CN111508935B

CN111508935B - Tiled display device

Info

Publication number: CN111508935B
Application number: CN201910963323.3A
Authority: CN
Inventors: 黄浩榕; 宋朝钦
Original assignee: Innolux Display Corp
Current assignee: Innolux Corp
Priority date: 2019-01-31
Filing date: 2019-10-11
Publication date: 2022-03-15
Anticipated expiration: 2039-10-11
Also published as: CN111508935A

Abstract

The present disclosure provides a tiled display device, comprising: the light emitting device comprises a first substrate, a second substrate and a light emitting unit, wherein the first substrate comprises a first main substrate and a first flexible substrate, and the first flexible substrate is arranged on the first main substrate. The second substrate is adjacent to the first substrate, the light emitting unit is disposed on the first flexible substrate, and a portion of the light emitting unit protrudes from an edge of the first main substrate.

Description

Tiled display device

Technical Field

The present disclosure relates to a tiled display device, and more particularly, to a tiled display device having a large joint space.

Background

Electronic products including display panels, such as smart phones, tablet computers, notebook computers, monitors and televisions, have become indispensable necessities of modern society. With the explosion of such portable electronic products, consumers have a high expectation on the quality, functionality, or price of these products.

Sub-millimeter led technology is a technology of flat panel display devices that have been recently developed, and can generate seamless images with wide viewing angle, high brightness, and high contrast. However, when the sub-millimeter led technology is applied to a large-sized display panel, a splicing method is mostly adopted. As the resolution requirements increase, the sub-millimeter led pitch decreases, thereby limiting the available space at the panel splice joint.

While existing tiled display devices can generally meet their intended purpose, they have not been completely satisfactory in every aspect. Therefore, developing a structure design that can improve the quality or reliability of the tiled display device is still one of the issues of the current industry.

Disclosure of Invention

According to some embodiments of the present disclosure, there is provided a tiled display device, including: the light emitting device comprises a first substrate, a second substrate and a light emitting unit, wherein the first substrate comprises a first main substrate and a first flexible substrate, and the first flexible substrate is arranged on the first main substrate. The second substrate is adjacent to the first substrate, the light emitting unit is disposed on the first flexible substrate, and a portion of the light emitting unit protrudes from an edge of the first main substrate.

Drawings

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below, wherein:

FIG. 1A is a schematic top view of a tiled display device according to some embodiments of the present disclosure;

FIG. 1B is an enlarged cross-sectional view of the area A in FIG. 1A;

FIG. 1C is a schematic diagram illustrating a top view of a light-emitting unit according to some embodiments of the present disclosure;

FIG. 2A is a schematic top view of a tiled display device according to some embodiments of the present disclosure;

FIG. 2B is an enlarged cross-sectional view of the area A in FIG. 2A;

FIG. 2C is a schematic diagram illustrating a top view of a light emitting unit according to some embodiments of the present disclosure;

FIG. 3 is a schematic cross-sectional view of a partial structure of a tiled display device according to some embodiments of the present disclosure;

FIG. 4A is a schematic cross-sectional view of a partial structure of a tiled display device according to some embodiments of the present disclosure;

FIG. 4B is a schematic diagram illustrating a top view of a light emitting unit according to some embodiments of the present disclosure;

FIG. 5 is a schematic top view of a tiled display device according to some embodiments of the present disclosure;

FIG. 6A is a schematic top view of a tiled display device according to some embodiments of the present disclosure;

FIG. 6B is an enlarged cross-sectional view of the area A in FIG. 6A;

FIG. 6C is a schematic diagram illustrating a top view of a light emitting unit according to some embodiments of the present disclosure;

FIG. 7 is a schematic top view of a tiled display device according to some embodiments of the present disclosure;

FIG. 8A is a schematic diagram illustrating a top view of a light emitting unit according to some embodiments of the present disclosure;

fig. 8B is a schematic top view of a light-emitting unit according to some embodiments of the present disclosure.

Description of the symbols

10A, 10B, 10C, 10D, 10E, 10F and 10G splicing display devices;

100a first substrate;

100a first primary substrate;

100ab lower surface;

100as edge;

100at upper surface;

100b a first flexible substrate;

100bb lower surface;

100e edge region;

a main region of 100 m;

a 100ex extension;

200a second substrate;

200a second primary substrate;

200ab lower surface;

200at upper surface;

200as edge;

200b a second flexible substrate;

200bb lower surface;

200e edge region;

a main region of 200 m;

200ex extension region;

300. 300-1, 300-2, 300-3, 301-4 light emitting units;

301. 301-1, 301-2, 301-3 pixels;

301a, 301b, 301c sub-pixels;

303. 303-1, 303-2, 303-3, 303-4, 303-5, 303-6, 303-7, 303-8, 303 '-1, 303' -2, 303 '-3, 303' -4, 303 '-5, 303' -6, 303 '-7, 303' -8 connection pads;

303s side walls;

303r dummy connection pads;

305 an intermediate substrate;

305s side walls;

307 a protective layer;

307s sidewalls;

400 a drive element;

a region A;

d distance;

SP bendable space;

P₁、P₁₁spacing;

l length.

Detailed Description

The following describes the tiled display device and the manufacturing method thereof according to the embodiments of the present disclosure in detail. It is to be understood that the following description provides many different embodiments, or examples, for implementing different aspects of some embodiments of the disclosure. The specific elements and arrangements described below are merely illustrative of some embodiments of the disclosure for simplicity and clarity. These are, of course, merely examples and are not intended to be limiting of the disclosure. Moreover, similar and/or corresponding elements may be labeled with similar and/or corresponding reference numerals in different embodiments in order to clearly describe the disclosure. However, the use of such like and/or corresponding reference numerals is merely for simplicity and clarity in describing some embodiments of the present disclosure and does not represent any association between the various embodiments and/or structures discussed.

It should be understood that the elements of the drawings or devices may take various forms well known to those skilled in the art. In addition, relative terms, such as "lower" or "bottom" or "upper" or "top," may be used in relation to one element of the figures to describe the relative relationship of one element to another. It will be understood that if the device of the drawings is turned over with the top and bottom portions turned over, elements on the "lower" side will be turned over to elements on the "higher" side. The embodiments of the present disclosure can be understood together with the accompanying drawings, which are also considered part of the disclosure description. It will be appreciated that the drawings of the present disclosure are not to scale and that, in fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the present disclosure.

Furthermore, when a first material layer is disposed on or disposed over a second material layer, the first material layer and the second material layer are in direct contact. Alternatively, one or more further material layers may be present, in which case there may not be direct contact between the first and second material layers.

Furthermore, the elements or devices of the drawings may exist in various forms well known to those skilled in the art of the invention. Further, it should be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, or sections, these elements, components, or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure.

In some embodiments of the present disclosure, terms relating to bonding, connecting, such as "connected," "interconnected," and the like, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, unless otherwise defined, wherein another structure is disposed between the two structures. And the terms coupled and connected should also be construed to include both structures being movable or both structures being fixed.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

According to some embodiments of the present disclosure, a flexible region of the flexible substrate may be increased by designing a connection pad of the light emitting unit or a package structure, so as to reduce a risk of a circuit breaking at a bending portion of the flexible substrate or reduce an influence of a splicing joint on a resolution of the panel.

Referring to fig. 1A, fig. 1A is a schematic top view of a tiled display apparatus 10A according to some embodiments of the present disclosure. It should be understood that only some of the elements of tiled display apparatus 10A are depicted in fig. 1A for clarity of illustration. Again, according to some embodiments, additional features may be added to the tiled display device 10A described below. In other embodiments, some of the features of the tiled display arrangement 10A described below can be replaced or omitted.

According to some embodiments of the present disclosure, the tiled display device 10A may include a Liquid Crystal Display (LCD), a light-emitting diode (LED), a quantum dot, a fluorescent light (fluorescence), a phosphorescent light (phosphor), other suitable display media, or a combination thereof, but is not limited thereto. According to some embodiments, the LED display device may include an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a sub-millimeter light-emitting diode (mini LED), or a micro light-emitting diode (micro LED), but not limited thereto.

As shown in fig. 1A, according to some embodiments, a tiled display device 10A includes a first substrate 100 and a second substrate 200, the second substrate 200 being disposed adjacent to the first substrate 100. In some embodiments, the first substrate 100 may include a main region 100m, an edge region 100e, and an extension region 100 ex. In some embodiments, the second substrate 200 may include a main region 200m, an edge region 200e, and an extension region 200 ex. In some embodiments,

edge regions

100e and 200e are adjacent to each other. In some embodiments, the

edge regions

100e and 200e may be used as bendable regions or regions where the first substrate 100 and the second substrate 200 are bonded. In some embodiments, the extension regions 100ex and 200ex may be bent under the first substrate 100 and the second substrate 200, and the definitions of the extension regions 100ex, 200ex, the

edge regions

100e, 200e, the

main regions

100m, and 200m will be further described with reference to fig. 1B.

Furthermore, the tiled display device 10A may include a plurality of light emitting units 300, and the light emitting units 300 may be disposed on the first substrate 100 and the second substrate 200. In some embodiments, in a normal direction (e.g., a Z direction shown in the figure) of the first substrate 100 or the second substrate 200, a portion of the light emitting units 300 overlaps the main region 100m or the main region 200m and does not overlap the edge region 100e or the edge region 200 e; a portion of the light emitting cells 300 partially overlaps the main region 100m or the main region 200m and partially overlaps the edge region 100e of the first substrate 100 or the edge region 200e of the second substrate 200.

In some embodiments, one light emitting unit 300 may include or correspond to one pixel (pixel)301, but the disclosure is not limited thereto. According to some embodiments, one light emitting unit 300 may include or correspond to a plurality of pixels 301. Also, the pixel 301 may include one or more sub-pixels (sub-pixels). As shown in fig. 1A, in some embodiments, a light emitting unit 300 may include a pixel (pixel)301, and the pixel 301 may include three sub-pixels, i.e., a sub-pixel 301A, a sub-pixel 301b, and a sub-pixel 310 c. For example, in some embodiments, the sub-pixels 301a, 301b and 310c may be red, green and blue sub-pixels arranged in a suitable manner, but the disclosure is not limited thereto. In other embodiments, a pixel 301 may comprise red, green, blue, or white sub-pixels, or other suitable color sub-pixels, but the disclosure is not limited thereto. In addition, in some embodiments, the sub-pixels 301a, 301b, and 310c can be light emitting diode dies emitting light of different colors, or light emitting diode dies emitting light of the same color.

In addition, two pixels 301 have a pitch P therebetween₁In detail, the "pitch" refers to a distance between one side (e.g., left side) edge of one sub-pixel (e.g., sub-pixel 301a) and the same side (e.g., left side) edge of the next same sub-pixel or the nearest neighboring same sub-pixel (e.g., another sub-pixel 301 a). In thatIn some embodiments, the "pitch" may be defined by sub-pixels emitting light of the same color, which means that the wavelength difference corresponding to the maximum peak in the spectra of the two light sources is between-5 nm and 5nm, but the disclosure is not limited thereto. As shown in fig. 1A, according to some embodiments of the present disclosure, the light emitting unit 300 includes one pixel 301, the pixel 301 includes three sub-pixels, and the aforementioned "pitch" may be, for example, a distance between a left edge of one sub-pixel (e.g., sub-pixel 301A) in the light emitting unit and a left edge of the same sub-pixel (e.g., another sub-pixel 301A) in another adjacent light emitting unit 300.

In addition, as shown in fig. 1A, according to some embodiments, the light emitting unit 300 may include a plurality of connection pads 303, the connection pads 303 may be disposed on the first substrate 100 and the second substrate 200, and the connection pads 303 may be disposed between the pixels 301 and the first substrate 100 or between the pixels 301 and the second substrate 200. The bonding pads 303 may provide electrical connection between the light emitting unit 300 and the first and

second substrates

100 and 200. Specifically, in some embodiments, a wiring layer (not shown) of various circuits or electronic circuits may be disposed on the edge region 100e of the first substrate 100 or the edge region 200e of the second substrate 200, or the front surface (e.g., the extension region 100ex or the extension region 200ex) or the back surface (rear surface) of the first substrate 100 and the second substrate 200 (e.g., the main region 100m or the main region 200m), and the wiring layer (not shown) may be electrically connected to the light emitting unit 300 through the connection pad 303.

It should be understood that, for clarity of illustrating the light emitting units 300 and the positional relationship of the splicing regions between the first substrate 100 and the second substrate 200, fig. 1A illustrates the first substrate 100 and the second substrate 200 separately, that is, illustrates the first substrate 100 and the second substrate 200 before the splicing is completed. Further, it should be understood that although only the first substrate 100 and the second substrate 200 are illustrated in the figures, the tiled display device 10A can have any suitable number of tiled substrates as desired according to some embodiments, and the disclosure is not limited thereto.

Next, referring to fig. 1B, fig. 1B shows an enlarged cross-sectional view of the edge area 100e, the edge area 200e, the extension area 100ex and the extension area 200ex of the area a in fig. 1A after bending, further illustrating the structure of the tiled display device 10A at the tiled location. As shown in fig. 1B, the first substrate 100 includes a first main substrate 100a and a first flexible substrate 100B, the first flexible substrate 100B is disposed on the first main substrate 100a, the second substrate 200 includes a second main substrate 200a and a second flexible substrate 200B, and the second flexible substrate 200B is disposed on the second main substrate 200 a. The first main substrate 100a has an upper surface 100at, a lower surface 100ab, and an edge 100 as. In some embodiments, the first flexible substrate 100b may extend from the upper surface 100at to the lower surface 100 ab. In some embodiments, the first flexible substrate 100b may optionally not be in contact with the edge 100 as.

Further, the second main substrate 200a has an upper surface 200at, a lower surface 200ab, and an edge 200 as. In some embodiments, the second flexible substrate 200b may extend from the upper surface 200at to the lower surface 200 ab. In some embodiments, the second flexible substrate 200b does not contact the edge 200 as.

In some embodiments, the first main substrate 100a and the second main substrate 200a may be flexible substrates, rigid substrates, or a combination thereof. In one embodiment, the materials of the first main substrate 100a and the second main substrate 200a may include, but are not limited to, glass, quartz, sapphire, ceramic, plastic, other suitable materials as substrates, or combinations thereof. In an embodiment, the material of the plastic substrate may include Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), other suitable materials, or a combination thereof, but is not limited thereto. In an embodiment, the material of the glass substrate may include silicon (Si), silicon carbide (SiC), gallium nitride (GaN), silicon dioxide (SiO)₂) Other suitable materials, or combinations of the foregoing, but are not limited to such. In addition, in some embodiments, the first main substrate 100a and the second main substrate 200a may include a metal-glass fiber composite board, or a metal-ceramic composite board, but are not limited thereto. In addition, the material of the first main substrate 100a may be the same as or different from the material of the second main substrate 200 a.

In some embodiments, the first flexible substrate 100b and the second flexible substrate 200b comprise a material having flexible properties. For example, in some embodiments, the material of the first flexible substrate 100b and the second flexible substrate 200b may include Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), other suitable materials, or a combination thereof, but is not limited thereto. In addition, the material of the first flexible substrate 100b may be the same as or different from the material of the second flexible substrate 200 b.

In view of the foregoing, in some embodiments, the first substrate 100 may include a main region 100m, an extension region 100ex, and an edge region 100 e. Further, the main region 100m is a region of the first flexible substrate 100b adjacent to the upper surface 100at of the first main substrate 100a and overlapping with the upper surface 100at of the first main substrate 100a in a normal direction (e.g., a Z direction shown in the figure) of the first main substrate 100 a. The extension area 100ex is an area of the first flexible substrate 100b adjacent to the lower surface 100ab of the first main substrate 100a and overlapping with the lower surface 100ab of the first main substrate 100a in the normal direction of the first main substrate 100 a. Furthermore, the edge region 100e is the region of the first flexible substrate 100b excluding the main region 100m and the extension region 100 ex.

In view of the foregoing, in some embodiments, the second substrate 200 may include a main region 200m, an extension region 200ex, and an edge region 200 e. Further, the main region 200m is a region of the second flexible substrate 200b adjacent to the upper surface 200at of the second main substrate 200a and overlapping with the upper surface 200at of the second main substrate 200a in a normal direction (e.g., a Z direction) of the second main substrate 200 a. The extension region 200ex is a region of the second flexible substrate 200b adjacent to the lower surface 200ab of the second main substrate 200a in the normal direction of the second main substrate 200a and overlapping the lower surface 200ab of the second main substrate 200 a. Furthermore, the edge region 200e is the region of the second flexible substrate 200b excluding the main region 200m and the extension region 200 ex.

As shown in fig. 1B, the light emitting unit 300 is disposed on the first flexible substrate 100B, and a portion of the light emitting unit 300 overlaps the upper surface 100at and another portion protrudes from the upper surface 100at or the edge 100as of the first main substrate 100 a. In other words, in some embodiments, a portion of the light emitting unit 300 overlaps the edge region 100e in the normal direction of the first main substrate 100 a. On the other hand, according to some embodiments, the light emitting units 300 are also disposed on the second flexible substrate 200b, and a portion of the light emitting units 300 overlaps the upper surface 200at, and another portion protrudes from the upper surface 200at or the edge 200as of the second main substrate 200 a. In other words, in some embodiments, a portion of the light emitting unit 300 overlaps the edge region 200e in the normal direction of the second main substrate 200 a.

Furthermore, in some embodiments, at least a portion of the first flexible base material 100b may be disposed between the first substrate 100 and the second substrate 200. Further, in some embodiments, at least a portion of the first flexible substrate 100b may be disposed between the edge 100as of the first main substrate 100a and the edge 200as of the second main substrate 200 a. In some embodiments, a portion of the light emitting unit 300 overlaps the first flexible substrate 100b disposed between the edge 100as and the edge 200as in a normal direction (e.g., a Z direction shown in the figure) of the first main substrate 100a or the second main substrate 200 a.

Similarly, in some embodiments, at least a portion of the second flexible base material 200b may be disposed between the first base plate 100 and the second base plate 200, for example, between the edge 100as of the first main base material 100a and the edge 200as of the second main base material 200 a.

In light of the foregoing, according to some embodiments, the light emitting unit 300 may include one or more pixels 301, and the pixels 301 may include a suitable number of sub-pixels, such as sub-pixel 301a, sub-pixel 301b, and sub-pixel 310 c. In this embodiment, the light emitting unit 300 includes one pixel 301, and the pixel 301 includes three sub-pixels. In some embodiments, subpixel 301a, subpixel 301b, and subpixel 310c are three light emitting diode dies.

In addition, as shown in fig. 1B, in some embodiments, the light emitting unit 300 may include a plurality of connection pads 303, and the connection pads 303 may be disposed on the first flexible substrate 100B and the second flexible substrate 200B. In some embodiments, the first flexible substrate 100b and the second flexible substrate 200b may include wiring layers (not shown) for various circuits or electronic circuits, and the wiring layers (not shown) may be electrically connected to the light emitting unit 300 through the connection pads 303.

In some embodiments, the connection pad 303 may be electrically connected to an anode electrode or a cathode electrode of the die of the light emitting unit 300. In detail, in this embodiment, the light emitting unit 300 has three sub-pixels 301a, 301b and 310c, wherein three connection pads 303 can be electrically connected to the anode electrodes of the dies of the sub-pixels 301a, 301b and 310c, and one connection pad 303 can be electrically connected to the cathode electrodes of the dies of the sub-pixels 301a, 301b and 310c, that is, the three sub-pixels 301a, 301b and 310c can have a common cathode, and the polarity connection manner is not limited thereto.

In some embodiments, the connection pads 303 may comprise a conductive material. In some embodiments, the connection pads 303 may comprise a metallic conductive material, a transparent conductive material, or a combination thereof. In some embodiments, the aforementioned metallic conductive material may include copper (Cu), aluminum (Al), molybdenum (Mo), silver (Ag), tin (Sn), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), a copper alloy, an aluminum alloy, a molybdenum alloy, a silver alloy, a tin alloy, a tungsten alloy, a gold alloy, a chromium alloy, a nickel alloy, a platinum alloy, other suitable metallic materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, the transparent conductive material may include a Transparent Conductive Oxide (TCO). For example, the transparent conductive oxide may include Indium Tin Oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), Indium Zinc Oxide (IZO), Indium Gallium Zinc Oxide (IGZO), Indium Tin Zinc Oxide (ITZO), Antimony Tin Oxide (ATO), Antimony Zinc Oxide (AZO), other suitable transparent conductive materials, or a combination thereof, but is not limited thereto.

In some embodiments, the bonding pads 303 may be formed by a Chemical Vapor Deposition (CVD) process, a Physical Vapor Deposition (PVD) process, an electroplating (electroplating) process, an electroless plating (electroplating) process, other suitable processes, or a combination thereof, but the disclosure is not limited thereto.

Furthermore, according to some embodiments, the light emitting unit 300 may further include an intermediate substrate 305 disposed between the pixel 301 and the connection pad 303, and a protection layer 307 disposed over the intermediate substrate 305. In some embodiments, the pixel 301 can be electrically connected to the connecting pad 303 through a via (not shown) penetrating the intermediate substrate 305, but is not limited thereto. In some embodiments, the protective layer 307 may selectively cover the top surface and the side surface of the pixel 301.

In some embodiments, the intermediate substrate 305 may be a flexible substrate, a rigid substrate, or a combination thereof. In one embodiment, the intermediate substrate 305 may include, but is not limited to, a glass substrate, a ceramic substrate, a plastic substrate, other suitable substrate materials, or a combination thereof. In an embodiment, the material of the middle substrate 305 may include epoxy resins (silicones), silicone resins (polymerized silicones), Polyimides (PIs), polyethylene terephthalate (PET), Polycarbonate (PC), other suitable materials, or a combination thereof, but is not limited thereto. In an embodiment, the material of the glass substrate may include silicon (Si), silicon carbide (SiC), gallium nitride (GaN), silicon dioxide (SiO)₂) Other suitable materials, or combinations of the foregoing, but are not limited to such. In addition, in some embodiments, the intermediate substrate 305 may include a Printed Circuit Board (PCB), a metal-glass fiber composite board, or a metal-ceramic composite board, but is not limited thereto.

In some embodiments, the protective layer 307 may comprise an organic material, an inorganic material, other suitable encapsulation materials, or a combination of the foregoing, but is not limited thereto. In some embodiments, the inorganic material may include, but is not limited to, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable materials. In some embodiments, the organic material may include epoxy resin (epoxy resins), silicone resin, acrylic resin (acrylic resins) (such as polymethyl methacrylate (PMMA), benzocyclobutene (BCB), polyimide (polyimide), copolyester (polyester), Polydimethylsiloxane (PDMS), tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA)), other suitable materials, or a combination thereof, but is not limited thereto.

Furthermore, according to some embodiments, the protective layer 307 may have a wavelength conversion function, for example, a light source generated by the pixel 301 may be converted into light having a specific wavelength range (a specific color). In some embodiments, the protection layer 307 may further include particles having a wavelength conversion function, such as phosphor(s), Quantum Dot (QD) material, organic fluorescent material, other suitable material, or combinations of the foregoing, but is not limited thereto.

In some embodiments, the passivation layer 307 may be formed by a chemical vapor deposition (cvd) process, a spin coating (spin coating) process, a printing (printing) process, other suitable methods, or a combination thereof.

According to some embodiments, the light emitting unit 300 may be packaged by a surface-mount device (SMD) package of light emitting diodes, a chip-on-board (COB) package of light emitting diodes, a micro light emitting diode or a flip chip light emitting diode package, an organic light emitting diode package, other suitable packages, or a combination thereof, but is not limited thereto.

In addition, as shown in fig. 1B, according to some embodiments, the tiled display device 10 can further include a driving element 400, and the driving element 400 can be disposed on the extension area 100ex of the first flexible substrate 100B. In some embodiments, the driving element 400 may be in contact with the lower surface 100bb of the first flexible substrate 100 b. In some embodiments, the driving element 400 may also be disposed on the extension region 200ex of the second flexible substrate 200b and may be in contact with the lower surface 200bb of the second flexible substrate 200 b.

In some embodiments, the driving element 400 may comprise an active driving element, a passive driving element, or a combination of the foregoing. For example, the active driving element may include a thin-film transistor (TFT), but is not limited thereto. The thin film transistor may include, for example, a switching transistor, a driving transistor, a reset transistor, or other thin film transistors. In some embodiments, the thin film transistor comprises at least one semiconductor layer. The semiconductor layer includes, but is not limited to, amorphous silicon, such as low-temperature polysilicon (LTPS), metal oxide, other suitable materials, or a combination thereof. The metal oxide may include Indium Gallium Zinc Oxide (IGZO), Indium Zinc Oxide (IZO), Indium Gallium Zinc Tin Oxide (IGZTO), other suitable materials, or combinations of the foregoing, but is not limited thereto.

Furthermore, in the embodiment where the driving element is a passive driving element, the driving element may be controlled by an Integrated Circuit (IC) or a microchip (microchip), for example, but the disclosure is not limited thereto.

Next, referring to fig. 1B and 1C, fig. 1C shows a top view of a light emitting unit 300 according to some embodiments of the present disclosure, in which only a pixel 301 and a connecting pad 303 are shown. As shown in fig. 1B and 1C, in some embodiments, the bonding pad 303 is not overlapped with the edge region 100e or the edge region 200e in a normal direction (e.g., the Z direction) of the first main substrate 100 a. Specifically, in some embodiments, the sidewalls 303s of the connection pads 303 are not flush with the sidewalls of the light emitting unit 300 (e.g., the sidewalls 305s of the intermediate substrate 305 or the sidewalls 307s of the protection layer 307). The sidewall 303s, the sidewall 305s and the sidewall 307s refer to the side walls of the bonding pad 303, the intermediate substrate 305 and the passivation layer 307, respectively, which are closer to the joint between the first substrate 100 and the second substrate 200.

In some embodiments, the bonding pads 303 may be disposed in an offset manner, i.e., the bonding pads 303 are not disposed at the four corners of the light emitting unit 300 on average, but each of the sub-pixels 301a, 301b and 301c in the light emitting unit is electrically connected to the corresponding bonding pad 303 through a circuit in the intermediate substrate 305. For example, the sub-pixel 301c is electrically connected to two connecting

pads

303c and 303z respectively through a circuit in the intermediate substrate 305, wherein the connecting pad 303z is a common cathode, so that the sub-pixels 301a and 301b are also electrically connected to the connecting pad 303 z. In some embodiments, the bonding pads 303 of the other light emitting units 300 except the light emitting unit 300 partially overlapped with the edge region 100e may be uniformly disposed at four corners of the light emitting unit 300 or uniformly disposed at the periphery of the light emitting unit 300, but not limited thereto. In some embodiments, in a normal direction (e.g., the Z direction shown in the figure) of the first main substrate 100a, a part of the sub-pixels (e.g., the sub-pixels 301c shown in the figure) protrudes from the edge area 100as of the first main substrate 100a and partially overlaps with the edge area 100 e. Furthermore, in some embodiments, in a normal direction (e.g., the Z direction shown in the figure) of the second main substrate 200a, a part of the sub-pixels (e.g., the sub-pixels 301a shown in the figure) protrudes from the edge 200as of the second main substrate 200a and partially overlaps with the edge 200 e.

In addition, in some embodiments, the bonding pads 303 do not protrude from the edge 100as of the first main substrate 100a in a normal direction (e.g., the Z direction shown in the figure) of the first main substrate 100 a. In some embodiments, the bonding pads 303 do not protrude from the edge 200as of the second main substrate 200a in a normal direction (e.g., the Z direction) of the second main substrate 200 a.

It is noted that according to some embodiments of the present disclosure, a portion of the light emitting unit 300 near the splice protrudes beyond the edge 100as of the first main substrate 100a or the edge 200as of the second main substrate 200 a. Compared with a general tiled display device in which the sidewalls of the light emitting units 300 are flush with the edge 100as or the edge 200as, or the light emitting units 300 do not protrude from the edge 100as or the edge 200as, the light emitting units 300 and the connection pads 303 thereof according to the embodiment of the disclosure are arranged such that at least a portion of the edge area 100e of the first flexible substrate 100b and at least a portion of the edge area 200e of the second flexible substrate 200b can be hidden under the light emitting units 300, so as to increase the bendable space SP at the substrate-tiled junction between the first flexible substrate 100b and the second flexible substrate 200b, thereby reducing the risk of wire breakage at the bent portion of the first flexible substrate 100b or the second flexible substrate 200 b. Specifically, the first flexible substrate 100b and the second flexible substrateThe bendable space SP at the substrate splicing joint of the flexible base material 200b may be the minimum distance between the edge 100as of the first main base material 100a and the edge 200as of the second main base material 200 a. Alternatively, according to some embodiments of the present disclosure, the configuration of the light emitting units 300 and the bonding pads 303 thereof can reduce the pitch P of the pixels 301 in the main area 100m₁Pixel 301 pitch P at the splice with adjacent substrate₁₁The difference reduces the gap feeling of the spliced part when the user watches the picture, thereby improving the display quality.

Next, referring to fig. 2A, fig. 2A is a schematic top view illustrating a tiled display apparatus 10B according to other embodiments of the present disclosure. It should be understood that the same or similar components or elements are denoted by the same or similar reference numerals, and the same or similar materials, manufacturing methods and functions are the same or similar to those described above, so that the detailed description thereof will not be repeated herein.

As shown in fig. 2A, according to some embodiments, the first substrate 100 may include at least one edge region 100e, that is, may include a plurality of regions capable of being bent and joined. In some embodiments, the second substrate 200 may include at least one edge region 200e, that is, may include a plurality of regions capable of being joined by bending. Specifically, in the present embodiment, the first substrate 100 and the second substrate 200 may have four

edge regions

100e and 200e, respectively, and four sides of the first substrate 100 and the second substrate 200 may be spliced with other substrates. In addition, in this embodiment, the light emitting unit 300 disposed on the first substrate 100 and the light emitting unit 300 disposed on the second substrate 200 may have the same configuration of the connection pads 303.

In detail, referring to fig. 2B and 2C, fig. 2B is an enlarged cross-sectional view of the area a of fig. 2A after bending the edge region 100e, the edge region 200e, the extension region 100ex and the extension region 200ex, and fig. 2C is a top view of the light emitting unit 300 according to the embodiment, which only shows the pixel 301 and the connecting pad 303. As shown in fig. 2B and 2C, in this embodiment, the bonding pads 303 may be disposed near the center of the light emitting unit 300, and the bonding pads 303 are not disposed at the four corners of the light emitting unit 300. In this embodiment, the sidewall 303s of the bonding pad 303 is not flush with the sidewall of the light emitting unit 300 (e.g., the sidewall 305s of the interposer substrate 305 or the sidewall 307s of the protection layer 307), the bonding pad 303 is also not overlapped with the edge region 100e or the edge region 200e in the normal direction (e.g., the Z direction shown in the figure) of the first main substrate 100a, and a portion of the light emitting unit 300 protrudes from the edge 100as of the first main substrate 100 a.

In some embodiments, in the normal direction (e.g., the Z direction shown in the figure) of the first main substrate 100a, a portion of the sub-pixel (e.g., the sub-pixel 301c shown in the figure) adjacent to the edge region 100e overlaps with the main region 100m, and another portion protrudes from the edge 100as of the first main substrate 100a and overlaps with the edge region 100 e. Furthermore, in some embodiments, in the normal direction (e.g., the Z direction shown in the figure) of the second main substrate 200a, a portion of the sub-pixel (e.g., the sub-pixel 301a shown in the figure) adjacent to the edge region 100e overlaps with the main region 200m, and another portion protrudes from the edge 200as of the second main substrate 200a and overlaps with the edge region 200 e.

In addition, in some embodiments, the bonding pads 303 do not protrude from the edge 100as of the first main substrate 100a in a normal direction (e.g., the Z direction shown in the figure) of the first main substrate 100a, i.e., the bonding pads 303 are substantially disposed on the main area 100 m. In some embodiments, the bonding pads 303 do not protrude from the edge 200as of the second main substrate 200a in a normal direction (e.g., the Z direction shown in the figure) of the second main substrate 200a, i.e., the bonding pads 303 are substantially disposed on the main region 200 m.

It is noted that in this embodiment, a portion of the light emitting unit 300 near the splice protrudes beyond the edge 100as of the first main substrate 100a or the edge 200as of the second main substrate 200 a. The arrangement of the light emitting units 300 and the connection pads 303 thereof can increase the bendable space SP at the joint of the first flexible base material 100b and the second flexible base material 200b, thereby reducing the risk of wire breakage at the bent position of the first flexible base material 100b or the second flexible base material 200 b. Alternatively, the arrangement of the light emitting units 300 and the bonding pads 303 can reduce the pitch P of the pixels 301 in the main area 100m₁Between pixels 301 spliced to adjacent substratesDistance P₁₁The difference reduces the gap feeling of the spliced part when the user watches the picture, thereby improving the display quality.

In addition, since the bonding pads 303 are disposed near the center of the light emitting units 300 in this embodiment, only one type of light emitting units 300 can be disposed on the first substrate 100 and the second substrate 200 in the case of having a plurality of

edge regions

100e and 200e, thereby reducing the manufacturing cost or the manufacturing difficulty.

Next, referring to fig. 3, fig. 3 is a schematic cross-sectional view illustrating a partial structure of a tiled display device 10C according to other embodiments of the present disclosure, specifically, fig. 3 illustrates a partial structure of the tiled display device 10C at a splicing joint of a first substrate 100 and a second substrate 200. As shown in fig. 3, in this embodiment, the maximum distance between the pixel 301 and the connection pad 303 in the X direction can be increased by increasing the package volume of the light emitting unit 300, for example, the connection pad 303 is further away from the position of the joint where the first substrate 100 and the second substrate 200 are spliced than the pixel 301. In this embodiment, the package volume of the light emitting unit 300 can be increased by increasing the volumes of the middle substrate 305 and the protection layer 307, so that a portion of the light emitting unit 300 protrudes from the edge 100as of the first main substrate 100 a.

Similarly, in this embodiment, the sidewall 303s of the bonding pad 303 is not flush with the sidewall of the light emitting unit 300 (e.g., the sidewall 305s of the middle substrate 305 or the sidewall 307s of the protection layer 307), the bonding pad 303 is disposed at a position away from the side of the first substrate 100 or the side of the second substrate 200, or the bonding pad 303 is disposed at a position away from the splicing joint of the first substrate 100 and the second substrate 200.

In some embodiments, in a normal direction (e.g., the Z direction) of the first main substrate 100a, a portion of the sub-pixels (e.g., the sub-pixel 301c and the sub-pixel 301b) protrudes from the edge area 100as of the first main substrate 100a and overlaps with the edge area 100 e. Furthermore, in some embodiments, in a normal direction (e.g., the Z direction) of the second main substrate 200a, a portion of the sub-pixels (e.g., the sub-pixels 301a and 301b) protrudes from the edge 200as of the second main substrate 200a and overlaps with the edge 200 e.

In addition, as shown in fig. 3, in some embodiments, the light emitting unit 300 may further include dummy bonding pads (dummy pads) 303r, and at least a portion of the dummy bonding pads 303r may protrude beyond the edge 100as of the first main substrate 100 a. In some embodiments, the dummy bonding pads 303r are bonding pads that are not electrically connected to the pixels 301 or the circuitry (not shown) on the first flexible substrate 100 b. In some embodiments, the dummy bonding pads 303r of the light emitting unit 300 may further contact dummy bonding pads (not shown) disposed on the edge region 100e of the first flexible substrate 100b to increase the structural strength or stability of the light emitting unit 300, for example, to make the light emitting unit 300 have uniform foot pressure distribution when being fixed on the substrate 100. In some embodiments, the material of the dummy bonding pad 303r may be the same as or similar to the material of the bonding pad 303, and will not be repeated here.

In this embodiment, a portion of the light emitting unit 300 near the joint protrudes beyond the edge 100as of the first main substrate 100a or the edge 200as of the second main substrate 200a, so that the edge area 100e of the first flexible substrate 100b and the edge area 200e of the second flexible substrate 200b can be hidden under the light emitting unit 300, so as to increase the bendable space SP at the joint of the first flexible substrate 100b and the second flexible substrate 200b for substrate joint, thereby reducing the risk of wire breakage at the bent part of the first flexible substrate 100b or the second flexible substrate 200 b. Alternatively, in this embodiment, the configuration of the light emitting units 300 and the bonding pads 303 thereof can reduce the pitch P of the pixels 301 in the main area 100m₁Pixel 301 pitch P at the splice with adjacent substrate₁₁The difference reduces the gap feeling of the spliced part when the user watches the picture, thereby improving the display quality.

Next, referring to fig. 4A and 4B, fig. 4A is a schematic cross-sectional view illustrating a partial structure of a tiled display device 10D according to some embodiments of the present disclosure, specifically, fig. 4A is a schematic cross-sectional view illustrating a partial structure of the tiled display device 10D at a splicing joint of a first substrate 100 and a second substrate 200, and fig. 4B is a schematic top view illustrating a portion of a light emitting unit 300 in this embodiment, in which only pixels 301 and a connecting pad 303 are shown.

As shown in FIG. 4A, in some embodiments, the configuration of the bonding pads 303 between different light emitting units 300 (for convenience of illustration, the light emitting units 300-1 and 300-2) may be different. In some embodiments, the bonding pad 303 of the light emitting cell 300-1 located on the main region 100m may be configured differently from the bonding pad 303 of the light emitting cell 300-2 located on the edge region 100 e.

Specifically, in this embodiment, the connecting pads 303 corresponding to the light emitting unit 300-1 are disposed substantially at the four corners of the light emitting unit 300 as shown in FIG. 4B. In some embodiments, a portion of the sub-pixels (e.g., the sub-pixel 301b) of the light emitting unit 300-1 does not overlap the bonding pad 303 in a normal direction (e.g., the Z direction) of the first main substrate 100 a. Furthermore, in this embodiment, the configuration of the connection pad 303 corresponding to the light emitting unit 300-2 can be as shown in the aforementioned fig. 1C, but the disclosure is not limited thereto.

It should be understood that, according to some embodiments, in the tiled display device 10D, the configuration of the connection pads 303 of a portion of the light emitting units 300 may be the same, and the configuration of the connection pads 303 of a portion of the light emitting units 300 may be different. Further, according to some embodiments, in the tiled display device 10D, the encapsulation structure (e.g., the volume of the encapsulation) of a portion of the light emitting units 300 may be the same, while the encapsulation structure of a portion of the light emitting units 300 may be different.

Next, referring to fig. 5, fig. 5 is a schematic top view of a tiled display apparatus 10E according to other embodiments of the present disclosure. As shown in fig. 5, in some embodiments, the light emitting unit 300 may have different bonding pads 303 according to its position on the first substrate 100.

For example, in this embodiment, the bonding pads 303 of the light emitting units 300 located in the edge region 100e are substantially as shown in fig. 1C, that is, the bonding pads 303 may be concentrated in a direction. Furthermore, in this embodiment, the light emitting units 300 located between the two edge regions 100e may be concentrated toward one corner, but the disclosure is not limited thereto.

Next, referring to fig. 6A, fig. 6A is a schematic top view of a tiled display apparatus 10F according to some embodiments of the present disclosure. As shown in fig. 6A, in some embodiments, the side of the first substrate 100 or the second substrate 200 may partially have an edge region 100e, an extension region 100ex, an edge region 200e, or an extension region 200ex as a region capable of being bent and joined. Moreover, in this embodiment, the tiled display device 10F can include light-emitting units 300 with different packaging structures, for example, the light-emitting unit 300-1 shown in the figure can include two sets of pixels 301 (denoted as pixel 301-1 and pixel 301-2), and the light-emitting unit 300-2 can include one set of pixels 301 (denoted as pixel 301-1). Furthermore, in some embodiments, the configuration of the connection pad 303 in the light emitting unit 300-1 may be different from the configuration of the connection pad 303 in the light emitting unit 300-2.

Referring to fig. 6B and 6C, fig. 6B is an enlarged cross-sectional view of the area a in fig. 6A, and fig. 6C is a top view of the light emitting unit 300 in this embodiment, in which only the pixel 301 and the connecting pad 303 are shown. In this embodiment, the light emitting unit 300 includes a pixel 301-1 and a pixel 301-2, the pixel 301-1 is disposed on the first main substrate 100a, and a portion of the pixel 301-2 protrudes from the edge 100as of the first main substrate 100 a. In detail, in this embodiment, the package volume of the light emitting unit 300 is increased, so that the light emitting unit 300 can accommodate a plurality of pixels 301 (e.g., the pixel 301-1 and the pixel 301-2), and the connecting pad 303 is located farther from the position of the splice joint between the first substrate 100 and the second substrate 200 than the pixel 301 (the pixel 301-2).

In this embodiment, the package volume of the light emitting unit 300 can be increased by increasing the volumes of the middle substrate 305 and the protection layer 307, so that a portion of the light emitting unit 300 protrudes from the edge 100as of the first main substrate 100 a. Specifically, in some embodiments, a portion of the light emitting unit 300 protrudes beyond the edge 100as by a distance d. In some embodiments, the light emitting unit 300 has a maximum length L along the x direction, and the length L may be, for example, a distance from one side edge of the middle substrate 305 to the other side edge along the x direction. In some embodiments, the distance d may range from L/2 or less, or between L/5 and L/3.

It is understood that if the distance d is too large, the light emitting unit 300 may not be stably mounted on the first flexible substrate 100 b; on the other hand, if the distance d is too small, the bendable space SP at the substrate joint of the first flexible base material 100b and the second flexible base material 200b may be insufficient. Further, according to some embodiments, the distance d refers to a maximum distance between the edge 100as of the first main substrate 100a and the sidewall of the light emitting unit 300 (e.g., the sidewall 305s of the middle substrate 305 or the sidewall 307s of the protection layer 307) in a direction perpendicular to the normal direction of the first main substrate 100a (e.g., the X direction shown in the figure).

Further, according to the embodiments of the present disclosure, the thickness, length, or distance between the elements, etc. of the elements may be measured using an Optical Microscope (OM), a Scanning Electron Microscope (SEM), a thin film thickness profile gauge (α -step), an ellipsometer, or other suitable means, but the present disclosure is not limited thereto.

As shown in fig. 6B and 6C, in this embodiment, the sidewalls 303s of the bonding pads 303 are not flush with the sidewalls of the light emitting unit 300 (e.g., the sidewalls 305s of the intermediate substrate 305 or the sidewalls 307s of the protection layer 307), and the bonding pads 303 are also disposed away from the joint where the first substrate 100 and the second substrate 200 are joined. Furthermore, according to some embodiments, the configuration of the connection pad 303 corresponding to the pixel 301-1 is different from the configuration of the connection pad 303 corresponding to the pixel 301-2.

Furthermore, in this embodiment, the light emitting unit 300 may further include a dummy bonding pad 303r, and at least a portion of the dummy bonding pad 303r may protrude beyond the edge 100as of the first main substrate 100 a. In some embodiments, the dummy bonding pads 303r are bonding pads that are not electrically connected to the pixels 301 or the circuitry (not shown) on the first flexible substrate 100 b. In some embodiments, the dummy bonding pads 303r of the light emitting unit 300 may further contact dummy bonding pads (not shown) disposed on the edge region 100e of the first flexible substrate 100b to increase the structural strength or stability.

In this embodiment, a portion of the light emitting unit 300 near the joint protrudes beyond the edge 100as of the first main substrate 100a or the edge 200as of the second main substrate 200a, so as to increase the bendable space SP at the joint of the first flexible substrate 100b and the second flexible substrate 200b at the substrate joint, thereby reducing the risk of wire breakage at the bent portion of the first flexible substrate 100b or the second flexible substrate 200 b. Furthermore, in this embodiment, the above configuration maintains the pitch P between the pixels 301₁Even at substrate splice joints.

Next, referring to fig. 7, fig. 7 is a schematic top view illustrating a tiled display apparatus 10G according to other embodiments of the present disclosure. As shown in FIG. 7, in some embodiments, the tiled display device 10G can include light-emitting units 300 with different packaging structures, for example, the light-emitting unit 300-1 can include two sets of pixels 301 (denoted as pixel 301-1 and pixel 301-2), the light-emitting unit 300-2 can include one set of pixels 301 (denoted as pixel 301-1), and the light-emitting unit 300-3 can include four sets of pixels 301 (denoted as pixel 301-1, pixel 301-2, pixel 301-3, and pixel 301-4).

In addition, in some embodiments, the configurations of the connection pads 303 in the light emitting unit 300-1, the light emitting unit 300-2, and the light emitting unit 300-3 may be different from each other. Specifically, in some embodiments, the configuration of the connection pad 303 in the light emitting unit 300-1 can be as shown in fig. 6C, and the configuration of the connection pad 303 in the light emitting unit 300-2 can be as shown in fig. 4B, but the disclosure is not limited thereto. In view of the foregoing, in this embodiment, the light emitting unit 300-3 may include four sets of pixels 301 and may include 12 sub-pixels, for example, as shown in fig. 7, the light emitting unit 300-3 may include 13 connecting pads 303, wherein one connecting pad 303 (e.g., the connecting pad 303 located at the center) is electrically connected to the common cathode of the sub-pixels, but the disclosure is not limited thereto.

Next, referring to fig. 8A, fig. 8A shows a top view of a light emitting unit 300 according to some embodiments of the present disclosure, in which only a pixel 301 and a connecting pad 303 are shown. As shown in fig. 8A, in some embodiments, the light emitting unit 300 may include four sets of pixels 301, and each pixel 301 includes three sub-pixels (sub-pixel 301a, sub-pixel 301b, and sub-pixel 301c), that is, the light emitting unit 300 may include 12 sub-pixels. In this embodiment, the anode electrodes of the 12 sub-pixels can be electrically connected to the 12 connecting pads 303 in the central region respectively, so as to control the 12 sub-pixels respectively. Furthermore, in this embodiment, the 8 bonding pads 303-1, 303-2, 303-3, 303-4, 303-5, 303-6, 303-7, and 303-8 disposed in the peripheral region are electrically connected to each other, and at least one of the bonding pads is electrically connected to the common cathode electrode of the 12 sub-pixels.

In addition, in some embodiments, at least one of the bonding pads 303-1, 303-2, 303-3, 303-4, 303-5, 303-6, 303-7, and 303-8 is electrically connected to the driving element 400 disposed on the lower surface 100bb of the first flexible substrate 100 b. It is noted that, in this embodiment, the connection pads 303-1, 303-2, 303-3, 303-4, 303-5, 303-6, 303-7 and 303-8 can be selected to be connected to the cathode electrode or the driving element 400 according to the edge region 100e at different positions or the bendable region at different orientations, thereby improving the flexibility of adjusting the substrate wiring or reducing the cost required for producing various molds. In some embodiments, at least one of the 8 bonding pads may protrude beyond the edge 100as of the first main substrate 100 a. In some embodiments, the unused or non-electrically connected pads of the pads 303-1, 303-2, 303-3, 303-4, 303-5, 303-6, 303-7, and 303-8 may be considered dummy pads.

Furthermore, it should be understood that although the connection pads 303 are illustrated in the drawings as having a rectangular or octagonal shape, the disclosure is not limited thereto. In some embodiments, the shape of the connecting pad 303 can be adjusted according to actual requirements, for example, the connecting pad 303 can have a triangle shape, a square shape, a circle shape, a pentagon shape, a hexagon shape, any polygon shape, other suitable shapes, or a combination of the foregoing, but is not limited thereto.

Next, referring to fig. 8B, fig. 8B is a schematic top view showing a light emitting unit 300 according to other embodiments of the present disclosure, in which only the pixel 301 and the connecting pad 303 are shown. As shown in fig. 8B, according to some embodiments, a portion of the connection pad 303 electrically connected to the anode electrode of the light emitting unit 300 may be further divided into a plurality of connection pads, such as the connection pads 303 '-1, 303' -2, 303 '-3, 303' -4, 303 '-5, 303' -6, 303 '-7, and 303' -8 shown in the figure. In some embodiments, two pads 303 '-1 may be electrically connected, two pads 303' -2 may be electrically connected, two pads 303 '-3 may be electrically connected, two pads 303' -4 may be electrically connected, two pads 303 '-5 may be electrically connected, two pads 303' -6 may be electrically connected, two pads 303 '-7 may be electrically connected, and two pads 303' -8 may be electrically connected. In some embodiments, the connecting pads 303 '-1, 303' -2, 303 '-3, 303' -4, 303 '-5, 303' -6, 303 '-7 and 303' -8 can be electrically connected to different anode electrodes of the light emitting unit 300. In some embodiments, the pads 303-1, 303-2, 303-3, 303-4, and 303-5 are electrically connected to each other, and at least one of the pads is electrically connected to the driving device 400. In some embodiments, the pads that are not used or electrically connected among the pads 303-1, 303-2, 303-3, 303-4, and 303-5 may be considered dummy pads. In some embodiments, at least one of the connection pads at the periphery of fig. 8B may protrude beyond the edge 100as of the first main substrate 100 a.

It is noted that, in this embodiment, according to the edge region 100e at different positions or the bendable regions at different orientations, an appropriate one of the bonding pads 303 '-1, 303' -2, 303 '-3, and 303' -4 can be further selected to contact the anode electrode, thereby improving flexibility in adjusting substrate wiring or reducing the cost required for producing various molds. In some embodiments, the pads 303 '-1, 303' -2, 303 '-3, and 303' -4 that are not used or electrically connected may be considered dummy pads.

In summary, according to some embodiments of the present disclosure, the bendable region of the flexible substrate can be increased or the bending angle of the flexible substrate can be reduced by separating the connection pad from the bending region of the substrate joint, or by changing the package structure of the light emitting unit or the configuration of the connection pad. According to some embodiments of the present disclosure, the risk of line disconnection in the substrate bending region can be reduced without affecting the pitch of the light emitting units or the resolution of the panel, thereby improving the reliability of the tiled display device.

Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the disclosure. Features of the disclosed embodiments can be combined and matched arbitrarily without departing from the spirit or conflict of the invention. Moreover, the scope of the present disclosure is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, the present disclosure will suggest any presently existing or later-to-be-developed process, machine, manufacture, composition of matter, means, method and steps, or use of the present disclosure, so long as the substantially similar function or result is achieved in the embodiments described herein. Accordingly, the scope of the present disclosure includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes combinations of the respective claims and embodiments. The scope of the present disclosure is to be determined by the terms of the appended claims.

Claims

1. A tiled display apparatus, comprising:

a first substrate including a first main substrate and a first flexible substrate, the first flexible substrate being disposed on the first main substrate;

the second substrate is arranged adjacent to the first substrate; and

a light emitting unit disposed on the first flexible substrate, wherein a portion of the light emitting unit protrudes from an edge of the first main substrate,

wherein the light emitting unit includes a plurality of connection pads, wherein at least one of the plurality of connection pads protrudes from the edge of the first main substrate.

2. The tiled display device of claim 1, wherein at least a portion of the first flexible substrate is disposed between the first substrate and the second substrate.

3. The tiled display apparatus of claim 1, wherein at least two of the plurality of connection pads are electrically connected to each other.

4. The tiled display apparatus of claim 1 wherein the light emitting unit comprises at least one pixel.

5. The tiled display apparatus of claim 4 wherein the light emitting unit comprises a first pixel and a second pixel, wherein the first pixel is on the first main substrate and a portion of the second pixel protrudes beyond the edge of the first main substrate.

6. The tiled display apparatus of claim 4 wherein the light emitting unit comprises a first pixel and a second pixel, and the plurality of connecting pads are disposed under the first pixel and the second pixel, wherein the configuration of the plurality of connecting pads corresponding to the first pixel is different from the configuration of the plurality of connecting pads corresponding to the second pixel.

7. The tiled display apparatus of claim 1 wherein the plurality of connection pads comprise a dummy connection pad, wherein at least a portion of the dummy connection pad protrudes beyond the edge of the first main substrate.

8. The tiled display device of claim 1 wherein the first host substrate has a normal direction and a lower surface, the first flexible substrate further comprising an extension region, wherein the extension region is adjacent to and overlaps the lower surface in the normal direction.

9. A tiled display arrangement according to claim 8, further comprising a drive element,

is arranged on the extension area.