CN111830355A - Integrated circuit electromagnetic compatibility test method and simulation test system device thereof - Google Patents
Integrated circuit electromagnetic compatibility test method and simulation test system device thereof Download PDFInfo
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Abstract
An integrated circuit electromagnetic compatibility test method and a simulation test system device thereof comprise the following steps: s1 testing module and relative circuit module to form testing system, S2 setting simulation testing platform; s3, connecting the electromagnetic field disturbance simulation signal and the simulation load to the simulation test platform; s4 loading the single electromagnetic field disturbance analog signals item by item to perform an electromagnetic compatibility test; s5, simultaneously loading various electromagnetic field disturbance simulation signals to carry out an electromagnetic compatibility comprehensive test in an extreme electromagnetic environment; s6 analyzes and evaluates the test results. The electromagnetic compatibility test of a single electromagnetic field disturbance signal can be realized, various electromagnetic field disturbance simulation signals can be loaded at the same time, the severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment is simulated, and an electromagnetic compatibility comprehensive test is performed. The error between the test results and the actual electromagnetic environment is small. The test bed can be used in various stages of research and development tests, type tests, acceptance tests, production tests and the like.
Description
Technical Field
The invention belongs to the two technical fields of power technology and microelectronic technology, relates to a test method and a test system, and is suitable for electromagnetic compatibility tests of an integrated circuit and an application electronic system thereof, in particular to an electromagnetic compatibility test technology of a radio frequency integrated circuit and an application electronic system thereof when working in an extreme electromagnetic environment.
Background
Electromagnetic compatibility testing of integrated circuits, including radio frequency integrated circuits, is typically performed by assembling test pieces of the integrated circuit under test into test modules, which are then placed in an automatic test system for testing. The test includes electromagnetic compatibility test, and more importantly, tests of various functions and performance indexes. Such testing is sufficient for integrated circuits used in a general electromagnetic environment, including radio frequency integrated circuits. As in the invention patent application with application number 201710016097.9: "a bluetooth integrated circuit test system and test method", application No. 201910153501.6 patent application for invention: this is true of the "system and method for testing RF mixed signal integrated circuits". However, such tests are far from sufficient for integrated circuits, especially radio frequency integrated circuits, used in extreme electromagnetic environments, such as extreme electromagnetic environments with high voltages, e.g., several kv, several tens kv, several hundreds kv or even thousands kv, and high currents, e.g., several tens a, several hundreds a, several thousands a or even several tens ka. In particular, for the electromagnetic compatibility test, a special simulation test environment must be set up to perform the electromagnetic compatibility test so as to evaluate various performance indexes of the integrated circuit, in particular, the performance index of the electromagnetic compatibility.
The extreme electromagnetic environment generally refers to a complex and special electromagnetic environment of aircrafts, spacecraft, ships and vehicles, and the like. With the continuous development of smart power grids in recent years, due to the characteristics of high voltage and strong current, the complexity of the extreme electromagnetic environment is more severe. Patent application No. 201811159403.5: "a generator electromagnetic compatibility test method", disclose the electromagnetic compatibility test method of the electrical equipment used on naval vessel; patent application No. 201510655755. X: the invention discloses a test method for verifying electromagnetic compatibility among satellite radio frequency subsystems, which is an invention patent application with the application number of 201110262626.6: the invention discloses a method for testing the radiation electromagnetic compatibility of an electric propulsion system and on-board radio frequency equipment, which belongs to the invention patent application with the application number of 200910242500.5: the three invention patents disclose the electromagnetic compatibility test method using the relevant equipment on the aircraft; patent application No. 201110051086.7: "a surface current injection technique for replacing electromagnetic compatibility radiation test", disclose it is mainly used in electromagnetic apparatus electromagnetic compatibility test method in electromagnetic environment such as aircraft; patent application No. 201710587037.2: the invention discloses a novel new energy automobile body electronic electromagnetic compatibility test method, and discloses an electronic equipment electromagnetic compatibility test method in an electromagnetic environment such as a vehicle.
For extreme electromagnetic environments with high voltage and strong current such as a smart grid, the number of application products is extremely large, and the technical field is very wide, so that the electromagnetic compatibility of electronic equipment applied to the extreme electromagnetic environment is widely and specifically regulated from limit value indexes to test methods no matter the extreme electromagnetic environment is international ISO, IEC and CISPR standard series, or national standard and energy industry standard series. Such as GB/T17626. XX/IEC 61000-4-XX, CISPR XX-X-X and the like, the series of standards make detailed specifications for various electromagnetic compatibility testing and measuring technologies. Meanwhile, the product standards applied to the smart grid also make more detailed specific regulations on limit requirements and test methods of electromagnetic compatibility of respective products. For example, in section 6.9 of the national energy industry standard NB/T42044-2014 "3.6 kV-40.5 kV intelligent ac metal-enclosed switchgear and control equipment", the electromagnetic compatibility test of the product is required to be performed according to the regulation of GB/T11022-2011, and the supplement is made: the oscillatory wave immunity test is carried out according to GB/T17626.12-2013; the surge immunity test is carried out according to GB/T17626.5-2008; the immunity test of the pulse magnetic field is carried out according to GB/T17626.9-2011; the immunity test of the damped oscillation magnetic field is carried out according to GB/T17626.10-1998. And the Chinese national energy industry standard NB/T42025-2013 'rated voltage 72.5kV and above intelligent gas insulated metal enclosed switchgear' and the Chinese national energy industry standard NB/T10091-2018 'technical specification of high-voltage switchgear temperature on-line monitoring device' also contain detailed regulations of electromagnetic compatibility tests. In the two product standards, in addition to the test contents specified by the four standards, the following electromagnetic compatibility test contents are added: radio frequency electromagnetic field radiation immunity test-GB/T17626.3-2016; electrostatic discharge immunity test-GB/T17626.2-2018; electric fast transient burst immunity test-GB/T17626.4-2018; power frequency magnetic field immunity test-GB/T17626.8-2006, etc. These standards not only specify the limits and criteria for electromagnetic compatibility tests, but also specify the testing methods and technical equipment for electromagnetic compatibility.
After reviewing the series of standards relating to the electromagnetic compatibility testing and measuring techniques and the known technical literature, the following problems are evident: on one hand, the electromagnetic compatibility test method and the simulation test system device thereof are basically used for the electromagnetic compatibility test of the whole electronic device or an intelligent system, and are lack of the electromagnetic compatibility test method and the simulation test system device of the integrated circuit, in particular to the electromagnetic compatibility test device when the radio frequency integrated circuit is applied in an intelligent power grid. Because electronic devices composed of non-rf integrated circuits are usually placed in an electromagnetic shield if they are used in an extreme electromagnetic environment such as a smart grid, the disturbance of external powerful electromagnetic fields has a limited effect on the internal integrated circuits. The radio frequency integrated circuit needs to be placed outside the shielding body when the radio frequency integrated circuit works, any change of an electromagnetic field outside the shielding body is directly coupled to the radio frequency integrated circuit through the antenna, and therefore, for the radio frequency integrated circuit working in an extreme electromagnetic environment such as a smart grid, the evaluation and the test of the electromagnetic compatibility of the radio frequency integrated circuit need to be supplemented on the basis of the standard.
On the other hand, the various tests are performed on single electromagnetic field disturbance signals item by item, which not only requires a large-scale shielding darkroom and high test cost, but also lacks a test method for loading a plurality of electromagnetic field disturbance signals into the electromagnetic environment in parallel, and the error between the test result and the electromagnetic environment in actual use is larger. Therefore, even if all the single tests are qualified, the electronic equipment, particularly the radio frequency integrated circuit therein, cannot be ensured to be out of work due to disturbance of a certain strong electromagnetic field in the actual use process, so that huge operation faults are caused, and irreparable and great loss is caused. Because during actual operation, either a lightning discharge or a switching action may cause the various intense electromagnetic field disturbances to occur simultaneously.
In recent years, ultrahigh voltage direct current transmission technology has been rapidly developed, for example, in recent years, a direct current transmission project of +/-500 kV and +/-800 kV in operation includes a large number of high-power current transformation devices. The electromagnetic environment of such converter substations is extremely harsh, and the integrated circuits, in particular the radio frequency integrated circuits and their electronic systems, operating therein must be subjected to special electromagnetic compatibility tests in order to ensure their reliable operation on-line.
In view of the above problems, it is desirable to provide a simple method and simulation test system for performing an emc test after an integrated circuit, particularly a radio frequency integrated circuit, is designed and tested. Meanwhile, the method and the device can meet the electromagnetic compatibility comprehensive test requirement of working in a certain extreme electromagnetic environment after the integrated circuit and the electronic system are designed and formed, so that the integrated circuit and the electronic system product thereof can be used in various stages of research and development tests, type tests, acceptance tests, production tests and the like.
Disclosure of Invention
In order to overcome the defects of the prior art and meet the test requirements of electromagnetic compatibility evaluation and examination in extreme electromagnetic environment after an integrated circuit, particularly a radio frequency integrated circuit, is designed to obtain a sample wafer or an intelligent electronic system is formed by the sample wafer, the invention aims to provide an integrated circuit electromagnetic compatibility test method and a simulation test system device thereof, which can not only carry out various electromagnetic compatibility tests of single electromagnetic disturbance according to international and domestic universal standards, but also simulate a plurality of electromagnetic disturbance signals of an electromagnetic field in actual extreme electromagnetic environment, thereby carrying out electromagnetic compatibility comprehensive tests in extreme electromagnetic environment.
In order to achieve the purpose, the invention adopts the technical scheme that:
an integrated circuit electromagnetic compatibility test method comprises the following steps:
s1, assembling at least one test module for the tested integrated circuit sample wafer which completes the general function and performance test according to the typical application, and forming at least one system to be tested with the related circuit module;
s2, assembling an electromagnetic compatibility simulation test platform according to the electromagnetic environment applied by the tested integrated circuit, wherein the tested integrated circuit test module, the system to be tested thereof and the main equipment working together with the tested integrated circuit are arranged in the electromagnetic compatibility simulation test platform;
s3, setting electromagnetic field disturbance analog signals and analog loads thereof, and connecting the electromagnetic field disturbance analog signals and the analog loads to an analog test platform through a plurality of switches with parallel output ends;
s4, loading each single electromagnetic field disturbance simulation signal to a simulation test platform item by item according to the standard requirement of the application product of the tested integrated circuit, and carrying out the electromagnetic compatibility test of each single electromagnetic interference;
s5, loading a plurality of electromagnetic field disturbance simulation signals to a simulation test platform in parallel, simulating the severe disturbance of the electromagnetic field in the actual extreme electromagnetic environment, and carrying out the electromagnetic compatibility comprehensive test of the extreme electromagnetic environment;
the single test results of the S6 and the comprehensive S4 and the comprehensive test result of the S5 are compared and analyzed, and the integrated circuit and the electronic system product thereof are used in various stages of research and development tests, type tests, acceptance tests, production tests and the like.
The technical key of the method is that S5 'various electromagnetic field disturbance simulation signals are loaded to a simulation test platform in parallel, and the severe disturbance of the electromagnetic field in the actual extreme electromagnetic environment is simulated'. If this is not achieved, it is impossible to "conduct an electromagnetic compatibility comprehensive test in an extreme electromagnetic environment". In order to achieve the purpose, the technical problem that ultrahigh voltage signals of thousands of volts, dozens of kilovolts, hundreds of kilovolts and even thousands of kilovolts and strong heavy current signals of dozens of amperes, hundreds of kilovolts, thousands of kilovolts and even dozens of kilovolts are loaded in an analog test platform in parallel, particularly to a main device in the platform, must be solved.
The invention solves the technical problem as follows:
the output end of each electromagnetic field disturbance analog signal and the corresponding analog load are connected in a three-phase star shape, the zero line of each electromagnetic field disturbance analog signal is connected in a suspension mode to be insulated with the chassis and the power ground, and the suspension ground of the output end of each electromagnetic field disturbance analog signal is separately connected with the suspension ground of the corresponding analog load and is insulated with the suspension ground of other electromagnetic field disturbance analog signals and the corresponding analog load. Therefore, when the electromagnetic compatibility comprehensive test of an extreme electromagnetic environment is carried out, a plurality of electromagnetic field disturbance simulation signals can be loaded into the simulation test platform in parallel.
The integrated circuit electromagnetic compatibility test method and the simulation test system device thereof can not only carry out electromagnetic compatibility test of various single electromagnetic field disturbances according to international and domestic universal standards, but also simulate the severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment and carry out electromagnetic compatibility comprehensive test of the extreme electromagnetic environment.
The invention relates to an integrated circuit electromagnetic compatibility simulation test system device, which consists of a plurality of electric field disturbance simulation signals and loads thereof, a plurality of magnetic field disturbance simulation signals and loads thereof, a test module containing an integrated circuit to be tested, a system to be tested consisting of related circuit modules, a simulation test platform and a monitoring terminal. The simulation test platform is internally provided with a main device which works together with the tested integrated circuit, and various electromagnetic compatibility test operation programs and driving programs of various related devices are installed in the monitoring terminal.
By taking a smart grid in an extreme electromagnetic environment as an example, the simulation test platform can be composed of a six-sided detachable metal box body, and main power circuit equipment which works together with the tested integrated circuit is installed in the simulation test platform. The main power circuit arrangement comprises at least one detachable high voltage switch, at least 3 detachable bus bars, at least one detachable cable head, etc.
The electromagnetic field disturbance analog signals are obtained by analyzing and integrating the existing various relevant standards related to electromagnetic compatibility tests, and are basically divided into two categories: one is electric field disturbance analog signal, and the other is magnetic field disturbance analog signal. The electric field disturbance analog signals are divided into two types of high-voltage alternating voltage analog signals and high-voltage impulse voltage analog signals, and the corresponding electric field analog loads are alternating voltage loads and impulse voltage loads respectively. The magnetic field disturbance analog signal is divided into a strong power frequency (including harmonic) current analog signal and a strong impact current analog signal, and the corresponding magnetic field analog load is a power frequency (including harmonic) current load and an impact current load respectively.
Therefore, the electric field disturbance analog signal can be mainly composed of a three-phase step-up transformer. The input end of the power supply is connected with a three-phase alternating current 0.4kV (or 10kV) commercial power grid, a waveform control unit is connected with the power supply, and the zero line of the power supply is connected with a box body and a power ground; the output end of the test device is set to be different voltage levels according to test requirements, the test device is connected into a star connection mode, a control switch with three phases connected in parallel at the output end is connected into an analog test platform, and a zero line is connected into a suspension ground to be insulated from a case and a power supply ground.
The electric field simulation load is provided with different grades of loads according to different grades of voltage, the alternating voltage load and the impulse voltage load are connected in a star connection mode, the zero line is connected in a suspension mode to be insulated from the case and the power ground, and is separately connected with a high-voltage alternating voltage signal or a suspension mode of the output end of the high-voltage impulse voltage signal in the corresponding electric field simulation interference signal, and is mutually insulated from other electromagnetic field disturbance simulation signals and the suspension modes of the corresponding simulation loads.
The magnetic field disturbance analog signal may be mainly composed of a three-phase step-down transformer. The input end of the power supply is connected with a three-phase alternating current 0.4kV (or 10kV) commercial power grid, a waveform control unit is connected with the power supply, and the zero line of the power supply is connected with a box body and a power ground; the output end of the test device is set to different current grades according to test requirements, the test device is connected into a star connection mode, a control switch with three phases connected in parallel at the output end is connected into an analog test platform, and a zero line is connected into a suspension ground to be insulated from a case and a power supply ground.
The magnetic field simulation load is provided with different grades of loads according to different grades of current, the power frequency (including harmonic wave) current load and the impact current load are connected in a star connection mode, the zero line is connected in a suspension mode to be insulated from the case and the power supply ground, and is respectively and independently connected with a suspension ground of a strong power frequency (including harmonic wave) current signal or a strong impact current signal output end in the corresponding magnetic field simulation interference signal, and is mutually insulated from other electromagnetic field disturbance simulation signals and the suspension ground of the corresponding simulation load.
Because the output voltage of the electric field disturbance analog signal is very high, such as several kilovolts, dozens of kilovolts, several hundred kilovolts or even thousands of kilovolts, the load impedance (capacitive reactance) of the near-field coupling loop is very high, so the loop current is very small; although the load loop current of the magnetic field analog signal is very large, dozens of amperes, hundreds of amperes, thousands of amperes or even dozens of kiloamperes, the load impedance (inductive reactance) of the current conduction loop is extremely low, and the output load voltage is also extremely low. The electromagnetic field disturbance simulation signal and the simulation load are designed based on the principle, so that the technical problem of loading multiple electromagnetic field disturbance simulation signals to a simulation test platform in parallel is solved, and various electromagnetic field disturbance simulation signal sources cannot be realized due to too high power.
In the "integrated circuit electromagnetic compatibility test method" provided by the present invention, the operation process of the S5 "electromagnetic compatibility comprehensive test of multiple electromagnetic field disturbances" is as follows: 1. various electromagnetic field disturbance analog signals are parallelly loaded on main equipment which works together with the tested integrated circuit in the analog test platform through corresponding control switches which output in parallel; 2. operating switches on the corresponding analog loads of the electromagnetic field disturbance analog signals to simultaneously load the electromagnetic field disturbance analog signals on the respective analog loads; 3. under the monitoring of the monitoring terminal, operating the main equipment and each control switch on the simulation test platform to simulate the severe disturbance of the electromagnetic field in the actual extreme electromagnetic environment; 4. and respectively carrying out electromagnetic compatibility comprehensive tests of various extreme electromagnetic environments, and recording test result data by the monitoring terminal.
The electromagnetic compatibility test method and the simulation test system device thereof are mainly suitable for electromagnetic compatibility tests in extreme electromagnetic environments, wherein the extreme electromagnetic environments not only refer to smart power grids, but also include other extreme electromagnetic environments such as ships, aircrafts, spacecrafts, vehicles and the like; the tested circuit not only refers to a radio frequency integrated circuit, but also comprises other integrated circuits, circuit boards, circuit modules and application electronic systems.
Drawings
Fig. 1 is a schematic block diagram of an integrated circuit electromagnetic compatibility test method and a simulation test system device thereof according to the present invention.
Fig. 2 is a schematic diagram of the wiring principle of an embodiment of the present invention.
FIG. 3 is a schematic diagram illustrating a wiring principle between an electromagnetic field disturbance analog signal and an analog testing platform according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of the wiring principle between the electric field disturbance analog signal and the analog voltage load.
Fig. 5 is a schematic diagram of the wiring principle between the magnetic field disturbance analog interference signal and the analog current load.
Detailed Description
The integrated circuit electromagnetic compatibility test method and the simulation test system device thereof according to the present invention will be further described with reference to the accompanying drawings and embodiments.
Fig. 1 is a schematic block diagram of an integrated circuit electromagnetic compatibility test method and a simulation test system apparatus thereof according to the present invention:
firstly, a simulation test platform [1] is arranged, a system to be tested (referred to as a system to be tested of the integrated circuit to be tested in the figure as a short term) [5, 6 and 7] consisting of a test module containing the integrated circuit to be tested and related circuit modules is assembled in the simulation test platform [1], the system to be tested of the integrated circuit to be tested is linked with a monitoring terminal [9] through an uplink channel [8], and main equipment which works together with the integrated circuit to be tested is arranged in the simulation test platform [1 ]. The magnetic field disturbance analog signal and its analog loads [11, 13, 17, 18], the electric field disturbance analog interference signal and its analog loads [12, 14, 15, 16] are respectively connected with the analog test platform [1] to form an integrated circuit electromagnetic compatibility analog test system device. Then, under the monitoring of the monitoring terminal [9], operating each control switch, loading each single electromagnetic field disturbance simulation signal to the simulation test platform [1] item by item, and carrying out the electromagnetic compatibility test of each single electromagnetic field disturbance; and operating each control switch, and loading various electromagnetic field disturbance simulation signals to the simulation test platform [1] in parallel to carry out an electromagnetic compatibility comprehensive test in an extreme electromagnetic environment. The test result data is recorded in the monitoring terminal [9 ].
Fig. 2 is a schematic diagram illustrating the wiring principle of an embodiment of the present invention. The embodiment is suitable for performing the electromagnetic compatibility test on the radio frequency integrated circuit and the application system thereof, and the electromagnetic environment of the radio frequency integrated circuit is 10kV (or 35 kV) intelligent power grid. The integrated circuit to be tested is a radio frequency integrated circuit applied to the intelligent power grid, and a test module formed by the integrated circuit is a wireless sensor (comprising an antenna) [5 ]; the related circuit module is a signal collector (including an antenna) [7 ]; the system to be measured is a radio frequency communication system consisting of a wireless sensor (including an antenna) 5 and a signal collector (including an antenna) 7.
In FIG. 2, the simulation test platform [1] is composed of a six-sided detachable metal box body; at least one detachable high-voltage switch [2], at least 3 detachable bus bars [3] and at least one detachable cable head [4] are arranged in the simulation test platform [1], and at least one instrument box [6] is also arranged; at least one wireless sensor (including an antenna) 5 for testing is arranged on the high-voltage switch [2], the bus bar [3] and the cable head [4 ]; at least one signal collector (including an antenna) 7 is arranged on the instrument box 6, and the signal collector 7 is linked with a monitoring terminal 9 through an uplink channel 8.
In fig. 2, a strong power frequency (including harmonic) current signal [11], a strong impact current signal [13], a high-voltage alternating voltage signal [12] and a high-voltage impact voltage signal [14] simulating magnetic field disturbance are respectively connected with the input ends of all switches in a control switch cabinet [10], the output ends of all switches in the switch cabinet [10] are connected in parallel and are connected with the input end of a high-voltage switch [2] in a simulation test platform [1], the output end of the high-voltage switch [2] is connected with a bus bar [3] and a cable head [4] in series, and the cable head [4] is connected with the input ends of control switches such as an impact voltage load [15], an alternating voltage load [16], an impact current load [17] and a power frequency (including harmonic) current load [18] in parallel through output cables.
In this embodiment, the method for performing the electromagnetic compatibility test includes:
s1, after completing the general function and performance test to the tested integrated circuit sample, assembling a plurality of (at least one) wireless sensors (including antennas) for test [5] according to the typical application, and then forming a plurality of (at least one) radio frequency communication systems to be tested with the wireless signal collector (including antennas) [7 ].
S2, assembling an electromagnetic compatibility simulation test platform [1] according to the using electromagnetic environment of the tested integrated circuit, arranging a wireless sensor (including an antenna) [5] for testing and a system to be tested consisting of a signal collector (including an antenna) [7], and arranging main power circuit equipment [2, 3 and 4] working together with the tested integrated circuit. The signal collector (including antenna) 7 is linked with the monitoring terminal 9 through the uplink channel 8, and various electromagnetic compatibility test operation programs and driving programs of various related devices are installed in the monitoring terminal 9.
S3, according to the two categories of the electric field disturbance analog signals and the magnetic field disturbance analog signals, the electromagnetic field disturbance analog signals [11, 12, 13 and 14] and the analog loads [15, 16, 17 and 18] are set to be connected to the analog test platform [1 ]. The electromagnetic field disturbance analog signals can be loaded to the analog test platform [1] respectively, and can also be loaded to the analog test platform [1] in parallel.
S4, loading various electromagnetic field disturbance simulation signals to the simulation test platform [1] item by item according to the standard requirements of the application products of the tested integrated circuit, and carrying out the electromagnetic compatibility test of each single electromagnetic field disturbance.
S5, loading a plurality of electromagnetic field disturbance simulation signals to the simulation test platform [1] in parallel, simulating the severe disturbance of the electromagnetic field in the actual extreme electromagnetic environment, and carrying out the electromagnetic compatibility comprehensive test of the extreme electromagnetic environment.
And comparing and analyzing the single test results of the S6 and the comprehensive S4 with the comprehensive test result of the S5, and using the integrated circuit and the electronic system product thereof in various stages of research and development tests, type tests, acceptance tests, production tests and the like.
The simulation test system device in the embodiment can load various single electromagnetic field disturbance simulation signals to the high-voltage switch [2], the bus bar [3] and the cable head [4] in the simulation test platform [1] according to the relevant standards to perform electromagnetic compatibility tests of various single electromagnetic field disturbances, and can also load various electromagnetic field disturbance simulation signals to the high-voltage switch [2], the bus bar [3] and the cable head [4] in the simulation test platform [1] in parallel to simulate severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment to perform electromagnetic compatibility comprehensive tests of the extreme electromagnetic environment.
In this embodiment, the detailed operation procedure for performing the electromagnetic compatibility test is as follows:
according to the product standard requirements of a radio frequency integrated circuit to be tested and an application system thereof, a control switch cabinet [10] is combined with switches on various simulation loads, corresponding electromagnetic field disturbance simulation signals are selected and loaded on a high-voltage switch [2], a bus bar [3], a cable head [4] and the corresponding simulation loads, and electromagnetic compatibility tests of power frequency (including harmonic waves) electric fields and magnetic fields, lightning and high-altitude electromagnetic pulse electromagnetic compatibility tests, transient pulse string electromagnetic compatibility tests generated by switching of switch equipment and control equipment, electromagnetic compatibility tests of other electromagnetic field disturbance signal sources caused by system faults such as insulation breakdown and the like are carried out item by item. Then, switches on a control switch cabinet [10] and each analog load are operated, a plurality of electromagnetic field disturbance analog signals such as a strong power frequency (including harmonic waves) current signal [11], a strong impact current signal [13], a high-voltage alternating voltage signal [12] and a high-voltage impact voltage signal [14] are loaded in parallel to the high-voltage switch [2], the busbar [3] and the cable head [4] and the respective analog load, and an electromagnetic compatibility comprehensive test of the radio frequency integrated circuit and the application system thereof in an extreme electromagnetic environment is carried out under the monitoring of a monitoring terminal [9 ]. The monitoring terminal [9] records the test data during each test period.
In this embodiment, the operation process of performing the comprehensive electromagnetic compatibility test in the extreme electromagnetic environment is as follows: 1. operating a high-voltage switch connected in parallel with the output end in a control switch cabinet [10], and loading a plurality of electromagnetic field disturbance analog signals such as a strong power frequency (including harmonic) current signal [11], a strong impact current signal [13], a high-voltage alternating voltage signal [12], a high-voltage impact voltage signal [14] and the like to a high-voltage switch [2], a bus bar [3] and a cable head [4] in a simulation test platform [1] in parallel; 2. operating switches of the respective analog loads (15, 16, 17, 18) of the respective electromagnetic field disturbance analog signals to simultaneously load the plurality of electromagnetic field disturbance analog signals onto the respective analog loads; 3. under the monitoring of a monitoring terminal [9], operating a high-voltage switch [2] in a simulation test platform [1], controlling switches in a switch cabinet [10], simulating switches of loads [15, 16, 17 and 18] and the like to simulate severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment; 4. and respectively carrying out electromagnetic compatibility comprehensive tests of various extreme electromagnetic environments, and recording test result data by a monitoring terminal [9 ].
Fig. 3 is a schematic diagram illustrating a wiring principle between the electromagnetic field disturbance analog signal and the analog testing platform according to the embodiment of the present invention. Disturbing analog signals that produce extreme electromagnetic environments fall into two broad categories: one is a strong magnetic field disturbance analog signal [11, 13], comprising a strong power frequency (including harmonic) current signal [11] and a strong impact current signal [13 ]; the other type is a high-voltage electric field disturbance analog signal [12, 14], which comprises a high-voltage alternating voltage signal [12] and a high-voltage impulse voltage signal [14 ].
It should be noted again that although the peak voltage of the electric field disturbance analog signal is very high, in the electromagnetic space where the integrated circuit under test works, the impedances (capacitive reactance) between the near-field coupling loop, i.e., the high-voltage switch [2], the bus bar [3] and the cable head [4], the box, the power ground and the system under test are very high, the consumed energy is very small, and accordingly, a very small analog load current can be set. Similarly, although the peak current of the magnetic field disturbance analog signal is large, in the electromagnetic space in which the tested integrated circuit works, the load impedance (inductive reactance) of the conduction loop, namely the high-voltage switch [2], the bus bar [3] and the cable head [4] is extremely small, the consumed power is extremely low, and correspondingly, the very low analog load voltage drop can be set. Therefore, an extremely complex electromagnetic environment can be synthesized only by corresponding analog voltage signals and analog current signals on the main circuit switch [2], the bus bar [3] and the cable head [4 ]. Based on the principle, the electric field disturbance analog signal and the magnetic field disturbance analog signal can be respectively set, and the signal source is not too high in power and cannot be realized.
Based on the principle, the strong magnetic field analog signals [11, 13] in fig. 3 are mainly composed of a three-phase step-down transformer. The input end of the transformer is connected with a 0.4kV (or 10kV) alternating current power supply, a waveform control unit is arranged on the transformer, and a zero line and a box body of the transformer are connected with a power supply ground; the output of the transformer is connected to a high-voltage switch of a control switch cabinet (10), and the zero line of the transformer is insulated from the box body and the power ground as a suspension ground.
Similarly, the high-voltage electric field analog signals [12, 14] in fig. 3 are mainly composed of a three-phase step-up transformer. The input end of the transformer is connected with a 0.4kV (or 10kV) alternating current power supply, a waveform control unit is arranged on the transformer, and a zero line and a box body of the transformer are connected with a power supply ground; the output of the transformer is connected to a high-voltage switch of a control switch cabinet (10), and the zero line of the transformer is insulated from the box body and the power ground as a suspension ground.
As shown in figure 3, the control switch cabinet [10] is formed by refitting a 10kV (or 35 kV) high-voltage power distribution cabinet. At least four power distribution switches are installed according to the number of the electromagnetic field disturbance analog signals, and the input end of each power distribution switch is connected with the output end of the corresponding electromagnetic field disturbance analog signal. The output ends of all the distribution switches are connected in parallel in three phases and are connected with the input end of a high-voltage switch [2] in the simulation test platform [1 ].
As shown in figure 3, the simulation test platform [1] is formed by modifying a 10kV (or 35 kV) high-voltage switch cabinet. The high-voltage switch [2], the bus bar [3] and the cable head [4] are arranged in the cable. The rated voltage of the high-voltage switch [2] is larger than the maximum value of the electric field disturbance analog signal, and the rated current is larger than the maximum value of the magnetic field disturbance analog signal. The input end of the high-voltage switch [2] is connected to the output end of each distribution switch in the control switch cabinet [10 ]. And an output cable connected to the cable head [4] is connected with the input end of the high-voltage switch on each electromagnetic field simulation load in three-phase parallel.
As shown in fig. 3, the analog loads of the electromagnetic field disturbance analog signal are divided into two main categories: one type is analog voltage load [15, 16] corresponding to electric field disturbance analog signal [12, 14], comprising impulse voltage load [15] and alternating voltage load [16 ]; the other type is an analog current load [17, 18] corresponding to the magnetic field disturbance analog signal [11, 13], and comprises an impact current load [17] and a power frequency (including harmonic wave) current load [18 ].
Fig. 4 is a schematic diagram illustrating the wiring principle between the electric field disturbance analog signal and the analog voltage load. An alternating current three-phase high-voltage switch is arranged in the analog voltage loads [15, 16], and the input end of the alternating current three-phase high-voltage switch is connected with the output of a cable head [4] in the analog test platform [1] in parallel or directly connected with the bus bar [3] and the high-voltage switch [2] in parallel. The loads in the analog voltage loads [15, 16] are all three-phase star-shaped connection, the zero line of the analog voltage loads is connected to be isolated from the box body and the power supply ground in a suspension mode, and is respectively and independently connected with the suspension ground in the electric field disturbance analog signals [12, 14] corresponding to the loads, and is isolated from the suspension ground of other electromagnetic field disturbance analog signals and corresponding analog loads.
Fig. 5 is a schematic diagram illustrating the wiring principle between the magnetic field disturbance analog signal and the analog current load. An alternating current three-phase high-voltage switch is arranged in the analog current loads [17 and 18], and the input end of the alternating current three-phase high-voltage switch is connected with the output of a cable head [4] of the analog test platform [1] in parallel or directly connected with the bus bar [3] and the high-voltage switch [2] in parallel. The loads in the analog current loads [17 and 18] are all three-phase star-shaped connection, the zero line of the analog current loads is connected to be isolated from the box body and the power supply ground in a suspension mode, and is respectively and independently connected with the suspension ground in the corresponding magnetic field disturbance analog signals [11 and 13], and the loads are isolated from the suspension ground of other electromagnetic field disturbance analog signals and the corresponding analog loads.
In summary, the following steps: the high-power frequency (including harmonic) current signal [11] and the power frequency (including harmonic) current load [18], the high-voltage alternating-current voltage signal [12] and the alternating-current voltage load [16], the high-power impact current signal [13] and the impact current load [17], and the high-voltage impact voltage signal [14] and the impact voltage load [15] are directly connected in a suspension manner and are insulated from each other. Therefore, all switches of the operation control switch cabinet [10] and all switches of the simulation load are all in a closed state, and then the on-off of the high-voltage switch [2] is controlled, so that electromagnetic field disturbance simulation signals of different types can be loaded into the simulation test platform [1] at the same time, an extreme electromagnetic field disturbance simulation environment is generated in the simulation test platform [1], and an electromagnetic compatibility comprehensive test of the extreme electromagnetic environment is carried out.
If the tested integrated circuit is other non-radio frequency integrated circuits, the test sample wafer can be assembled into a test module according to the application principle and installed in an instrument box [6] in the simulation test platform [1 ]; if the module to be tested is other electronic devices or systems, the module to be tested can be directly installed in the simulation test platform [1 ]. Therefore, the electromagnetic compatibility test under various electromagnetic environments can be carried out, and the electromagnetic compatibility comprehensive test under an extreme electromagnetic field disturbance simulation environment can also be carried out.
Compared with the prior art, the invention has obvious technical advantages in the following three aspects:
1. the technical gap of the method for carrying out the electromagnetic compatibility test on the integrated circuit, particularly the radio frequency integrated circuit, and the simulation test system device thereof is supplemented, and the operation is simple and convenient, and the realization is easy, so that the design and the verification of the electromagnetic compatibility of the integrated circuit are not limited any more.
2. The electromagnetic compatibility test is carried out without a professional electromagnetic compatibility test room, the electromagnetic compatibility test room with thousands of RMB investment is avoided, and the use cost of the electromagnetic compatibility test room can be accepted by common integrated circuit design and application units. For a unit developing intelligent electronic equipment in an intelligent power grid, the test cost can be greatly reduced, and the investment is saved.
3. The technical problem that an extremely complex and severely disturbed electromagnetic environment is simulated by an electromagnetic disturbance signal source with extremely low power in a limited space is solved. For example, in the electromagnetic environment with high voltage of several kilovolts, several tens of kilovolts, several hundreds of kilovolts or even thousands of kilovolts, and high current of several tens of amperes, several hundreds of amperes, several kiloamps or even several tens of kiloamps, especially in the ultrahigh voltage dc power transmission system which has been rapidly developed in recent years, because the system contains a large amount of high power converter devices, the electromagnetic environment is extremely severe. The invention makes the integrated circuit, especially the radio frequency integrated circuit and the electronic system thereof, easier to realize the electromagnetic compatibility comprehensive test in extreme electromagnetic environment. The experimental environment is really close to the actual operation environment, the electromagnetic compatibility of the tested integrated circuit, particularly the radio frequency integrated circuit and the application system thereof can be reflected, the result of the electromagnetic compatibility test is more practical, and basic test conditions are provided for improving the reliability of the tested product applied to the extreme electromagnetic environment.
The invention is not limited to the content disclosed in the above embodiments and drawings, nor to the application of the electromagnetic environment of the smart grid and the design and use unit of the integrated circuit. Various substitutions, alterations and modifications may be made by those skilled in the art within the scope of the claims of the present invention, and are intended to be encompassed by the spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.
Claims (12)
1. An integrated circuit electromagnetic compatibility test method is characterized by comprising the following steps:
s1, assembling at least one test module for the tested integrated circuit sample wafer which completes the general function and performance test according to the typical application, and forming at least one system to be tested with the related circuit module;
s2, assembling an electromagnetic compatibility simulation test platform according to the electromagnetic environment applied by the tested integrated circuit, wherein the tested integrated circuit test module, the system to be tested thereof and the main equipment working together with the tested integrated circuit are arranged in the electromagnetic compatibility simulation test platform;
s3, setting electromagnetic field disturbance analog signals and analog loads thereof, and connecting the electromagnetic field disturbance analog signals and the analog loads to an analog test platform through a plurality of switches with parallel output ends;
s4, loading each single electromagnetic field disturbance simulation signal to a simulation test platform item by item according to the standard requirement of the application product of the tested integrated circuit, and carrying out the electromagnetic compatibility test of each single electromagnetic interference;
s5, loading a plurality of electromagnetic field disturbance simulation signals to a simulation test platform in parallel, simulating the severe disturbance of the electromagnetic field in the actual extreme electromagnetic environment, and carrying out the electromagnetic compatibility comprehensive test of the extreme electromagnetic environment;
the single test results of the S6 and the comprehensive S4 and the comprehensive test result of the S5 are compared and analyzed, and the integrated circuit and the electronic system product thereof are used in various stages of research and development tests, type tests, acceptance tests, production tests and the like.
2. The method as claimed in claim 1, wherein the electromagnetic compatibility test of the extreme electromagnetic environment can be performed by loading various single electromagnetic field disturbance simulation signals to the simulation test platform according to the relevant standard to perform various single electromagnetic interference electromagnetic compatibility tests, or by loading various electromagnetic field disturbance simulation signals to the simulation test platform in parallel to simulate severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment.
3. The method of claim 1, wherein the output terminal of each electromagnetic field disturbance analog signal and the corresponding analog load are connected in a three-phase star configuration, and the neutral line of each electromagnetic field disturbance analog signal is connected to isolate the floating ground from the chassis and the power ground, and the floating ground of the output terminal of each electromagnetic field disturbance analog signal is separately connected to the floating ground of the corresponding analog load and isolated from the floating grounds of the other electromagnetic field disturbance analog signals and the other analog loads.
4. The integrated circuit electromagnetic compatibility test method of claim 1, wherein the electromagnetic compatibility comprehensive test step of S5 is:
1) various electromagnetic field disturbance analog signals are parallelly loaded on main equipment which works together with the tested integrated circuit in the analog test platform through corresponding control switches which output in parallel;
2) operating switches on the analog load devices corresponding to the electromagnetic field disturbance analog signals to simultaneously load the electromagnetic field disturbance analog signals to the respective analog loads;
3) under the monitoring of the monitoring terminal, operating the main equipment and each control switch on the simulation test platform to simulate the severe disturbance of an electromagnetic field in an actual extreme electromagnetic environment;
4) and respectively carrying out electromagnetic compatibility comprehensive tests of various extreme electromagnetic environments, and recording test result data by the monitoring terminal.
5. The integrated circuit electromagnetic compatibility simulation test system device is characterized by comprising a plurality of electric field disturbance simulation signals and simulation loads thereof, a plurality of magnetic field disturbance simulation signals and simulation loads thereof, a tested integrated circuit system to be tested, a simulation test platform and a monitoring terminal, wherein the simulation test platform is internally provided with a main device which works together with the tested integrated circuit.
6. The integrated circuit electromagnetic compatibility simulation test system device according to claim 5, wherein the integrated circuit under test is a radio frequency integrated circuit applied in a smart grid, and a test module based on the radio frequency integrated circuit and related circuit modules form a system under test; the test module is a wireless sensor (including an antenna), the related circuit module is a signal collector (including an antenna), the system to be tested is a radio frequency communication system to be tested, and the main equipment working together with the integrated circuit to be tested is main power circuit equipment.
7. The integrated circuit electromagnetic compatibility simulation test system device of claim 5, wherein the electric field disturbance analog signal and the magnetic field disturbance analog signal are respectively connected to the simulation test platform through a plurality of switches with parallel output ends.
8. The integrated circuit electromagnetic compatibility simulation test system device of claim 5, wherein the simulation test platform is formed by a six-sided detachable metal box, wherein the main power circuit equipment is provided with at least one detachable high-voltage switch, at least 3 detachable bus bars and at least one detachable cable head, and the wireless sensors for testing are respectively arranged on the high-voltage switch, the bus bars and the cable head; the simulation test platform is provided with at least one instrument box, the signal collector is installed in the instrument box, and the signal collector is connected with the monitoring terminal through an uplink channel.
9. The integrated circuit electromagnetic compatibility simulation test system device according to claim 5, wherein the plurality of electric field simulation interference signals are high voltage surge voltage signals, high voltage alternating current voltage signals and the like, respectively, the plurality of magnetic field simulation interference signals are strong surge current signals, strong power frequency (including harmonic) current signals and the like, and are connected with the high voltage switch in the simulation test platform through a plurality of switches connected in parallel at the output end of the control switch cabinet;
the impulse voltage load, the alternating voltage load, the impulse current load and the power frequency (including harmonic) current load are provided with input high-voltage switches, and the input ends of the input high-voltage switches are connected in parallel to a cable head or a bus bar or a high-voltage switch in the simulation test platform.
10. The integrated circuit electromagnetic compatibility simulation test system device of claim 5, wherein the plurality of magnetic field disturbance analog signals, i.e., a powerful power frequency (including harmonic) current signal and a powerful impact current signal, are respectively mainly composed of a three-phase step-down transformer, the input end of the transformer is connected to a 0.4kV (or 10kV) AC power supply, wherein a waveform control unit is arranged, and the zero line of the waveform control unit is connected with the box body and a power ground wire; the output end of the transformer is connected to a high-voltage switch in the control switch cabinet, the zero line of the transformer is used as a floating ground to be insulated from the box body and the power ground wire, the floating ground of each magnetic field disturbance analog signal output end is separately connected with the floating ground of the corresponding analog load, and is insulated from the other electromagnetic field disturbance analog signals and the floating ground of the corresponding analog load.
11. The integrated circuit electromagnetic compatibility simulation test system device of claim 5, wherein the plurality of electric field disturbance analog signals, i.e., the high voltage alternating voltage signal and the high voltage impulse voltage signal, are respectively mainly composed of a three-phase step-up transformer, the input end of the transformer is connected to a 0.4kV (or 10kV) alternating current power supply, wherein a waveform control unit is arranged, and the zero line of the waveform control unit is connected with the box body and the power ground wire; the output end of the transformer is connected to a high-voltage switch in the control switch cabinet, and the zero line of the transformer is used as a suspension ground to be insulated from the box body and the power supply ground wire;
the floating ground of each electric field analog interference signal output end is respectively and independently connected with the floating ground of the corresponding analog load, and is insulated from the other electromagnetic field disturbance analog signals and the floating ground of the corresponding analog load.
12. An integrated circuit electromagnetic compatibility simulation test system device according to claim 5 and claim 7, wherein the simulation test platform is formed by modifying a 10kV (or 35 kV) switch cabinet;
the switches with the parallel-connected output ends are arranged in a control switch cabinet, and the control switch cabinet is formed by modifying a 10kV (or 35 kV) power distribution cabinet.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167785A (en) * | 2021-12-09 | 2022-03-11 | 海南电网有限责任公司文昌供电局 | FTU distribution automation terminal testing platform |
| CN114978363A (en) * | 2022-04-25 | 2022-08-30 | Oppo广东移动通信有限公司 | Debugging method and device of radio frequency circuit, electronic equipment and storage medium |
| CN116359659A (en) * | 2023-05-31 | 2023-06-30 | 北京煜邦电力技术股份有限公司 | Portable electromagnetic compatibility testing equipment based on carrier communication unit and testing method thereof |
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2020
- 2020-08-14 CN CN202010817533.4A patent/CN111830355A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167785A (en) * | 2021-12-09 | 2022-03-11 | 海南电网有限责任公司文昌供电局 | FTU distribution automation terminal testing platform |
| CN114978363A (en) * | 2022-04-25 | 2022-08-30 | Oppo广东移动通信有限公司 | Debugging method and device of radio frequency circuit, electronic equipment and storage medium |
| CN116359659A (en) * | 2023-05-31 | 2023-06-30 | 北京煜邦电力技术股份有限公司 | Portable electromagnetic compatibility testing equipment based on carrier communication unit and testing method thereof |
| CN116359659B (en) * | 2023-05-31 | 2023-07-28 | 北京煜邦电力技术股份有限公司 | Portable electromagnetic compatibility testing equipment based on carrier communication unit and testing method thereof |
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