CN111843804A - Polishing device - Google Patents
Polishing device Download PDFInfo
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- CN111843804A CN111843804A CN202010820110.8A CN202010820110A CN111843804A CN 111843804 A CN111843804 A CN 111843804A CN 202010820110 A CN202010820110 A CN 202010820110A CN 111843804 A CN111843804 A CN 111843804A
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- Prior art keywords
- polishing
- fixed shaft
- groove
- bottom wall
- shaped groove
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- 238000005498 polishing Methods 0.000 title claims abstract description 224
- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 239000004744 fabric Substances 0.000 claims description 46
- 238000007664 blowing Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 5
- 210000001503 joint Anatomy 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a polishing device, which comprises a fixed shaft and a polishing component, wherein the fixed shaft is arranged on a mounting seat and is used for sleeving and fixing a wire guide wheel; the polishing member has a circular arc-shaped polishing portion; the polishing part faces the fixed shaft; the polishing part is driven by a driving force to move so as to drive the polishing part to be suitable for being embedded into or withdrawn from the V-shaped groove of the wire guide wheel, and the peripheral wall of the polishing part is suitable for being in tangential contact with the groove bottom wall of the V-shaped groove when the polishing part is embedded into the groove; one of the fixed shaft and the polishing member is driven by the drive mechanism to be rotatable relative to the other about the axis of the fixed shaft. Because the groove bottom wall of the groove is distributed on one circumferential surface in a circle, the peripheral wall of the polishing part can be in tangent abutting joint with the groove bottom wall, one of the fixed shaft and the polishing part rotates in a circle, the peripheral wall of the polishing part can be in tangent abutting joint with the wall of the groove bottom wall in a circle, so that the groove bottom wall of the groove can be uniformly polished in a circle, burrs are hardly arranged on the groove bottom wall of the groove, and the surface of the silk thread can not be scratched when the silk thread is conveyed.
Description
Technical Field
The invention belongs to the technical field of machining, and particularly relates to a polishing device.
Background
The bonding wire is one of five important structural materials of semiconductor packaging, along with the change of electronic technology in recent years, the continuous updating and upgrading of products such as intelligent household appliances, digital products, automobiles and the like promote the continuous expansion of the whole scale of the semiconductor packaging industry, the requirement on packaging materials is higher and higher, the surface of the bonding wire is required to be free from scratches, and the required smoothness is maintained.
In the production process of the bonding wire, particularly in the drawing process of the bonding wire, the bonding wire is embedded in the V-shaped groove of the wire passing guide wheel, and the bonding wire is continuously conveyed forwards through the driving force; meanwhile, in the conveying process, the bonding wire passes through the drawing die to thin the diameter of the bonding wire. In order to form a smooth surface of the bonding wire in the drawing process, in the prior art, an inverted V-shaped cutter is required to finish the wall surface of a V-shaped groove of the wire guide wheel, then the groove bottom wall of the V-shaped groove is required to be polished, so that burrs are prevented from being formed on the groove bottom wall of the V-shaped groove, and if the burrs are formed on the groove bottom wall of the V-shaped groove, the burrs can scratch the surface of the bonding wire in the drawing process of the bonding wire, so that the surface of the bonding wire is not smooth, and the yield of the bonding wire is low.
In the prior art, the polishing treatment of the groove bottom wall of the V-shaped groove of the wire guide wheel is usually performed by manually wiping and polishing the groove bottom wall of the V-shaped groove with an operator holding a grinding wheel, a cloth wheel or a sand belt, and manually polishing the groove bottom wall of the V-shaped groove, which causes the poor quality of the polished groove bottom of the V-shaped groove and the low polishing efficiency of the groove bottom of the V-shaped groove due to inconsistent polishing degrees at different positions of the groove bottom wall of the V-shaped groove.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is that the polishing of the existing wire guide wheel is polished by manually wiping, so that the defects of poor polishing quality and low efficiency are caused.
To this end, the invention provides a polishing apparatus comprising
The fixed shaft is arranged on the mounting seat and is used for sleeving and fixing the wire guide wheel;
a polishing member provided on the mounting base and having at least an arc-shaped polishing portion; the polishing part faces the fixed shaft;
the polishing part is driven by a driving force to move so as to drive the polishing part to be suitable for being embedded into or withdrawn from the V-shaped groove of the wire guide wheel, and the outer peripheral wall of the polishing part is suitable for being in tangential butt joint with the circumferential surface of a circle of the groove bottom wall of the V-shaped groove when the polishing part is embedded into the V-shaped groove;
one of the fixed shaft and the polishing member is driven by a drive mechanism to be rotatable relative to the other about an axis of the fixed shaft.
Optionally, in the polishing apparatus described above, the polishing member further has a mounting portion connected to the polishing portion; the polishing component is arranged on the mounting seat through the mounting part; the mounting portion and the polishing portion form a closed ring.
Optionally, in the polishing apparatus above, the closed ring is a circular ring.
Optionally, in the polishing apparatus described above, the polishing member further has a polishing cloth wrapped at least around the outer periphery of the closed ring; and at least one fixing member detachably fixing the polishing cloth to the mounting portion.
Optionally, in the polishing apparatus described above, the polishing cloth further covers the inner cavity of the closed ring.
Optionally, in the polishing apparatus described above, the closed ring is made of a metal material.
Optionally, in the polishing apparatus described above, the polishing apparatus further includes a transfer mechanism disposed on the mounting base; the transfer mechanism comprises a first sliding assembly, and the polishing part is fixed on the first sliding assembly and driven by the first sliding assembly to do reciprocating linear sliding embedded in or withdrawn from the V-shaped groove along the direction perpendicular to the axial direction of the fixed shaft.
Optionally, in the polishing apparatus described above, the transfer mechanism further includes a second sliding assembly disposed on the mounting seat; the first sliding component is fixed on the second sliding component and driven by the second sliding component to slide linearly in a reciprocating manner along the axis of the fixed shaft.
Optionally, in the polishing apparatus described above, the polishing apparatus further includes a blowing mechanism disposed on the first sliding assembly, and the blowing mechanism is configured to blow gas toward the fixed shaft; the blowing mechanism and the polishing component are arranged at intervals along the axial direction of the fixed shaft; and/or
The polishing device also comprises a supply mechanism arranged on the first sliding component or the mounting seat, and the supply mechanism is used for supplying polishing liquid to at least the polishing cloth of the polishing part.
Optionally, in the polishing apparatus described above, the polishing apparatus further includes an image magnifier provided on the first sliding member, the image magnifier being located above the polishing portion, for observing the groove bottom wall of the V-shaped groove.
The technical scheme of the invention has the following advantages:
1. the polishing device comprises a fixed shaft and a polishing component, wherein the fixed shaft is arranged on the mounting seat and is used for sleeving and fixing the wire guide wheel; the polishing component is arranged on the mounting seat and at least provided with an arc-shaped polishing part; the polishing part faces the fixed shaft; the polishing part is driven by a driving force to move so as to drive the polishing part to be suitable for being embedded into or withdrawn from the V-shaped groove of the wire guide wheel, and the peripheral wall of the polishing part is suitable for being in tangential butt joint with the circumferential surface where one circle of the groove bottom wall of the V-shaped groove is located when the polishing part is embedded into the groove; one of the fixed shaft and the polishing member is driven by a drive mechanism to be rotatable relative to the other about an axis of the fixed shaft.
The polishing device with the structure can sleeve and detachably arrange the wire guide wheel on the fixed shaft when polishing a circle of the bottom wall of the V-shaped groove of the wire guide wheel; the polishing part moves under the action of a driving force to drive the polishing part to be embedded into the V-shaped groove of the wire guide wheel, the peripheral wall of the polishing part is in tangential butt joint with the circumferential surface of a circle of the bottom wall of the V-shaped groove, the driving mechanism drives the fixed shaft to rotate so as to drive the wire guide wheel to rotate, or the driving mechanism drives the polishing part to rotate around the axis of the fixed shaft, the peripheral wall of the polishing part is always in tangential butt joint with the bottom wall of the groove, when the driving mechanism rotates for a circle, the polishing part polishes the bottom wall of the groove for a circle once, and the polishing is repeated for multiple times, so that the circle of the bottom wall of the groove of the wire guide wheel can be uniformly polished, burrs hardly exist on the bottom wall of the groove, and when the wire is conveyed by adopting the wire guide wheel, the surface of the wire.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic front side view of a polishing apparatus provided in embodiment 1 of the present invention;
fig. 2 is a schematic top view of a polishing apparatus provided in embodiment 1 of the present invention;
FIG. 3 is a schematic view of the polishing elements of the polishing apparatus of FIG. 1 engaged with the bottom wall of the V-groove;
description of reference numerals:
1-mounting a base; 2-a rotating electrical machine; 3-speed regulating switch; 4, fixing a shaft; 5, bearing seats; 6-an image amplifier; 7-a supply mechanism; 8-a polishing member; 81-polishing part; 82-a mounting portion; 83-polishing cloth; 9-a transfer mechanism; 10-a blowing mechanism; 11-a controller; 12-a wire guide wheel; 13-V-shaped groove.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
The present embodiment provides a polishing apparatus, as shown in fig. 1 to 3, which includes a mount 1, a fixed shaft 4, a polishing member 8, and a transfer mechanism 9.
As shown in fig. 1, the fixed shaft 4 is rotatably disposed on the mounting base 1, for example, in fig. 1, a bearing seat 5 is disposed on the left and right sides of the mounting base 1, and two ends of the fixed shaft 4 are respectively mounted on one bearing seat 5 through a bearing; the fixed shaft 4 is driven by a driving mechanism to rotate on the mounting base 1, for example, the driving mechanism is a rotating motor 2, the rotating motor 2 is arranged on the mounting base 1, an output rotating shaft of the rotating motor 2 is connected with one end of the fixed shaft 4 through a coupler, and therefore the rotating motor 2 rotates to drive the fixed shaft 4 to rotate.
Optionally, when the rotating electrical machine 2 is a dc electrical machine, the driving mechanism further includes a frequency converter connected to the dc electrical machine for adjusting the rotating speed of the dc electrical machine, for example, a speed regulating switch 3 is disposed on the frequency converter, and the rotating speed of the dc electrical machine is adjusted by rotating the speed regulating switch 3. As a variant, it is also possible to use a variable frequency motor directly.
As shown in fig. 3, the polishing member 8 has a circular arc-shaped polishing portion 81 and a mounting portion 82, the mounting portion 82 is connected to the polishing portion 81 to enclose a closed ring, and the polishing portion 81 faces the fixed shaft 4; the polishing part 8 is driven by the transfer mechanism 9 to move so as to drive the polishing part 81 to be embedded into or withdrawn from the V-shaped groove 13 of the wire guide wheel 12, and the outer peripheral wall of the polishing part 81 is in tangential contact with the circumferential surface of one circle of the bottom wall of the V-shaped groove when the polishing part is embedded into the groove.
Because the peripheral wall of the polishing part 81 can be in tangential butt joint with the circumferential surface where one circle of the groove bottom wall of the V-shaped groove 13 is located, and one circle of the groove bottom wall of the V-shaped groove is a circumferential surface, when the fixed shaft 4 drives the wire passing guide wheel 12 installed on the fixed shaft to synchronously rotate for one circle, one circle of the circumferential surface of the groove bottom wall of the V-shaped groove 13 can be in tangential butt joint with the peripheral wall of the polishing part 81, and the polishing part 81 polishes one circle of the groove bottom wall of the V-shaped groove; the fixed shaft 4 drives the thread guide wheel 12 to rotate for a plurality of times, and the polishing part 81 can polish one circle of the bottom wall of the groove for a plurality of times, so that one circle of the bottom wall of the groove is uniformly polished, burrs are hardly formed on the circumferential surface of the one circle of the bottom wall of the groove, the polishing quality is improved, the surface of the silk thread is not scratched when the thread guide wheel 12 is adopted to convey the silk thread, the smoothness of the surface of the silk thread is ensured, and the yield of the silk thread is improved.
Meanwhile, in the polishing process of the groove bottom wall of the V-shaped groove 13, the position of the polishing part 8 is changed through the transfer mechanism 9, so that the polishing part 81 is embedded into the V-shaped groove 13, and the peripheral wall of the polishing part 81 is in tangential contact with the groove bottom wall of the V-shaped groove 13; then the fixed shaft 4 is driven to rotate by the driving mechanism, and the polishing part 8 is kept still, so that automatic polishing is realized, and the polishing efficiency is further improved. Most preferably, the width of the peripheral wall of the polishing section coincides with the width of the groove bottom wall of the V-shaped groove.
The polishing member 8 is provided on the transfer mechanism 9 through the mounting portion 82; the mounting portion 82 and the polishing portion 81 form a closed ring, such as an elliptical ring, and most preferably, the closed ring is a circular ring, which facilitates the machining and mounting of the polishing member 8.
The polishing member 8 further has a polishing cloth 83 which is wrapped around the outer periphery of the closed ring and covers the inner cavity of the closed ring; and at least one fixing member (not shown) for detachably fixing the polishing cloth 83 to the mounting portion 82. Optionally, the polishing cloth 83 is a dust-free cloth, or other wiping cloth.
For example, the fixing component is a clamp, and the dust-free cloth is detachably clamped on the mounting portion 82, or the fixing component can also be a clamp, and the dust-free cloth is detachably clamped on the mounting portion 82, so that the polishing component 8 forms a structure similar to a round fan, the round ring is exposed by the fan cloth of the existing round fan, and the fan cloth is only filled in the inner cavity of the closed ring, but the dust-free cloth of the polishing component 8 in the embodiment not only covers the inner cavity of the closed ring, but also needs to wrap the periphery of the closed ring, and the dust-free cloth on the periphery of the closed ring is directly contacted with the groove bottom of the V-shaped groove 13 to polish the groove bottom wall.
Certainly, the dust-free cloth can be double-sided or single-sided in the inner cavity of the closed ring; if the two sides are double sides, the dust-free cloth is wholly sleeved outside the closed ring; if the single-side dust-free cloth is used, one end of the dust-free cloth needs to be sleeved on the periphery of the closed ring, a reserved part is preferably reserved at the installation part 82, the reserved part is not sleeved with the dust-free cloth and is used for installing the fixing component, and the other end of the dust-free cloth covers the inner cavity of the closed ring and extends towards the reserved part and is fixed on the reserved part of the installation part 82 through the fixing component.
After the dust-free cloth at the polishing part 81 is used for a period of time, the dust-free cloth at the polishing part 81 is worn, and when the dust-free cloth needs to be replaced, the fixing component can be opened, the dust-free cloth on the closed ring is rotated, so that the dust-free cloth which is not worn is rotated to the polishing part 81, and the dust-free cloth is fixed on the mounting part 82 by the fixing component, so that the dust-free cloth can be reused, and the cost of the polishing device is reduced.
Optionally, the above-mentioned closed ring is made of metal material, such as aluminum, copper, iron, etc., and most preferably, the closed ring is made of elastic metal material, such as: the elastic metal material is stainless steel, tungsten and molybdenum, etc., the closed ring has certain elasticity, when the polishing part 81 is abutted against the bottom wall of the groove, and the closed ring is abutted against the bottom wall of the groove for polishing, a small amount of deformation is provided, the concentrated stress applied to the polishing part 81 is buffered, and the closed ring is prevented from being broken due to overlarge stress concentration applied to the polishing part 81. It should be noted that: the elastic metal wire has a certain deformation, and has a small deformation on the basis of polishing to play a role in buffering. Of course, the non-elastic hard metal can be directly used, and even if the metal wire at the polishing part is subjected to concentrated stress, the metal wire can be slightly bent towards the inner cavity of the closed ring and can play a role in less buffer action due to the inner cavity of the closed ring.
The transfer mechanism 9 includes a first slide assembly to which the polishing member 8 is fixed and which is driven by the first slide assembly to make reciprocating linear sliding movement in a direction perpendicular to the axial direction of the fixed shaft 4 so as to be inserted into or withdrawn from the groove.
Optionally, the polishing member 8 further comprises a support provided on the mounting portion 82 and located outside the closed ring, the polishing member 8 being mounted on the first slide assembly by the support.
For example, the first sliding member has a screw structure, the sliding direction of the first sliding member in fig. 1 and 2 is the front-back direction, i.e., the inner-outer direction of the paper, and the axial direction of the fixed shaft 4 is the left-right direction, so that the position of the polishing member 8 is changed by the reciprocating linear sliding of the first sliding member, the polishing portion 81 of the polishing member 8 is embedded in the V-shaped groove, and the outer peripheral wall of the polishing portion 81 abuts against the bottom wall of the groove; or exit from the V-groove. That is, the polishing member 8 is located on the front or rear side of the fixed shaft 4.
Preferably, the transfer mechanism 9 further comprises a second sliding assembly, and the first sliding assembly is fixed on the second sliding assembly and driven by the second sliding assembly to perform reciprocating linear sliding along the axial direction of the fixed shaft 4.
For example, the second sliding assembly is also in a screw structure, and the sliding direction of the second sliding assembly in fig. 1 and 2 is the left-right direction, so that the transfer mechanism 9 forms a cross sliding table structure; after the polishing part 81 of the polishing component 8 driven by the first sliding component exits from the V-shaped groove, the axial position of the polishing component 8 on the fixing shaft 4 is changed by the sliding of the second sliding component, so that the groove bottom wall of the V-shaped groove of the wire guide wheel 12 sleeved at different positions on the fixing shaft 4 is polished, and the polishing efficiency is further improved.
Each lead screw structure comprises a lead screw, a lead screw nut matched on the lead screw and a driving motor fixedly connected with the lead screw, the driving motor drives the lead screw to rotate, and the lead screw nut slides in the length direction of the lead screw.
As shown in fig. 1 and 2, the polishing apparatus further includes a blowing mechanism 10 provided on the first slide assembly, the blowing mechanism 10 being configured to blow gas toward the fixed shaft 4; the air blowing mechanism 10 and the polishing component 8 are arranged at intervals along the axial direction of the fixed shaft 4, and the air blown out by the air blowing mechanism 10 blows off the particles or dust falling off on the groove bottom wall of the polished V-shaped groove 13, so that the groove bottom wall of the polished V-shaped groove is further ensured not to have impurities left.
Optionally, the gas blown out by the gas blowing mechanism 10 is plasma gas, which plays a role of electrostatic dust removal, and further improves the polishing effect. The air blowing mechanism 10 may be a fan, or an air conditioner, a plasma device, or the like.
As shown in fig. 1, the polishing apparatus further includes a supply mechanism 7 disposed on the first sliding assembly or the mounting base, wherein the supply mechanism 7 is configured to supply a polishing liquid to at least the polishing cloth 83, so that the polishing liquid is contained in the dust-free cloth, and the damping friction force of the dust-free cloth is increased, so that the dust-free cloth can better rub against the bottom wall of the V-shaped groove, thereby improving the polishing effect.
As shown in fig. 2, the polishing apparatus further includes an image intensifier 6 provided on the first slide assembly, the image intensifier 6 being located above the polishing section 81 for observing the groove bottom wall of the V-groove. For example, the image amplifier 6 is a magnifying glass, and the magnifying glass facilitates online observation of the polishing condition of the polishing part 81 on the groove bottom wall of the V-shaped groove at any time, facilitates online timely correction of a bad polishing phenomenon, and improves the yield of the polished wire passing guide wheel 12. The magnifier is moved synchronously with the polishing member 8 and the air blowing mechanism 10 driven by the transfer mechanism 9, and preferably, as shown in fig. 2, the polishing member 8 and the air blowing mechanism 10 are located on the same side of the fixed shaft 4, and the magnifier is located on the other side of the fixed shaft 4.
Preferably, the first sliding assembly is provided with a mounting frame, the mounting frame is bent and suspended above the fixed shaft 4, and the magnifier is arranged on the mounting frame.
In addition, a controller 11 is further disposed on the mounting base 1, the controller 11 is electrically connected to both the driving motor of the screw structure of the transfer mechanism 9 and the rotating motor 2 of the driving mechanism, and the controller 11 is used for controlling the moving stroke of the transfer mechanism 9 and also for controlling the rotation of the rotating motor 2.
The working process of the polishing device of this embodiment in polishing the wire guide wheel 12 is as follows:
firstly, one end of a fixed shaft 4 is detached from a bearing seat 5, a plurality of wire passing guide wheels 12 are sleeved and fixed on the fixed shaft 4 in a series connection mode, and the adjacent two wire passing guide wheels 12 are arranged at intervals; thereafter, the end of the fixed shaft 4 is mounted on the corresponding bearing housing 5.
Secondly, the controller 11 starts the driving motor of the transfer mechanism to act, the transfer mechanism drives the polishing component 8 to move in the front-back direction and the left-right direction in fig. 1 so as to adjust the position of the polishing component 8 until the polishing part 81 is embedded into a V-shaped groove of one wire guide wheel 12, the peripheral wall of the polishing part 81 is in contact with the groove bottom wall of the groove in a tangent mode, and the controller 11 controls the transfer mechanism to stop acting.
Thirdly, the controller 11 controls the rotation of the rotating motor 2, the rotating speed of the rotating motor 2 is adjusted through a frequency converter, then the rotating motor 2 drives the fixed shaft 4 to rotate, and one circle of groove bottom wall of the V-shaped groove 13 on the wire guide wheel 12 is rubbed and polished by the dust-free cloth of the polished part 81 every time the wire guide wheel 12 rotates one circle; polishing the groove bottom wall of the groove for a plurality of times in a circle by rotating the fixed shaft 4 for a plurality of circles; after the wire guide wheel 12 is polished; transferring mechanism 9 moves again to withdraw polishing portion 81 from V-shaped groove of wire guide wheel 12, for example, in the front-back direction in fig. 1; then moving in the left-right direction in fig. 1, changing the position of the polishing part 8, so that the polishing part 81 is positioned at the V-shaped groove of the next wire guide wheel 12;
for example, if the previous wire guide wheel 12 is on the right side in fig. 1 and the next wire guide wheel 12 is on the left side in fig. 1, the transfer mechanism drives the polishing member to move toward the front side, withdraw from the V-shaped groove of the previous wire guide wheel, and move toward the left side, the polishing member is driven to face the V-shaped groove of the next wire guide wheel, and then the polishing member is driven to move toward the rear side until the outer peripheral wall of the polishing part is in tangential contact with the bottom wall of the V-shaped groove of the next wire guide wheel, at this time, the blowing mechanism 10 just faces the notch of the polished V-shaped groove of the previous wire guide wheel 12; the controller 11 controls the air blowing mechanism 10 to start air blowing, and air blown by the air blowing mechanism 10 sweeps dust falling from the bottom wall of the polished groove; by analogy, the groove bottom walls of the V-shaped grooves 13 of the wire guide wheels 12 on the fixed shaft 4 are polished;
in the polishing process, the magnifier and the polishing part 8 move synchronously, the magnifier is positioned right above the line guide wheel 12, which is polished by the polishing part 8, and the polishing quality of the groove bottom wall of the V-shaped groove being polished is observed on line, so that the bad polishing phenomenon can be corrected in time.
Fourthly, after the groove bottom walls of the V-shaped grooves of all the wire guide wheels 12 on the fixed shaft 4 are polished for one circle, detaching one end of the fixed shaft 4 from the bearing seat 5, and taking down all the polished wire guide wheels 12 from the fixed shaft 4;
if the wire guide wheels 12 with different diameters are polished, the fixing shafts 4 with different diameters can be replaced, bearings with different inner holes can be correspondingly replaced, and the fixing shafts 4 are installed on the installation seat 1, so that the groove bottom walls of the V-shaped grooves of the wire guide wheels 12 with different diameters can be polished.
As a modified embodiment, the above-mentioned transfer mechanism 9 may also be in other structures, for example, a screw structure is replaced by a telescopic cylinder, or a gear and rack meshing structure; or a structure that the sliding block is matched with the guide rail.
As a modified embodiment, the polishing cloth 83 may be wrapped only around the outer circumference of the closed ring, not covering the inner cavity of the closed ring, and the above-described rubbing polishing function may be achieved.
As a further modified embodiment, the polishing member 8 may be provided with no mounting portion 82, and include only the circular arc polishing portion 81, and the polishing cloth 83 may be wrapped around the outer periphery of the polishing portion 81, or the polishing member may be provided with no polishing cloth 83, and the outer peripheral wall of the polishing portion 81 may be in direct contact with the groove bottom wall of the V-shaped groove to perform polishing.
As a modified embodiment of the above embodiment, the driving mechanism may not drive the fixed shaft 4 to rotate, but drive the polishing component 8 to rotate around the axis of the fixed shaft 4, at this time, the wire guide wheel 12 is sleeved on the fixed shaft 4, and during the polishing process, the wire guide wheel 12 remains stationary; the polishing part 81 rotates around the axis of the rotating shaft, so that the polishing part 81 is abutted and rotated on one circle of the groove bottom wall of the groove, and polishing treatment is carried out on the wire guide wheel 12.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. A polishing apparatus, characterized by comprising
The fixed shaft (4) is arranged on the mounting seat (1) and is used for sleeving and fixing the wire guide wheel (12);
a polishing member (8) provided on the mounting base (1) and having at least an arc-shaped polishing section (81); the polishing part (81) faces the fixed shaft (4);
the polishing part (8) is driven by a driving force to move so as to drive the polishing part (81) to be suitable for being embedded into or withdrawn from the V-shaped groove of the wire guide wheel (12), and the outer peripheral wall of the polishing part (81) is suitable for being in tangential contact with the circumferential surface of one circle of the bottom wall of the V-shaped groove when being embedded into the V-shaped groove;
one of the fixed shaft (4) and the polishing member (8) is rotatable relative to the other about the axis of the fixed shaft (4) by a drive mechanism.
2. A polishing apparatus according to claim 1, wherein said polishing member (8) further has a mounting portion (82) connected to a polishing portion (81); the polishing component (8) is arranged on the mounting seat (1) through the mounting part (82); the mounting portion (82) and the polishing portion (81) form a closed ring.
3. A polishing system according to claim 2 in which the closed ring is a circular ring.
4. A polishing device according to claim 2 or 3, characterized in that the polishing member (8) further has a polishing cloth (83) wrapped around at least the outer periphery of the closed ring; and at least one fixing member for detachably fixing the polishing cloth (83) to the mounting portion (82).
5. A polishing device as set forth in claim 4 characterized in that the polishing cloth (83) also covers the inner cavity of the closed ring.
6. A polishing system according to claim 4 or 5 in which the closure ring is of a metallic material.
7. A polishing device according to any one of claims 1-6, characterized in that it further comprises a transfer mechanism provided on the mount (1); the transfer mechanism comprises a first sliding assembly, and the polishing part (8) is fixed on the first sliding assembly and driven by the first sliding assembly to do reciprocating linear sliding which is embedded in or withdrawn from the V-shaped groove along the direction perpendicular to the axial direction of the fixed shaft (4).
8. A polishing device according to claim 7, characterized in that the transfer mechanism (9) further comprises a second slide assembly provided on the mounting base (1); the first sliding component is fixed on the second sliding component and is driven by the second sliding component to slide linearly in a reciprocating manner along the axis of the fixed shaft (4).
9. The polishing apparatus according to claim 7 or 8, further comprising an air blowing mechanism (10) provided on the first slide assembly, the air blowing mechanism (10) being configured to blow air toward the fixed shaft (4); the blowing mechanism (10) and the polishing component (8) are arranged at intervals along the axial direction of the fixed shaft (4); and/or
The polishing device also comprises a supply mechanism (7) arranged on the first sliding component or the mounting seat, wherein the supply mechanism (7) is used for supplying polishing liquid to at least a polishing cloth (83) of the polishing part.
10. A polishing apparatus according to any one of claims 7-9, characterized by further comprising an image magnifier (6) provided on said first slide assembly, said image magnifier (6) being positioned above said polishing section (81) for observing the bottom wall of said V-groove.
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CN202010820110.8A CN111843804A (en) | 2020-08-14 | 2020-08-14 | Polishing device |
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CN202010820110.8A CN111843804A (en) | 2020-08-14 | 2020-08-14 | Polishing device |
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Cited By (1)
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CN115106870A (en) * | 2022-07-07 | 2022-09-27 | 北京特思迪半导体设备有限公司 | Double-sided polishing machine and liquid discharge tank thereof |
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CN115106870B (en) * | 2022-07-07 | 2024-04-09 | 北京特思迪半导体设备有限公司 | Double-sided polishing machine and liquid discharge groove thereof |
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