CN111843188A - Semiconductor refrigeration circuit for laser handheld welding head - Google Patents
Semiconductor refrigeration circuit for laser handheld welding head Download PDFInfo
- Publication number
- CN111843188A CN111843188A CN202010748883.XA CN202010748883A CN111843188A CN 111843188 A CN111843188 A CN 111843188A CN 202010748883 A CN202010748883 A CN 202010748883A CN 111843188 A CN111843188 A CN 111843188A
- Authority
- CN
- China
- Prior art keywords
- temperature
- semiconductor refrigeration
- welding head
- switch
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0096—Portable laser equipment, e.g. hand-held laser apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the field of laser welding circuits, and particularly discloses a semiconductor refrigeration circuit for a laser handheld welding head, which comprises an external circuit and an internal refrigeration circuit arranged in the welding head, wherein the external circuit comprises a relay RLY1 and power supplies V1 and V2, and the internal refrigeration circuit comprises a high-temperature-domain temperature switch J1, a low-temperature-domain temperature switch J2 and a semiconductor refrigeration device U1; the first end of the high-temperature-domain temperature switch J1 is grounded, the second end of the high-temperature-domain temperature switch J1 is connected to the pin 5 of the relay RLY1, the common-end pin 1 of the relay RLY1 is connected with the first end of the low-temperature-domain temperature switch J2, and the second end of the low-temperature-domain temperature switch J2 is connected to the pin 1 of the semiconductor refrigeration device U1 and provides the required driving voltage for the semiconductor refrigeration device U1. The refrigeration circuit of the invention adopts the TEC to replace a water cooling scheme, so that the design of a handheld welding head can be simplified, the weight of the handheld welding head can be reduced, and meanwhile, the temperature does not need to be accurately controlled in the handheld welding head.
Description
Technical Field
The invention relates to the field of laser welding, in particular to a semiconductor refrigeration circuit for a laser handheld welding head.
Background
With the rapid development of economic technology, the mechanical automation has also been developed at a high speed. The traditional welding machine can not meet the personalized welding requirement, needs special personnel to operate and has low efficiency, so that the laser welding head is applied. The laser welding head is a laser outer light path device. The laser is associated with the laser through an optical fiber, and is subjected to adjustment of collimation and focusing by an internal optical lens and is monitored and operated by a control system. Laser welding, as an advanced welding technology, is commonly applied to industries such as electronics and automobiles by being matched with an automatic control system.
The high-power laser inside the laser handheld welding head passes through the laser handheld welding head, so that the heating phenomenon can be caused, the welding performance is influenced, and a device is damaged, so that the welding head needs to be refrigerated. The existing laser handheld welding system uses a water cooler for refrigeration, a complex circulating water path needs to be designed on a handheld welding head, the weight and the cost of the welding head are increased, and an external water supply connecting loop can also influence the welding operation.
Disclosure of Invention
The present invention is directed to a semiconductor refrigeration circuit for a laser hand-held welding head that solves the problems set forth above in the background.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor refrigeration circuit for a laser hand-held welding head comprises an external circuit and an internal refrigeration circuit arranged in the welding head, wherein the external circuit comprises a relay RLY1 and power supplies V1 and V2, and the internal refrigeration circuit comprises a high-temperature-domain temperature switch J1, a low-temperature-domain temperature switch J2 and a semiconductor refrigeration device U1; a first end of the high-temperature-domain temperature switch J1 is grounded, a second end of the high-temperature-domain temperature switch J1 is connected to a pin 5 of a relay RLY1, a common-end pin 1 of the relay RLY1 is connected with a first end of a low-temperature-domain temperature switch J2, a second end of a low-temperature-domain temperature switch J2 is connected to a pin 1 of a semiconductor refrigeration device U1, and a driving voltage required by the semiconductor refrigeration device U1 is provided; pin 2 of the semiconductor refrigeration device U1 is grounded, a normally closed pin 4 of a relay RLY1 is connected with a power supply V2, a normally open pin 3 of the relay RLY1 is connected with a power supply V1, when the temperature detected by a low-temperature-range temperature switch J2 reaches an action temperature, the switch is closed, a low-voltage power supply V2 connected to a normally closed pin 4 of a relay RLY1 supplies power to the semiconductor refrigeration device U1, and refrigeration with low power is started.
Preferably, the high-temperature-range temperature switch J1 is a micro temperature switch and has a specific model number of TB02-KA8D, and the operating temperature of the high-temperature-range temperature switch J1 is 45 degrees.
Preferably, the semiconductor refrigeration device U1 is rated at 12V and has a maximum current no greater than 12A.
Preferably, the power supplies V1, V2 are 5V, 12V, respectively, and are used for operating the semiconductor refrigeration device U1 below the rated voltage to reduce the refrigeration power and operating the semiconductor refrigeration device U1 at the rated voltage.
Compared with the prior art, the invention has the beneficial effects that:
the refrigeration circuit adopts the TEC to replace a water cooling scheme, so that the design of a handheld welding head can be simplified, and the weight of the handheld welding head is reduced; meanwhile, the temperature does not need to be accurately controlled in the hand-held welding head, and the temperature can be controlled in a proper range. The working state is controlled by adopting the double temperature sensors, so that the TEC can work stably and continuously with high efficiency, the control requirement is simplified, a complex PID control loop is saved, the TEC does not need to be switched frequently, and the service life of the TEC is prolonged; and only J1, J2 and U1 are positioned in the handheld welding head, and the relay and the power supply are positioned in the conventional external controller, so that the occupation of the interior of the handheld welding head is reduced to the maximum extent. The TEC is tightly attached to the metal shell of the handheld welding head, the heating surface faces outwards, the protection air flow of the handheld welding head can be directly used for cooling, the existing resources are further utilized, and the purposes of simplifying design and reducing weight are achieved.
Drawings
Fig. 1 is a schematic circuit diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, the present invention provides a technical solution: a semiconductor refrigeration circuit for a laser hand-held welding head comprises an external circuit and an internal refrigeration circuit arranged in the welding head, wherein the external circuit comprises a relay RLY1 and power supplies V1 and V2, and the internal refrigeration circuit comprises a high-temperature-domain temperature switch J1, a low-temperature-domain temperature switch J2 and a semiconductor refrigeration device U1; a first end of the high-temperature-domain temperature switch J1 is grounded, a second end of the high-temperature-domain temperature switch J1 is connected to a pin 5 of a relay RLY1, a common-end pin 1 of the relay RLY1 is connected with a first end of a low-temperature-domain temperature switch J2, a second end of a low-temperature-domain temperature switch J2 is connected to a pin 1 of a semiconductor refrigeration device U1, and a driving voltage required by the semiconductor refrigeration device U1 is provided; pin 2 of the semiconductor refrigeration device U1 is grounded, a normally closed pin 4 of a relay RLY1 is connected with a power supply V2, a normally open pin 3 of the relay RLY1 is connected with a power supply V1, when the temperature detected by a low-temperature-range temperature switch J2 reaches an action temperature, the switch is closed, a low-voltage power supply V2 connected to a normally closed pin 4 of a relay RLY1 supplies power to the semiconductor refrigeration device U1, and refrigeration with low power is started.
In the embodiment, the high-temperature-range temperature switch J1 is a micro temperature switch and has a specific model number of TB02-KA8D, and the operating temperature of the high-temperature-range temperature switch J1 is 45 degrees.
In the present embodiment, when the temperature is higher than the operating temperature of J2, the switch is closed, and the semiconductor cooling device U1 operates to cool the handheld welding head. J2 is a KSD series normally open temperature switch, the operating temperature is 25 ℃, and the working current can reach 12A at 12V voltage; because the reset temperature of the temperature switch is lower than the action temperature of the temperature switch, the semiconductor refrigeration device U1 is ensured not to frequently switch states at a temperature trigger point.
In the embodiment, a high-temperature-range temperature switch J1 is connected into a coil power supply loop of a relay RLY1, when the temperature is higher than the action temperature of J1, the switch is closed, a normally open contact of the relay is connected with a common end, the driving voltage of a semiconductor refrigerating device U1(TEC) is V2, the high-power refrigerating state is worked, when the temperature is lower than the reset temperature, the switch is opened, the normally closed contact of the relay is connected with the common end, the driving voltage of the semiconductor refrigerating device U1(TEC) is V1, and the low-power refrigerating state is worked; the V2 is 12V, so that the semiconductor refrigeration device U1(TEC) operates at rated voltage, and the V1 is 5V, so that the semiconductor refrigeration device U1(TEC) operates below the rated voltage, and the refrigeration power is reduced.
In the present embodiment, the semiconductor cooling device U1 has a rated voltage of 12V, and the maximum current is not more than 12A. Because the current passing through the J1 is small, the micro temperature switch TB02-KA8D is selected, so that the requirement of light weight and small volume of the handheld welding head can be further met, and the operating temperature is selected to be 45 degrees. Because the reset temperature of the temperature switch is lower than the action temperature of the temperature switch, the state of the relay can not be frequently switched at a temperature trigger point.
In the present embodiment, the power supplies V1, V2 are 5V, 12V, respectively, and are used to operate the semiconductor cooling device U1 below the rated voltage to reduce the cooling power and operate the semiconductor cooling device U1 at the rated voltage.
The refrigeration circuit adopts the TEC to replace a water cooling scheme, so that the design of a handheld welding head can be simplified, and the weight of the handheld welding head is reduced; meanwhile, the temperature does not need to be accurately controlled in the hand-held welding head, and the temperature can be controlled in a proper range. The working state is controlled by adopting the double temperature sensors, so that the TEC can work stably and continuously with high efficiency, the control requirement is simplified, a complex PID control loop is saved, the TEC does not need to be switched frequently, and the service life of the TEC is prolonged; and only J1, J2 and U1 are positioned in the handheld welding head, and the relay and the power supply are positioned in the conventional external controller, so that the occupation of the interior of the handheld welding head is reduced to the maximum extent. The TEC is tightly attached to the metal shell of the handheld welding head, the heating surface faces outwards, the protection air flow of the handheld welding head can be directly used for cooling, the existing resources are further utilized, and the purposes of simplifying design and reducing weight are achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A semiconductor refrigeration circuit for a laser hand-held welding head, comprising an external circuit and an internal refrigeration circuit arranged in the welding head, wherein the external circuit comprises a relay RLY1 and power supplies V1 and V2, and the internal refrigeration circuit comprises a high-temperature-domain temperature switch J1, a low-temperature-domain temperature switch J2 and a semiconductor refrigeration device U1; a first end of the high-temperature-domain temperature switch J1 is grounded, a second end of the high-temperature-domain temperature switch J1 is connected to a pin 5 of a relay RLY1, a common-end pin 1 of the relay RLY1 is connected with a first end of a low-temperature-domain temperature switch J2, a second end of a low-temperature-domain temperature switch J2 is connected to a pin 1 of a semiconductor refrigeration device U1, and a driving voltage required by the semiconductor refrigeration device U1 is provided; pin 2 of the semiconductor refrigeration device U1 is grounded, a normally closed pin 4 of a relay RLY1 is connected with a power supply V2, a normally open pin 3 of the relay RLY1 is connected with a power supply V1, when the temperature detected by a low-temperature-range temperature switch J2 reaches an action temperature, the switch is closed, a low-voltage power supply V2 connected to a normally closed pin 4 of a relay RLY1 supplies power to the semiconductor refrigeration device U1, and refrigeration with low power is started.
2. A semiconductor refrigeration circuit for a laser hand held welding head according to claim 1 wherein: the high-temperature-range temperature switch J1 is a micro temperature switch with the specific model of TB02-KA8D, and the operating temperature of the high-temperature-range temperature switch J1 is 45 ℃.
3. A semiconductor refrigeration circuit for a laser hand held welding head according to claim 1 wherein: the semiconductor refrigeration device U1 has a rated voltage of 12V and a maximum current of not more than 12A.
4. A semiconductor refrigeration circuit for a laser hand held welding head according to claim 1 wherein: the power supplies V1 and V2 are respectively 5V and 12V and are used for enabling the semiconductor refrigeration device U1 to work below the rated voltage to reduce refrigeration power and enabling the semiconductor refrigeration device U1 to work at the rated voltage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010748883.XA CN111843188A (en) | 2020-07-29 | 2020-07-29 | Semiconductor refrigeration circuit for laser handheld welding head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010748883.XA CN111843188A (en) | 2020-07-29 | 2020-07-29 | Semiconductor refrigeration circuit for laser handheld welding head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111843188A true CN111843188A (en) | 2020-10-30 |
Family
ID=72946157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010748883.XA Pending CN111843188A (en) | 2020-07-29 | 2020-07-29 | Semiconductor refrigeration circuit for laser handheld welding head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111843188A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2382988Y (en) * | 1999-07-13 | 2000-06-14 | 淄博电力实业总公司 | Multifunction indoor scavenger fan |
| US20070040040A1 (en) * | 2005-08-16 | 2007-02-22 | Emerson Electric Co. | Control for a heating and/or cooling unit |
| CN203787762U (en) * | 2014-04-12 | 2014-08-20 | 中山新诺科技股份有限公司 | Laser light source cooling device |
| CN204144660U (en) * | 2014-08-10 | 2015-02-04 | 绍兴光线数码科技有限公司 | A kind of laser automatic thermostatic device |
| CN104808719A (en) * | 2015-03-12 | 2015-07-29 | 北京长安汽车工程技术研究有限责任公司 | Temperature control system and method |
| CN105307962A (en) * | 2013-05-28 | 2016-02-03 | 奥的斯电梯公司 | Elevator motor cooling assembly |
| CN206389302U (en) * | 2016-12-30 | 2017-08-08 | 重庆瑜欣平瑞电子股份有限公司 | A kind of novel electricity generator starting module |
| CN110602816A (en) * | 2018-09-14 | 2019-12-20 | 恩智浦美国有限公司 | Thawing apparatus using low loss charge detection and method of operating the same |
| CN110838756A (en) * | 2019-11-04 | 2020-02-25 | 成都仙德科技有限公司 | Automatic power supply switching method for portable sound energy air conditioner |
-
2020
- 2020-07-29 CN CN202010748883.XA patent/CN111843188A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2382988Y (en) * | 1999-07-13 | 2000-06-14 | 淄博电力实业总公司 | Multifunction indoor scavenger fan |
| US20070040040A1 (en) * | 2005-08-16 | 2007-02-22 | Emerson Electric Co. | Control for a heating and/or cooling unit |
| CN105307962A (en) * | 2013-05-28 | 2016-02-03 | 奥的斯电梯公司 | Elevator motor cooling assembly |
| CN203787762U (en) * | 2014-04-12 | 2014-08-20 | 中山新诺科技股份有限公司 | Laser light source cooling device |
| CN204144660U (en) * | 2014-08-10 | 2015-02-04 | 绍兴光线数码科技有限公司 | A kind of laser automatic thermostatic device |
| CN104808719A (en) * | 2015-03-12 | 2015-07-29 | 北京长安汽车工程技术研究有限责任公司 | Temperature control system and method |
| CN206389302U (en) * | 2016-12-30 | 2017-08-08 | 重庆瑜欣平瑞电子股份有限公司 | A kind of novel electricity generator starting module |
| CN110602816A (en) * | 2018-09-14 | 2019-12-20 | 恩智浦美国有限公司 | Thawing apparatus using low loss charge detection and method of operating the same |
| CN110838756A (en) * | 2019-11-04 | 2020-02-25 | 成都仙德科技有限公司 | Automatic power supply switching method for portable sound energy air conditioner |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018028299A1 (en) | Cooling system for pure electric vehicle and vehicle | |
| CN106329028A (en) | Vehicle battery temperature control device and vehicle battery temperature control method | |
| CN111843188A (en) | Semiconductor refrigeration circuit for laser handheld welding head | |
| CN109565090A (en) | Rechargeable battery | |
| CN217034595U (en) | Constant temperature control system and test equipment | |
| JP2020118348A (en) | Chiller | |
| CN215934227U (en) | Temperature control alarm device for switch cabinet | |
| CN201061076Y (en) | Air cooling type end pumped solid laser | |
| CN207763286U (en) | A kind of intelligence dual-temperature industrial chilled water system | |
| JP2007166782A (en) | Refrigerator and inverter device used therefor | |
| CN217343998U (en) | Water cooling device and laser equipment | |
| CN201804231U (en) | Transformer cooling system self-control device | |
| CN101005188A (en) | Full wind cooling type end pump laser | |
| CN112086712A (en) | Cooling device of water-cooling energy storage battery and control method thereof | |
| KR20220118823A (en) | Vehicle battery cooling system in fast charging system | |
| CN112923600A (en) | Semiconductor thermoelectric material refrigeration platform | |
| CN220290917U (en) | Battery thermal management unit integrating heat pump system and electric heat dissipation system | |
| CN114379421B (en) | Cooling system, control method of cooling system and vehicle | |
| CN219019347U (en) | Multi-connected heat pipe air conditioner cold accumulation system of data center module | |
| CN220400704U (en) | Energy storage power supply | |
| CN220624443U (en) | Energy-saving air-cooled industrial water chiller | |
| CN210591447U (en) | Charging cabinet for oil-electric vehicle | |
| CN220671860U (en) | Intelligent energy-saving temperature control device | |
| CN112954979B (en) | Temperature adjusting mechanism of charger and temperature adjusting method thereof | |
| CN220545397U (en) | Active control infrared tracking type spray cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201030 |