CN111886120B

CN111886120B - Resin material for injection molding

Info

Publication number: CN111886120B
Application number: CN201880060434.7A
Authority: CN
Inventors: 加藤秀和; 岩本道尚; 富永泰裕; 田中高广; 浜田辉幸
Original assignee: Mazda Motor Corp
Current assignee: Mazda Motor Corp
Priority date: 2018-03-30
Filing date: 2018-03-30
Publication date: 2022-05-31
Anticipated expiration: 2038-03-30
Also published as: WO2019187071A1; JPWO2019187071A1; US11691324B2; JP7021698B2; EP3674056A1; US20200238585A1; CN111886120A; EP3674056A4

Abstract

The injection molding apparatus includes: an injection machine; forming a mould; and a high-frequency oscillation device. The injection molding machine injects a resin material mixed with a dielectric heat generating material while making the resin material have fluidity by temperature control. The molding die has a cavity as a flow path of the resin material, and has a pair of electrodes facing the cavity, respectively, the pair of electrodes being provided in a state of sandwiching the resin material in a direction intersecting with a flow direction of the resin material. The high-frequency oscillation device applies a high-frequency alternating voltage between a pair of electrodes.

Description

Resin material for injection molding

Technical Field

The present invention relates to an injection molding apparatus, an injection molding method, and a resin material for injection molding.

Background

An injection molding apparatus is an apparatus that injects a resin material having fluidity into a mold and cures the filled resin material to manufacture a resin product. Such an injection molding apparatus has been widely used since the past.

For example, patent document 1 discloses an injection molding apparatus including: the resin melting device is provided with a high-frequency oscillator, and the resin melting device is used for injecting a resin material with fluidity into a molding die and reducing the temperature of the resin in the molding die so as to manufacture a resin product.

In the resin melting apparatus disclosed in patent document 1, only the resin material of the extrusion portion located immediately before the nozzle connected to the molding die in the resin flow direction is heated and melted.

Further, patent document 2 discloses a structure in which a heater is attached to a mold to ensure the fluidity of a resin material injected into the mold. With this configuration, the fluidity of the resin material in the mold can be ensured, and the resin product can have excellent product quality.

Documents of the prior art

Patent literature

Patent document 1: japanese patent laid-open publication No. 2014-113699

Patent document 2: japanese laid-open patent publication No. 2000-127175

Disclosure of Invention

However, in the case of the technique disclosed in patent document 2, the entire mold needs to be heated and cooled to cure the resin material filled in the mold, and the tact time is long and the energy efficiency is low. Therefore, the technique disclosed in patent document 2 still has room for improvement from the viewpoint of production efficiency.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an injection molding apparatus, an injection molding method, and a resin material for injection molding, which can manufacture a high-quality resin product by ensuring high fluidity of the resin material in a mold, and can reduce production costs.

An injection molding apparatus according to an aspect of the present invention includes: an injection molding machine which injects a resin material mixed with a dielectric heating material while the resin material has fluidity by temperature control; a forming die having a cavity as a flow path of the resin material and having a pair of electrodes respectively opposed to the cavity, the pair of electrodes being provided in a state of sandwiching the resin material in a direction intersecting a flow direction of the resin material; and a high-frequency oscillation device for applying a high-frequency alternating voltage to the pair of electrodes.

Drawings

Fig. 1 is a schematic diagram showing a configuration of an injection molding apparatus according to an embodiment.

Fig. 2 is a schematic sectional view showing a partial structure of a molding die.

Fig. 3 is a schematic diagram showing the structure of a cavity formed in a molding die.

Fig. 4 is a schematic diagram illustrating the principle of heat generation of the resin material.

Fig. 5 is a timing chart showing a control method of the high-frequency voltage and the injection pressure by the control unit of the injection molding apparatus.

Fig. 6 is a schematic diagram showing the temperature and pressure of the resin material in the mold during injection.

Fig. 7 is a schematic diagram showing the temperature and pressure of the resin material in the mold during pressure holding.

Fig. 8 shows a chemical formula of the dielectric exothermic material.

Fig. 9A is a schematic view showing a state of cations before movement in the dielectric exothermic material.

Fig. 9B is a schematic diagram showing a state of cations after migration in the dielectric exothermic material.

Detailed Description

The embodiments are described below with reference to the drawings. The embodiment described below is merely one embodiment of the present invention, and the present invention is not limited to the embodiment described below except for the essential structure.

[ embodiment ]

1. Structure of injection molding apparatus 1

The structure of the injection molding apparatus 1 according to the present embodiment will be described with reference to fig. 1.

As shown in fig. 1, an injection molding apparatus 1 according to the present embodiment includes: a forming die 10; an injection unit (injector) 20; a high-frequency oscillation unit (high-frequency oscillation device) 30; and a control unit 60.

The molding die 10 has a movable die 11 and a fixed die 12, and a cavity 10a is formed between the movable die 11 and the fixed die 12. The movable mold 11 can be clamped to the fixed mold 12 and separated from the fixed mold 12 by driving a driving mechanism, not shown.

The movable mold 11 has: a die main body 111 made of a metal material; an electrode 112 provided on the mold main body 111 in a state of facing the chamber 10 a; and an insulator 113 disposed between the die main body 111 and the electrode 112. A cooling pipe 114 through which a cooling liquid (cooling medium) flows is embedded in the electrode 112.

The fixed mold 12 has: a die main body 121 made of a metal material; an electrode 122 provided on the mold body 121 in a state of facing the chamber 10 a; and an insulator 123 disposed between the die body 121 and the electrode 122. A cooling pipe 124 through which a cooling liquid (cooling medium) flows is embedded in the electrode 122.

The electrode 112 and the electrode 122 are provided to face each other with the chamber 10a interposed therebetween. In a state where the movable mold 11 and the fixed mold 12 are clamped, the insulator 113 or the insulator 123 is sandwiched between the electrode 112 and the electrode 122.

Further, the insulator 113 and the insulator 123 respectively include, for example, a silicon-based binder or a ceramic.

The injection unit 20 includes a cylinder 21, a propeller 22, an injection cylinder 23, a nozzle 24, and a cylinder heater 25. The nozzle 24 communicates with the chamber 10a of the molding die 10. The resin material supplied from a hopper (not shown) into the cylinder 21 is given fluidity by heat from the cylinder heater 25, and is ejected from the nozzle 24 into the chamber 10a while the screw 22 is driven to advance by the ejection cylinder 23.

Further, the cylinder 21 is grounded.

The high-frequency oscillation unit 30 applies a high-frequency ac voltage between the electrode 112 and the electrode 122, and includes a power supply 31, an oscillator 32, a matching box 33, and

feeder lines

34 and 35. In the present embodiment, the frequency of the high-frequency ac voltage of the

counter electrodes

112 and 122 generated by the high-frequency oscillation means 30 is set to 27MHz, as an example.

Here, the earth leakage breaker 41 is inserted in the feed path of the feed line 34, and the earth leakage breaker 42 is inserted in the feed line 35. The feeder 35 is grounded at a portion on the side close to the electrode 112 with respect to the portion where the earth leakage breaker 42 is inserted.

The control unit 60 executes drive control of the shooting pot 23 and the cylinder heater 25, control of the high-frequency oscillation unit 30, and the like. Although the detailed illustration of the control unit 60 is omitted, the control unit 60 includes a computer including, for example: a CPU, various programs executed on the CPU (a basic control program such as an OS, various application programs that are started on the OS and execute specific functions, and the like), a memory such as a ROM or a RAM for storing programs and various data, and the like.

Further, cooling liquid circulating means (cooling medium supply means) 51 and 52 for circulating cooling liquid (cooling medium) through the

cooling pipes

114 and 124 are connected to the injection molding apparatus 1. Earth leakage disconnection valves 43 to 46 are inserted in the coolant circulation paths between the

coolant circulation units

51, 52 and the movable mold 11 and the fixed mold 12.

The injection molding apparatus 1 further includes: a temperature sensor 71 for detecting the temperature of the electrode 112; a temperature sensor 72 for detecting the temperature of the electrode 122; a temperature sensor 73 for detecting the temperature of the resin material in the cylinder 21. The temperature sensors 71 to 73 sequentially transmit the detected temperature data to the control unit 60 during driving of the injection molding apparatus 1. The control unit 60 that has received the temperature data performs feedback control of the cylinder heater 25 and the high-frequency oscillation unit 30 using the data.

2. Application of high-frequency ac voltage E to resin material 70 introduced into chamber 10a

The application of the high-frequency ac voltage E to the resin material 70 introduced into the chamber 10a will be described with reference to fig. 2. Fig. 2 is a schematic sectional view showing an enlarged partial structure of the molding die 10.

First, the resin material 70 used in the injection molding apparatus 1 according to the present embodiment is a resin material mixed with a dielectric heating material (dielectric heating material). Details thereof will be described later.

As described above, the electrode 112 and the electrode 122 are disposed so as to face the chamber 10 a. Therefore, a high-frequency ac voltage E is applied to the resin material 70 introduced into the chamber 10a and flowing in the chamber 10a as indicated by an arrow.

Since the resin material 70 contains a dielectric heat generating material, it generates heat when a high-frequency ac voltage E is applied. Therefore, the resin material 70 maintains fluidity in the chamber 10a in a state where the high-frequency ac voltage E is applied.

3. Structure of chamber 10a

The structure of the cavity 10a provided in the mold 10 will be described with reference to fig. 3. Fig. 3 is a schematic diagram showing the structure of a cavity 10a provided in the mold 10.

As shown in fig. 3, in the injection molding apparatus 1 according to the present embodiment, the cavity 10a of the mold 10 is formed in the following shape as an example: two

bent portions

10d, 10e are provided between the base flow point portion 10b and the terminal flow point portion 10c, and have a substantially U-shape in plan view.

The resin material 70 injected from the nozzle 24 of the injection unit 20 flows from the base flow point 10b to the final flow point 10c through the

bent portions

10d and 10 e.

Here, although not shown in detail, in the mold 10, the

electrodes

112 and 122 extend over the entire flow path of the resin material 70 from the flow base point portion 10b to the flow end point portion 10 c. That is, the resin material 70 flowing in the cavity 10a of the molding die 10 can be applied with the high-frequency ac voltage E from the flow base point portion 10b to the flow end point portion 10 c.

4. Application of high-frequency alternating voltage E to resin material 70 and heat generation principle of resin material 70

The application of the high-frequency ac voltage E to the resin material 70 and the principle of heat generation of the resin material 70 will be described with reference to fig. 4. Fig. 4 is a schematic diagram illustrating the heat generation principle of the resin material 70.

As shown in fig. 4, the resin material 70 used in the injection molding apparatus 1 according to the present embodiment is a resin material in which a dielectric exothermic material 702 is mixed with a base material 701. As an example, a thermoplastic resin such as a polyolefin resin or a polyamide resin can be used as the base material 701.

As an example of the dielectric heat generating material 702, a resin material having a structure obtained by polymerizing a polyolefin-based monomer or a polyamide-based monomer with a polyether monomer can be used. The detailed structure of the resin material 70 will be described later.

As shown in fig. 4, when a high-frequency ac voltage E is applied to the resin material 70 by the high-frequency oscillation 30, an electromagnetic wave WR propagates through the resin material 70. When the electromagnetic wave WR propagates in the resin material 70, the mixed dielectric exothermic material 702 generates heat by deforming (moving) the molecular chains based on the electromagnetic wave WR, and the heat is conducted to the base material 701.

Based on the above principle, the resin material 70 in the chamber 10a generates heat when the high-frequency ac voltage E is applied thereto.

5. Injection molding method

An injection molding method using the injection molding apparatus 1 will be described with reference to fig. 5 to 7. Fig. 5 is a time chart showing the timing of applying the high-frequency ac voltage and the passage of the injection pressure per unit time, which are executed by the control unit 60, in the injection molding performed by the injection molding apparatus 1. Fig. 6 is a characteristic diagram showing the temperature and pressure of the resin material 70 in the cavity 10a at the time of injection, and fig. 7 is a characteristic diagram showing the temperature and pressure of the resin material 70 at the time of pressure holding after the resin material 70 is filled in the cavity 10 a.

As shown in fig. 5, at a time T1 when the power supply of the injection molding apparatus 1 is turned on, the controller 60 instructs the high-frequency oscillation means 30 to apply a high-frequency ac voltage E1 between the

electrodes

112, 122.

At a time T1, the control unit 60 instructs the injection unit 20 to increase the injection pressure LP toward P1. Thereby, the injection pressure LP is boosted to the pressure P1 at the period T2.

Although not shown, when the injection molding apparatus 1 is used to perform injection molding, the control unit 60 issues a command to set the cylinder heater 25 in the "on" state and set the resin material 70 in the cylinder 21 in the fluidized state.

Next, after a period T2 in which the cavity 10a is filled with the resin material 70, the control unit 60 instructs the high-frequency oscillation unit 30 to maintain the high-frequency ac voltage E at the same specified value LE as the period from the period T1 to the period T2, and also instructs the injection unit 20 to apply the injection pressure P2 of a specified value for a specified time up to the period T3.

The period from the period T2 to the period T3 shown in fig. 5 is referred to as a dwell period.

Next, as shown in fig. 6, during the injection from the time T1 to the time T2, the temperature LTp of the resin material 70 is maintained at a predetermined value Tp1 at which the resin material has fluidity over the entire region from the flow base point portion Pos1 (corresponding to the flow base point portion 10 b) to the flow end point portion Pos2 (corresponding to the flow end point portion 10 c) in the chamber 10a, based on the application of the high-frequency ac voltage E of the predetermined value LE.

On the other hand, during the injection from the time T1 to the time T2, the pressure LPr of the resin material 70 in the chamber 10a becomes the pressure P3 at the flow base point Pos1, and gradually decreases toward the flow end point Pos 2.

Next, as shown in fig. 7, during the dwell time from the period T2 to the period T3, the high-frequency alternating voltage E based on the specified value LE is continuously applied, and the temperature LTp of the resin material 70 in the chamber 10a is maintained at the temperature Tp 1. During the pressure holding period from the time T2 to the time T3, the injection unit 20 is continuously driven, and the pressure LPr of the resin material 70 in the chamber 10a reaches the pressure P2 at a substantially predetermined value over the entire region in the chamber 10a from the base point of flow Pos1 to the end point of flow Pos 2.

6. Constitution of resin Material 70

As described above, the injection molding apparatus 1 according to the present embodiment uses the resin material 70 including the base 701 and the dielectric heat generating material 702. The composition of the resin material 70 will be described with reference to fig. 8. Fig. 8 shows a chemical formula of the dielectric exothermic material 702.

First, the following two types are assumed as the resin material 70.

(1) First kind

The substrate 701 is a polyolefin resin selected from HIPS (high impact polystyrene), PP (polypropylene), LDPE (low density polyethylene), HDPE (high density polyethylene), m-PPE (modified polyphenylene ether), and PMMA (propylene).

Dielectric heating material 702 in the chemical formula shown in fig. 8, a is a polyolefin-based monomer, and B is a polyether monomer. In the first category, the following dielectric exothermic material 702 is used: the resin material is a resin material obtained by polymerizing a polyolefin monomer and a polyether monomer, and cations are retained in the polyether moiety.

(2) Second kind

The substrate 701 is a polyamide resin selected from ABS (acrylonitrile/butadiene/styrene copolymerized synthetic resin), PC/ABS (polycarbonate/acrylonitrile/butadiene/styrene mixed resin), PC (polycarbonate), POM (polyacetal), PA6 (polyamide 6), PA12 (polyamide 12), and PA66 (polyamide 66).

Dielectric heating material 702 in the chemical formula shown in fig. 8, a is a polyamide-based monomer, and B is a polyether monomer. In the second category, the following dielectric exothermic material 702 is used: the resin material is a resin material obtained by polymerizing a polyamide monomer and a polyether monomer, and the polyether moiety retains a cation.

7. Heating of the dielectric heating material 702 by applying a high-frequency alternating voltage E

The heat generation mechanism of the resin material 70 by the application of the high-frequency ac voltage E will be described with reference to fig. 9A and 9B. Fig. 9A is a schematic diagram showing a state of the dielectric heat generating material 702 immediately after the application of the high-frequency ac voltage E is started, and fig. 9B is a schematic diagram showing a state after the cations M + of the dielectric heat generating material 702 move based on the application of the high-frequency ac voltage E.

When a high-frequency ac voltage E is applied to the resin material 70 including the dielectric exothermic material 702, the electromagnetic wave WR also propagates to the dielectric exothermic material 702 (see fig. 4), and the cations M + at the positions shown in fig. 9A move as shown in fig. 9B.

When the cation M + moves from the position shown in fig. 9A to the position shown in fig. 9B, the molecular chain of the dielectric heat generating material 702 is deformed (moved). Accordingly, the dielectric heat generating material 702 generates heat, which is conducted to the base material 701.

The resin material 70 for injection molding of the injection molding apparatus 1 according to the present embodiment is applied with the high-frequency ac voltage E to increase its temperature, thereby maintaining its fluidity.

[ modified examples ]

In the above embodiment, the resin material 70 is a thermoplastic resin material, but the technique according to the present invention is not limited thereto. It may be a resin material having thermosetting properties. When a thermosetting resin material is injected, a high-frequency ac voltage is applied to cure the resin material.

In the above embodiment, the resin material 70 flowing in the cavity 10a is kept in fluidity by dielectric heating, and therefore, one injection unit 20 is connected to the mold 10. Since the temperature of the resin material flowing in the chamber can be made substantially equal over the entire area in the chamber, even if a technique of connecting two or more injection units is adopted, a defect in a filament shape is less likely to occur, and excellent appearance quality can be obtained.

In the above embodiment, the mold 10 is configured by combining one fixed mold 12 and one movable mold 11, but the technique according to the present invention is not limited thereto. For example, a mold formed by combining three or more molds may be used.

In the above embodiment, the pair of

electrodes

112 and 122 is provided between the flow starting point portion 10b and the flow ending point portion 10c of the cavity 10a of the mold 10, but the technique according to the present invention is not limited thereto. For example, a plurality of pairs of electrodes arranged at intervals may be provided in the flow direction of the resin material in the chamber.

In addition, the electrode pair may not be provided at a portion where discharge in air is likely to occur due to the shape of the chamber or the like.

[ summary of the invention ]

In the injection molding apparatus according to the above-described aspect, the following configuration is adopted: a resin material mixed with a dielectric exothermic material is used as the resin material to be injected, and a pair of electrodes are provided so as to face the chamber, and a high-frequency ac voltage is applied between the pair of electrodes. Therefore, in the injection molding apparatus according to the above aspect, the application control of the high-frequency ac voltage can be performed on the resin material that is injected from the injection machine and flows in the cavity, and the resin material can ensure high fluidity based on the application control of the high-frequency ac voltage.

Here, when the matrix material is a thermoplastic resin material as the resin material to be injected, the dielectric heat generating material generates heat by applying a high-frequency ac voltage to the resin material flowing through the cavity, and the fluidity of the resin material can be ensured.

On the other hand, when the matrix material is a thermosetting resin material as the resin material to be injected, the resin material can be cured by heat generated by the dielectric heat generating material by applying a high-frequency ac voltage in a state where the cavity is filled with the resin material.

In the injection molding apparatus according to the above aspect, the fluidity is ensured by controlling the temperature of the resin material flowing in the cavity, not by heating the entire mold, thereby reducing energy loss, and the resin material can be cured by controlling the application of the high-frequency ac voltage after the resin material is filled in the cavity.

Therefore, in the injection molding apparatus according to the above-described aspect, a high-quality resin product can be manufactured by ensuring high fluidity of the resin material in the mold, and the production cost can be reduced.

In the injection molding apparatus according to another aspect of the present invention, the mold includes a fixed mold and a movable mold fitted to each other, the fixed mold and the movable mold each include a mold body, one of the pair of electrodes is attached to the mold body of the fixed mold with an insulator interposed therebetween, and the other of the pair of electrodes is attached to the mold body of the movable mold with an insulator interposed therebetween.

In the injection molding apparatus according to this aspect, since the electrodes are attached to the mold main body via the insulator between the two mold bodies, namely the fixed mold and the movable mold, leakage of electromagnetic waves to the outside of the mold bodies can be suppressed when a high-frequency ac voltage is applied.

In an injection molding apparatus according to another aspect of the present invention, in the above aspect, at least one of the pair of electrodes has a cooling passage through which a cooling medium flows, and the injection molding apparatus further includes: and a cooling medium supply device for supplying a cooling medium to the cooling passage.

In the injection molding apparatus according to this aspect, since the electrode is provided with the cooling passage, even if heat of the resin material generated by dielectric heat generation is conducted to the electrode, the electrode can be cooled by the supply of the cooling medium. Therefore, in the injection molding apparatus according to the above-described aspect, the temperature of the resin material flowing in the cavity can be adjusted more accurately, and when the resin material is solidified and the product is taken out from the mold, the resin material and the mold can be cooled by supplying the cooling medium, and the tact time can be shortened. Therefore, the injection molding apparatus according to the above-described aspect is advantageous in that higher productivity can be achieved.

In the injection molding apparatus according to another aspect of the present invention, in the above aspect, the pair of electrodes is provided from an upstream end to a downstream end of the chamber in the flow direction.

In the injection molding apparatus according to this aspect, since the pair of electrodes is provided from the upstream end to the downstream end in the flow direction of the resin material in the cavity, the temperature of the resin material can be controlled over the entire region in the cavity.

An injection molding apparatus according to another aspect of the present invention is the injection molding apparatus described above, further including: a control unit that controls the injection of the resin material from the injection machine and controls the application of the high-frequency ac voltage by the high-frequency oscillation device; wherein the control section controls the injection machine in such a manner that: after the resin material is filled into the entire cavity, the injection pressure is continuously applied into the cavity for a prescribed time.

In the injection molding apparatus according to this aspect, since the pressure holding period (the predetermined time described above) is provided after the resin material is filled in the cavity, the pressure of the resin material can be made uniform over the entire area of the cavity until the resin material is cured. Accordingly, the injection molding apparatus according to the above-described aspect can uniformize shrinkage of the resin material at the time of curing over the entire cavity, and is advantageous in producing a high-quality resin product.

Another aspect of the present invention relates to an injection molding method including: an injection step of injecting a resin material into which a dielectric heat generating material is mixed, while the resin material is made to have fluidity by temperature control; a flowing step of flowing the resin material injected in the injecting step in a cavity formed in a molding die; and a high-frequency ac voltage application step of applying a high-frequency ac voltage to the resin material flowing in the chamber.

The injection molding method according to the technical scheme adopts the following scheme: a resin material mixed with a dielectric heat generating material is used as the resin material to be ejected, and in the high-frequency ac voltage applying step, a high-frequency ac voltage can be applied to the resin material flowing in the chamber. Therefore, in the injection molding method according to the above aspect, the resin material that is injected from the injection molding machine and flows in the cavity is controlled to be applied with the high-frequency ac voltage, and the resin material that flows in the cavity is controlled to be maintained at high fluidity by the application of the high-frequency ac voltage.

Here, as described above, when the base material is a thermoplastic resin material as the resin material to be injected, the dielectric heat generating material generates heat by applying a high-frequency ac voltage to the resin material flowing through the cavity, and the fluidity of the resin material can be ensured.

In the injection molding method according to this aspect, the resin material flowing in the cavity is temperature-controlled in the high-frequency ac voltage application step, instead of heating the entire mold, to ensure the fluidity of the resin material, thereby reducing energy loss, and the resin material can be cured by simply applying the high-frequency ac voltage after the resin material is filled in the cavity.

Therefore, in the injection molding method according to this aspect, a high-quality resin product can be produced by ensuring high fluidity of the resin material in the mold, and the production cost can be reduced.

In the injection molding method according to another aspect of the present invention, in the high-frequency ac voltage applying step, the high-frequency ac voltage is applied to the resin material that flows from an upstream end to a downstream end of the chamber in the flow direction.

In the injection molding method according to this aspect, since the pair of electrodes is provided from the upstream end to the downstream end in the flow direction of the resin material in the cavity, the temperature of the resin material can be controlled over the entire region in the cavity in the high-frequency ac voltage applying step.

As an injection molding method according to another aspect of the present invention, the injection molding method further includes: and a pressure holding step of continuing to apply an injection pressure into the cavity for a predetermined time after the resin material is filled into the entire cavity in the injection step.

In the injection molding method according to this aspect, since the pressure holding step is provided, the pressure of the resin material can be made uniform over the entire cavity until the resin material is cured after the resin material is filled into the cavity. Accordingly, the injection molding method according to the above-described aspect is advantageous in that shrinkage of the resin material during curing can be made uniform over the entire cavity, and a high-quality resin product can be produced.

As an injection molding method according to another aspect of the present invention, the injection molding method further includes: a cooling step of cooling the resin material filled in the cavity by supplying a cooling medium to a cooling passage provided in the mold after the pressure holding step is performed.

In the injection molding method according to this aspect, since the cooling step is provided, even if the heat of the resin material generated by the dielectric heat generation is conducted to the electrode, the cooling step can be performed to cool the electrode. Therefore, in the injection molding method according to the above-described aspect, the temperature of the resin material flowing in the cavity can be adjusted more accurately, and when the resin material is solidified and the product is taken out from the mold, the resin material and the mold can be cooled by supplying the cooling medium, and the tact time can be shortened. Therefore, the injection molding method according to the above-described aspect is advantageous in that higher productivity can be achieved.

Another aspect of the present invention relates to a resin material for injection molding, which is charged into the injection molding apparatus and includes: a base material containing a polyolefin resin or a polyamide resin; and a dielectric heating material capable of moving cations by applying the high-frequency alternating voltage.

The resin material according to this aspect includes the following dielectric heat generating material: the cations are moved (moved) based on the electromagnetic wave propagated in the resin material by the high-frequency alternating voltage being applied. Therefore, when the resin material according to the above-described aspect is injection-molded, the high-frequency ac voltage is applied to the resin material filled in the cavity, thereby moving (moving) the cations of the dielectric heat generating material. Thus, the resin material according to the above-described aspect is advantageous in that the fluidity of the base material is controlled based on the heat generated by the dielectric heating element, and a high-quality resin product is produced.

Further, in the resin material according to the above-described aspect, by including the dielectric heat generating material having the above-described structure, it is possible to control the fluidity of the resin material by applying only a high-frequency ac voltage to the resin material without heating the entire mold. Thus, the resin material according to the above-described aspect can be molded with excellent thermal efficiency during injection molding, and can also shorten the tact time.

In the injection molding resin material according to another aspect of the present invention, the base material is a polyolefin resin selected from HIPS, PP, LDPE, HDPE, m-PPE, and PMMA, and the dielectric heat generating material is a resin material obtained by polymerizing a polyolefin monomer and a polyether monomer with each other, and the cation is held in the polyether portion.

In the injection molding resin material according to another aspect of the present invention, the base material is a polyamide resin selected from ABS, PC/ABS, PC, POM, PA6, PA12, and PA66, and the dielectric heat generating material is a resin material obtained by polymerizing a polyamide monomer and a polyether monomer with each other, and the cation is held in the polyether portion.

As described above, in the case of employing the technique of the present invention, a high-quality resin product can be manufactured by ensuring high fluidity of the resin material in the mold, and the production cost can be reduced.

Claims

1. A resin material for injection molding, which is to be charged into an injection molding apparatus, characterized in that:

the injection molding apparatus includes:

an injection molding machine that injects the resin material for injection molding while making the injected resin material have fluidity by temperature control;

a mold having a cavity as a flow path of the resin material for injection molding and having a pair of electrodes facing the cavity, respectively, the pair of electrodes being provided in a state of being spaced apart from the resin material for injection molding in a direction intersecting with a flow direction of the resin material for injection molding; and

a high-frequency oscillation device for applying a high-frequency alternating voltage to the pair of electrodes,

the resin material for injection molding includes:

a base material comprising a polyolefin resin selected from HIPS, PP, LDPE, HDPE, m-PPE and PMMA; and

the dielectric heating material includes a resin material obtained by polymerizing a polyolefin monomer and a polyether monomer with each other.

2. A resin material for injection molding, which is to be charged into an injection molding apparatus, characterized in that:

the injection molding apparatus includes:

the resin material for injection molding comprises:

a base material comprising a polyamide-based resin selected from ABS, PC/ABS, PC, POM, PA6, PA12, and PA 66; and

the dielectric heating material includes a resin material obtained by polymerizing a polyamide monomer and a polyether monomer with each other.