CN111836451A - Circuit board processing method and circuit board - Google Patents
Circuit board processing method and circuit board Download PDFInfo
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- CN111836451A CN111836451A CN201910305024.0A CN201910305024A CN111836451A CN 111836451 A CN111836451 A CN 111836451A CN 201910305024 A CN201910305024 A CN 201910305024A CN 111836451 A CN111836451 A CN 111836451A
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- metal
- circuit board
- forming
- attached substrate
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Abstract
The invention provides a circuit board processing method and a circuit board, wherein the circuit board processing method comprises the following steps: providing an attached substrate and a plate body; forming surface layer metal on the attached substrate, and forming a metal block on the surface of the surface layer metal, which is deviated from the attached substrate; forming a groove on the outer surface of the plate body; attaching the surface metal to the outer surface, and accommodating the metal block in the groove; separating the attached substrate from the surface metal; the attached substrate bears the surface layer metal, and when the surface layer metal is attached to the plate body, the attached substrate always supports the surface layer metal, so that the surface layer metal is prevented from being folded, and the processing precision of the circuit board is improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a circuit board processing method and a circuit board.
Background
With the gradual development of circuit board processing technology, in order to satisfy the heat dissipation function of the circuit board, a copper block is often arranged in the circuit board, so how to process the copper block inside the circuit board becomes a hot point of research.
In the prior art, when a circuit board is processed, a board body is formed firstly, and then a groove is formed on the surface of the board body; then forming a copper foil, and forming a copper block on the copper foil; then, attaching the copper foil to the surface of the plate body, and when the copper foil is contacted with the surface of the plate body, accommodating the copper block in the groove; and forming a surface circuit on the copper foil to finish the processing of the circuit board.
However, the copper foil has a small thickness, and when the copper foil is attached to a board body, the copper foil is likely to wrinkle, resulting in insufficient processing accuracy of the circuit board.
Disclosure of Invention
In view of this, embodiments of the present invention provide a circuit board processing method and a circuit board, so as to solve the technical problem that when a copper foil is attached to a board body, the copper foil is prone to wrinkle, which results in insufficient processing precision of the circuit board.
The embodiment of the invention provides a circuit board processing method, which comprises the following steps:
providing an attached substrate and a plate body;
forming surface layer metal on the attached substrate, and forming a metal block on the surface of the surface layer metal, which is deviated from the attached substrate;
forming a groove on the outer surface of the plate body;
attaching the surface layer metal to the outer surface, and accommodating the metal block in the groove;
and separating the attached substrate from the surface metal.
In the above method for processing a circuit board, it is preferable that before forming the surface layer metal on the attached substrate, the method further includes:
forming a middle metal layer and a sacrificial layer on the attached substrate, wherein the middle metal layer is positioned between the sacrificial layer and the attached substrate; the surface metal is formed on the sacrificial layer.
In the above-described circuit board processing method, preferably, the separating the attachment substrate from the surface layer metal includes:
separating the surface metal from the intermediate metal layer.
In the above method for processing a circuit board, preferably, before attaching the surface layer metal to the outer surface and accommodating the metal block in the groove, the method further includes:
and performing brown oxidation treatment on the surface layer metal and the metal block.
In the above method for processing a circuit board, before the separating the attached substrate from the surface layer metal, the method further includes:
and extruding the attached substrate and the plate body so as to completely attach the surface layer metal to the upper surface of the plate body.
In the above-described method for processing a circuit board, it is preferable that the attached substrate and the board body are heated while the attached substrate and the board body are pressed.
In the above-described method for processing a circuit board, it is preferable that the forming of the surface metal on the attachment substrate includes:
and forming the surface metal on the attached substrate by an electroplating process.
In the above method for processing a circuit board, it is preferable that the forming of the metal block on the surface of the surface layer metal facing away from the attached substrate includes:
and forming a plating resistant film corresponding to the outer area of the metal block on the surface metal by a pattern transfer process, and then forming the metal block in an area except the plating resistant film by an electroplating mode.
In the above method for processing a circuit board, it is preferable that the step of separating the attachment substrate from the surface layer metal includes:
and forming a surface circuit on the surface metal.
The embodiment of the invention also provides a circuit board which is manufactured by adopting the circuit board processing method.
According to the circuit board processing method and the circuit board, the surface layer metal is formed on the attached substrate, the attached substrate bears the surface layer metal, and when the surface layer metal is attached to the board body, the attached substrate always supports the surface layer metal, so that the surface layer metal is prevented from being wrinkled, and the processing precision of the circuit board is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a flowchart of a circuit board processing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a metal block formed on a surface metal in a circuit board processing method according to an embodiment of the present invention;
fig. 3 is a schematic view of a board body provided with a groove in the circuit board processing method according to the embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a surface metal and a body in a circuit board processing method according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Description of reference numerals:
10: attaching a substrate;
20: surface layer metal;
201: a metal block;
30: a plate body;
301: a groove;
302: a core board;
303: a metal layer;
304: attaching the layer;
40: a sacrificial layer;
50: an intermediate metal layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, unless otherwise specifically stated, the terms "mounted," "connected," "fixed," and the like are to be understood broadly, and for example, may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or communicable with each other; they may be directly connected or indirectly connected through an intermediate medium, or they may be connected internally or in any other manner known to those skilled in the art, unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Fig. 1 is a flowchart of a circuit board processing method according to an embodiment of the present invention.
Fig. 2 is a schematic diagram illustrating a metal block formed on a surface metal in the circuit board processing method according to the embodiment of the present invention.
Fig. 3 is a schematic diagram of a board body with a groove in the circuit board processing method according to the embodiment of the present invention.
Fig. 4 is a schematic diagram illustrating a surface metal and a body in a circuit board processing method according to an embodiment of the present invention.
Please refer to fig. 1-4. The embodiment of the invention provides a circuit board processing method, which comprises the following steps:
s101, providing an attached substrate and a plate body.
And S102, forming surface layer metal on the attached substrate, and forming metal blocks on the surface of the surface layer metal, which is far away from the attached substrate.
And S103, forming a groove on the outer surface of the plate body.
And S104, attaching the surface layer metal to the outer surface, and accommodating the metal block in the groove.
S105, separating the attached substrate from the surface layer metal.
The attached substrate 10 in this embodiment may be any plate material capable of bearing the surface metal 20, for example: the attachment substrate 10 may be a polypropylene plate, a polyimide plate, or the like. The surface metal 20 is supported on the attachment substrate 10, so that when the surface metal 20 is attached to the plate body 30, the attachment substrate 10 supports the surface metal 20 to prevent the surface metal 20 from being wrinkled.
In this embodiment, the circuit board is a single-layer circuit board, the board body 30 may include a core board 302, the groove 301 is disposed on the outer surface of the board body 30, when the surface metal 20 is attached to the board body 30, the surface metal 20 is attached to the core board 302, and the metal block 201 is accommodated in the groove 301. When the circuit board is a multilayer circuit board, the board body 30 may include a core board 302 of the circuit board and a plurality of metal layers 303 formed at intervals outside the core board 302, and adjacent metal layers 303 are connected by an insulating layer; in this case, in order to attach the surface layer metal 20 to the plate body 30, the attachment layer 304 needs to be formed on the outermost metal layer 303 of the plate body 30; the corresponding groove 301 is disposed on the attaching layer 304, when the surface metal 20 is attached to the plate body 30, the surface metal 20 is connected to the attaching layer 304, and the metal block 201 is accommodated in the groove 301.
The attaching layer 304 may be an insulating layer such as a polypropylene layer, so as to accommodate the metal block 201 and achieve an insulating connection between the surface metal 20 and the outermost metal layer 303 of the plate body 30.
In this embodiment, the metal block 201 accommodated in the groove 301 has various functions in the circuit board, and can be set according to the actual use condition of the circuit board; for example, the metal block 201 is embedded in the circuit board, and can absorb the heat inside the circuit board to improve the heat dissipation efficiency of the circuit board; of course, the metal block 201 may also be connected to a circuit in the circuit board to implement functions such as signal adjustment of the circuit board.
In this embodiment, when the circuit board is a multilayer circuit board, the groove 301 may be only disposed on the attachment layer 304, and then the metal block 201 is only embedded in the attachment layer 304; alternatively, the recess 301 extends into the circuit board, through the metal layer 303 and the core 302 of the circuit board.
In this embodiment, the surface layer metal 20 and the metal block 201 are made of copper, but the surface layer metal 20 and the metal block 201 may be made of other metal materials such as gold and silver.
In this embodiment, the surface layer metal 20 may be prepared in advance, and then the surface layer metal 20 is attached to the attachment substrate 10 to realize the connection between the surface layer metal 20 and the attachment substrate 10.
Preferably, the forming of the surface metal 20 on the attachment substrate 10 includes: the surface metal 20 is formed on the attachment substrate 10 by a plating process. The surface metal 20 is formed by the electroplating process, and compared with the manufacturing method of manufacturing the surface metal 20 in advance and then attaching the surface metal 20 to the attached substrate 10, the surface metal 20 can be prevented from wrinkling in the process of attaching the surface metal 20 to the attached substrate 10, and the surface metal 20 formed by the electroplating method is relatively uniform in thickness and easy to control in thickness.
In this embodiment, the metal block 201 is formed on the surface layer metal 20, and the metal block 201 may be manufactured in advance, and then the metal block 201 may be mounted on the surface layer metal 20. Preferably, the forming of the metal block 201 on the surface of the surface metal 20 facing away from the attachment substrate 10 includes: a plating resist film corresponding to the region outside the metal block 201 is formed on the surface metal 20 by a pattern transfer process, and then the metal block 201 is formed in the region outside the plating resist film by electroplating. The metal block 201 is formed in an electroplating mode, compared with a manufacturing mode that the metal block 201 is manufactured in advance and then the metal block 201 is installed on the surface layer metal 20, the connecting force between the metal block 201 and the surface layer metal 20 is improved, and the metal block 201 is prevented from falling off in the process of attaching the attached substrate 10 to the plate; in addition, the metal block 201 formed by electroplating has high dimensional accuracy.
Specifically, after the surface layer metal 20 is formed on the attached substrate 10, a plating resist is formed on the surface layer metal 20, and then a mask plate is covered on the plating resist, the mask plate having a light-transmitting area corresponding to the metal block 201; exposing the mask plate to expose the mask plate in the light transmission area, and removing the exposed anti-coating film through processes such as development and the like; electroplating metal on the surface metal 20, and forming metal only in the region during electroplating because the plating resistant film of the region corresponding to the exposed plating resistant film is removed; after that, the plating resist is removed, and the metal block 201 is formed.
In this embodiment, there are various methods of forming the groove 301 on the outer surface of the plate body 30, for example: the groove 301 may be formed on the outer surface of the plate body 30 by means of laser drilling; or by milling, the recess 301 is machined in the plate body 30.
The specific process of the circuit board processing method provided by the embodiment is as follows: providing an attached substrate 10 and a plate body 30; forming a surface metal 20 on the attached substrate 10 by electroplating; and then forming a plating resistant film outside the area where the metal block 201 needs to be manufactured by a pattern transfer process, electroplating metal on the surface layer metal 20, and forming the metal block 201 at the position without the plating resistant film on the surface layer metal 20. After or simultaneously with the above-described process, the groove 301 is formed on the outer surface of the plate body 30 by means of laser drilling or milling. After that, the plate body 30 and/or the attached substrate 10 are moved to attach the surface layer metal 20 to the outer surface of the plate body 30, and the position between the plate body 30 and the attached substrate 10 is properly set to accommodate the metal block 201 in the groove 301, so as to achieve the connection between the surface layer metal 20 and the plate body 30. After that, the attached substrate 10 is separated from the surface layer metal 20 to complete the processing of the circuit board.
In the circuit board processing method provided by this embodiment, the surface layer metal 20 is formed on the attached substrate 10, the attached substrate 10 bears the surface layer metal 20, and when the surface layer metal 20 is attached to the board body 30, the attached substrate 10 always supports the surface layer metal 20, so as to avoid the surface layer metal 20 from wrinkling, and improve the processing precision of the circuit board.
In this embodiment, before forming the surface layer metal 20 on the attachment substrate 10 and forming the metal block 201 on the surface of the surface layer metal 20 away from the attachment substrate 10, the method further includes: forming an intermediate metal layer 50 and a sacrificial layer 40 on the attached substrate 10, wherein the intermediate metal layer 50 is located between the sacrificial layer 40 and the attached substrate 10; the surface metal 20 is formed on the sacrificial layer 40. The separating the attached substrate 10 from the surface metal 20 includes: separating the surface metal 20 from the intermediate metal layer 50. The surface layer metal 20 is prevented from being directly connected with the attached substrate 10, and the surface layer metal 20 and the attached substrate 10 are prevented from being difficult to separate.
The sacrificial layer 40 may be made of an inorganic material such as a nickel alloy, or the sacrificial layer 40 may be made of another organic material; the thickness of the sacrificial layer 40 is small. The adhesion between the sacrificial layer 40 and the intermediate metal layer 50 and the surface metal 20 is smaller than the adhesion between the attachment substrate 10 and the intermediate metal layer 50, and the adhesion between the sacrificial layer 4 and the intermediate metal layer 50 and the surface metal 20 is smaller than the adhesion between the surface metal 20 and the plate body 30; when the attached substrate 10 is peeled off from the plate body 30, the intermediate metal layer 50 and the surface metal 20 are separated first.
Specifically, the intermediate metal layer 50 may also be formed on the attachment substrate 10 by means of electroplating; the specific process can be as follows: firstly, forming an intermediate metal layer 50 on the attached substrate 10 in an electroplating mode, and then forming a sacrificial layer 40 on the intermediate metal layer 50; after which a surface metal 20 is formed on the sacrificial layer 40 by means of electroplating. And then forming a plating resistant film outside the area where the metal block 201 needs to be manufactured by a pattern transfer process, electroplating metal on the surface layer metal 20, and forming the metal block 201 at the position without the plating resistant film on the surface layer metal 20.
In this embodiment, the sacrificial layer 40 may be various, as long as the surface metal 20 is firstly separated from the middle metal when the attached substrate 10 is torn off from the plate body 30; for example: the sacrificial layer 40 may be made of an inorganic material such as a nickel alloy, or the sacrificial layer 40 may be made of another organic material.
It is noted that after the surface metal 20 is separated from the intermediate metal layer 50, the sacrificial layer 40 may remain on the surface metal 20 and/or the intermediate metal layer 50; when the sacrificial layer 40 remains on the surface metal 20, the sacrificial layer 40 needs to be removed by acid cleaning or other methods to prevent the sacrificial layer 40 from affecting the subsequent processing.
In the method for processing a circuit board according to this embodiment, the surface metal 20 is attached to the outer surface, and before the metal block 201 is accommodated in the groove 301, the method further includes: the surface layer metal 20 and the metal block 201 are browned. The surface layer metal 20 and the metal block 201 are browned before the surface layer metal 20 is attached to the plate body 30, so that the joining force between the surface layer metal 20 and the metal block 201 and the plate body 30 can be improved.
Specifically, the browning treatment may include cleaning the surface layer metal 20 and the metal block 201 with an acid solution, and after the cleaning, a rugged structure is formed on the surfaces of the surface layer metal 20 and the metal block 201, so that the contact areas of the surface layer metal 20 and the metal block 201 and the plate body 30 are increased, and the coupling force between the surface layer metal 20 and the plate body 30 is further increased, as compared with the surface layer metal 20 and the metal block 201 which are not subjected to the browning treatment.
The circuit board processing method provided by the embodiment further includes, before separating the attachment substrate 10 from the surface layer metal 20: the attached substrate 10 and the plate body 30 are pressed so that the surface layer metal 20 is completely attached to the upper surface of the plate body 30. The attached substrate 10 and the plate body 30 are pressed, so that the surface layer metal 20 and the plate body 30 are completely attached to avoid the insufficient connection force between the surface layer metal 20 and the plate body 30 caused by the partial contact of the surface layer metal 20 and the plate body 30, and the falling off of the surface layer metal 20 is avoided.
Further, the attached substrate 10 and the plate body 30 are heated while pressing the attached substrate 10 and the plate body 30. To further improve the coupling force between the skin metal 20 and the plate body 30.
The circuit board processing method provided by the embodiment separates the attached substrate 10 from the surface layer metal 20, and then includes: a skin circuit is formed on the skin metal 20. For subsequent connection to electrical components mounted on the circuit board.
Specifically, a protective film may be formed on the surface layer metal 20, a mask plate having a light shielding portion with the same shape as the surface layer circuit is covered on the protective film, and then the mask plate is exposed to expose the protective film except the light shielding portion; then removing the exposed light-shielding part by the processes of development and the like; finally, the surface layer metal 20 without the light shielding part is removed by an etching process, and a surface layer circuit can be formed.
The specific process of the circuit board processing method provided by the embodiment is as follows: providing an attached substrate 10 and a plate body 30; forming an intermediate metal layer 50 on the attachment substrate 10 by electroplating, and then forming a sacrificial layer 40 on the intermediate metal layer 50; then, forming a surface layer metal 20 on the sacrificial layer 40 by electroplating; forming an anti-plating film outside the area where the metal block 201 needs to be manufactured by a pattern transfer process, electroplating metal on the surface layer metal 20, and forming the metal block 201 at a position without the anti-plating film on the surface layer metal 20; after which the surface layer metal 20 and the metal block 201 are browned. After or simultaneously with the above-described process, the groove 301 is formed on the outer surface of the plate body 30 by means of laser drilling or milling. After that, the plate body 30 and/or the attached substrate 10 are moved to attach the surface layer metal 20 to the outer surface of the plate body 30, and the position between the plate body 30 and the attached substrate 10 is set reasonably to accommodate the metal block 201 in the groove 301 to realize the connection between the surface layer metal 20 and the plate body 30; the bonding of the surface layer metal 20 to the outer surface of the plate body 30 includes pressing the attached substrate 10 and the plate body 30, and simultaneously heating the pressed attached substrate 10 and the plate body 30. After that, the intermediate metal layer 50 is detached from the surface metal 20. And finally, forming a surface circuit on the surface metal 20 to finish the processing of the circuit board.
Fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Please refer to fig. 1-5. In other embodiments, a circuit board manufactured by the circuit board processing method as described above is also provided.
Specifically, the circuit board includes a plate body 30 and a surface metal 20, which are stacked, and the surface metal 20 has a metal block 201 embedded in the plate body 30.
The circuit board processing method comprises the following steps:
s101, providing an attached substrate and a plate body.
And S102, forming surface layer metal on the attached substrate, and forming metal blocks on the surface of the surface layer metal, which is far away from the attached substrate.
And S103, forming a groove on the outer surface of the plate body.
And S104, attaching the surface layer metal to the outer surface, and accommodating the metal block in the groove.
S105, separating the attached substrate from the surface layer metal.
The specific process is as follows: providing an attached substrate 10 and a plate body 30; forming an intermediate metal layer 50 on the attachment substrate 10 by electroplating, and then forming a sacrificial layer 40 on the intermediate metal layer 50; then, forming a surface layer metal 20 on the sacrificial layer 40 by electroplating; forming an anti-plating film outside the area where the metal block 201 needs to be manufactured by a pattern transfer process, electroplating metal on the surface layer metal 20, and forming the metal block 201 at a position without the anti-plating film on the surface layer metal 20; after which the surface layer metal 20 and the metal block 201 are browned. After or simultaneously with the above-described process, grooves are formed on the outer surface of the plate body 30 by means of laser drilling or milling. After that, the plate body 30 and/or the attached substrate 10 are moved to attach the surface layer metal 20 to the outer surface of the plate body 30, and the position between the plate body 30 and the attached substrate 10 is set reasonably to accommodate the metal block 201 in the groove, so as to realize the connection between the surface layer metal 20 and the plate body 30; the bonding of the surface layer metal 20 to the outer surface of the plate body 30 includes pressing the attached substrate 10 and the plate body 30, and simultaneously heating the pressed attached substrate 10 and the plate body 30. After that, the intermediate metal layer 50 is detached from the surface metal 20. And finally, forming a surface circuit on the surface metal 20 to finish the processing of the circuit board.
The circuit board provided by the embodiment forms the surface layer metal 20 on the attached substrate 10, the attached substrate 10 bears the surface layer metal 20, when the surface layer metal 20 is attached on the board body 30, the attached substrate 10 always supports the surface layer metal 20, the surface layer metal 20 is prevented from being wrinkled, and the processing precision of the circuit board is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A circuit board processing method is characterized by comprising the following steps:
providing an attached substrate and a plate body;
forming surface layer metal on the attached substrate, and forming a metal block on the surface of the surface layer metal, which is deviated from the attached substrate;
forming a groove on the outer surface of the plate body;
attaching the surface layer metal to the outer surface, and accommodating the metal block in the groove;
and separating the attached substrate from the surface metal.
2. The method for processing a circuit board according to claim 1, wherein the forming of the surface metal on the attachment substrate further comprises, before forming the metal block on a surface of the surface metal facing away from the attachment substrate:
forming a middle metal layer and a sacrificial layer on the attached substrate, wherein the middle metal layer is positioned between the sacrificial layer and the attached substrate; the surface metal is formed on the sacrificial layer.
3. The method for processing a circuit board according to claim 2, wherein the separating the attachment substrate from the surface metal comprises:
separating the surface metal from the intermediate metal layer.
4. The method for processing a circuit board according to any one of claims 1 to 3, wherein the attaching the surface metal to the outer surface and before the metal block is received in the groove further comprises:
and performing brown oxidation treatment on the surface layer metal and the metal block.
5. The circuit board processing method according to any one of claims 1 to 3, further comprising, before the separating the attachment substrate from the surface metal:
and extruding the attached substrate and the plate body so as to completely attach the surface layer metal to the upper surface of the plate body.
6. The circuit board processing method according to claim 5, wherein the attached substrate and the board body are heated while the attached substrate and the board body are pressed.
7. The circuit board processing method according to any one of claims 1 to 3, wherein the forming of the surface metal on the attachment substrate includes:
and forming the surface metal on the attached substrate by an electroplating process.
8. The method for processing a circuit board according to any one of claims 1 to 3, wherein the forming of the metal block on the surface of the surface metal facing away from the attached substrate comprises:
and forming a plating resistant film corresponding to the outer area of the metal block on the surface metal by a pattern transfer process, and then forming the metal block in an area except the plating resistant film by an electroplating mode.
9. The circuit board processing method according to any one of claims 1 to 3, wherein the step of separating the attachment substrate from the surface metal comprises:
and forming a surface circuit on the surface metal.
10. A circuit board manufactured by the circuit board processing method according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910305024.0A CN111836451B (en) | 2019-04-16 | 2019-04-16 | Circuit board processing method and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910305024.0A CN111836451B (en) | 2019-04-16 | 2019-04-16 | Circuit board processing method and circuit board |
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| CN111836451B CN111836451B (en) | 2021-12-21 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222894A (en) * | 2001-01-29 | 2002-08-09 | Hitachi Metals Ltd | Package for semiconductor |
| CN103188882A (en) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | Circuit board and manufacture method thereof |
| CN105185716A (en) * | 2014-02-13 | 2015-12-23 | 群成科技股份有限公司 | ELectronic package, package carrier, and methods of manufacturing electronic package and package carrier |
| CN106158667A (en) * | 2015-02-11 | 2016-11-23 | 旭德科技股份有限公司 | Package Substrate And Manufacturing Method Thereof |
-
2019
- 2019-04-16 CN CN201910305024.0A patent/CN111836451B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222894A (en) * | 2001-01-29 | 2002-08-09 | Hitachi Metals Ltd | Package for semiconductor |
| CN103188882A (en) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | Circuit board and manufacture method thereof |
| CN105185716A (en) * | 2014-02-13 | 2015-12-23 | 群成科技股份有限公司 | ELectronic package, package carrier, and methods of manufacturing electronic package and package carrier |
| CN106158667A (en) * | 2015-02-11 | 2016-11-23 | 旭德科技股份有限公司 | Package Substrate And Manufacturing Method Thereof |
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| CN111836451B (en) | 2021-12-21 |
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