CN111885843A - Dismounting device of SOP encapsulation integrated circuit chip - Google Patents
Dismounting device of SOP encapsulation integrated circuit chip Download PDFInfo
- Publication number
- CN111885843A CN111885843A CN202010800697.6A CN202010800697A CN111885843A CN 111885843 A CN111885843 A CN 111885843A CN 202010800697 A CN202010800697 A CN 202010800697A CN 111885843 A CN111885843 A CN 111885843A
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- groove
- fixedly connected
- movable
- dismounting
- sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Abstract
The invention discloses a dismounting device of an SOP packaged integrated circuit chip, which comprises a dismounting structure, wherein a baking structure is arranged in the dismounting structure, a movable groove is arranged in the middle of the inside of the dismounting structure, a movable post is movably connected in the movable groove in a telescopic manner, the bottom end of the dismounting structure is detachably connected with a limiting structure, and the top ends of the two side walls of the dismounting structure, which are far away from each other, are connected with a filtering structure respectively. And the self volume of the dismounting structure is smaller than that of the dismounting structure, and the dismounting structure is convenient to operate.
Description
The technical field is as follows:
the invention belongs to the technical field of relevant structures of circuit chip dismounting equipment, and particularly relates to a dismounting device for an SOP (self-aligned Passive optical) packaged integrated circuit chip.
Background art:
SOP encapsulation integrated circuit chip is the integrated form chip of installing on the circuit board, and the similar chip kind along with the development of science and technology is many, can both see this type of chip on the circuit board, through installing this type of chip on the circuit board, can effectual improvement circuit board's performance, and install different chips also can the time the circuit board deal with the field of the application of different operational environment and application.
At present, most of the chips are soldered on the circuit board, which results in that the current chips are cumbersome to detach and can be detached only by using special professional equipment, and the size of the equipment is generally large, which results in that a large number of whole circuit boards are discarded due to the damage of the chips, which can directly increase the production cost, and the directly discarded circuit boards can also generate certain negative effects on the surrounding environment.
The invention content is as follows:
the invention aims to provide a dismounting device for SOP packaged integrated circuit chips, which can effectively solve the technical problems that the chips are mostly welded on a circuit board by a baking structure and an auxiliary structure, so that the current chips are troublesome to dismount and can be dismounted by using special professional equipment, the size of the equipment is generally large, a whole circuit board is discarded due to the damage of the chips, the production cost is directly increased, and the directly discarded circuit board can generate certain negative influence on the surrounding environment.
In order to solve the problems, the invention provides a dismounting device for an SOP packaged integrated circuit chip, which comprises a dismounting structure, wherein a baking structure is arranged in the dismounting structure, an auxiliary structure is arranged in the dismounting structure, a movable groove is arranged in the middle of the inside of the dismounting structure, a movable column is movably connected in the movable groove in a telescopic manner, the bottom end of the dismounting structure is detachably connected with a limiting structure, and the top ends of the side walls of two sides, far away from each other, of the dismounting structure are both connected with a filtering structure;
the auxiliary structure comprises movable columns, pull rods are fixedly connected to the top ends of the side walls on the two sides, away from each other, of the movable columns, the bottom ends of the side walls on the two sides, away from each other, of the movable columns are rotatably connected with grippers through torsional springs, and limiting plates are fixedly connected to the bottom ends of the inner walls on the two sides, opposite to the movable grooves;
the baking structure comprises two mounting grooves, the two mounting grooves are both positioned in the dismounting structure and are respectively positioned on two sides of the movable groove, a fan is detachably connected in each mounting groove, a heating structure is arranged below each fan, the heating structures are detachably connected in the mounting grooves, ventilation grooves are arranged below the heating structures, and heat insulation cotton is fixedly connected to the inner walls of the ventilation grooves;
the heating structure comprises surrounding plates, wherein the outer walls of two sides, far away from each other, of the surrounding plates are fixedly connected with fixing plates, a connecting groove is formed in each surrounding plate, and a plurality of electric heating tubes are detachably connected in each connecting groove.
Preferably, the detachable structure comprises a box body, four side edges of the bottom end of the box body are fixedly connected with inserting plates, a clamping groove is formed in the middle of the outer wall of each inserting plate, the box body is detachably connected with the limiting structure through the inserting plates, a handle is fixedly connected to the top end of the box body, the top wall of each movable column penetrates through the top wall of the box body, extends to the outside of the box body 11 and is located under the handle, air inlets are formed in the positions, far away from the box body, of the side walls of the two sides and corresponding to the two fans, and the filtering structure is detachably connected.
Preferably, the limiting structure comprises a butt joint column which is of a hollow structure, slots are formed in the edges of the four sides of the top end of the butt joint column, the inserting plates are inserted into the corresponding slots in an inserting mode, clamping plates are fixedly connected to the side wall of one side of the inside of each slot and the positions corresponding to the clamping slots, the clamping plates are clamped inside the corresponding clamping slots, and a cushion layer is fixedly connected to the bottom end of the butt joint column.
Preferably, the filtering structure comprises a connecting plate, a filter screen is fixedly connected in the middle of the connecting plate, and the connecting plate is detachably connected to the air inlet.
Preferably, the ventilation groove is communicated with the mounting groove, the fan is a micro fan, each fixing plate is provided with a plurality of screw holes, and the heating structure is detachably connected in the mounting groove through the screw holes and screws.
Preferably, the upper ends of the inner walls of the two opposite sides of the movable groove are fixedly connected with top plates, the lower ends of the side walls of the two opposite sides, far away from each other, of the movable columns are fixedly connected with baffle plates, and the top plates correspond to the baffle plates.
Preferably, the limiting plate corresponds to the hand grip, one end of the fan is detachably connected to the inner wall of the air inlet, and the mounting groove is communicated with the air inlet.
The invention has the beneficial effects that: the invention heats and raises the temperature through the electric heating tube detachably connected in the connecting groove, the high temperature is transmitted out along the ventilating groove through the wind blown by the fan, the welding point of the chip is heated, after the welding point of the chip is ensured to be melted, the dismounting structure is taken down from the circuit board through the handle, then the fan and the heating structure are closed, the movable post is pushed back into the movable groove, the hand grip can gradually loosen along the torsion spring, thereby taking down the dismounted chip, the chip can be dismounted quickly through the dismounting structure, the size of the dismounting structure is smaller, the operation is convenient, the movable post is pulled to rise through the pull rod, thereby driving the hand grip to rise, the ascending hand grip can be extruded and limited through the limiting plate, two hand grips can move along the torsion spring, the clamping and fixing of the chip are finally realized, the hot wind generated by the baking structure can be ensured to be accurately and intensively acted on the chip through the limiting structure, thereby increase the efficiency of dismantling, establish the bed course on docking post bottom and can make the leakproofness of docking post and circuit board contact, avoid hot-blast leakage, can also avoid docking post to cause negative effects to the circuit board.
The invention is provided with the baking structure, and the welding point of the chip can be effectively heated and melted through the baking structure, so that the chip is more convenient to disassemble;
the chip grabbing device is provided with the auxiliary structure, so that a chip can be grabbed through the auxiliary structure, and the operation of workers is facilitated.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a schematic plan sectional view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a perspective view of a heating structure according to the present invention;
fig. 4 is a partial cross-sectional structural schematic view of a defining structure of the present invention.
In the figure: 1. disassembling the structure; 11. a box body; 12. a handle; 13. an air inlet; 14. inserting plates; 15. a card slot; 2. an auxiliary structure; 21. a movable post; 22. a pull rod; 23. a movable groove; 24. a top plate; 25. a baffle plate; 26. a torsion spring; 27. a limiting plate; 28. a gripper; 3. a baking structure; 31. mounting grooves; 32. a fan; 33. a heating structure; 331. enclosing plates; 332. a joining groove; 333. an electric heating tube; 334. a fixing plate; 335. a screw hole; 34. a ventilation slot; 35. heat preservation cotton; 4. defining a structure; 41. butting columns; 42. a slot; 43. a cushion layer; 44. clamping a plate; 5. a filter structure; 51. a connecting plate; 52. and (5) filtering by using a filter screen.
The specific implementation mode is as follows:
as shown in fig. 1 to 4, the following technical solutions are adopted in the present embodiment: a dismounting device for an SOP packaged integrated circuit chip comprises a dismounting structure 1, wherein a baking structure 3 is arranged in the dismounting structure 1, an auxiliary structure 2 is arranged in the dismounting structure 1, a movable groove 23 is arranged in the middle of the inside of the dismounting structure 1, a movable column 21 is movably connected in the movable groove 23 in a telescopic mode, a limiting structure 4 is detachably connected to the bottom end of the dismounting structure 1, and the top ends of the side walls of two sides, far away from each other, of the dismounting structure 1 are connected with a filtering structure 5;
the auxiliary structure 2 comprises a movable column 21, pull rods 22 are fixedly connected to the top ends of the side walls of two sides of the movable column 21, which are far away from each other, the bottom ends of the side walls of two sides of the movable column 21, which are far away from each other, are rotatably connected with grippers 28 through torsion springs 26, and limiting plates 27 are fixedly connected to the bottom ends of the inner walls of two sides of the movable groove 23, which are opposite to each other;
the baking structure 3 comprises two mounting grooves 31, the two mounting grooves 31 are located inside the detachable structure 1 and located on two sides of the movable groove 23 respectively, a fan 32 is detachably connected in each mounting groove 31, a heating structure 33 is arranged below each fan 32, each heating structure 33 is detachably connected in each mounting groove 31, a ventilation groove 34 is arranged below each heating structure 33, and heat insulation cotton 35 is fixedly connected to the inner wall of each ventilation groove 34;
the heating structure 33 comprises a surrounding plate 331, the outer walls of two sides of the surrounding plate 331, which are far away from each other, are fixedly connected with a fixing plate 334, a connecting groove 332 is arranged inside the surrounding plate 331, and a plurality of electric heating tubes 333 are detachably connected in the connecting groove 332.
Wherein, dismantlement structure 1 includes box 11, the equal fixedly connected with picture peg 14 of four side border departments in box 11 bottom, draw-in groove 15 has all been seted up in the middle of picture peg 14's the outer wall, box 11 passes through picture peg 14 and 4 detachable connections of limited structure, box 11 top fixedly connected with handle 12, the roof that box 11 was run through on the top of activity post 21 extends to the outside of box 11 and is located under handle 12, air intake 13 has all been seted up to the both sides lateral wall that box 11 kept away from each other and the position that corresponds two fans 32, 5 detachable connections of filtration are on air intake 13.
The limiting structure 4 comprises a butt joint column 41, the butt joint column 41 is of a hollow structure, slots 42 are formed in the edges of the four sides of the top end of the butt joint column 41, the inserting plate 14 is inserted into the corresponding slots 42, a side wall of the inside of each slot 42 corresponds to a clamping groove 15, a clamping plate 44 is fixedly connected to the position of each clamping groove 15, the clamping plate 44 is clamped inside the corresponding clamping groove 15, and a cushion layer 43 is fixedly connected to the bottom end of the butt joint column 41.
The filtering structure 5 comprises a connecting plate 51, a filter screen 52 is fixedly connected in the middle of the connecting plate 51, and the connecting plate 51 is detachably connected to the air inlet 13.
The ventilating slot 34 is communicated with the mounting slot 31, the fan 32 is a micro fan, each fixing plate 334 is provided with a plurality of screw holes 335, and the heating structure 33 is detachably connected in the mounting slot 31 through the screw holes 335 and screws.
Wherein, the equal fixedly connected with roof 24 of upper end in the relative both sides inner wall of activity groove 23, the equal fixedly connected with baffle 25 of lower extreme in the both sides lateral wall that the activity post 21 kept away from each other, roof 24 is corresponding with baffle 25.
The limiting plate 27 corresponds to the hand grip 28, one end of the fan 32 is detachably connected to the inner wall of the air inlet 13, and the mounting groove 31 is communicated with the air inlet 13.
Specifically, the method comprises the following steps: a kind of dismounting device of SOP encapsulated integrated circuit chip, when using, connect the limited structure 4 on the bottom of the container 11 at first, all fixedly connect with the picture peg 14 in the four sides border of bottom of the container 11, and equip with the card slot 15 in the middle of the outer wall of the picture peg 14, the side wall of one side inside slot 42 and position corresponding to card slot 15 are all fixedly connected with the card board 44, the card board 44 will be blocked in card slot 15 when the picture peg 14 is inserted in card slot 15, make the limited structure 4 of the container 11 connect firmly, can guarantee the hot wind that the baking structure 3 produces is accurate and concentrated and acted on the chip through the limited structure 4, thus increase the efficiency of dismantling, the bed course 43 set up on the bottom of the docking column 41 can make the sealing property of the docking column 41 and circuit board contact, avoid the hot-blast leakage, can also avoid causing the negative effect to the circuit board to the docking column 41, after the, the pull rod 22 pulls the movable column 21 to rise, so as to drive the hand grips 28 to rise, the hand grips 28 are rotatably connected to the bottom ends of the two side walls of the movable column 21, which are far away from each other, through the torsion spring 26, the limiting plates 27 are fixedly connected to the bottom ends of the two opposite sides of the movable groove 23, the lifted hand grips 28 can be extruded and limited through the limiting plates 27, so that the two hand grips 28 move along the torsion spring 26, and finally the chip is clamped and fixed, the top plates 24 are fixedly connected to the upper ends of the two opposite side inner walls of the movable groove 23, the baffle plates 25 corresponding to the top plates 24 are fixedly connected to the lower ends of the two opposite side walls of the movable column 21, which are far away from each other, the tightening amplitude of the hand grips 28 can be limited through the matching of the top plates 24 and the baffle plates 25, so as to avoid the negative influence on, after the chip is firmly held, the fan 32 and the heating structure 33 are started, the electric heating tube 333 detachably connected in the connecting groove 332 is used for heating and raising the temperature, the wind blown by the fan 32 transfers the high temperature along the ventilation groove 34, the chip is heated at the bonding point, because the tin sheet is usually bonded by soldering, because the tin is melted by heating the bonding point, the chip can be taken down, because the melting point of the tin is lower, the chip is not influenced by high temperature, after the melting of the chip bonding point is ensured, the dismounting structure 1 is removed from the circuit board through the handle 12, then the blower 32 and the heating structure 33 are closed, the movable column 21 is pushed back into the movable groove 23, the hand grip 28 is gradually loosened along the torsion spring 26, thereby take off the chip of dismantling, dismantle the chip that structure 1 can be swift through dismantling, and dismantle the volume of structure 1 self also less convenient operation.
While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (7)
1. The dismounting device for the SOP packaged integrated circuit chip is characterized by comprising a dismounting structure (1), wherein a baking structure (3) is arranged in the dismounting structure (1), an auxiliary structure (2) is arranged in the dismounting structure (1), a movable groove (23) is arranged in the middle of the inside of the dismounting structure (1), a movable column (21) is movably connected in the movable groove (23) in a telescopic mode, a limiting structure (4) is detachably connected at the bottom end of the dismounting structure (1), and the top ends of the side walls of two sides, far away from each other, of the dismounting structure (1) are both connected with a filtering structure (5);
the auxiliary structure (2) comprises movable columns (21), pull rods (22) are fixedly connected to the top ends of the side walls of the two sides, away from each other, of the movable columns (21), the bottom ends of the side walls of the two sides, away from each other, of the movable columns (21) are rotatably connected with grippers (28) through torsion springs (26), and limiting plates (27) are fixedly connected to the bottom ends of the inner walls of the two opposite sides of the movable grooves (23);
the baking structure (3) comprises two mounting grooves (31), the two mounting grooves (31) are arranged, the two mounting grooves (31) are located inside the disassembling structure (1) and located on two sides of the movable groove (23) respectively, a fan (32) is detachably connected in each mounting groove (31), a heating structure (33) is arranged below each fan (32), the heating structure (33) is detachably connected in each mounting groove (31), a ventilating groove (34) is arranged below each heating structure (33), and heat-insulating cotton (35) is fixedly connected to the inner wall of each ventilating groove (34);
the heating structure (33) comprises a surrounding plate (331), the outer walls of two sides, far away from each other, of the surrounding plate (331) are fixedly connected with a fixing plate (334), a connecting groove (332) is formed in the surrounding plate (331), and a plurality of electric heating tubes (333) are detachably connected in the connecting groove (332).
2. The device of claim 1, wherein the device comprises: dismantle structure (1) and include box (11), equal fixedly connected with picture peg (14) of four sides border department in box (11) bottom, draw-in groove (15) have all been seted up in the middle of the outer wall of picture peg (14), box (11) are through picture peg (14) and limited structure (4) detachable connections, box (11) top fixedly connected with handle (12), the roof that box (11) were run through on the top of activity post (21) extends to the outside of box (11) and is located under handle (12), air intake (13) have all been seted up to the both sides lateral wall that box (11) kept away from each other and the position that corresponds two fan (32), filtration (5) detachable connections are on air intake (13).
3. The device of claim 2, wherein the device comprises: it includes docking post (41) to inject structure (4), docking post (41) are hollow structure, slot (42) have all been seted up to four side border departments in the top of docking post (41), picture peg (14) are pegged graft inside slot (42) that correspond, the equal fixedly connected with cardboard (44) in the position of the inside one side lateral wall of slot (42) and corresponding draw-in groove (15), cardboard (44) joint is inside draw-in groove (15) that correspond, the bottom fixedly connected with bed course (43) of docking post (41).
4. The device of claim 3, wherein the device comprises: the filtering structure (5) comprises a connecting plate (51), a filter screen (52) is fixedly connected in the middle of the connecting plate (51), and the connecting plate (51) is detachably connected to the air inlet (13).
5. The device of claim 1, wherein the device comprises: the ventilating groove (34) is communicated with the mounting groove (31), the fan (32) is a micro fan, each fixing plate (334) is provided with a plurality of screw holes (335), and the heating structure (33) is detachably connected in the mounting groove (31) through the screw holes (335) and screws.
6. The device of claim 1, wherein the device comprises: the movable column is characterized in that a top plate (24) is fixedly connected to the upper ends of the inner walls of the two opposite sides of the movable groove (23), a baffle plate (25) is fixedly connected to the lower ends of the side walls of the two sides, away from each other, of the movable column (21), and the top plate (24) corresponds to the baffle plate (25).
7. The device of claim 2, wherein the device comprises: the limiting plate (27) corresponds to the hand grip (28), one end of the fan (32) is detachably connected to the inner wall of the air inlet (13), and the mounting groove (31) is communicated with the air inlet (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010800697.6A CN111885843B (en) | 2020-08-11 | 2020-08-11 | Dismounting device of SOP encapsulation integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010800697.6A CN111885843B (en) | 2020-08-11 | 2020-08-11 | Dismounting device of SOP encapsulation integrated circuit chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111885843A true CN111885843A (en) | 2020-11-03 |
| CN111885843B CN111885843B (en) | 2021-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010800697.6A Active CN111885843B (en) | 2020-08-11 | 2020-08-11 | Dismounting device of SOP encapsulation integrated circuit chip |
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| Country | Link |
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| CN (1) | CN111885843B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269352A (en) * | 2014-09-30 | 2015-01-07 | 京东方科技集团股份有限公司 | Chip removal device |
| CN206254178U (en) * | 2016-12-01 | 2017-06-16 | 衢州宏盛环保科技有限公司 | A kind of gripper |
-
2020
- 2020-08-11 CN CN202010800697.6A patent/CN111885843B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269352A (en) * | 2014-09-30 | 2015-01-07 | 京东方科技集团股份有限公司 | Chip removal device |
| CN206254178U (en) * | 2016-12-01 | 2017-06-16 | 衢州宏盛环保科技有限公司 | A kind of gripper |
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| Publication number | Publication date |
|---|---|
| CN111885843B (en) | 2021-08-13 |
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