CN111830389B - 一种基于发射极功率端子温度的igbt结温估算系统及方法 - Google Patents
一种基于发射极功率端子温度的igbt结温估算系统及方法 Download PDFInfo
- Publication number
- CN111830389B CN111830389B CN202010765684.XA CN202010765684A CN111830389B CN 111830389 B CN111830389 B CN 111830389B CN 202010765684 A CN202010765684 A CN 202010765684A CN 111830389 B CN111830389 B CN 111830389B
- Authority
- CN
- China
- Prior art keywords
- igbt
- temperature
- power
- emitter terminal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 claims description 21
- 230000032683 aging Effects 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000036541 health Effects 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000003862 health status Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2608—Circuits therefor for testing bipolar transistors
- G01R31/2619—Circuits therefor for testing bipolar transistors for measuring thermal properties thereof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/20—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment
- H02H7/205—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for electronic equipment for controlled semi-conductors which are not included in a specific circuit arrangement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Power Conversion In General (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010765684.XA CN111830389B (zh) | 2020-07-31 | 2020-07-31 | 一种基于发射极功率端子温度的igbt结温估算系统及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010765684.XA CN111830389B (zh) | 2020-07-31 | 2020-07-31 | 一种基于发射极功率端子温度的igbt结温估算系统及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111830389A CN111830389A (zh) | 2020-10-27 |
CN111830389B true CN111830389B (zh) | 2023-10-20 |
Family
ID=72919322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010765684.XA Active CN111830389B (zh) | 2020-07-31 | 2020-07-31 | 一种基于发射极功率端子温度的igbt结温估算系统及方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111830389B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112327127A (zh) * | 2020-10-29 | 2021-02-05 | 西安西电电力系统有限公司 | 集成铂温度传感器的全控型电力电子器件及结温测量方法 |
CN113777460A (zh) * | 2021-08-13 | 2021-12-10 | 许继集团有限公司 | 一种mmc柔直换流igbt健康状态监测系统及方法 |
CN114397036B (zh) * | 2022-03-25 | 2022-09-16 | 新誉轨道交通科技有限公司 | Fpga温度采集单元及其工作方法、温度采集系统 |
CN115201649B (zh) * | 2022-05-30 | 2024-05-14 | 北京交通大学 | 一种自发短路电流实现igbt状态监测的驱动电路 |
CN115017722B (zh) * | 2022-06-17 | 2023-02-28 | 合肥工业大学 | 一种igbt功率模块热网络模型的分区解耦计算方法 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327123A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 高周波誘電加熱装置 |
EP2615467A1 (en) * | 2012-01-11 | 2013-07-17 | ABB Research Ltd. | System and method for monitoring in real time the operating state of an IGBT device |
CN105910730A (zh) * | 2016-05-10 | 2016-08-31 | 浙江大学 | 一种大功率igbt模块运行结温的在线检测系统及其检测方法 |
CN106771951A (zh) * | 2016-12-31 | 2017-05-31 | 徐州中矿大传动与自动化有限公司 | 电力电子开关器件结温在线监测装置、检测电路及测试方法 |
CN206362890U (zh) * | 2016-12-31 | 2017-07-28 | 徐州中矿大传动与自动化有限公司 | 电力电子开关器件结温在线监测装置、检测电路 |
WO2018086666A1 (en) * | 2016-11-08 | 2018-05-17 | Aalborg Universitet | Junction temperature measurement in a power semiconductor module |
CN108682672A (zh) * | 2018-04-26 | 2018-10-19 | 浙江大学 | 适用于内部功率开关芯片在短路工况下均热的大功率半导体模块 |
CN108957278A (zh) * | 2018-08-10 | 2018-12-07 | 中国矿业大学 | 基于门极电荷Qg的大功率IGBT故障诊断及保护方法和装置 |
CN109581179A (zh) * | 2018-12-24 | 2019-04-05 | 天津城建大学 | 一种绝缘栅双极晶体管结温测量方法 |
CN110020447A (zh) * | 2017-11-07 | 2019-07-16 | 上海大郡动力控制技术有限公司 | 电动汽车控制器中功率元件igbt结温的估算方法 |
CN110044510A (zh) * | 2019-05-17 | 2019-07-23 | 上海希形科技有限公司 | Igbt模块测温电路、测温方法及计算机可读存储介质 |
CN110350484A (zh) * | 2019-06-25 | 2019-10-18 | 徐州中矿大传动与自动化有限公司 | 一种igbt短路故障快速保护方法及电路 |
CN110765601A (zh) * | 2019-10-12 | 2020-02-07 | 北京北方华德尼奥普兰客车股份有限公司 | 一种基于igbt热电耦合模型的igbt结温估计方法 |
CN110867835A (zh) * | 2019-11-26 | 2020-03-06 | 广东美的制冷设备有限公司 | 智能功率模块及空调器 |
CN111125947A (zh) * | 2019-12-02 | 2020-05-08 | 广东电网有限责任公司 | 一种压接型igbt热网络模型建模方法和相关装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1616463B1 (en) * | 2003-04-22 | 2015-06-10 | Panasonic Corporation | High-frequency dielectric heating device and printed board with thermistor |
WO2005104743A2 (en) * | 2004-04-26 | 2005-11-10 | Rowan Electric, Inc. | Adaptive gate drive for switching devices of inverter |
-
2020
- 2020-07-31 CN CN202010765684.XA patent/CN111830389B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327123A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 高周波誘電加熱装置 |
EP2615467A1 (en) * | 2012-01-11 | 2013-07-17 | ABB Research Ltd. | System and method for monitoring in real time the operating state of an IGBT device |
CN105910730A (zh) * | 2016-05-10 | 2016-08-31 | 浙江大学 | 一种大功率igbt模块运行结温的在线检测系统及其检测方法 |
WO2018086666A1 (en) * | 2016-11-08 | 2018-05-17 | Aalborg Universitet | Junction temperature measurement in a power semiconductor module |
CN106771951A (zh) * | 2016-12-31 | 2017-05-31 | 徐州中矿大传动与自动化有限公司 | 电力电子开关器件结温在线监测装置、检测电路及测试方法 |
CN206362890U (zh) * | 2016-12-31 | 2017-07-28 | 徐州中矿大传动与自动化有限公司 | 电力电子开关器件结温在线监测装置、检测电路 |
CN110020447A (zh) * | 2017-11-07 | 2019-07-16 | 上海大郡动力控制技术有限公司 | 电动汽车控制器中功率元件igbt结温的估算方法 |
CN108682672A (zh) * | 2018-04-26 | 2018-10-19 | 浙江大学 | 适用于内部功率开关芯片在短路工况下均热的大功率半导体模块 |
CN108957278A (zh) * | 2018-08-10 | 2018-12-07 | 中国矿业大学 | 基于门极电荷Qg的大功率IGBT故障诊断及保护方法和装置 |
CN109581179A (zh) * | 2018-12-24 | 2019-04-05 | 天津城建大学 | 一种绝缘栅双极晶体管结温测量方法 |
CN110044510A (zh) * | 2019-05-17 | 2019-07-23 | 上海希形科技有限公司 | Igbt模块测温电路、测温方法及计算机可读存储介质 |
CN110350484A (zh) * | 2019-06-25 | 2019-10-18 | 徐州中矿大传动与自动化有限公司 | 一种igbt短路故障快速保护方法及电路 |
CN110765601A (zh) * | 2019-10-12 | 2020-02-07 | 北京北方华德尼奥普兰客车股份有限公司 | 一种基于igbt热电耦合模型的igbt结温估计方法 |
CN110867835A (zh) * | 2019-11-26 | 2020-03-06 | 广东美的制冷设备有限公司 | 智能功率模块及空调器 |
CN111125947A (zh) * | 2019-12-02 | 2020-05-08 | 广东电网有限责任公司 | 一种压接型igbt热网络模型建模方法和相关装置 |
Non-Patent Citations (3)
Title |
---|
大功率三电平变频器损耗计算及散热分析;景巍,谭国俊,叶宗彬;《电工技术学报》;135-140 * |
有源钳位三电平变频器及其结温平衡控制;谭国俊,景巍;《电工技术学报》;98-101 * |
永磁直驱风电变流器功率器件损耗分析;景巍,谭国俊,马小平;《电工系统及其自动化学报》;95-97 * |
Also Published As
Publication number | Publication date |
---|---|
CN111830389A (zh) | 2020-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111830389B (zh) | 一种基于发射极功率端子温度的igbt结温估算系统及方法 | |
US11215657B2 (en) | Real-time online prediction method for dynamic junction temperature of semiconductor power device | |
WO2017071365A1 (zh) | 数字化驱动的igbt电流检测系统及其检测方法 | |
EP3166141A1 (en) | Electronic device with electronic power component and direct detection of the temperature of such a component | |
Wei et al. | Condition monitoring of IGBT modules based on changes of thermal characteristics | |
Sathik et al. | Comparison of power cycling and thermal cycling effects on the thermal impedance degradation in IGBT modules | |
CN107121629B (zh) | 一种判定电力电子模块失效的检测装置和方法 | |
KR101526680B1 (ko) | 절연 게이트 양극성 트랜지스터 모듈의 온도 센싱 회로 | |
CN104458039A (zh) | Igbt模块壳温的实时估算方法 | |
CN109443589A (zh) | 一种igbt模块及igbt模块的温度监测系统 | |
Arya et al. | Accurate online junction temperature estimation of IGBT using inflection point based updated I–V characteristics | |
WO2018086666A1 (en) | Junction temperature measurement in a power semiconductor module | |
Chen et al. | Driver Integrated Online R ds-on Monitoring Method for SiC Power Converters | |
CN117110823A (zh) | 一种SiC器件功率循环老化参数在线监测系统和方法 | |
US11736000B2 (en) | Power converter with thermal resistance monitoring | |
CN113376497A (zh) | 一种适用于功率半导体器件结温和老化信息的在线监测方法 | |
KR101531018B1 (ko) | 전력반도체소자의 불량 예측 방법 | |
CN116500400B (zh) | 碳化硅功率器件的焊料层失效状态在线原位表征系统及方法 | |
CN117030307A (zh) | 一种基于智能功率模块晶圆结温的散热评估方法和系统 | |
Irace et al. | Reliability enhancement with the aid of transient infrared thermal analysis of smart Power MOSFETs during short circuit operation | |
Huang et al. | IGBT condition monitoring drive circuit based on self-excited short-circuit current | |
EP3542430B1 (en) | System for detecting a gate leakage current in a power switch | |
CN115575787A (zh) | 一种igbt模块健康状态监测方法及装置 | |
CN115616367A (zh) | 一种电力电子器件状态信息在线监测方法及系统 | |
CN208384442U (zh) | 温度检测电路及温度检测装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 221116 No. second Zhujianglu Road Industrial Park, Xuzhou high tech Zone, Jiangsu 7 Applicant after: Jiangsu Guochuan Electric Co.,Ltd. Address before: 221116 No. second Zhujianglu Road Industrial Park, Xuzhou high tech Zone, Jiangsu 7 Applicant before: CHINA MINING DRIVES & AUTOMATION Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Tan Guojun Inventor after: Zhang Jingwei Inventor after: Geng Chengfei Inventor after: Feng Anbo Inventor before: Tan Guojun Inventor before: Zhang Jingwei Inventor before: Geng Chengfei Inventor before: Feng Anbo |
|
CB03 | Change of inventor or designer information |