CN218387313U - Cooling semiconductor power generation device - Google Patents
Cooling semiconductor power generation device Download PDFInfo
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- CN218387313U CN218387313U CN202222734557.0U CN202222734557U CN218387313U CN 218387313 U CN218387313 U CN 218387313U CN 202222734557 U CN202222734557 U CN 202222734557U CN 218387313 U CN218387313 U CN 218387313U
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- China
- Prior art keywords
- semiconductor power
- fixedly connected
- power generation
- plate
- adapter sleeve
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000010248 power generation Methods 0.000 title claims abstract description 43
- 238000001816 cooling Methods 0.000 title claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 230000005611 electricity Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The utility model discloses a cooling semiconductor power generation facility relates to semiconductor power generation facility technical field, including the semiconductor power generation piece, the left side fixedly connected with heating device of semiconductor power generation piece, the right side fixedly connected with heat abstractor of semiconductor power generation piece, heating device's top is provided with the raceway, the front end fixedly connected with of semiconductor power generation piece connects the electricity pin. The utility model discloses a adapter sleeve, the connecting pipe, sealed the pad, the drive ring gear, the drive wheel, the threaded rod, the thread slider, rotate the slide, mutually support between the rotation kelly, insert the connecting pipe in the adapter sleeve, seal through the extrusion to sealed pad, and can drive the drive wheel through rotating the drive ring gear and rotate, thereby make the threaded rod drive thread slider remove, and can make the rotation slide drive the rotation kelly and roll out, carry out the chucking to the connecting pipe, the effect of connecting is improved, the seepage of the liquid of avoiding, the use of device has been made things convenient for.
Description
Technical Field
The utility model relates to a semiconductor power generation facility technical field, concretely relates to cooling semiconductor power generation facility.
Background
The principle of the cooling semiconductor power generation is that electrons on a semiconductor element diffuse from high concentration to low concentration, and the diffusion rate of the electrons is in direct proportion to the temperature of a contact region, so that the electrons can be continuously diffused to generate continuous and stable electric quantity as long as the temperature difference between two metals is maintained.
The following problems exist in the prior art:
when current cooling semiconductor power generation facility is using, need connect the pipeline of carrying hot water and coolant liquid, current connected mode is mostly the bolt, and the wireless connection is relatively poor, appears the seepage of water easily to current cooling semiconductor power generation facility's electrode pin directly stretches out, can lead to appearing damaging when transporting and taking, has influenced the normal use of device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a cooling semiconductor power generation device to solve the problem of proposing among the above-mentioned background art.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
the utility model provides a cooling semiconductor power generation device, includes the semiconductor power generation piece, the left side fixedly connected with heating device of semiconductor power generation piece, the right side fixedly connected with heat abstractor of semiconductor power generation piece, heating device's top is provided with the raceway, the front end fixedly connected with of semiconductor power generation piece connects the electricity pin.
The raceway includes the adapter sleeve, adapter sleeve fixed connection is at heating device's top, the top of adapter sleeve is provided with the connecting pipe, the sealed pad of inboard fixedly connected with of adapter sleeve, the side swing joint of adapter sleeve has the drive ring gear, the inboard meshing of drive ring gear is connected with the drive wheel, drive wheel swing joint is in the inside of adapter sleeve, the top fixedly connected with threaded rod of drive wheel, the side threaded connection of threaded rod has the screw thread slider, the sliding connection has the rotation slide before the screw thread slider, the one end swing joint that rotates the slide is in the inside of adapter sleeve, the top right side fixedly connected with rotation kelly of rotation slide, the rotation kelly extends to the side of connecting pipe.
The utility model discloses technical scheme's further improvement lies in: the power connection pin comprises a connecting plate, the connecting plate is fixedly connected to the front end of the semiconductor power generation piece, a moving plate is connected to the middle of the connecting plate in a sliding mode, and cover plates are fixedly connected to two ends of the bottom of the moving plate.
By adopting the technical scheme, the connecting plate, the moving plate and the cover plate in the scheme are matched with each other, the electrode pins can be protected through the cover plate, and the damage to the pins is avoided.
The utility model discloses technical scheme's further improvement lies in: the side face of the moving plate is fixedly connected with a pull rope, the middle of the pull rope is fixedly connected with a rotating roller, the side face of the rotating roller is fixedly connected with an electrode connector, and the electrode connector is rotatably connected inside the connecting plate.
Adopt above-mentioned technical scheme, mutually support between stay cord, live-rollers, the electrode joint in this scheme to when using, conveniently stretch out the electrode joint, made things convenient for the use of device.
The utility model discloses technical scheme's further improvement lies in: the top of stay cord fixedly connected with arm-tie, arm-tie sliding connection is in the inside of connecting plate, the bottom fixedly connected with top tension spring of arm-tie.
By adopting the technical scheme, the pulling plate and the jacking spring in the scheme are matched with each other, so that the electrode joint is conveniently retracted.
The utility model discloses technical scheme's further improvement lies in: the movable plate comprises a sliding plate, the sliding plate is connected to the middle of the connecting plate in a sliding mode, clamping blocks are connected to two sides of the inside of the sliding plate in a sliding mode, and clamping springs are fixedly connected to the inner sides of the clamping blocks.
By adopting the technical scheme, the sliding plate, the clamping block and the clamping spring in the scheme are matched with each other, so that the position of the moving plate can be fixed.
The utility model discloses technical scheme's further improvement lies in: the top end of the interior of the sliding plate is movably connected with a pressing plate, the bottom end of the pressing plate is movably connected with a push rod, and one end of the push rod is movably connected with the side face of the clamping block.
By adopting the technical scheme, the pressing plate and the push rod are matched with each other, so that the movement of the moving plate can be controlled.
Owing to adopted above-mentioned technical scheme, the utility model discloses relative prior art, the technological progress who gains is:
1. the utility model provides a cooling semiconductor power generation facility, through the adapter sleeve, the connecting pipe, sealed the pad, the drive ring gear, the drive wheel, the threaded rod, the screw thread slider, the slide rotates, mutually support between the rotation kelly, insert the connecting pipe in the adapter sleeve, seal through the extrusion to sealed the pad, and can drive the drive wheel through rotating the drive ring gear and rotate, thereby make the threaded rod drive screw thread slider remove, and can make the slide drive rotation kelly of rotation rotate and roll out, carry out the chucking to the connecting pipe, the effect of connecting has been improved, the seepage of the liquid of avoiding, the use of device has been made things convenient for.
2. The utility model provides a cooling semiconductor power generation device, through the connecting plate, the movable plate, the apron, the stay cord, the live-rollers, the arm-tie, the tight spring in top, mutually support between the electrode joint, block the electrode joint through the apron, thereby can avoid the electrode joint to appear damaging, during the use, can drive the apron through the movable plate and remove, and can stimulate the live-rollers through the stay cord and rotate, thereby can make the electrode joint stretch out, the normal use of device has been guaranteed, and move the arm-tie through the tight spring top in top, it resets to have made things convenient for the electrode joint, make the use of device more convenient.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic sectional structure view of the water pipe of the present invention;
fig. 3 is a schematic view of the cross-sectional structure of the power connection pin of the present invention;
fig. 4 is a schematic sectional view of the movable plate of the present invention.
In the figure: 1. a semiconductor power generation sheet; 2. a heating device; 3. a heat sink; 4. a water delivery pipe; 41. connecting sleeves; 42. a connecting pipe; 43. a gasket; 44. a drive gear ring; 45. a drive wheel; 46. a threaded rod; 47. a threaded slider; 48. rotating the sliding plate; 49. rotating the clamping rod; 5. connecting a power pin; 51. a connecting plate; 52. moving the plate; 521. a sliding plate; 522. a clamping block; 523. a chucking spring; 524. a pressing plate; 525. a push rod; 53. a cover plate; 54. pulling a rope; 55. a rotating roller; 56. pulling a plate; 57. the spring is tightly propped; 58. and (4) electrode joints.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in fig. 1-4, the utility model provides a cooling semiconductor power generation device, including semiconductor power generation piece 1, semiconductor power generation piece 1's left side fixedly connected with heating device 2, semiconductor power generation piece 1's right side fixedly connected with heat abstractor 3, heating device 2's top is provided with raceway 4, semiconductor power generation piece 1's front end fixedly connected with connects electric pin 5, raceway 4 includes adapter sleeve 41, adapter sleeve 41 fixed connection is at heating device 2's top, adapter sleeve 41's top is provided with connecting pipe 42, adapter sleeve 41's inboard fixedly connected with seals pad 43, adapter sleeve 41's side swing joint has drive ring gear 44, the inboard meshing of drive ring gear 44 is connected with drive wheel 45, drive wheel 45 swing joint is in adapter 41's inside, the top fixedly connected with threaded rod 46 of drive wheel 45, threaded rod 46's side threaded connection has thread slider 47, thread slider 47's front side swing joint has rotation slide 48, the one end swing joint of rotation slide 48 is in adapter 41's inside, rotation slide 48's top right side fixedly connected with rotation kelly 49, rotation kelly 49 extends to the side of connecting pipe 42.
In this embodiment, foam aluminum is adopted to cool the whole shell of the semiconductor power generation device, when having a good heat preservation effect, the device is lighter in weight, and meanwhile has good strength, and is not easy to damage, and an equilateral triangle coil is further arranged inside the semiconductor power generation sheet 1, when the power is on, object gravity can be reduced, the device is lighter in weight, and more convenient to use, when the device is used, the connecting pipe 42 is inserted into the connecting sleeve 41, the sealing gasket 43 is sealed by extruding, and the driving wheel 45 can be driven to rotate by rotating the driving gear ring 44, so that the threaded rod 46 drives the threaded slider 47 to move, and the rotating sliding plate 48 can drive the rotating clamping rod 49 to rotate out, the connecting pipe 42 is clamped, the heating device 2 and the heat dissipation device 3 are convenient to connect the water pipe, then hot water and cooling liquid are respectively conveyed to the inside of the heating device 2 and the heat dissipation device 3, so as to form temperature difference on two sides of the semiconductor power generation sheet 1, so that the semiconductor hot end shows positive charge, so as to form an electric field, so that the semiconductor power generation sheet 1 can conveniently transmit electricity to the cold end through the pins 5.
Example 2
As shown in fig. 1-4, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the power connection pin 5 comprises a connection plate 51, the connection plate 51 is fixedly connected to the front end of the semiconductor power generation sheet 1, a moving plate 52 is slidably connected to the middle of the connection plate 51, cover plates 53 are fixedly connected to two ends of the bottom of the moving plate 52, a pull rope 54 is fixedly connected to the side of the moving plate 52, a rotating roller 55 is fixedly connected to the middle of the pull rope 54, an electrode connector 58 is fixedly connected to the side of the rotating roller 55, the electrode connector 58 is rotatably connected to the inside of the connection plate 51, a pull plate 56 is fixedly connected to the top of the pull rope 54, the pull plate 56 is slidably connected to the inside of the connection plate 51, and a jacking spring 57 is fixedly connected to the bottom end of the pull plate 56.
In this embodiment, block electrode joint 58 through apron 53 to can avoid electrode joint 58 to appear colliding with damaging, during the use, can drive apron 53 through movable plate 52 and remove, and can stimulate live-rollers 55 through stay cord 54 and rotate, thereby can make electrode joint 58 stretch out, guarantee the normal use of device, and push up pull plate 56 through top tension spring 57, make things convenient for electrode joint 58 to reset, make the use of device more convenient.
Example 3
As shown in fig. 1-4, on the basis of embodiment 2, the utility model provides a technical solution: preferably, the moving plate 52 includes a sliding plate 521, the sliding plate 521 is slidably connected to the middle of the connecting plate 51, two sides of the inside of the sliding plate 521 are slidably connected with a clamping block 522, a clamping spring 523 is fixedly connected to the inside of the clamping block 522, the top end of the inside of the sliding plate 521 is movably connected with a pressing plate 524, the bottom end of the pressing plate 524 is movably connected with a push rod 525, and one end of the push rod 525 is movably connected with the side surface of the clamping block 522.
In this embodiment, push up fixture block 522 through chucking spring 523 for fixture block 522 blocks into connecting plate 51's inside groove, thereby can fix the position of movable plate 52 afterwards, and press through pressing according to pressure board 524, thereby can drive push rod 525 and push back fixture block 522, made things convenient for and removed movable plate 52, later unclamped and pressed according to board 524, thereby can carry out fixed once more to movable plate 52, make the use of device more convenient.
The operation principle of the cooling semiconductor power generation device will be described in detail below.
As shown in fig. 1 to 4, when the cooling semiconductor power generation device is used, the connecting pipe 42 is inserted into the connecting sleeve 41, the driving wheel 45 can be driven to rotate by the driving toothed ring 44, so that the threaded rod 46 drives the threaded slider 47 to move, and the rotating slide plate 48 can drive the rotating clamping rod 49 to clamp the connecting pipe 42, thereby facilitating the connection of the water pipe, and then hot water and cooling liquid are respectively conveyed to the inside of the heating device 2 and the inside of the heat dissipation device 3, so that temperature difference is formed on two sides of the semiconductor power generation sheet 1, the semiconductor hot end represents positive charge, the cold end represents negative charge, so that a built-in electric field is formed, so that the semiconductor power generation sheet 1 can generate electricity, the cover plate 53 can be driven to move by the moving plate 52, the rotating roller 55 can be pulled to rotate by the pull rope 54, so that the electrode joint 58 can extend out, and the transmission of electric quantity is facilitated by the electric pin 5, so that the use of the device is more convenient.
The present invention has been described in detail with reference to the above general description, but it will be apparent to one of ordinary skill in the art that modifications and improvements can be made to the invention. Therefore, modifications or improvements without departing from the spirit of the invention are within the scope of the invention.
Claims (6)
1. The utility model provides a cooling semiconductor power generation device, includes semiconductor power generation piece (1), the left side fixedly connected with heating device (2) of semiconductor power generation piece (1), the right side fixedly connected with heat abstractor (3) of semiconductor power generation piece (1), its characterized in that: a water delivery pipe (4) is arranged at the top of the heating device (2), and the front end of the semiconductor power generation sheet (1) is fixedly connected with a power connection pin (5);
raceway (4) are including adapter sleeve (41), adapter sleeve (41) fixed connection is at the top of heating device (2), the top of adapter sleeve (41) is provided with connecting pipe (42), the sealed pad (43) of inboard fixedly connected with of adapter sleeve (41), the side swing joint of adapter sleeve (41) has drive ring gear (44), the inboard meshing of drive ring gear (44) is connected with drive wheel (45), drive wheel (45) swing joint is in the inside of adapter sleeve (41), the top fixedly connected with threaded rod (46) of drive wheel (45), the side threaded connection of threaded rod (46) has screw thread slider (47), the preceding side sliding connection of screw thread slider (47) has rotation slide (48), the one end swing joint that rotates slide (48) is in the inside of adapter sleeve (41), the top right side fixedly connected with of rotation slide (48) rotates kelly (49), rotation kelly (49) extend to the side of connecting pipe (42).
2. A cooled semiconductor power plant according to claim 1, characterised in that: connect electric pin (5) including connecting plate (51), connecting plate (51) fixed connection is at the front end of semiconductor power generation piece (1), the middle part sliding connection of connecting plate (51) has movable plate (52), the bottom both ends fixedly connected with apron (53) of movable plate (52).
3. A cooled semiconductor power plant according to claim 2, characterized in that: the side surface of the moving plate (52) is fixedly connected with a pull rope (54), the middle part of the pull rope (54) is fixedly connected with a rotating roller (55), the side surface of the rotating roller (55) is fixedly connected with an electrode joint (58), and the electrode joint (58) is rotatably connected inside the connecting plate (51).
4. A cooled semiconductor power plant according to claim 3, characterized in that: the top of the pull rope (54) is fixedly connected with a pull plate (56), the pull plate (56) is connected inside the connecting plate (51) in a sliding mode, and the bottom end of the pull plate (56) is fixedly connected with a jacking spring (57).
5. A cooled semiconductor power plant according to claim 2, characterized in that: the moving plate (52) comprises a sliding plate (521), the sliding plate (521) is connected to the middle of the connecting plate (51) in a sliding mode, clamping blocks (522) are connected to two sides of the inside of the sliding plate (521) in a sliding mode, and clamping springs (523) are fixedly connected to the inner sides of the clamping blocks (522).
6. A cooled semiconductor power plant according to claim 5, characterized in that: the top end of the interior of the sliding plate (521) is movably connected with a pressing plate (524), the bottom end of the pressing plate (524) is movably connected with a push rod (525), and one end of the push rod (525) is movably connected with the side surface of the clamping block (522).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222734557.0U CN218387313U (en) | 2022-10-17 | 2022-10-17 | Cooling semiconductor power generation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222734557.0U CN218387313U (en) | 2022-10-17 | 2022-10-17 | Cooling semiconductor power generation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218387313U true CN218387313U (en) | 2023-01-24 |
Family
ID=84930626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222734557.0U Expired - Fee Related CN218387313U (en) | 2022-10-17 | 2022-10-17 | Cooling semiconductor power generation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218387313U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117229076A (en) * | 2023-09-22 | 2023-12-15 | 江苏中研宜普科技有限公司 | SiC refractory material for incinerator and application method thereof |
-
2022
- 2022-10-17 CN CN202222734557.0U patent/CN218387313U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117229076A (en) * | 2023-09-22 | 2023-12-15 | 江苏中研宜普科技有限公司 | SiC refractory material for incinerator and application method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230124 |
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| CF01 | Termination of patent right due to non-payment of annual fee |