CN111865357B - AIP radio frequency front end - Google Patents
AIP radio frequency front end Download PDFInfo
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- CN111865357B CN111865357B CN202010778674.XA CN202010778674A CN111865357B CN 111865357 B CN111865357 B CN 111865357B CN 202010778674 A CN202010778674 A CN 202010778674A CN 111865357 B CN111865357 B CN 111865357B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
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- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention discloses an AIP radio frequency front end, which comprises a radio frequency AIP unit, a control integrated board unit and a structure connecting unit, wherein the radio frequency AIP unit is pasted on the control integrated unit to communicate a radio frequency signal, a low frequency signal and a power supply signal of the radio frequency AIP unit and the control integrated unit, and the control integrated unit is fixedly arranged on the structure connecting unit. Through the mode, the invention gives full play to the combination advantages of radio frequency layout and process manufacturing, organically combines antenna integration, power supply control and structural connection, has good integration effect and simple implementation mode, avoids the difficulty of multiple times of previous pressing, simultaneously has simpler processing of the matched low-frequency control board, realizes the direct connection of the chip and the antenna in position, and simultaneously realizes the nearby realization of the path because the processing difficulty of the antenna is reduced, and minimizes the loss of radio frequency energy.
Description
Technical Field
The invention relates to the technical field of millimeter wave radio frequency integration, in particular to an AIP radio frequency front end.
Background
Currently, 5G millimeter wave technology is developing rapidly, and compared with the sub6 frequency band, the 5G millimeter wave has a high frequency band and a short wavelength, and the requirement for space integration is very urgent. Since the application scenarios of 5G millimeter waves are mostly to be placed indoors, for a communication base station, the radio frequency front end is an important part of the base station, and the realization of miniaturization thereof is a problem to be solved urgently.
The existing 5G millimeter wave base station radio frequency front end technology is realized in a single mode, and a metal packaging antenna integration scheme or a multi-pressing radio frequency board antenna integration scheme is often adopted.
For the former, a iii-v family radio frequency monolithic integrated circuit is generally adopted, a single-layer radio frequency passive circuit is matched, the micro-assembly process is utilized to realize integration with a corresponding metal structural member, meanwhile, a corresponding power control panel is assisted to realize a radio frequency feed front end, and finally, an independent antenna unit is matched to finally realize the radio frequency front end.
Another scheme is a multilayer press-fit radio frequency antenna integration scheme, the scheme adopts a silicon-based CMOS radio frequency multifunctional chip to realize amplification and modulation of radio frequency signals, utilizes a radio frequency plate to realize an antenna function network and a chip power supply and control network, and pastes and mounts the chip and the radio frequency antenna plate after the radio frequency antenna plate is integrally formed, thereby realizing the completion of an active antenna network. Then, the corresponding power system and the structural system are matched to realize the radio frequency front end architecture. The radio frequency plate has good high-frequency performance and certain integration capability, and is suitable for realizing radio frequency networks of various communication architectures. However, the existing rf front-end has the following disadvantages: 1. the existing radio frequency front end is large in size, too high in cost, relatively poor in integration level and difficult to apply to a large-scale commercial base station scene due to the disadvantages of cost. 2. Another problem of the existing rf front end is that it is difficult to select rf plates, and when it implements multiple functional networks simultaneously, it needs very high requirements for processing technology, and it can be implemented by few manufacturers in China. The cost is correspondingly high. 3. The radio frequency feed path between the antenna and the radio frequency chip is long, and has overhigh loss, thereby providing a very high challenge for the energy efficiency of the 5G millimeter wave base station.
Disclosure of Invention
The invention aims to provide an AIP (antenna in Package) radio frequency front end, wherein an antenna and a chip are integrated in a package based on packaging materials and a packaging process, a technology of a system-level wireless function is realized, the combination advantage of radio frequency layout and process manufacturing is fully exerted, the antenna integration, control power supply and structural connection are organically combined, the integration effect is good, the realization mode is simple, the difficulty of multiple times of pressing in the past is avoided, the processing of a matched low-frequency control board is simpler, the chip and the antenna are directly connected in position, and meanwhile, the processing difficulty of the antenna is reduced, the middle path is realized nearby, and the loss of radio frequency energy is lowest.
In order to solve the technical problems, the invention adopts a technical scheme that: the utility model provides a AIP radio frequency front end, includes radio frequency AIP unit, control integrated board unit and structure connecting element, radio frequency AIP unit paster is to controlling integrated unit and is gone up radio frequency signal, low frequency signal and the power signal UNICOM of radio frequency AIP unit and control integrated unit, control integrated unit fixed mounting is on structure connecting element.
Furthermore, a plurality of radio frequency AIP unit patches are combined on the control integration board unit in an array mode.
Further, the control integrated unit comprises a control integrated board and a connector, a bonding pad and a chip avoiding groove are arranged on the surface of the control integrated board, and the control integrated board comprises a power supply part, a radio frequency feed part and a low-frequency signal part.
Furthermore, the radio frequency AIP unit comprises a radio frequency chip and an integrated antenna board, wherein solder balls are implanted in advance in functions of each part of the radio frequency chip, and the solder balls are connected with bonding pads on the control integrated board in a reflow soldering mode.
Further, the structural connection unit comprises a structural connection piece, a radiating block is fixedly mounted on the structural connection piece, and the radiating block corresponds to the avoidance groove in position and is embedded into the avoidance groove.
Further, the integrated antenna board comprises a radio frequency feed part, a low frequency switching part and an antenna realizing part, and the radio frequency feed part, the low frequency switching part and the antenna realizing part are subjected to solder ball pre-implantation treatment.
Further, the radio frequency feed part feeds in a radio frequency signal connection between the radio frequency chip and the antenna and an input signal of the radio frequency chip, and fans out through a solder ball of the integrated antenna board; after the low-frequency signal and the power supply of the radio frequency chip are switched to the control integrated board through the solder balls, the functions are regularly divided, and finally the fan-out is realized by the solder balls of the integrated antenna board, and the antenna part mainly realizes the amplification and the space radiation of the radio frequency signal.
Further, the low-frequency signal, the radio frequency feed and the power supply control of the radio frequency AIP unit are in functional conduction with the low-frequency signal, the radio frequency feed and the power supply in the control integration board, and the conducted signals are output through the connector.
Further, the edge of the control integration plate is provided with a mounting hole, and the mounting hole fixedly connects the structural connecting piece with the control integration plate through a screw.
Further, the integrated antenna board is made of an M6 radio frequency board and a Rogers 4350 radio frequency board.
The invention has the beneficial effects that: the AIP radio frequency front end provided by the invention fully exerts the combination advantages of radio frequency layout and process manufacturing, organically combines antenna integration, power supply control and structural connection, has a good integration effect and a simple implementation mode, avoids the difficulty of multiple times of previous pressing, simultaneously has simpler processing of a matched low-frequency control board, realizes position direct connection between a chip and an antenna, and simultaneously realizes the near realization of a middle path because the processing difficulty of the antenna is reduced, and minimizes the loss of radio frequency energy.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of an AIP RF front end according to the present invention;
1. a power source; 2. feeding radio frequency; 3. an antenna; 4. a radio frequency chip; 5. a solder ball; 6. a low frequency signal; 7. feeding radio frequency; 8. a power source; 9. a low frequency signal; 10. a pad; 11. a control integration board; 12. a connector; 13. a structural connecting plate; 14. a heat dissipating block; 15. an integrated antenna board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.
Also, in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, an embodiment of the present invention includes: the utility model provides a radio frequency front end of AIP, includes radio frequency AIP unit, control integrated board unit and structure connecting element, radio frequency AIP unit paster is to controlling integrated unit on with radio frequency AIP unit and control integrated unit's radio frequency signal, low frequency signal and power signal UNICOM, control integrated unit fixed mounting is on structure connecting element.
Furthermore, a plurality of radio frequency AIP unit patches are combined on the control integration board unit in an array mode.
Further, the control integrated unit comprises a control integrated board 11 and a connector 12, a pad 10 and a chip avoiding groove are arranged on the surface of the control integrated board 11, and the control integrated board 11 comprises a power supply 8 part, a radio frequency feed 7 part and a low frequency signal 9 part.
Further, the radio frequency AIP unit comprises a radio frequency chip 4 and an integrated antenna board 15, wherein solder balls 5 are implanted in advance to manufacture functions of each part of the radio frequency chip 4, and the solder balls 5 are connected with bonding pads 10 on a control integrated board 11 in a reflow soldering mode. The RF chip is manufactured by ball-planting in advance, and the size of a solder ball is generally 100 um. After the wafer is manufactured, the rf chip may be subjected to solder ball manufacturing, i.e., the solder ball and the chip are integrated, which is called solder ball implanting operation, so that the chip may be applied to flip chip bonding. Typically by a wafer fab.
Further, the structure connection unit comprises a structure connection piece 13, a radiating block 14 is fixedly mounted on the structure connection piece 13, and the radiating block 14 corresponds to the avoidance groove in position and is embedded into the avoidance groove.
Further, the integrated antenna board 15 includes a radio frequency feed 2 portion, a low frequency signal transfer portion and an antenna 3, and the radio frequency feed 2 portion, the low frequency signal transfer portion and the antenna 3 realize that the antenna unit portion performs solder ball 5 pre-implantation treatment, and function is to radiate and amplify the radio frequency signal output by the chip to the space. After the AIP is partially formed, the ball-mounting operation is performed, and the size of the solder ball is generally 250 um. In order to physically connect the AIP antenna and the control board, the AIP part needs to be subjected to ball mounting operation, namely, the bonding pads of the AIP are subjected to ball welding.
Further, the radio frequency feeding portion feeds in the radio frequency signal connection between the radio frequency chip 4 and the antenna 3 and the input signal of the radio frequency chip 4, and fans out via the solder balls 5 of the integrated antenna board 15; the low-frequency connecting part transfers the low-frequency signal 6 of the radio-frequency chip 4 and the power supply 1 to the control integrated board 15 through the solder balls 5, the functions are regularly divided, the fan-out is finally carried out by the solder balls 5 of the integrated antenna board 15, and the antenna 3 mainly realizes the amplification and the space radiation of the radio-frequency signal.
Further, the low-frequency signal 6, the radio frequency feed 2 and the power supply 1 of the radio frequency AIP unit are controlled to be in functional conduction with the low-frequency signal 9, the radio frequency feed 7 and the power supply 8 in the control integration board 11, and the conducted signals are output outwards through the connector 12.
Further, the edge of the control integration plate 11 is provided with a mounting hole, and the mounting hole fixedly connects the structural connecting piece 13 with the control integration plate 11 through a screw.
Further, the integrated antenna board 11 is made of M6 rf board or ROGERS 4350 rf board.
The invention carries out SMT (surface mount technology) surface mounting on the radio frequency AIP to the control integrated board, realizes the communication of radio frequency signals, low frequency signals and power signals, combines the structure connecting piece with the parts, realizes the radiating surface of a chip through the radiating block, simultaneously carries out mounting hole arrangement on the edge of the control integrated board, and uses screws to fasten with the structure connecting piece. And finally, the AIP radio frequency front end is realized. The implementation of the various parts in the middle is described as follows:
and the radio frequency AIP part consists of a radio frequency chip 4 and an integrated antenna board 15. The radio frequency chip 4 is pre-implanted with solder balls, and the functions of each part of the chip are manufactured with solder balls. The integrated antenna board 15 is generally manufactured by using a radio frequency board (M6 or ROGERS 4350, board model), and the functions of the integrated antenna board 15 include three parts, namely a radio frequency feed part, a low frequency switching part and an antenna implementation part. The radio frequency feed 2 part mainly realizes radio frequency signal connection between a radio frequency chip and an antenna and input signal feed-in of the radio frequency chip, and fan-out is realized through a solder ball 5 of an integrated antenna board 15; the low-frequency connecting part is mainly used for transferring the low-frequency signals 6 and the power supply of the chip to the antenna control board through the solder balls, regularly dividing the functions and finally fanning out by the solder balls 5 of the integrated antenna board 15. The antenna 3 part mainly amplifies and spatially radiates radio frequency signals. The signal of which comes from the chip 4 via the radio frequency feed 2 to the antenna 3.
The control integration board portion is mainly composed of the control integration board 11 and the connector 12. The main function of the part is to array combine a plurality of radio frequency AIPs, and the mounting connection is realized through the solder balls 5 of the radio frequency AIP unit and the bonding pads 10 on the control integrated board 11. The solder balls 5 and the pads 10 are connected by means of reflow soldering. After the low-frequency signal 6, the radio frequency feed 2 and the power supply 1 of the radio frequency AIP unit are communicated, the low-frequency signal 9, the radio frequency feed 7 and the power supply 8 in the control integration board 11 are controlled to be in functional conduction. The conducted signals are output to the outside through the connector 12. After the control integrated board 11 is welded with the radio frequency AIP unit, the control integrated board 11 needs to be grooved and avoided, and the connection reliability of the solder balls 5 and the bonding pads 10 is improved.
The structural connector part mainly comprises a structural connector 13 and a radiating block 14, and the main function of the structural connector part is to provide structural support and heat conduction for the whole radio frequency AIP unit and the control integrated board. The welded control integrated board 11 is fixed on the structural connecting piece through a screw, and meanwhile, as the chip is avoided through the avoiding groove of the control integrated board 11, the structural radiating block 14 is well attached to the back of the chip by utilizing the heat conducting pad, and heat conduction is provided.
The invention mainly solves the defects of high cost, complex manufacture and difficult batch manufacture of the traditional radio frequency front end realization mode of the 5G millimeter wave base station. The invention is based on AIP (integrated antenna) framework, and realizes the manufacturing scheme of the radio frequency front end under the conditions of lower cost and more ingenious design mode. The combination advantages of radio frequency layout and process manufacturing are fully exerted, and antenna integration, power supply control and structural connection are organically combined. The radio frequency front end mainly solves three problems of the existing radio frequency front end, namely, in the aspect of integration level, the existing radio frequency front end is large in size, too high in cost and relatively poor in integration level. The invention solves the problem well, makes the radio frequency front end antenna have high integration effect, and has simple realization mode, and simultaneously, the application of the radio frequency AIP makes the unit size of the array surface obtain a larger selection space. In the aspect of cost, the existing common radio frequency front end has higher cost mainly because the adopted framework is the integration of radio frequency feed, low frequency control and antenna integration of a single antenna board, which has higher processing difficulty and lower processing yield of the board and correspondingly brings higher cost. The disadvantage in large-scale application of the 5G base station is large. The AIP antenna plate is low in processing difficulty, the thickness of the plate is in a controllable range, the difficulty of multiple times of previous pressing is reduced, meanwhile, the matched low-frequency control plate is simpler to process, and the cost is far lower than that of the traditional scheme. In the aspect of performance, the requirement of the radio frequency front end of the 5G base station on the performance is high, and the radio frequency energy loss is too high due to the fact that the middle path of an antenna unit realized by the traditional multi-time laminated plate is too long and cannot be directly connected with the output end of a chip. By adopting the AIP antenna framework, the chip and the antenna are directly connected in position, and meanwhile, the processing difficulty of the antenna is reduced, and the middle path is realized nearby. The loss of radio frequency energy is minimized.
The invention has the distinct characteristic for the realization of the radio frequency front end of the 5G millimeter wave base station through the combination of the AIP mode. Meanwhile, for the field of millimeter wave radio frequency front ends, the selection of a design scheme is increased.
Furthermore, it should be noted that in the present specification, "include" or any other variation thereof is intended to cover a non-exclusive inclusion, so that a process, a method, an article or an apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or further includes elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.
Claims (2)
1. An AIP radio frequency front end is characterized by comprising a radio frequency AIP unit, a control integrated board unit and a structure connecting unit, wherein the radio frequency AIP unit is pasted on the control integrated unit to communicate radio frequency signals, low frequency signals and power signals of the radio frequency AIP unit and the control integrated unit, and the control integrated unit is fixedly arranged on the structure connecting unit; a plurality of radio frequency AIP unit patches are combined on the control integrated board unit in an array mode; the control integrated unit comprises a control integrated board and a connector, and a bonding pad and a chip avoidance groove are arranged on the surface of the control integrated board; the radio frequency AIP unit comprises a radio frequency chip and an integrated antenna board, wherein each part of the radio frequency chip is manufactured by implanting solder balls in advance, and the solder balls are connected with bonding pads on the control integrated board in a reflow soldering manner; the structure connecting unit comprises a structure connecting piece, a heat dissipation block is fixedly arranged on the structure connecting piece, and the heat dissipation block corresponds to the chip avoidance groove in position and is embedded into the chip avoidance groove; the integrated antenna plate comprises a radio frequency feed part, a low frequency switching part and an antenna realizing part, wherein the radio frequency feed part, the low frequency switching part and the antenna realizing part are subjected to solder ball pre-implantation treatment; the radio frequency feed part feeds in a radio frequency signal connection between the radio frequency chip and the antenna and an input signal of the radio frequency chip, and fans out through a solder ball of the integrated antenna board; after the low-frequency signal and the power supply of the radio frequency chip are switched to the control integrated board through the solder balls, the low-frequency signal and the power supply signal are integrated, namely, the signals with the same function are combined, meanwhile, different layers of layout design is carried out on different signals, electromagnetic interference is avoided, fan-out is finally carried out through the solder balls of the integrated antenna board, and the antenna part amplifies the radio frequency signal and carries out spatial radiation; the low-frequency signal, the radio frequency feed and the power supply control of the radio frequency AIP unit realize functional conduction with the low-frequency signal, the radio frequency feed and the power supply in the control integration board and output various conducted signals through the connector; the edge of the control integration plate is provided with a mounting hole, and the structural connecting piece and the control integration plate are fixedly connected through screws by the mounting hole.
2. The AIP radio frequency front end of claim 1, wherein: the integrated antenna board is made of M6 radio frequency boards and Rogers 4350 radio frequency boards.
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| CN202010778674.XA CN111865357B (en) | 2020-08-05 | 2020-08-05 | AIP radio frequency front end |
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| CN202010778674.XA CN111865357B (en) | 2020-08-05 | 2020-08-05 | AIP radio frequency front end |
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| CN111199957A (en) * | 2019-12-30 | 2020-05-26 | 厦门云天半导体科技有限公司 | Three-dimensional packaging structure integrating chip and antenna and preparation method thereof |
| CN210897279U (en) * | 2019-12-24 | 2020-06-30 | 华进半导体封装先导技术研发中心有限公司 | Embedded packaging structure of integrated antenna and radio frequency front end based on metal substrate |
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| US9620464B2 (en) * | 2014-08-13 | 2017-04-11 | International Business Machines Corporation | Wireless communications package with integrated antennas and air cavity |
| CN108879114A (en) * | 2017-05-16 | 2018-11-23 | 华为技术有限公司 | Integrated antenna packages structure and terminal |
| CN107481998B (en) * | 2017-07-05 | 2020-07-07 | 华为技术有限公司 | Packaging structure and electronic device |
| US10784563B2 (en) * | 2018-02-21 | 2020-09-22 | International Business Machines Corporation | Scalable phased array package |
| CN109687165A (en) * | 2018-12-29 | 2019-04-26 | 瑞声科技（南京）有限公司 | Millimeter wave array antenna mould group and mobile terminal |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210575925U (en) * | 2019-09-23 | 2020-05-19 | 加特兰微电子科技(上海)有限公司 | Encapsulation module and radar system |
| CN210897279U (en) * | 2019-12-24 | 2020-06-30 | 华进半导体封装先导技术研发中心有限公司 | Embedded packaging structure of integrated antenna and radio frequency front end based on metal substrate |
| CN111199957A (en) * | 2019-12-30 | 2020-05-26 | 厦门云天半导体科技有限公司 | Three-dimensional packaging structure integrating chip and antenna and preparation method thereof |
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