CN111900108B - Package structure adjusting device, adjusting method and control device - Google Patents
Package structure adjusting device, adjusting method and control device Download PDFInfo
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- CN111900108B CN111900108B CN202010718237.9A CN202010718237A CN111900108B CN 111900108 B CN111900108 B CN 111900108B CN 202010718237 A CN202010718237 A CN 202010718237A CN 111900108 B CN111900108 B CN 111900108B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 111
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- 239000012790 adhesive layer Substances 0.000 abstract description 30
- 230000006870 function Effects 0.000 abstract description 13
- 239000010410 layer Substances 0.000 abstract description 11
- 230000001276 controlling effect Effects 0.000 description 16
- 238000007667 floating Methods 0.000 description 13
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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Abstract
The invention discloses a packaging structure adjusting device, a packaging structure adjusting method and a control device. The packaging structure adjusting device comprises a base and an adjusting mechanism, wherein the base is used for placing a packaging structure, the packaging structure comprises a packaging substrate, a shell and an uncured adhesive layer, and the adhesive layer is arranged between the packaging substrate and the shell; the adjusting mechanism is arranged above the base and comprises a mounting base and at least two ejector pins, and the at least two ejector pins are arranged on the mounting base at intervals; and the adjusting mechanism drives the ejector pin to move towards the base when moving towards the base, so that the ejector pin is abutted to the packaging substrate and pushes the packaging substrate to adjust the thickness of the bonding layer. The technical scheme of the invention aims to ensure that the levelness, the flatness and the like of the packaging substrate in the packaging structure can meet the requirements of normal realization of element functions.
Description
Technical Field
The present invention relates to the field of packaging technologies, and in particular, to a device for adjusting a packaging structure, a method for adjusting a packaging structure, and a control device.
Background
With the development of the electronic industry, products increasingly tend to be miniaturized, multifunctional and high-performance, and system-in-package is emerging and gradually applied. System in package generally integrates and packages a plurality of elements and electronic units together into an integrated electronic system to realize various functions of the product. In packaging, the various elements are generally integrated on a packaging substrate, and the packaging substrate is fixed in a shell with a certain depth through an adhesive material to form a packaging structure. However, certain elements (such as a gyro sensor) have high requirements on levelness, flatness and the like, and if the levelness, flatness and the like of the package substrate do not meet the requirements, the functions of the package structure are easily lost.
Disclosure of Invention
The invention mainly aims to provide a packaging structure adjusting device, which aims to ensure that the levelness, the flatness and the like of a packaging substrate in a packaging structure can meet the requirements of normal realization of element functions.
In order to achieve the above object, the present invention provides a packaging structure adjusting device, which includes:
The packaging structure comprises a packaging substrate, a shell and an uncured bonding layer, wherein the bonding layer is arranged between the packaging substrate and the shell;
the adjusting mechanism is arranged above the base and comprises a mounting base and at least two ejector pins, and the at least two ejector pins are arranged on the mounting base at intervals;
And the adjusting mechanism drives the ejector pin to move towards the base when moving towards the base, so that the ejector pin is abutted to the packaging substrate and pushes the packaging substrate to adjust the thickness of the bonding layer.
Optionally, the adjusting mechanism further comprises a push pin mechanism, the push pin mechanism is arranged above the ejector pin, and the ejector pin is movably connected with the mounting base;
the ejector pin mechanism pushes the ejector pin to move towards the base.
Optionally, the push pin mechanism and one end of the ejector pin away from the base are arranged at intervals, so that when the adjusting mechanism moves towards the base, the packaging substrate pushes the ejector pin abutting against the packaging substrate to move away from the base.
Optionally, each thimble is provided with a marking part at the same height relative to the base, and the distance between one end of each thimble, which is close to the base, and the corresponding marking part is equal.
Optionally, the packaging structure adjusting device further comprises a camera, and a lens of the camera is arranged towards the identification part;
The identification part is a groove extending along the circumferential direction of the thimble.
Optionally, the push pin mechanism includes at least two sub-pushing pieces, the sub-pushing pieces with the thimble one-to-one sets up, sub-pushing pieces locates the thimble top that corresponds.
Optionally, the packaging structure adjusting device further comprises a buffer, and the buffer is arranged between the base and the adjusting mechanism; and/or the number of the groups of groups,
The packaging structure adjusting device further comprises a driving mechanism, wherein the driving mechanism is connected with the adjusting mechanism to drive the adjusting mechanism to move towards or away from the base.
In addition, in order to achieve the above object, the present application further provides a method for adjusting a package structure, applying the device for adjusting a package structure according to any one of the above claims, the method for adjusting a package structure comprising:
When the packaging structure is placed on the base, the adjusting mechanism is controlled to move towards the base so as to adjust the packaging substrate to a set state, wherein the set state is that the deviation of different positions on the packaging substrate relative to the height of the base is smaller than or equal to a set threshold value.
Optionally, when the adjusting mechanism includes a push pin mechanism, the ejector pin includes a marking portion, and the packaging structure adjusting device further includes a camera, the step of controlling the adjusting mechanism to move toward the base to adjust the packaging substrate to a set state includes:
acquiring images of at least two thimbles, and acquiring the reference height of the identification part relative to the base; the image is acquired by the camera;
Determining the current height of each identification part relative to the base according to the image position of each identification part in the image; wherein the reference height is less than or equal to the current height;
controlling the ejector pin mechanism to push the ejector pin to move towards the base according to the height difference between the current height and the reference height until the ejector pin in the adjusting mechanism is abutted against the packaging substrate;
And controlling the push pin mechanism to push the ejector pins to move towards the base, so that the ejector pins push the packaging substrate to adjust to a set state.
Optionally, when the push pin mechanism includes at least two sub-pushing elements, the step of controlling the push pin mechanism to push the ejector pin according to the height difference between the current height and the reference height includes:
And according to the height difference corresponding to each thimble, each sub pushing piece is controlled to push the corresponding thimble to move towards the base in sequence, so that the height of the identification part of each thimble relative to the base reaches the standard height.
Optionally, the step of sequentially controlling each sub-pushing member to push the corresponding thimble to move towards the base according to the height difference corresponding to each thimble includes:
Determining an adjustment sequence according to a comparison result of the current height corresponding to each thimble; wherein the greater the current height, the more forward the adjustment order;
And according to the height difference corresponding to each thimble, each sub-pushing piece is controlled to push the corresponding thimble to move towards the base in sequence according to the adjustment sequence.
Optionally, after the step of controlling the adjusting mechanism to move toward the base to adjust the package substrate to the set state, the method further includes:
When the packaging substrate reaches a set state, the adjusting mechanism is controlled to stop moving, so that the ejector pins in the adjusting mechanism are static and maintain a state of abutting against the packaging substrate until the bonding layer is solidified.
In addition, in order to achieve the above object, the present application also provides a control device including: the device comprises a memory, a processor and a packaging structure adjusting program stored in the memory and capable of running on the processor, wherein the packaging structure adjusting program realizes the steps of the packaging structure adjusting method when being executed by the processor.
According to the technical scheme, the position of the package substrate in the unshaped package structure is adjusted by adopting the package structure adjusting device, the adjusting device comprises a base and an adjusting mechanism, the adjusting mechanism comprises at least two ejector pins and an installation base, when the package structure comprising the package substrate, a shell and an uncured adhesive layer is placed on the base, the adjusting mechanism arranged above the base moves towards the base and drives at least two ejector pins arranged at intervals on the installation base to move towards the base, the ejector pins can press at least two positions of the package substrate under the continuous pushing of the adjusting mechanism when being abutted on the package substrate, and the thickness of the uncured adhesive layer between the package substrate and the shell is correspondingly adjusted, so that the assembly position of the package substrate can be adjusted based on the levelness, flatness and the like of the package substrate required by normal realization of element functions, and the requirements of normal realization of element functions can be met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of a device for adjusting a package structure according to the present invention;
FIG. 2 is a front view of the device of FIG. 1;
FIG. 3 is a schematic diagram of a hardware structure involved in the operation of the control device in the embodiment of the present invention;
FIG. 4 is a flow chart illustrating an embodiment of a method for adjusting a package structure according to the present invention;
FIG. 5 is a flow chart illustrating an adjusting method of a package structure according to another embodiment of the present invention;
FIG. 6 is a flowchart illustrating a method for adjusting a package structure according to another embodiment of the present invention;
FIG. 7 is a view of the images collected by the camera of the package structure adjusting device of the present invention of the pins before adjustment of the package substrate;
Fig. 8 is a flowchart illustrating a method for adjusting a package structure according to another embodiment of the invention.
Reference numerals illustrate:
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The embodiment of the invention provides a device for adjusting a packaging structure 01, which is used for adjusting levelness, flatness and the like of a packaging substrate 011 in an unshaped packaging structure 01.
In the embodiment of the invention, referring to fig. 1, a packaging structure 01 adjusting device comprises a base 1 and an adjusting mechanism 2. The base 1 is used for placing the package structure 01.
Specifically, the package structure 01 includes a package substrate 011, a case 012, and an uncured adhesive layer 013, and the adhesive layer 013 is provided between the package substrate 011 and the case 012. Specifically, the package substrate 011 is specifically a structure formed by integrating and installing multiple functional chips (including a processor, a memory, a gyroscope and the like), and is specifically prepared by adopting a system-in-package technology. The housing 012 is specifically a shell structure having an open cavity. Specifically, an uncured adhesive material (such as a hot melt adhesive) is added to the bottom of the opening in the housing 012 to form an adhesive layer 013, and then the package substrate 011 is laid flat over the adhesive layer 013 to form the package structure 01.
The adjusting mechanism 2 specifically comprises a mounting base 21 and at least two ejector pins 22, and the at least two ejector pins 22 are arranged on the mounting base 21 at intervals. Specifically, the adjusting device of the packaging structure 01 further comprises a guide post (such as a linear bearing), the guide post is fixed on the base 1, the adjusting mechanism 2 can be movably mounted on the guide post, and the adjusting mechanism 2 can slide towards or away from the base 1 along the guide post. When the package structure 01 is placed on the base 1, the manual or electric control manner can control the adjusting mechanism 2 to move towards the base 1 and drive the ejector pin 22 to move towards the base 1, so that the ejector pin 22 abuts against the package substrate 011 and pushes the package substrate 011 to adjust the thickness of the adhesive layer 013. Because the thickness of the uncured adhesive layer 013 in the packaging structure 01 is not uniform, the packaging substrate 011 can be floated, and therefore when the thimble 22 arranged at intervals is abutted against the packaging substrate 011, the contact position of the packaging substrate 011 and the thimble 22 can move and press down along with the thimble 22, so that the thickness of the adhesive layer 013 below is adjusted, the floating position of the packaging substrate 011 is adjusted, and the levelness, flatness and the like of the packaging substrate 011 can meet the requirements of normal use of elements (such as a gyroscope) on the substrate.
In this embodiment, at least two pins 22 are symmetrically disposed to ensure uniformity of stress of the package substrate 011. For example, 4 pins 22 are provided in the embodiment, and are distributed in a rectangular shape. Specifically, the projections of the at least two ejector pins 22 on the package substrate 011 are symmetrically disposed about the center of the package substrate 011, and the projections are close to the edges of the package substrate 011.
According to the technical scheme, the position of a package substrate 011 in an unshaped package structure 01 is adjusted by adopting a package structure 01 adjusting device, the adjusting device comprises a base 1 and an adjusting mechanism 2, the adjusting mechanism 2 comprises at least two ejector pins 22 and an installation base 21, when the package structure 01 comprising the package substrate 011, a shell 012 and an uncured bonding layer 013 is placed on the base 1, the adjusting mechanism 2 arranged above the base 1 moves towards the base 1 and drives at least two ejector pins 22 arranged at intervals on the installation base 21 to move towards the base 1, the ejector pins 22 can press at least two positions of the package substrate 011 under the continuous pushing of the adjusting mechanism 2 when being abutted against the package substrate 011, and the thickness of an uncured bonding layer 013 between the package substrate 011 and the shell 012 is correspondingly adjusted, so that the assembly position of the package substrate 011 can be adjusted based on the levelness, flatness and the like of the package substrate 011 required by normal realization of element functions, and the requirements that the element functions can be normally realized can be met in the package structure 01. Because the package substrate 011 is not uniformly pressed or is excessively large, individual sensitive devices are easily damaged, and functions are lost, the ejector pins 22 are arranged at intervals, so that the stress of different positions of the package substrate 011 is uniform, the levelness and the flatness of the package substrate 011 are regulated, the stress of each point of the package substrate 011 is uniform and not excessively large, the package substrate 011 is prevented from being crushed, and the normal realization of functions of the package substrate 011 is further ensured.
Further, in this embodiment, the adjustment device of the package structure 01 further includes a driving mechanism 201 (such as a mechanical arm, etc.), where the driving mechanism 201 is connected to the adjustment mechanism 2 to drive the adjustment mechanism 2 to move toward or away from the base 1. Here, the driving mechanism 201 replaces a human hand to control the action of the adjusting mechanism 2, so that human errors in the adjusting and controlling process are avoided, and the accuracy of the action adjustment and control of the adjusting mechanism 2 is ensured.
Further, in this embodiment, in order to facilitate the use of the accuracy and controllability of the ejector pins 22 for adjusting and controlling the levelness, flatness, etc. of the package substrate 011, referring to fig. 1, the adjusting mechanism 2 further includes a push pin mechanism 23 disposed above the ejector pins 22, where the ejector pins 22 are movably connected with the mounting base 21, and the push pin mechanism 23 pushes the ejector pins 22 to move toward the base 1. The push pin mechanism 23 is specifically provided above the ejector pin 22 and is movable toward the base 1. When the ejector pins 22 do not need to be pushed, the ejector pin mechanism 23 can be connected with the ejector pins 22, and can also be arranged at intervals of the ejector pins 22. When the package substrate 011 needs to be adjusted, the push pin mechanism 23 can be controlled to move towards the base 1 manually or electrically, and the push pin 22 is connected with the push pin mechanism or pushed to move towards the base 1 when the push pin mechanism abuts against the push pin 22. The push pin mechanism 23 may be configured to push the plurality of push pins 22 synchronously or push each push pin 22 one by one according to actual needs.
Specifically, referring to fig. 1 and 2, the push pin mechanism 23 includes at least two sub-push members 231, where the sub-push members 231 are disposed in one-to-one correspondence with the ejector pins 22, and the sub-push members 231 are disposed above the corresponding ejector pins 22. When any sub-pushing member 231 moves towards the base 1, the corresponding thimble 22 can be pushed to move towards the base 1, so as to adjust the corresponding position of the package substrate 011. Based on this, the movement of each thimble 22 towards the base 1 can be independently regulated and controlled by the corresponding sub-pushing piece 231, so that the method can be suitable for different height floating phenomena of different positions of the packaging substrate 011 to carry out differential regulation, and the accuracy of regulation and control of levelness, flatness and the like of the packaging substrate 011 is further improved. Specifically, in this embodiment, the sub-pushing member 231 is specifically an adjusting bolt, the adjusting bolt is mounted on a mounting substrate, the mounting substrate is fixed above the mounting base 21 and is spaced from the mounting base 21, and the adjusting bolt can be driven by a manual or electric mode to move towards the base 1, and when moving to contact with the thimble 22 corresponding thereto, the thimble 22 is pushed to move towards the base 1. Because the manual adjustment is easier to deviate, in order to ensure the accuracy of adjustment such as levelness and flatness of the package substrate 011, the push pin mechanism 23 may further include a motor 232 and an electric screwdriver (not shown) adapted to the adjustment bolt, the electric screwdriver (not shown) is in transmission connection with the motor 232, the motor 232 and the electric screwdriver (not shown) connected with the motor may be mounted on a manipulator, when the height of a certain position of the package substrate 011 is higher, the electric screwdriver (not shown) may be engaged with the adjustment bolt corresponding to the thimble 22 above the position, and the adjustment bolt connected with the electric screwdriver (not shown) is driven by the motor 232 to push the thimble 22 corresponding to the electric screwdriver to move towards the base 1, the position of the thimble 22 corresponding to the package substrate 011 is pressed down along with the thimble 22, and when the thickness of the uncured adhesive layer 013 is reduced to the height of the package substrate 011 reaches the set height, the operation of the motor 232 is stopped, so that the accurate adjustment and control of the package substrate position is realized.
In addition, in other embodiments, the ejector pins 22 may be fixedly mounted on the mounting base 21, the distances between one ends of the different ejector pins 22, which are close to the base 1, and relative to the base 1 are equal, in the process that the adjustment mechanism 2 moves towards the base 1, due to the floating phenomenon of the package substrate 011, part of the ejector pins 22 are closer to the package substrate 011, part of the ejector pins 22 are farther from the package substrate 011, the ejector pins 22 closer to the package substrate 011 contact the package substrate 011 first and reduce the thickness of the adhesive layer 013 corresponding to the position, then the ejector pins 22 farther from the package contact the package substrate 011, and when all the ejector pins 22 are abutted against the package substrate 011, the heights of the package substrate 011 relative to the base 1 are equal, so that the thickness of the adhesive layer 013 is uniform, the problem that the package substrate 011 floats is effectively solved, and the levelness, flatness and the like of the package substrate 011 can meet the requirements of the elements (such as a gyroscope) on the substrate in normal use.
Further, in this embodiment, in order to know the flatness and levelness of the package substrate 011 before adjustment, referring to fig. 2, the ejector pin mechanism 23 and one end of the ejector pin 22 away from the base 1 are spaced apart, so that when the adjustment mechanism 2 moves toward the base 1, the package substrate 011 pushes the ejector pin 22 abutting against the ejector pin to move away from the base 1. After the package structure 01 is placed on the base 1, the adjusting mechanism 2 is first released to move toward the base 1, and the ejector pins 22 are continuously approaching the package substrate 011 from a position far away from the package substrate 011 until the ejector pins 22 are abutted against the package substrate 011, and the ejector pins 22 can freely move up and down on the mounting base 21, so that the ejector pins 22 are abutted against the package substrate 011 and then move in a direction away from the base under the reaction force of the package substrate 011 until the adjusting mechanism 2 stops. After the adjusting mechanism 2 is stopped and before the ejector pins 22 are not contacted with the push pin mechanism 23, the relative positions of the ejector pins 22 at different positions of the packaging substrate 011 can be changed due to different floating conditions, so that the change of the relative positions of the ejector pins 22 can be monitored by eyes or machines, the deviation condition of the actual state of the packaging substrate 011 before the adjustment of the packaging structure 01 and the required horizontal state can be known, the ejector pins 22 are further adjusted by the push pin mechanism 23 on the basis, the position adjustment precision of the packaging substrate 011 is improved, and the adjusted packaging substrate 011 can be matched with the required levelness and flatness for normal operation of elements of the packaging substrate 011.
Further, referring to fig. 1 and 2, in order to accurately and intuitively reflect the flatness and levelness of the package substrate 011 before adjustment, each thimble 22 is provided with a marking portion 221 at the same height relative to the base 1, the distance between one end of each thimble 22 near the base 1 and the corresponding marking portion 221 is equal, and the height of the package substrate 011 before adjustment changes the marking portion 221 on each thimble 22 from a level state to a non-level state, so that the current level state of the package substrate 011 can be accurately represented by the height of different marking portions 221, and the current state of the package substrate 011 can be accurately identified based on the marking portion 221 based on human eyes or machines, so as to perform further accurate adjustment actions. Specifically, in this embodiment, the adjustment device for the package structure 01 further includes a camera 3, where the camera 3 is disposed towards the identifier 221, so as to implement automatic recognition of the floating condition of the package substrate 011 before adjustment based on the image collected by the camera 3. In this embodiment, the video camera 3 is specifically a vision camera. Based on this, the marking portion 221 is a groove extending along the circumferential direction of the ejector pin 22, so that the groove can form a significant characteristic image on the image collected by the camera 3 (especially, the vision camera), thereby ensuring the accurate identification of the floating condition of the package substrate 011 based on the image collected by the camera 3.
Further, referring to fig. 1, the adjusting device for the package structure 01 further includes a buffer 4, and the buffer 4 is disposed between the base 1 and the adjusting mechanism 2. In the present embodiment, the damper 4 specifically includes a spring. One end of the damper 4 may be fixed to one of the adjustment mechanism 2 and the base 1, and when the other end of the damper 4 contacts an obstacle during the relative movement between the base 1 and the adjustment mechanism 2, a reaction force against the obstacle is generated to generate a damping effect. The buffer 4 is specifically configured to slow down the pressure on the substrate when the adjustment mechanism 2 contacts the package substrate 011 during the descent process, so as to avoid the pressure injury to the package substrate 011 caused by excessive pressure. Specifically, before the packaging structure 01 is placed on the base 1, the driving mechanism 201 can lift the adjusting mechanism 2 to a certain height (namely, move away from the base 1) and fix the adjusting mechanism by limiting, so that the ejector pins 22 and the packaging structure 01 are prevented from interfering, the packaging structure 01 is convenient to install, after the packaging structure 01 is placed on the base 1, the driving mechanism 201 can loosen the adjusting mechanism 2 to enable the adjusting mechanism 2 to descend along the guide column (namely, move towards the base 1), the adjusting mechanism 2 slowly falls under the action of the buffer 4, and gravity is relieved, so that the force of the ejector pins 22 when contacting products is effectively reduced.
The embodiment of the invention also provides a control device which is used for controlling the action of the adjusting mechanism 2 in the adjusting device of the packaging structure 01.
In an embodiment of the present invention, referring to fig. 3, the control device includes: a processor 1001 (e.g., CPU), a memory 1002, and the like. The memory 1002 may be a high-speed RAM memory or a stable memory (non-volatile memory), such as a disk memory. The memory 1002 may alternatively be a storage device separate from the processor 1001 described above.
The camera 3, the driving mechanism 201 of the adjusting mechanism 2, the motor 232 corresponding to the adjusting bolt, and the memory 1002 are all connected to the processor 1001. The processor 1001 may acquire image data acquired by the camera 3, and may control the operation of the adjustment mechanism 2 and the adjustment bolt by controlling the operation of the driving mechanism 201 and the motor 232.
It will be appreciated by those skilled in the art that the device structure shown in fig. 3 is not limiting of the device and may include more or fewer components than shown, or certain components may be combined, or a different arrangement of components.
As shown in fig. 3, an adjustment program of the package structure 01 may be included in a memory 1002 as a readable storage medium. In the apparatus shown in fig. 3, the processor 1001 may be configured to call an adjustment program of the package structure 01 stored in the memory 1002 and perform the relevant step operations related to the adjustment mechanism 2 in the adjustment method of the package structure 01 in the following embodiments.
Further, the embodiment of the invention also provides a method for adjusting the package structure 01, which is applied to the device for adjusting the package structure 01 in the embodiment, so as to realize adjustment of the package structure 01 placed in the device for adjusting the package structure 01.
Referring to fig. 4, an embodiment of a method for adjusting a package structure 01 according to an embodiment of the present invention is provided. In this embodiment, the method for adjusting the package structure 01 includes:
In step S100, when the package structure 01 is placed on the base 1 and the ejector pins 22 package structure 01 encapsulates the substrate 011, the adjusting mechanism 2 is controlled to move towards the base 1 to adjust the package substrate 011 to a set state, where the set state is that a deviation of different positions on the package substrate 011 relative to the height of the base 1 is less than or equal to a set threshold.
In this embodiment, the package structure 01 includes a package substrate 011, a case 012, and an uncured adhesive layer 013, and the adhesive layer 013 is disposed between the package substrate 011 and the case 012. Before the adhesive layer 013 of the package structure 01 is cured, the package structure 01 is placed on the base 1. In the package structure 01 of the base 1, the package substrate 011 faces upward away from the bonding layer 013. When the package structure 01 is placed on the base 1, a user of the package structure 01 adjusting device can input a setting instruction in a key mode or the like, and when the setting instruction is detected, the package structure 01 can be considered to be placed on the base 1, otherwise, the package structure 01 can be considered not to be placed on the base 1; in addition, when the base 1 is provided with the sensing module (such as an infrared detection module, a proximity sensor, etc.) and an object is detected at a set position of the base 1, the package structure 01 may be considered to be placed on the base 1, otherwise, the package structure 01 may not be considered to be placed on the base 1.
The set state is specifically a position state of the package substrate 011 in the case 012 when all elements on the package substrate 011 are normally operated. The set threshold value can be set according to the requirements of the normal operation of the element on the levelness and the flatness, and the higher the levelness and the flatness degree required by the normal operation of the element, the smaller the corresponding set threshold value.
Specifically, the driving mechanism 201 of the adjusting mechanism 2 can be controlled to control the movement of the ejector pin 22 in the adjusting mechanism 2, and when the adjusting mechanism 2 includes the ejector pin mechanism 23, the driving mechanism 201 of the adjusting mechanism 2 is controlled to control the movement of the ejector pin 22 in the adjusting mechanism 2 by the motor 232 corresponding to the ejector pin mechanism 23. When the adjusting mechanism 2 is controlled to move towards the base 1, the ejector pins 22 are driven to move towards the base 1, so that the ejector pins 22 are abutted against the packaging substrate 011 and push the packaging substrate 011 to adjust the thickness of the bonding layer 013. Because the uncured adhesive layer 013 in the packaging structure 01 is uneven in thickness, the packaging substrate 011 can have different floating phenomena, when the packaging substrate 011 is abutted against the ejector pins 22, the contact positions of the packaging substrate 011 and the ejector pins 22 can move and press down along with the ejector pins 22, so that the thickness of the adhesive layer 013 below is adjusted, the floating position of the packaging substrate 011 is adjusted, the packaging substrate 011 is adjusted to a set state from a rugged state, and the levelness, flatness and the like of the packaging substrate 011 can meet the requirements of elements (such as gyroscopes) on the substrate during normal use.
According to the method for adjusting the packaging structure 01, when the packaging structure 01 is placed on the base 1, the adjusting mechanism 2 in the device for adjusting the packaging structure 01 is controlled to move towards the base 1 so as to adjust the packaging substrate 011 to a set state, so that the deviation of different positions on the packaging substrate 011 relative to the height of the base 1 is smaller than or equal to a set threshold value, and the deviation of the height is smaller than or equal to the set threshold value, so that the levelness, flatness and the like of the packaging substrate 011 in the packaging structure 01 can meet the requirements of normal realization of element functions.
Further, in the present embodiment, after step S100, the method further includes: when the package substrate 011 reaches a set state, the movement of the adjustment mechanism 2 is controlled to stop so that the ejector pins 22 in the adjustment mechanism 2 are stationary and kept in contact with the package substrate 011 until the adhesive layer 013 is cured. The curing time may be specifically set according to the curing characteristics of the adhesive layer 013, for example, 20min to 40min. Here, after the package substrate 011 is adjusted to the set state by the adjusting mechanism 2, the state that the ejector pins 22 are abutted against the package substrate 011 is maintained before the bonding layer 013 is cured, so that rebound caused by the plastic influence of the bonding layer 013 in the curing process is avoided, the cured package substrate 011 can be accurately maintained to the set state, on one hand, the bonding firmness between the package substrate 011 and the shell 012 can be ensured, and on the other hand, the levelness, flatness and the like of the package substrate 011 in the package structure 01 can be further ensured to meet the requirements of normal realization of element functions.
Further, based on the above embodiment, another embodiment of the adjustment method of the package structure 01 of the present application is provided. In this embodiment, when the adjustment device for the package structure 01 includes the push pin mechanism 23, referring to fig. 5, the step of controlling the adjustment mechanism 2 to move toward the base 1 to adjust the package substrate 011 to a set state includes:
Step S110, controlling the adjustment mechanism 2 to move towards the base 1 until the ejector pins 22 in the adjustment mechanism 2 abut against the package substrate 011;
Specifically, before the package structure 01 is placed on the base 1, the whole adjusting mechanism 2 can be lifted to a certain height, so that the package structure 01 can not interfere with the ejector pins 22 when the base 1 is placed. Accordingly, when the package structure 01 is placed on the base 1, the driving mechanism 201 of the adjusting mechanism 2 controls the entire adjusting mechanism 2 to move toward the base 1 until the ejector pins 22 are abutted against the package substrate 011.
In step S120, the ejector pin mechanism 23 is controlled to push the ejector pins 22 to move toward the base 1, so that the ejector pins 22 push the package substrate 011 to adjust to a set state.
When the ejector pin 22 abuts against the package substrate 011, the driving mechanism 201 can be controlled to stop driving, and then the motor 232 of the ejector pin mechanism 23 is further controlled to operate, and the motor 232 drives the ejector pin mechanism 23 to move towards the base 1 and pushes the ejector pin 22 to move towards the base 1, so that the ejector pin 22 packages the substrate 011 until reaching the set state.
In this embodiment, when the adjusting mechanism 2 includes the push pin mechanism 23, the adjusting mechanism 2 is first integrally adjusted to a state where the ejector pin 22 abuts against the package substrate 011, and then the ejector pin mechanism 23 pushes the ejector pin 22 to adjust the package substrate 011 to a set state, so that the package structure 01 can be normally placed on the base 1, and meanwhile, the push pin mechanism 23 can push the ejector pin 22 to effectively regulate and control the package substrate 011.
Further, based on the above embodiment, another embodiment of the adjustment method of the package structure 01 of the present application is provided. In this embodiment, in the structure that the ejector pin 22 includes the identification portion 221 in the above-mentioned package structure 01 adjustment device, and the package structure 01 adjustment device further includes the camera 3, referring to fig. 6, step S120 includes:
step S121, acquiring images of at least two thimbles 22, and acquiring a reference height of the identification portion 221 relative to the base 1; the image is acquired by the camera;
Specifically, the standard height is specifically the height of all the identification parts 221 corresponding to the level height of the package substrate 011 fully adjusted in place with respect to the base 1. The standard height can be specifically set according to the actual demand of the product. The standard height may be a fixed parameter set in advance, or may be a parameter set based on an actual floating state of the package substrate 011.
Step S122, determining a current height of each identification portion 221 relative to the base 1 according to an image position of each identification portion 221 in the image; wherein the reference height is less than or equal to the current height;
the sub-image of each identification part 221 is identified in the image acquired by the camera, the position of the sub-image in the acquired image is determined, and the current height of each identification part 221 relative to the base 1 is determined based on the image position based on the conversion relation of the image coordinates and the space coordinates.
Step S123, controlling the ejector pin mechanism 23 to push the ejector pin 22 to move towards the base 1 according to the height difference between the current height and the reference height.
Specifically, the height difference between each current height and the reference height may be calculated, and the ejector pin mechanism 23 is controlled to simultaneously or stepwise push the ejector pins 22 to move toward the base 1 based on the height difference, so that the height of each marking portion 221 with respect to the base 1 is the reference height.
In this embodiment, when the push pin mechanism 23 includes at least two sub-pushers 231, step S123 includes: according to the height difference corresponding to each thimble 22, each sub-pushing member 231 is controlled to push the corresponding thimble 22 to move towards the base 1 in turn, so that the height of the identification portion 221 of each thimble 22 relative to the base 1 reaches the standard height. For example, when the sub-pushing member 231 is an adjusting bolt, the electric screwdriver head connected by the motor 232 is aligned and clamped with the sub-pushing member 231 corresponding to each thimble 22 in sequence, so that the electric screwdriver head is driven by the operation of the motor 232 to push the corresponding thimble 22. The greater the height difference corresponding to the ejector pin 22, the greater the distance the sub-pushing member 231 pushes the ejector pin 22 to slide toward the chassis 1, and the greater the thickness of the adhesive layer 013 corresponding to the position corresponding to the ejector pin 22 is reduced. When the corresponding thimble 22 is pushed to move towards the base 1 according to the height difference control sub-pushing member 231, the motor 232 of the sub-pushing member 231 can be controlled to operate and return to execute step S211 when the current height deviates from the standard height or exceeds a preset threshold value, and the motor 232 of the sub-pushing member 231 can be controlled to stop operating when the current height is consistent with the standard height or the deviation is less than or equal to the preset threshold value, and then the next thimble 22 is controlled by analogy.
Referring to fig. 7, fig. 7 is an image of all the pins 22 when the pins 22 collected by the camera 3 are in contact with the package substrate 011 without contacting the upper push pin mechanism 23. The broken line a is a reference line representing the basic height of all the identification parts 221, the solid lines B1, B2, B3 and B4 are images formed corresponding to each identification part 221 respectively, and fig. 7 can intuitively and accurately represent that the ejector pin 22 is directly connected with the package substrate 011 without adopting the ejector pin mechanism 23 to push the ejector pin 22 so as to adjust the floating state of the package substrate 011 before the package substrate 011.
Specifically, in this embodiment, the step of sequentially controlling each of the sub-pushing members 231 to push the corresponding thimble 22 to move toward the base 1 according to the height difference corresponding to each thimble 22 includes:
step 123a, determining an adjustment order according to the comparison result of the current height corresponding to each thimble 22; wherein the greater the current height, the more forward the adjustment order;
Specifically, the greater the current height, the higher the ejector pins 22 are lifted up, indicating that the more serious the floating phenomenon of the position package substrate 011, the more the thickness of the position corresponding adhesive layer 013 where the floating phenomenon is serious is preferentially adjusted. The higher the current height of each thimble 22 is, the more forward the ranking of the current height is.
Step S123b, according to the height difference corresponding to each thimble 22, sequentially controlling each sub-pushing member 231 to push the corresponding thimble 22 to move towards the base 1 according to the adjustment sequence.
For example, when the sub-pushing member 231 is an adjusting bolt, the push pin mechanism 23 further includes a motor 232 and an electric screwdriver head adapted to the adjusting bolt, and the mechanical arm can be controlled to drive the motor 232 to move to the upper end of the adjusting bolt corresponding to the highest thimble 22 and slowly descend, so as to enable the electric screwdriver head to contact the upper end of the adjusting bolt and realize pairing, the motor 232 operates to drive the adjusting bolt to rotate and move towards the base 1, after the adjusting bolt contacts the upper end of the corresponding thimble 22, the pushing adjustment is continuously performed on the packaging substrate 011 under the continuous operation of the motor 232, in the process, the camera 3 continuously collects images of the thimble 22, and continuously identifies the deviation of the current height of the identifier 221 of the pushed thimble 22 relative to the base 1, if the height of the identifier 221 is consistent with the standard height based on the image identification, the motor 232 can be controlled to stop working, otherwise, the continuous operation of the motor 232 is maintained. After the height of the identification portion 221 of the highest ejector pin 22 is adjusted to the standard height, the push-pin maintaining mechanism 23 is stopped to push and maintain the current state, and the height of the identification portion 221 of the second highest ejector pin 22 is adjusted to the standard height in the above-mentioned manner by analogy with the ejector pin 22 maintained in contact with the package substrate 011 until the height of the identification portion 221 of each ejector pin 22 is adjusted to the standard height.
Because the packaging substrate 011 is a whole, when one end of the packaging substrate 011 is pressed down, the other end of the packaging substrate 011 must tilt to a certain height, in order to avoid the phenomenon that the floating height of one end of the packaging substrate 011 is increased when the lower position is adjusted first, in this embodiment, according to the order from high to low of the current height of the identification part 221 of the thimble 22, the push pin mechanism 23 is controlled to push the thimble 22 to adjust the height of the packaging substrate 011 corresponding to the position based on the height difference corresponding to each thimble 22 in sequence, the position with larger deviation between the packaging substrate 011 and the required height is adjusted first, then the position with smaller deviation between the packaging substrate 011 and the required height is adjusted, because the height of the identification part 221 of the thimble 22 is adjusted to the position with smaller deviation between the standard height packaging substrate 011 and the required height, the height of the next thimble 22 is adjusted under the limiting effect, the height of the identification part 221 of the rest thimble 22 is adjusted, the height of the identification part 221 of the rest thimble 22 is close to the standard height, the height of the next thimble 22 is pushed, the distance between the next thimble 22 and the required to be adjusted to the position with smaller distance 231 is reduced, and the distance between the packaging substrate 011 and the required to be adjusted to the standard height is increased, and the distance between the packaging substrate 011 and the required to be adjusted to the height is adjusted to the height of the corresponding height of the thimble 22.
Further, based on any of the above embodiments, another embodiment of the method for adjusting the package structure 01 of the present application is provided. In this embodiment, referring to fig. 8, before the step of controlling the movement of the adjustment mechanism 2 toward the base 1, the method further includes:
step S001 of obtaining a case 012, a package substrate 011, and an adhesive;
The bonding material is specifically a material which can realize bonding and fixing between objects after being cured. The type of the adhesive material can be specifically selected according to actual requirements. In this embodiment, the adhesive material is specifically polyurethane thermosol, and the curing time of the glue is long, so that the adjustment of the horizontal height of the package substrate 011 in the subsequently formed package structure 01 is convenient for a long time, and meanwhile, good adhesion between the housing 012 and the package substrate 011 can be ensured.
Step S002 of filling the adhesive material into the case 012 to form an uncured adhesive layer 013;
looking at the placement of the housing 012 on the automated dispensing platform, the dispenser dispenses the fixed position of the package substrate 011 within the open cavity of the housing 012, forming an uncured adhesive layer 013. And a glue overflow groove is reserved at the fixed position of the packaging substrate 011 in the opening cavity, so that the glue is convenient to bear, and better bonding strength can be provided. The fixing position of the package substrate 011 in the housing 012 and the size of the glue overflow groove may be defined according to the size specification of different package substrates 011.
In step S003, the package substrate 011 is laid flat on the adhesive layer 013 to form a package structure 01.
The package substrate 011 has two opposing plate surfaces, and after the adhesive layer 013 is formed, one of the plate surfaces is tiled on the adhesive layer 013 to form the package structure 01.
In step S004, the package structure 01 is placed on the base 1, where the surface of the package substrate 011 facing away from the adhesive layer 013 faces upwards.
Before dispensing, the housing 012 may be mounted in the carrier for fixing, where the opening of the housing 012 is upward, dispensing and assembling the housing 012 and the package substrate 011 fixed on the carrier to form the package structure 01, and then placing the carrier mounted with the package structure 01 on the base 1 of the device for adjusting the package structure 01, and adjusting the position of the package substrate 011 in the package structure 01 according to the adjustment manner in the above embodiment.
In this embodiment, the package structure 01 is preassembled in the above manner, and the face of the package substrate 011 of the package structure 01 that is assembled but not yet cured by the adhesive layer 013 is upwards placed on the base 1 of the adjustment device of the package structure 01, and the levelness and flatness of the package substrate 011 are adjusted by the adjustment device of the package structure 01, so that the levelness and flatness of the finally formed package structure 01 are ensured to meet the normal realization of the functions of the elements on the package substrate 011.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. A package structure adjusting apparatus, characterized in that the package structure adjusting apparatus comprises:
The packaging structure comprises a packaging substrate, a shell and an uncured bonding layer, wherein the bonding layer is arranged between the packaging substrate and the shell;
the adjusting mechanism is arranged above the base and comprises a mounting base and at least two ejector pins, and the at least two ejector pins are arranged on the mounting base at intervals;
the adjusting mechanism drives the thimble to move towards the base when moving towards the base so as to enable the thimble to be abutted against the packaging substrate;
the adjusting mechanism further comprises a push pin mechanism, the push pin mechanism is arranged above the ejector pins, the push pin mechanism comprises at least two sub-pushing pieces, the sub-pushing pieces are arranged in one-to-one correspondence with the ejector pins, the sub-pushing pieces are arranged above the corresponding ejector pins and are arranged at intervals with one end, away from the base, of the ejector pins, the distance between the ejector pins and the sub-pushing pieces at the moment is defined as an initial distance, and the ejector pins are movably connected with the mounting base;
When the adjusting mechanism moves towards the base, the packaging substrate pushes the thimble which is abutted against the packaging substrate to deviate from the base for movement, and the movement distance of the thimble is smaller than the initial distance between the thimble and the sub pushing piece, so that the thimble is still arranged at intervals with the pushing mechanism when the adjusting mechanism stops moving; and then each sub-pushing piece of the push pin mechanism can push each thimble to move towards the base so as to push the packaging substrate to adjust the thickness of the bonding layer.
2. The package structure adjusting apparatus according to claim 1, wherein each of the ejector pins is provided with a marking portion at the same height relative to the base, and a distance between an end of each of the ejector pins near the base and the corresponding marking portion is equal.
3. The package structure adjusting apparatus according to claim 2, wherein the package structure adjusting apparatus further comprises a camera, a lens of the camera being disposed toward the identification portion;
The identification part is a groove extending along the circumferential direction of the thimble.
4. A package structure adjusting apparatus according to any one of claims 1 to 3, further comprising a buffer provided between the base and the adjusting mechanism; and/or the number of the groups of groups,
The packaging structure adjusting device further comprises a driving mechanism, wherein the driving mechanism is connected with the adjusting mechanism to drive the adjusting mechanism to move towards or away from the base.
5. A method for adjusting a package structure, using the device for adjusting a package structure according to any one of claims 1 to 4, characterized in that the method for adjusting a package structure comprises:
When the packaging structure is placed on the base, the adjusting mechanism is controlled to move towards the base so as to adjust the packaging substrate to a set state, wherein the set state is that the deviation of different positions on the packaging substrate relative to the height of the base is smaller than or equal to a set threshold value.
6. The method of claim 5, wherein when the adjustment mechanism includes a push pin mechanism, the ejector pin includes a marking portion, and the package structure adjustment device further includes a camera, the step of controlling the adjustment mechanism to move toward the base to adjust the package substrate to a set state includes:
Acquiring images of at least two thimbles, and acquiring the reference height of the identification part relative to the base; the image is acquired by the camera;
Determining the current height of each identification part relative to the base according to the image position of each identification part in the image; wherein the reference height is less than or equal to the current height;
controlling the ejector pin mechanism to push the ejector pin to move towards the base according to the height difference between the current height and the reference height until the ejector pin in the adjusting mechanism is abutted against the packaging substrate;
And controlling the push pin mechanism to push the ejector pins to move towards the base, so that the ejector pins push the packaging substrate to adjust to a set state.
7. The method of adjusting a package structure of claim 6, wherein when the push pin mechanism includes at least two sub-pushers, the step of controlling the push pin mechanism to push the ejector pin according to a height difference between the current height and the reference height includes:
According to the height difference corresponding to each thimble, each sub pushing piece is controlled to push the corresponding thimble to move towards the base in sequence, so that the height of the identification part of each thimble relative to the base reaches the standard height;
the standard height is the height of all the identification parts corresponding to the horizontal height of the packaging substrate which is completely adjusted in place relative to the base.
8. The method of adjusting a package structure according to claim 7, wherein the step of sequentially controlling each of the sub-pushing members to push the corresponding ejector pin to move toward the base according to the height difference corresponding to each ejector pin comprises:
Determining an adjustment sequence according to a comparison result of the current height corresponding to each thimble; wherein the greater the current height, the more forward the adjustment order;
And according to the height difference corresponding to each thimble, each sub-pushing piece is controlled to push the corresponding thimble to move towards the base in sequence according to the adjustment sequence.
9. The method of adjusting a package structure according to any one of claims 5 to 8, wherein after the step of controlling the adjustment mechanism to move toward the base to adjust the package substrate to a set state, further comprising:
When the packaging substrate reaches a set state, the adjusting mechanism is controlled to stop moving, so that the ejector pins in the adjusting mechanism are static and maintain a state of abutting against the packaging substrate until the bonding layer is solidified.
10. A control device, characterized in that the control device comprises: memory, a processor and a program for adjusting a package structure stored on the memory and executable on the processor, which when executed by the processor, implements the steps of the method for adjusting a package structure according to any one of claims 5 to 9.
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| CN202010718237.9A CN111900108B (en) | 2020-07-23 | 2020-07-23 | Package structure adjusting device, adjusting method and control device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120083686A (en) * | 2011-01-18 | 2012-07-26 | 엘아이지에이디피 주식회사 | Sealing system and method of organic light emitting diode |
| KR20140054651A (en) * | 2012-10-29 | 2014-05-09 | 삼성전기주식회사 | Power module package and method of manufacturing the same |
| CN104975257A (en) * | 2014-04-04 | 2015-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for adjusting levelness of PIN lifting mechanism |
| US9633874B1 (en) * | 2014-07-17 | 2017-04-25 | Altera Corporation | Package substrate warpage reshaping apparatus and method |
| CN207180651U (en) * | 2017-07-19 | 2018-04-03 | 江西凯强实业有限公司 | A kind of flatness detecting device of high density bga substrate |
| KR20180040349A (en) * | 2016-10-12 | 2018-04-20 | 삼성전자주식회사 | Apparatus for correcting a paralleism between a bonding head and a stage and chip bondder including the same |
-
2020
- 2020-07-23 CN CN202010718237.9A patent/CN111900108B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120083686A (en) * | 2011-01-18 | 2012-07-26 | 엘아이지에이디피 주식회사 | Sealing system and method of organic light emitting diode |
| KR20140054651A (en) * | 2012-10-29 | 2014-05-09 | 삼성전기주식회사 | Power module package and method of manufacturing the same |
| CN104975257A (en) * | 2014-04-04 | 2015-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for adjusting levelness of PIN lifting mechanism |
| US9633874B1 (en) * | 2014-07-17 | 2017-04-25 | Altera Corporation | Package substrate warpage reshaping apparatus and method |
| KR20180040349A (en) * | 2016-10-12 | 2018-04-20 | 삼성전자주식회사 | Apparatus for correcting a paralleism between a bonding head and a stage and chip bondder including the same |
| CN207180651U (en) * | 2017-07-19 | 2018-04-03 | 江西凯强实业有限公司 | A kind of flatness detecting device of high density bga substrate |
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|---|---|
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