CN111834282A - Vibration-proof wafer lifting mechanism - Google Patents
Vibration-proof wafer lifting mechanism Download PDFInfo
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- CN111834282A CN111834282A CN202010761204.2A CN202010761204A CN111834282A CN 111834282 A CN111834282 A CN 111834282A CN 202010761204 A CN202010761204 A CN 202010761204A CN 111834282 A CN111834282 A CN 111834282A
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- rubber block
- mechanism according
- fluted disc
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- 230000007246 mechanism Effects 0.000 title claims abstract description 44
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a vibration-proof wafer lifting mechanism which comprises a base, a transmission case, a cover body, a screw rod and a fixing mechanism, wherein the vibration-proof wafer lifting mechanism is provided with the fixing mechanism, an external tool is used for rotating a rotating button during fixing, then a first fluted disc rotates to drive a hammer-shaped gear to rotate, and at the moment, a second fluted disc rotates and drives a threaded sleeve to rotate, so that two rubber blocks are screwed out to clamp and fix an external unformed wafer, the displacement is prevented, the problem that the wafer is inconvenient to fix during use of the existing lifting mechanism, the wafer is easy to displace, drop and damage during lifting is solved, and the right side of the existing lifting mechanism is limited and rotated by a bearing while the rotating button rotates, so that the rotation of the existing lifting mechanism is more stable.
Description
Technical Field
The invention relates to the field related to wafer processing, in particular to a vibration-proof wafer lifting mechanism.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer, and the current domestic wafer production line mainly takes 8 inches and 12 inches.
When the wafer is processed, the lifting mechanism is required to be used for displacement, but the existing lifting mechanism is inconvenient to fix the wafer when in use, and the wafer is easy to displace, drop and damage in the lifting process.
Disclosure of Invention
Therefore, in order to solve the above-mentioned disadvantages, the present invention provides a vibration-proof wafer lifting mechanism.
The invention is realized in such a way, a vibration-proof wafer lifting mechanism is constructed, the device comprises a base, the upper end of the base is respectively connected with a transmission case and a cover body, the inner side of the cover body is in sliding fit with a screw rod, the top of the screw rod is connected with a fixing mechanism, the fixing mechanism comprises a ring body, a placing groove, a rotating button, a bearing, a first fluted disc, a conical gear, a rotating rod, a second fluted disc, a threaded sleeve and a rubber block, the bottom of the ring body is connected with the screw rod, the middle part of the ring body is provided with the placing groove, the right side of the rotating button is in rotating fit with the inner part of the ring body through the bearing, the circle center of the first fluted disc is fastened at the middle part of the rotating button, the conical gear is in rotating fit with the upper end and the lower end inside the ring body through the rotating, and the middle part of the threaded sleeve is fastened with the second gear plate, and the top of the rubber block is in sliding fit with the threaded sleeve.
Preferably, a reinforcing ring is arranged at the bottom of the ring body, and the inner diameter of the reinforcing ring is the same as the outer diameter of the screw rod.
Preferably, the left side of the rotating button is provided with an inner hexagonal bolt port, and the upper end and the lower end of the left side of the rotating button are arc-shaped.
Preferably, two bevel gears are symmetrically arranged, and the inclination angle of two ends of each bevel gear is 90 degrees.
Preferably, the head end and the tail end of the rotating rod are both provided with limiting bearings, and the rotating rod is installed in a 45-degree inclined mode.
Preferably, the second cog diameter is eighty percent of the first cog diameter, and the second cog and the first cog are mounted 90 degrees vertically.
Preferably, the thread on the inner side of the thread bush is the same as the thread on the outer side of the rubber block, and the outer diameter of the thread bush is 1.3 times of the outer diameter of the rubber block.
Preferably, the inclination angle of the bottom of the rubber block is 45 degrees, and a limit ring is arranged at the top of the rubber block.
Preferably, the bearing is made of stainless steel.
Preferably, the side of the transmission case is connected to the base by a wedge-shaped reinforcing structure.
Preferably, the rubber block is of a bullet-shaped structure and is provided with a tip part and a body part, and the tip part extends into the placing groove.
The invention has the following advantages: the invention provides a vibration-proof wafer lifting mechanism through improvement, compared with the same type of equipment, the vibration-proof wafer lifting mechanism comprises the following improvements:
the method has the advantages that: according to the vibration-proof wafer lifting mechanism, the fixing mechanism is arranged, an external tool is used for rotating the rotating button during fixing, then the first fluted disc rotates to drive the hammer-shaped gear to rotate, at the moment, the second fluted disc rotates and drives the threaded sleeve to rotate, so that the two rubber blocks are screwed out to clamp and fix an external unformed wafer, displacement is prevented, and the problems that the existing lifting mechanism is inconvenient to fix the wafer during use and the wafer is easy to displace, drop and damage during lifting are solved.
The method has the advantages that: according to the vibration-proof wafer lifting mechanism, the bearing is arranged, the rotation button rotates, and meanwhile, the right side rotates in a limiting mode through the bearing, so that the rotation of the wafer lifting mechanism is more stable.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic view of the securing mechanism of the present invention;
FIG. 4 is a schematic view of the internal structure of the fixing mechanism of the present invention;
fig. 5 is a schematic view of the structure of fig. 4 according to the present invention at a.
Wherein: the device comprises a base-1, a transmission case-2, a cover body-3, a screw rod-4, a fixing mechanism-5, a ring body-51, a placing groove-52, a rotating button-53, a bearing-54, a first fluted disc-55, a bevel gear-56, a rotating rod-57, a second fluted disc-58, a threaded sleeve-59 and a rubber block-510.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 5, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, the invention provides a vibration-proof wafer lifting mechanism by improvement, which comprises a base 1, wherein the upper end of the base 1 is respectively connected with a transmission case 2 and a cover 3, the inner side of the cover 3 is in sliding fit with a screw rod 4, and the top of the screw rod 4 is connected with a fixing mechanism 5.
The gear box 2 and the cover 3 are connected to each other. The screw rod 4 penetrates through the cover body 3 and penetrates out of the top of the cover body 3. The screw 4 is seen to be partially inside the housing 3.
The side of the gear box 2 is connected to the base 1 by a wedge-shaped reinforcement (not shown, shown as a triangle on the left side of the gear box 2 in fig. 2) to provide a better fixation.
As shown in fig. 3 to 5, the fixing mechanism 5 includes a ring body 51, a placement groove 52, a rotation button 53, a bearing 54, a first toothed disc 55, a bevel gear 56, a rotation lever 57, a second toothed disc 58, a threaded sleeve 59, and a rubber block 510.
The bottom of the ring body 51 is connected with the screw rod 4, and the connection can be direct connection or indirect connection.
The middle part of the ring body 51 is provided with a placing groove 52. The placement groove 52 is provided as a circular groove in the present embodiment.
As shown in fig. 4, the right side of the rotating knob 53 is rotatably fitted to the inside of the ring body 51 through a bearing 54. The first gear 55 is fastened at the center of the rotation knob 53 (the center includes the space between the left and right ends of the rotation knob 53, i.e., the space between the left and bearing 54).
Referring to fig. 5, which shows an enlarged structure of a region a in fig. 4, the bevel gear 56 is rotatably engaged with the upper and lower ends of the inside of the ring body 51 by the rotating rod 57, and both ends of the bevel gear 56 are respectively engaged with the first toothed disc 55 and the second toothed disc 58, the top of the threaded sleeve 59 is rotatably engaged with the ring body 51 by a bearing, the middle of the threaded sleeve 59 is fastened with the second toothed disc 58, and the top of the rubber block 510 is slidably engaged with the threaded sleeve 59.
With combined reference to fig. 3 and 4, in the present exemplary embodiment, the rubber block 510 is provided in a bullet-shaped configuration with a tip (not differently labeled) and a body (not differently labeled), which correspondingly projects into the placement groove 52 for better achieving a corresponding clamping fixation. The rubber blocks 510 of this embodiment are two in number and are oppositely disposed 180 apart, as shown in fig. 3. It should be noted that in other embodiments, three rubber blocks 510 may be provided, in which case the three rubber blocks are uniformly distributed in the groove 52 at intervals of 120 degrees, or four rubber blocks 510 may be provided, in which case the four rubber blocks are uniformly distributed in the groove 52 at intervals of 90 degrees. In other embodiments, the rubber block 510 may be more.
Furthermore, a reinforcing ring (not labeled) is arranged at the bottom of the ring body 51, the inner diameter of the reinforcing ring is the same as the outer diameter of the screw rod 4, and the reinforcing ring can be well reinforced.
Further, the left side of the rotating button 53 is provided with an inner hexagonal bolt opening, and the upper end and the lower end of the left side of the rotating button 53 are arc-shaped.
Furthermore, two bevel gears 56 are symmetrically arranged, and the inclination angle of two ends of each bevel gear 56 is 90 degrees, so that transmission is better performed.
Further, the head and tail ends of the rotating rod 57 are provided with limit bearings (not labeled, as shown in fig. 5), and the rotating rod 57 is installed in a 45-degree inclined manner, so that the rotating rod can rotate well. The upper and lower rotating levers 57 are inclined at 45 degrees in different directions, so that they form an angle of 90 degrees with each other, please refer to fig. 4 in combination.
Further, the diameter of the second toothed disc 58 is eighty percent of the diameter of the first toothed disc 55, and the second toothed disc 58 and the first toothed disc 55 are vertically arranged at 90 degrees, so that better transmission is achieved.
Furthermore, the thread on the inner side of the threaded sleeve 59 is the same as the thread on the outer side of the rubber block 510, and the outer diameter of the threaded sleeve 59 is 1.3 times of the outer diameter of the rubber block 510, so that the threaded sleeve 59 can be well meshed with the rubber block.
Further, the inclination angle of the bottom of the rubber block 510 is 45 degrees, and a limiting ring is arranged at the top of the rubber block 510 to play a limiting role.
Furthermore, the bearing 54 is made of stainless steel and is not easy to rust.
The invention provides a vibration-proof wafer lifting mechanism through improvement, and the working principle is as follows;
firstly, after the base 1 is installed, an external transmission assembly is connected with the transmission case 2, so that a gear inside the transmission case 2 drives the screw rod 4 to rotate, and the screw rod 4 drives the top ring body 51 to move up and down under the fixation of the cover body 3;
secondly, when the wafer is placed into the placing groove 52 for fixing, the rotating button 53 is rotated by using an external tool, then the first fluted disc 55 rotates to drive the hammer gear 56 to rotate, and at the moment, the second fluted disc 58 rotates to drive the threaded sleeve 59 to rotate, so that the two rubber blocks 510 are screwed out to clamp and fix the wafer which is not formed outside, and displacement is prevented;
thirdly, while the rotating button 53 rotates, the right side rotates in a limiting way through the bearing 54, so that the rotating button 53 rotates more stably, the bevel gear 56 plays a good role in transmission, and the rotating rod 57 is used for fixing the bevel gear 56.
The invention provides a vibration-proof wafer lifting mechanism through improvement, a fixing mechanism 5 is arranged, an external tool is used for rotating a rotating button 53 during fixing, then a first fluted disc 55 rotates to drive a hammer-shaped gear 56 to rotate, and at the moment, a second fluted disc 58 rotates and drives a threaded sleeve 59 to rotate, so that two rubber blocks 510 are screwed out to clamp and fix an external unformed wafer, and displacement is prevented, the problems that the wafer is inconvenient to fix during use of the existing lifting mechanism, and the wafer is easy to displace, drop and damage during lifting are solved, and the rotating button 53 rotates and the right side is limited and rotated through a bearing 54 by virtue of the bearing 54, so that the rotation is more stable.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A vibration-proof wafer lifting mechanism comprises a base (1), wherein the upper end of the base (1) is respectively connected with a transmission box (2) and a cover body (3), and the inner side of the cover body (3) is in sliding fit with a screw rod (4);
the method is characterized in that: the screw rod (4) is connected with the fixing mechanism (5), the fixing mechanism (5) comprises a ring body (51), a placing groove (52), a rotating button (53), a bearing (54), a first fluted disc (55), a bevel gear (56), a rotating rod (57), a second fluted disc (58), a threaded sleeve (59) and a rubber block (510), the bottom of the ring body (51) is connected with the screw rod (4), the placing groove (52) is formed in the middle of the ring body (51), the right side of the rotating button (53) is in rotating fit with the inside of the ring body (51) through the bearing (54), the circle center of the first fluted disc (55) is fastened in the middle of the rotating button (53), and the bevel gear (56) is in rotating fit with the upper end and the lower end of the inside of the ring body (51) through the rotating rod (57), and both ends of the conical gear (56) are respectively meshed with the first fluted disc (55) and the second fluted disc (58), the top of the threaded sleeve (59) is in running fit with the ring body (51) through a bearing, the middle of the threaded sleeve (59) is fastened with the second fluted disc (58), and the top of the rubber block (510) is in sliding fit with the threaded sleeve (59).
2. The vibration-proof wafer lift mechanism according to claim 1, wherein: and a reinforcing ring is arranged at the bottom of the ring body (51), and the inner diameter of the reinforcing ring is the same as the outer diameter of the screw rod (4).
3. The vibration-proof wafer lift mechanism according to claim 1, wherein: the left side of the rotating button (53) is provided with an inner hexagonal bolt port, and the upper end and the lower end of the left side of the rotating button (53) are arc-shaped.
4. The vibration-proof wafer lift mechanism according to claim 1, wherein: the two conical gears (56) are symmetrically arranged, and the inclination angle of two ends of each conical gear (56) is 90 degrees.
5. The vibration-proof wafer lift mechanism according to claim 1, wherein: and the head and the tail of the rotating rod (57) are both provided with limiting bearings, and the rotating rod (57) is installed in a 45-degree inclined mode.
6. The vibration-proof wafer lift mechanism according to claim 1, wherein: the second cog (58) diameter is eighty percent of the first cog (55) diameter, and the second cog (58) and the first cog (55) are vertically mounted at 90 degrees.
7. The vibration-proof wafer lift mechanism according to claim 1, wherein: the thread on the inner side of the thread sleeve (59) is the same as the thread on the outer side of the rubber block (510), and the outer diameter of the thread sleeve (59) is 1.3 times of the outer diameter of the rubber block (510).
8. The vibration-proof wafer lift mechanism according to claim 1, wherein: the inclination angle of the bottom of the rubber block (510) is 45 degrees, and a limit ring is arranged at the top of the rubber block (510).
9. The vibration-proof wafer lift mechanism according to claim 1, wherein: the side surface of the transmission case (2) is connected with the base (1) through a wedge-shaped reinforcing structure.
10. The vibration-proof wafer lift mechanism according to claim 1, wherein: the rubber block (510) is of a bullet-shaped structure and is provided with a tip part and a body part, and the tip part extends into the placing groove (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010761204.2A CN111834282A (en) | 2020-07-31 | 2020-07-31 | Vibration-proof wafer lifting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010761204.2A CN111834282A (en) | 2020-07-31 | 2020-07-31 | Vibration-proof wafer lifting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111834282A true CN111834282A (en) | 2020-10-27 |
Family
ID=72920835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010761204.2A Pending CN111834282A (en) | 2020-07-31 | 2020-07-31 | Vibration-proof wafer lifting mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN111834282A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013082A (en) * | 2021-03-01 | 2021-06-22 | 晋美玉 | Fixture mechanism for wafer detection |
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|---|---|---|---|---|
| KR200472259Y1 (en) * | 2013-07-24 | 2014-04-14 | 주식회사 팀스핀들 | Wafer fixing apparatus |
| CN105023875A (en) * | 2015-07-29 | 2015-11-04 | 沈阳拓荆科技有限公司 | Wafer lifting mechanism |
| CN110148573A (en) * | 2019-04-17 | 2019-08-20 | 欧金森 | A kind of wafer elevating device of semiconductor equipment process cavity |
| CN209592004U (en) * | 2019-04-03 | 2019-11-05 | 杭州载力科技有限公司 | A kind of positioning fixture that semiconductor crystal wafer equipment is carried |
| CN110671439A (en) * | 2019-11-06 | 2020-01-10 | 江苏科技大学 | Elastic coupling for motor |
| CN110890308A (en) * | 2018-09-07 | 2020-03-17 | 长鑫存储技术有限公司 | Wafer bearing device, glue coating developing equipment and glue coating developing method |
| CN111312644A (en) * | 2020-02-26 | 2020-06-19 | 厦门通富微电子有限公司 | Automatic wafer alignment device and etching machine |
| CN212625531U (en) * | 2020-07-31 | 2021-02-26 | 芯米(厦门)半导体设备有限公司 | Vibration-proof wafer lifting mechanism |
-
2020
- 2020-07-31 CN CN202010761204.2A patent/CN111834282A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200472259Y1 (en) * | 2013-07-24 | 2014-04-14 | 주식회사 팀스핀들 | Wafer fixing apparatus |
| CN105023875A (en) * | 2015-07-29 | 2015-11-04 | 沈阳拓荆科技有限公司 | Wafer lifting mechanism |
| CN110890308A (en) * | 2018-09-07 | 2020-03-17 | 长鑫存储技术有限公司 | Wafer bearing device, glue coating developing equipment and glue coating developing method |
| CN209592004U (en) * | 2019-04-03 | 2019-11-05 | 杭州载力科技有限公司 | A kind of positioning fixture that semiconductor crystal wafer equipment is carried |
| CN110148573A (en) * | 2019-04-17 | 2019-08-20 | 欧金森 | A kind of wafer elevating device of semiconductor equipment process cavity |
| CN110671439A (en) * | 2019-11-06 | 2020-01-10 | 江苏科技大学 | Elastic coupling for motor |
| CN111312644A (en) * | 2020-02-26 | 2020-06-19 | 厦门通富微电子有限公司 | Automatic wafer alignment device and etching machine |
| CN212625531U (en) * | 2020-07-31 | 2021-02-26 | 芯米(厦门)半导体设备有限公司 | Vibration-proof wafer lifting mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013082A (en) * | 2021-03-01 | 2021-06-22 | 晋美玉 | Fixture mechanism for wafer detection |
| CN113013082B (en) * | 2021-03-01 | 2022-09-13 | 深圳市容微精密电子有限公司 | Fixture mechanism for wafer detection |
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