CN111863644A - Semiconductor packaging ultrasonic aluminum wire bonding device - Google Patents
Semiconductor packaging ultrasonic aluminum wire bonding device Download PDFInfo
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- CN111863644A CN111863644A CN202010769951.0A CN202010769951A CN111863644A CN 111863644 A CN111863644 A CN 111863644A CN 202010769951 A CN202010769951 A CN 202010769951A CN 111863644 A CN111863644 A CN 111863644A
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- wire bonding
- ultrasonic
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 128
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 239000004065 semiconductor Substances 0.000 title claims abstract description 86
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 235000014820 Galium aparine Nutrition 0.000 claims abstract description 28
- 240000005702 Galium aparine Species 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims description 17
- 239000004411 aluminium Substances 0.000 claims description 12
- 244000309464 bull Species 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 description 11
- 238000003466 welding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a semiconductor packaging ultrasonic aluminum wire bonding device which comprises a base, wherein a conveying cavity is formed in the top of the base, a conveying mechanism is arranged in the inner cavity of the conveying cavity, the conveying mechanism comprises two rotary rollers which are rotatably connected to the inner cavity of the conveying cavity, a conveying belt is sleeved on the surfaces of the rotary rollers, a supporting plate is fixedly connected to the inner cavity of the conveying cavity, and the top of the supporting plate is in contact with the conveying belt. The semiconductor packaging ultrasonic aluminum wire bonding device solves the problems that when the aluminum wire bonding is carried out on a semiconductor chip, the intermittent feeding cannot be realized, even the feeding is controlled manually, so that the automation degree is low, and the aluminum wire feeding is carried out by clamping the aluminum wire by a cleaver tip, so that the stroke of clamping the aluminum wire is increased, and the aluminum wire bonding efficiency of the semiconductor chip is influenced.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an ultrasonic aluminum wire bonding device for semiconductor packaging.
Background
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of a semiconductor, the semiconductor is a material with controllable conductivity ranging from an insulator to a conductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products in the present day, such as computers, mobile phones or digital audio recorders, have very close relationship with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor materials in commercial application.
Referring to a semiconductor bonding wire and a semiconductor package structure of the patent application No. CN201420804324.6, the semiconductor bonding wire includes a first end portion, a bent portion and a tail portion; wherein the first end is fixed to a first bond site of the semiconductor component; the corner part at least comprises a corner; the tail is fixed on a second bonding point of the semiconductor component; and the lead is not overlapped with the shortest path connecting the first bonding point and the second bonding point, and the lead comprises a corner part at the semiconductor bonding lead, so that the shortest path of the lead and the conventional lead can keep a proper distance, and the mutual inductance between the adjacent leads is greatly reduced.
However, when the semiconductor chip is bonded by the aluminum wire, the intermittent feeding can not be realized when the semiconductor chip is conveyed, and even the feeding is manually controlled, so that the automation degree is low, and the feeding of the aluminum wire is also required to be clamped by a cleaver tip, so that the stroke of clamping the aluminum wire is increased, and the efficiency of bonding the aluminum wire of the semiconductor chip is influenced.
Disclosure of Invention
The invention aims to provide a semiconductor packaging ultrasonic aluminum wire bonding device which has the advantage of high-efficiency bonding and solves the problems that when a semiconductor chip is subjected to aluminum wire bonding and conveyed, intermittent feeding cannot be realized, even the feeding needs to be controlled manually, the automation degree is low, aluminum wire feeding needs to be clamped by a cleaver tip, the stroke of clamping an aluminum wire is increased, and the efficiency of semiconductor chip aluminum wire bonding is influenced.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor package supersound aluminum wire bonding device, includes the base, the transport chamber has been seted up at the top of base, the inner chamber of carrying the chamber is provided with conveying mechanism, conveying mechanism is including rotating two commentaries on classics rollers of connecting in carrying the intracavity chamber, the surface cover of changeing the roller is equipped with the conveyer belt, the inner chamber fixedly connected with backup pad of carrying the chamber, the top and the conveyer belt contact of backup pad, the surface of conveyer belt is provided with drive mechanism, the top of base is provided with the clamp plate, the bottom of clamp plate is provided with elevating system, the top of clamp plate is provided with aluminum wire paying out machine and constructs, the rear side at base top is provided with the ultrasonic wave.
Preferably, drive mechanism is including being fixed in the box on base top right side, the rear side rotation of box inner chamber is connected with the bull stick, the front end of bull stick runs through to the front side of box and fixedly connected with gear, the gear is located the inner chamber in transport chamber, the front side fixedly connected with ring gear on conveyer belt surface, ring gear and gear engagement, the inner chamber of box is provided with actuating mechanism.
Preferably, the driving mechanism comprises a driving disc fixed on the surface of the rotating rod, driving grooves and positioning arc-shaped grooves are formed in the periphery of the surface of the driving disc, and the driving grooves and the positioning arc-shaped grooves are arranged in a staggered mode.
Preferably, the left side of the bottom of the inner cavity of the box body is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a vertical plate, the front side of the vertical plate is fixedly connected with an arc plate matched with the positioning arc groove, and the top and the bottom of the front side of the vertical plate are fixedly connected with a driving block matched with the driving groove.
Preferably, elevating system is including seting up the recess in transport chamber inner chamber rear side, the bottom fixedly connected with cylinder of recess inner chamber, the top of cylinder run through to the top of base and with clamp plate fixed connection.
Preferably, both sides of the bottom of the pressing plate are fixedly connected with guide rods, the bottoms of the guide rods penetrate through the inner cavities of the grooves, and the surfaces of the guide rods are connected with the base in a sliding mode.
Preferably, the box is placed including being fixed in the left aluminium drum in clamp plate top to aluminium line paying out machine structure, the box is placed to the front side fixedly connected with of box is placed to the aluminium line dish, the right side fixedly connected with motor of paying out box, the output shaft of motor runs through to the inner chamber and the fixedly connected with rolling disc of paying out box, the front side fixedly connected with unwrapping wire stand pipe of paying out box.
Preferably, the surface of the rotating disc is provided with anti-slip saw teeth.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention has the advantages that the semiconductor chip is placed on the top of the conveyer belt, the conveyer belt intermittently conveys the semiconductor chip to the right by the transmission mechanism, the aluminum wire is conveyed to the top of the semiconductor by the aluminum wire paying-off mechanism after being conveyed to a proper position, then the aluminum wire is conveyed to the top of the semiconductor by the ultrasonic cleaver, a certain ultrasonic power and pressure are applied to ensure that eutectic melting is formed between the aluminum wire and the aluminum layer contact surface on the surface of the chip, the effect of connecting the chip is achieved, after the connection is finished, the right conveying is continuously carried out by the conveying mechanism, the purpose of high-efficiency bonding can be achieved, the problems that the intermittent feeding can not be realized, even the feeding is manually controlled when the semiconductor chip is conveyed when the aluminum wire bonding is carried out on the semiconductor chip, the automation degree is low, the feeding of the aluminum wire is also required to be clamped by a tool tip, the stroke for clamping the, the semiconductor packaging ultrasonic aluminum wire bonding device can effectively improve the aluminum wire bonding efficiency of the semiconductor chip and improve the semiconductor processing efficiency.
2. According to the invention, through the arrangement of the transmission mechanism, the motor is started to drive the vertical plate, the arc-shaped plate and the driving block to rotate, so that the driving block is rotated into the inner cavity of the driving groove, the driving disc can be driven to rotate, and further the purpose of driving the rotating rod to rotate is realized.
3. The invention can ensure the stability of the bonding of the semiconductor chip by using the lifting mechanism and the aluminum wire paying-off mechanism together, and avoid the shaking during the semiconductor bonding, when the semiconductor chip moves to a proper position, the cylinder retracts to drive the pressing plate to move downwards to contact with the semiconductor chip, and the aluminum wire at one end passes through the inner cavity of the paying-off box and the bottom of the rotating disc, and then enters the inner cavity of the paying-off guide pipe, the motor is started to drive the rotating disc to rotate, because the friction force of the saw teeth on the surface of the rotating disc and the aluminum wire is used for conveying the aluminum wire, the semiconductor chip is fixed by the pressing plate, the aluminum wire mechanism is driven to move downwards when the pressing plate moves downwards, and the paying-off guide pipe is positioned at the top of the semiconductor chip, and the aluminum wire coming out of the paying-off guide pipe is clamped by the ultrasonic cleaver, at the moment, the aluminum wire is slightly longer than the point of the cleaver, when the aluminum wire reaches a connection area, the aluminum wire at the point of the ultrasonic cleaver is contacted with a chip, ultrasonic friction generates heat to melt the aluminum wire, the effect of connecting the aluminum wire with a semiconductor chip is achieved, after a welding area is completed, the ultrasonic cleaver cuts the aluminum wire connected with the aluminum wire pay-off mechanism, then the aluminum wire coming out of the pay-off guide pipe is clamped, the ultrasonic cleaver moves to another welding area, ultrasonic friction is also adopted to connect the aluminum wire with the semiconductor chip, and after the welding area is completed, the aluminum wire is cut off by the cleaver, and aluminum wire bonding of one semiconductor chip can be completed.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front view of a partial connecting structure of a conveying mechanism and a transmission mechanism according to the present invention;
FIG. 3 is a schematic top sectional view of the box structure of the present invention;
FIG. 4 is a schematic front view of the driving mechanism of the present invention;
FIG. 5 is a schematic perspective view of the aluminum wire paying-off mechanism structure of the present invention;
fig. 6 is a schematic perspective view of a connection structure of a base and a lifting mechanism according to the present invention.
In the figure: 1. a base; 2. a delivery lumen; 3. a conveying mechanism; 31. rotating the roller; 32. a conveyor belt; 4. a support plate; 5. a transmission mechanism; 51. a box body; 52. a rotating rod; 53. a gear; 54. a toothed ring; 55. a drive mechanism; 551. a drive disc; 552. a driving groove; 553. positioning the arc-shaped groove; 554. a motor; 555. a vertical plate; 556. an arc-shaped plate; 557. driving the block; 6. pressing a plate; 7. a lifting mechanism; 71. a groove; 72. a cylinder; 73. a guide bar; 8. an aluminum wire paying-off mechanism; 81. an aluminum wire coil placing box; 82. a wire releasing box; 83. a motor; 84. rotating the disc; 85. paying off the guide pipe; 9. an ultrasonic cleaver.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-6, the present invention provides a technical solution: a semiconductor packaging ultrasonic aluminum wire bonding device comprises a base 1, a conveying cavity 2 is formed in the top of the base 1, a conveying mechanism 3 is arranged in an inner cavity of the conveying cavity 2, the conveying mechanism 3 comprises two rotary rollers 31 rotatably connected to the inner cavity of the conveying cavity 2, a conveying belt 32 is sleeved on the surface of each rotary roller 31, a supporting plate 4 is fixedly connected to the inner cavity of the conveying cavity 2, the top of each supporting plate 4 is in contact with the conveying belt 32, a transmission mechanism 5 is arranged on the surface of each conveying belt 32, each transmission mechanism 5 comprises a box body 51 fixed on the right side of the top of the base 1, a rotary rod 52 is rotatably connected to the rear side of the inner cavity of each box body 51, the front end of each rotary rod 52 penetrates through the front side of each box body 51 and is fixedly connected with a gear 53, each gear 53 is located in the inner cavity of the conveying cavity 2, a toothed ring 54 is fixedly connected, the driving mechanism 55 includes a driving disk 551 fixed on the surface of the rotating rod 52, the periphery of the surface of the driving disk 551 is provided with a driving groove 552 and a positioning arc groove 553, the driving groove 552 and the positioning arc groove 553 are arranged in a staggered manner, the left side of the bottom of the inner cavity of the box body 51 is fixedly connected with a motor 554, the output shaft of the motor 554 is fixedly connected with a vertical plate 555, the front side of the vertical plate 555 is fixedly connected with an arc plate 556 matched with the positioning arc groove 553, the top and the bottom of the front side of the vertical plate 555 are fixedly connected with a driving block 557 matched with the driving groove 552, through the arrangement of the transmission mechanism 5, the motor 554 is started to drive the vertical plate 555, the arc plate 556 and the driving block 557 to rotate, so that the driving block 557 is rotated into the inner cavity of the driving groove 552, the driving disk 551 can be driven to rotate, the purpose of driving the rotating rod 52 to rotate is realized, the driving disk 551 can be limited when the arc plate 556 enters the inner cavity of the positioning arc groove 553, thereby avoiding the occurrence of excessive rotation, when one driving block 557 enters the inner cavity of the driving groove 552, the driving disk 551 is driven to rotate ninety degrees each time, so as to drive the rotating rod 52 to rotate ninety degrees, the rotating rod 52 drives the gear 53 to rotate, so as to drive the toothed ring 54 to move, the toothed ring 54 can drive the conveyer belt 32 to move intermittently, thereby achieving the purpose of conveying semiconductor chips by automatic intermittent motion, the top of the base 1 is provided with the pressing plate 6, the bottom of the pressing plate 6 is provided with the lifting mechanism 7, the lifting mechanism 7 comprises a groove 71 arranged at the rear side of the inner cavity of the conveying cavity 2, the bottom of the inner cavity of the groove 71 is fixedly connected with the cylinder 72, the top of the cylinder 72 penetrates through to the top of the base 1 and is fixedly connected with the pressing plate 6, both sides of the bottom of the, the bottom of guide bar 73 runs through to the inner chamber of recess 71, the surface and the base 1 sliding connection of guide bar 73, the top of clamp plate 6 is provided with aluminium wire paying out machine 8, box 81 is placed including being fixed in the left aluminium wire dish in clamp plate 6 top to aluminium wire paying out machine 8, the box 82 is placed to the front side fixedly connected with of box 81 to aluminium wire dish, the right side fixedly connected with motor 83 of paying out box 82, the output shaft of motor 83 runs through to the inner chamber and the fixedly connected with rolling disc 84 of paying out box 82, the front side fixedly connected with pay off stand pipe 85 of paying out box 82, the surface of rolling disc 84 is provided with anti-skidding sawtooth, the rear side at base 1 top is provided with ultrasonic cleaver 9, thereby make this semiconductor package supersound aluminium wire bonding device have the advantage of high efficiency bonding.
Example 2
Referring to fig. 1-6, the present invention provides a technical solution: a semiconductor packaging ultrasonic aluminum wire bonding device comprises a base 1, a conveying cavity 2 is formed in the top of the base 1, a conveying mechanism 3 is arranged in an inner cavity of the conveying cavity 2, the conveying mechanism 3 comprises two rotary rollers 31 rotatably connected to the inner cavity of the conveying cavity 2, a conveying belt 32 is sleeved on the surface of each rotary roller 31, a supporting plate 4 is fixedly connected to the inner cavity of the conveying cavity 2, the top of each supporting plate 4 is in contact with the conveying belt 32, a transmission mechanism 5 is arranged on the surface of each conveying belt 32, each transmission mechanism 5 comprises a box body 51 fixed on the right side of the top of the base 1, a rotary rod 52 is rotatably connected to the rear side of the inner cavity of each box body 51, the front end of each rotary rod 52 penetrates through the front side of each box body 51 and is fixedly connected with a gear 53, each gear 53 is located in the inner cavity of the conveying cavity 2, a toothed ring 54 is fixedly connected, the driving mechanism 55 comprises a driving disk 551 fixed on the surface of the rotating rod 52, the periphery of the surface of the driving disk 551 is provided with a driving groove 552 and a positioning arc groove 553, the driving groove 552 and the positioning arc groove 553 are arranged in a staggered manner, the left side of the bottom of the inner cavity of the box body 51 is fixedly connected with a motor 554, the output shaft of the motor 554 is fixedly connected with a vertical plate 555, the front side of the vertical plate 555 is fixedly connected with an arc plate 556 matched with the positioning arc groove 553, the top and the bottom of the front side of the vertical plate 555 are fixedly connected with a driving block 557 matched with the driving groove 552, the top of the base 1 is provided with a pressing plate 6, the bottom of the pressing plate 6 is provided with a lifting mechanism 7, the lifting mechanism 7 comprises a groove 71 arranged at the rear side of the inner cavity of the conveying cavity 2, the bottom of the inner cavity of the groove 71 is fixedly connected with an air cylinder 72, the, the bottom of the guide rod 73 penetrates into the inner cavity of the groove 71, the surface of the guide rod 73 is in sliding connection with the base 1, the top of the pressing plate 6 is provided with an aluminum wire pay-off mechanism 8, the aluminum wire pay-off mechanism 8 comprises an aluminum wire coil placing box 81 fixed on the left side of the top of the pressing plate 6, the front side of the aluminum wire coil placing box 81 is fixedly connected with a pay-off box 82, the right side of the pay-off box 82 is fixedly connected with a motor 83, an output shaft of the motor 83 penetrates into the inner cavity of the pay-off box 82 and is fixedly connected with a rotating disc 84, the front side of the pay-off box 82 is fixedly connected with a pay-off guide pipe 85, the surface of the rotating disc 84 is provided with anti-skid sawteeth, when the semiconductor chip is used in a matched mode through the lifting mechanism 7 and the aluminum wire pay-off mechanism 8, after the semiconductor chip moves to a proper position, the air cylinder 72, the user places the aluminum wire coil in the inner cavity of the aluminum wire coil placement box 81, then the aluminum wire with one end is arranged to pass through the inner cavity of the wire releasing box 82 and pass through the bottom of the rotating disc 84, then the aluminum wire enters the inner cavity of the wire releasing guide pipe 85, the motor 83 is started to drive the rotating disc 84 to rotate, the aluminum wire is conveyed due to the friction force of the contact between the saw teeth on the surface of the rotating disc 84 and the aluminum wire, because the semiconductor chip is fixed by the pressing plate 6 at the moment, the pressing plate 6 drives the aluminum wire releasing mechanism 8 to move downwards when moving downwards, further the wire releasing guide pipe 85 is positioned at the top of the semiconductor chip, the aluminum wire coming out of the wire releasing guide pipe 85 is clamped by the ultrasonic cleaver 9, at the moment, the aluminum wire is slightly longer than the cleaver tip, when reaching a connection area, the aluminum wire at the knife tip of the ultrasonic cleaver 9 contacts with the chip and performs ultrasonic friction, the effect of connecting with the semiconductor chip is achieved, after a welding area is finished, the ultrasonic cleaver 9 cuts the aluminum wire connected with the aluminum wire paying off mechanism 8, then the aluminum wire which is clamped from the wire releasing guide tube 85 moves to another welding area through the ultrasonic cleaver 9, the ultrasonic friction is also adopted to connect the aluminum wire with the semiconductor chip, after the completion, the aluminum wire is cut off by the cleaver, the aluminum wire bonding of a semiconductor chip can be completed, the rear side of the top of the base 1 is provided with an ultrasonic cleaver 9, therefore, the semiconductor packaging ultrasonic aluminum wire bonding device solves the problems that when the semiconductor chip is bonded by the aluminum wire, when the semiconductor chip is conveyed, the intermittent feeding can not be realized, even the feeding is manually controlled, so that the automation degree is low, and the feeding of the aluminum wire also needs to be clamped by a cleaver tip, so that the stroke of clamping the aluminum wire is increased, and the bonding efficiency of the aluminum wire of the semiconductor chip is influenced.
In summary, the following steps: the semiconductor packaging ultrasonic aluminum wire bonding device has the advantages that the semiconductor chip is placed on the top of the conveyer belt 32, the conveyer belt 32 is enabled to intermittently convey the semiconductor chip to the right side by the transmission mechanism 5, after the semiconductor chip is conveyed to a proper position, the aluminum wire is conveyed to the top of the semiconductor by the aluminum wire pay-off mechanism 8, the contact surface of the aluminum wire and the semiconductor chip is rubbed by the ultrasonic cleaver 9 to generate heat and form eutectic melting between the aluminum wire and the chip contact surface aluminum layer, the effect of connecting with the chip is achieved, after the connection is completed, the aluminum wire is continuously conveyed to the right side by the conveying mechanism 3, the purpose of high-efficiency bonding can be achieved, the problems that when the aluminum wire is bonded by a conductor chip, the intermittent feeding cannot be achieved, even the feeding is manually controlled, the automation degree is low, the feeding of the aluminum wire is required to be clamped by the cleaver tip, and the stroke of clamping the aluminum, the efficiency of the aluminum wire bonding of the semiconductor chip is influenced, the efficiency of the aluminum wire bonding of the semiconductor chip can be effectively improved, the efficiency of the semiconductor processing is improved, through the arrangement of the transmission mechanism 5, the motor 554 is started to drive the vertical plate 555, the arc plate 556 and the driving block 557 to rotate, so that the driving block 557 is rotated into the inner cavity of the driving groove 552, the driving disc 551 can be driven to rotate, the purpose of driving the rotating rod 52 to rotate is realized, after the driving disc 551 rotates ninety degrees, the driving block 557 at the moment is separated from the inner cavity of the current driving groove 552, and then the arc plate 556 enters the inner cavity of the positioning arc groove 553, the driving disc 551 can be limited, the phenomenon that the rotating rod 52 rotates too much is avoided, when one driving block 557 enters the inner cavity of the driving groove 552, the driving disc 551 is driven to rotate ninety degrees, so as to drive the rotating rod 52 to rotate ninety degrees, and the, the gear ring 54 can be driven to move, the gear ring 54 can drive the conveyer belt 32 to move intermittently, the purpose of automatic intermittent movement and conveying of semiconductor chips can be achieved, the lifting mechanism 7 and the aluminum wire paying-off mechanism 8 are used in a matched mode, after the semiconductor chips move to a proper position, the air cylinder 72 retracts to drive the pressing plate 6 to move downwards to be in contact with the semiconductor chips, the stability of the semiconductor chips in bonding can be guaranteed, the situation that the semiconductor chips are shaken in the bonding process is avoided, a user places an aluminum wire coil in the inner cavity of the aluminum wire coil placing box 81, then arranges an aluminum wire at one end to penetrate through the inner cavity of the wire releasing box 82 and penetrate through the bottom of the rotating disc 84, then the aluminum wire enters the inner cavity of the wire releasing guide pipe 85, the motor 83 is started to drive the rotating disc 84 to rotate, the aluminum wire is conveyed due to the friction force of the surface of the rotating disc 84, which is in contact with the aluminum wire, and, when the pressing plate 6 moves downwards, the aluminum wire pay-off mechanism 8 is driven to move downwards, the pay-off guide pipe 85 is located at the top of a semiconductor chip, an aluminum wire coming out of the pay-off guide pipe 85 is clamped by the ultrasonic cleaver 9, the aluminum wire is slightly longer than the point of a cleaver at the moment, when the aluminum wire reaches a connection area, the aluminum wire at the point of the ultrasonic cleaver 9 is in contact with the chip and generates heat through ultrasonic friction, the aluminum wire is melted, the effect of connection with the semiconductor chip is achieved, after one welding area is completed, the aluminum wire connected with the aluminum wire pay-off mechanism 8 is cut off by the ultrasonic cleaver 9, then the aluminum wire coming out of the pay-off guide pipe 85 is clamped and moved to the other welding area through the ultrasonic cleaver 9, ultrasonic friction is also adopted, the aluminum wire is connected with the semiconductor chip, and after the aluminum wire is cut off by the cle.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a semiconductor package supersound aluminum wire bonding device, includes base (1), its characterized in that: the conveying cavity (2) is seted up at the top of base (1), the inner chamber of conveying cavity (2) is provided with conveying mechanism (3), conveying mechanism (3) are connected in two of conveying cavity (2) inner chambers and are changeed roller (31) including rotating, the surface cover of changeing roller (31) is equipped with conveyer belt (32), the inner chamber fixedly connected with backup pad (4) of conveying cavity (2), the top and conveyer belt (32) contact of backup pad (4), the surface of conveyer belt (32) is provided with drive mechanism (5), the top of base (1) is provided with clamp plate (6), the bottom of clamp plate (6) is provided with elevating system (7), the top of clamp plate (6) is provided with aluminium wire paying out machine structure (8), the rear side at base (1) top is provided with ultrasonic wave cleaver (9).
2. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: drive mechanism (5) are including being fixed in box (51) on base (1) top right side, the rear side rotation of box (51) inner chamber is connected with bull stick (52), the front end of bull stick (52) runs through to the front side of box (51) and fixedly connected with gear (53), gear (53) are located the inner chamber of carrying chamber (2), the front side fixedly connected with ring gear (54) on conveyer belt (32) surface, ring gear (54) and gear (53) meshing, the inner chamber of box (51) is provided with actuating mechanism (55).
3. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 2, wherein: the driving mechanism (55) comprises a driving disc (551) fixed on the surface of the rotating rod (52), driving grooves (552) and positioning arc-shaped grooves (553) are formed in the periphery of the surface of the driving disc (551), and the driving grooves (552) and the positioning arc-shaped grooves (553) are arranged in a staggered mode.
4. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 3, wherein: the left side of the bottom of the inner cavity of the box body (51) is fixedly connected with a motor (554), an output shaft of the motor (554) is fixedly connected with a vertical plate (555), the front side of the vertical plate (555) is fixedly connected with an arc plate (556) matched with the positioning arc groove (553), and the top and the bottom of the front side of the vertical plate (555) are fixedly connected with driving blocks (557) matched with the driving groove (552).
5. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: elevating system (7) are including offering recess (71) in transport chamber (2) inner chamber rear side, the bottom fixedly connected with cylinder (72) of recess (71) inner chamber, the top of cylinder (72) run through to the top of base (1) and with clamp plate (6) fixed connection.
6. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 5, wherein: the two sides of the bottom of the pressing plate (6) are fixedly connected with guide rods (73), the bottoms of the guide rods (73) penetrate through inner cavities of the grooves (71), and the surfaces of the guide rods (73) are connected with the base (1) in a sliding mode.
7. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 1, wherein: box (81) is placed including being fixed in the left aluminium drum in clamp plate (6) top to aluminium line paying out machine structure (8), the front side fixedly connected with of box (81) is placed to the aluminium drum is put line box (82), the right side fixedly connected with motor (83) of putting line box (82), the output shaft of motor (83) runs through to the inner chamber and the fixedly connected with rolling disc (84) of putting line box (82), the front side fixedly connected with unwrapping wire stand pipe (85) of putting line box (82).
8. The ultrasonic aluminum wire bonding device for the semiconductor package according to claim 7, wherein: the surface of the rotating disc (84) is provided with anti-slip saw teeth.
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| US5318234A (en) * | 1992-08-25 | 1994-06-07 | West Bond Inc. | Automatic wire de-spooler for wire bonding machines |
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