CN111873036B - Processing technology of conductive wrapped foam - Google Patents

Processing technology of conductive wrapped foam Download PDF

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Publication number
CN111873036B
CN111873036B CN202010669956.6A CN202010669956A CN111873036B CN 111873036 B CN111873036 B CN 111873036B CN 202010669956 A CN202010669956 A CN 202010669956A CN 111873036 B CN111873036 B CN 111873036B
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jig plate
jig
processing
processing technology
conductive
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CN111873036A (en
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王佳宾
黄军政
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Zhengzhou Triumphlead Technology Co ltd
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Zhengzhou Triumphlead Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)

Abstract

The invention discloses a processing technology of conductive wrapped foam. The process comprises the following steps: a) installing a processing jig on the die cutting equipment, and fixedly installing a material to be processed on the processing jig; b) processing the material arranged on the processing jig by using a cutter of the die cutting equipment to obtain a semi-finished product; c) taking a first jig plate and a second jig plate, and installing the second jig plate in the center of the top of the first jig plate; d) attaching the semi-finished product to the edge of the second jig plate and surrounding the second jig plate to obtain a product; wherein, the processing jig is provided with a strip-shaped groove, and the semi-finished product is not cut off. The conductive wrapped foam processing technology can stably and accurately process conductive wrapped foam products with relatively irregular shapes, so that the mass production and the use of the conductive wrapped foam are smoothly realized, the yield of the conductive wrapped foam is improved, and the quality of electronic products applied to the conductive wrapped foam is ensured.

Description

Processing technology of conductive wrapped foam
Technical Field
The invention relates to the field of electronic product part processing, in particular to a processing technology of conductive wrapping foam.
Background
In electronic products such as mobile phones and tablet computers, conductive wrapping foam is arranged for shielding electromagnetic waves emitted by electronic devices in the products, and meanwhile, various functions such as dust prevention, shading, shock prevention and buffering can be achieved.
However, the conductive wrapped foam is generally in a single strip shape, and in practical applications, it is sometimes necessary to set the conductive wrapped foam into a specific shape, for example, when the conductive wrapped foam is applied to the inner side of a housing of an electronic product, the conductive wrapped foam is often required to be set into a regular ring shape.
Disclosure of Invention
In order to solve the problems, the invention provides a processing technology of conductive wrapped foam.
According to one aspect of the invention, a processing technology of conductive wrapping foam is provided, which comprises the following steps
a) Installing a processing jig on die cutting equipment, and fixedly installing a material to be processed on the processing jig;
b) processing the material arranged on the processing jig by using a cutter of die cutting equipment to obtain a semi-finished product;
c) taking a first jig plate and a second jig plate, and installing the second jig plate in the center of the top of the first jig plate;
d) attaching the semi-finished product to the edge of the second jig plate and surrounding the second jig plate to obtain a product;
and the processing jig is provided with a strip-shaped groove, and the semi-finished product is not cut off.
The conductive wrapped foam processing technology can stably and accurately process conductive wrapped foam products with relatively irregular shapes, so that the mass production and the use of the conductive wrapped foam are smoothly realized, the yield of the conductive wrapped foam is improved, and the quality of electronic products applied to the conductive wrapped foam is ensured.
In some embodiments, the recess has a plurality of recesses, and the dimensions of the recesses (4) are not all the same. Therefore, the grooves with different sizes are arranged, and semi-finished products with required sizes can be machined as required.
In some embodiments, the depth of the groove is 1 mm. From this, set up the reasonable degree of depth of recess, also can set up other depths according to actual need.
In some embodiments, the processing jig is provided with a plurality of positioning holes on the outer periphery. Therefore, when the positioning hole is machined, the machining jig can be positioned by matching the positioning hole with corresponding positioning columns on other mechanisms of the machining equipment.
In some embodiments, a first screw hole is formed in the middle of the first jig plate, a second screw hole is formed in the middle of the second jig plate, and the first screw hole corresponds to the second screw hole. Therefore, the first jig plate and the second jig plate can be fixedly installed through the first screw holes and the second screw holes by screws.
In some embodiments, the first jig plate is provided with a plurality of positioning bosses at a middle portion thereof, the second jig plate is provided with a plurality of through holes, and each of the positioning bosses corresponds to each of the through holes. Therefore, the first jig plate and the second jig plate can be accurately matched and positioned through the positioning bosses and the through holes.
In some embodiments, the first jig plate is provided at a periphery thereof with a plurality of limiting bosses, and the limiting bosses are located around a side surface of the second jig plate when the second jig plate is mounted on the first jig plate. From this, can carry on spacingly to the second tool board of installing on first tool board around the edgewise through spacing boss.
In some embodiments, the locating boss and the locating boss each comprise a platform, a ramp, and a rounded corner. From this, set up the concrete structure of location boss and spacing boss.
In some embodiments, the positioning boss has a platform height of 0.5mm, a ramp height of 1.00mm, and a fillet radius of 0.2 mm. Thus, the specific dimensions of the positioning boss and the structures thereon are set.
In some embodiments, the height of the platform of the limiting boss is 3.0mm, the height of the sloping platform is 2.00mm, and the radius of the fillet is 0.5 mm. Therefore, the limiting boss and the specific size of each structure on the limiting boss are set.
Drawings
Fig. 1 is a top view of a processing jig for a conductive wrapped foam processing process according to an embodiment of the present invention;
FIG. 2 is a top view of a first jig plate of the conductive wrapped-foam process of FIG. 1;
fig. 3 is a side cross-sectional view of the first jig plate shown in fig. 2;
fig. 4 is a top view of a second jig plate of the conductive wrapped foam processing process shown in fig. 1.
In the figure: the processing jig comprises a processing jig 1, a first jig plate 2, a second jig plate 3, a groove 4, a positioning hole 11, a first screw hole 21, a positioning boss 22, a limiting boss 23, a second screw hole 31 and a through hole 32.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 schematically shows a top view structure of a processing jig for a conductive wrapped foam processing process according to an embodiment of the present invention, fig. 2 shows a top view structure of a first jig plate of the conductive wrapped foam processing process in fig. 1, fig. 3 shows a side view structure of the first jig plate in fig. 1, and fig. 4 shows a top view structure of a second jig plate of the conductive wrapped foam processing process in fig. 1. As shown in fig. 1-4, the process requires the use of a processing jig 1, a first jig plate 2 and a second jig plate 3, which are specially made, in addition to the die cutting equipment. Wherein, processing tool 1 is installed and is used in cooperation with the cutter of equipment etc. on the cross cutting equipment, and first tool board 2 and second tool board 3 then break away from the cross cutting equipment and use alone.
Except the conventional structures such as the installation position that is used for installing the material to be processed on the processing jig 1, still be formed with the recess 4 of rectangular shape on it, the recess 4 has certain sunken downwards on the surface of processing jig 1, when installing the material to be processed on processing jig 1 and use the cutter to carry out the cross cutting, because the existence of recess 4, can guarantee to have fixed incision on the material man-hour, nevertheless can not thoroughly be cut off yet.
Preferably, a plurality of grooves 4 are formed on the processing jig 1, the plurality of grooves 4 are generally arranged side by side on the surface of the processing jig 1, the sizes of the grooves 4, the distances between the grooves and the like are not completely the same, and when the processing is specifically performed, the proper grooves 4 can be selected to process the material to be processed according to actual requirements. In addition, the cutter on the die cutting equipment also needs to be specially designed according to the distribution characteristics of the grooves 4 on the processing jig 1.
Preferably, the depth of the groove 4 may be 1 mm. In addition, the size of the tool can be set to other sizes according to different processing requirements.
In addition, a plurality of positioning holes 11 are distributed on the periphery of the processing jig 1, and these positioning holes 11 can be matched with positioning columns and other mechanisms on the die cutting equipment for positioning during processing.
The overall shape of the first jig plate 2 can be irregular so as to facilitate the operation, and the overall shape of the second jig plate 3 needs to be specially designed, especially the edge needs to be designed into the shape that the conductive packaging foam product is bent into. The second jig plate 3 is smaller than the first jig plate 2 in size, and when the second jig plate 3 is installed in the center of the top of the first jig plate 2, the periphery thereof does not exceed the range directly above the first jig plate 2.
Preferably, a first screw hole 21 is formed in the middle of the first jig plate 2, and a second screw hole 31 is formed in the middle of the second jig plate 3, so that when the second jig plate 3 is installed at the top center of the first jig plate 2, the first jig plate 2 and the second jig plate 3 can be fixedly installed by using screws through the first screw hole 21 and the second screw hole 31.
Be provided with a plurality of location bosss 22 in the middle part of first tool board 2, location boss 22 generally uses first screw 21 to distribute comparatively evenly as the center, and is provided with a plurality of through-holes 32 on second tool board 3, when installing second tool board 3 at the top of first tool board 2 central authorities, each location boss 22 passes each through-hole 32 respectively to realize accurate location.
The positioning boss 22 may be integrally formed with the first jig plate 2, or may be insertable and detachable, wherein the portion of the positioning boss 22 exposed outside the first jig plate 2 is sequentially divided into a platform, an inclined table and a fillet. Preferably, the height of the platform is 0.5mm, the height of the inclined platform is 1.00mm, and the radius of the fillet is 0.2 mm.
Be provided with a plurality of spacing bosss 23 in the middle part of first tool board 2, spacing boss 23 generally also uses first screw 21 to distribute comparatively evenly as the center to the distance between each spacing boss 23 exceeds the size of second tool board 3. When the second jig plate 3 is installed at the top center of the first jig plate 2, each limiting boss 23 is located around the side face of the second jig plate 3, respectively, so as to limit the second jig plate 3, and meanwhile, the semi-finished product is not affected to be attached to the edge of the second jig plate 3.
The limiting boss 23 can be integrally formed with the first jig plate 2, and can also be inserted and detached, wherein the part of the limiting boss 23 exposed outside the first jig plate 2 is also sequentially divided into a platform, an inclined table and a fillet. Preferably, the height of the platform is 3.0mm, the height of the inclined platform is 2.00mm, and the radius of the fillet is 0.5 mm.
When the processing technology is used for processing the conductive wrapping foam, the processing technology mainly comprises the following steps:
a) installing a processing jig 1 on die cutting equipment, corresponding to a cutter, and then fixedly installing a conductive wrapping foam material to be processed on the processing jig 1;
b) operating the die cutting equipment to enable a cutter to process the conductive wrapping foam material arranged on the processing jig 1, and processing the conductive wrapping foam material into a long strip-shaped semi-finished product, wherein the semi-finished product can be ensured to have a fixed cut due to the existence of the groove 4, but cannot be completely cut off;
c) taking a first jig plate 2 and a second jig plate 3, and installing the second jig plate 3 in the center of the top of the first jig plate 2, wherein during installation, a screw is used for fixing through a first screw hole 21 and a second screw hole 31, positioning is carried out through a positioning boss 22 and a through hole 32, and the second jig plate 3 is limited through a limiting boss 23;
d) the semi-finished product is attached to the edge of the second jig plate 3 and surrounds the second jig plate 3, so that the semi-finished product can be wound into a characteristic shape along the edge of the second jig plate 3, a conductive wrapping foam product with a required shape is obtained, and then the semi-finished product can be selected for proper sizing and installed in an electronic product.
The conductive wrapped foam processing technology can stably and accurately process conductive wrapped foam products with relatively irregular shapes, so that the mass production and the use of the conductive wrapped foam are smoothly realized, the yield of the conductive wrapped foam is improved, and the quality of electronic products applied by the conductive wrapped foam is ensured.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims (8)

1. A processing technology of conductive wrapping foam is characterized in that: comprises the following steps
a) Installing a processing jig (1) on die cutting equipment, and fixedly installing a material to be processed on the processing jig (1);
b) processing the material arranged on the processing jig (1) by using a cutter of die cutting equipment to obtain a semi-finished product;
c) taking a first jig plate (2) and a second jig plate (3), and installing the second jig plate (3) in the center of the top of the first jig plate (2);
d) attaching the semi-finished product to the edge of the second jig plate (3) and surrounding the second jig plate (3) to obtain a product;
wherein, a strip-shaped groove (4) is formed on the processing jig (1), and the semi-finished product is not cut off;
a plurality of positioning bosses (22) are arranged in the middle of the first jig plate (2), a plurality of through holes (32) are arranged on the second jig plate (3), and each positioning boss (22) corresponds to each through hole (32) respectively;
the periphery of the first jig plate (2) is provided with a plurality of limiting bosses (23), and when the second jig plate (3) is installed on the first jig plate (2), the limiting bosses (23) are located around the side face of the second jig plate (3).
2. The processing technology of the conductive wrapping foam as claimed in claim 1, wherein the processing technology comprises the following steps: the grooves (4) are provided with a plurality of grooves, and the sizes of the grooves (4) are not identical.
3. The processing technology of the conductive wrapping foam as claimed in claim 1, wherein the processing technology comprises the following steps: the depth of the groove (4) is 1 mm.
4. The processing technology of the conductive wrapping foam as claimed in claim 1, wherein the processing technology comprises the following steps: the periphery of the processing jig (1) is provided with a plurality of positioning holes (11).
5. The processing technology of the conductive wrapping foam as claimed in claim 1, wherein the processing technology comprises the following steps: the middle part of the first jig plate (2) is provided with a first screw hole (21), the middle part of the second jig plate (3) is provided with a second screw hole (31), and the first screw hole (21) corresponds to the second screw hole (31).
6. The processing technology of the conductive wrapping foam as claimed in claim 1, wherein the processing technology comprises the following steps: the positioning boss (22) and the limiting boss (23) comprise platforms, inclined platforms and round corners.
7. The processing technology of the conductive wrapping foam as claimed in claim 6, wherein the processing technology comprises the following steps: the platform height of location boss (22) is 0.5mm, and the sloping platform height is 1.00mm, and fillet radius is 0.2 mm.
8. The processing technology of the conductive wrapping foam as claimed in claim 6, wherein the processing technology comprises the following steps: the height of the platform of the limiting boss (23) is 3.0mm, the height of the inclined platform is 2.00mm, and the radius of the fillet is 0.5 mm.
CN202010669956.6A 2020-07-13 2020-07-13 Processing technology of conductive wrapped foam Active CN111873036B (en)

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Application Number Priority Date Filing Date Title
CN202010669956.6A CN111873036B (en) 2020-07-13 2020-07-13 Processing technology of conductive wrapped foam

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CN111873036B true CN111873036B (en) 2022-05-17

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09117962A (en) * 1995-01-30 1997-05-06 Nishikawa Rubber Co Ltd Production of latex sponge
CN102705326A (en) * 2012-06-04 2012-10-03 昆山迈致治具科技有限公司 Tool for pressing conductive adhesive
CN206201103U (en) * 2016-10-25 2017-05-31 上海景奕电子科技有限公司 A kind of die-cutting apparatus for conducting foam tooth punching line
CN107443478A (en) * 2017-07-14 2017-12-08 泛泰大西(常州)电子科技股份有限公司 The production technology of bar shaped foam cutting part
CN207930788U (en) * 2018-01-24 2018-10-02 东莞领杰金属精密制造科技有限公司 The high-accuracy processing unit (plant) of earphone foam material
CN109501234A (en) * 2018-12-21 2019-03-22 隆扬电子(昆山)有限公司 For the molding equivalent jig of conducting foam and processing method
CN109969486A (en) * 2019-04-25 2019-07-05 东莞捷邦实业有限公司 A kind of manufacture craft of rectangular wrapping device and flexible package foam
CN111070322A (en) * 2019-12-20 2020-04-28 无锡积捷光电材料有限公司 Die-cutting non-knife-mark processing technology of adhesive product

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09117962A (en) * 1995-01-30 1997-05-06 Nishikawa Rubber Co Ltd Production of latex sponge
CN102705326A (en) * 2012-06-04 2012-10-03 昆山迈致治具科技有限公司 Tool for pressing conductive adhesive
CN206201103U (en) * 2016-10-25 2017-05-31 上海景奕电子科技有限公司 A kind of die-cutting apparatus for conducting foam tooth punching line
CN107443478A (en) * 2017-07-14 2017-12-08 泛泰大西(常州)电子科技股份有限公司 The production technology of bar shaped foam cutting part
CN207930788U (en) * 2018-01-24 2018-10-02 东莞领杰金属精密制造科技有限公司 The high-accuracy processing unit (plant) of earphone foam material
CN109501234A (en) * 2018-12-21 2019-03-22 隆扬电子(昆山)有限公司 For the molding equivalent jig of conducting foam and processing method
CN109969486A (en) * 2019-04-25 2019-07-05 东莞捷邦实业有限公司 A kind of manufacture craft of rectangular wrapping device and flexible package foam
CN111070322A (en) * 2019-12-20 2020-04-28 无锡积捷光电材料有限公司 Die-cutting non-knife-mark processing technology of adhesive product

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