CN111855801A - Method for accurately measuring defect size of rough part based on laser ultrasonic imaging - Google Patents
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Abstract
The invention discloses a method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging, which comprises the following steps: scanning to obtain a surface wave time domain signal set; extracting a surface wave signal in a non-defective area as a reference signal; drawing a two-dimensional color image by taking the time of the maximum amplitude position of the reference signal as a reference; preliminarily identifying a defect image and setting a defect evaluation frame; performing cross-correlation operation and amplitude difference operation on all signals in the evaluation frame and reference signals to respectively obtain a two-dimensional matrix of a cross-correlation maximum value X, a time shift value tau and an amplitude difference value delta; setting the three thresholds to satisfy X<Xdec、τ>τdecAnd Δ>ΔdecAny one condition being a criterion structureEstablishing a defect binary matrix; and eliminating abnormal points of the binary matrix, counting zero-value element regions, and respectively obtaining the area, the length and the width of the defect region. The invention can avoid the problems of defect amplitude jump and signal-to-noise ratio uneven distribution caused by rough surface of the part, and realize accurate quantitative measurement of the defect size.
Description
Technical Field
The invention relates to the technical field of laser ultrasonic nondestructive testing, in particular to a method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging.
Background
The laser ultrasonic detection technology is the most potential on-line detection means applied to advanced manufacturing technologies represented by metal additive manufacturing due to the advantages of non-contact, high resolution, easy integration and the like. However, the surface of the sample is generally rough during the manufacturing process, and the roughness of the surface of the sample fluctuates within a range of 10 to 100 μm depending on the manufacturing method. The sample surface roughness can have two problems when the laser ultrasonic detection technology is used for detection: when the laser ultrasonic surface is propagated on the rough surface of the sample, the laser ultrasonic surface is disturbed by the rough microstructure of the sample surface to generate larger noise; and secondly, when a non-contact laser ultrasonic receiver based on the laser interference is adopted for detection, the signal-to-noise ratio dispersibility generated at different scanning positions is larger due to the fact that the size of a light spot is equivalent to the roughness. The inherent problems of the laser ultrasonic wave cause that when the laser ultrasonic wave is applied to the detection of rough surface parts, the fluctuation of defect signals is large, the defect boundaries are difficult to accurately identify, and particularly, in the scanning imaging process, the accurate measurement of the defect size of a rough sample is difficult to realize.
For laser ultrasonic detection research, the main direction at present is to polish the surface of an additive sample and then perform scanning imaging research, for example, french atomic energy committee uses a B scanning mode to detect the sub-millimeter scale defects on the surface of the polished additive sample; the university of nottingham in the united kingdom utilizes a laser ultrasonic C scanning mode to realize the detection of hundreds of micron-scale defects on the surface of a polished sample printed by a powder bed. Both of the above methods make it difficult to accurately measure the defect size of a rough surface part.
Disclosure of Invention
The invention aims to provide a method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging, aiming at overcoming the defects of the prior art, and solving the problem that the prior art is difficult to accurately and quantitatively measure the defect size of an industrial part with a rough surface.
The technical scheme adopted by the invention is as follows: a method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging comprises the following steps:
s1, two-dimensional scanning is carried out on the surface of a sample according to a scanning step d and the number of scanning points MxN at a fixed distance L between an excitation laser spot and a receiver spot of a laser ultrasonic system, and M x N groups of ultrasonic surface wave time domain signals are obtained;
s2, extracting a group of surface wave time domain signals A scanned from a defect-free area of the sample from the M multiplied by N groups of signals0(t) as a reference signal, obtaining the surface wave time domain signal A0(t) time t0 at which the maximum amplitude corresponds;
s3, extracting the amplitude intensity of all M multiplied by N groups of signals at the time t0 by taking t0 as a reference time, constructing an M multiplied by N amplitude matrix, and drawing the M multiplied by N amplitude matrix into a two-dimensional color image;
s4, identifying the image map containing the defect area from the two-dimensional color image, and setting the range of the defect evaluation frame as Mf×Nf；
S5, calling all time domain signals A (t) in the range of the evaluation frame in sequence, and combining the reference signal A0(t) performing a cross-correlation operation according to the formula (1),
calculating the maximum value X of the cross-correlation function Xcor (n) of each scanning point in the evaluation frame and the corresponding time shift tau according to the formula (1), and respectively recording the maximum value X and the time shift tau as two values Mf×NfA matrix of (a);
s6, all time domain signals A (t) in the range of the evaluation frame are respectively compared with the reference signal A0(t) comparing absolute values of the maximum amplitudes according to the formula (2),
the amplitude difference Δ is obtained and recorded as magnitude Mf×NfA matrix of (a);
s7, respectively setting a threshold value X by taking the maximum value X of the cross-correlation function, the time shift tau and the amplitude difference delta as characteristic quantities of whether the cross-correlation function is a defect scanning point or notdecThreshold value τdecAnd a threshold value deltadecAnd sequentially evaluating each scanning point in the evaluation frame: when X is satisfied<Xdec、τ>τdecAnd Δ>ΔdecWhen any one of the three conditions is satisfied, the scanning point is determined as a defect position point and is recorded as 0, otherwise, the scanning point is recorded as 1, and the scanning point of the evaluation frame range is described as Mf×NfThe binarization matrix of (1);
s8, eliminating abnormal points existing in the binary matrix, wherein the eliminating method comprises the following steps: judging the elements with the value of 1 in the matrix one by one, and when 8 points around the elements are all 0 values, setting the value of the element as 0, wherein the scanning points corresponding to the elements are abnormal points; the area with the element value of 0 in the removed binary matrix is a defect area;
s9, counting the quantity Q of all 0 elements in the binary matrix, and combining with scanning stepping d to obtain the defect area S which is Q multiplied by d2Respectively counting the number M of 0 elements in two dimensions of the binary matrixxAnd NyObtaining the length l and the width b of the defect area, wherein l is Mx×d，b＝Ny×d。
According to the above scheme, in S1, the scanning step d is not more than one-half of the target detection accuracy.
According to the scheme, in S1, the value range of the distance L is 1-2 mm.
According to the above scheme, in S2, surface wave signal A0The maximum amplitude of (t) is taken as its absolute value.
According to the scheme, in S4, the method for identifying the image map containing the defect area comprises the following steps: compared with the color of the non-defective area, the area with obvious color difference is the defective area.
In S4, the defect evaluation box completely covers the defective area in the above-described scheme.
According to the scheme, in S7, the threshold value XdecThe setting method comprises the following steps:selecting a set of surface wave time domain signals of a defect free region as A0(t) as a reference signal, calculating a set of cross-correlation coefficients, and taking the average value of the cross-correlation coefficients as Xdec。
According to the scheme, in S7, the threshold value taudecThe setting method comprises the following steps: the time corresponding to 1/4 cycles of the surface wave is taken as taudec。
According to the scheme, in S7, the threshold value deltadecThe setting method comprises the following steps: selecting a set of surface wave time domain signals of a defect free region as A0(t) as a reference signal, calculating a set of amplitude differences, the average of which plus 6dB is taken as Deltadec。
The invention has the beneficial effects that: the technical scheme of the invention accurately identifies the defect area in the scanned image and accurately and quantitatively measures the defect size by providing three comprehensive judgment conditions of the maximum value of the cross correlation coefficient, the time translation and the amplitude difference value, solves the problems of random fluctuation of echo amplitudes of the defect area and the non-defect area caused by the rough surface of the detected sample and difficulty in distinguishing the defect boundary in the prior art, and improves the measurement accuracy of the defect size of the detected sample. The invention can also be applied to other defects which are difficult to quantify and are caused by low signal-to-noise ratio or uneven noise distribution, such as large non-contact laser ultrasonic imaging noise caused by coarse texture crystal grains in the material, uneven non-contact laser ultrasonic imaging signal-to-noise ratio distribution caused by uneven color and luster of the surface of a component, and the like.
Drawings
FIG. 1 is a schematic diagram of a rough sample and defects in accordance with one embodiment of the present invention.
Fig. 2 is a schematic diagram of a reference surface wave signal in the present embodiment.
Fig. 3 is a schematic diagram of laser ultrasonic scanning imaging in the present embodiment.
FIG. 4 is a schematic diagram of a defect image in the present embodiment.
Fig. 5 is a schematic length diagram of a defect area in the present embodiment.
Fig. 6 is a schematic width diagram of a defect region in the present embodiment.
Detailed Description
For a better understanding of the present invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
Printing a stainless steel sample with the length of 30mm, the width of 30mm and the thickness of 5mm by using a powder bed cladding additive manufacturing method, wherein the surface roughness range of the sample is 8-12 mu m; a long-strip defect with the length of 1mm and the width and the depth of 0.1mm is designed on the surface of a sample, as shown in figure 1. Based on the sample, the invention provides a method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging, which specifically comprises the following steps:
s1, two-dimensional scanning is carried out on the surface of a sample according to scanning stepping d and the number of scanning points MxN at a fixed distance L between an excitation laser spot and a receiver spot of a laser ultrasonic system, and M x N groups of ultrasonic surface wave time domain signals are obtained.
In the present invention, the setting principle of the distance L includes two points: firstly, on the premise of ensuring that the surface wave crest and the interference wave crest can be distinguished in a time domain, a smaller value is selected as much as possible; and secondly, aiming at samples with different roughness grades, the signal-to-noise ratio of the surface wave is always ensured to be higher than 6 dB. Based on the two points, the value range of the distance L is 1-2 mm. The setting principle of the scanning step d is as follows: the scan step d is no more than one-half of the target detection accuracy.
In this embodiment, the pitch L is 2mm, the scanning step d is 0.048mm, the number of scanning points M × N is 215 × 208, and 215 × 208 sets of ultrasonic surface wave time domain signals are obtained.
S2, extracting a group of surface wave time domain signals A scanned from a defect-free area of the sample from the M multiplied by N groups of signals0(t) as a reference signal, obtaining the surface wave time domain signal A0(t) time t0 at which the maximum amplitude corresponds; in this embodiment, t0 is 0.84 μ s, as shown in fig. 2.
In the present invention, a surface wave time domain signal A0(t) the maximum amplitude may be positive or negative and is calculated as the absolute value.
And S3, extracting the amplitude intensity of all M multiplied by N groups of signals at the time t0 by taking t0 as a reference time, constructing an M multiplied by N amplitude matrix, and drawing the M multiplied by N amplitude matrix into a two-dimensional color image, as shown in FIG. 3.
S4, identifying the image map containing the defect area from the two-dimensional color image, and setting the range of the defect evaluation frame as Mf×NfAs shown in fig. 3.
In the invention, the method for identifying the image map containing the defect area comprises the following steps: compared with the color of the non-defective area, the area with obvious color difference is the defective area. The range of the defect evaluation frame is set according to the principle that the range of the defect evaluation frame is as small as possible on the premise of ensuring the coverage of the defect area.
S5, calling all time domain signals A (t) in the range of the evaluation frame in sequence, and combining the reference signal A0(t) performing a cross-correlation operation according to the formula (1),
calculating the maximum value X of the cross-correlation function Xcor (n) of each scanning point in the evaluation frame and the corresponding time shift tau according to the formula (1), and respectively recording the maximum value X and the time shift tau as two values Mf×NfOf the matrix of (a).
S6, all time domain signals A (t) in the range of the evaluation frame are respectively compared with the reference signal A0(t) comparing absolute values of the maximum amplitudes according to the formula (2),
the amplitude difference Δ is obtained and recorded as magnitude Mf×NfOf the matrix of (a).
S7, respectively setting a threshold value X by taking the maximum value X of the cross-correlation function, the time shift tau and the amplitude difference delta as characteristic quantities of whether the cross-correlation function is a defect scanning point or notdecThreshold value τdecAnd a threshold value deltadecAnd sequentially evaluating each scanning point in the evaluation frame: when X is satisfied<Xdec、τ>τdecAnd Δ>ΔdecWhen any one of the three conditions is satisfied, the scanning point is determined as a defect position point and is recorded as 0, otherwise, the scanning point is recorded as 01, describe the assessment frame range scan point as an Mf×NfThe binarization matrix of (1);
in the present invention, the threshold value XdecThe setting method of (1) is that the sample roughness is positively correlated, and the setting method comprises the following steps: selecting a set of surface wave time domain signals of a defect free region as A0(t) as a reference signal, calculating a set of cross-correlation coefficients, and taking the average value of the cross-correlation coefficients as Xdec。
Threshold τdecThe setting method is related to the period of the surface wave, and comprises the following steps: the time corresponding to 1/4 cycles of the surface wave is taken as taudec。
Threshold value deltadecThe setting method is as follows: selecting a set of surface wave time domain signals of a defect free region as A0(t) as a reference signal, calculating a set of amplitude differences, the average of which plus 6dB is taken as Deltadec。
S8, eliminating abnormal points existing in the binary matrix, wherein the eliminating method comprises the following steps: and judging the elements with the value of 1 in the matrix one by one, and when 8 points around the element are all 0 values, setting the value of the element as 0, wherein the scanning point corresponding to the element is an abnormal point. The removed binary matrix is used to describe the defect morphology, wherein the area with the element value of 0 is the defect area, as shown in fig. 4.
S9, counting the quantity Q of all 0 elements in the binary matrix, and combining with scanning stepping d to obtain the defect area S which is Q multiplied by d2Respectively counting the number M of 0 elements in two dimensionsxAnd NyThe length l and width b of the defect region can be obtained, where l ═ Mx×d，b＝NyX d. In the present invention, the length l of the defective region is the maximum length of the region, and the width b of the defective region is the maximum width of the region.
In this embodiment, the binary matrix corresponds to the number M of 0 elements in the dimension of the length direction of the defect regionx20, the length l of the defect area is MxX d 20 × 0.048 0.96mm as shown in fig. 5; the binary matrix corresponds to 0 element in the dimension of the width direction of the defect areaNumber of elements NYIf 3, the width b of the defect area is NyAnd x d is 3 × 0.048 is 0.144mm, as shown in fig. 6.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (9)
1. A method for accurately measuring the defect size of a rough part based on laser ultrasonic imaging is characterized by comprising the following steps:
s1, two-dimensional scanning is carried out on the surface of a sample according to a scanning step d and the number of scanning points MxN at a fixed distance L between an excitation laser spot and a receiver spot of a laser ultrasonic system, and M x N groups of ultrasonic surface wave time domain signals are obtained;
s2, extracting a group of surface wave time domain signals A scanned from a defect-free area of the sample from the M multiplied by N groups of signals0(t) as a reference signal, obtaining the surface wave time domain signal A0(t) time t0 at which the maximum amplitude corresponds;
s3, extracting the amplitude intensity of all M multiplied by N groups of signals at the time t0 by taking t0 as a reference time, constructing an M multiplied by N amplitude matrix, and drawing the M multiplied by N amplitude matrix into a two-dimensional color image;
s4, identifying the image map containing the defect area from the two-dimensional color image, and setting the range of the defect evaluation frame as Mf×Nf；
S5, calling all time domain signals A (t) in the range of the evaluation frame in sequence, and combining the reference signal A0(t) performing a cross-correlation operation according to the formula (1),
calculating the maximum value X of the cross-correlation function Xcor (n) of each scanning point in the evaluation frame and the corresponding time shift tau according to the formula (1), and respectively recording the maximum value X and the time shift tau as two values Mf×NfA matrix of (a);
s6, all time domain signals A (t) in the range of the evaluation frame are respectively compared with the reference signal A0(t) comparing absolute values of the maximum amplitudes according to the formula (2),
the amplitude difference Δ is obtained and recorded as magnitude Mf×NfA matrix of (a);
s7, respectively setting a threshold value X by taking the maximum value X of the cross-correlation function, the time shift tau and the amplitude difference delta as characteristic quantities of whether the cross-correlation function is a defect scanning point or notdecThreshold τdecAnd a threshold value deltadecAnd sequentially evaluating each scanning point in the evaluation frame: when X is satisfied<Xdec、τ>τdecAnd Δ>ΔdecWhen any one of the three conditions is satisfied, the scanning point is determined as a defect position point and is recorded as 0, otherwise, the scanning point is recorded as 1, and the scanning point of the evaluation frame range is described as Mf×NfThe binarization matrix of (1);
s8, eliminating abnormal points existing in the binary matrix, wherein the eliminating method comprises the following steps: judging the elements with the value of 1 in the matrix one by one, and when 8 points around the elements are all 0 values, setting the value of the element as 0, wherein the scanning points corresponding to the elements are abnormal points; the area with the element value of 0 in the removed binary matrix is a defect area;
s9, counting the quantity Q of all 0 elements in the binary matrix, and combining with scanning stepping d to obtain the defect area S which is Q multiplied by d2Respectively counting the number M of 0 elements in two dimensions of the binary matrixxAnd NyObtaining the length l and the width b of the defect area, wherein l is Mx×d，b＝Ny×d。
2. The method for accurately measuring the dimensions of the defects in the rough part according to claim 1, wherein the scanning step d is not more than one-half of the target detection accuracy in S1.
3. The method for accurately measuring the defect size of a rough part according to claim 1, wherein in S1, the distance L has a value ranging from 1 to 2 mm.
4. The method for accurately measuring the dimensions of a defect in a rough part according to claim 1, wherein the surface wave signal a is obtained in S20The maximum amplitude of (t) is taken as its absolute value.
5. The method for accurately measuring the defect size of a rough part according to claim 1, wherein in S4, the method for identifying the image map containing the defect region comprises: compared with the color of the non-defective area, the area with obvious color difference is the defective area.
6. The method for accurately measuring the defect size of a rough part according to claim 1, wherein the defect evaluation box completely covers the defect area in S4.
7. The method for accurately measuring the defect size of a rough part according to claim 1, wherein the threshold value X is set at S7decThe setting method comprises the following steps: selecting a set of surface wave time domain signals of a defect free region as A0(t) as a reference signal, calculating a set of cross-correlation coefficients, and taking the average value of the cross-correlation coefficients as Xdec。
8. The method for accurately measuring the defect size of a rough part according to claim 1, wherein the threshold τ is set at S7decThe setting method comprises the following steps: the time corresponding to 1/4 cycles of the surface wave is taken as taudec。
9. The method for accurately measuring the defect size of a rough part according to claim 1, wherein the threshold value Δ is set at S7decThe setting method comprises the following steps: selecting a set of surface wave time domain signals of a defect free region as A0(t) calculating a set of amplitude differences for the reference signal, the average of the set of amplitude differencesPlus 6dB as Δdec。
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| CN113446944B (en) * | 2021-06-16 | 2023-11-03 | 厦门天宇丰荣科技有限公司 | Method and device for evaluating dimension precision of straight line element of 3D printing of biological ink |
| CN114166942A (en) * | 2021-11-25 | 2022-03-11 | 武汉大学 | Laser ultrasonic-based method for measuring defect burying depth between metal additive manufacturing layers |
| CN114166942B (en) * | 2021-11-25 | 2023-08-15 | 武汉大学 | Method for measuring interlayer defect burial depth in metal additive manufacturing based on laser ultrasonic |
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