CN111863855A - Method for manufacturing light emitting module and light emitting module - Google Patents

Method for manufacturing light emitting module and light emitting module Download PDF

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Publication number
CN111863855A
CN111863855A CN202010319566.6A CN202010319566A CN111863855A CN 111863855 A CN111863855 A CN 111863855A CN 202010319566 A CN202010319566 A CN 202010319566A CN 111863855 A CN111863855 A CN 111863855A
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CN
China
Prior art keywords
light
conductive paste
bottomed
hole
light emitting
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Pending
Application number
CN202010319566.6A
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Chinese (zh)
Inventor
凑永子
田口晃治
龟岛由美子
胜又雅昭
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Nichia Corp
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Nichia Corp
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Filing date
Publication date
Priority claimed from JP2019215168A external-priority patent/JP7004921B2/en
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN111863855A publication Critical patent/CN111863855A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
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    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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    • H05K3/22—Secondary treatment of printed circuits
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

Provided are a method of manufacturing a light emitting module and the light emitting module. The method for manufacturing the light emitting module comprises the following steps: a preparation step (S11) for preparing a bonded substrate (25), the method comprising: a substrate (15) having a circuit pattern (17) and bottomed holes (18a1, 18a2) formed in a pair of wiring pads (18) continuous with the circuit pattern on one surface side; and a plurality of light-emitting sections (10) connected to the other surface side of the substrate via an adhesive sheet (20), the light-emitting sections being formed by arranging a plurality of light-emitting devices (1); a filling step (S12) for filling the conductive paste (30) into the bottomed hole via the opening hole of the mask, and for providing the conductive paste on a part of the surface of the wiring pad around the bottomed hole; and a heat pressing step (S13) in which the conductive paste is heated and pressed to make the thickness of the conductive paste on a part of the surface of the wiring pad smaller than that when the conductive paste is set through the opening hole of the mask, and the conductive paste filled in the hole with the bottom is cured.

Description

Method for manufacturing light emitting module and light emitting module
Technical Field
The present disclosure relates to a method of manufacturing a light emitting module and a light emitting module.
Background
Conventionally, in a connection structure of a printed circuit board, a mounting method of an electric component, or a manufacturing method of a connection structure, a pressing force is applied to reduce a thickness or a resistance value. For example, in a printed circuit board connection structure, it is described that solder paste is reflowed and melted into a through hole (see patent document 1). Further, in a method of mounting an electric component, it is described that the electric component is mounted by depressing a pressure contact member (see patent document 2). Further, it is described that in the method for manufacturing a connection structure, a hot press time corresponding to the viscosity of the anisotropic conductive adhesive is set in the hot press step and the connection structure is pressed (see patent document 3).
Prior art documents
Patent document
Patent document 1: japanese laid-open patent publication No. 60-49698
Patent document 2: japanese patent laid-open publication Nos. 2013-48300
Patent document 3: japanese patent laid-open publication No. 2017-175045
However, in the conventional method for thinning, the adhesive material is heated and pressed only in the through hole or only on the substrate side to realize thinning, but when the conductive paste is used to electrically connect to the through hole formed in the substrate, it is desired to further reduce the resistance value of the conductive paste.
Disclosure of Invention
An object of an embodiment according to the present disclosure is to provide a method for manufacturing a light emitting module capable of reducing a resistance value of a conductive paste, and a light emitting module.
A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes: a preparation step of preparing a bonded substrate, the bonded substrate including: a substrate having a circuit pattern on one surface side and bottomed holes formed in a pair of wiring pads continuous with the circuit pattern, respectively; and a plurality of light-emitting sections formed by connecting the other surface side of the substrate via an adhesive sheet and arranging a plurality of light-emitting devices; a filling step of filling the bottomed hole with a conductive paste through an opening hole of a mask and providing the conductive paste on a part of a surface of the wiring pad around the bottomed hole; and a heat pressing step of curing the conductive paste by heat pressing the conductive paste so that the thickness of the conductive paste on a part of the surface of the wiring pad is smaller than that when the conductive paste is provided through the opening hole of the mask, and curing the conductive paste filled in the bottomed hole.
The light-emitting module according to an embodiment of the present disclosure includes: a substrate having a circuit pattern on one surface side and a plurality of bottomed holes formed for each of a pair of wiring pads continuous with the circuit pattern, and having a conductive paste filled over two or more of the bottomed holes and an insulating resin provided so as to cover the conductive paste from one surface side; and a plurality of light-emitting sections connected to the other surface side of the substrate via an adhesive sheet, wherein the light-emitting sections are formed by arranging a plurality of light-emitting devices, and the conductive paste is formed across two or more of the bottomed holes and in a portion of a surface of the wiring pad.
According to the embodiments of the present disclosure, a wiring board having excellent connection reliability can be provided.
Drawings
Fig. 1 is a perspective view schematically showing the whole light-emitting module according to the embodiment, with a part of the light-emitting module omitted.
Fig. 2 is a perspective view schematically showing one light emitting section in an enlarged manner from the rear surface side in the light emitting module according to the embodiment.
Fig. 3 is a cross-sectional view schematically showing the structure of the light emitting section as a cross-section at the line III-III of fig. 2.
Fig. 4A is an enlarged perspective view schematically showing a wiring pad portion formed for each light-emitting section in the light-emitting module according to the embodiment, with other portions omitted.
Fig. 4B is an enlarged perspective view schematically showing a state where a conductive paste is filled in a bottomed hole formed in the wiring pad of fig. 4A and cured.
Fig. 4C is an enlarged perspective view schematically showing a state in which an insulating resin is provided in the conductive paste in the cured state in fig. 4B.
Fig. 5 is a flowchart illustrating a method of manufacturing a light-emitting module according to an embodiment.
Fig. 6A is an explanatory view schematically showing a cross section of a substrate prepared in a preparation step in the method for manufacturing a light-emitting module according to the embodiment, with a part of the substrate omitted.
Fig. 6B is an explanatory view schematically showing, as a cross section, a state in which a conductive paste is filled in a bottomed hole formed in a wiring pad in the method for manufacturing a light-emitting module according to the embodiment.
Fig. 6C is an explanatory view schematically showing a state where the conductive paste is pressed via the hot plate in the method for manufacturing the light-emitting module according to the embodiment.
Fig. 6D is an explanatory view schematically showing a state where an insulating resin is provided on the conductive paste pressed in the method for manufacturing the light-emitting module according to the embodiment.
Fig. 7A is a schematic enlarged plan view showing a state of a bottomed hole formed in a wiring pad of a light-emitting module and a conductive paste filled in the bottomed hole according to the embodiment.
Fig. 7B is a schematic enlarged plan view of a state 1 of a bottomed hole formed in a wiring pad of the light-emitting module according to the embodiment and a conductive paste filled in the bottomed hole.
Fig. 7C is a schematic enlarged plan view of a 2 nd modification of the light-emitting module according to the embodiment, in which a bottomed hole formed in a wiring pad and a conductive paste filled in the bottomed hole are formed.
Fig. 7D is a schematic enlarged plan view of a wiring pad of the light-emitting module according to the embodiment, in modification 3 of the present invention, showing a bottomed hole and a conductive paste filled in the bottomed hole.
Fig. 7E is a schematic enlarged plan view of a wiring pad of the light-emitting module according to the embodiment, in a state of a bottomed hole and a conductive paste filled in the bottomed hole, according to modification 4.
Fig. 7F is a schematic enlarged plan view of a state of the conductive paste filled in the bottomed hole and the bottomed hole formed in the wiring pad of the light-emitting module according to the embodiment in modification 5.
Fig. 8A is a plan view showing a relationship between a bottomed hole and a mask opening hole in modification 6.
Fig. 8B is an enlarged perspective view of the vicinity of the wiring pad before the conductive paste in modification 6 is provided.
Fig. 8C is an enlarged perspective view of the vicinity of the wiring pad after the conductive paste in modification 6 is provided.
Fig. 9A is a plan view showing a relationship between a bottomed hole and a mask opening hole in modification 7.
Fig. 9B is a plan view showing a relationship between a bottomed hole and a mask opening hole in the 8 th modification.
Fig. 9C is a plan view showing a relationship between a bottomed hole and a mask opening hole in the 9 th modification.
Fig. 9D is a plan view showing a relationship between a bottomed hole and a mask opening hole in the 10 th modification.
Fig. 10A is a plan view showing a diagonal line of the outer shape of the entire adhesive substrate viewed from the wiring pad side.
Fig. 10B is an enlarged view of a wiring pad portion in the same direction as fig. 10A.
Fig. 11 is a cross-sectional view showing a case where a peripheral portion of a through-hole or a bottomed hole provided in a wiring pad is bent.
Fig. 12A is a plan view showing an example of a recess provided in a region connecting the bottomed holes.
Fig. 12B is a cross-sectional view at line XB-XB of fig. 12A showing the depth of the depression.
Fig. 12C is a cross-sectional view of an XB-XB line in fig. 12A showing an example of providing a conductive paste in the recess and the bottomed hole.
Fig. 13A is a plan view showing an example of a recess provided in a region not connected to another bottomed hole.
Fig. 13B is a cross-sectional view at line XIB-XIB of fig. 13A showing the depth of the depression.
Fig. 13C is a cross-sectional view taken along line XIB-XIB in fig. 13A showing an example of disposing a conductive paste in the recess and the bottomed hole.
Fig. 14A is a perspective view showing an example of a punch for forming the recess.
Fig. 14B is a plan view showing an example of a punch for forming the recess.
Fig. 14C is a perspective view showing an example of a punch capable of forming both a through hole and a recess.
Fig. 14D is a perspective view showing an example of a punch for forming a V-shaped recess.
Fig. 14E is a perspective view showing an example of a punch capable of forming both a through hole and a V-shaped recess.
Fig. 15A is a schematic view schematically showing an adhesive sheet, a substrate, and a light-emitting section in the preparation step according to the embodiment.
Fig. 15B is a schematic view schematically showing a state where the substrate and the light-emitting section are bonded by a hot plate via an adhesive sheet in the preparation step according to the embodiment.
Fig. 15C is a schematic view showing a state where an extension portion of the adhesive sheet due to heat is formed in the bottomed hole in the preparation step according to the embodiment
-description of symbols-
1 light emitting device
2 light emitting element
3 wavelength conversion member
4 light guide plate
4a optical function part
5 protective component
6 wiring part
8 bending of peripheral edge
9a, 9b are recessed
10 light emitting section
12a1, 12a2, 6 th modification example, oblong shape of mask opening hole
13a, 13b, 13c mask opening edge
15 base plate
16 base material
17 circuit pattern
18. 18C, 18D, 18E, 18F routing pad
18a1, 18c1, 18d1, 18e1, 18f1 have bottomed holes
18a2, 18c2, 18d2, 18e2, 18f2 have bottomed holes
18a11, 18c11, 18d11, 18e11, 18f11 part of the surface
18a12, 18c12, 18d12, 18e12, 18f12 part of the surface
19 protective sheet
20 adhesive sheet
21 extension of adhesive sheet
25 bonded substrate
30. 30B, 30C, 30D, 30E, 30F electrical paste
31. 31B, 31C, 31D, 31E, 31F insertion section
32. 32B, 32C, 32D, 32E, 32F filling parts
40 insulating resin
50a, 50d, 50e, 50h punch
Recess forming part of 50b, 50f punch
Through-hole forming part of 50c and 50g punches
51a bottom surface of punch
51b Linear projections on the bottom of the punch
100 light emitting module
A01 shows an example of an angle in a diagonal direction of the outer shape of the bonded substrate or light-emitting module
A02 shows an example of the angle of inclination of through-holes or bottomed holes formed in parallel
M1, M01, M02, M03, M04, M05 mask open pores
Projection of MP01, MP02, MPa1, MPa2 mask opening holes to the wiring pad surface
Center position of C11, C12 mask opening hole
D11, D12, D21, D22, D31 and D32 mask opening hole inner diameters
Depth of D01 recess
G01, G02 through hole or gap with bottom hole
Detailed Description
Since the drawings referred to in the description of the embodiments below are drawings schematically illustrating the present invention, the proportions, intervals, positional relationships, and the like of the respective members may be exaggerated or a part of the members may be omitted. Further, the ratio and the interval of the respective members may not be uniform. In the following description, the same names and symbols are used for the same or similar members in principle, and detailed description is omitted as appropriate. In addition, in the structure of the wiring substrate, "up", "down", "left", and "right", etc. are replaced according to the situation. In the present specification, "upper" and "lower" are drawings showing relative positions between constituent elements in drawings referred to for explanation, and do not mean absolute positions unless otherwise specified.
In addition, in this embodiment, after the structure of the light emitting module is described first, a method for manufacturing the light emitting module will be described.
< embodiment >
[ light-emitting Module ]
The light emitting module 100 is described with reference to fig. 1 to 4C.
The light-emitting module 100 includes: a substrate 15 having a circuit pattern 17 and a plurality of (four in fig. 2) bottomed holes 18a1, 18a2 formed for each of a pair of wiring pads 18 continuous with the circuit pattern 17 on one surface side, and having a conductive paste 30 and an insulating resin 40; and a plurality of light-emitting sections 10 connected to the other surface side of the substrate 15 via an adhesive sheet 20, the conductive paste being filled in two or more (two in fig. 4B and 4C) bottomed holes 18a1, and the insulating resin being provided so as to cover the conductive paste 30 from one surface side of the substrate 15. Further, the conductive paste 30 forms an intervening portion 31 having a portion that is interposed between the partial surface 18a11 of the wiring pad 18 across the two bottomed holes shown at 18a1 in fig. 4B, and a portion that is interposed between the partial surface 18a12 of the wiring pad 18 across the two bottomed holes shown at 18a2 in fig. 4B. The light emitting module 100 is formed by arranging one or more light emitting sections in which a plurality of light emitting devices 1 are arranged. The following describes each structure of the light-emitting module 100.
[ base plate ]
The substrate 15 has a circuit pattern 17 formed on a base material 16 and wiring pads 18 continuous with the circuit pattern 17 and formed with a plurality of (four in fig. 2) bottomed holes 18a1, 18a 2. Here, the substrate 15 is formed such that a protective sheet 19 is formed on one surface side and is bonded to the plurality of light emitting segments 10 via an adhesive sheet 20 on the other surface side.
The base material 16 forming the substrate 15 is made of an insulating resin material such as a phenol resin, an epoxy resin, a polyimide resin, a BT resin, or polyphthalamide. The substrate 16 may be made of a ceramic material such as alumina or aluminum nitride. The insulating member may be formed on the surface layer of the metal member as the base material 16. In addition, a rigid substrate or a flexible substrate can be used as the substrate 15.
The circuit pattern 17 and the wiring pad 18 can be made of a metal material, and for example, a simple metal such as Ag, Al, Ni, Rh, Au, Cu, Ti, Pt, Pd, Mo, Cr, or W, or an alloy containing these metals can be preferably used. It is more preferable that simple metals such as Ag, Al, Pt, and Rh, or alloys containing these metals, which have excellent light reflectivity, be used.
The wiring pad 18 is formed in a pair, for example, continuously with the circuit pattern 17 for each light-emitting segment 10. The wiring pad 18 is formed in a rectangular region, for example, which is formed to be wider than the wiring width of the circuit pattern 17. Here, the wiring pads 18 are formed so as to face the circuit patterns located on both ends of the light-emitting section 10. In addition, do For example, the pair of wiring pads 18 each have two bottomed holes, i.e., a bottomed hole 18a1 and a bottomed hole 18a 2. The bottomed hole 18a1 and the bottomed hole 18a2 are formed continuously with a via hole formed to penetrate the substrate 16. The diameter of the bottomed holes 18a1 and 18a2 is set to be
Figure BDA0002459600500000081
The above is more preferably 0.3mm or more, and variations in connection resistance can be suppressed to stabilize luminance. In addition, it is preferable that the aspect ratio of the hole diameter to the depth of each of the bottomed holes 18a1 and 18a2 is 0.75 or less, more preferably 0.5 or less, because the conductive paste 30 is easily filled in the bottomed holes 18a1 and 18a 2. The gap G01 between the two bottomed holes 18a1 and the gap G02 between the two bottomed holes 18a2 are preferably 0.1mm to 0.5mm, since the connection resistance can be reduced.
The openings of the bottomed holes 18a1 and the bottomed holes 18a2 are formed in any shape of, for example, a circle, an ellipse, a rectangle, a rhombus, a triangle, a cross, or the like. The number of bottomed holes may be one or more formed in one of the pair of wiring pads 18, and four wiring pads are shown as two or more.
Two bottomed holes 18a1 and two bottomed holes 18a2 are arranged in parallel in a direction inclined with respect to the arrangement direction of the light-emitting devices 1. By disposing the bottomed hole 18al and the bottomed hole 18a2 in the oblique direction, the conductive paste 30 filled by screen printing can be easily filled into both the bottomed holes 18a1 and 18a 2.
The conductive paste 30 is filled in the two bottomed holes 18a1 and the two bottomed holes 18a2, respectively, to electrically conduct current so that current is supplied from the outside to the arranged light emitting devices 1. The conductive paste 30 is filled in the holes from one surface side of the substrate 15 so as to cover the bottomed holes 18a1 and the bottomed holes 18a 2. In other words, the conductive paste 30 is filled in the bottomed hole 18al and the bottomed hole 18a2, and is provided across a part of the surfaces 18a11, 18a12 of the wiring pad 18 between the two bottomed holes 18a1 and between the two bottomed holes 18a 2. The partial surfaces 18a11 and 18a12 of the wiring pad 18 are part of the peripheral edges of the bottomed holes 18a1 and 18a 2.
The conductive paste 30 is provided with a filling portion 32 filled in the two bottomed holes 18a1, and an intervening portion 31 interposed between a part of the surface 18a11 of the wiring pad 18 across the filling portion 32. Similarly, the conductive paste 30 is provided so as to have a filling portion 32 filled in the two bottomed holes 18a2, and an intervening portion 31 interposed between the partial surfaces 18a12 of the wiring pads 18 so as to straddle the filling portion 32. The intervening portion 31 is formed to have a predetermined thickness or less.
The intervening portion 31 is formed by screen printing, for example, in a manufacturing method described later, but is formed to be thinner than that in the screen printing. Specifically, the intervening portion 31 is preferably formed to have a thickness of 15 to 40 μm from the surface of the wiring pad 18, so that the light-emitting module 100 can be thinned. The filling portion 32 is preferably completely filled in the bottomed hole 18a1 or the bottomed hole 18a2, but may be provided in a state where at least electrical conduction can be achieved. The filling portion 32 is preferably filled with 70% or more, more preferably 80% or more and 90% or more, in the bottomed hole 18a1 or the bottomed hole 18a 2.
As the conductive paste 30, for example, paste obtained by mixing a filler such as silver powder or copper powder in a flake, flake or bark form with a thermosetting binder resin can be used. As the conductive paste 30, it is preferable to use a conductive paste having as small a volume resistivity as possible and containing a small amount of a binder resin or a solvent component.
The conductive paste 30 preferably has a volume resistivity of 2X 10-5～1.5×10-4Omega cm, and the content of binder resin is 3-10% by mass. With the conductive paste 30, the resistance value of the interlayer connection portion becomes smaller, and the variation in the resistance value also becomes smaller. The volume resistivity is more preferably 7.5X 10-5The content of the binder resin is more preferably 4 to 6% by mass, which is about Ω · cm. The conductive paste 30 preferably contains a solvent in an amount of 0 to 5 mass%, for example.
The conductive paste 30 is preferably a conductive paste that has little thermal shrinkage during curing. Specifically, the mass reduction rate during curing is preferably 5% or less. With such a conductive paste 30, the flatness of the intervening portion 31 can be controlled more easily.
As described in the manufacturing method described later, the conductive paste 30 is provided with, as an example: filling section 32 filled in two bottomed holes 18a1 and filling section 32 filled in two bottomed holes 18a2 through opening hole M1 of mask MK in screen printing; and intervening portions 31 interposed between a part of the surfaces 18a11, 18a12 of the wiring pads 18 across the respective filling portions 32. In addition, the filling portion 32 and the intervening portion 31 may be in an electrically connectable state without maintaining a specific shape in the hole or on the surface of the wiring pad during curing. Here, as the mask MK, any of a metal mask in which openings are formed by processing SUS (steelsue stainless), and a screen mask in which a mesh of SUS or teflon (registered trademark) is used may be used.
If the conductive paste 30 is provided, the insulating resin 40 may be formed so as to cover the conductive paste from above. The insulating resin 40 protects the wiring pad 18 and the conductive paste 30. As the insulating resin 40, phenyl silicone resin, dimethyl silicone resin, epoxy resin, acrylic resin, urethane resin, or the like can be used. In addition, a pigment may be added to the insulating resin 40 in order to make it opaque.
Protective sheet 19 is formed to have a predetermined thickness so as to cover a predetermined range in order to protect circuit pattern 17 and the like provided on substrate 15. The protective sheet 19 can be formed using the same resin as the insulating resin 40. Further, a film of an acrylic, epoxy, or urethane resin adhesive may be laminated on polyimide, PET, or the like.
[ light-emitting device, light-emitting element ]
The light-emitting device 1 includes, for example: the light-emitting device includes a light-emitting element 2, a wavelength conversion member 3 attached to a light extraction surface side of the light-emitting element 2, a protective member 5 directly or indirectly provided on a side surface of the light-emitting element 2, and a light guide plate 4 including an optical functional portion 4a provided on the protective member 5 and the wavelength conversion member 3. The light emitting device 1 has a wiring portion 6 formed on the side opposite to the light guide plate 4, and a plurality of light emitting devices are arranged to constitute a light emitting section 10.
As the light emitting element 2, a known semiconductor light emitting element can be used, and a light emitting diode is exemplified as the light emitting element 2. The light emitting element 2 can emit white light by using a light source that emits blue light or a light emitting element that emits a plurality of different color lights, for example, by mixing red, blue, and green color lights. As the light emitting element 2, an element emitting light of an arbitrary wavelength can be selected, and the composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose. For example, as an element emitting blue or green light, a nitride semiconductor (In) can be usedxAlyGa1-x-yN, 0. ltoreq. X, 0. ltoreq. Y, X + Y. ltoreq.1) or a light-emitting element using GaP. As an element that emits red light, a light-emitting element including a semiconductor such as GaAlAs or AlInGaP can be used. In addition, a semiconductor light-emitting element made of a material other than the above-described materials can be used, and various emission wavelengths can be selected according to the material of the semiconductor layer and the mixed crystallinity thereof.
The wavelength conversion member 3 includes a light-transmitting material and a phosphor. The light-transmissive material is preferably a material having a higher refractive index than the material of the light guide plate 4. Epoxy resin, silicone resin, a resin obtained by mixing these resins, glass, or the like can be used, but from the viewpoint of light resistance and ease of molding, silicone resin is preferably selected.
The wavelength conversion member 3 varies in the range of wavelengths that can be converted depending on the type of the phosphor, and an appropriate phosphor needs to be selected in order to obtain a wavelength to be converted. Examples of the phosphor include fluoride-based phosphors such as YAG phosphor, LAG phosphor, chlorate-based phosphor, β -sialon phosphor, CASN phosphor, SCASN phosphor, and KSF-based phosphor. In particular, by using a plurality of types of phosphors for one wavelength conversion member 3, it is more preferable that the wavelength conversion member 3 includes a β -sialon phosphor that emits green light and a fluoride phosphor such as a KSF phosphor that emits red light, and thereby the color reproduction range of the light-emitting module can be expanded.
Further, the wavelength conversion member 3 can emit light of a specific color by containing a fluorescent material that emits light of a specific color. Further, the wavelength conversion member 3 may be a quantum dot. The wavelength conversion member 3 is not limited in the arrangement of the wavelength conversion material, and an effective mode such as substantially uniformly distributing the wavelength conversion material, partially deflecting the wavelength conversion material, or laminating a plurality of layers each containing a different wavelength conversion material can be selected.
The wavelength conversion member 3 may be configured to have a diffusion member provided on the light extraction surface side thereof.
The protective member 5 is a member that protects the light emitting element 2 and the light guide plate 4, reflects light from the side surface of the light emitting element 2, and transmits the light to the light extraction surface side. The protective member 5 preferably has light reflectivity, and preferably has a reflectivity of 60% or more, and preferably 90% or more, with respect to light emitted from the light-emitting element 2. By using the light-reflecting member as the protective member 5, light emitted from the light-emitting element 2 can be efficiently taken into the light guide plate 4. The protective member 5 also serves as a member for protecting the light-emitting element 2 and a reflecting member provided on the surface opposite to the emission surface of the light guide plate 4, thereby making it possible to reduce the thickness of the light-emitting module 100.
The material of the protective member 5 is preferably a resin containing a white pigment or the like. The protective member 5 is a material that is used in a relatively large amount to cover one surface of the light guide plate 4, and a silicone resin containing inexpensive titanium oxide is preferably used to reduce the cost of the light emitting module 100.
The light guide plate 4 is a light-transmitting member on which light from the light source enters and which emits light in a planar manner. The light guide plate 4 may have a plurality of optical functional portions 4a on a 1 st main surface which is a light-emitting surface, and a recess portion for accommodating the wavelength conversion member 3 on a 2 nd main surface which is an opposite side of the 1 st main surface.
As a material of the light guide plate 4, a resin material such as a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, a thermosetting resin such as an epoxy resin or a silicone resin, or a material having light transmittance such as glass can be used. In particular, since thermoplastic resin materials can be efficiently produced by injection molding, polycarbonate having high transparency and being inexpensive is more preferable. In the light emitting module 100 in which the wiring portion 6 is formed after the light emitting element 2 is mounted on the light guide plate 4, a process in which a high temperature acts like reflow soldering can be omitted, and therefore, a material having low thermal resistance and thermoplastic properties such as polycarbonate can be used. The light guide plate 4 can be formed by injection molding or transfer molding, for example.
The optical functional portion 4a is provided to reflect light from the light emitting element 2 and spread the light in the radiation direction, thereby equalizing the light emission intensity in the plane of the light guide plate 4. The optical functional portion 4a can be realized by providing the light guide plate 4 with various structures such as a member having a reflection and diffusion function, such as a lens. For example, the interface may be provided with a substance having a refractive index different from that of the material of the light guide plate 4, such as air. The optical functional portion 4a is formed as a concave space of an inverted cone, but the size and shape thereof can be set as appropriate. Specifically, the concave space may be formed in an inverted polygonal pyramid such as an inverted rectangular pyramid or an inverted hexagonal pyramid. The optical functional portion 4a is a recess formed in this way, and can be configured to reflect light irradiated at an interface between a substance having a refractive index different from that of the light guide plate 4 and the inclined surface of the recess in the radiation direction with the optical functional portion 4a, which is a side of the light emitting element 2, as the center. The optical functional portion 4a may be configured such that a reflective film such as a metal or a reflective material such as a white resin is provided in a concave portion having a linear or curved inclined surface in a cross-sectional view. The optical functional portion 4a is preferably provided at a position where the optical axis of the light emitting element 2 and the optical axis that is the center (the apex of the concave portion) of the optical functional portion 4a substantially coincide on the extension line.
For example, the light emitting element 2 and the wavelength conversion member 3, and the light guide plate 4 and the wavelength conversion member 3 are joined by a translucent joining member. When the translucent joining member is provided between the light extraction surface of the light emitting element 2 and the wavelength conversion member 3, the side surface of the light emitting element 2 is preferably rounded. When the side surface of the light-emitting element 2 is formed to be rounded, a known adhesive such as a silicone resin can be used as the translucent bonding member.
Wiring portions 6 electrically connected to the electrodes of the plurality of light emitting elements 2 are provided. The wiring portion 6 is formed on the electrode-side surfaces of the protective member 5 and the light-emitting elements 2, the light-emitting segments 10 are connected via the substrate 15 and the adhesive sheet 20, and the wiring portion 6 is connected to the conductive paste 30 provided in the through-hole, whereby the light-emitting elements 2 of the plurality of light-emitting devices 1 can be electrically connected.
Next, a method of manufacturing the light emitting module 100 will be described with reference to fig. 5 to 6D.
The method for manufacturing the light emitting module comprises the following steps: a preparation step S11 of preparing an adhesive substrate 25, the adhesive substrate 25 including a substrate 15 and a plurality of light-emitting segments 10, the substrate 15 having a circuit pattern 17 on one surface side and a bottomed hole 18a1 and a bottomed hole 18a2 formed in each of a pair of wiring pads 18 continuous with the circuit pattern 17, the light-emitting segments being formed by arranging a plurality of light-emitting devices 1 connected to the other surface side of the substrate 15 via an adhesive sheet 20; a filling step S12 of filling the conductive paste 30 into the bottomed hole through the opening M1 of the mask MK, and providing the conductive paste 30 on the partial surfaces 18a11 and 18a12 of the wiring pad 18 around the bottomed hole; and a heat pressing step S13 of curing the conductive paste 30 filled in the bottomed hole by heat pressing the conductive paste 30 so that the thickness of the intervening portion 31 of the conductive paste 30 on a part of the surface of the wiring pad 18 is thinner than that when the conductive paste is provided through the opening M1 of the mask MK. After the hot pressing step S13, an insulating resin forming step S14 is performed, and in this insulating resin forming step S14, an insulating resin 40 is formed to cover the conductive paste 30 from one surface side of the substrate 15. Hereinafter, each step will be explained.
The preparation step S11 is a step of preparing the adhesive substrate 25, which is the plurality of light-emitting segments 10 adhered to the substrate 15 via the adhesive sheet 20. In the preparation step S11, the circuit pattern 17 and the wiring land 18 are provided on the base material 16, and the substrate 15 having the bottomed hole 18a1 and the bottomed hole 18a2 penetrating the wiring land 18 and the base material 16 is formed. The substrate 15 is in a state where the protective sheet 19 is provided at a predetermined position on the one surface side on which the circuit pattern 17 is formed. Here, as shown in fig. 15C described later, the adhesive sheet 20 may be partially extended on the upper surface of the light-emitting segment 10 exposed through the bottomed holes 18a1 and 18a 2. The substrate 15 is bonded to a plurality of light-emitting sections 10, in which a plurality of light-emitting devices 1 are arranged, via an adhesive sheet 20 on the other surface side. In the light-emitting section 10, the wiring portion 6 electrically connected to each light-emitting device 1 is formed at the bottom of the bottomed hole 18a1 and the bottomed hole 18a2 of the wiring pad 18. In the preparation step S11, the substrate 15 and the adhesive sheet 20 may be bonded together, and the bottomed holes 18a1 and 18a2 may be formed together. In the present preparation step S11, as a means for integrating the substrate 15 and the adhesive sheet 20, a hot plate press, a diaphragm type vacuum laminator, a roll laminator, or the like can be suitably used.
The bottomed hole is first formed as a through hole penetrating the substrate 15 and the adhesive sheet 20. The through-holes are closed by the wiring portion 6 of the light emitting device 1 on the side opposite to the wiring pads 18 of the substrate 15, in other words, on the side of the adhesive sheet 20, and have bottomed holes 18a1 and 18a2 on the bottom surface. The through-hole is not different from the bottomed holes 18a1 and 18a2 in shape and properties near the opening and on the inner surface.
As shown in fig. 6A, the substrate in which the substrate 15 and the light-emitting section 10 bonded to the substrate 15 are combined is a bonding substrate 25. In the bonded substrate 25, the through-hole of the substrate 15 is a bottomed hole.
In the preparation step S11, a step of forming a concave portion for connecting the wavelength conversion member 3 to the light guide plate 4 in which the optical functional portion 4a is formed in advance is prepared. Further, the wavelength conversion member 3 may be disposed in a recess of the light guide plate 4, the light extraction surface of the light emitting element 2 may be bonded to the wavelength conversion member 3 with an adhesive, and the wiring portion 6 to which the external lead of the light emitting element 2 is connected may be formed after the protective member 5 is provided. Further, the step of connecting one or more light-emitting segments 10 on which the wiring portion 6 is formed to the substrate 15 via the adhesive sheet 20 may be performed as the preparation step S11.
The filling step S12 is a step of filling the bottomed hole 18a1 and the bottomed hole 18a2 with the conductive paste 30 and providing the conductive paste 30 on the partial surfaces 18a11 and 18a12 of the wiring pad 18. In the filling step S12, for example, a mask MK having an opening M1 formed therein is used. For example, the opening holes M1 of the mask MK are formed in an oval shape including two bottomed holes 18a1 on the upper surface of each bottomed hole 18a 1. In the present embodiment, the oblong shape means a ring shape having a major diameter and a minor diameter and including at least two bending lines. The long circular two-dot chain lines MPa1 and MPa2 in fig. 4A show the projection of the opening M1 of the mask MK onto the surface of the wiring pad 18. The opening M1 of the mask MK is disposed facing at least a part of the bottomed hole and a part of the surfaces 18a11, 18a12 of the wiring pad 18 so as to cross over the plurality of bottomed holes 18a1 formed for each wiring pad 18 or the plurality of bottomed holes 18a 2. Therefore, when the conductive paste is supplied while moving the squeegee in a printing operation such as screen printing, the conductive paste 30 is filled in the bottomed holes 18a1 and the bottomed holes 18a2 from the opening M1 of the mask MK and is provided on the partial surfaces 18a11 and 18a12 of the wiring pads 18. The conductive paste 30 is printed on the filling portion 32 filled with the bottomed hole 18a1 and the bottomed hole 18a2, and the intervening portion 31 provided on the partial surfaces 18a11 and 18a12 of the wiring pad 18. Further, since the conductive paste 30 is formed at a position where the bottomed hole 18a1 and the bottomed hole 18a2 are inclined at a predetermined angle with respect to the arrangement direction of the light emitting devices 1 (or the printing direction in screen printing), the conductive paste 30 can be easily filled in the bottomed holes 18a1 and the bottomed holes 18a2 by the movement of the squeegee along the arrangement direction of the light emitting devices 1. In the screen printing, the squeegee may be moved once or may be reciprocated a plurality of times.
As shown in fig. 6C, the heat pressing step S13 is a step of curing the interposed portion 31 of the conductive paste 30 to be thinner than that when provided through the open hole M1 of the mask MK, and curing the filled portion 32 of the conductive paste 30 filled in the bottomed holes 18a1 and 18a 2. In the heat pressing step S13, heat is applied and pressed using, for example, heat plates HL1 and HL2 whose temperatures can be controlled up and down. The pressing may be performed in a state where the release films are provided on the hot plates HL1 and HL2, respectively. The intervening portion 31 of the conductive paste 30 is formed to be thin by being pressed so as to have a height of the protective sheet 19 set in advance. In the hot pressing step S13, interposing portion 31 is pressed against hot plate HL1, so that interposing portion 31 is set to the same height as protective sheet 19 and cured. The pressed conductive paste 30 is cured in a state of entering the bottomed holes 18a1 and the bottomed holes 18a 2. In the hot pressing step S13, the thickness of the conductive paste 30 formed in the cured intervening portion 31 is 10 to 70% of the thickness before pressing, and the connection resistance can be reduced, and therefore, the thickness is preferably 20 to 40% from the viewpoint of reduction in resistance and stability of the resistance value, and is more preferably. As the apparatus used in the heat pressing step S13, hot plate pressing, a diaphragm type vacuum laminator, a roll laminator, or the like can be suitably used.
The insulating resin forming step S14 is a step of forming the insulating resin 40 from above the conductive paste 30 pressurized in the heat pressurizing step S13. In the insulating resin forming step S14, the insulating resin 40 is supplied from one surface side of the substrate 15 and pressed so as to cover the wiring pads 18. The insulating resin 40 is formed to cover the conductive paste 30 higher than the protective sheet 19. In addition, when the conductive paste 30 is not completely filled in the holes with the bottom holes 18a1 and 18a2 and there is a gap, the insulating resin 40 is also filled in the holes.
As described above, the light emitting module 100 is described as being formed by arranging the plurality of light emitting sections 10 and providing the pair of wiring pads 18 for each light emitting section 10, but at least one light emitting section 10 may be provided.
In the light-emitting module 100, the intervening portion 31 of the conductive paste 30 provided on a part of the surface of the wiring pad 18 is formed to be thin, so that the resistance can be reduced and the thickness of the entire module can be reduced.
The bottomed hole 18a1, the bottomed hole 18a2, and the conductive paste 30 formed in the wiring pad 18 are configured as shown in fig. 7A, but may have other configurations as shown in fig. 7B to 7F. Hereinafter, modifications 1 to 5 will be described with reference to fig. 7B to 7F. In addition, the filling portion and the interposing portion may be electrically connectable to each other without maintaining a specific shape in the hole or on the surface of the wiring pad during curing. In fig. 7B to 7F, filling portions 32B to 32F are shown at positions equivalent to reference numeral 32 shown in fig. 4B.
As shown in fig. 7B, bottomed holes 18a1 and bottomed holes 18a2 are formed in the same circular shape as shown in fig. 7A in the same arrangement in the oblique direction, and conductive paste 30B is provided in a slender rectangular shape. That is, the opening hole formed in the mask MK is formed in a shape different from the bottomed holes 18a1, 18a2 formed in the wiring pad 18. Conductive paste 30B has a shape in plan view according to the shape of the opening hole of mask MK. The rectangular portion of conductive paste 30B is formed such that the rectangular short side is smaller than the aperture and the rectangular long side is longer than the sum of the two bottomed holes 18a1 and a part of surface 18a11 of wiring pad 18. The conductive paste 30B is formed over the two bottomed holes 18a1, and includes an intervening portion 31B provided on a part of the surfaces 18a11 and 18a12 of the wiring pad 18 so as to extend over the two filling portions 32B filled in the holes. In the conductive paste 30B, a part of the surface of the wiring pad 18 on the opposite side to the intervening portion 31B is also filled with the conductive paste 30.
As shown in fig. 7C, the wiring pad 18C is formed with bottom holes 18C1, 18C 2. The conductive paste 30C is formed by the filling portions 32C filled in the bottomed holes 18C1 and 18C2, and the intervening portions 31C provided on a part of the surface of the wiring pad 18C so as to be continuous with the filling portions 32C. In addition, since the shape of the opening hole of the mask MK used in screen printing of the conductive paste 30C is circular in a plan view, the shape of the filling portion 32C and the intervening portion 31C together is circular in filling. The opening hole of the mask MK has the same shape as the bottomed holes 18C1 and 18C2 formed in the wiring pad 18C, and is arranged so that a part of the opening hole overlaps and faces the bottomed holes 18C1 and 18C2 so as not to be in the same position as the bottomed holes 18C1 and 18C 2.
As shown in fig. 7D, the wiring pad 18D is formed with bottom holes 18D1, 18D 2. The conductive paste 30D is formed by filling portions 32D having a rectangular shape in plan view, which are filled in the bottomed holes 18D1, 18D2, and intervening portions 31D which are continuous with the respective filling portions 32D and are not provided on a part of the surface of the wiring pad 18D. That is, the opening hole formed in the mask MK is formed in a shape different from the bottomed holes 18D1, 18D2 formed in the wiring pad 18D. Since the opening of the mask MK is rectangular when the conductive paste 30D is screen-printed, the shape of the filling portion 32D and the intervening portion 31D when filled is rectangular in plan view. The rectangular portion of conductive paste 30D is formed such that the rectangular short side is smaller than the aperture and the rectangular long side is longer than the aperture. The rectangular shape of the conductive paste 30 when filled is formed along the arrangement direction of the light emitting devices 1 (the direction orthogonal to the printing direction of screen printing). Furthermore, the intervening portion 31D of the conductive paste 30D is formed at two positions facing each other through the bottomed hole 18D1 on the partial surface 18D11 of the wiring pad 18D, and at two positions facing each other through the bottomed hole 18D2 on the partial surface 18D12 of the wiring pad 18D.
As shown in fig. 7E, the wiring pad 18E is formed with bottomed holes 18E1, 18E2 that are square in plan view, in parallel with the arrangement direction of the light emitting devices 1 (see fig. 1). In conductive paste 30E, filling portion 32E and intervening portion 31E are formed by the opening of mask MK having the same shape as bottomed holes 18E1 and 18E2 and having a shape changed in direction by 45 degrees. That is, the opening hole of the mask MK is formed in the same shape as the bottomed holes 18E1, 18E2 formed in the wiring pad 18E, and is arranged so that a part thereof overlaps and faces each other, so that the opening hole of the mask MK and the bottomed holes 18E1, 18E2 are not in the same position as each other. Since the filling portion 32E and the intervening portion 31E are each square with an inclination of 45 degrees with respect to the square bottomed hole 18a1, the filling portion 32E is in a state in which the shape in plan view of filling in the hole is octagonal. The via portion 31E is formed along the four sides of the bottomed holes 18E1 and 18E2 in a triangular shape on the surface of the wiring pad. In addition, the filling portion 32E is not required to maintain the shape in the holes of the bottomed holes 18E1 and 18E2, and may be in a filling state in which electrical connection is possible.
As shown in fig. 7F, the wiring pad 18F has bottomed holes 18F1 and 18F2 in a cross shape in plan view. The conductive paste 30F is filled in a circular shape in which the filling portion 32F and the intervening portion 31F are combined in a plan view. That is, the opening hole formed in the mask MK is formed in a shape different from the bottomed holes 18F1, 18F2 formed in the wiring pad 18F. Since the opening of the mask MK is circular when the conductive paste 30F is screen-printed, the shape of the filling portion 32F and the intervening portion 31F combined when filling is circular when viewed from above. The circular portion of the conductive paste 30F is formed to have a smaller diameter than the cross-shaped vertical groove portion and the horizontal groove portion. The circular shape of the conductive paste 30F when filled is formed along the arrangement direction of the light emitting devices 1. The intervening portion 31F of the conductive paste 30F is formed at four positions on the partial surfaces 18F11 and 18F12 of the wiring pad 18F between the horizontal groove portion and the vertical groove portion which are the bottomed holes 18F 1.
As described above, the bottomed hole formed in the wiring pad and the conductive paste provided in the bottomed hole and a part of the surface of the wiring pad may have various shapes.
A modification of the aperture hole of the mask MK will be described with reference to fig. 8A to 8C.
Fig. 8A shows the relationship between the bottomed holes 18A1, 18A2 and the opening M01 of the mask MK in modification 6. The open holes M01 of the mask MK are provided one each for the bottomed holes 18a1, 18a 2. One is formed in an elongated circular shape 12a1 that surrounds a group of bottomed holes 18a1 formed in an oblique direction and aligned in the shortest circumferential length in plan view. The other is formed in an oblong shape 12a2 surrounding a group of bottomed holes formed in an oblique direction as the bottomed holes 18a2 with the shortest circumferential length in plan view. In modification 6, it is preferable that the opening M01 formed in the mask MK have an inner diameter that is 0.9 times or more and 1.1 times or less long in plan view without changing the orientation and center position of the long circular shape.
Fig. 8B is a schematic view of the vicinity of the wiring pad 18 in the 6 th modification. The two-dot chain lines MP01 and MP02 surrounding the bottom holes 18a1 and 18a2 indicate projections of the opening hole M01 of the mask MK onto the surface of the wiring pad 18. In fig. 8C, the conductive paste 30 is filled.
Fig. 9A to 9D show several modifications (7 th to 10 th modifications). Since the same configuration will be described repeatedly, only the openings of the mask MK will be described in the 7 th modification to the 10 th modification.
In the 7 th modification example shown in fig. 9A, the opening M02 of the mask MK is formed such that the lengths of the inner diameters D11 and D12 are 1.2 times without changing the orientation of the oblong shapes 12a1 and 12a2 and the positions of the centers C11 and C12 in the 6 th modification example in a plan view. D21 ═ D11 × 1.2, D22 ═ D12 × 1.2. In modification 7, it is preferable that the length of the inner diameter of the opening M02 formed in the mask MK be 1.1 times or more and 1.3 times or less without changing the orientation and center position of the oblong shape in plan view.
In the 8 th modification example shown in fig. 9B, the opening M03 of the mask MK is formed such that the lengths of the inner diameters D11 and D12 are 1.4 times without changing the orientation of the oblong shapes 12a1 and 12a2 and the positions of the centers C11 and C12 in the 6 th modification example in a plan view. D31 ═ D11 × 1.4, and D32 ═ D12 × 1.4. In modification 8, it is preferable that the opening M03 formed in the mask MK be formed so that the length of the inner diameter is 1.3 times or more and 1.5 times or less without changing the orientation and center position of the long circular shape in plan view.
The ratio of the length of the inner diameter to the lengths of the inner diameters D11 and D12 can be set to a value in the range of 0.9 to 1.5. That is, the length of the inner diameter of the aperture formed in the mask MK can be 0.9 times or more and 1.5 times or less without changing the orientation and center position of the oblong shape in plan view.
In a 9 th modification example shown in fig. 9C, the opening M04 of the mask MK is formed in a rectangular shape having two sides 13a parallel to the printing direction of the screen printing, surrounding the plurality of bottomed holes 18a1 and 18a2 formed for each wiring pad 18 in plan view.
In the 10 th modification shown in fig. 9D, the bottomed holes 18a1(18a2) are a set of bottomed holes formed side by side in an oblique direction. The opening M05 of the mask MK is formed in a rectangular shape including two sides 13b parallel to the oblique direction and two sides 13c included in the bottomed holes located at both ends of one set in a plan view.
As shown in fig. 10A and 10B, the direction in which the bottomed holes formed side by side are inclined is preferably a direction 26B1, 26B2 parallel to one diagonal line 26a of the bonded substrate 25. This arrangement has the effect of minimizing positional deviation of the bottomed holes 18a1, 18a2 with respect to expansion and contraction of the adhesive substrate 25. This effect is particularly effective when the adhesive substrate 25 is large. When the external shape of the bonded substrate 25 is square, the angle a01 of the diagonal line of the bonded substrate 25 is 45 degrees, and the angle a02 indicating the oblique direction of the through holes or bottomed holes formed in parallel, in other words, the angle formed by 26c, which is one of the arrangement directions of the light emitting device 1 and the light emitting segments 10, and the oblique directions 26b1 and 26b2 is also 45 degrees.
In addition, regarding the shape of the peripheral edge portion having the bottomed hole in the wiring pad, if the peripheral edge portions having the bottomed holes 18a1, 18a2 are smoothly bent as shown in the cross section of fig. 11, the conductive paste 30 easily flows into the hole along the bend 8, and the filling property is excellent. Further, the contact area between the conductive paste 30 and the wiring pad 18 is increased, and the connection resistance can be reduced. Further, the connection resistance can be further reduced by the synergistic effect with the heat pressing step S13.
The through hole before the bottomed hole can be formed by, for example, drilling or punching. In the case of forming by punching, the peripheral edge portion is bent in the punching direction. If the substrate is punched out from the wiring pad 18 side, as shown in the cross section of fig. 11, the bend 8 in which the conductive paste 30 easily flows into the hole can be formed.
Further, as shown in fig. 12A to 12C, if the recess 9a is formed in the region where the bottomed holes arranged adjacently in parallel are connected to each other, even if the peripheral edge portions of the bottomed holes 18a1, 18a2 are sharp, the thickness of the conductive paste 30 can be ensured, and disconnection of the conductive paste 30 can be prevented. As shown in fig. 13A to 13C, in addition to the recess 9a, a recess 9b may be formed in a region not connected to another bottomed hole around the bottomed hole. It is also possible to form only the recesses 9 b. For example, in the case of a flexible substrate in which the metal material of the wiring pad 18 has a thickness of about 20 μm, the depth D01 of the recesses 9a and 9b is preferably 5 μm to 30 μm.
The recesses 9a and 9B can be formed in the shape of the recesses 9a and 9B as shown in fig. 14A and 14B by pressing a punch 50a provided on the bottom surface 51a from the wiring pad 18 side by punching, for example. Further, as shown in fig. 14C, if a punch 50d provided with a recess forming portion 50b having a recessed shape and a through hole forming portion 50C for punching a through hole continuous to the recess forming portion 50b is used, the through hole and the recesses 9a and 9b can be formed by one punch 50 d. The recesses 9a, 9b may also be formed before the bonding of the light-emitting sections 10. In this case, the through-holes and the recesses 9a and 9b may be formed by one punching operation using the punch 50 d. Further, as shown in fig. 14D, linear protrusions 51b may be provided in the longitudinal direction of the bottom surface 51 a. Since the depressions formed by the punches 50e provided with the linear protrusions 51b are V-shaped, the thickness of the conductive paste 30 can be ensured to be thicker. In this case, as shown in fig. 14E, a punch 50h provided with a recess-forming portion 50f having a recessed shape and a through-hole-forming portion 50g for punching a through hole continuous with the recess-forming portion 50f may be used.
In the case where the bottomed hole is filled with the conductive paste 30, as shown in fig. 15A to 15C, the extension portion 21 which is a part of the adhesive sheet 20 may be extended to the upper surface of the light emitting segment 10. That is, the adhesive sheet 20 is disposed between the substrate 15 and the light-emitting section 10, and as shown in fig. 15B, the substrate 15 and the light-emitting section 10 are adhered by applying heat and pressure from above and below by the heat plates HL1 and HL 2. The adhesive sheet 20 is preferably heated to form the extension 21, and the length of the adhesive sheet 20 extending over the light-emitting section 10 is preferably 10 μm or more and 1/10 or less which is the diameter of the bottomed hole 18a1, 18a 2. When the conductive paste 30 is filled by forming the extension portion 21, it is possible to suppress the generation of bubbles at the corner of the bottomed hole, and it is preferable from the viewpoint of connection resistance because the diameter is 1/10 or less, and reliability can be improved. Further, as the amount of flow from the adhesive sheet 20, the drying conditions of the adhesive sheet, the temperature, pressure, and time at the time of pressure and heat can be appropriately controlled by the extension portion 21 extending from the adhesive sheet 20. As the means for pressurization, hot plate pressurization, a membrane type vacuum laminator, a roll laminator, or the like can be suitably used.

Claims (21)

1. A method of manufacturing a light emitting module, comprising:
a preparation step of preparing a bonded substrate, the bonded substrate including: a substrate having a circuit pattern on one surface side and bottomed holes formed in a pair of wiring pads continuous with the circuit pattern, respectively; and a plurality of light-emitting sections connected to the other surface side of the substrate via an adhesive sheet, the light-emitting sections being formed by arranging a plurality of light-emitting devices;
a filling step of filling the bottomed hole with a conductive paste through an opening hole of a mask and providing the conductive paste on a part of a surface of the wiring pad around the bottomed hole; and
and a heat pressing step of curing the conductive paste by heat pressing the conductive paste so that the thickness of the conductive paste on a part of the surface of the wiring pad is smaller than that when the conductive paste is provided through the opening of the mask, and the conductive paste filled in the bottomed hole is cured.
2. The method for manufacturing a light emitting module according to claim 1, wherein
After the heat pressing step, an insulating resin forming step of forming an insulating resin covering the conductive paste from one surface side of the substrate is performed.
3. The method of manufacturing a light emitting module according to claim 1 or 2,
In the filling step, the opening hole of the mask is arranged so as to face at least a part of the bottomed holes and a part of the surface of the wiring pad so as to straddle a plurality of bottomed holes formed for each of the wiring pads.
4. The method of manufacturing a light emitting module according to claim 1 or 2,
in the filling process, the opening hole of the mask is configured to: at least a part of the opening hole overlaps the bottomed hole in a face-to-face manner, and is disposed at a position facing a part of a surface of the wiring pad.
5. The method for manufacturing a light-emitting module according to any one of claims 1 to 4,
the opening hole formed in the mask is formed in a shape different from the bottomed hole formed in the wiring pad.
6. The method for manufacturing a light-emitting module according to any one of claims 1 to 4,
the opening hole formed in the mask is formed in the same shape as the bottomed hole formed in the wiring pad, and is arranged so that a part of the opening hole and the bottomed hole are repeatedly facing each other so as not to be in the same position as each other.
7. The method for manufacturing a light-emitting module according to any one of claims 1 to 6,
The filling step is performed by screen printing a conductive paste.
8. The method of manufacturing a light emitting module according to claim 7,
at least two of the bottomed holes are formed side by side for each of the wiring pads in a direction orthogonal to a printing direction of the screen printing.
9. The method of manufacturing a light emitting module according to claim 7,
at least two of the bottomed holes are formed side by side for each of the wiring pads in a direction inclined with respect to a printing direction of the screen printing.
10. The method of manufacturing a light emitting module according to claim 9,
the inclined direction is a direction parallel to one diagonal line of the bonded substrate.
11. The method of manufacturing a light emitting module according to claim 9 or 10,
the opening holes formed in the mask are formed so as to be aligned in the oblique direction, for each of the groups of bottomed holes formed in the mask: and a rectangular shape including two sides parallel to the direction of inclination and two sides respectively included in the bottomed holes located at both ends of the group 1 in a plan view.
12. The method of manufacturing a light emitting module according to claim 9 or 10,
The opening hole formed in the mask is formed as follows: and an oblong shape surrounding each group of bottomed holes formed in parallel in the oblique direction with the shortest circumferential length in plan view.
13. The method of manufacturing a light emitting module according to claim 12,
the opening hole of the mask is formed as follows: the length of the inner diameter is set to 0.9 times or more and 1.5 times or less in plan view without changing the orientation and the center position of the oblong shape.
14. The method for manufacturing a light-emitting module according to any one of claims 8 to 10,
the opening hole formed in the mask is formed as follows: and a rectangular shape surrounding a plurality of bottomed holes formed for the wiring pads in a plan view and having two sides parallel to a printing direction of the screen printing.
15. The method for manufacturing a light-emitting module according to any one of claims 9 to 14,
a pair of the wiring pads is formed for each of the light emitting sections,
four of the bottomed holes are formed in one of the wiring pads,
every two of the bottomed holes are formed side by side in the oblique direction.
16. The method for manufacturing a light-emitting module according to any one of claims 8 to 15,
In the wiring pad, a recess is formed in a region connecting the adjacent bottomed holes formed in parallel.
17. The method of manufacturing a light emitting module according to claim 16,
the recess is formed in a region not connected to the other bottomed holes around the bottomed hole.
18. The method of manufacturing a light emitting module according to claim 16 or 17,
the bottomed hole is formed by blocking one end of the through hole,
the through-hole and the recess are formed by one punching operation using a punch provided with a recess forming portion having the shape of the recess and a through-hole forming portion for punching the through-hole continuous with the recess forming portion.
19. A light-emitting module is provided with:
a substrate having a circuit pattern on one surface side and a plurality of bottomed holes formed for each of a pair of wiring pads continuous with the circuit pattern, and having a conductive paste filled over two or more of the bottomed holes and an insulating resin provided so as to cover the conductive paste from one surface side; and
a plurality of light emitting sections connected to the other surface side of the substrate via an adhesive sheet,
The light emitting section is formed by arranging a plurality of light emitting devices,
the conductive paste is formed across two or more of the bottomed holes and is interposed between a part of the surface of the wiring pad.
20. The lighting module of claim 19,
the plurality of bottomed holes are arranged in parallel in a direction inclined to the arrangement direction of the light emitting devices.
21. The lighting module of claim 19 or 20,
the bottomed hole is formed such that the opening shape is a circle, a cross, or a quadrangle in plan view.
CN202010319566.6A 2019-04-26 2020-04-21 Method for manufacturing light emitting module and light emitting module Pending CN111863855A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019085494 2019-04-26
JP2019-085494 2019-04-26
JP2019-215168 2019-11-28
JP2019215168A JP7004921B2 (en) 2019-04-26 2019-11-28 Light emitting module manufacturing method and light emitting module

Publications (1)

Publication Number Publication Date
CN111863855A true CN111863855A (en) 2020-10-30

Family

ID=70390843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010319566.6A Pending CN111863855A (en) 2019-04-26 2020-04-21 Method for manufacturing light emitting module and light emitting module

Country Status (1)

Country Link
CN (1) CN111863855A (en)

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