CN111883402B - Ceramic gas diode discharge tube structure and assembly method thereof - Google Patents
Ceramic gas diode discharge tube structure and assembly method thereof Download PDFInfo
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- CN111883402B CN111883402B CN202010793420.5A CN202010793420A CN111883402B CN 111883402 B CN111883402 B CN 111883402B CN 202010793420 A CN202010793420 A CN 202010793420A CN 111883402 B CN111883402 B CN 111883402B
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- electrode
- base material
- valve element
- ceramic gas
- metallized
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/04—Electrodes; Screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/04—Electrodes; Screens
- H01J17/06—Cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
- H01J9/042—Manufacture, activation of the emissive part
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
A ceramic gas diode discharge tube structure comprises a first electrode and a second electrode, wherein the first electrode and the second electrode are identical in structure; the valve comprises a valve element, a base material and a metalization film, wherein the section of the valve element is of a convex structure, and the shape of the base material is of a buckle cover structure corresponding to the convex part of the valve element; the concave surface of the inner side of the base material buckle cover structure is clamped on the convex part of the valve element; the metallized film is arranged on the upper surface of the outer side of the base material buckle cover structure; the first electrode and the second electrode are respectively fixed at the upper end and the lower end of the metallized porcelain tube; according to the ceramic gas diode discharge tube structure, electrode emissions formed by the base material and the metallized film are assembled on the valve member, the structure breaks through the traditional design, a novel electrode emissions formula for replacing the original electronic powder formula of the product is adopted, the stability and consistency of the product are effectively improved, meanwhile, the production process is simplified, and the influence on the production environment and the health of staff caused by electronic powder coating is eliminated.
Description
Technical Field
The invention belongs to the technical field of ceramic gas discharge tubes, and particularly relates to a ceramic gas diode discharge tube structure and an assembly method thereof.
Background
At present, the electrical performance of the ceramic gas discharge tube is widely realized by adopting a mode of coating electronic powder, and an electron emitter is a mixture of various electronic powders. In the actual production process, the electronic powder has non-uniformity in the mixing and using processes, so that the electric properties of the products are inconsistent; under the serious unbalance of the electronic powder, the electronic performance of the product can be invalid. Meanwhile, because the electronic powder has small particles (nano-scale), the electronic powder is easy to drift in the using process, pollutes the working environment and affects the physical health of staff.
Under the development conditions of the current 5G, AI and the Internet of things, the ceramic gas discharge tube is used as a core overvoltage protection device, the demand is increased rapidly, and meanwhile, higher requirements are put on the consistency and reliability of products.
Therefore, in view of the premise of improving the productivity and performance of the product, it is necessary to design a ceramic gas diode structure and an assembling method thereof, which meet the demands of market application and solve the technical problems generated by the conventional scheme.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a ceramic gas diode structure and an assembling method thereof.
To achieve the above and other related objects, the present invention provides the following technical solutions: a ceramic gas diode discharge tube structure comprises
The first electrode and the second electrode have the same structure; the valve comprises a valve element, a base material and a metalization film, wherein the section of the valve element is of a convex structure, and the shape of the base material is of a buckle cover structure corresponding to the convex part of the valve element; the concave surface of the inner side of the base material buckle cover structure is clamped on the convex part of the valve element; the metalizing film is arranged on the upper surface of the outer side of the base material buckle cover structure;
the first electrode and the second electrode are respectively fixed at the upper end and the lower end of the metallized porcelain tube.
Preferably, the metallized porcelain tube and the valve member are welded by a solder sheet.
Preferably, the metallized film is specifically formed by bombarding a target material by a vacuum sputtering method and attaching the material on the target material to the upper surface of the outer side of the base material buckle cover.
Preferably, the target material is specifically formed by mixing metal powder and a metal compound and then curing.
Preferably, the substrate material is a material having a low rate of change in resistance temperature.
Preferably, the concave surface on the inner side of the base material buckle cover structure is in interference fit with the convex part of the valve element.
A method of ceramic gas diode discharge tube assembly comprising the steps of:
step one: selecting raw material components and mixing proportion according to the electrical performance parameters required by the discharge tube to manufacture a target material; selecting a covering base material corresponding to the convex part of the valve member, loading the target material and the base material meeting the requirements into vacuum sputtering equipment, bombarding the target material through a vacuum sputtering process, and enabling the target material to be uniformly attached to the upper surface of the outer side of the covering structure of the base material to form a layer of metallized film;
step two: after the substrate is processed, the substrate is punched and assembled on the valve element through equipment to be fixed, so that the whole electrode part is formed, and two electrodes are assembled at the same time according to the steps;
step three: and respectively installing and fixing the two electrodes at the upper end and the lower end of the metallized porcelain tube to complete the assembly of the whole ceramic gas diode discharge tube.
Preferably, the target material in the first step is formed by mixing and curing metal powder and a metal compound which meet the requirements.
Preferably, the specific assembly modes of the first electrode, the second electrode and the metallized porcelain tube are as follows: a solder sheet is clamped between an electrode and a metallized porcelain tube, and then the electrode and the metallized porcelain tube are fixed by welding.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the novel ceramic gas discharge tube electrode structure is characterized in that electrode emission materials formed by base materials and metallized films are assembled on a valve member, the structure breaks through the traditional design, the novel electrode emission materials are adopted to replace an original electronic powder formula of the product, the stability and consistency of the product are effectively improved, meanwhile, the production process is simplified, and the influence on the production environment and the health of staff caused by electronic powder coating is eliminated.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the overall structure of the electrode.
Fig. 3 is a schematic view of an electrode disassembly structure.
In the above figures, the valve element 1, the base material 2, the metallized film 3, the solder sheet 4, the metallized porcelain tube 5, the first electrode 6 and the second electrode 7 can be used.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1-3. It should be noted that, in the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or directions or positional relationships in which the inventive product is conventionally put in use, are merely for convenience of describing the present invention and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," "overhang," and the like do not denote that the component is required to be absolutely horizontal or overhang, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or communicating between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 3, a ceramic gas diode discharge tube structure comprises a first electrode 6 and a second electrode 7, wherein the first electrode 6 and the second electrode 7 have the same structure; the valve comprises a valve element 1, a base material 2 and a metalizing film 3, wherein the section of the valve element 1 is of a convex structure, and the base material 2 is of a buckle cover structure corresponding to the convex part of the valve element 1; the concave surface of the inner side of the buckle cover structure of the base material 2 is clamped on the convex part of the valve element 1; the metallized film 3 is arranged on the upper surface of the outer side of the buckle cover structure of the base material 2; the electrode comprises a metallized porcelain tube 5, and the first electrode 6 and the second electrode 7 are respectively fixed at the upper end and the lower end of the metallized porcelain tube 5.
The preferred embodiment is as follows:
the metallized porcelain tube 5 and the valve element 1 are welded by a solder sheet 4.
The metallized film 3 is specifically formed by bombarding a target material by a vacuum sputtering method and attaching the material on the target material to the upper surface of the outer side of the buckle cover of the base material 2; the thickness of the metallized film 3 can be adjusted by adjusting the vacuum sputtering process, so that the metallized film can meet the electrical performance requirements of different requirements.
The target material is specifically formed by mixing and solidifying metal powder and a metal compound; the metal powder and the metal compound which meet the requirements are mixed and then solidified to be used as target materials, the target materials are consumable materials, and effective substances on the target materials are attached to the surface of the base material 2 in the process.
The material of the base material 2 is a material with low resistance temperature change rate.
The concave surface on the inner side of the buckle cover structure of the base material 2 is in interference fit with the convex part of the valve element 1; the base material 2 in the shape of a buckle closure is assembled on the valve element 1 in a punching mode by equipment, has certain strength and prevents the base material 2 from falling off from the valve element 1.
Meanwhile, the specific assembly mode of the ceramic gas diode discharge tube designed by the scheme is as follows: selecting target raw material components and mixing proportion according to required electrical performance parameters, manufacturing a target, loading the target and a base material 2 meeting requirements into vacuum sputtering equipment, uniformly attaching the target to the base material 2 through a vacuum sputtering process, and forming a layer of metallized film 3 on the surface of the base material 2; after the substrate 2 is processed, forming an electron emitter part by stamping; the component is provided with a substance for generating the electrical property of the ceramic gas discharge tube, and is assembled on a valve element 1 to form a complete electrode; and finally, welding the two assembled electrodes at the upper end and the lower end of the metallized porcelain tube 5 through the solder sheets 4 respectively to complete the assembly of the whole ceramic gas diode discharge tube product.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (8)
1. A ceramic gas diode discharge tube structure, characterized by: comprising
The first electrode and the second electrode have the same structure; the valve comprises a valve element, a base material and a metalization film, wherein the section of the valve element is of a convex structure, and the shape of the base material is of a buckle cover structure corresponding to the convex part of the valve element; the concave surface of the inner side of the base material buckle cover structure is clamped on the convex part of the valve element; the metalizing film is arranged on the upper surface of the outer side of the base material buckle cover structure; the metallized film is specifically formed by bombarding a target material by a vacuum sputtering method and attaching the material on the target material to the upper surface of the outer side of the base material buckle cover;
the first electrode and the second electrode are respectively fixed at the upper end and the lower end of the metallized porcelain tube.
2. A ceramic gas diode discharge structure according to claim 1, wherein: the metallized porcelain tube is welded with the valve element through a solder piece.
3. A ceramic gas diode discharge structure according to claim 1, wherein: the target material is specifically formed by mixing and solidifying metal powder and a metal compound.
4. A ceramic gas diode discharge structure according to claim 1, wherein: the base material is a material with low resistance temperature change rate.
5. A ceramic gas diode discharge structure according to claim 1, wherein: the concave surface on the inner side of the base material buckle cover structure is in interference fit with the convex part of the valve element.
6. A method for assembling a ceramic gas diode discharge tube, characterized by: the method comprises the following steps:
step one: selecting raw material components and mixing proportion according to the electrical performance parameters required by the discharge tube to manufacture a target material; selecting a covering base material corresponding to the convex part of the valve member, loading the target material and the base material meeting the requirements into vacuum sputtering equipment, bombarding the target material through a vacuum sputtering process, and enabling the target material to be uniformly attached to the upper surface of the outer side of the covering structure of the base material to form a layer of metallized film;
step two: after the substrate is processed, the substrate is punched and assembled on the valve element through equipment to be fixed, so that the whole electrode part is formed, and two electrodes are assembled at the same time according to the steps;
step three: and respectively installing and fixing the two electrodes at the upper end and the lower end of the metallized porcelain tube to complete the assembly of the whole ceramic gas diode discharge tube.
7. A method of assembling a ceramic gas diode discharge tube according to claim 6, wherein: the target material is formed by mixing metal powder meeting the requirements and a metal compound and then solidifying.
8. A method of assembling a ceramic gas diode discharge tube according to claim 6, wherein: the electrode and the metallized porcelain tube are specifically assembled in the following way: a solder sheet is clamped between an electrode and a metallized porcelain tube, and then the electrode and the metallized porcelain tube are fixed by welding.
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CN202010793420.5A CN111883402B (en) | 2020-08-10 | 2020-08-10 | Ceramic gas diode discharge tube structure and assembly method thereof |
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CN202010793420.5A CN111883402B (en) | 2020-08-10 | 2020-08-10 | Ceramic gas diode discharge tube structure and assembly method thereof |
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CN111883402A CN111883402A (en) | 2020-11-03 |
CN111883402B true CN111883402B (en) | 2023-08-15 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1439775A (en) * | 1972-11-08 | 1976-06-16 | Ericsson Telefon Ab L M | Gas-filled discharge tubes annular elem |
US5266867A (en) * | 1990-10-15 | 1993-11-30 | Matsushita Electronics Corporation | Gas discharge tube with tunnel effect type cathode |
CN201054461Y (en) * | 2007-06-25 | 2008-04-30 | 镇江市电子管厂 | Thin type high power gas discharge tube |
CN201515147U (en) * | 2009-07-29 | 2010-06-23 | 深圳市槟城电子有限公司 | Low-junction capacitance ceramic gas discharge tube |
CN101882757A (en) * | 2009-05-06 | 2010-11-10 | 深圳市槟城电子有限公司 | High-intensity arc voltage gas electrical discharge tube |
-
2020
- 2020-08-10 CN CN202010793420.5A patent/CN111883402B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1439775A (en) * | 1972-11-08 | 1976-06-16 | Ericsson Telefon Ab L M | Gas-filled discharge tubes annular elem |
US5266867A (en) * | 1990-10-15 | 1993-11-30 | Matsushita Electronics Corporation | Gas discharge tube with tunnel effect type cathode |
CN201054461Y (en) * | 2007-06-25 | 2008-04-30 | 镇江市电子管厂 | Thin type high power gas discharge tube |
CN101882757A (en) * | 2009-05-06 | 2010-11-10 | 深圳市槟城电子有限公司 | High-intensity arc voltage gas electrical discharge tube |
CN201515147U (en) * | 2009-07-29 | 2010-06-23 | 深圳市槟城电子有限公司 | Low-junction capacitance ceramic gas discharge tube |
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CN111883402A (en) | 2020-11-03 |
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