CN111890240A - Ultra-precise jet polishing device and method for complex surface device - Google Patents
Ultra-precise jet polishing device and method for complex surface device Download PDFInfo
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- CN111890240A CN111890240A CN202010885619.0A CN202010885619A CN111890240A CN 111890240 A CN111890240 A CN 111890240A CN 202010885619 A CN202010885619 A CN 202010885619A CN 111890240 A CN111890240 A CN 111890240A
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- 238000005498 polishing Methods 0.000 title claims abstract description 255
- 238000000034 method Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims abstract description 138
- 239000007921 spray Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000007517 polishing process Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 5
- 238000011084 recovery Methods 0.000 claims description 21
- 238000003756 stirring Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 9
- 230000010349 pulsation Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 230000003116 impacting effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 239000002086 nanomaterial Substances 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- 230000033228 biological regulation Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000001139 pH measurement Methods 0.000 claims 1
- 230000029219 regulation of pH Effects 0.000 claims 1
- 239000000243 solution Substances 0.000 description 68
- 230000003287 optical effect Effects 0.000 description 6
- 239000012535 impurity Substances 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
- B24C5/04—Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
- B24C7/0015—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier with control of feed parameters, e.g. feed rate of abrasive material or carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
- B24C7/0015—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier with control of feed parameters, e.g. feed rate of abrasive material or carrier
- B24C7/0023—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier with control of feed parameters, e.g. feed rate of abrasive material or carrier of feed pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
- B24C9/006—Treatment of used abrasive material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses an ultra-precise jet polishing device for a complex-profile device, which comprises a liquid supply system and a polishing nozzle component arranged on a six-axis motion platform, wherein the liquid supply system sprays premixed polishing liquid onto the surface of a workpiece to be processed, which is fixed on a workbench, through a jet nozzle at a specified pressure and speed, particles in the polishing liquid interact with the surface of the workpiece to be processed to perform nano removal of materials, and finally, the removal and finishing of the surface material of the workpiece to be processed are realized. The jet nozzle has various different structural forms of an eccentric single-hole structure, an eccentric porous structure and a non-eccentric porous structure, and can be selected according to requirements. The jet polishing device disclosed by the invention is used for polishing, so that a liquid supply system can provide stable polishing liquid with pressure, concentration, temperature, flow, pH value and the like in the ultra-precise jet polishing process of a complex-profile device, and the polishing quality of the surface of a workpiece is ensured.
Description
Technical Field
The invention belongs to the technical field of surface polishing, and particularly relates to an ultra-precise polishing device and method for a complex-profile device.
Background
With the development of modern optical industry and optical technology, aspheric optical elements are widely used in the fields of advanced optical telescope, high-sensitivity sensing, high-resolution image pickup and the like due to their excellent optical characteristics. The demand for high performance and high quality optical components with complex profiles is increasing, which places increasing demands on the processing equipment and processing technology of complex profile parts. There are many polishing methods for complex profile devices, such as abrasive water jet polishing, but the prior art has many deficiencies. Because the removal rate of the jet flow polishing material is relatively low, the processing time is long, and the concentration, the temperature, the pressure, the pH value and other parameters of the polishing solution cannot be guaranteed to be unchanged in the processing process, the polishing quality cannot be guaranteed. For complex-profile devices, the machine tool is required to have sufficient degrees of freedom during machining to complete the machining of each surface. In addition, the single nozzle is not easy to obtain an ideal removal function in the machining process, the polishing quality is influenced, and the machining efficiency of the single nozzle is low.
Disclosure of Invention
Aiming at the prior art, the invention aims to solve the defects in the prior jet polishing technology, ensure that a liquid supply system can provide stable polishing liquid with pressure, concentration, temperature, flow, pH value and the like in the ultra-precise jet polishing process of a complex-profile device, and ensure the polishing quality of the surface of a workpiece; the liquid supply system sprays the premixed polishing liquid to the surface of the workpiece through the polishing nozzle component at a specified pressure and speed, and nano-removal of materials is carried out by utilizing the interaction of particles in the suspension and the workpiece, so that the purposes of material removal and finishing processing are finally realized. Different devices can be processed by switching the single-nozzle arrays with different sizes and the multi-nozzle arrays with different types, so that the processing requirements of different devices are met, and the polishing efficiency is greatly improved; the six-axis motion platform can enable the nozzle to move with 6 degrees of freedom, and can meet the processing requirements of complex-profile devices.
In order to solve the technical problems, the ultra-precise jet polishing device for the complex-profile device comprises a liquid supply system and a polishing nozzle component arranged on a six-axis moving platform, wherein the liquid supply system sprays premixed polishing liquid onto the surface of a workpiece to be processed fixed on a workbench through a jet nozzle at a specified pressure and speed, particles in the polishing liquid interact with the surface of the workpiece to be processed to remove nano materials, and finally the removal and the trimming processing of surface materials of the workpiece to be processed are realized.
Further, the ultra-precise jet polishing device for the complex-profile device, provided by the invention,
the liquid supply system comprises a polishing liquid supply control system, a stirring device, a precise water chiller, a concentration compensation device, a pH adjusting device, a polishing liquid container, a pressure and flow adjusting device, an output pump, a pressure gauge, a concentration measuring device, a temperature sensor, a flow sensor and a pH measuring device; the precision water chiller, the concentration compensation device and the PH adjusting device are all connected with the polishing solution container through liquid supply pipelines, the stirring device is arranged in the polishing solution container, the input end of the output pump is connected with the polishing solution container, and the output end of the output pump conveys the polishing solution to the input end of the rotary joint of the polishing nozzle component through the liquid supply pipelines; the workbench is provided with a polishing solution backflow output port, and the polishing solution backflow output port and the polishing solution container are connected to the recovery device through a polishing solution recovery pipeline; the polishing solution supply control system controls the states of the stirring device, the precise water cooler, the concentration compensation device, the PH adjusting device and the pressure and flow adjusting device according to the acquired data signals so as to ensure that the liquid supply system sprays premixed polishing solution onto the surface of a workpiece to be processed through the jet nozzle at specified pressure, concentration, temperature, PH value and speed.
And a filter I is arranged on a liquid supply pipe section between the output pump and the polishing liquid container, and a filter II is arranged on a polishing liquid recovery pipe section between the recovery device and the polishing liquid container.
And a damper is arranged on the liquid supply pipeline section between the output pump and the polished nozzle part so as to reduce the pressure pulsation and flow pulsation of the liquid supply pipeline and ensure the stable pressure and flow of the sprayed polishing liquid.
And an overflow valve is arranged on the liquid supply pipe section between the damper and the polished nozzle part, so that the pressure overload protection of the liquid supply system is realized.
The polishing nozzle component comprises a rotary joint, a rotating main shaft, a jet nozzle and a penetrating motor; the rotating main shaft is a hollow shaft, one end of the rotating main shaft is connected with the output end of the rotating joint, and the other end of the rotating main shaft is connected with the jet nozzle; the penetrating motor comprises a hollow rotor and a stator, wherein the hollow rotor is sleeved on the rotating main shaft and is fixedly connected with the rotating main shaft through threaded connection; an upper end cover and a lower end cover are respectively fixed at the upper end and the lower end of the stator; rolling bearings are respectively arranged between the upper end cover and the rotating main shaft, and between the lower end cover and the rotating main shaft; when the hollow rotor rotates, power is transmitted to the rotating main shaft, so that the hollow rotor and the jet flow nozzle are driven to rotate; meanwhile, the output end of the rotary joint rotates along with the rotating main shaft, and the input end of the rotary joint is fixed; during polishing, firstly, the polishing nozzle component is arranged on the six-axis motion platform, the liquid supply system conveys polishing liquid to the input end of the rotary joint through a liquid supply pipeline, then the polishing liquid enters the hollow cavity of the rotary main shaft through the output end of the rotary joint, and the polishing liquid reaches the jet flow nozzle through the hollow cavity of the rotary main shaft and is sprayed to the surface of a workpiece through the spray hole of the jet flow nozzle at certain pressure and speed.
The six-axis motion platform is provided with a sliding block, a first connecting rod and a second connecting rod, the sliding block is connected with one end of the first connecting rod, the other end of the first connecting rod is connected with one end of the second connecting rod, the other end of the second connecting rod is connected with one end plate of a right-angle support mounting seat, and the polished nozzle component is fixed on the other end plate of the right-angle support mounting seat.
The jet flow nozzle comprises a main body, a polishing liquid channel and a liquid collecting cavity which are coaxially communicated with the hollow cavity of the rotating main shaft are arranged in the main body from top to bottom, and jet flow spray holes are formed in the bottom of the liquid collecting cavity; according to the structural form of jet spray holes arranged at the bottom of the liquid collecting cavity, the jet nozzle has the following conditions:
1) eccentric single-hole structure's jet nozzle: the number of the jet flow spray holes is one, the center of each jet flow spray hole is eccentric relative to the axis of the polishing liquid channel, and the axis of each jet flow spray hole is inclined to the lower end face of the jet flow nozzle; during polishing, the jet nozzle rotates under the drive of the rotating main shaft, and jet flow sprayed by the jet nozzle rotates around a removing spot formed on a workpiece, so that the jet flow of the polishing solution forms a Gaussian-like removing function.
2) Eccentric porous structure jet nozzle: the number of the jet flow spray holes is multiple, the extension lines of the axes of the jet flow spray holes intersect at a point O, the point O is on the axis of the polishing solution channel, and the point O is positioned below the jet flow spray holes; during polishing, the distance between the jet nozzle and the workpiece is adjusted to enable the point O to fall on the surface of the workpiece, and the jet nozzle rotates under the driving of the rotating main shaft, so that polishing liquid jet forms a Gaussian removal function, and the polishing efficiency is improved.
3) Non-eccentric porous structure jet nozzle: the number of the jet flow spray holes is multiple, the axes of the jet flow spray holes are perpendicular to the lower end face of the jet flow nozzle, and during polishing, the jet flow nozzle rotates under the driving of the rotating main shaft, so that the surface of a workpiece is homogenized and removed, and efficient polishing is realized.
The ultra-precise jet polishing device for the complex-profile device, disclosed by the invention, is characterized in that the aperture of the jet orifice is 0.05-5 mm; the included angle between the axis of the jet orifice of the jet nozzle and the lower end face of the jet nozzle is 30-90 degrees.
Meanwhile, the invention also provides a polishing method using the ultra-precise jet polishing device for the complex-profile device, which comprises the following steps:
step 1: selecting a proper jet nozzle, installing the proper jet nozzle at the lower end of the rotating main shaft, assembling a polishing nozzle component, installing the polishing nozzle component on a six-shaft moving platform through an installation component, clamping a workpiece to be polished on a proper position of a workbench, adjusting the position of the workpiece, and clamping the workpiece; starting the moving platform, and adjusting the relative positions of the jet nozzle and the workpiece;
step 2: starting a stirring device, adding a proper amount of prepared polishing solution into a polishing solution container, and starting an output pump after the polishing solution is uniformly stirred; the pressure, concentration, flow, temperature and PH value of the polishing solution are set through a polishing solution supply control system, the proper rotating speed of the jet flow nozzle is set according to the material, surface shape and size characteristics of a workpiece to be polished, and the nozzle starts to rotate;
and step 3: the pressurized polishing solution is sprayed out from the jet flow nozzle, at the moment, the polishing solution is not stable, the polishing solution supply control system is controlled in a closed loop mode, after the pressure, the concentration, the temperature, the PH value and the flow of the polishing solution are stable, the six-axis motion platform is started, the motion platform is adjusted, a machining program is operated, the jet flow is sprayed onto a workpiece, the surface of the workpiece is impacted, and polishing machining is started; the motion track of the jet nozzle in the polishing process is controlled by a numerical control system of the six-axis motion platform, and accurate polishing is realized by controlling the residence time and the motion track of the nozzle;
and 4, step 4: and after impacting the surface of the workpiece, the polishing solution flows into the recovery device, and enters the polishing solution container again through the polishing solution recovery pipeline for cyclic utilization.
Compared with the prior art, the invention has the beneficial effects that:
(1) the ultra-precise jet polishing device for the complex-profile device, provided by the invention, adopts closed-loop control, can ensure the stability of the pressure, concentration, flow, temperature and PH value of the polishing solution in the jet polishing process, and improves the processing quality of the surface of a workpiece.
(2) The device can polish the surface of a device with a complex profile by adjusting the relative position between the nozzle and the workpiece through the six-axis motion platform.
(3) In the machining process, the device can be suitable for machining different workpieces by replacing single nozzles with different sizes and multi-nozzle arrays with different types, so that the workpiece polishing efficiency is greatly improved.
Drawings
FIG. 1 is a schematic view of a liquid supply system of the ultra-precise jet polishing device for complex-profile devices according to the present invention;
FIG. 2 is a three-dimensional schematic view of a motion platform of the ultra-precise jet polishing device for the complex-profile device according to the present invention;
FIG. 3 is a front view of a motion platform of the ultra-precise jet polishing device for complex-profile devices according to the present invention;
FIG. 4 is a schematic view of the construction of a polished nozzle unit according to the present invention;
FIG. 5-1 is a schematic view of a jet nozzle of the polished nozzle section of the present invention in the form of a first configuration;
FIG. 5-2 is a schematic view of a second embodiment of the jet nozzle of the polished nozzle section of the present invention;
FIGS. 5-3 are schematic illustrations of a third form of construction of the jet nozzle of the polished nozzle assembly of the present invention;
fig. 6 is a schematic view of the structure of the nozzle mounting part of the present invention.
In the figure:
1-polishing liquid supply control system 2-stirring device 3-precision water chiller
4-concentration compensation device 5-PH adjusting device 6-polishing solution container
7-pressure and flow regulating device 8-filter I9-output pump
10-filter II 11-pressure gauge 12-concentration measuring device
13-temperature sensor 14-flow sensor 15-PH measuring device
16-damper 17-overflow valve 18-recovery device
20-polished nozzle part 21-rotary joint 22-hollow rotating shaft
23-upper end cap 24-first rolling bearing 25-rotor
26-stator 27-second rolling bearing 28-lower end cap
29-sealing gasket 30-jet nozzle 101-polishing solution channel
102-liquid collecting cavity 103-jet flow orifice 104-annular groove
31-slide 32-first link 33-second link
34-right-angle support mounting seat 41-base 42-workbench
Detailed Description
The invention will be further described with reference to the following figures and specific examples, which are not intended to limit the invention in any way.
The invention provides an ultra-precise jet polishing device for a complex-profile device, which comprises a liquid supply system and a polishing nozzle component 20 arranged on a six-axis motion platform, wherein the liquid supply system sprays premixed polishing liquid onto the surface of a workpiece to be processed, which is fixed on a workbench 42, through a polishing nozzle at a specified pressure and speed, particles in the polishing liquid interact with the surface of the workpiece to be processed to remove nano materials, and finally, the removal and the finishing of the surface material of the workpiece to be processed are realized.
As shown in fig. 1, the liquid supply system comprises a polishing liquid supply control system 1, a stirring device 2, a precision water chiller 3, a concentration compensation device 4, a PH adjusting device 5, a polishing liquid container 6, a pressure and flow adjusting device 7, an output pump 9, a pressure gauge 11, a concentration measuring device 12, a temperature sensor 13, a flow sensor 14 and a PH measuring device 15; the precision water chiller 3, the concentration compensation device 4 and the PH adjusting device 5 are all connected with the polishing solution container 6 through liquid supply pipelines, the stirring device 2 is arranged in the polishing solution container 6, the input end of the output pump 9 is connected with the polishing solution container 6, and the output end of the output pump 9 conveys the polishing solution to the input end of the rotary joint 21 of the polishing nozzle component 20 through the liquid supply pipelines; the workbench 42 is provided with a polishing solution backflow output port, and the polishing solution backflow output port and the polishing solution container 6 are connected to the recovery device 18 through a polishing solution recovery pipeline; the pressure gauge 11, the concentration measuring device 12, the temperature sensor 13, the flow sensor 14 and the PH measuring device 15 are disposed on a liquid supply pipe section at an outlet of the output pump 9, and are configured to collect related data signals, and feed back the collected data signals to the polishing liquid supply control system 1, and the polishing liquid supply control system 1 controls states of the stirring device 2, the precision water chiller 3, the concentration compensating device 4, the PH adjusting device 5 and the pressure and flow adjusting device 7 according to the collected data signals, including:
1) when the pressure gauge 11 detects that the pressure of the polishing liquid in the system changes, the polishing liquid supply control system 1 can adjust the pressure of the polishing liquid through the pressure adjusting device 7, so that the pressure of the polishing liquid is ensured to be stable.
2) When the concentration measuring device 12 detects the change of the concentration of the polishing liquid, the polishing liquid supply control system 1 can adjust the concentration of the polishing liquid through the concentration compensation device 4, thereby ensuring the concentration of the polishing liquid to be stable.
3) When the flow sensor 14 detects that the flow rate of the polishing liquid changes, the polishing liquid supply control system 1 can adjust the flow rate of the polishing liquid by adjusting the output flow rate and the speed of the output pump 9, thereby ensuring the flow rate of the polishing liquid to be stable.
4) When the temperature of the polishing liquid rises due to environmental changes, the temperature sensor 13 feeds back a signal to the polishing liquid supply control system 1, and the polishing liquid supply control system 1 can control the precision water chiller to adjust the temperature of the polishing liquid, thereby ensuring the temperature of the polishing liquid to be stable.
5) When the PH measuring device 15 detects that the PH value of the polishing solution changes, the polishing solution supply control system 1 can adjust the PH value of the polishing solution through the PH adjusting device 5, thereby ensuring that the PH value of the polishing solution is stable.
Thereby realizing that the liquid supply system sprays the premixed polishing liquid to the surface of the workpiece to be processed through the jet nozzle at the specified pressure, concentration, temperature, PH value and speed.
The stirring device 2 is used for stirring the polishing solution in the polishing solution container 6, and can prevent the abrasive of the polishing solution from depositing and influencing the concentration of the polishing solution.
The output pump 9 pumps the polishing liquid out of the polishing liquid container 6 through a pipeline and pressurizes the polishing liquid. Be equipped with filter I8 on the delivery pump 9 with the feed pipe section between the polishing solution container 6, filter I8 can filter the impurity in the polishing solution container 6, prevent that impurity from to the delivery pump 9, feed pipe way and jet nozzle 30 cause the damage.
In order to reduce the vibration of the system, a damper 16 is arranged on the liquid supply pipeline section between the output pump 9 and the polishing nozzle component 20, when the system is interfered to cause the pressure and the flow of the polishing liquid in the liquid supply pipeline to pulsate, the damper 16 can eliminate the vibration of the liquid supply pipeline, reduce the pressure pulsation and the flow pulsation of the pressurized polishing liquid, and ensure the pressure and the flow of the polishing liquid ejected by the jet nozzle 30 to be stable, thereby ensuring the polishing quality of the workpiece.
In order to ensure the safety of the system and prevent the pressure of the pipeline from being overlarge, an overflow valve 17 is arranged on the liquid supply pipeline section between the damper 16 and the polished nozzle component 20, when the pressure of the polishing liquid in the liquid supply pipeline is increased to exceed a set value due to the failure of the liquid supply system, the overflow valve 17 can overflow part of the polishing liquid to reduce the pressure in the liquid supply pipeline, so that the pressure overload protection of the liquid supply system is realized, and the safety of the liquid supply system is ensured.
The polishing solution can be recycled, so that the processing cost is reduced. The polishing solution jetted by the jet flow nozzle flows into the polishing solution recovery device 18 below the workbench 42 after impacting the surface of the workpiece, and flows back to the polishing solution container 6 through the polishing solution recovery pipeline to circulate, and the recovery device 18 and the polishing solution recovery pipeline section connected with the polishing solution container 6 are provided with the filter II 10, so that impurities can be filtered out, and the impurities are prevented from entering the polishing solution container.
As shown in fig. 2 and 3, the polished nozzle component 20 of the present invention is mounted on a six-axis motion platform by a right-angle support mount 34; the six-axis motion platform is provided with a sliding block 31, a first connecting rod 32 and a second connecting rod 33, the sliding block 31 is assembled on the six-axis motion platform, one end of the first connecting rod 32 is fixed on the sliding block 31, the other end of the second connecting rod 33 is connected with one end of the first connecting rod 32, the other end of the second connecting rod 32 is fixed with one end plate of the right-angle support mounting seat 34, and the lower end cover 28 of the polished nozzle component 20 is fixed on the other end plate of the right-angle support mounting seat 34.
As shown in fig. 4, the polished nozzle part 20 includes a rotary joint 21, a rotary spindle 22, a jet nozzle 30, and a through motor; the rotating main shaft 22 is a hollow shaft, one end of the rotating main shaft 22 is connected with the output end of the rotating joint 21, and the other end of the rotating main shaft 22 is connected with the jet nozzle 30; the penetrating motor comprises a hollow rotor 25 and a stator 26, wherein the hollow rotor 25 is sleeved on the rotating main shaft 22 and fixedly connected with the rotating main shaft 22 through threaded connection; an upper end cover 23 and a lower end cover 28 are respectively fixed at the upper end and the lower end of the stator 26; rolling bearings are respectively arranged between the upper end cover 23 and the rotating main shaft and between the lower end cover 28 and the rotating main shaft; when the hollow rotor 25 rotates, the power is transmitted to the rotating main shaft 22, so that the jet nozzle 30 is driven to rotate; meanwhile, the output end of the rotary joint 21 rotates along with the rotating main shaft 22, and the input end of the rotary joint 21 is fixed; during polishing, firstly, the polishing nozzle component 20 is mounted on a six-axis motion platform, the liquid supply system delivers polishing liquid to the input end of the rotary joint 21 through a liquid supply pipeline, and then the polishing liquid enters the hollow cavity of the rotary main shaft 22 through the output end of the rotary joint 21, reaches the jet nozzle 30 through the hollow cavity of the rotary main shaft 22, and is sprayed to the surface of a workpiece through the spray hole of the jet nozzle 30 at a certain pressure and speed.
As shown in fig. 5-1, 5-2 and 5-3, the jet nozzle 30 includes a main body, a polishing liquid channel 101 and a liquid collecting cavity 102 are formed in the main body from top to bottom, the polishing liquid channel and the liquid collecting cavity are coaxially communicated with the hollow cavity of the rotating main shaft 22, and jet spray holes 103 are formed in the bottom of the liquid collecting cavity 102. The jet nozzle 30 can be replaced with a single nozzle of different size or a multi-nozzle array of different types depending on the surface shape and size characteristics of the polished workpiece. The single nozzle is used for processing the micro-miniature workpiece, the multi-nozzle array is used for processing a larger workpiece, and the multi-nozzle array is suitable for different workpieces, so that the polishing efficiency is improved. According to the structural form of jet spray holes arranged at the bottom of the liquid collecting cavity 102, the jet nozzle has the following conditions:
1) eccentric single-hole structure's jet nozzle: as shown in fig. 5-1, the number of the jet nozzle holes 103 is one, the center of the jet nozzle hole 103 is eccentric with respect to the axis of the polishing liquid channel 101, and the axis of the jet nozzle hole 103 is inclined to the lower end surface of the jet nozzle; during polishing, the jet nozzle 30 is rotated under the driving of the rotating main shaft 22, and the jet flow ejected by the jet nozzle 30 rotates around the removal spot formed on the workpiece, so that the polishing solution jet flow forms a gaussian-like removal function.
2) Eccentric porous structure jet nozzle: as shown in fig. 5-2, the number of the jet injection holes 103 is multiple, and the extension lines of the axes of the jet injection holes 103 intersect at a point O, which is on the axis of the polishing liquid channel 101 and is located below the jet injection holes 103; during polishing, the distance between the jet nozzle and the workpiece is adjusted to enable the point O to fall on the surface of the workpiece, and the jet nozzle 30 rotates under the driving of the rotating main shaft 2, so that the jet of the polishing solution forms a Gaussian removal function, and the polishing efficiency is improved.
3) Non-eccentric porous structure jet nozzle: as shown in fig. 5-3, the number of the jet nozzles 103 is multiple, the axes of the jet nozzles 103 are perpendicular to the lower end surface of the jet nozzle, and during polishing, the jet nozzle 30 is rotated under the driving of the rotating spindle 2, so as to remove the workpiece surface by homogenization and achieve efficient polishing.
The aperture of the jet flow spray hole is 0.05-5 mm; the included angle between the axis of the jet orifice of the jet nozzle 30 and the lower end face of the jet nozzle is 30-90 degrees.
The six-axis motion platform used in the present invention has X, Y, Z three degrees of freedom for linear motion and A, B, C three degrees of freedom for rotation. Comprises a base 41 and a workbench 42, wherein the workbench 42 can move along the X-axis direction; the workbench can rotate around the C-axis direction; the motion platform can drive the nozzle to move along the Y-axis direction and the Z-axis direction; the motion stage may adjust the angle between the nozzle and the workpiece through the rotational axis A, B; the motion platform has 6 degrees of freedom, and can finish surface polishing of the complex-profile device.
The ultra-precise jet polishing device for the complex-profile device, disclosed by the invention, is used for polishing, as shown in figures 1, 2 and 3, and comprises the following steps,
step 1: selecting a proper jet nozzle 30, installing the proper jet nozzle 30 at the lower end of a rotating main shaft 22, assembling a polishing nozzle component 20, installing the jet nozzle component 20 on a six-axis moving platform through an installation component, clamping a workpiece to be polished on a proper position of a workbench 42, adjusting the position of the workpiece, and clamping the workpiece; starting the moving platform, and adjusting the relative positions of the jet nozzle 30 and the workpiece; avoiding the jet nozzle 30 from shooting the workpiece.
Step 2: starting the stirring device 2, adding a proper amount of prepared polishing solution into the polishing solution container 6, and starting the output pump 9 after the polishing solution is uniformly stirred; the pressure, concentration, flow, temperature and PH value of the polishing solution are set through the polishing solution supply control system 1, the proper rotating speed of the jet nozzle 30 is set according to the material, surface shape and size characteristics of a workpiece to be polished, and the nozzle starts to rotate;
and step 3: the pressurized polishing solution is sprayed out from the jet flow nozzle, at the moment, the polishing solution is not stable, the polishing solution supply control system is controlled in a closed loop mode, after the pressure, the concentration, the temperature, the PH value and the flow of the polishing solution are stable, the six-axis motion platform is started, the motion platform is adjusted, a machining program is operated, the jet flow is sprayed onto a workpiece, the surface of the workpiece is impacted, and polishing machining is started; the motion track of the jet nozzle in the polishing process is controlled by a numerical control system of the six-axis motion platform, and accurate polishing is realized by controlling the residence time and the motion track of the nozzle;
and 4, step 4: after impacting the surface of the workpiece, the polishing solution flows into the recovery device 18, and enters the polishing solution container 6 again through the polishing solution recovery pipeline for recycling.
While the present invention has been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are illustrative only and not restrictive, and various modifications which do not depart from the spirit of the present invention and which are intended to be covered by the claims of the present invention may be made by those skilled in the art.
Claims (10)
1. The ultra-precise jet polishing device for the complex-profile device is characterized by comprising a liquid supply system and a polishing nozzle component (20) arranged on a six-axis motion platform, wherein the liquid supply system sprays premixed polishing liquid onto the surface of a workpiece to be processed, which is fixed on a workbench, through the polishing nozzle component at a specified pressure and speed, particles in the polishing liquid interact with the surface of the workpiece to be processed to remove nano materials, and finally the removal and the finishing of surface materials of the workpiece to be processed are realized.
2. The ultra-precise jet polishing device for the complex-profile device according to claim 1, wherein the liquid supply system comprises a polishing liquid supply control system (1), a stirring device (2), a precise water chiller (3), a concentration compensation device (4), a PH regulation device (5), a polishing liquid container (6), a pressure and flow regulation device (7), an output pump (9), a pressure gauge (11), a concentration measurement device (12), a temperature sensor (13), a flow sensor (14) and a PH measurement device (15);
the precision water chiller (3), the concentration compensation device (4) and the PH adjusting device (5) are connected with the polishing solution container (6) through liquid supply pipelines, the stirring device (2) is arranged in the polishing solution container (6), the input end of the output pump (9) is connected with the polishing solution container (6), and the output end of the output pump (9) conveys the polishing solution to the input end of a rotary joint (21) of the polishing nozzle component (20) through the liquid supply pipelines;
the workbench is provided with a polishing solution backflow output port, and the polishing solution backflow output port and the polishing solution container (6) are connected to the recovery device (18) through a polishing solution recovery pipeline;
the polishing liquid supply system is characterized in that the pressure gauge (11), the concentration measuring device (12), the temperature sensor (13), the flow sensor (14) and the PH measuring device (15) are arranged on a liquid supply pipe section at the outlet of the output pump (9) and used for collecting related data signals and feeding back the collected data signals to the polishing liquid supply control system (1), and the polishing liquid supply control system (1) controls the states of the stirring device (2), the precise water cooling machine (3), the concentration compensating device (4), the PH adjusting device (5) and the pressure and flow adjusting device (7) according to the collected data signals so as to ensure that the liquid supply system sprays premixed polishing liquid to the surface of a workpiece to be processed through the jet nozzle at specified pressure, concentration, temperature, PH value and speed.
3. The ultra-precise jet polishing device for complex-profile devices according to claim 2, wherein a filter i (8) is provided on a liquid supply line section between the output pump (9) and the polishing liquid container (6), and a filter ii (10) is provided on a polishing liquid recovery line section where the recovery device (18) is connected to the polishing liquid container (6).
4. The ultra-precise jet polishing device for the complex-profile device according to claim 2, wherein a damper (16) is arranged on the liquid supply pipeline section between the output pump (9) and the polishing nozzle component (20) to reduce pressure pulsation and flow pulsation of the liquid supply pipeline and ensure stable pressure and flow of the sprayed polishing liquid.
5. The ultra-precise jet polishing device for the complex-profile device according to claim 4, wherein an overflow valve (17) is arranged on a liquid supply pipeline section between the damper (16) and the polished nozzle component (20), so that pressure overload protection of a liquid supply system is realized.
6. The ultra-precise jet polishing device for complex-profile devices according to claim 1, wherein the polished nozzle part (20) comprises a rotary joint (21), a rotary spindle (22), a jet nozzle (30) and a through motor; the rotating main shaft (22) is a hollow shaft, one end of the rotating main shaft (22) is connected with the output end of the rotating joint (21), and the other end of the rotating main shaft (22) is connected with the jet nozzle (30);
the penetrating type motor comprises a hollow rotor (25) and a stator (26), wherein the hollow rotor (25) is sleeved on the rotating main shaft (22) and is fixedly connected with the rotating main shaft (22) through threaded connection; an upper end cover (23) and a lower end cover (28) are respectively fixed at the upper end and the lower end of the stator (26); rolling bearings are respectively arranged between the upper end cover (23) and the rotating main shaft as well as between the lower end cover (28) and the rotating main shaft; when the hollow rotor (25) rotates, power is transmitted to the rotating main shaft (22) so as to drive the jet nozzle (30) to rotate; meanwhile, the output end of the rotary joint (21) rotates along with the rotating main shaft (22), and the input end of the rotary joint (21) is fixed;
during polishing, firstly, a polishing nozzle component (20) is arranged on a six-axis motion platform, the liquid supply system conveys polishing liquid to the input end of the rotary joint (21) through a liquid supply pipeline, then the polishing liquid enters the hollow cavity of the rotary main shaft (22) through the output end of the rotary joint (21), and the polishing liquid reaches the jet flow nozzle (30) through the hollow cavity of the rotary main shaft (22) and is sprayed to the surface of a workpiece through the spray hole of the jet flow nozzle (30) at a certain pressure and speed.
7. The ultra-precise jet polishing device for the complex-profile device according to claim 6, wherein a sliding block (31), a first connecting rod (32) and a second connecting rod (33) are arranged on the six-axis motion platform, the sliding block (31) is connected with one end of the first connecting rod (32), the other end of the first connecting rod (32) is connected with one end of the second connecting rod (33), the other end of the second connecting rod (33) is connected with one end plate of a right-angle support mounting seat (34), and the polished nozzle component (20) is fixed on the other end plate of the right-angle support mounting seat (34).
8. The ultra-precise jet polishing device for the complex-profile device, according to claim 1, is characterized in that the jet nozzle (30) comprises a main body, a polishing liquid channel (101) and a liquid collecting cavity (102) which are coaxially communicated with the hollow cavity of the rotating main shaft (22) are arranged in the main body from top to bottom, and a jet spray hole (103) is formed in the bottom of the liquid collecting cavity (102);
according to the structural form of jet spray holes arranged at the bottom of the liquid collecting cavity (102), the jet nozzle has the following conditions:
1) eccentric single-hole structure's jet nozzle: the number of the jet flow spray holes (103) is one, the center of each jet flow spray hole (103) is eccentric relative to the axis of the polishing liquid channel (101), and the axis of each jet flow spray hole (103) is inclined to the lower end face of the jet flow nozzle; during polishing, the jet nozzle (30) rotates under the drive of the rotating main shaft (22), and jet flow sprayed by the jet nozzle (30) rotates around a removal spot formed on a workpiece, so that the polishing solution jet flow forms a Gaussian removal function.
2) Eccentric porous structure jet nozzle: the number of the jet flow spray holes (103) is multiple, the extension lines of the axes of the jet flow spray holes (103) intersect at a point O, the point O is on the axis of the polishing liquid channel (101), and the point O is positioned below the jet flow spray holes (103); during polishing, the distance between the jet nozzle and the workpiece is adjusted to enable the point O to fall on the surface of the workpiece, and the jet nozzle (30) rotates under the driving of the rotating main shaft (2), so that the jet of the polishing solution forms a Gaussian removal function, and the polishing efficiency is improved.
3) Non-eccentric porous structure jet nozzle: the number of the jet flow spray holes (103) is multiple, the axes of the jet flow spray holes (103) are perpendicular to the lower end face of the jet flow nozzle, and during polishing, the jet flow nozzle (30) rotates under the driving of the rotating main shaft (2), so that the surface of a workpiece is homogenized and removed, and efficient polishing is realized.
9. The ultra-precise jet polishing device for the complex-profile device according to claim 8, wherein the diameter of the jet orifice is 0.05-5 mm; the included angle between the axis of the jet orifice of the jet nozzle (30) and the lower end face of the jet nozzle is 30-90 degrees.
10. An ultra-precise jet polishing method for a complex-profile device, characterized in that, by using the ultra-precise jet polishing device for a complex-profile device as claimed in any one of claims 1 to 9, the steps of jet polishing are as follows:
step 1: selecting a proper jet flow nozzle (30), installing the proper jet flow nozzle at the lower end of a rotating main shaft (22), assembling a polishing nozzle component (20), installing the polishing nozzle component (20) on a six-axis moving platform through an installation component, clamping a workpiece to be polished on a proper position of a workbench (42), adjusting the position of the workpiece, and clamping the workpiece; starting the moving platform, and adjusting the relative positions of the jet nozzle (30) and the workpiece;
step 2: starting the stirring device (2), adding a proper amount of prepared polishing solution into the polishing solution container (6), and starting the output pump (9) after the polishing solution is uniformly stirred; the pressure, concentration, flow, temperature and PH value of the polishing solution are set through the polishing solution supply control system (1), the proper rotating speed of the jet nozzle (30) is set according to the characteristics of the material, surface shape and size of a workpiece to be polished, and the nozzle starts to rotate;
and step 3: the pressurized polishing solution is sprayed out from the jet flow nozzle, at the moment, the polishing solution is not stable, the polishing solution supply control system is controlled in a closed loop mode, after the pressure, the concentration, the temperature, the PH value and the flow of the polishing solution are stable, the six-axis motion platform is started, the motion platform is adjusted, a machining program is operated, the jet flow is sprayed onto a workpiece, the surface of the workpiece is impacted, and polishing machining is started; the motion track of the jet nozzle in the polishing process is controlled by a numerical control system of the six-axis motion platform, and accurate polishing is realized by controlling the residence time and the motion track of the nozzle;
and 4, step 4: after impacting the surface of the workpiece, the polishing solution flows into a recovery device (18) and enters a polishing solution container (6) again through a polishing solution recovery pipeline for cyclic utilization.
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| CN113183043A (en) * | 2021-06-02 | 2021-07-30 | 浙江工业大学 | Strong-constraint high-speed jet polishing device |
| CN113478395A (en) * | 2021-06-02 | 2021-10-08 | 浙江工业大学 | Replaceable high-speed strong-constraint abrasive particle jet polishing device |
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| CN114713854A (en) * | 2022-06-07 | 2022-07-08 | 西安交通大学 | Surface post-treatment device for fusion forming of complex curved surface laser powder bed |
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