CN111833758A - Video Wall - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及一种拼接显示装置,且特别是涉及一种具有光学结构的拼接显示装置。The present invention relates to a splicing display device, and in particular, to a splicing display device with an optical structure.
背景技术Background technique
包含显示面板在内的电子产品,如智能手机、平板电脑、笔记本电脑、显示器和电视,已成为现代社会不可或缺的必需品。随着这种便携式电子产品的蓬勃发展,消费者对这些产品的质量,功能或价格抱有很高的期望。Electronic products, including display panels, such as smartphones, tablets, laptops, monitors, and TVs, have become indispensable necessities in modern society. With the boom in such portable electronics, consumers have high expectations for the quality, functionality or price of these products.
次毫米发光二极管(mini LED)及微型发光二极管(micro LED)技术是近年来兴起的平板显示装置技术,次毫米发光二极管及微型发光二极管显示装置可产生具有广视角、高亮度、以及高对比度的无缝影像。然而,次毫米发光二极管及微型发光二极管技术应用于大尺寸的显示面板时,大多需采用拼接方式达成。随着解析度的要求增加,发光二极管的间距随之减小,也因此限制了面板拼接接合处的可用空间。Sub-millimeter light emitting diode (mini LED) and micro light emitting diode (micro LED) technology are flat panel display device technologies emerging in recent years. seamless image. However, when the sub-millimeter light emitting diode and micro light emitting diode technology is applied to a large-size display panel, it is mostly achieved by splicing. As resolution requirements increase, the spacing of LEDs decreases, which limits the space available for panel splicing joints.
虽然现存的拼接显示装置可大致满足它们原先预定的用途,但其仍未在各个方面皆彻底地符合需求。因此,发展出可改善拼接显示装置的品质或可靠度的结构设计仍为目前业界致力研究的课题之一。Although existing video wall devices can generally meet their original intended use, they have not yet fully met the requirements in every respect. Therefore, developing a structural design that can improve the quality or reliability of the video tiled display device is still one of the current research topics in the industry.
发明内容SUMMARY OF THE INVENTION
根据本发明一些实施例,提供一种拼接显示装置,包含:主要支撑基板、第一显示基板以及第二显示基板。第一显示基板设置于主要支撑基板上,第二显示基板设置于主要支撑基板上且邻近于第一显示基板。且主要支撑基板包含光反射抑制结构,且于拼接显示装置的上视方向上,光反射抑制结构与第一显示基板以及第二显示基板之间的间隙重叠。According to some embodiments of the present invention, a tiled display device is provided, including: a main support substrate, a first display substrate, and a second display substrate. The first display substrate is disposed on the main support substrate, and the second display substrate is disposed on the main support substrate and adjacent to the first display substrate. The main support substrate includes a light reflection suppression structure, and in the top view direction of the tiled display device, the light reflection suppression structure overlaps with the gap between the first display substrate and the second display substrate.
附图说明Description of drawings
为让本发明的上述目的、特征和优点能更明显易懂,以下结合附图对本发明的具体实施方式作详细说明,其中:In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:
图1显示根据本发明一些实施例中,拼接显示装置的上视结构示意图;FIG. 1 shows a top-view structural schematic diagram of a splicing display device according to some embodiments of the present invention;
图2~图9显示根据本发明一些实施例中,图1中沿着截线A-A’的剖面结构示意图;Figures 2 to 9 show schematic cross-sectional structures along the section line A-A' in Figure 1 according to some embodiments of the present invention;
图10显示根据本发明一些实施例中,拼接显示装置的主要支撑基板的结构示意图。10 shows a schematic structural diagram of a main supporting substrate of a tiled display device according to some embodiments of the present invention.
符号说明Symbol Description
100R 光学结构;100R optical structure;
100RA 第一部分;100R A Part I;
100RB 第二部分;100R B Part II;
102 主要支撑基板;102 Main support substrate;
102A 第一子支撑基板;102A the first sub-support substrate;
102B 第二子支撑基板;102B the second sub-support substrate;
102b 底表面;102b bottom surface;
102s、102s’ 侧表面;102s, 102s’ side surface;
102t 顶表面;102t top surface;
200 显示元件;200 display elements;
202A 第一显示基板;202A a first display substrate;
202As、202Bs 侧表面;202As, 202Bs side surface;
202B 第二显示基板;202B the second display substrate;
204 电路层;204 circuit layer;
206 显示层;206 display layer;
302 接合层;302 bonding layer;
A-A’ 截线;A-A’ stub;
d1、d2 距离;d 1 , d 2 distance;
GP 间隙;GP clearance;
P1、P2、P3、P1’、P2’、P3’ 端点;P 1 , P 2 , P 3 , P 1 ′, P 2 ′, P 3 ′ endpoints;
T 厚度;T thickness;
θ1、θ2 夹角。The included angle between θ 1 and θ 2 .
具体实施方式Detailed ways
以下针对本发明实施例的拼接显示装置以及其制造方法作详细说明。应了解的是,以下的叙述提供许多不同的实施例或例子,用以实施本发明一些实施例的不同形态。以下所述特定的元件及排列方式仅为简单清楚描述本发明一些实施例。当然,这些仅用以举例而非本发明的限定。此外,在不同实施例中可能使用类似及/或对应的标号标示类似及/或对应的元件,以清楚描述本发明。然而,这些类似及/或对应的标号的使用仅为了简单清楚地叙述本发明一些实施例,不代表所讨论的不同实施例及/或结构之间具有任何关联性。The splicing display device and the manufacturing method thereof according to the embodiments of the present invention will be described in detail below. It should be appreciated that the following description provides many different embodiments or examples for implementing various aspects of some embodiments of the present invention. The specific elements and arrangements described below are intended to simply and clearly describe some embodiments of the present invention. Of course, these are only used as examples rather than limitations of the present invention. Furthermore, similar and/or corresponding reference numerals may be used in different embodiments to designate similar and/or corresponding elements in order to clearly describe the present invention. However, the use of these similar and/or corresponding reference numbers is merely for the purpose of simply and clearly describing some embodiments of the present invention and does not imply any association between the different embodiments and/or structures discussed.
应理解的是,附图的元件或装置可以发明所属技术领域技术人员所熟知的各种形式存在。此外实施例中可能使用相对性用语,例如「较低」或「底部」或「较高」或「顶部」,以描述附图的一个元件对于另一元件的相对关系。可理解的是,如果将附图的装置翻转使其上下颠倒,则所叙述在「较低」侧的元件将会成为在「较高」侧的元件。本发明实施例可配合附图一并理解,本发明的附图亦被视为发明说明的一部分。应理解的是,本发明的附图并未按照比例绘制,事实上,可能任意的放大或缩小元件的尺寸以便清楚表现出本发明的特征。It should be understood that the elements or devices of the figures may exist in various forms known to those skilled in the art to which the invention pertains. In addition, relative terms, such as "lower" or "bottom" or "higher" or "top" may be used in embodiments to describe the relative relationship of one element of the figures to another element. It will be understood that if the device of the figures were turned upside down, elements described on the "lower" side would become elements on the "upper" side. The embodiments of the present invention can be understood together with the accompanying drawings, and the accompanying drawings of the present invention are also regarded as a part of the description of the invention. It is to be understood that the drawings of the present invention are not to scale and, in fact, the dimensions of elements may be arbitrarily enlarged or reduced in order to clearly represent the features of the present invention.
再者,当述及一第一材料层设置于一第二材料层上或之上时,包括第一材料层与第二材料层直接接触的情形。或者,亦可能间隔有一或更多其它材料层的情形,在此情形中,第一材料层与第二材料层之间可能不直接接触。Furthermore, when it is mentioned that a first material layer is disposed on or above a second material layer, it includes the situation that the first material layer and the second material layer are in direct contact. Alternatively, one or more layers of other materials may be spaced apart, in which case the first and second layers of material may not be in direct contact.
此外,附图的元件或装置可以发明所属技术领域技术人员所熟知的各种形式存在。此外,应理解的是,虽然在此可使用用语「第一」、「第二」、「第三」等来叙述各种元件、组件、或部分,这些元件、组件或部分不应被这些用语限定。这些用语仅是用来区别不同的元件、组件、区域、层或部分。因此,以下讨论的一第一元件、组件、区域、层或部分可在不偏离本发明的教示的情况下被称为一第二元件、组件、区域、层或部分。Furthermore, the elements or devices of the drawings may exist in various forms known to those skilled in the art to which the invention pertains. In addition, it will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, or sections, these elements, components, or sections should not be replaced by these terms limited. These terms are only used to distinguish between different elements, components, regions, layers or sections. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
在文中,「实质上」的用语通常表示在一给定值或范围的20%内,或10%内,或5%内,或3%之内,或2%之内,或1%之内,或0.5%之内。在此给定的数量为大约的数量,亦即在没有特定说明「实质上」的情况下,仍可隐含「实质上」的含义。In the text, the term "substantially" usually means within 20%, or within 10%, or within 5%, or within 3%, or within 2%, or within 1% of a given value or range , or within 0.5%. The quantity given here is an approximate quantity, that is, the meaning of "substantially" can still be implied if "substantially" is not specifically stated.
在本发明一些实施例中,关于接合、连接的用语例如「连接」、「互连」等,除非特别定义,否则可指两个结构是直接接触,或者亦可指两个结构并非直接接触,其中有其它结构设于此两个结构之间。且此关于接合、连接的用语亦可包括两个结构都可移动,或者两个结构都固定的情况。In some embodiments of the present invention, terms related to joining and connecting, such as "connection", "interconnection", etc., unless otherwise defined, may mean that the two structures are in direct contact, or may also mean that the two structures are not in direct contact, There are other structures located between these two structures. And the terms of joining and connecting can also include the case where both structures are movable, or both structures are fixed.
除非另外定义,在此使用的全部用语(包含技术及科学用语)具有与本发明所属技术领域的技术人员通常理解的相同涵义。能理解的是,这些用语例如在通常使用的字典中定义用语,应被解读成具有与相关技术及本发明的背景或上下文一致的意思,而不应以一理想化或过度正式的方式解读,除非在本发明实施例有特别定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the relevant art and the background or context of the present invention, and should not be interpreted in an idealized or overly formal manner, Unless otherwise defined in the embodiments of the present invention.
根据本发明一些实施例,提供的拼接显示装置包含光学结构,光学结构可改变光的路径或降低光反射强度。在一些实施例中,光学结构可例如为光反射抑制结构(lightrefection reduction structure),光反射抑制结构可降低环境光于显示器拼接处所产生的反射光,减少环境光对于显示器所呈现的影像品质的干扰,以下以光反射抑制结构为例。本案中所述的「光反射抑制」,是指光源(可例如为环境光)反射光的频谱积分值小于入射光频谱积分值,在一些实施例中,光源可包含可见光(例如波长介于380nm至780nm之间)或紫外光(例如波长小于365nm),但不限于此,意即当光源为可见光时,波长380nm至波长780nm范围内的反射光频谱积分值小于相同范围内的入射光频谱积分值。According to some embodiments of the present invention, a tiled display device is provided that includes an optical structure that can change the path of light or reduce the intensity of light reflection. In some embodiments, the optical structure can be, for example, a lightrefection reduction structure, which can reduce the reflected light generated by ambient light at the display splicing place, and reduce the interference of ambient light on the image quality presented by the display , and the light reflection suppression structure is taken as an example below. The "light reflection suppression" mentioned in this case means that the spectral integral value of the reflected light from the light source (such as ambient light) is smaller than the spectral integral value of the incident light. In some embodiments, the light source may include visible light (such as wavelengths between 380nm between 780nm and 780nm) or ultraviolet light (such as wavelength less than 365nm), but not limited to this, that is, when the light source is visible light, the spectral integral value of reflected light in the range of wavelength 380nm to wavelength 780nm is smaller than the spectral integral of incident light in the same range value.
请参照图1,图1显示根据本发明一些实施例中,拼接显示装置10的上视结构示意图。应理解的是,为了清楚说明,图1中仅示出拼接显示装置10的部分元件。再者,根据一些实施例,可添加额外的特征于以下所述的拼接显示装置10。在另一些实施例中,以下所述拼接显示装置10的部分特征可以被取代或省略。Please refer to FIG. 1 . FIG. 1 shows a schematic top-view structure diagram of a
如图1所示,根据一些实施例,拼接显示装置10可包含多个显示单元100,显示单元100彼此相邻排列。在一些实施例中,显示单元100可包含主要支撑基板102以及显示元件200,显示元件200可设置于主要支撑基板102上。在一些实施例中,主要支撑基板102的尺寸可大于显示元件200(例如图2,显示基板202A或202B)的尺寸,例如,从拼接显示装置10的上视视角观察,至少一部分的主要支撑基板102突出于显示元件200,例如,主要支撑基板102的四个边可沿着图中的X方向或Y方向突出于显示元件200,且主要支撑基板102可作为显示单元100之间相互连接的主要基板。在一些实施例中,由于主要支撑基板102的尺寸大于显示元件200的尺寸,主要支撑基板102之间的拼接部分TP可能并未被显示元件200覆盖,因此,环境光可能会照射到拼接部分TP。As shown in FIG. 1 , according to some embodiments, the
请参照图2,图2显示根据本发明一些实施例中,图1中沿着截线A-A’的剖面结构示意图。应理解的是,图1中的两种截线A-A’均可对应于图2所示的剖面结构,后续的图3至图9亦同。如图2所示,在一些实施例中,拼接显示装置10可包含主要支撑基板102以及多个显示元件200,显示元件200可设置于主要支撑基板102上。Please refer to FIG. 2. FIG. 2 shows a schematic diagram of a cross-sectional structure along the section line A-A' in FIG. 1 according to some embodiments of the present invention. It should be understood that, both of the two sectional lines A-A' in Fig. 1 can correspond to the cross-sectional structure shown in Fig. 2, and the same is true for the subsequent Fig. 3 to Fig. 9 . As shown in FIG. 2 , in some embodiments, the
在一些实施例中,显示元件200可包含液晶显示(liquid-crystal display,LCD)装置、发光二极管(light-emitting diode,LED)装置、量子点装置、荧光(fluorescence)装置、磷光(phosphor)装置、具有其它合适显示介质的装置、或前述的组合,但不限于此。根据一些实施例,发光二极管显示装置可例如包含有机发光二极管(organic light-emittingdiode,OLED)、量子点发光二极管(quantum dot light-emitting diode,QLED)、次毫米发光二极管(mini light-emitting diode,mini LED)、微型发光二极管(micro light-emitting diodes,micro LED)、或前述的组合,但不限于此。In some embodiments, the
此外,在一些实施例中,拼接显示装置10可进一步包含设置于主要支撑基板102与显示元件200之间的接合层302。在一些实施例中,接合层302可包含粘着材料、机械固定元件、或前述的组合,但不限于此。Furthermore, in some embodiments, the
如图2所示,在一些实施例中,显示元件200可包含显示基板(显示基板202A或202B)、电路层204及显示层206。在一些实施例中,电路层204以及显示层206可设置于显示基板上,且电路层204可设置于显示基板与显示层206之间。As shown in FIG. 2 , in some embodiments, the
应理解的是,本发明附图所示出的实施例是以次毫米发光二极管或微型发光二极管作为显示元件200以进行说明,但根据本发明一些实施例,显示元件200可为前述任一种显示元件或其组合。此外,显示元件200的结构可以发明所属技术领域技术人员所熟知的各种形式存在,在此便不赘述。It should be understood that the embodiments shown in the drawings of the present invention use sub-millimeter light emitting diodes or micro light emitting diodes as the
此外,为了清楚说明不同显示元件200中的显示基板与主要支撑基板102的位置关系,本文中进一步将不同显示元件200中的显示基板标示为第一显示基板202A及第二显示基板202B。如图2所示,在一些实施例中,第一显示基板202A以及第二显示基板202B可设置于主要支撑基板102上,且第二显示基板202B可邻近于第一显示基板202A。In addition, in order to clearly illustrate the positional relationship between the display substrates in the
在一些实施例中,第一显示基板202A以及第二显示基板202B之间具有间隙GP,且间隙GP可位于拼接部分TP中。根据一些实施例,间隙GP指的是第一显示基板202A的侧表面202As与第二显示基板202B的侧表面202Bs之间的最小距离。In some embodiments, there is a gap GP between the
值得注意的是,主要支撑基板102包含光学结构100R。在一些实施例中,在拼接显示装置10的上视方向(例如,图中所示出的Z方向)上,光学结构100R与第一显示基板202A以及第二显示基板202B之间的间隙GP至少部分重叠。根据一些实施例,光学结构100R可减少环境光(例如,图中所示的光线L)于间隙GP处(亦即显示器的拼接部分TP)产生反射光。详细而言,根据一些实施例,光学结构100R可减少穿过间隙GP的反射光的产生,借此降低间隙GP处产生亮线进而干扰影像品质的风险。Notably, the
具体而言,光学结构100R为可降低反射光的强度的结构。在一些实施例中,可降低反射光的部分波段强度的结构亦可作为光学结构100R。Specifically, the
如图2所示,在一些实施例中,光学结构100R位于主要支撑基板102的上部部分(upper portion)。在一些实施例中,光学结构100R可包含凹陷结构。在一些实施例中,主要支撑基板102包含顶表面102t以及与顶表面102t连接的侧表面102s,且侧表面102s并未垂直于顶表面102t,使得侧表面102s可作为光学结构100R的一部分。具体而言,由于主要支撑基板102的侧表面102s与顶表面102t并未垂直(亦即主要支撑基板102具有一部分的倾斜表面),因此可有效减少光线L到达主要支撑基板102后所产生的反射光。As shown in FIG. 2 , in some embodiments, the
此外,前述主要支撑基板102的侧表面102s沿上视方向上(例如为Z方向)为与间隙GP至少部分重叠的侧表面。在一些实施例中,主要支撑基板102的顶表面102t与侧表面102s之间具有夹角θ1。在一些实施例中,夹角θ1可大于135度且小于180度(135度<夹角θ1<180度)、或大于140度且小于170度,例如,145度、150度、155度、160度、或165度,但不限于此。在一些实施例中,夹角θ1可大于90度且小于135度(90度<夹角θ1<135度),但不限于此。In addition, the
详细而言,根据一些实施例,夹角θ1指的是主要支撑基板102的顶表面102t上的端点P1与端点P2(例如,于一剖面结构中的顶表面102t的两个端点或是转折点)之间的连线,以及端点P1与侧表面102s上的另一端点P3(例如,于一剖面结构中的侧表面102s的端点或是转折点)之间的连线所形成的夹角。In detail, according to some embodiments, the included angle θ 1 refers to the end point P 1 and the end point P 2 on the
如图2所示,在一些实施例中,主要支撑基板102的下部部分(lower portion)亦可包含凹陷结构。在一些实施例中,主要支撑基板102包含底表面102b以及与底表面102b连接的侧表面102s’,且侧表面102s’并未垂直于底表面102b。根据一些实施例,主要支撑基板102于下部部分具有凹陷结构,借此可提升拼接显示装置10的后续组装制程的效率。As shown in FIG. 2 , in some embodiments, the lower portion of the
在一些实施例中,主要支撑基板102的侧表面102s’为与间隙GP至少部分重叠的侧表面。在一些实施例中,主要支撑基板102的底表面102b与侧表面102s’之间具有夹角θ2。在一些实施例中,夹角θ2的范围可大于90度且小于180度(90度<夹角θ2<180度)。在一些实施例中,夹角θ2可等于90度。此外,夹角θ1可与夹角θ2相同或不同。In some embodiments, the
根据一些实施例,夹角θ2指的是主要支撑基板102的底表面102b上的端点P1’与端点P2’(例如,于一剖面结构中的底表面102b的两个端点或是转折点)之间的连线,以及端点P1’与侧表面102s’上的另一端点P3’(例如,于一剖面结构中的侧表面102s’的端点或是转折点,也可例如为侧表面102AS连接侧表面102s’的端点或转折点)之间的连线所形成的夹角。According to some embodiments, the included angle θ 2 refers to the end point P 1 ′ and the end point P 2 ′ on the
此外,根据本发明实施例,可使用光学显微镜(optical microscopy,OM)、扫描式电子显微镜(scanning electron microscope,SEM)、角度测量仪、或其它合适的方式量测前述夹角θ1及夹角θ2,但本发明不限于此。详细而言,在一些实施例中,可使用扫描式电子显微镜取得结构的剖面影像,并使用角度测量仪量测夹角θ1及夹角θ2。In addition, according to an embodiment of the present invention, an optical microscope (OM), a scanning electron microscope (SEM), an angle measuring instrument, or other suitable methods can be used to measure the aforementioned included angle θ 1 and the included angle θ 2 , but the present invention is not limited thereto. Specifically, in some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image of the structure, and a goniometer can be used to measure the included angle θ 1 and the included angle θ 2 .
此外,主要支撑基板102可包含可挠基板或不可挠基板。在一些实施例中,主要支撑基板102的材料可包含金属、塑胶、玻璃、石英、蓝宝石、陶瓷、碳纤维、其它合适的作为基板材料、或前述的组合,但不限于此。在一些实施例中,前述金属的材料可包含铝(Al)、铜(Cu)、钼(Mo)、银(Ag)、锡(Sn)、钨(W)、金(Au)、铬(Cr)、镍(Ni)、铂(Pt)、铝合金、铜合金、钼合金、银合金、锡合金、钨合金、金合金、铬合金、镍合金、铂合金、其它合适的金属材料、或前述的组合,但不限于此。在一些实施例中,前述塑胶的材料可包含聚酰亚胺(polyimine,PI)、聚乙烯对苯二甲酸酯(polyethylene terephthalate,PET)、聚碳酸酯(polycarbonate,PC)、其它合适的材料、或前述的组合,但不限于此。此外,在一些实施例中,主要支撑基板102可包含金属-玻璃纤维复合板材、或金属-陶瓷复合板材,但不限于此。Furthermore, the
再者,主要支撑基板102可具有厚度T。在一些实施例中,主要支撑基板102的厚度T的范围可介于500微米(μm)至5毫米(mm)之间(500μm≦厚度T≦5mm)、或介于1毫米至4毫米之间,例如,1.5毫米、2毫米、2.5毫米、3毫米、或3.5毫米,但不限于此。应理解的是,根据不同类型的显示装置,厚度T可具有其它合适的范围,本发明不以此为限。Also, the
根据一些实施例,主要支撑基板102的厚度T指的是,于主要支撑基板102的底表面102b的法线方向(例如,图中所示出的Z方向)上,主要支撑基板102的最大厚度。此外,应理解的是,若主要支撑基板102的厚度T过薄(例如,小于500μm)则可能无法提供充足的支撑作用。According to some embodiments, the thickness T of the
根据本发明实施例,可使用光学显微镜(optical microscopy,OM)、扫描式电子显微镜(scanning electron microscope,SEM)、薄膜厚度轮廓测量仪(α-step)、椭圆测厚仪、或其它合适的方式量测各元件的厚度、长度或各元件之间的距离等,但本发明不限于此。详细而言,在一些实施例中,可使用扫描式电子显微镜取得结构的剖面影像,并使用合适的仪器量测各元件于影像中的厚度、宽度或元件之间的距离。According to the embodiments of the present invention, an optical microscope (OM), a scanning electron microscope (SEM), a film thickness profiler (α-step), an ellipsometer, or other suitable methods may be used. The thickness and length of each element or the distance between each element are measured, but the present invention is not limited thereto. In detail, in some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image of the structure, and a suitable instrument can be used to measure the thickness, width, or distance between elements in the image.
此外,在一些实施例中,显示基板202(第一显示基板202A以及第二显示基板202B)的材料可包含塑胶、玻璃、石英、蓝宝石、陶瓷、碳纤维、其它合适的作为基板材料、或前述的组合,但不限于此。在一些实施例中,前述塑胶的材料可包含聚酰亚胺(polyimine,PI)、聚乙烯对苯二甲酸酯(polyethylene terephthalate,PET)、聚碳酸酯(polycarbonate,PC)、其它合适的材料、或前述的组合,但不限于此。此外,在一些实施例中,显示基板202可包含金属-玻璃纤维复合板材、或金属-陶瓷复合板材,但不限于此。此外,主要支撑基板102的材料可与显示基板202的材料相同或不同。In addition, in some embodiments, the material of the display substrate 202 (the
再者,在一些实施例中,可对主要支撑基板102实行磨削制程(grindingprocess)、研磨制程(lapping process)、抛光制程(polishing process)、铣削制程(milling process)、或前述的组合,以形成前述光学结构100R。在另一些实施例中,可使用模具以及射出成型等制程形成具有光学结构100R的主要支撑基板102,但不限于此。Furthermore, in some embodiments, a grinding process, a lapping process, a polishing process, a milling process, or a combination of the foregoing may be performed on the
接着,请参照图3,图3显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。应理解的是,后文中与前文相同或相似的组件或元件将以相同或相似的标号表示,其材料、制造方法与功能皆与前文所述相同或相似,故此部分于后文中将不再赘述。Next, please refer to FIG. 3 . FIG. 3 shows a schematic cross-sectional structure diagram along the section line A-A' in FIG. 1 according to other embodiments of the present invention. It should be understood that in the following, the same or similar components or elements as the previous ones will be denoted by the same or similar reference numerals, and their materials, manufacturing methods and functions are the same or similar to the previous ones, so this part will not be repeated hereafter. .
如图3所示,根据一些实施例,主要支撑基板102可包含多个子支撑基板。例如,在一些实施例中,主要支撑基板102可包含第一子支撑基板102A以及第二子支撑基板102B,第一显示基板202A可设置于第一子支撑基板102A上,且第二显示基板202B可设置于第二子支撑基板102B上。As shown in FIG. 3, according to some embodiments, the
在一些实施例中,拼接显示装置10的光学结构100R可包含第一部分100RA以及第二部分100RB,且第一部分100RA可为第一子支撑基板102A的一部分,第二部分100RB可为第二子支撑基板102B的一部分。此外,于拼接显示装置10的上视方向(例如,图中所示出的Z方向)上,光学结构100R的第一部分100RA及第二部分100RB亦与间隙GP至少部分重叠。In some embodiments, the
在一些实施例中,第一部分100RA位于第一子支撑基板102A的上部部分,第二部分100RB位于第二子支撑基板102B的上部部分。在一些实施例中,光学结构100R的第一部分100RA以及第二部分100RB可包含倒角(chamfer)结构。In some embodiments, the
具体而言,第一子支撑基板102A以及第二子支撑基板102B各自可包含顶表面102t以及与顶表面102t连接的侧表面102s,且侧表面102s并未垂直于顶表面102t,使得侧表面102s可分别作为光学结构100R的第一部分100RA及第二部分100RB。如同前述,由于第一子支撑基板102A以及第二子支撑基板102B的侧表面102s与顶表面102t并未垂直(包含倒角结构),因此可有效减少光线L到达第一子支撑基板102A以及第二子支撑基板102B后所产生的反射光。Specifically, each of the first
此外,前述第一子支撑基板102A以及第二子支撑基板102B的侧表面102s为与间隙GP至少部分重叠的侧表面。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的顶表面102t与侧表面102s之间分别具有夹角θ1。在一些实施例中,夹角θ1可大于135度且小于180度(135度<夹角θ1<180度)、或大于140度且小于170度,例如,145度、150度、155度、160度、或165度,但不限于此。In addition, the side surfaces 102s of the aforementioned first
详细而言,根据一些实施例,夹角θ1指的是第一子支撑基板102A以及第二子支撑基板102B的顶表面102t上的端点P1与端点P2(例如,于一剖面结构中的顶表面102t的两个端点或是转折点)之间的连线,以及端点P1与侧表面102s上的另一端点P3(例如,于一剖面结构中的侧表面102s的端点或是转折点,也可例如为侧表面102AS连接侧表面102s的端点或转折点)之间的连线所形成的夹角。In detail, according to some embodiments, the included angle θ 1 refers to the end points P 1 and P 2 on the
再者,如图3所示,在一些实施例中,第一子支撑基板102A及/或第二子支撑基板102B的下部部分亦可具有倒角结构。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B各自包含底表面102b以及与底表面102b连接的侧表面102s’,且侧表面102s’并未垂直于底表面102b。根据一些实施例,第一子支撑基板102A以及第二子支撑基板102B于下部部分具有倒角结构,借此可提升拼接显示装置10的后续组装制程的效率。Furthermore, as shown in FIG. 3 , in some embodiments, the lower portion of the first
在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的侧表面102s’为与间隙GP至少部分重叠的侧表面。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的底表面102b与侧表面102s’之间分别具有夹角θ2。在一些实施例中,夹角θ2的范围可大于90度且小于180度(90度<夹角θ2<180度)。在一些实施例中,夹角θ2可等于90度(亦即不具有倒角)。此外,夹角θ1可与夹角θ2相同或不同。In some embodiments, the side surfaces 102s' of the first
根据一些实施例,夹角θ2指的是第一子支撑基板102A以及第二子支撑基板102B的底表面102b上的端点P1’与端点P2’(例如,于一剖面结构中的底表面102b的两个端点或是转折点)之间的连线,以及端点P1’与侧表面102s’上的另一端点P3’(例如,于一剖面结构中的侧表面102s’的端点或是转折点,也可例如为侧表面102AS连接侧表面102s’的端点或转折点)之间的连线所形成的夹角。According to some embodiments, the included angle θ 2 refers to the end point P 1 ′ and the end point P 2 ′ on the bottom surfaces 102b of the first
如图3所示,在一些实施例中,第一子支撑基板102A可具有另一侧表面102As,第二子支撑基板102B可具有另一侧表面102Bs,且侧表面102As与侧表面102Bs相对设置。此外,侧表面102As以及侧表面102Bs亦与间隙GP至少部分重叠。As shown in FIG. 3 , in some embodiments, the first
在一些实施例中,第一子支撑基板102A的侧表面102As与第一显示基板202A的侧表面202As之间可相隔距离d1,亦即,相较于第一显示基板202A的侧表面202As,第一子支撑基板102A的侧表面102As突出距离d1。在一些实施例中,相较于第一显示基板202A的外侧表面(与侧表面202As相对的表面,未标示),第一子支撑基板102A的外侧表面(与侧表面102As相对的表面,未标示)亦可突出一段距离。在一些实施例中,第二子支撑基板102B的侧表面102Bs与第二显示基板202B的侧表面202Bs之间可相隔距离d1,亦即,相较于第二显示基板202B的侧表面202Bs,第二子支撑基板102B的侧表面102Bs突出距离d1。在一些实施例中,距离d1小于显示元件200中的发光单元(未示出)的像素间距(pixel pitch)的二分的一(亦即d1<1/2像素间距),使得发光单元于间隙GP处(拼接处)仍可维持一致的像素间距,降低使用者观看时对间隙GP处的缝隙感,以提升显示品质。In some embodiments, the side surface 102As of the first
具体而言,在一些实施例中,距离d1的范围可介于10μm至300μm之间(10μm≦距离d1≦3mm)、介于50μm至250μm之间、或介于100μm至200μm之间。然而,应理解的是,根据不同类型的显示装置,距离d1可具有其它合适的范围,本发明不以此为限。Specifically, in some embodiments, the distance d 1 may range from 10 μm to 300 μm (10 μm≦distance d 1 ≦3mm), from 50 μm to 250 μm, or from 100 μm to 200 μm. However, it should be understood that the distance d 1 may have other suitable ranges according to different types of display devices, and the present invention is not limited thereto.
根据一些实施例,距离d1指的是,垂直于拼接显示装置10的上视方向上(例如,图中所示出的X方向上),上视方向可例如为剖面图(例如图3)中的Z方向,第一子支撑基板102A的侧表面102As与第一显示基板202A的侧表面202As之间的最小距离,或是第二子支撑基板102B的侧表面102Bs与第二显示基板202B的侧表面202Bs之间的最小距离。在一些实施例中,第一子支撑基板102A的距离d1与第二子支撑基板102B的距离d1可相同或不同。According to some embodiments, the distance d 1 refers to a top view direction perpendicular to the video tile 10 (eg, the X direction shown in the figure), which may be, for example, a cross-sectional view (eg, FIG. 3 ) In the Z direction, the minimum distance between the side surface 102As of the first
此外,在一些实施例中,第一子支撑基板102A与第二子支撑基板102B之间可相隔距离d2,且距离d2小于第一显示基板202A与第二显示基板202B之间的间隙GP。在一些实施例中,距离d2可接近于0,亦即,第一子支撑基板102A相当接近第二子支撑基板102B。在一些实施例中,距离d2可趋近或是等于0,亦即,第一子支撑基板102A可与第二子支撑基板102B接触。当距离d2小于间隙GP时,在组装过程中可以降低显示元件200之间因过于接近导致碰撞碎裂的风险。In addition, in some embodiments, the first
根据一些实施例,距离d2指的是,垂直于拼接显示装置10的上视方向上(例如,图中所示出的X方向上),上视方向可例如为剖面图(例如图3)中的Z方向,第一子支撑基板102A的侧表面102As与第二子支撑基板102B的侧表面102Bs之间的最小距离。According to some embodiments, the distance d 2 refers to a top-view direction perpendicular to the video wall 10 (eg, the X-direction shown in the figure), which may be, for example, a cross-sectional view (eg, FIG. 3 ) In the Z direction, the minimum distance between the side surfaces 102As of the first
接着,请参照图4,图4显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图4所示,在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的顶表面102t与侧表面102s之间的夹角θ1可大于90度且小于135度(90度<夹角θ1<135度)、或大于100度且小于120度,例如,95度、100度、105度、110度、或115度,但不限于此。Next, please refer to FIG. 4 . FIG. 4 shows a schematic cross-sectional structure diagram along the section line AA′ in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 4 , in some embodiments, the included angle θ1 between the
相似地,如图4所示,在一些实施例中,光学结构100R可包含第一部分100RA以及第二部分100RB,第一部分100RA以及第二部分100RB可分别位于第一子支撑基板102A以及第二子支撑基板102B的上部部分。此外,于此实施例中,第一子支撑基板102A以及第二子支撑基板102B的侧表面102s与顶表面102t亦未垂直(包含倒角结构),因此可有效减少光线L到达第一子支撑基板102A以及第二子支撑基板102B后所产生的反射光,借此降低间隙GP处产生亮线进而降低影像品质的风险。Similarly, as shown in FIG. 4 , in some embodiments, the
此外,在一些实施例中,第一子支撑基板102A的顶表面102t与另一侧表面102st(位于外侧的侧表面)之间可具有夹角θ1’。在一些实施例中,夹角θ1’可与夹角θ1相同或不同。根据一些实施例,第二子支撑基板102B的夹角θ1’以及夹角θ1亦可具有前述关系。In addition, in some embodiments, the
接着,请参照图5,图5显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图5所示,在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的侧表面102s可包含曲面部分RC。详细而言,在一些实施例中,侧表面102s的曲面部分RC可具有曲率半径r。前述的「曲面部分」是指开始与顶表面102t实质上不平行的部分至开始与侧表面(例如侧表面102As或侧表面102Bs)实质上不平行的部分。在一些实施例中,曲率半径r可大于或等于第一子支撑基板102A的侧表面102As与第一显示基板202A的侧表面202As之间的距离d1,且曲率半径r可小于或等于第一子支撑基板102A以及第二子支撑基板102B的厚度T(亦即d1≦曲率半径r≦T)。Next, please refer to FIG. 5 . FIG. 5 shows a schematic cross-sectional structure diagram along the section line AA′ in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 5 , in some embodiments, the side surfaces 102s of the first
在一些实施例中,曲率半径r指的是,第一子支撑基板102A的顶表面102t上的端点P1与侧表面102s上的另一端点P3之间的曲线(例如,于一剖面结构中的端点P1及端点P3)的曲率半径。详细而言,于此实施例中,端点P1实质上可为顶表面102t上曲率开始不为0的端点,端点P3实质上可为侧表面102s上曲率开始不为0的端点。In some embodiments, the radius of curvature r refers to a curve between the end point P1 on the
于此实施例中,第一子支撑基板102A以及第二子支撑基板102B的侧表面102s与顶表面102t亦未垂直(包含曲面部分RC),因此可有效减少光线L到达第一子支撑基板102A以及第二子支撑基板102B后所产生的反射光,借此降低间隙GP处产生亮线进而干扰影像品质的风险。In this embodiment, the side surfaces 102s and the
接着,请参照图6,图6显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图6所示,根据一些实施例,拼接显示装置10可为曲状的拼接显示器(curved tiled display)。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B可为弯曲状的。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B可具有固定的曲率。Next, please refer to FIG. 6. FIG. 6 shows a schematic cross-sectional structure diagram along the section line A-A' in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 6 , according to some embodiments, the
在一些实施例中,第一子支撑基板102A与第二子支撑基板102B拼接形成凹状的显示结构。例如,第一子支撑基板102A的顶表面102t上的端点P2的水平位置高于端点P1的水平位置。此外,于此实施例中,夹角θ1指的是第一子支撑基板102A的顶表面102t上于端点P1的切线L1(意即顶表面102t上通过端点P1的切线)与侧表面102s之间所形成的夹角。相似地,于此实施例中,夹角θ2指的是,第一子支撑基板102A的底表面102b上于端点P1’的切线L1’与侧表面102s’之间所形成的夹角。再者,根据一些实施例,第二子支撑基板102B的夹角θ1以及夹角θ2亦可以前述方式进行定义。In some embodiments, the first
接着,请参照图7,图7显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图7所示,根据一些实施例,拼接显示装置10可为曲状的拼接显示器。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B可为弯曲状的。在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B可具有固定的曲率。Next, please refer to FIG. 7. FIG. 7 shows a schematic cross-sectional structure diagram along the section line A-A' in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 7 , according to some embodiments, the
在一些实施例中,第一子支撑基板102A与第二子支撑基板102B拼接形成凸状的显示结构。此外,于此实施例中,夹角θ1以及夹角θ2的定义与图6所示实施例中所述者相同,于此便不再重复。In some embodiments, the first
接着,请参照图8,图8显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图8所示,根据一些实施例,光学结构100R的第一部分100RA以及第二部分100RB可包含覆盖层110,覆盖层110可用于吸收部分光线,在一些实施例中,覆盖层110可具有较深颜色而为深色层。换言之,在一些实施例中,第一子支撑基板102A以及第二子支撑基板102B的部分顶表面102t及部分的侧表面102As及侧表面102Bs上可具有覆盖层110,且于拼接显示装置10的上视方向(例如,图中所示出的Z方向)上,覆盖层110与间隙GP重叠。在另一些实施例中,覆盖层110实质上可完整地包覆第一子支撑基板102A以及第二子支撑基板102B。覆盖层110可吸收部分光线,减少间隙GP处产生反射光线。Next, please refer to FIG. 8 . FIG. 8 shows a schematic cross-sectional structure diagram along the section line AA′ in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 8 , according to some embodiments, the
此外,在一些实施例中,第一子支撑基板102A的顶表面102t与侧表面102As之间的夹角θ1实质上可为90度或135度,且第一子支撑基板102A以及第二子支撑基板102B的部分顶表面102t及部分的侧表面102As及侧表面102Bs上具有覆盖层110。于这些实施例中,虽然夹角θ1为90度或135度,但是形成于第一子支撑基板102A以及第二子支撑基板102B的部分顶表面102t及部分的侧表面102As及侧表面102Bs上的覆盖层110可作为光学结构100R,因此仍可有效减少光线L到达第一子支撑基板102A以及第二子支撑基板102B后所产生的反射光。In addition, in some embodiments, the included angle θ1 between the
此外,应理解的是,在一些实施例中,覆盖层110亦可应用于图2所示的具有单一主要支撑基板102的实施例。Furthermore, it should be understood that, in some embodiments, the
在一些实施例中,覆盖层110的反射率可介于0%至10%之间(0%≦反射率≦10%)、介于0.001%至5%之间、或介于0.01%至0.5%之间。本案中所述的「反射率」,是指光源(例如为环境光)反射光的频谱积分值除以入射光频谱积分值的百分比,在一些实施例中,光源可包含可见光(例如波长介于380nm至780nm之间)或紫外光(例如波长小于365nm),但不限于此,举例而言,当光源为可见光时,覆盖层或深色层的反射率是指,波长380nm至波长780nm范围内的反射光频谱积分值除以相同范围内的入射光频谱积分值的百分比介于0%至10%之间。换言之,在一些实施例中,覆盖层110的吸收率可介于90%至100%之间(90%≦吸收率≦100%)、介于95%至100%之间、或介于97%至100%之间。在一些实施例中,覆盖层110可包含基材以及形成于基材中的覆盖颜料,但本发明不限于此。在一些实施例中,前述基材可包含有机树脂、玻璃糊、其它合适的材料、或前述的组合,但不限于此。In some embodiments, the reflectivity of the
在一些实施例中,可借由化学气相沉积制程、涂布制程、蒸镀制程、溅镀制程、贴覆制程、印刷制程、或其它合适的制程形成覆盖层110于第一子支撑基板102A以及第二子支撑基板102B上,但本发明不限于此。此外,在第一子支撑基板102A以及第二子支撑基板102B包含铝的一些实施例中,可借由阳极氧化铝(anodic aluminum oxide,AAO)制程形成覆盖层110。In some embodiments, the
接着,请参照图9,图9显示根据本发明另一些实施例中,图1中沿着截线A-A’的剖面结构示意图。如图9所示,根据一些实施例,覆盖层110可形成于第一子支撑基板102A的侧表面102s以及侧表面102As上,而未形成于第一子支撑基板102A的其它表面上。相似地,根据一些实施例,覆盖层110可形成于第二子支撑基板102B的侧表面102s以及侧表面102Bs上,而未形成于第二子支撑基板102B的其它表面上。再者,于这些实施例中,在拼接显示装置10的上视方向(例如,图中所示出的Z方向)上,覆盖层110亦与间隙GP至少部分重叠。Next, please refer to FIG. 9. FIG. 9 shows a schematic cross-sectional structure diagram along the section line A-A' in FIG. 1 according to other embodiments of the present invention. As shown in FIG. 9 , according to some embodiments, the
接着,请参照图10,图10显示根据本发明一些实施例中,拼接显示装置10的主要支撑基板102的结构示意图。如图10所示,根据一些实施例,光学结构100R(未标示)(例如,第一部分100RA或第二部分100RB)可包含非平坦表面NP。虽然图10中并未标示出部分元件的标号,但可参照上文提供的附图(例如,图3)理解图10与以下说明。Next, please refer to FIG. 10 . FIG. 10 shows a schematic structural diagram of the
此外,图10中标示出端点P1与端点P2(例如,顶表面102t的两个端点或是转折点),以及端点P3(例如,侧表面102s的端点或是转折点,也可例如为侧表面102As连接侧表面102s的端点或转折点),以更清楚阐明本发明实施例中所定义的端点。In addition, FIG. 10 shows the endpoints P 1 and P 2 (for example, the two endpoints or turning points of the
在一些实施例中,主要支撑基板102(或者,第一子支撑基板102A以及第二子支撑基板102B)的部分顶表面102t及部分的侧表面102As及侧表面102s上可具有非平坦表面NP。在一些实施例中,非平坦表面NP可包含波纹状(corrugated)表面、凹凸状表面、其它非平坦的表面型态、或前述的组合。此外,非平坦表面NP的表面型态可为不规则状(如区域R1所示)或规则状(如区域R2所示)。In some embodiments, the main support substrate 102 (or, the first
此外,应理解的是,在一些实施例中,非平坦表面NP亦可应用于图2所示的具有单一主要支撑基板102的实施例。Furthermore, it should be understood that, in some embodiments, the non-planar surface NP may also be applied to the embodiment shown in FIG. 2 having a single
在一些实施例中,前述非平坦表面NP的粗糙度Ra)的范围可介于0.05μm至50μm之间(0.05μm≦Ra≦50μm)、介于1μm至40μm之间、或介于10μm至30μm之间,例如,15μm、20μm、或25μm等。根据一些实施例,可借由原子力显微镜(atomic force microscope)、表面粗糙度量测计、白光干涉仪、激光显微镜、或其它可测量粗糙度的仪器测量非平坦表面NP的粗糙度。In some embodiments, the roughness Ra of the aforementioned non-planar surface NP may range from 0.05 μm to 50 μm (0.05 μm≦R a ≦50 μm), from 1 μm to 40 μm, or from 10 μm Between 30 μm, for example, 15 μm, 20 μm, or 25 μm, etc. According to some embodiments, the roughness of the non-planar surface NPs can be measured by means of an atomic force microscope, a surface roughness meter, a white light interferometer, a laser microscope, or other instruments that can measure roughness.
在一些实施例中,可使用机械或化学方法对主要支撑基板102(或者,第一子支撑基板102A以及第二子支撑基板102B)进行表面粗化处理(surface rougheningtreatment),使其具有合适的粗糙度,以形成非平坦表面NP。此外,在基板的材料包含铝的一些实施例中,可借由阳极氧化铝(anodic aluminum oxide,AAO)制程形成非平坦表面NP。In some embodiments, the main support substrate 102 (or, the first
综上所述,根据本发明一些实施例,提供的拼接显示装置包含光学结构,光学结构可降低环境光于显示器拼接处所产生的反射光,减少环境光对于显示器所呈现的影像品质的干扰。根据一些实施例,光学结构可例如为光反射抑制结构。To sum up, according to some embodiments of the present invention, the splicing display device provided includes an optical structure, and the optical structure can reduce the reflected light generated by the ambient light at the display splicing place, and reduce the interference of the ambient light on the image quality presented by the display. According to some embodiments, the optical structure may eg be a light reflection suppressing structure.
虽然本发明的实施例及其优点已揭露如上,但应该了解的是,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作变动、替代与润饰。本发明各实施例之间的特征只要不违背发明精神或相冲突,均可任意组合搭配使用。此外,本发明的保护范围并未局限于说明书内所述特定实施例中的制程、机器、制造、物质组成、装置、方法及步骤,任何本领域技术人员可从本发明揭示内容中理解现行或未来所发展出的制程、机器、制造、物质组成、装置、方法及步骤,只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本发明使用。因此,本发明的保护范围包括上述制程、机器、制造、物质组成、装置、方法及步骤。另外,每一申请专利范围构成个别的实施例,且本发明的保护范围也包括各个申请专利范围及实施例的组合。本发明的保护范围当视后附的权利要求书所界定的为准。Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that changes, substitutions and modifications can be made by any person skilled in the art without departing from the spirit and scope of the present invention. The features of the various embodiments of the present invention can be used in any combination as long as they do not violate the spirit of the invention or conflict with each other. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and any person skilled in the art can understand current or Processes, machines, manufacturing, material compositions, devices, methods and steps developed in the future can be used according to the present invention as long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claimed scope constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claimed scope and the embodiments. The protection scope of the present invention should be determined by the appended claims.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112908188A (en) * | 2021-02-05 | 2021-06-04 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
CN113724617A (en) * | 2021-09-24 | 2021-11-30 | 京东方科技集团股份有限公司 | Display module, splicing method of splicing display module and display device |
CN114120845A (en) * | 2021-11-30 | 2022-03-01 | 京东方科技集团股份有限公司 | Display module and splicing display device |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1104795A (en) * | 1993-11-13 | 1995-07-05 | 葛晓勤 | Super large screen displaying board |
TW581993B (en) * | 1999-02-15 | 2004-04-01 | Micro Displays Inc | Method for assembling a tiled, flat-panel microdisplay array |
KR20080105616A (en) * | 2007-05-31 | 2008-12-04 | 삼성에스디아이 주식회사 | Film filter and plasma display device having same |
CN102207567A (en) * | 2011-02-18 | 2011-10-05 | 广东威创视讯科技股份有限公司 | Seam-removing device and seamless spliced display device |
CN102272974A (en) * | 2008-11-17 | 2011-12-07 | 全球Oled科技有限责任公司 | Tileable OLED device with edge light extraction |
KR20120026229A (en) * | 2010-09-09 | 2012-03-19 | 삼성전자주식회사 | Optical plate and tiled display device including the same |
CN102654588A (en) * | 2011-03-03 | 2012-09-05 | 夏普株式会社 | Light diffusion member, method of manufacturing same, and display device |
US20130162504A1 (en) * | 2011-12-22 | 2013-06-27 | Masayuki Kawano | Display device |
CN103518233A (en) * | 2011-05-11 | 2014-01-15 | 夏普株式会社 | Display, multi-display system, and method for manufacturing display |
CN104795422A (en) * | 2014-01-21 | 2015-07-22 | 群创光电股份有限公司 | Organic light emitting diode display device |
US20160209665A1 (en) * | 2016-03-29 | 2016-07-21 | Kedrick F. Brown | Auto-multiscopic 3D billboard display system |
CN105869537A (en) * | 2016-06-21 | 2016-08-17 | 深圳市华夏光彩股份有限公司 | Transparent face mask and LED (light-emitting diode) display module employing transparent face mask |
CN106415376A (en) * | 2014-06-13 | 2017-02-15 | 索尼公司 | Light distribution adjustment sheet and display device |
US20180358582A1 (en) * | 2017-06-09 | 2018-12-13 | Revolution Display, Llc | Visual-Display Structure Having a Metal Contrast Enhancer, and Visual Displays Made Therewith |
CN109613758A (en) * | 2019-02-02 | 2019-04-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
-
2019
- 2019-11-12 CN CN201911100379.2A patent/CN111833758B/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1104795A (en) * | 1993-11-13 | 1995-07-05 | 葛晓勤 | Super large screen displaying board |
TW581993B (en) * | 1999-02-15 | 2004-04-01 | Micro Displays Inc | Method for assembling a tiled, flat-panel microdisplay array |
KR20080105616A (en) * | 2007-05-31 | 2008-12-04 | 삼성에스디아이 주식회사 | Film filter and plasma display device having same |
CN102272974A (en) * | 2008-11-17 | 2011-12-07 | 全球Oled科技有限责任公司 | Tileable OLED device with edge light extraction |
KR20120026229A (en) * | 2010-09-09 | 2012-03-19 | 삼성전자주식회사 | Optical plate and tiled display device including the same |
CN102207567A (en) * | 2011-02-18 | 2011-10-05 | 广东威创视讯科技股份有限公司 | Seam-removing device and seamless spliced display device |
CN102654588A (en) * | 2011-03-03 | 2012-09-05 | 夏普株式会社 | Light diffusion member, method of manufacturing same, and display device |
CN103518233A (en) * | 2011-05-11 | 2014-01-15 | 夏普株式会社 | Display, multi-display system, and method for manufacturing display |
US20130162504A1 (en) * | 2011-12-22 | 2013-06-27 | Masayuki Kawano | Display device |
CN104795422A (en) * | 2014-01-21 | 2015-07-22 | 群创光电股份有限公司 | Organic light emitting diode display device |
CN106415376A (en) * | 2014-06-13 | 2017-02-15 | 索尼公司 | Light distribution adjustment sheet and display device |
US20160209665A1 (en) * | 2016-03-29 | 2016-07-21 | Kedrick F. Brown | Auto-multiscopic 3D billboard display system |
CN105869537A (en) * | 2016-06-21 | 2016-08-17 | 深圳市华夏光彩股份有限公司 | Transparent face mask and LED (light-emitting diode) display module employing transparent face mask |
US20180358582A1 (en) * | 2017-06-09 | 2018-12-13 | Revolution Display, Llc | Visual-Display Structure Having a Metal Contrast Enhancer, and Visual Displays Made Therewith |
CN109613758A (en) * | 2019-02-02 | 2019-04-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
Non-Patent Citations (2)
Title |
---|
JIA, J;: ""A scalable diffractionbased scanning 3D colour video display as demonstrated by using tiled gratings and a vertical diffuser"", 《SCIENTIFIC REPORTS 》 * |
高国保: ""拼接投影的边缘融合处理问题"", 《现代显示》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112908188A (en) * | 2021-02-05 | 2021-06-04 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
CN112908188B (en) * | 2021-02-05 | 2022-07-22 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
CN113724617A (en) * | 2021-09-24 | 2021-11-30 | 京东方科技集团股份有限公司 | Display module, splicing method of splicing display module and display device |
CN113724617B (en) * | 2021-09-24 | 2024-04-23 | 京东方科技集团股份有限公司 | Display module, spliced display module, splicing method of spliced display module and display device |
CN114120845A (en) * | 2021-11-30 | 2022-03-01 | 京东方科技集团股份有限公司 | Display module and splicing display device |
CN114120845B (en) * | 2021-11-30 | 2024-01-26 | 京东方科技集团股份有限公司 | Display module and spliced display device |
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