CN111885818B - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN111885818B CN111885818B CN202010956562.9A CN202010956562A CN111885818B CN 111885818 B CN111885818 B CN 111885818B CN 202010956562 A CN202010956562 A CN 202010956562A CN 111885818 B CN111885818 B CN 111885818B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- board body
- pad
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the application provides a circuit board and electronic equipment. The circuit board includes: a circuit board body and an electronic component; the electronic component comprises an electronic component body and at least two terminal electrodes, wherein the terminal electrodes are connected with the electronic component body; the surface of the circuit board body comprises a slotted area and at least two welding areas, a pad is arranged in each welding area, the slotted area is located between the at least two welding areas, a groove is formed in each slotted area, and the end electrode is fixed on the pad. That is, in this application embodiment, the electronic components body can be towards the recess for when having the electric current to flow in electronic components, when electronic components body and end electrode vibrate under the effect of electric current, the recess can slow down the striking of electronic components and circuit board body, makes the noise that the circuit board produced less, improves user's experience.
Description
Technical Field
The application relates to the technical field of communication, in particular to a circuit board and electronic equipment.
Background
With the advancement of technology, the application of electronic devices has become more and more common. Generally, electronic devices are provided with circuit boards, and partial functions of the electronic devices are realized through the circuit boards.
In the related art, a circuit board includes a circuit board body and electronic components, and the electronic components are soldered to the circuit board.
In the process of implementing the present application, the inventors found that at least the following problems exist in the related art: when current flows in the electronic components, the electronic components vibrate under the action of the current, and then the electronic components possibly impact the circuit board body, and the electronic components drive the circuit board body to vibrate together, so that the circuit board generates noise, and the user experience is poor.
Disclosure of Invention
The embodiment of the application provides a circuit board and electronic equipment, and can solve the problem that in the related art, an electronic component drives a circuit board body to vibrate together, so that the circuit board generates noise, and the user experience is poor.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a circuit board, where the circuit board includes: a circuit board body and an electronic component;
the electronic component comprises an electronic component body and at least two terminal electrodes, wherein the terminal electrodes are connected with the electronic component body;
the surface of the circuit board body comprises a slotted area and at least two welding areas, a welding pad is arranged in each welding area, the slotted area is located between the at least two welding areas, a groove is formed in the slotted area, and the terminal electrode is fixed on the welding pad.
In a second aspect, an embodiment of the present application provides an electronic device, which includes the circuit board described in the first aspect
In this application embodiment, because electronic components includes electronic components body and two at least end electrodes, this body coupling of end electrode and electronic components, and the fluting region is located between two at least welding regions, the fluting region is seted up flutedly, the end electrode is fixed on the pad, therefore, the electronic components body can be towards the recess, it is outdated to make there be the electric current to flow in electronic components, when electronic components body and end electrode vibrate under the effect of electric current, the striking of electronic components and circuit board body can be slowed down to the recess, make the noise that the circuit board produced less, improve user's experience.
Drawings
Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of another circuit board provided by an embodiment of the present application;
FIG. 3 is a schematic diagram of another circuit board provided by an embodiment of the present application;
fig. 4 is a schematic diagram of another circuit board provided in an embodiment of the present application.
Reference numerals:
10: a circuit board body; 20: an electronic component; 12: a groove; 13: a via hole; 11: a pad; 21: an electronic component body; 22: a terminal electrode; 101: a dielectric layer; 102: a conductive layer; 103: a protective layer; 131: a buffer member; 1311: a metal member; 1312: a buffer medium.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1, a schematic diagram of a circuit board provided by an embodiment of the present application is shown, referring to fig. 2, a schematic diagram of another circuit board provided by an embodiment of the present application is shown, referring to fig. 3, a schematic diagram of another circuit board provided by an embodiment of the present application is shown, and referring to fig. 4, a schematic diagram of another circuit board provided by an embodiment of the present application is shown. As shown in fig. 1, 2, 3 and 4, the circuit board includes: a circuit board body 10 and an electronic component 20.
The electronic component 20 comprises an electronic component body 21 and at least two terminal electrodes 22, wherein the terminal electrodes 22 are connected with the electronic component body 21; the surface of the circuit board body 10 includes a slotted area and at least two welding areas, a pad 11 is arranged in the welding area, the slotted area is located between the at least two welding areas, the slotted area is provided with a groove 12, and a terminal electrode 22 is fixed on the pad 11.
In the embodiment of the application, because electronic component 20 includes electronic component body 21 and two at least terminal electrodes 22, terminal electrode 22 is connected with electronic component body 21, and the fluting region is located between two at least welding regions, fluting region has seted up recess 12, terminal electrode 22 fixes on the pad, therefore, electronic component body 21 can be towards recess 12, when making current flow in electronic component 20, when electronic component body 21 and terminal electrode 22 vibrate under the effect of current, recess 12 can slow down the striking of electronic component 20 and circuit board body 10, make the noise that the circuit board produced less, improve user's experience.
It should be noted that, in the embodiment of the present application, the electronic component 20 may be a capacitor, and at this time, when a current flows through the capacitor, due to the groove 12 on the circuit board body 10 and the buffer member 131 in the via hole 13, the impact of the capacitor and the circuit board body 10 may be reduced, and the capacitor sound generated by the vibration of the circuit board body 10 is driven. Of course, the electronic component 20 may also be other devices, such as an inductor, and the embodiment of the present application is not limited herein with respect to the type of the electronic component 20.
In addition, in the embodiment of the present application, the location of the slotted zone between the at least two welding zones may be: when the number of the at least two welding areas is two, the slotting area is positioned between the two welding areas; when the number of the at least two welding regions is plural, at this time, the plural welding regions may surround the grooved region such that the grooved region is located between the plural welding regions.
In the embodiment of the present application, as shown in fig. 1, the pad 11 is provided with the via hole 13, and the buffer 131 is provided in the via hole 13.
Because the via hole 13 is formed in the pad 11, and the buffer member 131 is disposed in the via hole 13, the pad is driven by the terminal electrode 22 to vibrate in the process that the terminal electrode 22 vibrates along with the electronic component body 21, and at this time, the buffer member 131 can slow down the vibration of the pad. That is, through set up the via hole 13 on the pad 11, and set up the bolster 131 in the via hole 13, when having current to flow in electronic component 20, the vibration of pad can be slowed down to the bolster 131 in the via hole 13 to make the vibration of electronic component 20 and circuit board body 10 less, further make the noise that the circuit board produced less, improve user's experience.
In addition, in the embodiment of the present application, when the via hole 13 is opened on the pad 11, and the terminal electrode 22 is welded on the pad 11, during the welding process, the position on the pad avoiding the via hole 13 can be welded with the terminal electrode 22, that is, the welded object is prevented from entering the via hole 13 during the welding process.
It should be noted that, in the embodiment of the present application, the via hole 13 is used to conduct a circuit in the circuit board, so that the circuit board may have a function of transmitting an electrical signal.
In addition, in the embodiment of the present application, the connection manner of the pad 11 and the terminal electrode 22 may be: the pad 11 and the terminal electrode 22 are connected by solder welding. That is, the terminal electrode 22 is soldered to the pad 11 by solder.
When the terminal electrode 22 is soldered to the pad 11 by solder, the terminal electrode 22 can be soldered to the pad 11 by the solder surrounding the via hole 13 in the pad 11, so that the solder is prevented from flowing into the via hole 13 to block the via hole 13, thereby affecting the circuit board body 10.
In addition, in some embodiments, as shown in fig. 3, the projection area of the electronic component body 21 on the circuit board body 10 is smaller than or equal to the area of the notch of the groove 12.
When the projection area of the electronic component body 21 on the circuit board body 10 is smaller than or equal to the area of the notch of the groove 12, when current flows in the electronic component body 21, the electronic component body 21 vibrates under the action of the current, at the moment, the electronic component body 21 enters the groove 12 or leaves the groove 12 in the vibrating process, namely, the electronic component body 21 cannot collide with the circuit board body 10, and the circuit board is prevented from generating noise due to the vibration of the electronic component 20. That is, the area of the projection of the electronic component body 21 on the circuit board body 10 is set to be less than or equal to the area of the notch of the groove 12, so that the electronic component body 21 and the circuit board body 10 can be prevented from being collided, and the problem that the circuit board generates noise due to vibration of the electronic component 20 is avoided.
In addition, in the embodiment of the present application, as shown in fig. 1, the circuit board body 10 may include a dielectric layer 101 and a conductive layer 102, which are stacked, where the dielectric layer 101 and the conductive layer 102 are adjacent, the conductive layer 102 is on the surface of the circuit board body 10, and the groove 12 is disposed on the conductive layer 102.
When the circuit board body 10 includes the dielectric layer 101 and the conductive layer 102, which are stacked, a circuit can be disposed in the conductive layer 102, and the dielectric layer 101 can prevent the circuit between two adjacent circuit boards from being affected by each other, thereby improving the performance of the circuit board body 10. At this time, the surface of the circuit board 10 may be the conductive layer 102, and the groove 12 may be disposed on the conductive layer 102.
It should be noted that the circuit board body 10 may include a plurality of dielectric layers 101 and a plurality of conductive layers 102, in this case, the dielectric layers 101 and the conductive layers 102 are stacked in a crossed manner, that is, two adjacent conductive layers 102 are separated by the dielectric layers 101, and two adjacent dielectric layers 101 are separated by the conductive layers 102.
It should be noted that the conductive layer 102 may be made of copper foil, and of course, the conductive layer 102 may also be made of other metal materials, for example, silver, and the material of the conductive layer 102 is not limited herein.
In addition, in some embodiments, as shown in fig. 1, the buffer member 131 may include a metal member 1311 and a buffer medium 1312, the metal member 1311 is disposed in the via hole 13, the metal member 1311 forms a receiving cavity at the dielectric layer 101, and the buffer medium 1312 is disposed in the receiving cavity.
In the related art, when the metal part 1311 is disposed in the via hole 13, and the metal part 1311 forms a receiving cavity at the position where the dielectric layer 101 is formed, and a medium which is the same as the medium in the dielectric layer 101 is generally disposed in the receiving cavity, or no medium is disposed in the receiving cavity, therefore, when the electrode of the electronic component 20 drives the pad 11 on the circuit board to vibrate, the vibration of the metal part 1311 is strong, so that the vibration of the circuit board is strong.
In the embodiment of the present application, when the metal piece 1311 is disposed in the via hole 13, the conductive layer 102 in the circuit board body 10 can be conducted through the metal piece 1311, so that the conductive layer 102 can transmit an electrical signal therebetween. In addition, when the electronic component 20 vibrates due to the action of current, the electrode of the electronic component 20 drives the pad 11 on the circuit board to vibrate, so that the metal piece 1311 vibrates, and since the metal piece 1311 forms an accommodating cavity at the dielectric layer 101, and a buffer medium 1312 is arranged in the accommodating cavity, the buffer medium 1312 can slow down the vibration of the metal piece 1311, the vibration of the circuit board due to the vibration of the electronic component 20 can be reduced, and the noise generated by the circuit board can be reduced. That is, the metal 1311 may transmit an electrical signal between the conductive layers 102 of the circuit board body 10 by providing the metal 1311 in the via hole 13, and noise generated from the circuit board may be reduced by forming a receiving cavity at the dielectric layer 101 in the metal 1311 and providing the buffer dielectric 1312 in the receiving cavity.
In the embodiment of the present application, the metal 1311 provided in the via hole 13 is electrically connected to the conductive layer 102 in the circuit board body 10. The material of the metal 1311 may be copper, but may also be other materials, such as silver, aluminum, and the like, and the material of the metal 1311 is not limited in this embodiment.
It should be further noted that, in the embodiment of the present application, the via hole 13 may include any one of a through hole and a blind hole. Here, the through hole refers to a hole penetrating the circuit board body 10, and the blind hole refers to a hole not penetrating the circuit board body 10. For example, as shown in fig. 1, the via hole 13 is a blind hole. As shown in fig. 2, the via hole 13 is a through hole.
In addition, in the embodiment of the present application, the density of the buffer dielectric 1312 may be less than that of the dielectric layer 101. The buffer medium 1312 may be a flame retardant material with a flame retardant rating FR4, and the flame retardant material may be a composite material made of epoxy resin, a filler and glass fibers.
In addition, in some embodiments, as shown in fig. 4, the surface of the circuit board body 10 is provided with a protective layer 103.
When the surface of the circuit board body 10 is provided with the protection layer 103, the protection layer 103 may damage the circuit board body 10, and the protection layer 103 may also prevent the conductive layer 102 in the circuit board body 10 from being electrically connected with other devices outside the circuit board body 10, which may affect the circuit in the circuit board body 10. That is, by disposing the protection layer 103 on the surface of the circuit board body 10, the circuit board body 10 can be prevented from being damaged, and other devices can be prevented from affecting the circuit in the circuit board body 10.
Note that, in the embodiment of the present application, the protective layer 103 is a liquid photo solder resist, where the liquid photo solder resist may also be referred to as green oil. In addition, in the embodiment of the present application, when the surface of the circuit board body 10 is the conductive layer 102, at this time, the protection layer 103 is disposed on the conductive layer 102, at this time, the groove 12 may penetrate through the protection layer 103, and the groove bottom of the groove 12 is on the conductive layer 102. Of course, the groove 12 may not penetrate the protection layer 103, and the groove bottom of the groove 12 is in the protection layer 103.
In the embodiment of the application, because electronic component 20 includes electronic component body 21 and two at least terminal electrodes 22, terminal electrode 22 is connected with electronic component body 21, and the fluting region is located between two at least welding regions, fluting region has seted up recess 12, terminal electrode 22 fixes on the pad, therefore, electronic component body 21 can be towards recess 12, when making current flow in electronic component 20, when electronic component body 21 and terminal electrode 22 vibrate under the effect of current, recess 12 can slow down the striking of electronic component 20 and circuit board body 10, make the noise that the circuit board produced less, improve user's experience. In the embodiment of the present application, the pad 11 is provided with the via hole 13, and the buffer 131 is provided in the via hole 13. When current flows through the electronic component 20, the buffer member 131 in the via hole 13 can slow down vibration of the bonding pad, so that vibration of the electronic component 20 and the circuit board body 10 is small, noise generated by the circuit board is further small, and user experience is improved.
In addition, in this application embodiment, the projection area of electronic components body 21 on circuit board body 10 is less than or equal to the notch area of recess 12 can avoid electronic components body 21 and circuit board body 10 to form the striking, avoids electronic components's vibrations and makes the problem of circuit board noise production appear. In addition, the surface of the circuit board body 10 is provided with the protective layer 103, which can prevent the circuit board body 10 from being damaged and can prevent other devices from affecting the circuit in the circuit board body.
An embodiment of the present application provides an electronic device, which includes the circuit board provided in any one of the above embodiments.
It should be noted that, in the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element.
The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.
Claims (7)
1. A circuit board, comprising: a circuit board body and an electronic component;
the electronic component comprises an electronic component body and at least two terminal electrodes, wherein the terminal electrodes are connected with the electronic component body;
the surface of the circuit board body comprises a slotted area and at least two welding areas, a welding pad is arranged in each welding area, the slotted area is located between the at least two welding areas, a groove is formed in the slotted area, and the terminal electrode is fixed on the welding pad;
the bonding pad is provided with a via hole, and a buffer piece is arranged in the via hole;
the circuit board body comprises a plurality of dielectric layers and a plurality of conducting layers which are arranged in a stacked mode, the dielectric layers are adjacent to the conducting layers, the conducting layers are arranged on the surface of the circuit board body, and the grooves are formed in the conducting layers;
the buffer piece comprises a metal piece and a buffer medium, the metal piece is arranged in the conducting hole, a containing cavity is formed in the position of the medium layer, and the buffer medium is arranged in the containing cavity.
2. The circuit board of claim 1, wherein the pads and the terminal electrodes are connected by solder soldering.
3. The circuit board according to claim 1, wherein a projection area of the electronic component body on the circuit board body is smaller than or equal to a notch area of the groove.
4. The circuit board of claim 1, wherein a surface of the circuit board body is provided with a protective layer.
5. The circuit board of claim 4, wherein the protective layer is a liquid photo solder resist.
6. The circuit board according to any one of claims 1 to 5, wherein the via hole includes any one of a through hole and a blind hole.
7. An electronic device, characterized in that the electronic device comprises a circuit board according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010956562.9A CN111885818B (en) | 2020-09-11 | 2020-09-11 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010956562.9A CN111885818B (en) | 2020-09-11 | 2020-09-11 | Circuit board and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111885818A CN111885818A (en) | 2020-11-03 |
| CN111885818B true CN111885818B (en) | 2022-02-08 |
Family
ID=73199967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010956562.9A Active CN111885818B (en) | 2020-09-11 | 2020-09-11 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111885818B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252809A (en) * | 2007-02-22 | 2008-08-27 | 希克斯株式会社 | Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
| CN202262076U (en) * | 2011-10-21 | 2012-05-30 | 京东方科技集团股份有限公司 | Circuit board and display device |
| CN210469858U (en) * | 2019-07-31 | 2020-05-05 | 延锋伟世通电子科技（上海）有限公司 | Circuit board structure for suppressing capacitor squeal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102189804B1 (en) * | 2015-12-04 | 2020-12-11 | 삼성전기주식회사 | stacked electronic component and circuit board for mounting the same |
| US20210024742A1 (en) * | 2018-03-30 | 2021-01-28 | Taiyo Ink Mfg. Co., Ltd. | Curable resin composition, cured product thereof and printed wiring board |
-
2020
- 2020-09-11 CN CN202010956562.9A patent/CN111885818B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252809A (en) * | 2007-02-22 | 2008-08-27 | 希克斯株式会社 | Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
| CN202262076U (en) * | 2011-10-21 | 2012-05-30 | 京东方科技集团股份有限公司 | Circuit board and display device |
| CN210469858U (en) * | 2019-07-31 | 2020-05-05 | 延锋伟世通电子科技（上海）有限公司 | Circuit board structure for suppressing capacitor squeal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111885818A (en) | 2020-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6392784B2 (en) | Multilayer electronic component and its mounting structure | |
| KR102463337B1 (en) | Electronic component and board having the same mounted thereon | |
| TWI643334B (en) | High frequency signal transmission structure and manufacturing method thereof | |
| US10305157B2 (en) | High-frequency signal transmission line and electronic device | |
| CN109121285B (en) | Circuit board structure and electronic equipment | |
| JPWO2016203842A1 (en) | Electronic device and antenna element | |
| JP2016507870A (en) | Battery protection device manufacturing method and battery protection device | |
| KR101681429B1 (en) | Electronic component and board having the same | |
| CN111885818B (en) | Circuit board and electronic equipment | |
| KR20200101006A (en) | Flexible flat cable and method for manufacturing the same | |
| KR20180099220A (en) | Copper clad laminate and the process of manufacture | |
| WO2023165426A1 (en) | Integrated circuit assembly and electronic apparatus | |
| JP2021511675A (en) | Printed circuit board, manufacturing method of printed circuit board and mobile terminal | |
| US20070215378A1 (en) | Circuit board | |
| EP4017226A1 (en) | Embedded circuit board, and manufacturing method for embedded circuit board | |
| CN211580284U (en) | Adapter plate, circuit board structure and electronic equipment | |
| JPH11298097A (en) | Printed wiring board | |
| CN215220519U (en) | Stacked multilayer ceramic capacitor | |
| CN210271842U (en) | Low loss transmission line and apparatus | |
| CN220020316U (en) | Fingerprint module and electronic equipment | |
| CN220235062U (en) | Earphone bonding pad wiring structure | |
| JP6848119B1 (en) | Composite wiring boards, packages and electronics | |
| CN113643897B (en) | Method for manufacturing ceramic capacitor and ceramic capacitor | |
| JP5306551B1 (en) | Multilayer circuit board | |
| KR101153479B1 (en) | Printed circuit board with multi-layered structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |