CN111893530A - Cyanide-free cupronickel-tin electroplating solution and preparation method thereof - Google Patents
Cyanide-free cupronickel-tin electroplating solution and preparation method thereof Download PDFInfo
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- CN111893530A CN111893530A CN202010791525.7A CN202010791525A CN111893530A CN 111893530 A CN111893530 A CN 111893530A CN 202010791525 A CN202010791525 A CN 202010791525A CN 111893530 A CN111893530 A CN 111893530A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Abstract
The invention provides cyanide-free cupronickel-tin electroplating solution, which comprises the following components per liter: 15-20 g of copper pyrophosphate, 10-15 g of tin pyrophosphate, 220-230 g of potassium pyrophosphate, 20-25 g of monopotassium phosphate, 2-3 g of stabilizer, 1-2 g of leveling agent, 5-8 g of complexing agent, 2-5 g of grain refiner and the balance of water. The invention also provides a preparation method of the cyanide-free cupronickel-tin electroplating solution. The cyanide-free cupronickel-tin electroplating solution provided by the invention has better stability and electroplating effect.
Description
Technical Field
The invention relates to an electroplating solution, in particular to a cyanide-free cupronickel-tin electroplating solution and a preparation method thereof.
Background
Copper-tin alloys have become a preferred choice for nickel plating in the electroplating industry because of their good corrosion resistance, ductility, solderability, and good appearance. Copper-tin alloys can be divided into 3 types of low tin (6-15%), medium tin (15-40%) and high tin (> 40%) according to the alloy composition (mass fraction of tin). The high tin-copper-tin alloy is called white copper tin, also called white bronze, and is a metal bond compound; the coating is silvery white, and can effectively prevent the bottom layer metal from diffusing into the surface layer metal and prevent the surface layer metal from fading and changing color. At present, the plating solution for electroplating white copper tin is divided into cyanide system and cyanide-free solution system. Cyanide is a highly toxic chemical substance, but cyanide plating solutions (such as white copper tin plating, gold plating, zinc plating, copper plating and the like) in the electroplating industry have many advantages, such as stable plating solution, strong impurity resistance, good plating layer compactness and low plating solution price. The cyanide system electroplating of cupronickel and tin can cause harm to human beings and the environment, and a great deal of research is carried out by a plurality of scholars and scientific research institutions at home and abroad in order to replace cyanide electroplating.
Chinese patent application CN201810298555.7 discloses "a cyanide-free cupronickel-tin electroplating solution and a preparation method thereof", wherein the cyanide-free cupronickel-tin electroplating solution comprises solvent water and the following components by unit volume: 120-130 g/L of complexing agent, 16-20 g/L of organic copper thiocyanate salt, 2-3 g/L of organic zinc thiocyanate salt, 30-50 g/L of potassium stannate and 8-12 g/L of potassium hydroxide, wherein the complexing agent is polymeric potassium ammonium thiocyanate and has a general formula of (NH)2K)mC2nN2n+1SOnHn+3(ii) a Wherein n is more than or equal to 1 and less than or equal to 50, and m is more than or equal to 1 and less than or equal to 5. The invention has the following problems: the stability and the actual electroplating effect are not good.
Disclosure of Invention
The invention aims to provide a cyanide-free cupronickel-tin electroplating solution which has better stability and electroplating effect.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a cyanide-free cupronickel-tin electroplating solution comprises the following components per liter: 15-20 g of copper pyrophosphate, 10-15 g of tin pyrophosphate, 220-230 g of potassium pyrophosphate, 20-25 g of monopotassium phosphate, 2-3 g of stabilizer, 1-2 g of leveling agent and the balance of water.
Further, the stabilizer of the invention is prepared by the following steps:
and (2) mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide) under the condition of introducing nitrogen, stirring for 30-40 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutyrimidazoline hydrochloride, stirring for reaction for 10-12 hours to obtain a reaction liquid, decompressing the reaction liquid, evaporating DMF, and drying to constant weight to obtain the stabilizer.
Further, in the preparation step of the stabilizer, the ratio of N, N-dimethylcyclohexylamine, glycidyltrimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane, azobisisobutyrimidazoline hydrochloride was 8g:12g:200mL:15g:1 g.
Further, in the step of preparing the stabilizer, the temperature at the time of drying was 100 ℃.
Further, the leveling agent is itaconic acid-sodium styrene sulfonate-acrylic acid copolymer.
Furthermore, the complexing agent is formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to the mass ratio of 2: 1.
Further, the grain refiner is 2-aminobenzothiazole.
Further, the water is deionized water.
The invention also provides a preparation method of the cyanide-free white copper-tin electroplating solution.
In order to solve the technical problems, the technical scheme is as follows:
a preparation method of cyanide-free cupronickel-tin electroplating solution comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 2-3 hours, adding a stabilizer, a leveling agent, a complexing agent and a grain refiner, continuously stirring for 3-4 hours, and filtering with active carbon to obtain the cyanide-free cupronickel-tin electroplating solution.
Further, the stirring speed in the step is 200-300 rpm.
Compared with the prior art, the invention has the following beneficial effects:
1) according to the invention, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and gamma-aminopropyl triethoxysilane are subjected to copolymerization reaction under the initiation action of azobisisobutyrimidazoline hydrochloride to prepare the stabilizer, which not only can improve the stability of the electroplating solution, but also can improve the brightness and hardness of the plating layer and the binding force between the plating layer and a substrate.
2) The invention uses itaconic acid-styrene sodium sulfonate-acrylic acid copolymer as leveling agent, which can not only further improve the hardness of the plating layer, but also improve the leveling property and corrosion resistance of the plating layer.
3) The invention uses the complexing agent formed by mixing the tetrahydroxypropyl ethylenediamine and the carboxymethyl chitosan according to the mass ratio of 2:1, and the complexing agent not only can play a good complexing role, but also can further improve the stability of the electroplating solution.
4) The 2-aminobenzothiazole is used as the grain refiner, so that the corrosion resistance of the plating layer can be further improved besides the good grain refining effect.
Detailed Description
The present invention will be described in detail with reference to specific embodiments, and the exemplary embodiments and descriptions thereof herein are provided to explain the present invention but not to limit the present invention.
Example 1
Each liter of cyanide-free cupronickel-tin electroplating solution comprises the following components: 18g of copper pyrophosphate, 12g of tin pyrophosphate, 225g of potassium pyrophosphate, 21g of monopotassium phosphate, 2.5g of a stabilizer, 1.5g of an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, 6g of a complexing agent formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to a mass ratio of 2:1, 3g of 2-aminobenzothiazole and the balance of deionized water.
Wherein, the stabilizer is prepared by the following steps:
mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide), stirring for 35 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutyrimidazoline hydrochloride, stirring for reaction for 11 hours to obtain a reaction liquid, decompressing the reaction liquid, evaporating DMF, and drying at 100 ℃ to constant weight to obtain a stabilizer; the proportion of N, N-dimethylcyclohexylamine, glycidyltrimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane, azobisisobutyrimidazoline hydrochloride is 8g:12g:200mL:15g:1 g.
The preparation method of the cyanide-free cupronickel-tin electroplating solution comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 2.5 hours, adding a stabilizer, an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, a complexing agent and 2-aminobenzothiazole, continuously stirring for 3.5 hours, and filtering with activated carbon to obtain the cyanide-free cupronickel-tin electroplating solution, wherein the stirring speed is 250 revolutions per minute.
Example 2
Each liter of cyanide-free cupronickel-tin electroplating solution comprises the following components: 16g of copper pyrophosphate, 14g of tin pyrophosphate, 230g of potassium pyrophosphate, 25g of monopotassium phosphate, 2.7g of a stabilizer, 1.2g of an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, 7g of a complexing agent formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to a mass ratio of 2:1, 4g of 2-aminobenzothiazole and the balance of deionized water.
Wherein, the stabilizer is prepared by the following steps:
mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide), stirring for 35 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutylimidazoline hydrochloride, stirring for reaction for 10.5 hours to obtain a reaction liquid, decompressing the reaction liquid, distilling off the DMF, and drying at 100 ℃ to constant weight to obtain a stabilizer; the proportion of N, N-dimethylcyclohexylamine, glycidyltrimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane, azobisisobutyrimidazoline hydrochloride is 8g:12g:200mL:15g:1 g.
The preparation method of the cyanide-free cupronickel-tin electroplating solution comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 3 hours, adding a stabilizer, an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, a complexing agent and 2-aminobenzothiazole, continuously stirring for 4 hours, and filtering with active carbon to obtain the cyanide-free cupronickel-tin electroplating solution, wherein the stirring speed is 200 revolutions per minute.
Example 3
Each liter of cyanide-free cupronickel-tin electroplating solution comprises the following components: 15g of copper pyrophosphate, 15g of tin pyrophosphate, 220g of potassium pyrophosphate, 20g of monopotassium phosphate, 3g of a stabilizer, 1g of itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, 5g of a complexing agent formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to a mass ratio of 2:1, 2g of 2-aminobenzothiazole and the balance of deionized water.
Wherein, the stabilizer is prepared by the following steps:
mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide), stirring for 40 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutyrimidazoline hydrochloride, stirring for reaction for 12 hours to obtain a reaction liquid, decompressing the reaction liquid, evaporating DMF, and drying at 100 ℃ to constant weight to obtain a stabilizer; the proportion of N, N-dimethylcyclohexylamine, glycidyltrimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane, azobisisobutyrimidazoline hydrochloride is 8g:12g:200mL:15g:1 g.
The preparation method of the cyanide-free cupronickel-tin electroplating solution comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 2 hours, adding a stabilizer, an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, a complexing agent and 2-aminobenzothiazole, continuously stirring for 3 hours, and filtering with active carbon to obtain the cyanide-free cupronickel-tin electroplating solution, wherein the stirring speed is 250 revolutions per minute.
Example 4
Each liter of cyanide-free cupronickel-tin electroplating solution comprises the following components: 20g of copper pyrophosphate, 10g of tin pyrophosphate, 228g of potassium pyrophosphate, 23g of monopotassium phosphate, 2g of a stabilizer, 2g of an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, 8g of complex formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to a mass ratio of 2:1, 4g of 2-aminobenzothiazole and the balance of deionized water.
Wherein, the stabilizer is prepared by the following steps:
mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide), stirring for 30 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutyrimidazoline hydrochloride, stirring for 10 hours to obtain a reaction solution, decompressing the reaction solution, evaporating DMF, and drying at 100 ℃ to constant weight to obtain a stabilizer; the proportion of N, N-dimethylcyclohexylamine, glycidyltrimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane, azobisisobutyrimidazoline hydrochloride is 8g:12g:200mL:15g:1 g.
The preparation method of the cyanide-free cupronickel-tin electroplating solution comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 2.5 hours, adding a stabilizer, an itaconic acid-sodium styrene sulfonate-acrylic acid copolymer, a complexing agent and 2-aminobenzothiazole, continuously stirring for 3.5 hours, and filtering with activated carbon to obtain the cyanide-free cupronickel-tin electroplating solution, wherein the stirring speed is 250 revolutions per minute.
Reference example 1:
the difference from example 1 is that: the components lack the stabilizer, and the preparation step is omitted.
Reference example 2:
the difference from example 1 is that: the itaconic acid-sodium styrene sulfonate-acrylic acid copolymer is lacked in the components.
Reference example 3:
the difference from example 1 is that: the components lack a complexing agent formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan in a mass ratio of 2: 1.
Reference example 4:
the difference from example 1 is that: the 2-aminobenzothiazole is absent from the component.
Comparative example: example 1 of chinese patent application No. CN 201810298555.7.
Test example 1: stability test
50mL of each of examples 1 to 4, reference examples 1 to 2 and comparative example was taken, heated to 85 ℃ and then kept warm for 5 minutes, and turbidity and precipitation of each plating solution were observed, and the test results are shown in Table 1:
| example 1 | No turbidity and no generation of precipitate |
| Example 2 | No turbidity and no generation of precipitate |
| Example 3 | No turbidity and no generation of precipitate |
| Example 4 | No turbidity and no generation of precipitate |
| Reference example 1 | Slight turbidity with little precipitation |
| Reference example 2 | No turbidity and no generation of precipitate |
| Reference example 3 | Slight turbidity with little precipitation |
| Reference example 4 | No turbidity and no generation of precipitate |
| Comparative example | Turbidity, generation of large amount of precipitate |
TABLE 1
As can be seen from Table 1, examples 1 to 4 of the present invention were not cloudy and did not produce precipitates, indicating that the present invention has good stability. The partial compositions of referential examples 1 to 4 are different from those of referential example 1, and both referential example 1 and referential example 3 are slightly turbid, and a small amount of precipitate is generated, indicating that both the stabilizer prepared by the present invention and the complexing agent used can improve the stability of the plating solution.
Test example 2: test of coating brightness
The test method comprises the following steps: using a 267mL Heler cell, the volume of the plating solution was 250mL, the anode was 6 cm. times.8 cm stainless steel, the cathode was 10 cm. times.6.5 cm brass, the current was 0.5A, the time was 5 minutes, the temperature was 25 ℃, and the width of the white area of each plating layer was measured after the plating was completed. The larger the width of the white-bright area, the better the brightness, and the test results are shown in table 2:
| width of white bright area (cm) | |
| Example 1 | 9.3 |
| Example 2 | 9.2 |
| Example 3 | 9.1 |
| Example 4 | 9.2 |
| Reference example 1 | 7.5 |
| Reference example 2 | 9.3 |
| Reference example 3 | 9.2 |
| Reference example 4 | 9.3 |
| Comparative example | 7.0 |
TABLE 2
As can be seen from Table 2, the widths of the white bright areas of inventive examples 1-4 are significantly greater than those of the comparative examples, indicating that the coatings obtained using the present invention have better brightness, and example 1 has the best brightness. The partial compositions of reference examples 1 to 4 are different from those of reference example 1 in that the widths of the white-bright regions of reference example 1 are greatly reduced, indicating that the stabilizer prepared by the present invention is a main factor for improving the brightness of the plated layer.
Test example 3: hardness test of plating
The test method comprises the following steps: a640 mL (10 cm. times.8 cm) square tank was used, the volume of the plating solution was 500mL, the anode was 6 cm. times.8 cm stainless steel, the cathode was 10 cm. times.6.5 cm brass, and the current density was 1A/dm2The time is 20 minutes, the temperature is 25 ℃, the microhardness of each plating layer is respectively measured by a microhardness meter after plating is finished, the load is 100g, the load time is 15 seconds, and the test results are shown in table 3:
TABLE 3
As can be seen from Table 3, the microhardness of examples 1-4 of the present invention is significantly higher than that of the comparative examples, indicating that the hardness of the plating layer obtained by using the present invention is higher, and that the hardness of example 1 is the highest. The compositions of reference examples 1 to 4 are different from those of reference example 1 in that the microhardness of reference example 1 and reference example 2 is slightly lowered, indicating that the stabilizer prepared by the present invention and the itaconic acid-sodium styrene sulfonate-acrylic acid copolymer used are effective in increasing the hardness of the plating layer.
Test example 4: plating adhesion test
The plating layers obtained in test example 3 were subjected to scratch tests, and it was observed that peeling did not occur in each plating layer, and the test results are shown in table 4:
| example 1 | No peeling phenomenon |
| Example 2 | No peeling phenomenon |
| Example 3 | No peeling phenomenon |
| Example 4 | No peeling phenomenon |
| Reference example 1 | Peeling phenomenon appears |
| Reference example 2 | No peeling phenomenon |
| Reference example 3 | No peeling phenomenon |
| Reference example 4 | No peeling phenomenon |
| Comparative example | Peeling phenomenon appears |
TABLE 4
As can be seen from Table 4, no peeling occurred in any of examples 1 to 4 of the present invention, indicating that the plating obtained by using the present invention has a good bonding force. The compositions of reference examples 1 to 4 are different from those of reference example 1, and the peeling phenomenon of reference example 1 appears, indicating that the stabilizer prepared by the present invention is a main factor for improving the bonding force of the plating layer.
Test example 5: plating leveling test
The surface morphology of each plating layer obtained in test example 3 was observed with a metallographic microscope, and the test results are shown in table 5:
| example 1 | The surface is flat and has only a few pits |
| Example 2 | The surface is flat and has only a few pits |
| Example 3 | The surface is flat and has only a few pits |
| Example 4 | The surface is flat and has only a few pits |
| Reference example 1 | The surface is flat and has only a few pits |
| Reference example 2 | Rough surface, increased pockmarks and no microcracks |
| Reference example 3 | The surface is flat and has only a few pits |
| Reference example 4 | The surface is flat and has only a few pits |
| Comparative example | Rough surface, increased pock marks and few micro cracks |
TABLE 5
As can be seen from Table 5, the plating layers of examples 1 to 4 of the present invention had smooth surfaces with only a few pits, indicating that the plating layers obtained by using the present invention had good leveling properties. The compositions of reference examples 1 to 4 were partially different from those of reference example 1, and the surface of the plating layer of reference example 2 was rough, the number of pits was increased, and microcracks were not generated, indicating that the itaconic acid-sodium styrene sulfonate-acrylic acid copolymer used in the present invention is a main factor for improving the leveling property of the plating layer.
Test example 6: corrosion resistance test of plating
The test method comprises the following steps: a640 mL (10 cm. times.8 cm) square tank was used, the volume of the plating solution was 500mL, the anode was 6 cm. times.8 cm stainless steel, the cathode was 10 cm. times.6.5 cm iron piece, and the current density was 1A/dm2The time is 20 minutes, the temperature is 25 ℃, salt spray tests are respectively carried out on the plating layers after plating, the test temperature is 30 ℃, the mass concentration of a sodium chloride solution is 5%, the time from the beginning of the salt spray test to the occurrence of red rust of each plating layer is measured, the longer the time of the red rust occurrence is, the better the corrosion resistance is, and the test results are shown in table 6:
TABLE 6
As can be seen from Table 6, the red rust development times of inventive examples 1-4 are significantly longer than those of comparative examples, indicating that the corrosion resistance of the plating layers obtained using the present invention is better. The compositions of reference examples 1 to 4 were partially different from those of example 1, and the red rust occurrence time was shortened by 1 hour in both reference example 2 and reference example 4, indicating that both the kojic acid-sodium styrenesulfonate-acrylic acid copolymer and 2-aminobenzothiazole used in the present invention can improve the corrosion resistance of the plating layer.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. The cyanide-free cupronickel-tin electroplating solution is characterized in that: each liter of cyanide-free cupronickel-tin electroplating solution comprises the following components: 15-20 g of copper pyrophosphate, 10-15 g of tin pyrophosphate, 220-230 g of potassium pyrophosphate, 20-25 g of monopotassium phosphate, 2-3 g of stabilizer, 1-2 g of leveling agent, 5-8 g of complexing agent, 2-5 g of grain refiner and the balance of water.
2. The cyanide-free cupronickel-tin plating solution as recited in claim 1, wherein: the stabilizer is prepared by the following steps:
and (2) mixing N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride and DMF (dimethyl formamide) under the condition of introducing nitrogen, stirring for 30-40 minutes, adding gamma-aminopropyltriethoxysilane, heating to 95 ℃, adding azobisisobutyrimidazoline hydrochloride, stirring for reaction for 10-12 hours to obtain a reaction liquid, decompressing the reaction liquid, evaporating DMF, and drying to constant weight to obtain the stabilizer.
3. The cyanide-free cupronickel-tin plating solution as set forth in claim 2, characterized in that: in the preparation step of the stabilizer, the proportion of N, N-dimethylcyclohexylamine, glycidol trimethylammonium chloride, DMF, gamma-aminopropyltriethoxysilane and azobisisobutyrimidazoline hydrochloride is 8g to 12g to 200mL to 15g to 1 g.
4. The cyanide-free cupronickel-tin plating solution as set forth in claim 2, characterized in that: in the preparation step of the stabilizer, the temperature during drying is 100 ℃.
5. The cyanide-free cupronickel-tin plating solution as recited in claim 1, wherein: the leveling agent is itaconic acid-sodium styrene sulfonate-acrylic acid copolymer.
6. The cyanide-free cupronickel-tin plating solution as recited in claim 1, wherein: the complexing agent is formed by mixing tetrahydroxypropyl ethylenediamine and carboxymethyl chitosan according to the mass ratio of 2: 1.
7. The cyanide-free cupronickel-tin plating solution as recited in claim 1, wherein: the grain refiner is 2-aminobenzothiazole.
8. The cyanide-free cupronickel-tin plating solution as recited in claim 1, wherein: the water is deionized water.
9. The method for preparing a cyanide-free cupronickel-tin electroplating solution as claimed in any one of claims 1 to 8, wherein: the method comprises the following steps:
weighing the components according to the formula, adding copper pyrophosphate, tin pyrophosphate, potassium pyrophosphate and potassium dihydrogen phosphate into water, stirring for 2-3 hours, adding a stabilizer, a leveling agent, a complexing agent and a grain refiner, continuously stirring for 3-4 hours, and filtering with active carbon to obtain the cyanide-free cupronickel-tin electroplating solution.
10. The method for preparing a cyanide-free cupronickel-tin plating solution as recited in claim 9, wherein: the stirring speed in the step is 200-300 r/min.
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| CN101618616A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Zinc alloy product and preparation method thereof |
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| CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
| CN104480501A (en) * | 2014-11-28 | 2015-04-01 | 广东致卓精密金属科技有限公司 | High-tin copper-tin alloy electroplating solution and process for barrel plating |
| CN108203837A (en) * | 2018-04-04 | 2018-06-26 | 临海市伟星电镀有限公司 | A kind of no cyamelide copper and tin electroplate liquid and its preparation method |
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- 2020-08-07 CN CN202010791525.7A patent/CN111893530A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101618616A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Zinc alloy product and preparation method thereof |
| JP2011042841A (en) * | 2009-08-21 | 2011-03-03 | Kizai Kk | Cyan-free gloss copper-tin alloy plating bath |
| CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
| CN104480501A (en) * | 2014-11-28 | 2015-04-01 | 广东致卓精密金属科技有限公司 | High-tin copper-tin alloy electroplating solution and process for barrel plating |
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Application publication date: 20201106 |