applied to a metal foil by a coating method or the like, and is further dried and/or cooled and solidified.
When a solution of the resin composition is applied to the metal foil by a coating method or the like and dried to form the resin composition layer, the solvent used in the solution of the resin composition is preferably a mixed solution of water and a solvent having a boiling point lower than that of water. When a mixed solution of water and a solvent having a boiling point lower than that of water is used, it is advantageous to reduce residual bubbles in the resin composition layer. The type of the solvent having a boiling point lower than that of water is not particularly limited, and examples thereof include alcohol compounds such as ethanol, methanol, and isopropyl alcohol, and low-boiling solvents such as methyl ethyl ketone and acetone may be used. As the other solvent, a solvent obtained by mixing water or an alcohol compound with tetrahydrofuran or acetonitrile, which are partially compatible with the resin composition, can be used.
[ drilling method ]
The drilling method of the present embodiment includes the following hole forming step: holes are formed in the laminated sheet or the multilayer sheet using the above-described drilling cover sheet. The diameter of the drill used for drilling (drill diameter) is preferably 0.10mm φ or less, more preferably 0.080mm φ or less. Such a drill is thin and therefore particularly vulnerable, and also requires hole position accuracy. In contrast, by using the cover plate of the present embodiment, the drill breakage resistance, the hole position accuracy, and the effect of suppressing the chip of the resin composition layer from being entangled with the cutting tool can be more effectively exhibited. The drilling cover plate of the present embodiment can be used for drilling using a drill having a diameter of more than 0.30mm, and there is no problem.
The drilling cover plate of the present embodiment can be suitably used, for example, when drilling a printed circuit board material, more specifically, a laminated board or a multilayer board. Specifically, a cover plate for drilling may be disposed on at least the uppermost surface of a board (printed circuit board material) in which 1 or more laminated boards or multilayer boards are stacked, so that the metal foil side is in contact with the printed circuit board material, and drilling may be performed from the upper surface (resin composition layer side) of the cover plate.
Examples
Hereinafter, the effects of the examples of the present invention will be described by comparing with comparative examples which are not within the scope of the present invention.
< shear storage modulus >
The shear storage modulus of the resin composition layers in examples and comparative examples was measured by using a dynamic viscoelasticity measuring apparatus "DISCOVER HR-2" manufactured by TA Instruments Inc. The method for preparing the measurement sample is described below. The cover plate for drilling produced by the method described in example 1 was used as a measurement sample by softening the resin composition layer at 170 ℃. As a preparation method for the dynamic viscoelasticity measuring apparatus before measurement, a measurement sample was placed on a measurement table of the dynamic viscoelasticity measuring apparatus, the measurement table was heated to 170 ℃, a resin composition layer was sandwiched between a parallel plate having a diameter of 20mm attached to the dynamic viscoelasticity measuring apparatus and the measurement table until the distance between the parallel plate and the measurement table became 0.2mm, and the measurement was carried out after the temperature of the measurement table was stabilized by cooling to 30 ℃. As the measurement conditions, the measurement was performed under the following measurement conditions.
[ measurement conditions ]
Mode (2): shear mode
Temperature rise rate: 10 ℃/min
Temperature range: 30 to 150 DEG C
Frequency: 1.0Hz
Strain: 0.01 percent
[ working conditions for evaluating hole position accuracy and average number of broken holes (drill breakage resistance) ]
The drilling lids prepared in examples and comparative examples were placed on the upper surface of a copper-clad laminate (trade name: HL832NS-L, copper foil thickness 5 μm, double-sided board, manufactured by Mitsubishi gas chemical Co., Ltd.) in which 6 sheets of a copper-clad laminate (trade name: HL832NS-L, copper foil thickness 5 μm, double-sided board, manufactured by Mitsubishi gas chemical Co., Ltd.) having a thickness of 1.5mm were stacked, and a backing board (paper phenol laminate PS1160-G, manufactured by Rich corporation) was placed on the back surface (lower surface) of the lowermost board of the stacked copper-clad laminate. Then, 5 drill bits (Union Tools Co., Ltd.) having a diameter of 0.060mm were drilled under the following machining conditions until each drill bit was broken at a setting of 10000 holes for 1 drill bit.
Rotating speed: 330000rpm
Conveying speed: 2.94 m/min
Number of drilling of 1 drill: set 10000 holes
[ method of evaluating hole position accuracy ]
For the holes machined by the 1-gauge drilling machine, the deviation of the hole position on the back surface (lower surface) of the lowermost plate of the stacked copper-clad laminate from the designated coordinates was measured using a hole analyzer (model: HA-1AM, hitachi Via Mechanics, ltd.). For each 1 bit, the deviation is the calculated mean and standard deviation (σ), and the "mean +3 σ" is calculated. Then, as the hole position accuracy of the entire drilling process, the average value of the values of "average value +3 σ" for the 5 drills used was calculated, and the hole position accuracy was evaluated based on the following evaluation criteria. The equation used for calculating the hole position accuracy is as follows.
(here, n represents the number of drill bits used.)
(evaluation criteria)
5: hole position accuracy below 15 μm
4: the hole position accuracy is 15 μm or more and less than 17 μm
3: the hole position accuracy is 17 μm or more and less than 25 μm
2: the hole position accuracy is 25 μm or more and less than 35 μm
1: the hole position accuracy is more than 35 mu m
[ method of evaluating average number of fracture holes (drill fracture resistance) ]
Under the above-mentioned machining conditions, the number of times of drilling until each drill broke was counted, an average of 5 was calculated, and the drill breakage resistance was evaluated based on the obtained average (average number of broken holes) according to the following criteria.
(evaluation criteria)
5: the average number of broken holes is more than 8000
4: the average number of broken holes is 7000 to 8000
3: the average number of broken holes is 6000 or more and less than 7000
2: the average number of broken holes is more than 5000 and less than 6000
1: average number of broken holes less than 5000
[ winding ]
The drilling covers prepared in examples and comparative examples were placed on the upper surface of a copper-clad laminate (trade name: HL832NS-L, copper foil 3 μm thick, double-sided board, manufactured by Mitsubishi gas chemical Co., Ltd.) having 8 sheets of a copper-clad laminate (thickness: 0.06 mm) stacked thereon, such that the resin composition layer side thereof became the upper surface, and a backing plate (paper phenol laminate SPB-W, manufactured by Nihon Decouxe Co., Ltd.) having a thickness of 1.5mm was placed on the back surface (lower surface) of the lowermost board of the stacked copper-clad laminate. Then, 10000 holes were drilled and a total of 30000 holes were drilled in 1 drill using 3 drill bits (trade name: KMWM476EWU, Union Tools Co., Ltd.) of 0.080mm diameter under the following conditions.
Rotating speed: 280000rpm
Conveying speed: 1.4 m/min
Number of drilling of 1 drill: 10000 holes
The recovered drill was observed with a microscope having a magnification of 100 times. The diameter of the portion of the resin composition layer where the chips were entangled with the drill was determined to be the largest in the drill diameter direction (hereinafter, "the maximum diameter of entanglement of the machining chips"), and the entanglement was evaluated based on the following criteria.
(evaluation criteria)
3: the maximum diameter of the winding of the resin composition layer is less than 1.2 times the diameter of the drill
2: the maximum diameter of the winding of the resin composition layer is more than 1.2 times and less than 2.0 times of the drill diameter
1: the maximum diameter of the winding of the resin composition layer is more than 2.0 times of the diameter of the drill
< raw Material >
Table 1 shows the raw materials used for producing the drilling cover plates of the examples and comparative examples.
[ Table 1]
[ example 1]
8 parts by mass of polyethylene oxide (manufactured by Ming chemical industries, Ltd., Alkox E-45) having a weight average molecular weight of 560000 as the high-molecular water-soluble resin (a-1), 77 parts by mass of polyethylene glycol (manufactured by Sanyo chemical industries, Ltd., PEG4000S) having a weight average molecular weight of 3300 as the medium-molecular water-soluble resin (a-2), and 15 parts by mass of polyethylene glycol monostearate (manufactured by Nichikoku corporation, NONION S15.4) having a weight average molecular weight of 1540 as the low-molecular water-soluble resin (a-3) were dissolved in the water/methanol mixed solvent so that the solid content concentration of the resin composition solution became 30%. The mixing ratio of the water/methanol mixed solvent was set to 50/50. The resin composition solution was applied to one surface of an aluminum foil (aluminum foil: JIS-A1100H, thickness 0.07mm, manufactured by Mitsubishi aluminum corporation) by a bar coater so that the thickness of the dried resin composition layer became 50 μm, dried at 90 ℃ for 5 minutes in a dryer, and cooled to room temperature to prepare a drilling cover plate.
< examples 2 to 6, comparative examples 1 to 4 >
A drilling cap plate was produced in the same manner as in example 1, except that the raw materials used were changed as shown in table 2.
The evaluation results are shown in table 2, and the measurement results of the shear storage modulus of examples 2, 3 and 5, and comparative examples 1, 2 and 3 are shown in fig. 1.
[ Table 2]
The present application is based on the japanese patent application (japanese patent application 2018-69169) filed on 30/3/2018 to the franchise of the home country, the contents of which are incorporated herein by reference.
Industrial applicability
The present invention has industrial applicability as a drilling cover plate used for drilling of laminated plates and multilayer plates. In particular, according to the present invention, compared to a conventional cover plate for drilling, the accuracy of hole positions is excellent, breakage of a drilling machine due to peeling of a metal foil and a resin composition layer is reduced, and an adhesive layer which has been conventionally required is not required, so that a cover plate for drilling excellent in economical efficiency can be provided.
Claims (9)
1. A drilling cover plate, comprising: a metal foil, and a resin composition layer formed on at least one surface of the metal foil,
the shear storage modulus of the resin composition layer satisfies the relationships represented by the following formulas (i) and (ii),
-3.0≤△G’≤-1.0…(i)
4.5×105≤G’(56)≤100×105…(ii)
wherein G ═ log ═ G-10(G’(62))-log10(G’(56) G '(56) and G' (62) respectively represent the shear storage modulus at 56 ℃ and 62 ℃ of the resin composition, and the unit is Pa.
2. The drilling cover plate according to claim 1, wherein the resin composition layer further satisfies the relationship represented by the following formula (iii),
0.005×105≤G’(70)≤80×105…(iii)
in the formula, G' (70) represents a shear storage modulus at 70 ℃ of the resin composition, and has a unit of Pa.
3. The drilling cover plate according to claim 1 or 2, wherein the resin composition contains a water-soluble resin (A).
4. The drilling cover plate according to any one of claims 1 to 3, wherein the resin composition contains a filler (B).
5. Cover plate for drilling according to claim 4, wherein the filler material (B) is talc and/or molybdenum disulphide.
6. The drilling cover sheet according to any one of claims 3 to 5, wherein the water-soluble resin (A) is 1 or 2 or more selected from the group consisting of polyethylene oxide, polypropylene oxide, polybutylene glycol, polyethylene glycol, polypropylene glycol, a monoether compound of polyoxyethylene, polyoxyethylene monostearate, polyoxyethylene sorbitan monostearate, a polyglycerin monostearate compound, and a polyoxyethylene propylene copolymer.
7. The entry sheet for drilling according to any one of claims 1 to 6, wherein the resin composition layer has a thickness in the range of 0.02 to 0.3 mm.
8. The entry sheet for drilling according to any one of claims 1 to 7, wherein the metal foil has a thickness in the range of 0.05 to 0.5 mm.
9. A drilling method includes the following hole forming steps: a method of forming a hole in a laminated sheet or a multilayer sheet by using the entry sheet for drilling according to any one of claims 1 to 8.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018069169 | 2018-03-30 | ||
| JP2018-069169 | 2018-03-30 | ||
| PCT/JP2019/004295 WO2019187670A1 (en) | 2018-03-30 | 2019-02-06 | Entry sheet for drilling, and drilling method employing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111918752A true CN111918752A (en) | 2020-11-10 |
| CN111918752B CN111918752B (en) | 2022-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980022283.0A Active CN111918752B (en) | 2018-03-30 | 2019-02-06 | Cover plate for drilling and drilling method using same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7129030B2 (en) |
| KR (1) | KR102582789B1 (en) |
| CN (1) | CN111918752B (en) |
| TW (1) | TWI772630B (en) |
| WO (1) | WO2019187670A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112851993A (en) * | 2021-01-12 | 2021-05-28 | 深圳市宏宇辉科技有限公司 | Lubricating phenolic plate |
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| TWI298007B (en) | 2006-04-03 | 2008-06-11 | Uniplus Electronics Co Ltd | Heat-dissipating accessory plate for high speed drilling |
| JP6940823B2 (en) * | 2016-05-31 | 2021-09-29 | 三菱瓦斯化学株式会社 | Entry sheet for drilling and drilling method using it |
-
2019
- 2019-02-06 JP JP2020510356A patent/JP7129030B2/en active Active
- 2019-02-06 WO PCT/JP2019/004295 patent/WO2019187670A1/en active Application Filing
- 2019-02-06 KR KR1020207025533A patent/KR102582789B1/en active IP Right Grant
- 2019-02-06 CN CN201980022283.0A patent/CN111918752B/en active Active
- 2019-03-27 TW TW108110607A patent/TWI772630B/en active
Patent Citations (7)
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|---|---|---|---|---|
| JP2003136485A (en) * | 2001-10-31 | 2003-05-14 | Mitsubishi Gas Chem Co Inc | Entry sheet for boring and drilled hole boring method |
| CN101053938A (en) * | 2006-04-11 | 2007-10-17 | 合正科技股份有限公司 | Heat radiation assistant board used for high speed drilling |
| JP2008222762A (en) * | 2007-03-09 | 2008-09-25 | Mitsubishi Gas Chem Co Inc | Entry sheet for drilling |
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| CN103552126A (en) * | 2009-06-05 | 2014-02-05 | 三菱瓦斯化学株式会社 | Cover plate for drilling |
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| CN112851993A (en) * | 2021-01-12 | 2021-05-28 | 深圳市宏宇辉科技有限公司 | Lubricating phenolic plate |
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| Publication number | Publication date |
|---|---|
| WO2019187670A1 (en) | 2019-10-03 |
| KR20200139137A (en) | 2020-12-11 |
| CN111918752B (en) | 2022-02-25 |
| JP7129030B2 (en) | 2022-09-01 |
| TWI772630B (en) | 2022-08-01 |
| JPWO2019187670A1 (en) | 2021-05-13 |
| TW201941846A (en) | 2019-11-01 |
| KR102582789B1 (en) | 2023-09-25 |
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