CN111915984B - Display device - Google Patents
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- CN111915984B CN111915984B CN201910385400.1A CN201910385400A CN111915984B CN 111915984 B CN111915984 B CN 111915984B CN 201910385400 A CN201910385400 A CN 201910385400A CN 111915984 B CN111915984 B CN 111915984B
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- insulating layer
- insulating
- cutting edge
- display device
- display panel
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The embodiment of the invention discloses a display device which comprises a display panel and a flexible circuit board, wherein the display panel comprises a cutting edge and a plurality of first bonding pads, the flexible circuit board comprises a substrate, the substrate comprises a binding area and a non-binding area, the binding area is provided with a plurality of second bonding pads, the non-binding area is provided with an insulating layer, the second bonding pads are bound and connected with the first bonding pads on the display panel, the insulating layer is positioned between the substrate and the cutting edge, and the insulating layer is overlapped with the cutting edge. According to the display device provided by the embodiment of the invention, the insulating layer of the non-binding region is positioned between the substrate and the cutting edge, the insulating layer is overlapped with the cutting edge, and the plurality of second bonding pads of the binding region are isolated from the cutting edge through the insulating layer, so that the phenomenon that after the plurality of second bonding pads arranged in the binding region are bound with the plurality of first bonding pads of the display panel, the region outside the binding region is contacted with metal scraps at the cutting edge to cause a COF circuit short circuit is avoided, the problem that the display performance is influenced by the formation of a display dark line is avoided, and the display performance of the display device is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display device.
Background
As smart products and wearable devices become hot spots gradually, the demand for flexible display panels is continuously expanding. In the design of the existing flexible product, a GL (Gate line) line is arranged near a cutting edge, a binding pad On a flexible display panel is arranged On the inner side of the cutting edge, before a Chip-containing flexible circuit board (Chip On Film, COF) binding process is carried out, the redundant part of the flexible display panel needs to be cut off through Laser shaping cutting, and the existing COF binding process is to connect a pad (COF pad) On the flexible circuit board and the binding pad On the flexible display panel through an ACF (Anisotropic Conductive Film) Conductive adhesive to realize signal transmission.
After the redundant part of the existing flexible display panel is cut off by laser forming cutting, hot-melt electrons and metal chips are generated at the edge of the cutting edge, and after the flexible display panel is subjected to COF binding process, the exposed circuit outside the COF bonding pad area can be contacted with the metal chips at the cutting edge, so that the problem that the COF circuit is short-circuited to form a display dark line is easily caused, and the display performance is influenced. In the existing method, UV glue is generally coated on the connection edge of a cutting edge and a COF (chip on film) of a flexible display panel, or the flexible display panel is cleaned after laser forming and cutting, and then COF (chip on film) binding is carried out, or the process flow of laser forming and cutting is changed, so that the generation of hot melting electrons and metal chips at the cutting edge is avoided. However, the existing solution is complex in process flow, reduces production efficiency, and cannot thoroughly solve the problem that the display performance is affected by a display dark line formed by short circuit of a COF (chip on film) circuit due to the fact that the exposed circuit outside the COF bonding pad area can be contacted with metal chips at the cutting edge.
Disclosure of Invention
The embodiment of the invention provides a display device, which aims to solve the problem that after an existing flexible display panel is subjected to COF binding process, exposed circuits outside a COF bonding pad area are contacted with metal chips at a cutting edge, so that the COF circuits are easily short-circuited to form display dark lines to influence the display performance.
In order to realize the technical problem, the invention adopts the following technical scheme:
the embodiment of the invention provides a display device, which comprises a display panel and a flexible circuit board;
the display panel comprises a cutting edge and a plurality of first bonding pads;
the flexible circuit board comprises a substrate, wherein the substrate comprises a binding region and a non-binding region, the binding region is provided with a plurality of second bonding pads, and the non-binding region is provided with an insulating layer; the second bonding pad is connected with the first bonding pad on the display panel in a binding manner;
the insulating layer is located between the substrate and the cutting edge, and the insulating layer overlaps the cutting edge.
Furthermore, the second pads are arranged in at least one row, the flexible circuit board further comprises a wiring layer arranged between the insulating layer and the substrate, the wiring layer comprises a plurality of first wires, and the first wires are electrically connected with the second pads correspondingly.
Further, the insulating layer includes first insulating zone and second insulating zone, and first insulating zone is located between binding district and the second insulating zone, and first insulating zone is provided with a plurality of recesses.
Furthermore, the insulating layer includes first insulating zone and second insulating zone, and first insulating zone is located between binding district and the second insulating zone, and the rete thickness of the insulating layer of second insulating zone is greater than the rete thickness of the insulating layer of first insulating zone.
Furthermore, the insulating layer comprises a plurality of insulating parts arranged in a strip shape, and each insulating part covers at least one first routing wire; the substrate is exposed between the adjacent insulating parts.
Furthermore, the insulation parts correspond to the first wires one to one.
Further, the insulating layer is an ink layer.
Further, the distance between the vertical projection of the cutting edge on the insulating layer and the edge of the insulating layer close to the binding region ranges from 100 to 200 μm.
Further, the shortest distance between the cutting edge and the first pad ranges from 250 to 300 μm.
Further, the projection of the edge of the insulating layer close to the bonding area on the display panel is in a distance range of 100-150 μm from the first bonding pad.
The display device provided by the embodiment of the invention comprises a display panel and a flexible circuit board, wherein the display panel comprises a cutting edge and a plurality of first bonding pads, the flexible circuit board comprises a substrate, the substrate comprises a binding area and a non-binding area, the binding area is provided with a plurality of second bonding pads, the non-binding area is provided with an insulating layer, the second bonding pads are bound and connected with the first bonding pads on the display panel, the insulating layer is positioned between the substrate and the cutting edge, and the insulating layer is overlapped with the cutting edge. According to the display device provided by the embodiment of the invention, the insulating layer of the non-binding region is positioned between the substrate and the cutting edge, the insulating layer is overlapped with the cutting edge, and the plurality of second bonding pads of the binding region are isolated from the cutting edge through the insulating layer, so that the phenomenon that after the plurality of second bonding pads arranged in the binding region are bound with the plurality of first bonding pads of the display panel, the region outside the binding region is contacted with metal scraps at the cutting edge to cause a COF circuit short circuit is avoided, the problem that the display performance is influenced by the formation of a display dark line is avoided, and the display performance of the display device is improved.
Drawings
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present invention;
FIG. 2 isbase:Sub>A schematic cross-sectional view taken along A-A ofbase:Sub>A display device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another display device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a display device according to another embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view taken along line B-B of a display device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a display device according to another embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view taken along line C-C of a display device according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of another display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings, not all of them.
Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present invention. Fig. 2 isbase:Sub>A schematic cross-sectional view alongbase:Sub>A-base:Sub>A ofbase:Sub>A display device according to an embodiment of the present invention. Referring to fig. 1 and 2, a display device provided in an embodiment of the present invention includes a display panel 1 and a flexible printed circuit 2, the display panel 1 includes a cutting edge 11 and a plurality of first pads 12, the flexible printed circuit 2 includes a substrate 21, the substrate 21 includes a bonding region 22 and a non-bonding region 23, the bonding region 22 is provided with a plurality of second pads 24, the non-bonding region 23 is provided with an insulating layer 25, the second pads 24 are bonded to the first pads 12 on the display panel 1, the insulating layer 25 is located between the substrate 21 and the cutting edge 11, and the insulating layer 25 overlaps the cutting edge 11.
Specifically, in the display panel manufacturing process, the cutting edge 11 is formed by cutting off the excess portion of the display panel 1 by laser cutting, in other words, a portion of the display panel 1 is cut off along the cutting edge 11, during the cutting process, hot melting electrons and metal chips are generated at the cutting edge 11 of the display panel 1, and a portion of the hot melting electrons and metal chips are generated near the cutting edge 11. In the display device provided in the embodiment of the present invention, after the flexible printed circuit board 2 is bonded and connected to the first bonding pad 12 on the display panel 1 through the second bonding pad 24, the position where the flexible printed circuit board overlaps the cutting edge is provided with the insulating layer 25, the hot-melt electrons and the metal chips can only contact the insulating layer 25, and cannot contact the second bonding pad 24 on the flexible printed circuit board 2, in other words, the plurality of second bonding pads 24 arranged in the bonding region 22 of the flexible printed circuit board 2 of the flexible display device exceed the length of the first bonding pad 12 on the display panel 1 and exceed the cutting edge 11 of the display panel 1, the insulating layer 25 arranged in the non-bonding region 23 of the flexible printed circuit board 2 is located between the substrate 21 and the cutting edge 11, the insulating layer 25 covers or wraps the portion exceeding the second bonding pad 24 of the first bonding pad 12 on the display panel 1, and the hot-melt electrons and the metal chips generated when the cutting edge 11 of the display panel 1 are cut, and the insulating layer 25 overlaps the cutting edge 11, thereby effectively avoiding the short circuit phenomenon caused by the hot-melt electrons or the metal chips between the second bonding pads 24, and improving the display performance.
The display device provided by the embodiment of the invention comprises a display panel and a flexible circuit board, wherein the display panel comprises a cutting edge and a plurality of first bonding pads, the flexible circuit board comprises a substrate, the substrate comprises a binding area and a non-binding area, the binding area is provided with a plurality of second bonding pads, the non-binding area is provided with an insulating layer, the second bonding pads are bound and connected with the first bonding pads on the display panel, the insulating layer is positioned between the substrate and the cutting edge, and the insulating layer is overlapped with the cutting edge. According to the display device provided by the embodiment of the invention, the insulating layer of the non-binding region is positioned between the substrate and the cutting edge, the insulating layer is overlapped with the cutting edge, and the plurality of second bonding pads of the binding region are isolated from the cutting edge through the insulating layer, so that the phenomenon that after the plurality of second bonding pads arranged in the binding region are bound with the plurality of first bonding pads of the display panel, the region outside the binding region is contacted with metal scraps at the cutting edge to cause a COF circuit short circuit is avoided, the problem that the display performance is influenced by the formation of a display dark line is avoided, and the display performance of the display device is improved.
Optionally, fig. 3 is a schematic structural diagram of another display device provided in the embodiment of the present invention. Referring to fig. 3, the plurality of second pads 24 are arranged in at least one row, the flexible printed circuit board 2 further includes a routing layer 26 disposed between the insulating layer 25 and the substrate 21, the routing layer 26 includes a plurality of first traces 261, and the first traces 261 are electrically connected to the second pads 24 correspondingly.
Specifically, the second pads 24 are arranged in at least one row, which facilitates soldering and alignment, and the routing layer 26 on the flexible circuit board is disposed between the insulating layer 25 and the substrate 21, and is used for transmitting signals on the external circuit to the second pads 24 through the first routing lines 261 of the routing layer 26 on the flexible circuit board, and to the display panel 1 through the first pads 12.
Optionally, fig. 4 is a schematic structural diagram of another display device provided in the embodiment of the present invention. Referring to fig. 4, the insulation layer 25 includes a first insulation region 251 and a second insulation region 252, the first insulation region 251 being located between the bonding region 22 and the second insulation region 252, the first insulation region 251 being provided with a plurality of grooves 253.
Specifically, in the process of bending the flexible printed circuit board to the back of the display panel 1, the first insulating region 251 is provided with a plurality of grooves 253, and the thickness of the flexible printed circuit board is reduced by the portion where the grooves 253 are provided, so that the buffer stress when the flexible printed circuit board is bent is reduced. At flexible line way board and cutting edge overlapping's position, a plurality of recesses 253 that first insulating zone 251 set up conveniently hold hot melt electron and metal fillings, after buckling the flexible line way board to display panel 1's back, the first insulating zone 251 of insulating layer 25 can closely laminate with display panel 1's cutting edge 11, the recess 253 of first insulating zone 251 can hold hot melt electron or metal fillings, prevent that the hot melt electron or the metal fillings at cutting edge from removing everywhere, guarantee that hot melt electron and metal fillings can not contact second pad 24 and other circuits on the flexible line way board 2, avoid arousing the short circuit and influence the display effect.
Optionally, fig. 5 is a schematic cross-sectional view taken along B-B of a display device according to an embodiment of the present invention. Referring to fig. 5, the insulating layer 25 includes a first insulating region 251 and a second insulating region 252, the first insulating region 251 is located between the binding region 22 and the second insulating region 252, and a film thickness of the insulating layer 25 of the second insulating region 252 is greater than a film thickness of the insulating layer 25 of the first insulating region 251.
Specifically, in the process of bending the flexible printed circuit board, the film thickness of the insulating layer 25 of the first insulating region 251 is smaller than that of the insulating layer 25 of the second insulating region 252, which is beneficial to flexible bending and can prevent the insulating layer 25 of the first insulating region 251 from cracking due to bending and affecting the insulating effect. The second insulating region 252 is a flat region, and the film thickness of the insulating layer 25 of the second insulating region 252 is greater than that of the insulating layer 25 of the first insulating region 251, so that the mutual insulating property of a plurality of first wires is ensured, and the signal transmission stability of the display device is improved.
Optionally, fig. 6 is a schematic structural diagram of another display device provided in the embodiment of the present invention. Fig. 7 is a schematic cross-sectional view taken along C-C of a display device according to an embodiment of the present invention. With reference to fig. 3, 6 and 7, the insulating layer 25 includes a plurality of insulating portions 254 arranged in a stripe shape, and each insulating portion 254 covers at least one first trace 261; the substrate 21 is exposed between the adjacent insulating portions 254.
Specifically, the insulating layer 25 may be a whole layer of cover or may include a plurality of insulating portions 254, each insulating portion 254 is located in the same layer, and the insulating portions 254 cover the first traces 261, so as to prevent a short circuit phenomenon of the first traces 261 caused by hot-melt electrons or metal chips near the cut edge due to cutting of the display panel 1 between the first traces 261. Each insulating part 254 covers at least one first routing wire 261, so that each first routing wire 261 is ensured to be covered by the insulating part 254, and good display performance is ensured. The substrate 21 is exposed between the adjacent insulating parts 254, so that the insulating parts 254 are independent from each other, the stress on the insulating parts during bending is reduced on the premise of realizing insulation protection, the bending is convenient, and the insulating material is saved. Second pad 24 on the flexible line way board is bound with first pad 12 of display panel 1 and is connected the back, the flexible line way board is buckled behind display panel 1's the back, insulating layer 25 can closely laminate with display panel 1's cutting edge 11, recess 253 between the adjacent insulating part 254 can hold hot melt electron or metal fillings, prevent that the hot melt electron or the metal fillings at cutting edge from removing everywhere, arouse short circuit between the first line 261 of walking or respectively bind the short circuit between the pad, arouse and show the dark line problem, influence the display effect. It should be noted that, the substrate 21 is not shown in fig. 3 and fig. 6, fig. 6 schematically shows a case where the wiring layer 26 is covered by a plurality of insulating portions 254 arranged in a stripe shape, the wiring layer 26 in fig. 3 is not shown in fig. 6, and fig. 7 schematically shows a case where the insulating portion 254 covers the corresponding first wiring 261 on the substrate.
Optionally, with continued reference to fig. 7, the insulation 254 is in one-to-one correspondence with the first traces 261.
Specifically, each insulating part 254 covers one first routing wire 261, so that the insulating parts 254 correspond to the first routing wires 261 one by one, the space of the flexible circuit board is saved to the maximum extent, and the insulating material is saved.
Optionally, the insulating layer is an ink layer.
Specifically, the printing ink layer is used as an insulating layer, so that the insulating effect is good, the bending is convenient, and the flexible printed circuit board is suitable for the insulating layer of the flexible printed circuit board.
Optionally, fig. 8 is a schematic structural diagram of another display device provided in an embodiment of the present invention. Referring to fig. 8, the distance D1 between the perpendicular projection of the cut edge 11 on the insulating layer 25 and the edge of the insulating layer 25 near the bonding region 22 may range from 100 μm to 200 μm.
Specifically, the edge of the insulating layer 25 close to the bonding area 22 is closer to the bonding area 22 than the vertical projection of the cutting edge 11 on the insulating layer 25, because the distance between the vertical projection of the cutting edge 11 on the insulating layer 25 and the edge of the insulating layer 25 close to the bonding area 22 is set to be between 100 and 200 μm, the insulating layer 25 can cover cutting hot-melt electrons or metal chips, thereby ensuring the safe insulation between the bonding area 22 and the non-bonding area 23, ensuring the good display of the display panel 1, and avoiding the problem of poor display such as dark lines.
Optionally, with continued reference to FIG. 8, the shortest distance D2 between the cut edge 11 and the first pad 12 ranges from 250 to 300 μm.
Specifically, the overlapping of the insulating layer 25 and the cut edge 11 can be realized by shortening the distance between the insulating layer 25 and the bonding region 22 or adjusting the position of the cut edge 11 of the display panel 1 by keeping the position of the insulating layer 25 unchanged, and the shortest distance between the cut edge 11 and the first pad 12 is ensured to be 250-300 μm.
Optionally, with continued reference to fig. 8, the projection of the edge of the insulating layer 25 close to the bonding region 22 on the display panel 1 is in a range of 100 to 150 μm from the first pad 12.
Specifically, the distance between the projection of the edge of the insulating layer 25 close to the binding region on the display panel 1 and the first pad 12 is 100-150 μm, and the distance between the edge 11 and the range larger than the cutting hot melting range is 15-40 um, so that the overlapping of the insulating layer 25 and the cutting edge 11 is facilitated, the good display of the display panel 1 is ensured, and the problem of poor display such as a display dark line is avoided.
According to the display device provided by the embodiment of the invention, the overlapping of the insulating layer and the cutting edge is realized by setting the reasonable distance range of the insulating layer and the cutting edge, after the plurality of second bonding pads arranged in the binding region are bound with the plurality of first bonding pads of the display panel, the contact between the region outside the binding region and the cutting hot-melt electrons or metal chips at the cutting edge is prevented, the risk of short circuit between the flexible circuit board and the metal chips at the edge of the cutting channel after the binding is improved, the problem that the display performance is influenced by the formation of a display dark line is avoided, and the good display performance of the display device is ensured.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (6)
1. A display device is characterized by comprising a display panel and a flexible circuit board;
the display panel comprises a cutting edge and a plurality of first bonding pads;
the flexible circuit board comprises a substrate, wherein the substrate comprises a binding region and a non-binding region, the binding region is provided with a plurality of second bonding pads, and the non-binding region is provided with an insulating layer; the second bonding pad is connected with the first bonding pad on the display panel in a binding mode;
the insulating layer is positioned between the substrate and the cutting edge, and the insulating layer overlaps the cutting edge;
the insulating layer comprises a first insulating area and a second insulating area, the first insulating area is positioned between the binding area and the second insulating area, and the first insulating area is provided with a plurality of grooves;
the film thickness of the insulating layer of the second insulating region is larger than that of the insulating layer of the first insulating region;
the insulating layer comprises a plurality of insulating parts arranged in a strip shape, and each insulating part covers at least one first routing wire; the substrate is exposed between the adjacent insulating parts;
the distance range between the vertical projection of the cutting edge on the insulating layer and the edge of the insulating layer close to the binding area is 100-200 mu m.
2. The display device according to claim 1, wherein the second pads are arranged in at least one row, the flexible printed circuit further comprises a routing layer disposed between the insulating layer and the substrate, the routing layer comprises a plurality of first traces, and the first traces are electrically connected to the second pads correspondingly.
3. The display device according to claim 1, wherein the insulating portions correspond to the first traces one to one.
4. The display device according to claim 1,
the insulating layer is an ink layer.
5. The display device according to claim 1,
the shortest distance range between the cutting edge and the first bonding pad is 250 to 300 mu m.
6. The display device according to claim 1,
the distance between the projection of the edge of the insulating layer close to the bonding area on the display panel and the first bonding pad ranges from 100 to 150 micrometers.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910385400.1A CN111915984B (en) | 2019-05-09 | 2019-05-09 | Display device |
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| CN201910385400.1A CN111915984B (en) | 2019-05-09 | 2019-05-09 | Display device |
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| CN111915984A CN111915984A (en) | 2020-11-10 |
| CN111915984B true CN111915984B (en) | 2022-10-21 |
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| CN112562524B (en) * | 2020-12-04 | 2022-07-12 | Tcl华星光电技术有限公司 | Display panel and display panel manufacturing method |
| CN112817481B (en) * | 2021-01-28 | 2024-03-22 | 京东方科技集团股份有限公司 | Touch display panel and touch display device |
| CN113793862A (en) * | 2021-09-13 | 2021-12-14 | 京东方科技集团股份有限公司 | Display panel, display module and preparation method thereof |
| CN114460773B (en) * | 2022-01-27 | 2023-09-26 | 武汉华星光电技术有限公司 | Display panel to be cut, display panel and display device |
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| CN102387662A (en) * | 2010-09-06 | 2012-03-21 | 上海贺鸿电子有限公司 | Rigid-flexibility circuit board and manufacturing method thereof |
| KR101899063B1 (en) * | 2012-04-16 | 2018-09-17 | 엘지디스플레이 주식회사 | Display device and reworking methode thereof |
| KR101983374B1 (en) * | 2012-11-06 | 2019-08-29 | 삼성디스플레이 주식회사 | Chip on film, display pannel, display device including thereof |
| CN105826353B (en) * | 2016-03-25 | 2019-08-16 | 京东方科技集团股份有限公司 | Flip chip and display device |
| KR102487061B1 (en) * | 2016-06-30 | 2023-01-12 | 삼성디스플레이 주식회사 | Display device |
| CN107734845A (en) * | 2017-10-12 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | A kind of FPC and preparation method thereof |
| CN109459895B (en) * | 2018-12-13 | 2021-05-14 | 厦门天马微电子有限公司 | Display panel and display device |
| CN109686712B (en) * | 2018-12-26 | 2020-10-16 | 厦门天马微电子有限公司 | Display panel and display device |
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