CN111854400A - Semiconductor part assembly packaging device and using method thereof - Google Patents
Semiconductor part assembly packaging device and using method thereof Download PDFInfo
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- CN111854400A CN111854400A CN202010751403.5A CN202010751403A CN111854400A CN 111854400 A CN111854400 A CN 111854400A CN 202010751403 A CN202010751403 A CN 202010751403A CN 111854400 A CN111854400 A CN 111854400A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B17/00—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement
- F26B17/02—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces
- F26B17/04—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces the belts being all horizontal or slightly inclined
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/002—Handling, e.g. loading or unloading arrangements for bulk goods
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor part assembly packaging device and a using method thereof, and relates to the technical field of semiconductor part processing. Including dry bellows, dry bellows's one end welding has the extension to carry on the pipe, and the inside bottom mounting that extends to carry on has a locating support, and extends to carry on the inside bottom still to be fixed with two cooperation direction slide rails, and two cooperation direction slide rails are located the both sides of locating support respectively. According to the invention, through the design of the air-drying self-conveying material carrying frame structure, the device is convenient for carrying out convenient and fast adaptive clamping on semiconductor parts for production, conveying and discharging are intelligently carried out, the high-temperature scalding risk generated in the manual feeding process is avoided, a large amount of labor consumption is reduced, and through the design of the fast liquid-remaining-free cooling structure, the device is convenient for carrying out fast non-liquid-spraying type fast matched cooling on the dried high-temperature semiconductor parts, so that the liquid is prevented from remaining, and meanwhile, the efficient cooling processing is completed.
Description
Technical Field
The invention relates to the technical field of semiconductor part processing, in particular to a semiconductor part assembling and packaging device and a using method thereof.
Background
The semiconductor production flow is composed of wafer manufacturing, wafer testing, chip packaging and post-packaging testing, the semiconductor packaging testing refers to the process of processing a wafer passing the testing according to product models and functional requirements to obtain independent chips, the cleaned semiconductor parts are often required to be dried and then cooled in the process, and therefore good processing performance is guaranteed.
SUMMARY OF THE PATENT FOR INVENTION
The invention aims to provide a semiconductor part assembling and packaging device and a using method thereof, which aim to solve the existing problems: the existing device is often sent into the high-temperature drying furnace by manpower pushing in the using process, so that the existing device is often easily scalded and wastes a large amount of manpower in the processing process.
In order to achieve the purpose, the invention provides the following technical scheme: the semiconductor part assembly packaging device comprises a drying air box, wherein an extension carrying pipe is welded at one end of the drying air box, a positioning support is fixed at the bottom end inside the extension carrying pipe, two matched guide slide rails are fixed at the bottom end inside the extension carrying pipe and are respectively positioned at two sides of the positioning support, a long shaft motor is fixed at one end of the positioning support through a screw, the output end of the long shaft motor is rotatably connected with an output threaded rod, the top ends of the output threaded rod and the long shaft motor are movably connected with an air-drying self-transferring material carrying frame structure, and a quick liquid-remaining-free cooling structure is fixed at the top end of the extension carrying pipe;
the air-drying self-transferring material carrying frame structure comprises a frame main body, matched sliding blocks, a transmission connecting guide block and stable adaptive clamping structures, wherein two sides of the bottom end of the frame main body are welded with the matched sliding blocks, the bottom end of the frame main body is also welded with the transmission connecting guide block, the transmission connecting guide block is positioned between the two matched sliding blocks, and a plurality of stable adaptive clamping structures are fixed inside the frame main body;
the stable adaptive clamping structure comprises a positioning bottom plate, an assembling frame, a limiting inner assembling shell, a first spring, a bidirectional transmission push rod, a second spring, a displacement force-unloading push rod, a contact load plate, an adaptive limiting block, a clamping and clamping frame, a stroke limiting spring and a contact roller wheel, wherein the top end of the positioning bottom plate is welded with the limiting inner assembling shell and the assembling frame, the limiting inner assembling shell is positioned in the assembling frame, the inner side of the assembling frame is welded with the first spring, the bottom end of the first spring is completely attached to the bottom end of the bidirectional transmission push rod, the bottom end of the bidirectional transmission push rod is welded with the contact load plate, four end corners at the bottom of the contact load plate are welded with the displacement force-unloading push rod which is connected with the assembling frame in a sliding manner, the bottom end of the displacement force-unloading push rod is connected with the positioning bottom plate through the second spring, the adaptive limiting blocks are welded on two sides of the top end of the contact load plate, the inner part of the adaptive limiting block is connected with the clamping and clamping frame in a sliding mode, the clamping and clamping frame is connected with the clamping and clamping frame through a stroke limiting spring, and the inner side of the clamping and clamping frame is fixedly connected with the contact rollers.
Preferably, quick no liquid retention cooling structure includes cooling assembly jig, water storage box, backflow water pipe, semiconductor refrigeration piece, slice cold guide, drawing liquid pump, location connecting plate, circulating water cooling pipe and wind-force fan, the both ends of cooling assembly jig all with water storage box fixed connection, water storage box and another the top between the water storage box is passed through the backward flow water piping connection, the inside top of water storage box still with semiconductor refrigeration piece fixed connection, the bottom of semiconductor refrigeration piece is passed through temperature and is glued and slice cold guide and be connected, the bottom mounting of water storage box has the drawing liquid pump, the one end and the circulating water cooling pipe plug-in connection of drawing liquid pump, the top and the location connecting plate joint of circulating water cooling pipe are connected, the bottom both ends of cooling assembly jig all pass through the screw with the wind-force fan fixedly.
Preferably, the guide T-shaped sliding grooves are formed in the two sides of the assembling frame, a T-shaped matching sliding block is welded at one end of the displacement force-unloading push rod, and the guide T-shaped sliding grooves are in clearance fit with the T-shaped matching sliding block.
Preferably, the forked tail sliding tray has all been seted up at the inside both ends of adaptation stopper, the bottom welding of clamping chucking frame has the forked tail slider, the forked tail slider is clearance fit with the forked tail sliding tray.
Preferably, the transmission connection guide block is internally provided with a power connection through hole, the bottom end of the matching section sliding block is provided with a displacement following groove, the displacement following groove and the matching guide sliding rail are in clearance fit, and the power connection through hole is in threaded connection with the output threaded rod.
Preferably, a plurality of air drying air passing holes are formed in the periphery of the frame main body, and the diameter of each air drying air passing hole is three centimeters.
Preferably, the bottom end of the positioning connecting plate is fixed with a plurality of soft clamping locking blocks, and the soft clamping locking blocks are connected with the circulating water cooling pipe in a clamping mode.
Preferably, the flaky cold guide block is made of copper, a plurality of contact surface grooves are formed in the flaky cold guide block, and the width of each contact surface groove is one centimeter.
A method for using a semiconductor component assembly packaging device, which is used for any one of the above steps, and comprises the following steps:
s1: clamping and positioning are completed by placing the semiconductor part and stably adapting to the top end of the clamping structure by setting the temperature of the drying air box to be ninety-five ℃;
s2: the formation of the derivation force is completed by controlling the positioning support, and the feeding pushing of the whole air-dried self-transferring material carrying frame structure is completed by matching with the guide slide rail, so that the parts enter the interior of the extension carrying pipe and are dried to remove moisture;
s3: after moisture is removed, a reverse driving force is completed by controlling the positioning support, the reset driving of the air-dried self-transferring material carrying frame structure is completed by matching with the guide slide rail, and the air-dried self-transferring material carrying frame structure is taken out of the extension carrying pipe to be positioned at the bottom of the rapid liquid-cooling-free structure;
s4: form compound quick wind-force cooling through quick no liquid cooling structure that stays, accomplish the temperature reduction to the part to reach quick cooling, so that follow-up continuation processing.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the design of the air-drying self-transferring material carrying frame structure, the device is convenient for carrying out convenient and fast adaptive clamping on semiconductor parts for production, and carrying and discharging materials intelligently, so that the risk of high-temperature scalding generated in the manual feeding process is avoided, and a large amount of labor consumption is reduced;
2. according to the invention, through the design of the rapid liquid-remaining-free cooling structure, the device is convenient for rapid non-liquid-spraying rapid matching cooling of the dried high-temperature semiconductor part, so that the high-efficiency cooling processing is completed while the liquid remaining is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention patent, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a side view of the present invention in its entirety;
FIG. 3 is a partial cross-sectional view of the invention as a whole;
FIG. 4 is a schematic view of a partial structure of the air-drying self-transporting material carrying frame structure according to the present invention;
FIG. 5 is a schematic view of a portion of the stable adaptive clamping structure of the present invention;
fig. 6 is a partial structural schematic view of the fast cooling structure without leaving liquid according to the present invention.
In the figure: 1. drying the air box; 2. an extension carrying pipe; 3. matching with a guide slide rail; 4. positioning the bracket; 5. a long shaft motor; 6. an output threaded rod; 7. a frame body; 8. matching a section sliding block; 9. the transmission is connected with the guide block; 10. the clamping structure is stably adapted; 11. air-drying the self-transferring material carrying frame structure; 12. positioning the bottom plate; 13. assembling a frame; 14. limiting the inner shell; 15. a first spring; 16. a bidirectional conductive push rod; 17. a second spring; 18. a displacement force-unloading push rod; 19. contacting the landing plate; 20. adapting to a limiting block; 21. clamping and clamping the clamping frame; 22. a travel limit spring; 23. a contact roller; 24. cooling the assembly frame; 25. a water storage tank; 26. a return flow pipe; 27. a semiconductor refrigeration sheet; 28. a sheet-shaped cold guide block; 29. a liquid pump; 30. positioning the connecting plate; 31. a circulating water-cooled tube; 32. a wind power fan; 33. a fast liquid-free cooling structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-6, a semiconductor part assembly and packaging device and a using method thereof, including a drying air box 1, one end of the drying air box 1 is welded with an extension carrying pipe 2, a positioning support 4 is fixed at the bottom end inside the extension carrying pipe 2, two matching guide slide rails 3 are also fixed at the bottom end inside the extension carrying pipe 2, the two matching guide slide rails 3 are respectively located at two sides of the positioning support 4, a long shaft motor 5 is fixed at one end of the positioning support 4 through a screw, the output end of the long shaft motor 5 is rotatably connected with an output threaded rod 6, the top ends of the output threaded rod 6 and the long shaft motor 5 are both movably connected with an air-drying self-transferring material carrying frame structure 11, and a quick non-residual liquid cooling structure 33 is fixed at the top end of the extension;
the air-drying self-transferring material carrying frame structure 11 comprises a frame main body 7, matched sliding blocks 8, a transmission connecting guide block 9 and a stable adaptive clamping structure 10, wherein two sides of the bottom end of the frame main body 7 are welded with the matched sliding blocks 8, the bottom end of the frame main body 7 is also welded with the transmission connecting guide block 9, the transmission connecting guide block 9 is positioned between the two matched sliding blocks 8, a plurality of stable adaptive clamping structures 10 are fixed inside the frame main body 7, the stable adaptive clamping structure 10 comprises a positioning bottom plate 12, a matched frame 13, a limiting inner shell 14, a first spring 15, a bidirectional transmission push rod 16, a second spring 17, a displacement force-unloading push rod 18, a contact loaded plate 19, an adaptive limiting block 20, a clamping and clamping frame 21, a stroke limiting spring 22 and a contact roller 23, the top end of the positioning bottom plate 12 is welded with the limiting inner shell 14 and the matched frame 13, the limiting inner shell 14 is positioned inside the matched frame 13, the inner side of the assembling frame 13 is welded with a first spring 15, the bottom end of the first spring 15 is completely attached to the bottom end of a bidirectional conduction push rod 16, the bottom end of the bidirectional conduction push rod 16 is welded with a contact loading plate 19, four end corners at the bottom of the contact loading plate 19 are welded with a displacement force-unloading push rod 18, the displacement force-unloading push rod 18 is connected with the assembling frame 13 in a sliding mode, the bottom end of the displacement force-unloading push rod 18 is connected with the positioning bottom plate 12 through a second spring 17, adaptive limiting blocks 20 are welded on two sides of the top end of the contact lapping plate 19, the interior of each adaptive limiting block 20 is connected with the clamping and clamping frame 21 in a sliding mode, the clamping and clamping frame 21 is connected with the clamping and clamping frame 21 through a stroke limiting spring 22, and the inner side of the clamping and clamping frame 21 is fixedly connected with a plurality of contact rollers 23, so that adaptive clamping of semiconductor parts is completed, automatic feeding and material taking are completed, and manual contact is avoided;
the quick liquid-cooling-free structure 33 comprises a cooling assembly frame 24, water storage tanks 25, a water return pipe 26, semiconductor refrigeration sheets 27, sheet-shaped cold guide blocks 28, a liquid pump 29, a positioning connecting plate 30, a circulating water cooling pipe 31 and a wind power fan 32, wherein two ends of the cooling assembly frame 24 are fixedly connected with the water storage tanks 25, the top between one water storage tank 25 and the other water storage tank 25 is connected through the water return pipe 26, the top ends of the interiors of the water storage tanks 25 are also fixedly connected with the semiconductor refrigeration sheets 27, the bottom ends of the semiconductor refrigeration sheets 27 are connected with the sheet-shaped cold guide blocks 28 through temperature sensitive glue, the liquid pump 29 is fixed at the bottom end of the water storage tank 25, one end of the liquid pump 29 is connected with the circulating water cooling pipe 31 in an inserting mode, the top end of the circulating water cooling pipe 31 is connected with the positioning connecting plate 30 in a clamping mode, two ends of the bottom end of the cooling assembly frame 24 are both fixed with, the residual damage of the traditional water cooling is avoided;
the two sides of the assembling frame 13 are both provided with guide T-shaped sliding grooves, one end of the displacement force-unloading push rod 18 is welded with a T-shaped matching sliding block, and the guide T-shaped sliding grooves and the T-shaped matching sliding block are in clearance fit, so that the component force derivation of stress is facilitated, and a good stress bearing effect is achieved;
dovetail sliding grooves are formed in two ends of the interior of the adaptive limiting block 20, a dovetail sliding block is welded at the bottom end of the clamping and clamping frame 21, and the dovetail sliding block and the dovetail sliding grooves are in clearance fit, so that sliding fit clamping adaptive derivation and adjustment can be conveniently formed;
the inside of the transmission connection guide block 9 is provided with a power connection through hole, the bottom end of the matching section sliding block 8 is provided with a displacement following groove, the displacement following groove is in clearance fit with the matching guide sliding rail 3, and the power connection through hole is in threaded connection with the output threaded rod 6, so that power transmission connection is conveniently completed, a good power displacement effect is formed, and the displacement of feeding and taking is formed;
a plurality of air-drying air holes are formed in the periphery of the frame main body 7, the diameter of each air-drying air hole is three centimeters, and external wind power can be conveniently and rapidly guided in and pushed to carry out rapid air drying;
a plurality of soft clamping locking blocks are fixed at the bottom end of the positioning connecting plate 30 and are connected with the circulating water cooling pipe 31 in a clamping manner, so that the circulating water cooling pipe 31 can be conveniently fixed, and a water cooling range with a larger area is formed;
the material of cold guide block 28 of slice is copper, and a plurality of contact surface grooves are seted up to the inside of cold guide block 28 of slice, and the width in contact surface groove is one centimetre, is convenient for with the inside of the quick leading-in water storage box 25 of refrigeration effect of semiconductor refrigeration piece 27 formation to reach the effect of lasting cooling water flow, thereby guarantee to wind-force refrigerated effect.
The working principle is as follows: the semiconductor part is transversely inserted between the two clamping and clamping frames 21, the whole part is conveniently pushed by the contact roller 23 to carry out clamping displacement, in the inserting process, the clamping and clamping frames 21 on the two sides slide along with the dovetail sliding grooves under stress to expand to form the enlargement of a clamping range, after the inserting is stopped, the clamping and clamping frames 21 on the two sides lose stress and are clamped inwards under the reset and pulling action of the stroke limiting springs 22 to finish the adaptive clamping of the part, the guide pressure is formed by the clamping of a plurality of parts, the pressure is guided to the first spring 15 and the second spring 17 through the component force transmission pressure of the bidirectional transmission push rod 16 and the displacement force-unloading push rod 18 to form the separation of stress, the good stress support is finished, the part is prevented from losing the support stress and shaking collision in the drying process, and the output threaded rod 6 is driven to rotate by the long shaft motor 5, the torque is transmitted and transmitted to the transmission connecting guide block 9 by the matching of the output threaded rod 6 and the transmission connecting guide block 9, the torque is limited to form a guiding driving force by the matching of the matching sliding block 8 and the matching guiding sliding rail 3, the air-dried self-transferring material carrying frame structure 11 is conducted and displaced by the guiding driving force to complete automatic feeding and material taking, the parts taken out after drying are positioned at the bottom end of the quick liquid-remained-free cooling structure 33, good wind power output is formed by the rotation of the wind power fan 32 at the moment, when wind power passes through the circulating water cooling pipe 31, the cooling water in the water storage tank 25 is pumped out and circulated through the liquid pump 29 in the circulating water cooling pipe 31, the liquid pump 29 is used for continuously increasing the pressure in the circulating process to complete circulation, the water storage tanks 25 at two ends are connected through the circulating water pipe 26 to avoid one-way water shortage, the heat in the wind power passing through the circulating water cooling pipe 31 is conducted into the cooling water by the, the temperature of wind power is reduced, so that good low-temperature wind power cooling is achieved, in order to ensure the continuous low temperature of cooling water, the low temperature is generated through the semiconductor refrigeration sheet 27 and is transmitted into the water through the sheet-shaped cold guide block 28, and the continuous cooling is completed.
Example two:
the first step is that: clamping and positioning are completed by placing and stably adapting the semiconductor part to the top end of the clamping structure 10 by setting the temperature of the drying air box 1 to ninety-five ℃;
secondly, the following steps: the formation of the derivation force is completed by controlling the positioning support 4, and the feeding pushing of the whole air-dried self-transferring material carrying frame structure 11 is completed by matching with the guide slide rail 3, so that the parts enter the interior of the extension carrying pipe 2 and are dried to remove moisture;
the third step is: after moisture is removed, a reverse driving force is completed by controlling the positioning support 4, the return driving of the air-dried self-transferring material carrying frame structure 11 is completed by matching with the guide slide rail 3, and the air-dried self-transferring material carrying frame structure 11 is taken out to be positioned at the bottom of the rapid liquid-remaining-free cooling structure 33 by the extending carrying pipe 2;
the fourth step: the rapid liquid-cooling-free structure 33 forms composite rapid wind cooling to complete the temperature reduction of the parts, thereby achieving rapid cooling and facilitating subsequent continuous processing.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The utility model provides a semiconductor parts equipment packing plant, includes drying bellows (1), its characterized in that: an extension carrying pipe (2) is welded at one end of the drying air box (1), a positioning support (4) is fixed at the bottom end inside the extension carrying pipe (2), two matching guide sliding rails (3) are fixed at the bottom end inside the extension carrying pipe (2), the two matching guide sliding rails (3) are respectively located on two sides of the positioning support (4), a long shaft motor (5) is fixed at one end of the positioning support (4) through a screw, an output end of the long shaft motor (5) is rotatably connected with an output threaded rod (6), the top ends of the output threaded rod (6) and the long shaft motor (5) are movably connected with an air-drying self-transferring material carrying frame structure (11), and a quick liquid cooling structure (33) without liquid remaining is fixed at the top end of the extension carrying pipe (2);
the air-drying self-transferring material carrying frame structure (11) comprises a frame main body (7), two matched sliding blocks (8), a transmission connecting guide block (9) and stable adaptive clamping structures (10), wherein two sides of the bottom end of the frame main body (7) are welded with the matched sliding blocks (8), the bottom end of the frame main body (7) is also welded with the transmission connecting guide block (9), the transmission connecting guide block (9) is positioned between the two matched sliding blocks (8), and a plurality of stable adaptive clamping structures (10) are fixed inside the frame main body (7);
the stable adaptive clamping structure (10) comprises a positioning bottom plate (12), an assembling frame (13), a limiting inner assembling shell (14), a first spring (15), a bidirectional transmission push rod (16), a second spring (17), a displacement force-unloading push rod (18), a contact assembling plate (19), an adaptive limiting block (20), a clamping frame (21), a stroke limiting spring (22) and a contact roller (23), wherein the top end of the positioning bottom plate (12) is welded with the limiting inner assembling shell (14) and the assembling frame (13), the limiting inner assembling shell (14) is positioned inside the assembling frame (13), the inner side of the assembling frame (13) is welded with the first spring (15), the bottom end of the first spring (15) is completely attached to the bottom end of the bidirectional transmission push rod (16), and the bottom end of the bidirectional transmission push rod (16) is welded with the contact assembling plate (19), four end angles at the bottom of the contact loading plate (19) are all in welded connection with a displacement force-unloading push rod (18), the displacement force-unloading push rod (18) is in sliding connection with a loading frame (13), the bottom end of the displacement force-unloading push rod (18) is connected with a positioning bottom plate (12) through a second spring (17), adaptation limiting blocks (20) are welded on two sides of the top end of the contact loading plate (19), the inside of the adaptation limiting blocks (20) is in sliding connection with a clamping and clamping frame (21), the clamping and clamping frame (21) is connected with the clamping and clamping frame (21) through stroke limiting springs (22), and the inner side of the clamping and clamping frame (21) is fixedly connected with a plurality of contact rollers (23).
2. The semiconductor component assembly packaging apparatus of claim 1, wherein: the quick liquid-cooling-free structure (33) comprises a cooling assembly frame (24), a water storage tank (25), a water return pipe (26), a semiconductor refrigerating sheet (27), a sheet-shaped cold guide block (28), a liquid pump (29), a positioning connecting plate (30), a circulating water cooling pipe (31) and a fan (32), wherein both ends of the cooling assembly frame (24) are fixedly connected with the water storage tank (25), the water storage tank (25) is connected with the other top part between the water storage tanks (25) through the water return pipe (26), the top end inside the water storage tank (25) is fixedly connected with the semiconductor refrigerating sheet (27), the bottom end of the semiconductor refrigerating sheet (27) is connected with the sheet-shaped cold guide block (28) through temperature-sensitive glue, the bottom end of the water storage tank (25) is fixedly provided with the liquid pump (29), and one end of the liquid pump (29) is connected with the circulating water cooling pipe (31) in an inserting manner, the top of circulating water cooling pipe (31) is connected with location connecting plate (30) joint, the bottom both ends of cooling assembly jig (24) all pass through the fix with screw with wind-force fan (32).
3. The semiconductor component assembly packaging apparatus of claim 1, wherein: the assembling frame is characterized in that guide T-shaped sliding grooves are formed in two sides of the assembling frame (13), a T-shaped matching sliding block is welded at one end of the displacement unloading push rod (18), and the guide T-shaped sliding grooves are in clearance fit with the T-shaped matching sliding block.
4. The semiconductor component assembly packaging apparatus of claim 1, wherein: dovetail sliding grooves are formed in two ends inside the adaptation limiting block (20), dovetail sliding blocks are welded at the bottom ends of the clamping and clamping frames (21), and the dovetail sliding blocks are in clearance fit with the dovetail sliding grooves.
5. The semiconductor component assembly packaging apparatus of claim 1, wherein: the transmission connecting guide block (9) is internally provided with a power connecting through hole, the bottom end of the section matching sliding block (8) is provided with a displacement following groove, the displacement following groove and the matching guide sliding rail (3) are in clearance fit, and the power connecting through hole is in threaded connection with the output threaded rod (6).
6. The semiconductor component assembly packaging apparatus of claim 1, wherein: a plurality of air drying air passing holes are formed in the periphery of the frame main body (7), and the diameter of each air drying air passing hole is three centimeters.
7. The semiconductor component assembly packaging apparatus of claim 2, wherein: the bottom of location connecting plate (30) is fixed with a plurality of soft joint locking pieces, soft joint locking piece passes through the joint with circulating water cooling pipe (31) and is connected.
8. The semiconductor component assembly packaging apparatus of claim 2, wherein: the material of slice cold guide block (28) is copper, a plurality of contact surface grooves are seted up to the inside of slice cold guide block (28), the width of contact surface groove is one centimetre.
9. A method of using a semiconductor component assembling and packaging apparatus for a semiconductor component assembling and packaging apparatus according to any one of claims 1 to 8, characterized by the steps of:
s1: clamping positioning is completed by placing and stably adapting the semiconductor part to the top end of the clamping structure (10) by setting the temperature of the drying air box (1) to ninety-five ℃;
s2: the formation of the derivation force is completed by controlling the positioning support (4), and the feeding pushing of the whole air-dried self-transferring material carrying frame structure (11) is completed by matching with the guide sliding rail (3), so that the parts enter the interior of the extension carrying pipe (2) and are dried to remove moisture;
s3: after moisture is removed, a reverse driving force is completed by controlling the positioning support (4), the air-dried self-transferring material carrying frame structure (11) is reset and pushed by matching with the guide sliding rail (3), and the air-dried self-transferring material carrying frame structure (11) is taken out of the extension carrying pipe (2) to be positioned at the bottom of the rapid liquid-remaining-free cooling structure (33);
s4: composite quick wind power cooling is formed through the quick liquid-leaving-free cooling structure (33), and the temperature of parts is reduced, so that quick cooling is achieved, and subsequent continuous processing is facilitated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010751403.5A CN111854400B (en) | 2020-07-30 | 2020-07-30 | Semiconductor part assembly packaging device and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010751403.5A CN111854400B (en) | 2020-07-30 | 2020-07-30 | Semiconductor part assembly packaging device and using method thereof |
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| Publication Number | Publication Date |
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| CN111854400A true CN111854400A (en) | 2020-10-30 |
| CN111854400B CN111854400B (en) | 2021-11-19 |
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| CN202010751403.5A Active CN111854400B (en) | 2020-07-30 | 2020-07-30 | Semiconductor part assembly packaging device and using method thereof |
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| CN202734457U (en) * | 2012-06-30 | 2013-02-13 | 安徽瑞虎肥业有限公司 | Compound fertilizer drying device |
| CN107598802A (en) * | 2017-08-25 | 2018-01-19 | 北京理工大学 | A kind of flexible protective fixture for precision assembly |
| CN109848846A (en) * | 2017-11-29 | 2019-06-07 | 中国航空工业集团公司济南特种结构研究所 | A kind of mechanical self- steering quick clamping device |
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