CN111916384B - Bonding machine alignment module and bonding machine - Google Patents
Bonding machine alignment module and bonding machine Download PDFInfo
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- CN111916384B CN111916384B CN202010827566.7A CN202010827566A CN111916384B CN 111916384 B CN111916384 B CN 111916384B CN 202010827566 A CN202010827566 A CN 202010827566A CN 111916384 B CN111916384 B CN 111916384B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The invention provides a bonding machine alignment module and a bonding machine, which can ensure that after an alignment assembly performs alignment action, the distances from a plurality of moving rods for pushing wafers to be aligned to the rotating axis of a cam are equal, reduce the advancing precision error caused by a moving driving mechanism, solve the problems of large wafer alignment error and unstable alignment precision before wafer bonding, reduce the problem of wafer breakage in the subsequent wafer thinning process, and improve the product quality and the qualification rate.
Description
Technical Field
The invention relates to a bonder alignment module and a bonder.
Background
Wafers (wafers) are carriers used in the production of integrated circuits and are known by their name round in shape and are also referred to as chips or wafers. Since the first integrated circuit emerged in 1958, silicon technology has dominated the production of integrated circuits, and silicon wafers are the basic material for manufacturing semiconductor chips.
Bonding is an important process that is indispensable in semiconductor manufacturing processes, and combines two materials (or structures). Direct wafer bonding (generally referred to as "wafer bonding" or "direct bonding") enables polished semiconductor wafers to be bonded together without the use of adhesives, and has wide application in the fields of integrated circuit fabrication, micro-electro-mechanical systems (MEMS) packaging, and multi-functional chip integration.
Before wafer bonding, the wafers need to be aligned, and a high-precision alignment module needs to be adopted in the step, so that the problem of wafer breakage in the subsequent wafer thinning process is solved.
Disclosure of Invention
The invention provides an alignment module of a bonding machine and the bonding machine, aiming at reducing the error of wafer alignment before wafer bonding.
In a first aspect, a bonder alignment module includes a support platform, a first wafer support assembly, a first wafer alignment assembly, a second wafer support assembly, a second wafer alignment assembly, and two sets of cam assemblies.
The supporting platform is horizontally arranged.
First wafer supporting component and second wafer supporting component all at least three groups, and all include lifter and lift actuating mechanism, through lift actuating mechanism drives, the lifter is passing the downthehole reciprocating motion from top to bottom of stepping down on the supporting platform.
The first wafer supporting assembly is used for supporting the placed first wafer and then placing the first wafer on the supporting platform. The second wafer supporting group is used for supporting the placed second wafer and then placing the second wafer on the supporting platform.
The cam assembly is arranged at the bottom of the supporting platform and comprises a cam, a motor and a driven piece. The profile of the cam comprises working profile curves, the number of which is consistent with the number of the first wafer alignment component groups, and the working profile curves are rotationally symmetrical around the rotating axis of the cam; the cams are driven by the motor to rotate, the two cams rotate independently, and the rotation axes are collinear and perpendicular to the horizontal direction.
The first wafer alignment assembly and the second wafer alignment assembly are at least three groups and comprise moving rods and moving driving mechanisms. The movable rod penetrates through the abdicating hole in the supporting platform and is vertically arranged, the movable driving mechanism drives the movable rod to move towards the rotating axis of the cam, and the movable rod is used for pushing the wafer to enable the circle center of the wafer to be aligned with the rotating axis of the cam.
The movable rod of the first wafer alignment assembly and the working profile curve of the cam of the first cam assembly are arranged in a one-to-one correspondence mode, the bottoms of the movable rod and the cam of the first wafer alignment assembly are abutted against the working profile curve of the cam through a driven piece, and the distance from the movable rod of the first wafer alignment assembly to the rotating shaft center of the cam is consistent after the movable rod of the first wafer alignment assembly advances through the driven piece.
The movable rod of the second wafer alignment assembly and the working profile curve of the cam of the second cam assembly are arranged in a one-to-one correspondence mode, the bottoms of the movable rod and the cam of the second wafer alignment assembly are abutted against the working profile curve of the cam through a driven piece, and the distance from the movable rod of the second wafer alignment assembly to the rotating shaft center of the cam is consistent after the movable rod of the second wafer alignment assembly advances through the driven piece.
Preferably, the movable rod of the first wafer alignment assembly and the lifting rod of the second wafer supporting assembly adopt the same rod piece, the lifting driving mechanism is arranged on the moving driving mechanism, the moving driving mechanism drives the lifting driving mechanism and the rod piece to move horizontally, and the lifting driving mechanism drives the rod piece to move up and down.
Preferably, the first wafer supporting assembly, the first wafer aligning assembly, the second wafer supporting assembly and the second wafer aligning assembly are all provided with three groups, and the working profile curve on the cam is provided with three sections.
Preferably, the three groups of first wafer supporting assemblies adopt the same lifting driving mechanism.
Preferably, the lifting driving mechanism and the moving driving mechanism both comprise stepping motors; the motor of the cam assembly is a stepping motor.
Preferably, one end of the driven piece, which abuts against the cam, is provided with a ball.
Preferably, the cam corresponding to the second wafer alignment assembly is larger than the cam corresponding to the first wafer alignment assembly.
Preferably, the lifting rods of the first wafer support assembly act in unison; the action of the lifting rod of the second wafer supporting component can be selected to be consistent or inconsistent when the lifting rod descends, the second wafer can be inclined when placed on the first wafer by adopting an inconsistent descending mode, and then the second wafer is gradually attached, so that bubbles between the two wafers can be reduced.
Preferably, the device further comprises a first wafer feeding assembly and a second wafer feeding assembly; the first wafer feeding assembly and the second wafer feeding assembly comprise feeding plates, the bottom of each feeding plate is provided with a wafer adsorption assembly, and when the wafer feeding device works, the feeding plates adsorb wafers from a wafer feeding position and then place the wafers on the supporting rods.
In a second aspect, a bonder includes a bonder alignment module of the first aspect.
The invention has the beneficial effects that:
through setting up the cam, can guarantee that the alignment subassembly is after carrying out the alignment action, its many movable rods that promote the wafer alignment equal to the distance of the rotation axle center of cam, reduce the precision error that advances that removes actuating mechanism and bring, solved that wafer alignment error is big before the wafer bonding, aim at the unstable problem of precision, reduced the problem that the follow-up wafer attenuation in-process appears the wafer and collapses the piece, improve product quality and qualification rate.
Drawings
Fig. 1 is a first front view of a bonder alignment module;
FIG. 2 is a top view one of the bonder alignment module;
FIG. 3 is a cross-sectional view one of the bonder alignment module;
fig. 4 is a second top view of the bonder alignment module (hidden support platform);
FIG. 5 is a schematic view of the first wafer alignment assembly in cooperation with the travel bar and the first cam assembly;
FIG. 6 is a simplified schematic illustration of the first wafer alignment assembly in cooperation with the travel bar and the first cam assembly;
FIG. 7 is a schematic view of the second wafer alignment assembly in cooperation with the travel bar and the second cam assembly;
FIG. 8 is a simplified structural diagram of the second wafer alignment assembly in cooperation with the travel bar and the second cam assembly;
FIG. 9 is a first schematic view of the first wafer support assembly in operation with a first wafer inserted therein;
FIG. 10 is a second schematic view of the operation of the first wafer support assembly with a first wafer inserted therein;
FIG. 11 is a first schematic view of the first wafer alignment assembly;
FIG. 12 is a second schematic view of the first wafer alignment assembly;
FIG. 13 is a schematic view of a second wafer being placed therein;
FIG. 14 is a first schematic view of the operation of the second wafer alignment assembly;
FIG. 15 is a second schematic view of the operation of the second wafer alignment assembly;
figure 16 is an operational schematic of a second wafer support assembly.
The labels in the figures are: the wafer alignment device comprises a supporting platform 1, a relief hole 11, a first wafer supporting assembly 2, a first wafer alignment assembly 3, a second wafer alignment assembly 4, a first cam assembly 51, a second cam assembly 52, a follower 53, a first wafer 6 and a second wafer 7.
Detailed Description
The invention will now be further described with reference to the accompanying drawings and detailed description.
Those not described in detail in this specification are within the skill of the art. In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The first embodiment is as follows:
referring to fig. 1 to 4, a bonder alignment module and a bonder include a support platform 1, a first wafer support assembly 2, a first wafer alignment assembly 3, a second wafer support assembly, a second wafer alignment assembly 4, and a cam assembly.
The supporting platform 1 is horizontally arranged, and a plurality of yielding holes 11 are formed in the upper portion of the supporting platform.
First wafer supporting component 2 and the equal three groups of second wafer supporting component set up in supporting platform 1 bottom, are used for supporting first wafer 6 and second wafer 7 respectively, and all include lifter and lift actuating mechanism (not drawn), through lift actuating mechanism drives, the lifter is reciprocating motion about passing in the hole of stepping down 11 on supporting platform 1.
The first wafer alignment assembly 3 and the second wafer alignment assembly 4 are three sets each, and each includes a moving rod and a moving drive mechanism (not shown). The movable rod penetrates through the abdicating hole 11 in the supporting platform 1 and is vertically arranged, the movable driving mechanism drives the movable rod to move towards the rotating axis of the cam, and the movable rod is used for pushing the wafer to enable the circle center of the wafer to be aligned with the rotating axis of the cam.
In this embodiment, for a simplified mechanism, the moving rod of the first wafer alignment assembly 3 and the lifting rod of the second wafer supporting assembly adopt the same rod, the lifting driving mechanism is disposed on the moving driving mechanism, the moving driving mechanism drives the lifting driving mechanism and the rod to move horizontally, and the lifting driving mechanism drives the rod to move up and down.
The cam assembly is arranged at the bottom of the supporting platform 1, and two groups of the cam assembly are a first cam assembly 51 corresponding to the first wafer alignment assembly 3 and a second cam assembly 52 corresponding to the second wafer alignment assembly 4 respectively, and each cam assembly comprises a cam, a motor and a driven member 53.
The cam comprises three working profile curves, and the working profile curves are rotationally symmetrical by using the rotation axis of the cam. The two cams are driven by the motor to rotate, and the two cams rotate independently, and the rotating axes are collinear and vertical to the horizontal.
Specifically, the moving rod of the first wafer alignment assembly 3 is arranged in one-to-one correspondence with the working profile curve of the cam of the first cam assembly 51, and the bottom of the moving rod abuts against the working profile curve of the cam through a follower 53, so that the distance from the moving rod of the first wafer alignment assembly 3 to the rotation axis of the cam is ensured to be consistent after the moving rod advances through the follower 53. Referring to fig. 5 and 6, the cam rotates, the follower 53 always abuts against the cam, and the movable rod of the first wafer alignment assembly 3 advances.
The moving rod of the second wafer alignment assembly 4 and the working profile curve of the cam of the second cam assembly 52 are arranged in a one-to-one correspondence manner, and the bottoms of the moving rod of the second wafer alignment assembly 4 are abutted against the working profile curve of the cam through a follower 53, so that the distance from the moving rod of the second wafer alignment assembly 4 to the rotating shaft center of the cam is ensured to be consistent after the moving rod moves forwards through the follower 53. Referring to fig. 7 and 8, the cam rotates, the follower 53 always abuts against the cam, and the travel bar of the second wafer alignment assembly 4 advances.
The bonding machine alignment module provided by the embodiment aligns the wafer by the following steps:
1. referring to fig. 9 and 10, a first wafer 6 is placed on the lift pins of the first wafer support assembly 2, and the lift pins are lowered to place the first wafer 6 on the support platform 1;
2. the first wafer alignment module 3 and the corresponding first cam module 51 are activated, when the moving rod of the first wafer alignment module 3 moves towards the axis of the cam of the first cam module 51, the cam rotates, the position of the moving rod of the first wafer alignment module 3 is from fig. 11 to fig. 12, and the position of the corresponding cam is from fig. 5 to fig. 6;
3. referring to fig. 13, the second wafer 7 is placed on the lift pins, i.e., on top of the moving pins of the first wafer alignment assembly 3;
4. when the second wafer alignment assembly 4 and the corresponding second cam assembly 52 are activated, the moving rod of the second wafer alignment assembly 4 moves toward the axis of the cam of the second cam assembly 52, the cam rotates, the position of the moving rod of the second wafer alignment assembly 4 is from fig. 12 to fig. 14, and the position of the corresponding cam is from fig. 7 to fig. 8, as also shown in fig. 15.
5. Referring to fig. 16, the lifting rod of the second wafer supporting assembly, i.e., the moving rod of the first wafer aligning assembly 3, is lowered to place the second wafer 7 on the first wafer 6, and the centers of the two wafers are coincident.
Example two:
a bonder including a bonder alignment module as described in the first embodiment.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art; the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A bonder alignment module, characterized by:
the wafer alignment device comprises a supporting platform, a first wafer supporting assembly, a first wafer alignment assembly, a second wafer supporting assembly, a second wafer alignment assembly and two groups of cam assemblies;
the supporting platform is horizontally arranged;
the first wafer supporting assembly and the second wafer supporting assembly are at least three groups and respectively comprise a lifting rod and a lifting driving mechanism, and the lifting rod is driven by the lifting driving mechanism to reciprocate up and down in a yielding hole penetrating through the supporting platform;
the cam assembly is arranged at the bottom of the supporting platform and comprises a cam, a motor and a driven piece; the profile of the cam comprises at least three working profile curves, and the working profile curves are rotationally symmetrical around the rotation axis of the cam; the cams are driven to rotate by a motor, the two cams rotate independently, and the rotating axes are collinear and vertical to the horizontal;
the first wafer alignment assembly and the second wafer alignment assembly are at least three groups and respectively comprise a moving rod and a moving driving mechanism; the movable rod penetrates through the abdicating hole in the supporting platform and is vertically arranged, and the movable rod is driven by the movable driving mechanism to move towards the rotating axis of the cam;
the movable rods of the first wafer alignment assembly are arranged in one-to-one correspondence with the working profile curve of the cam of the first cam assembly, and the bottoms of the movable rods of the first wafer alignment assembly are abutted against the working profile curve of the cam through a driven piece;
the movable rod of the second wafer alignment assembly and the working profile curve of the cam of the second cam assembly are arranged in a one-to-one correspondence mode, and the bottoms of the movable rod and the cam of the second wafer alignment assembly are abutted to the working profile curve of the cam through a driven piece.
2. The bonder alignment module of claim 1, wherein:
the movable rod of the first wafer aligning assembly and the lifting rod of the second wafer supporting assembly adopt the same rod piece, the lifting driving mechanism is arranged on the moving driving mechanism, the moving driving mechanism drives the lifting driving mechanism and the rod piece to move horizontally, and the lifting driving mechanism drives the rod piece to move up and down.
3. A bonder alignment module as claimed in claim 1 or 2, characterized in that:
the first wafer supporting assembly, the first wafer aligning assembly, the second wafer supporting assembly and the second wafer aligning assembly are all provided with three groups, and the working profile curve on the cam is provided with three sections.
4. A bonder alignment module as claimed in claim 3, characterized in that:
and the three groups of first wafer supporting assemblies adopt the same lifting driving mechanism.
5. The bonder alignment module of claim 1, wherein:
the lifting driving mechanism and the moving driving mechanism both comprise stepping motors; the motor of the cam assembly is a stepping motor.
6. The bonder alignment module of claim 1, wherein:
and one end of the driven piece, which is abutted against the cam, is provided with a ball.
7. The bonder alignment module of claim 1, wherein:
the cam corresponding to the second wafer alignment assembly is larger than the cam corresponding to the first wafer alignment assembly.
8. The bonder alignment module of claim 1, wherein:
the lifting rods of the first wafer supporting assembly act in the same direction; the actions of the lifting rod of the second wafer supporting component can be selected to be consistent or inconsistent when the lifting rod descends.
9. The bonder alignment module of claim 1, wherein:
the device also comprises a first wafer feeding assembly and a second wafer feeding assembly; the first wafer feeding assembly and the second wafer feeding assembly comprise feeding plates, and wafer adsorption assemblies are arranged at the bottoms of the feeding plates.
10. A bonder, characterized by:
a bonder alignment module including a bonder as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010827566.7A CN111916384B (en) | 2020-08-17 | 2020-08-17 | Bonding machine alignment module and bonding machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010827566.7A CN111916384B (en) | 2020-08-17 | 2020-08-17 | Bonding machine alignment module and bonding machine |
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| CN111916384A CN111916384A (en) | 2020-11-10 |
| CN111916384B true CN111916384B (en) | 2022-05-17 |
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| CN202010827566.7A Active CN111916384B (en) | 2020-08-17 | 2020-08-17 | Bonding machine alignment module and bonding machine |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI732700B (en) * | 2020-10-16 | 2021-07-01 | 天虹科技股份有限公司 | Alignment mechanism and alignment method of bonding machine |
| CN112309945A (en) * | 2020-11-11 | 2021-02-02 | 鑫天虹(厦门)科技有限公司 | Alignment mechanism and alignment method of bonding machine |
| CN117153760B (en) * | 2023-11-01 | 2024-04-12 | 迈为技术(珠海)有限公司 | Bonding sheet centering mechanism and bonding sheet centering method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988009303A1 (en) * | 1987-05-21 | 1988-12-01 | Hine Design Inc. | Method and apparatus for aligning silicon wafers |
| JP2812642B2 (en) * | 1993-07-01 | 1998-10-22 | 三菱電機株式会社 | Wafer alignment machine |
| US6270307B1 (en) * | 1999-01-25 | 2001-08-07 | Chartered Semiconductor Manufacturing Company | Method for aligning wafers in a cassette |
| JP4603209B2 (en) * | 2001-08-23 | 2010-12-22 | 株式会社アドバンテスト | Positioning and fixing device for wafer transfer |
| JP2003163258A (en) * | 2001-09-14 | 2003-06-06 | Assist Japan Kk | Aligner device of wafer |
| US8181688B2 (en) * | 2009-04-16 | 2012-05-22 | Suss Microtec Lithography, Gmbh | Apparatus for temporary wafer bonding and debonding |
| US9640418B2 (en) * | 2015-05-15 | 2017-05-02 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
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